CN113888956A

CN113888956A - Backlight module and display device

Info

Publication number: CN113888956A
Application number: CN202110012017.9A
Authority: CN
Inventors: 林佳慧; 丁景隆; 毛立维; 林芳禾; 陈洁莹
Original assignee: Innolux Display Corp
Current assignee: Innolux Corp
Priority date: 2020-07-03
Filing date: 2021-01-06
Publication date: 2022-01-04

Abstract

The disclosure provides a backlight module and a display device. The backlight module comprises a substrate, a light-emitting element, a circuit element and a reflector plate. The light emitting element is bonded to the substrate. The circuit element is bonded on the substrate and electrically connected to the light-emitting element. The reflector plate is arranged on the substrate and provided with a first opening. The first opening at least exposes the light-emitting element. The surface of at least a portion of the circuit element is made reflective. The display device comprises a backlight module and a display panel arranged on the backlight module. The backlight module and the display device of the embodiment of the disclosure can improve the problem of dark shadow or have more uniform brightness.

Description

Backlight module and display device

Technical Field

The present disclosure relates to a backlight module and a display device, and more particularly, to a backlight module and a display device capable of improving a problem of a shadow or having a uniform brightness.

Background

Display panels have been widely used in electronic devices such as mobile phones, televisions, monitors, tablet computers, displays for vehicles, wearable devices, and desktop computers. With the rapid development of electronic products, the requirements for display quality on the electronic products are higher and higher, so that the electronic devices for displaying are continuously improved towards larger or higher resolution display effects.

Disclosure of Invention

The present disclosure provides a backlight module and a display device, which can improve the problem of dark shadows or have more uniform brightness.

According to an embodiment of the present disclosure, a backlight module includes a substrate, a light emitting element, a circuit element, and a reflective sheet. The light emitting element is bonded to the substrate. The circuit element is bonded on the substrate and electrically connected to the light-emitting element. The reflector plate is arranged on the substrate and provided with a first opening. The first opening at least exposes the light-emitting element. The surface of at least a portion of the circuit element is made reflective.

According to an embodiment of the present disclosure, a display device includes a backlight module and a display panel disposed on the backlight module.

Drawings

The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the disclosure and together with the description serve to explain the principles of the disclosure.

Fig. 1 is a schematic perspective view of a display device according to an embodiment of the present disclosure;

FIG. 2A is a schematic top view of a protrusion of the display device of FIG. 1;

fig. 2B to 2D are schematic top views of protrusions of display devices according to various embodiments of the disclosure;

fig. 3 is a schematic perspective view of a display device according to another embodiment of the disclosure.

Description of the reference numerals

10. 10 a: a display device;

100: a backlight module;

110: a substrate;

111: a first surface;

112: a second surface;

120: a light emitting element;

130: a circuit element;

130 a: a top surface;

130 b: a side surface;

131. 1421: a vertex;

132. 1422: an edge;

140. 140 a: a reflective sheet;

141: a first opening;

141 a: a second opening;

142. 142a, 142b, 142 c: a protrusion;

1423. 1423a, 1423b, 1423 c: opening a hole;

1424: a riding thread;

150: a diffusion plate;

160: an optical film;

170: a reflective material;

200: a display panel;

d: distance between two adjacent plates

Y: the normal direction.

Detailed Description

The present disclosure may be understood by reference to the following detailed description taken in conjunction with the accompanying drawings, in which it is noted that, for the sake of clarity and brevity of the drawings, the various drawings in the present disclosure depict only some of the electronic devices and are not necessarily drawn to scale. In addition, the number and size of the elements in the figures are merely illustrative and are not intended to limit the scope of the present disclosure.

In the following specification and claims, the words "comprise", "comprising", "includes" and "including" are open-ended words that should be interpreted as meaning "including, but not limited to …".

It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers may be present (not directly). In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or film, there are no intervening elements or films present between the two.

Although the terms first, second, and third … may be used to describe various components, the components are not limited by this term. This term is used only to distinguish a single component from other components within the specification. The same terms may not be used in the claims, but instead first, second, and third … may be substituted for the elements in the claims in the order in which they are presented. Therefore, in the following description, a first constituent element may be a second constituent element in the claims.

In some embodiments of the present disclosure, terms such as "connected," "interconnected," and the like, with respect to bonding, connecting, and the like, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, unless otherwise specified, with respect to the structure between which they are disposed. And the terms coupled and connected should also be construed to include both structures being movable or both structures being fixed. Furthermore, the term "coupled" encompasses any direct and indirect electrical connection.

In the present disclosure, the length and width may be measured by an optical microscope, and the height, thickness and distance may be measured by a cross-sectional image of an electron microscope, but not limited thereto. In addition, there may be some error in any two values or directions for comparison.

The electronic device of the present disclosure may include, but is not limited to, a display device, an antenna device (e.g., a liquid crystal antenna), a sensing device, a light-emitting device, a touch device, or a tiled device. The electronic device may include a bendable electronic device. The exterior of the electronic device may be rectangular, circular, polygonal, shaped with curved edges, or other suitable shapes. The display device may include, for example, but not limited to, a Light Emitting Diode (LED), a liquid crystal (liquid crystal), a fluorescent (fluorescent), a phosphorescent (phosphor), a Quantum Dot (QD), other suitable materials, or a combination thereof. The light emitting diode may include, for example, an Organic Light Emitting Diode (OLED), an inorganic light emitting diode (inorganic light-emitting diode), a submillimeter light emitting diode (mini LED), a micro LED (micro LED), a Quantum Dot (QD) light emitting diode (QLED, QDLED), other suitable materials, or any combinations thereof, but is not limited thereto. The display device may also include, but is not limited to, a tiled display device, for example. The antenna device may be, for example, a liquid crystal antenna, but is not limited thereto. The antenna device may include, for example, but is not limited to, an antenna splicing device. It should be noted that the electronic device can be any permutation and combination of the foregoing, but not limited thereto. In addition, the exterior of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device may have a peripheral system such as a drive system, a control system, a light source system, a shelf system …, etc. to support the display device, the antenna device, or the tile device. The disclosure will be described with reference to a display device, but the disclosure is not limited thereto.

It is to be understood that the following illustrative embodiments may be implemented by replacing, recombining, and mixing features of several different embodiments without departing from the spirit of the present disclosure. Features of the various embodiments may be combined and matched as desired, without departing from the spirit or ambit of the invention.

Reference will now be made in detail to the exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

Fig. 1 is a schematic perspective view of a display device according to an embodiment of the present disclosure. Fig. 2A is a schematic top view of a protrusion of the display device of fig. 1. Fig. 2B to 2D are schematic top views of protrusions of display devices according to embodiments of the disclosure. Referring to fig. 1, a display device 10 of the present embodiment may include a backlight module 100 and a display panel 200. The display panel 200 is disposed on the backlight module 100, so that the backlight module 100 can provide light to the display panel 200. In some embodiments, the backlight module 100 may be a direct-type backlight module, such that light emitted from the backlight module 100 is emitted toward the display panel 200.

Referring to fig. 1, the backlight module 100 of the present embodiment may include a substrate 110, a light emitting device 120, a circuit device 130, and a reflector 140. In the present embodiment, the substrate 110 has a first surface 111 and a second surface 112 opposite to the first surface 111. The substrate 110 may be, for example, a circuit board, which may include a single layer or multiple layers of circuit traces. The substrate 110 may also be an active driving substrate, which may include a driving circuit (not shown) such as a transistor, a scan line, a data line, etc., so as to drive the light emitting element 120 to emit light. The substrate 110 may include a rigid substrate, a flexible substrate, or a combination thereof. For example, the material of the substrate 110 may include glass, quartz, sapphire (sapphire), ceramic, Polycarbonate (PC), Polyimide (PI), polyethylene terephthalate (PET), other suitable substrate materials, or a combination thereof, but is not limited thereto.

In the present embodiment, the light emitting element 120 can be bonded on the first surface 111 of the substrate 110. Specifically, the light emitting device 120 may include an electrode pad (not shown) disposed on the light emitting device 120, and the substrate 110 may include a pad (not shown) and another pad (not shown) disposed on the substrate 110. The light emitting device 120 can be bonded to the pad of the substrate 110 through the electrode pad, so that the light emitting device 120 can be electrically connected to the substrate 110 through the electrode pad and the pad. In the present embodiment, the light emitting elements 120 may be, for example, light emitting diodes including different colors, such as a red light emitting diode, a green light emitting diode, a blue light emitting diode, and/or a white light emitting diode, but not limited thereto. The light emitting element 120 may also include a blue light emitting diode or an ultraviolet light emitting diode with a light conversion material, wherein the light conversion material may include, for example, quantum dots, fluorescence, phosphorescence, other suitable materials, or a combination thereof, but is not limited thereto.

In the present embodiment, the circuit element 130 can be bonded on the first surface 111 of the substrate 110 and electrically connected to the light emitting element 120. Specifically, the circuit element 130 may be, for example, a non-light emitting element including a driving IC (driving IC), a Gate On Panel (GOP), a capacitor, and/or a resistor, which are already manufactured, but is not limited thereto. The circuit device 130 can be, for example, an integrated circuit fabricated by a semiconductor process, or an active driving circuit fabricated by a thin film process. The circuit element 130 may be bonded to the substrate 110 through another bonding pad of the substrate 110, such that the circuit element 130 may be electrically connected to the light emitting element 120 through the another bonding pad of the substrate 110 and a circuit trace or a driving circuit in the substrate 110, and further the light emitting element 120 may be controlled and driven to emit light. In the present embodiment, since the circuit device 130 and the light emitting device 120 are both disposed on the same surface (e.g., the first surface 111) of the substrate 110, the backlight module 100 of the present embodiment may have a thinner thickness or may conform to a thinner design compared to a backlight module in which the circuit device and the light emitting device are respectively disposed on different surfaces (e.g., a first surface and a second surface opposite to each other) of the substrate.

In addition, in the present embodiment, the circuit element 130 has a top surface 130a facing away from the first surface 111 of the substrate 110 and a side surface 130 b. The height of the circuit element 130 is, for example, greater than the height of the light emitting element 120, but not limited thereto. Here, the height of the circuit element 130 is, for example, the maximum height of the circuit element 130 measured along the normal direction Y of the substrate 110, and the height of the light emitting element 120 is, for example, the maximum height of the light emitting element 120 measured along the normal direction Y of the substrate 110.

In the embodiment, the reflective sheet 140 may be disposed on the first surface 111 of the substrate 110, so that the reflective sheet 140 may cover the non-light-emitting region and/or the non-light-emitting element on the substrate 110. The material of the reflective sheet 140 may be, for example, white polyester, other suitable reflective materials, or a combination of the foregoing, but is not limited thereto. The reflective sheet 140 has a first opening 141 and a protrusion 142. The first opening 141 may at least expose the light emitting element 120. The protrusion 142 may be a part of the reflective sheet 140, the protrusion 142 and the reflective sheet 140 may be integrally formed, and the protrusion 142 and the reflective sheet 140 may be connected seamlessly, but not limited thereto. The protrusions 142 may be disposed corresponding to the positions of the circuit elements 130, such that the protrusions 142 may cover the circuit elements 130, and at least a portion of the surfaces (e.g., the top surface 130a and the side surface 130b) of the circuit elements 130 may be reflective due to the covering of the protrusions 142. Therefore, the problem of dark shadow (mura) of the display device caused by the exposure of the circuit elements can be improved, or the display device can have more uniform brightness.

For example, in the embodiment, the shape of the circuit element 130 is, for example, a square, and the bottom thereof has 4 vertices 131 and 4 edges 132, and the shape of the protrusion 142 is, for example, a pyramid, and the bottom thereof also has 4 vertices 1421 and 4 edges 1422. The 4 edges 1422 of the protrusion 142 may respectively correspond to and are substantially parallel to the 4 edges 132 of the circuit element 130, and the 4 vertexes 1421 of the bottom of the protrusion 142 may respectively correspond to the 4 vertexes 131 of the circuit element 130, so that the protrusion 142 has a better coverage effect on the circuit element 130. Furthermore, when the edges 1422 of the protrusions 142 respectively correspond to and are substantially parallel to the edges 132 of the circuit device 130, the heat generated by the circuit device 130 can be uniformly transferred to the edges 1422 of the protrusions 142 through the edges 132, so as to prevent the edges 1422 of the protrusions 142 from being wrinkled due to uneven heating.

Referring to fig. 2A, in the top view of the protrusion 142 of the present embodiment, the protrusion 142 further has an opening 1423 and a seam 1424. The opening 1423 may be an X-shape formed by intersecting 2 slits, such that the extending directions of the 2 slit openings 1423 are all different from the extending directions of the 4 edges 132 of the circuit device 130. Therefore, the protrusion 142 can have a better covering effect on the circuit element 130.

Further, in the present embodiment, the saddle stitching 1424 is provided corresponding to the edge 1422 of the protrusion 142. The rider lines 1424 can be considered as a plurality of discrete indentations formed in the edge 1422 of the tab 142, as shown in phantom in FIG. 2A. In this embodiment, the edge 1422 of the protrusion 142 can be attached or fixed to the substrate 110 by the design of the seam 1424 (i.e., a plurality of discontinuous indentations). For example, for a protrusion without a seam, when the protrusion is arched due to heat generated by the circuit element, the arched range may be expanded to the outside of the edge of the protrusion and extended to the reflective sheet around the opening, so that the light emitting element in the opening is shielded by the arched reflective sheet to cause a dark shadow; on the contrary, for the protrusion 142 provided with the riding thread 1424 in the embodiment, since the riding thread 1424 can firmly fix the edge 1422 of the protrusion 142 on the substrate 110, the arching range can not be expanded beyond the edge 1422 of the protrusion 142, so as to reduce the problem that the reflective sheet arches to shield the light emitting element and cause a dark shadow.

Although the shape of the protrusion 142 of the present embodiment may be, for example, a pyramid shape, and the opening 1423 of the protrusion 142 may be, for example, an X shape formed by intersecting 2 slits, the shape of the protrusion, the number of slits, and the form of the opening are not limited in the present invention. In some embodiments, as shown in fig. 2B, the protrusion 142a may also be shaped like a Chinese character tian, and the opening 1423a of the protrusion 142a may be a cross shape formed by intersecting 2 slits, for example. In some embodiments, as shown in fig. 2C, the protrusion 142b may also be I-shaped, and the opening 1423b of the protrusion 142b may be, for example, I-shaped formed by intersecting 3 slits. In some embodiments, as shown in fig. 2D, the protrusion 142c may also be in a shape of a Chinese character 'mi', and the opening 1423c of the protrusion 142c may be in a shape of a Chinese character 'mi' formed by intersecting 4 slits, for example.

Referring to fig. 1 again, in the present embodiment, the backlight module 100 may further include a diffuser plate 150 and an optical film 160. The diffusion plate 150 is disposed on the substrate 110 and located between the display panel 200 and the substrate 110. The diffusion plate 150 is spaced apart from the substrate 110 by a distance D. The distance D is, for example, less than or equal to 5 millimeters (mm), so that the backlight module 100 and the display device 10 of the present embodiment can conform to a thin design, but not limited thereto. The distance D is, for example, a maximum distance between the diffusion plate 150 and the substrate 110 measured along the normal direction Y of the substrate 110. The optical film 160 is disposed on the diffusion plate 150 and located between the display panel 200 and the diffusion plate 150. The optical film 160 may include a prism sheet, a diffusion film, and a brightness enhancement film, but is not limited thereto.

In short, in the backlight module 100 and the display device 10 of the embodiment of the disclosure, since the circuit elements 130 and the light emitting elements 120 are disposed on the same surface (e.g., the first surface 111) of the substrate 110, the backlight module 100 and the display device 10 of the embodiment can have a thinner thickness or can meet a thinner design compared to a backlight module in which the circuit elements and the light emitting elements are disposed on different surfaces (e.g., a first surface and a second surface opposite to each other) of the substrate. In addition, the protrusion 142 of the reflective sheet 140 is used to cover the circuit element 130, so as to improve the problem of the display device that the circuit element is exposed to cause a dark shadow or to make the display device have a more uniform brightness.

Other examples will be listed below for illustration. It should be noted that the following embodiments follow the reference numerals and parts of the contents of the foregoing embodiments, wherein the same reference numerals are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

Fig. 3 is a schematic perspective view of a display device according to another embodiment of the disclosure. Referring to fig. 1 and fig. 3, the display device 10a of the present embodiment is substantially similar to the display device 10 of fig. 1, and therefore, the same and similar components in the two embodiments are not repeated herein. The display device 10a of the present embodiment is different from the display device 10 in that, in the display device 10a of the present embodiment, the reflective sheet 140a does not have a protrusion, but the reflective sheet 140a further has a second opening 141 a.

Specifically, referring to fig. 3, the reflective sheet 140a has a second opening 141a, and the second opening 141a can expose the top surface 130a and the side surface 130b of the circuit element 130. In addition, in the present embodiment, the backlight module 100 further includes a reflective material 170. The reflective material 170 may be, for example, white glue, white paint, other suitable reflective material, or a combination of the foregoing, but is not limited thereto. The reflective material 170 may be disposed and applied to the top surface 130a of the circuit element 130 to make at least a portion of the surface of the circuit element 130 (e.g., the top surface 130a) reflective. Therefore, the problem of dark shadow (mura) of the display device caused by the exposure of the circuit elements can be improved, or the display device can have more uniform brightness.

In summary, in the backlight module and the display device according to the embodiments of the disclosure, since the circuit elements and the light emitting elements are both disposed on the same surface (e.g., the first surface) of the substrate, the backlight module and the display device of the present disclosure may have a thinner thickness or may conform to a thinner design compared to the backlight module in which the circuit elements and the light emitting elements are disposed on different surfaces (e.g., the first surface and the second surface opposite to each other) of the substrate. In addition, the protrusion of the reflective sheet is used to cover the circuit element, or the reflective material is coated on the top surface of the circuit element, so as to improve the problem of dark shadow caused by the exposed circuit element of the display device or make the display device have more uniform brightness.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present disclosure, and not for limiting the same; while the present disclosure has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present disclosure.

Claims

1. A backlight module, comprising:

a substrate;

a light emitting element bonded on the substrate;

a circuit element bonded on the substrate and electrically connected to the light emitting element; and

a reflector plate disposed on the substrate and having a first opening,

the first opening at least exposes the light-emitting element, and at least one part of the surface of the circuit element is made to be reflective.

2. The backlight module of claim 1, wherein the reflector sheet further has a second opening, and the backlight module further comprises:

a reflective material, wherein the second opening exposes the circuit element, and the reflective material is coated on the surface of the circuit element.

3. The backlight module of claim 1, wherein the reflective sheet further comprises a protrusion, wherein the protrusion is disposed corresponding to the circuit element and covers the circuit element.

4. The backlight module of claim 3, wherein the protrusions are pyramid-shaped.

5. The backlight module of claim 3, wherein the apex of the protrusion corresponds to the apex of the circuit element.

6. The backlight module of claim 3, wherein the protrusions have a seam line disposed corresponding to an edge of the protrusions.

7. The backlight module of claim 1, wherein the circuit element comprises a driving chip, a gate driver, a capacitor, or a resistor.

8. A display device, comprising:

the backlight module of claim 1; and

and the display panel is arranged on the backlight module.

9. The display device of claim 8, wherein the backlight module further comprises a diffuser plate and an optical film, wherein the diffuser plate is disposed on the substrate and the optical film is disposed on the diffuser plate.

10. The display device according to claim 9, wherein the diffuser plate is located between the display panel and the substrate with a distance of less than or equal to 5 mm.