CN113871379A - Display substrate and display device having the same - Google Patents
Display substrate and display device having the same Download PDFInfo
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- CN113871379A CN113871379A CN202111131366.9A CN202111131366A CN113871379A CN 113871379 A CN113871379 A CN 113871379A CN 202111131366 A CN202111131366 A CN 202111131366A CN 113871379 A CN113871379 A CN 113871379A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a display substrate and a display device having the same, wherein the display substrate comprises: a back plate; the LED device is arranged on one side of the thickness of the back plate and comprises a plurality of LED lamp beads arranged at intervals; encapsulation light-shielding structure, encapsulation light-shielding structure and LED device locate the homonymy of backplate, and encapsulation light-shielding structure's at least part is filled in the clearance between arbitrary two adjacent LED lamp pearls, and includes infrared stop, and infrared stop is used for the separation infrared light. The display substrate provided by the invention has the advantages of lower working temperature and good use reliability.
Description
Technical Field
The invention relates to the technical field of display equipment, in particular to a display substrate and a display device with the same.
Background
The Micro-LED module has the advantages of high brightness, light weight, thinness, long service life, low power consumption and the like, and when the high-power Micro-LED module is used for illumination and outdoor sign application, the light efficiency of the Micro-LED module is reduced, the color of the Micro-LED module is shifted and the like due to overhigh temperature, and the temperature problem of the LED must be considered.
However, in the related art, the temperature of the Micro-LED module is high, and it is difficult to control the temperature within a predetermined range.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the display substrate, which has lower working temperature and good use reliability.
The invention also provides a display device with the display substrate.
According to an embodiment of the first aspect of the invention, a display substrate includes: a back plate; the LED device is arranged on one side of the thickness of the back plate and comprises a plurality of LED lamp beads arranged at intervals; encapsulation light-shielding structure, encapsulation light-shielding structure with the LED device is located the homonymy of backplate, encapsulation light-shielding structure's at least part is filled in arbitrary adjacent two clearance between the LED lamp pearl, and includes infrared stop, infrared stop is used for the separation infrared light.
According to the display substrate provided by the embodiment of the invention, the packaging shading structure is arranged to comprise the infrared cut-off piece so as to cut off infrared rays, so that the energy of the infrared rays irradiating the interior of the display substrate can be reduced, the temperature of the display substrate is effectively reduced, the working temperature of the display substrate is controlled within a set range, and the display substrate is further ensured to be used reliably.
In some embodiments, the infrared cut-off is configured to absorb infrared light.
In some embodiments, a side surface of the LED device facing away from the back plate is exposed outside the package light shielding structure.
In some embodiments, the package light shielding structure includes a light shielding member defining a plurality of filling grooves, each filling groove is located between two adjacent LED beads, and at least one filling groove is filled with the infrared cut-off member.
In some embodiments, the infrared cut-off includes an infrared absorber and a resin matrix.
In some embodiments, the infrared absorber is a cyanine dye, a phthalocyanine dye, an azo dye, a metal particle, an inorganic compound, or a semiconductor nanoparticle, and the resin matrix is an epoxy resin, an acrylic resin, a polyurethane, an alkyd resin, a phenolic resin, a vinyl resin, a fluorocarbon resin, or a silicone resin.
In some embodiments, the infrared cut-off member fills a gap between two adjacent LED beads, and includes a light shielding material and infrared absorbing nanoparticles, and the infrared absorbing nanoparticles are mixed in the light shielding material.
In some embodiments, the back plate comprises: a substrate; the signal wiring layer is arranged between the substrate and the LED device and is electrically connected with each LED lamp bead; the heat conduction layer is arranged between the signal wiring layer and the substrate, the first buffer layer is arranged between the signal wiring layer and the heat conduction layer so as to enable the signal wiring layer and the heat conduction layer to be arranged at intervals, and a through hole is formed in the first buffer layer; and the heat conducting piece is arranged in the through hole and is directly connected with the signal wiring layer and the heat conducting layer respectively.
In some embodiments, the heat conducting layer is formed in a flat plate structure, and a projected area of the heat conducting layer is larger than a projected area of the signal wiring layer along a thickness direction of the back plate.
In some embodiments, the thermally conductive layer is a light blocking material.
A display device according to an embodiment of the second aspect of the invention comprises a display substrate according to an embodiment of the first aspect of the invention described above.
According to the display device provided by the embodiment of the invention, the display substrate is adopted, so that the temperature of the display device is conveniently controlled within a specified range, and the display device is ensured to be reliable to use.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic view of a display substrate according to one embodiment of the present invention;
FIG. 2 is a schematic view of a display substrate according to another embodiment of the present invention;
FIG. 3 is a schematic view of a display substrate according to yet another embodiment of the present invention;
FIG. 4 is a schematic view of a display substrate according to yet another embodiment of the present invention;
fig. 5 is a schematic view of a display substrate according to still another embodiment of the present invention.
Reference numerals:
a display substrate 100,
A back plate 1,
A substrate 11, a signal wiring layer 12, a heat conduction layer 13, a first buffer layer 14, a heat conduction member 15, a second buffer layer 16, a first signal terminal 121, a second signal terminal 122,
An active layer 141, an insulating layer 142, an interlayer insulating layer 143,
An LED device 2, an LED lamp bead 21,
The package light shielding structure 3, the infrared cut-off member 31, the light shielding member 32, and the filling groove 320.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the applicability of other processes and/or the use of other materials.
Next, a display substrate 100 according to an embodiment of the first aspect of the present invention is described with reference to the drawings.
As shown in fig. 1 to 4, the display substrate 100 includes a back plate 1, an LED device 2 and a package light shielding structure 3, the LED device 2 is disposed on one thickness side (for example, an upper side in fig. 1) of the back plate 1, and the LED device 2 includes a plurality of LED beads 21 disposed at intervals to provide a suitable light source for the display substrate 100 to meet the display requirement of the display substrate 100, that is, the LED device 2 is used for implementing the display function of the display substrate 100 and is not used as a backlight source; encapsulation light-shielding structure 3 and LED device 2 locate the homonymy of backplate 1, encapsulation light-shielding structure 3's at least part is filled in the clearance between two arbitrary adjacent LED lamp pearls 21, the clearance between two arbitrary adjacent LED lamp pearls 21 is filled in a part of encapsulation light-shielding structure 3 promptly, or encapsulation light-shielding structure 3 all fills the clearance between two arbitrary adjacent LED lamp pearls 21, then encapsulation light-shielding structure 3 can shelter from LED lamp pearl 21's light, be convenient for guarantee that LED device 2's light can comparatively concentrate ground directive required direction, with guarantee light-emitting efficiency, be convenient for avoid LED device 2's light directive other positions and easily lead to the optical crosstalk simultaneously, and encapsulation light-shielding structure 3 can also participate in the encapsulation that realizes display substrate 100, promote display substrate 100's use reliability.
Wherein, above-mentioned at least part of encapsulation light-shielding structure 3 includes infrared cut-off 31, the part of packing the clearance between two adjacent LED lamp pearls 1 of encapsulation light-shielding structure 3 includes infrared cut-off 31 promptly, infrared cut-off 31 is used for the separation infrared ray, can effectively reduce the energy that display substrate 100 absorbed infrared ray, for example when display substrate 100 is used for outdoor display, can reduce the energy that display substrate 100 absorbed the sunlight, thereby effectively reduced the inside energy of infrared ray irradiation display substrate 100, reduce the temperature of display substrate 100, so as to guarantee that display substrate 100's operating temperature control is in setting for the within range, avoid display substrate 100 high temperature to lead to the light efficiency of display substrate 100 to descend, problems such as colour skew, the use reliability of display substrate 100 has been promoted.
According to the display substrate 100 of the embodiment of the invention, the encapsulation light shielding structure 3 includes the infrared cut-off 31 to block the infrared light, so that the energy of the infrared light irradiating the display substrate 100 can be reduced, the temperature of the display substrate 100 can be effectively reduced, the working temperature of the display substrate 100 can be controlled within a set range, and the display substrate 100 can be reliably used.
It can be understood that the arrangement manner of the plurality of LED beads 21 may be specifically set according to the practical application, for example, the plurality of LED beads 21 may be arranged in a plurality of rows and a plurality of columns.
The inventor of the present invention has analyzed the reason for causing the high temperature of the display substrate 100, on one hand, the external quantum efficiency of the display substrate 100 is generally 20% to 30%, the light emitting efficiency is not high, and the remaining 70% to 80% is converted into heat; on the other hand, if the display substrate 100 is used for outdoor display, especially in summer, the heat generated by the sunlight will also be accumulated inside the display substrate 100, causing the temperature inside the display substrate 100 to increase.
For example, when the display substrate 100 is a Micro-LED module, the Micro-LED module has a very small size, and the generated heat is difficult to dissipate, which further increases the temperature of the Micro-LED module.
Therefore, the display substrate 100 in the present application can be applied to outdoor display scenes and also to small-sized modules, and has good applicability and practicability.
In some embodiments, the infrared cut-off 31 is used to absorb infrared light, so that the energy of the infrared light absorbed by other parts of the display substrate 100 can be reduced, thereby reducing the operating temperature of the display substrate 100, and at the same time, when the display substrate 100 is used for outdoor display, the outdoor display effect of the display substrate 100 can be effectively ensured.
Of course, the infrared stoppers 31 may also be used to block infrared light, and in this case, the infrared stoppers 31 may separate the infrared light from the components of the display substrate 100 to reduce the energy of the infrared light absorbed by the above components of the display substrate 100.
In some embodiments, as shown in fig. 1 and fig. 2, a side surface of the LED device 2 facing away from the backplane 1 is exposed outside the package light shielding structure 3, that is, the package light shielding structure 3 does not shield a side surface of the LED device 2 facing away from the backplane 1, or the package light shielding structure 3 does not cover a side surface of the LED lamp bead 21 facing away from the backplane 1, so that the shielding structure does not shield light emitted from the side of the LED device 2 facing away from the backplane 1, so as to ensure the light emitting efficiency of the display substrate 100, thereby ensuring the display effect.
In some embodiments, as shown in fig. 1 and 3, the light shielding structure 3 includes a light shielding member 32, the light shielding member 32 defines a plurality of filling grooves 320, each filling groove 320 is located between two adjacent LED beads 21, and at least one filling groove 320 is filled with an infrared cut-off member 31, so that one or more infrared cut-off members 31 are filled in the corresponding filling groove 320, in other words, the total number of the filling grooves 320 is greater than or equal to the number of the filling grooves 320 filled with the infrared cut-off members 31, so that interference between the infrared cut-off members 31 and the LED beads 21 does not occur, and at the same time, a good infrared light shielding effect of the infrared cut-off members 31 can be ensured.
For example, each filling groove 320 is filled with the infrared cut-off member 31, the arrangement of the plurality of infrared cut-off members 31 is substantially the same as the arrangement of the plurality of LED beads 21, and the plurality of infrared cut-off members 31 are arranged in a patterned manner, which is beneficial to further improving the infrared light blocking effect of the infrared cut-off members 31.
Optionally, the light shielding member 32 is a black glue member.
In some embodiments, the infrared cut-off 31 includes an infrared absorbent and a resin matrix, that is, the infrared cut-off 31 is a mixture including the infrared absorbent and the resin matrix, so that the infrared cut-off 31 can absorb infrared light for the purpose of blocking the infrared light.
For example, the infrared cut-off 31 is composed of an infrared absorber, a resin matrix and an auxiliary agent, wherein the infrared absorber is a light stabilizer and can absorb infrared part, and the resin matrix is mainly used as a film-forming substance which plays a role in determining the physical and mechanical properties of a film formed by the infrared cut-off 31; infrared absorbers, resin matrices and auxiliaries are well known to those skilled in the art and will not be described in detail herein.
Alternatively, the infrared cutoff member 31 may be prepared by a conventional vacuum evaporation process, a sputtering process, or PECVD (plasma enhanced chemical vapor deposition). The specific process flow of the vacuum evaporation process, the sputtering process, or the PECVD process is well known to those skilled in the art and will not be described herein.
Of course, the composition of the infrared cut-off 31 is not limited thereto.
Alternatively, the infrared absorber is a cyanine dye, a phthalocyanine dye, an azo dye, a metal particle (e.g., Ni, W, Mo, Co, Pt, etc.), an inorganic compound, or a semiconductor nanoparticle (e.g., ITO, ATO, SnO2Etc.) wherein cyanine dyes, phthalocyanine dyes, azo dyes, etc. are organic infrared absorbers, and metal particles, inorganic compounds, or semiconductor nanoparticles, etc. are inorganic infrared absorbers; the resin matrix is epoxy resin, acrylic resin, polyurethane, alkyd resin, phenolic resin, vinyl resin, fluorocarbon resin, organic silicon resin or the like.
In some embodiments, as shown in fig. 2 and 4, the infrared cut-off 31 is filled in a gap between two adjacent LED beads 21, and the infrared cut-off 31 includes a light-shielding material and infrared absorption nanoparticles, and the infrared absorption nanoparticles are mixed in the light-shielding material, that is, the infrared cut-off 31 is a mixture including the light-shielding material and infrared absorption nanoparticles, so that the infrared cut-off 31 can be used for absorbing infrared light to achieve the purpose of blocking infrared light, and reducing heat of sunlight and the like irradiated to the inside of the display substrate 100, thereby reducing the temperature of the LED device 2.
Optionally, the light-shielding material is black glue.
In some embodiments, as shown in fig. 3 and 4, the back plate 1 includes a substrate 11, a signal wiring layer 12, a heat conduction layer 13, a first buffer layer 14 and a heat conduction member 15, the signal wiring layer 12 is disposed between the substrate 11 and the LED device 2, and the signal wiring layer 12 is electrically connected to each LED bead 21, the signal wiring layer 12 can provide a corresponding driving control signal for each LED bead 21, the heat conduction layer 13 is disposed between the signal wiring layer 12 and the substrate 11, the first buffer layer 14 is disposed between the signal wiring layer 12 and the heat conduction layer 13 to space the signal wiring layer 12 from the heat conduction layer 13, a through hole is formed on the first buffer layer 14, the through hole penetrates through the first buffer layer 14 along the thickness direction of the first buffer layer 14, the heat conduction member 15 is disposed in the through hole, and the heat conduction member 15 is directly connected to the signal wiring layer 12 and the heat conduction layer 13, respectively, heat generated by the LED device 2 can be transferred from the signal wiring layer 12 to the heat conduction member 15 to the heat conduction layer 13, the heat dissipation area of the display substrate 100 is increased, so that uniform heat dissipation of the display substrate 100 is facilitated, the heat dissipation effect of the display substrate 100 is improved, and the problems that the display substrate 100 generates a hot spot, the light efficiency of the display substrate 100 is reduced, the color cast is caused and the like are avoided.
Optionally, the signal routing layer 12 may include a plurality of first signal terminals 121 and a plurality of second signal terminals 122, and one first signal terminal 121 and one second signal terminal 122 may be electrically connected to the corresponding LED lamp bead 21 to provide a corresponding driving control signal for the LED lamp bead 21.
For example, one of the first signal terminal 121 and the second signal terminal 122 is connected to the heat conductive layer 13 through the heat conductive member 15, so that heat generated by the LED device 2 can be timely transferred to the heat conductive layer 13, thereby effectively reducing the color shift problem caused by heat aggregation.
Optionally, the signal wiring layer 12 may also be a ground signal line, and the ground signal line is used for realizing the grounding of the display substrate 100.
The substrate 11 is a flexible substrate 11, which is beneficial to improving the applicability of the display substrate 100.
In some embodiments, as shown in fig. 3 and 4, the heat conducting layer 13 is formed in a flat plate structure, in which the heat conducting layer 13 may be formed as a planar heat conducting layer, and a projection area of the heat conducting layer 13 is larger than a projection area of the signal routing layer 12 along a thickness direction (e.g., an up-down direction in fig. 3) of the back plate 1, so as to further increase a heat dissipation area of the display substrate 100 and improve heat dissipation uniformity of the display substrate 100.
For example, in the examples of fig. 3 and 4, the projected area of the heat conductive layer 13 may be substantially equal to the projected area of the substrate 11 along the thickness direction of the rear panel 1, that is, the projected area of the heat conductive layer 13 is equal to the projected area of the substrate 11, or the projected area of the heat conductive layer 13 is not greatly different from the projected area of the rear panel 1, so that the heat conductive layer 13 is formed on the whole surface of the substrate 11 to further improve the heat dissipation uniformity of the display substrate 100.
Of course, the arrangement of the heat conductive layer 13 is not limited thereto; for example, the orthographic projection of the heat conductive layer 13 on the substrate 11 may be in a grid shape. Therefore, the heat conduction layer 13 can have a larger area, and the heat dissipation effect is improved.
Optionally, the heat conduction layer 13 and the heat conduction member 15 are both metal members, so as to ensure that the heat conduction layer 13 and the heat conduction member 15 have good heat conduction performance, and ensure that the heat conduction layer 13 has good heat dissipation performance. For example, the heat conductive layer 13 and the heat conductive member 15 are both copper members.
As shown in fig. 5, in order to further improve the adhesion between the substrate 11 and the heat conductive layer 13, a second buffer layer 16 may be further provided between the substrate 11 and the heat conductive layer 13. The thickness and material of the second buffer layer 16 are not particularly limited. For example, when the substrate 11 is a glass material and the heat conductive layer 13 is a copper layer, defects such as peeling may occur if a Cu layer having a large thickness is directly formed on the substrate 11; at this time, the second buffer layer 16 may be formed on the substrate 11 in advance, so that defects such as peeling of the heat conductive layer 13 from the substrate 11 can be alleviated or avoided, wherein the second buffer layer 16 may be an alloy buffer layer.
Further, as shown in fig. 5, a thin film transistor is disposed in the first buffer layer 14, and the thin film transistor may specifically include an active layer 141, a source/drain electrode, a gate electrode, and an insulating layer 142, where the active layer 141 is located on a side of the heat conducting layer 13 away from the substrate 11, and the insulating layer 142 covers the active layer 141 and is located on a side of the active layer away from the substrate 11, for example, the insulating layer 142 may be a gate insulating layer, and insulates and separates the gate electrode from the active layer 141. The source-drain metal layer is located on the side of the insulating layer 142 away from the substrate 11, and a source drain in the source-drain metal layer may be connected to the active layer 141 through a via. The thin film transistor may further have an interlayer insulating layer 143, a passivation layer, and the like to further improve the performance of the thin film transistor.
In some embodiments, the heat conducting layer 13 is made of a light shielding material, and the heat conducting layer 3 may be formed as a light shielding layer, so that it is not necessary to separately provide a light shielding layer for the active layer to implement POLY light shielding, which is beneficial to simplify the structure of the display substrate 100 and reduce the cost.
For example, the process flow of the display substrate 100 shown in fig. 1 may include: s1, processing the backboard 1; s2, adhering the LED device 2 to the back plate 1 (namely, a bonding process); s3, processing the infrared stop piece 31, and arranging the infrared stop piece 31 on the backboard 1; s4, coating the light-shielding member 32; and S5, grinding the part of the shading piece 32, which shields the surface of one side of the LED lamp bead 21, which faces away from the backboard 1, so that the surface of one side of the LED lamp bead 21, which faces away from the backboard 1, is exposed out of the shading piece 32. In step S1, the back plate 1 may be manufactured by using a conventional LTPS process.
The process flow of the display substrate 100 shown in fig. 3 and 4 may include: s1, disposing a heat conducting layer 13 (i.e., an LS layer) on the substrate 11, for example, processing the heat conducting layer 13 on the substrate 11 by a sputtering process (sputter), wherein the heat conducting layer 13 is made into a whole surface or a large-area flat layer to improve the heat dissipation effect; s2, providing the signal wiring layer 12 (i.e., VSS layer), and punching a hole on the first buffer layer 14 between the signal wiring layer 12 and the heat conductive layer 13 to form a through hole, and providing a heat conductive member 15 in the through hole to communicate the signal wiring layer 12 and the heat conductive layer 13; s3, adhering the LED device 2 to the back plate 1 (namely, a bonding process); s4, arranging a packaging shading structure 3 to reduce the optical crosstalk phenomenon; s5, grinding the part, facing away from the backboard 1, of the packaging and shading structure 3, which shields the surface of one side, facing away from the backboard 1, of the LED lamp bead 21, so that the surface of one side, facing away from the backboard 1, of the LED lamp bead 21 is exposed outside the packaging and shading structure 3. In step S2, the through holes may be processed by LTPS process, and when the substrate 11 is a flexible substrate, the heat conducting layer 13 may be made of nano silver or other materials with high flexibility to ensure the bending effect.
A display device according to an embodiment of the second aspect of the present invention comprises the display substrate 100 according to the above-described embodiment of the first aspect of the present invention.
According to the display device of the embodiment of the invention, the display substrate 100 is adopted, so that the temperature of the display device is conveniently controlled within a specified range, and the display device is ensured to be reliable in use.
Other configurations and operations of the display device according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. A display substrate, comprising:
a back plate;
the LED device is arranged on one side of the thickness of the back plate and comprises a plurality of LED lamp beads arranged at intervals;
encapsulation light-shielding structure, encapsulation light-shielding structure with the LED device is located the homonymy of backplate, encapsulation light-shielding structure's at least part is filled in arbitrary adjacent two clearance between the LED lamp pearl, and includes infrared stop, infrared stop is used for the separation infrared light.
2. The display substrate of claim 1, wherein the infrared cut-off is configured to absorb infrared light.
3. The display substrate of claim 1, wherein a surface of the LED device facing away from the back plate is exposed outside the encapsulation light shielding structure.
4. The display substrate of claim 1, wherein the encapsulation light shielding structure comprises a light shielding member defining a plurality of filling grooves, each filling groove is located between two adjacent LED beads, and at least one filling groove is filled with the infrared cut-off member.
5. The display substrate according to claim 4, wherein the infrared cut member comprises an infrared absorber and a resin matrix.
6. The display substrate of claim 5, wherein the infrared absorber is a cyanine dye, a phthalocyanine dye, an azo dye, a metal particle, an inorganic compound, or a semiconductor nanoparticle, and the resin matrix is an epoxy resin, an acrylic resin, a polyurethane, an alkyd resin, a phenolic resin, a vinyl resin, a fluorocarbon resin, or a silicone resin.
7. The display substrate of claim 1, wherein the infrared cut-off member fills a gap between two adjacent LED beads and comprises a light shielding material and infrared absorbing nanoparticles, and the infrared absorbing nanoparticles are mixed in the light shielding material.
8. The display substrate of any one of claims 1-7, wherein the backplane comprises:
a substrate;
the signal wiring layer is arranged between the substrate and the LED device and is electrically connected with each LED lamp bead;
a heat conduction layer arranged between the signal wiring layer and the substrate,
the first buffer layer is arranged between the signal wiring layer and the heat conduction layer so as to enable the signal wiring layer and the heat conduction layer to be arranged at intervals, and a through hole is formed in the first buffer layer;
and the heat conducting piece is arranged in the through hole and is directly connected with the signal wiring layer and the heat conducting layer respectively.
9. The display substrate according to claim 8, wherein the heat conductive layer is formed in a flat plate structure, and a projected area of the heat conductive layer is larger than a projected area of the signal wiring layer in a thickness direction of the back plate.
10. The display substrate according to claim 8, wherein the heat conductive layer is a light shielding material.
11. A display device comprising the display substrate according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111131366.9A CN113871379A (en) | 2021-09-26 | 2021-09-26 | Display substrate and display device having the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111131366.9A CN113871379A (en) | 2021-09-26 | 2021-09-26 | Display substrate and display device having the same |
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|---|---|
| CN113871379A true CN113871379A (en) | 2021-12-31 |
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| CN202111131366.9A Pending CN113871379A (en) | 2021-09-26 | 2021-09-26 | Display substrate and display device having the same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114975751A (en) * | 2022-05-25 | 2022-08-30 | 厦门天马显示科技有限公司 | Light-emitting panel, display device and backlight module |
| WO2023206625A1 (en) * | 2022-04-25 | 2023-11-02 | Tcl华星光电技术有限公司 | Display apparatus and preparation method therefor |
-
2021
- 2021-09-26 CN CN202111131366.9A patent/CN113871379A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023206625A1 (en) * | 2022-04-25 | 2023-11-02 | Tcl华星光电技术有限公司 | Display apparatus and preparation method therefor |
| CN114975751A (en) * | 2022-05-25 | 2022-08-30 | 厦门天马显示科技有限公司 | Light-emitting panel, display device and backlight module |
| CN114975751B (en) * | 2022-05-25 | 2024-08-02 | 厦门天马显示科技有限公司 | Light-emitting panel, display device and backlight module |
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