CN113871340A - Novel wafer film pasting process - Google Patents
Novel wafer film pasting process Download PDFInfo
- Publication number
- CN113871340A CN113871340A CN202111132834.4A CN202111132834A CN113871340A CN 113871340 A CN113871340 A CN 113871340A CN 202111132834 A CN202111132834 A CN 202111132834A CN 113871340 A CN113871340 A CN 113871340A
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- Prior art keywords
- vacuum
- wafer
- film
- film pasting
- main body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
Abstract
The invention relates to the technical field of wafer film pasting, in particular to a novel wafer film pasting process, which comprises a workbench, wherein a bearing plate is arranged at the lower side in the workbench, a vacuum machine is arranged at the end part of the bearing plate, a film pasting component is arranged at the end part of the workbench, the film pasting component comprises a vacuum film pasting table, a support pillar, a wafer main body, a positioning frame, a positioning shaft, a connecting rod, a first connecting shaft, a connecting rod, a positioning block, a second connecting shaft, a vacuum cover and an electric telescopic rod, the vacuum cover and the vacuum film pasting table can be connected simply and conveniently through the sliding connection of the positioning shaft and the connecting rod at the driving end of the electric telescopic rod, the pressing connection stability of the vacuum cover and the vacuum film pasting table can be high through the positioning block, the vacuum film pasting effect of the wafer main body can be good through the corresponding adaptive arrangement of the vacuum cover and the vacuum film pasting table, the film pasting effect of the wafer main body can be good through the vacuum adsorption, the film sticking efficiency and the quality of the wafer main body can be improved.
Description
Technical Field
The invention relates to the technical field of wafer film pasting, in particular to a novel wafer film pasting process.
Background
For some thin wafers with protruding solder balls and gold balls on the surfaces of chips, the conventional film pasting method is to adsorb the wafer on a worktable surface with the front surface of the wafer facing downwards, and then to press the film on the front surface of the wafer by using a roller, so that the protruding solder balls and the gold balls are easily crushed in the film pasting process, and the wafer is cracked.
Regarding the film-pasting problem of thin wafer with protruding solder balls and gold balls on the surface of the chip, a new wafer film-pasting process is needed to improve the above problem.
Disclosure of Invention
The present invention is directed to a novel wafer film pasting process to solve the problems of the background art mentioned above.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a new wafer pad pasting technology, includes the workstation, there is the loading board the inside downside of workstation, the tip of loading board is provided with the vacuum machine, the tip of workstation is provided with the pad pasting subassembly, the pad pasting subassembly includes vacuum pad pasting platform, support column, wafer main part, locating rack, location axle, linking pole, first switching axle, switching pole, locating piece, second switching axle, vacuum cover and electric telescopic handle.
As a preferable scheme of the invention, a vacuum tube is arranged on the left rear side of the end part of the vacuum film sticking table, a support column is arranged on the front side of the end part of the vacuum film sticking table, a wafer main body is arranged on the end part of the support column, positioning blocks are slidably arranged inside the left side and the right side of the positioning frame, connecting rods are rotatably arranged at two ends of the positioning shaft, a first rotating shaft is rotatably arranged at the other end of each connecting rod, rotating rods are rotatably arranged at two ends of the first rotating shaft, a second rotating shaft is arranged at the other end of each rotating rod, a vacuum cover is arranged on the inner side wall of each positioning block, and an electric telescopic rod is arranged on the left front side of the end part of the workbench.
As the preferable scheme of the invention, the middle of the grabbing and switching rod is rotatably connected with the positioning block through a small circular shaft, and the positioning shaft is fixedly connected with the workbench.
As a preferable scheme of the present invention, a positioning chute is formed in the left front side of the left side of the adapter rod, and the driving end of the electric telescopic rod is slidably connected to the adapter rod through a positioning circular shaft.
As a preferable scheme of the invention, the vacuum cover is correspondingly matched with the vacuum film sticking table, and the vacuum film sticking table is arranged at the end part of the workbench.
According to a preferable scheme of the invention, the positioning frame is positioned at the end part of the workbench and is arranged corresponding to the vacuum film sticking table, the vacuum pressure gauge is arranged on the left side of the front surface of the vacuum film sticking table, and the vacuum tube is connected with the vacuum machine through the connecting tube.
A novel wafer film pasting process comprises the following film pasting process steps:
s1, placing the wafer body with the back face upward and the edge suspended in the air by using the supporting column supporting center, and then placing the film on the wafer body;
and S2, pulling the counter-rotating connecting rod through an electric telescopic rod to enable the vacuum cover and the vacuum film sticking table to be sealed and covered, enabling the vacuum cover and the vacuum film sticking table to be vacuum through the work of a vacuum machine, and enabling the wafer main body to be well attached to the film by means of vacuum adsorption.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the vacuum film sticking table, the driving end of the electric telescopic rod is connected with the adapter rod in a sliding mode through the positioning round shaft, so that the vacuum cover and the vacuum film sticking table can be connected and operated simply and conveniently, and the vacuum cover and the vacuum film sticking table can be connected in a pressing mode through the arranged positioning block in a high-stability mode.
2. According to the invention, the vacuum cover and the vacuum film pasting table are correspondingly and adaptively arranged, so that the vacuum film pasting effect of the wafer main body is better, the vacuum adsorption is utilized to ensure that the film pasting effect of the wafer main body is good, and the film pasting efficiency and the film pasting quality of the wafer main body are high.
Drawings
FIG. 1 is a schematic overall front view of the present invention;
FIG. 2 is a schematic view of a rear view of a portion of the present invention;
FIG. 3 is a schematic structural diagram of a vacuum lamination station according to the present invention.
In the figure: 1. a work table; 101. a carrier plate; 102. a vacuum machine; 2. a film pasting component; 201. a vacuum film pasting table; 202. a support pillar; 203. a wafer body; 204. a positioning frame; 205. positioning the shaft; 206. a connecting rod; 207. a first transfer shaft; 208. a transfer lever; 209. positioning blocks; 210. a second transfer shaft; 211. a vacuum hood; 212. an electric telescopic rod; 213. a vacuum tube; 214. and a positioning chute.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
In order to facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-3, the present invention provides a technical solution:
the utility model provides a novel wafer pad pasting technology, includes workstation 1, there is the loading board 101 workstation 1's inside downside, and the tip of loading board 101 is provided with vacuum machine 102, and the tip of workstation 1 is provided with pad pasting subassembly 2, and pad pasting subassembly 2 includes vacuum pad pasting platform 201, support column 202, wafer main part 203, locating rack 204, location axle 205, joint pole 206, first joint axle 207, adapter pole 208, locating piece 209, second joint axle 210, vacuum hood 211 and electric telescopic handle 212.
In the embodiment, referring to fig. 1, 2 and 3, a vacuum tube 213 is disposed on the left rear side of the end portion of a vacuum film pasting table 201, a support column 202 is disposed on the front side of the end portion of the vacuum film pasting table 201, a wafer main body 203 is disposed on the end portion of the support column 202, positioning blocks 209 are slidably disposed inside the left and right sides of a positioning frame 204, connecting rods 206 are rotatably disposed on the two ends of the positioning shaft 205, a first connecting shaft 207 is rotatably disposed on the other end of the connecting rod 206, a connecting rod 208 is rotatably disposed on the two ends of the first connecting shaft 207, a second connecting shaft 210 is disposed on the other end of the connecting rod 208, a vacuum cover 211 is disposed on the inner side wall of the positioning block 209, an electric telescopic rod 212 is disposed on the left front side of the end portion of a workbench 1, the middle of the connecting rod 208 is rotatably connected with the positioning block 209 through a small round shaft, the positioning shaft 205 is fixedly connected with the workbench 1, a positioning chute 214 is disposed on the left front side of the connecting rod 208, the driving end of the electric telescopic rod 212 is connected with the adapter rod 208 in a sliding mode through the positioning round shaft, the vacuum cover 211 and the vacuum film sticking table 201 can be connected and operated simply and conveniently, and the vacuum cover 211 and the vacuum film sticking table 201 can be connected stably in a pressing mode through the set positioning block 209.
In an embodiment, referring to fig. 1, 2 and 3, the vacuum cover 211 is correspondingly adapted to the vacuum film sticking table 201, the vacuum film sticking table 201 is located at an end of the working table 1, the positioning frame 204 is located at an end of the working table 1 and is correspondingly arranged to the vacuum film sticking table 201, a vacuum manometer is arranged at a left side of a front surface of the vacuum film sticking table 201, the vacuum pipe 213 is connected to the vacuum machine 102 through a connecting pipe, the vacuum cover 211 and the vacuum film sticking table 201 are correspondingly adapted to each other, so that a vacuum film sticking effect of the wafer body 203 is good, the wafer body 203 is well stuck to the film by using vacuum adsorption, and the film sticking efficiency and quality of the wafer body 203 are high.
A novel wafer film pasting process comprises the following film pasting process steps:
s1, placing the wafer main body 203 with the back side facing upwards and the edge of the wafer main body 203 supported by the support column 202 with the center suspended, and then placing the film on the wafer main body 203;
s2, the extension rod 208 is pulled by the electric telescopic rod 212 to hermetically cover the vacuum cover 211 and the vacuum film-pasting table 201, the vacuum machine 102 is operated to realize vacuum between the vacuum cover 211 and the vacuum film-pasting table 201, and the wafer body 203 is pasted with the film by vacuum adsorption.
The working principle is as follows: when in use, the back of the wafer main body 203 is upwards, the edge of the wafer main body 203 is suspended by the supporting center of the supporting column 202, then a film is placed on the wafer main body 203, the rotating connecting rod 208 is pulled by the electric telescopic rod 212, so that the vacuum cover 211 and the vacuum film sticking table 201 are sealed and covered, the vacuum machine 102 works to realize vacuum between the vacuum cover 211 and the vacuum film sticking table 201, the wafer main body 203 is well adhered to the film by vacuum adsorption, the vacuum cover 211 and the vacuum film sticking table 201 can be simply and conveniently connected and operated by the sliding connection of the driving end of the arranged electric telescopic rod 212 and the rotating connecting rod 208 through the positioning circular shaft, the pressing connection stability of the vacuum cover 211 and the vacuum film sticking table 201 can be high through the arranged positioning block 209, the vacuum cover 211 and the vacuum film sticking table 201 are correspondingly matched, so that the vacuum film sticking effect of the wafer main body 203 is good, the vacuum adsorption is used to make the wafer main body 203 have good effect of adhering with the film, and the film adhering efficiency and the quality of the wafer main body 203 can be high.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A novel wafer film pasting process comprises a workbench (1), and is characterized in that: there is loading board (101) inside downside of workstation (1), the tip of loading board (101) is provided with vacuum machine (102), the tip of workstation (1) is provided with pad pasting subassembly (2), pad pasting subassembly (2) are including vacuum pad pasting platform (201), support column (202), wafer main part (203), locating rack (204), location axle (205), joint pole (206), first switching axle (207), changeover lever (208), locating piece (209), second switching axle (210), vacuum cover (211) and electric telescopic handle (212).
2. The novel wafer lamination process according to claim 1, wherein: the utility model discloses a vacuum film laminating machine, including vacuum pad pasting platform (201), locating rack (204), locating rack (208), positioning shaft (206), vacuum tube (213), support column (202), wafer main body (203) are provided with to the tip left rear side of vacuum pad pasting platform (201), the inside slidable mounting in the left and right sides of vacuum pad pasting platform (201) has locating piece (209), the both ends of positioning shaft (205) are rotated and are installed linking rod (206), the other end of linking rod (206) is rotated and is installed first switching shaft (207), the both ends of first switching shaft (207) are rotated and are installed switching rod (208), second switching shaft (210) are installed to the other end of switching rod (208), vacuum cup (211) is installed to the inside wall of locating piece (209), the tip left front side of workstation (1) is provided with electric telescopic handle (212).
3. The novel wafer lamination process according to claim 1, wherein: the middle of the grabbing and switching rod (208) is rotatably connected with the positioning block (209) through a small round shaft, and the positioning shaft (205) is fixedly connected with the workbench (1).
4. The novel wafer lamination process according to claim 1, wherein: the left side the left front side of adapter lever (208) is opened and is equipped with location spout (214), the drive end of electric telescopic handle (212) passes through location circle axle and adapter lever (208) sliding connection.
5. The novel wafer lamination process according to claim 1, wherein: the vacuum cover (211) is correspondingly matched with the vacuum film sticking table (201), and the vacuum film sticking table (201) is arranged at the end part of the workbench (1).
6. The novel wafer lamination process according to claim 1, wherein: the end part of the positioning frame (204) positioned on the workbench (1) is arranged corresponding to the vacuum film sticking table (201), the left side of the front surface of the vacuum film sticking table (201) is provided with a vacuum pressure gauge, and the vacuum tube (213) is connected with the vacuum machine (102) through a connecting tube.
7. The novel wafer lamination process according to claim 1, wherein: the method comprises the following film pasting process steps:
s1, placing the wafer main body (203) with the back face upward and the edge of the wafer main body (203) with the supporting column (202) supporting the center in a suspended manner, and then placing the film on the wafer main body (203);
s2, the electric telescopic rod (212) pulls the rotary connecting rod (208), so that the vacuum cover (211) and the vacuum film sticking table (201) are sealed and covered, the vacuum machine (102) works to realize vacuum between the vacuum cover (211) and the vacuum film sticking table (201), and the wafer body (203) is bonded with the film by vacuum adsorption.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111132834.4A CN113871340B (en) | 2021-09-27 | 2021-09-27 | Novel wafer film pasting process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111132834.4A CN113871340B (en) | 2021-09-27 | 2021-09-27 | Novel wafer film pasting process |
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| Publication Number | Publication Date |
|---|---|
| CN113871340A true CN113871340A (en) | 2021-12-31 |
| CN113871340B CN113871340B (en) | 2022-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111132834.4A Active CN113871340B (en) | 2021-09-27 | 2021-09-27 | Novel wafer film pasting process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116130384A (en) * | 2022-12-16 | 2023-05-16 | 江苏宝浦莱半导体有限公司 | Semiconductor wafer film pasting technology |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208906609U (en) * | 2018-09-26 | 2019-05-28 | 东莞市译码半导体有限公司 | A kind of vacuum chip mounter |
| CN111710620A (en) * | 2019-03-18 | 2020-09-25 | 广东思沃精密机械有限公司 | Film sticking device |
| CN112172118A (en) * | 2020-09-24 | 2021-01-05 | 江苏赛博宇华科技有限公司 | Mobile phone film processing equipment |
| CN112786497A (en) * | 2021-03-03 | 2021-05-11 | 芯钛科半导体设备(上海)有限公司 | Inverted vacuum wafer film pasting device |
-
2021
- 2021-09-27 CN CN202111132834.4A patent/CN113871340B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208906609U (en) * | 2018-09-26 | 2019-05-28 | 东莞市译码半导体有限公司 | A kind of vacuum chip mounter |
| CN111710620A (en) * | 2019-03-18 | 2020-09-25 | 广东思沃精密机械有限公司 | Film sticking device |
| CN112172118A (en) * | 2020-09-24 | 2021-01-05 | 江苏赛博宇华科技有限公司 | Mobile phone film processing equipment |
| CN112786497A (en) * | 2021-03-03 | 2021-05-11 | 芯钛科半导体设备(上海)有限公司 | Inverted vacuum wafer film pasting device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116130384A (en) * | 2022-12-16 | 2023-05-16 | 江苏宝浦莱半导体有限公司 | Semiconductor wafer film pasting technology |
| CN116130384B (en) * | 2022-12-16 | 2023-10-24 | 江苏宝浦莱半导体有限公司 | Semiconductor wafer film pasting technology |
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| Publication number | Publication date |
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| CN113871340B (en) | 2022-11-25 |
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