CN113869479A - Multi-purpose wireless RFID (radio frequency identification) tag suitable for different frequency bands - Google Patents
Multi-purpose wireless RFID (radio frequency identification) tag suitable for different frequency bands Download PDFInfo
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- CN113869479A CN113869479A CN202111141953.6A CN202111141953A CN113869479A CN 113869479 A CN113869479 A CN 113869479A CN 202111141953 A CN202111141953 A CN 202111141953A CN 113869479 A CN113869479 A CN 113869479A
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- glue
- metal layer
- frequency
- substrate
- wireless rfid
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 78
- 239000002184 metal Substances 0.000 claims abstract description 78
- 239000003292 glue Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 26
- -1 chip Substances 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 239000012811 non-conductive material Substances 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 71
- 239000000047 product Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 10
- 241001602730 Monza Species 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 239000011265 semifinished product Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
Abstract
A multi-purpose wireless RFID tag suitable for different frequency bands. Relate to a be suitable for different frequency channels multi-purpose wireless RFID label, belong to RFID label technical field. The multi-purpose wireless RFID tag suitable for different frequency bands can realize multi-frequency-point performance of the tag and widen the application range of products. Substrate, glue, chip, metal level that set gradually including from the bottom up are one, substrate one, frequency point group, glue and plane materiel, the chip passes through conducting resin and is connected with metal level one, frequency point group includes glue, metal level and the substrate that from the bottom up set gradually, in the vertical direction, the metal level has partial overlap with metal level one. The frequency point group comprises at least two frequency points. Two metal layers in adjacent frequency bin groups have a partial overlap in the vertical direction. And a glue-free area is arranged on the outer side of the glue in the frequency point group. The glue is removable glue, and the thickness of removable glue is 10-30 um. The invention is convenient to process and improves the product competitiveness.
Description
Technical Field
The invention relates to a multipurpose wireless RFID (radio frequency identification) tag suitable for different frequency bands, belonging to the technical field of RFID tags.
Background
Rfid (radio Frequency identification) technology, also called radio Frequency identification, is a communication technology that can identify a specific target and read and write related data through radio signals without establishing mechanical or optical contact between an identification system and the specific target.
In the Chinese market, the application of high-frequency RFID technology is still the mainstream trend of industry development, and ultrahigh frequency is the future development trend. In China, RFID has already formed a mature application mode in the fields of electronic tickets, access control, mobile phone payment and the like, and the applications in the fields are mostly concentrated in low and high frequency bands. In the aspect of high-frequency application, chip design, manufacture, ticket manufacturing process, packaging technology and the like of domestic manufacturers gradually show strong competitive strength and advantages, and through rapid development for years, a domestic RFID high-frequency industry chain is continuously perfected and can be compared with the international level to become the middle strength of the market. The occupancy of the ultrahigh frequency RFID field in the whole market is only at a low level at present, but as the ultrahigh frequency RFID is continuously popularized and developed in a plurality of fields such as shoe and clothing new retail, unmanned convenience stores, book management, medical health, aviation, logistics, traffic and the like, the ultrahigh frequency RFID will become a key breakthrough in industry development in the future.
In order to adapt to the increasingly complex application environment and the increasingly special application requirements, the application capability of the RFID tag is increasingly high. The conventional ultrahigh frequency tag comprises a base material, a front metal antenna, a conductive adhesive and a chip, wherein the front metal antenna is attached above the base material, and the conductive adhesive is positioned above the metal antenna and is used for connecting the metal antenna and the chip. The conventional RFID ultrahigh frequency tag obtains energy by receiving electromagnetic waves to activate the tag to radiate the electromagnetic waves in an outward fixed direction, so that radio frequency information transmission communication is carried out. The RFID ultrahigh frequency tag in the existing industry is a single application frequency point and is designed and developed aiming at a single application environment, so that the application market of the tag is limited, the product competitiveness is insufficient, and the product application is not wide.
Therefore, it is a great trend to provide a multi-purpose wireless RFID tag suitable for different frequency bands to solve the above problems, improve product competitiveness and reduce enterprise cost.
In addition, the existing RFID label suitable for multiple frequency bands on the market is mainly characterized in that a virtual cutter is added on the surface of the label to divide the label into 2-3 areas, and different virtual cutter areas of an antenna are torn off to apply the label at different frequency points; however, the method has high requirements on production precision, and in addition, when the label is torn, a customer risks that the label is torn off, so that the label is completely out of service.
Meanwhile, the publication number of 2021.02.26 published by the national intellectual property agency is CN112418375A, which is named as a multi-band anti-counterfeiting RFID tag, and the multi-band anti-counterfeiting RFID tag is provided with a surface material with adhesive and a substrate with adhesive, wherein an antenna front aluminum layer, a first strong adhesive layer, an antenna substrate layer, a weak adhesive layer, a fragile film layer, a second strong adhesive layer, an antenna back aluminum layer and a chip are sequentially arranged between the surface material with adhesive and the substrate with adhesive; and the aluminum layer on the front surface of the antenna and the aluminum layer on the back surface of the antenna are provided with antennas which are connected with at least two frequency bands of the chip. However, in use, only two frequency bands can be used (i.e., one high frequency and one ultra-high frequency); meanwhile, the two multi-band antenna designs cannot be overlapped, which can affect the performance of the two frequency bands; and the fragile layer process is adopted, so that the production precision requirement is high, and the mass production cannot be realized.
Disclosure of Invention
Aiming at the problems, the invention provides the multi-frequency-point wireless RFID label which can realize the multi-frequency-point performance of the label and widen the application range of products and is suitable for different frequency bands.
The technical scheme of the invention is as follows: comprises a substrate, glue, a chip, a first metal layer, a first substrate, a frequency point group, glue and a surface material which are arranged from bottom to top in sequence,
the chip is connected with the first metal layer through conductive adhesive,
the frequency point group comprises glue, a metal layer and a base material which are sequentially arranged from bottom to top, and the metal layer are partially overlapped in the vertical direction.
The frequency point group comprises at least two frequency points.
Two metal layers in adjacent frequency bin groups have a partial overlap in the vertical direction.
And a glue-free area is arranged on the outer side of the glue in the frequency point group.
The glue is removable glue, and the thickness of removable glue is 10-30 um.
The first metal layer and the metal layer are both made of conductive materials, and comprise AI, copper, silver paste or graphene.
The first base material and the base material are both non-conductive materials and comprise PET, PVC, PTFE or resin.
The weight thickness range of the metal layer and the base material is 1-100 um.
In the working process, the chip is arranged at the lower part of the label, so that the production efficiency is improved; the frequency point group is arranged on the upper portion of the first metal layer connected with the chip, and the first base material is arranged between the frequency point group and the first metal layer, so that the metal layer in the frequency point group and the first metal layer are in a non-contact state, and meanwhile, the metal layer and the first metal layer are partially overlapped, and therefore the label performance frequency point is enabled to reach the optimal state in a non-contact coupling mode.
The invention is convenient to process and improves the product competitiveness.
Drawings
Figure 1 is a schematic view of the structure of the present invention,
figure 2 is an exploded schematic view of figure 1,
figure 3 is a schematic view of an application of the invention,
figure 4 is a schematic perspective view of figure 3,
FIG. 5 is an exploded schematic view of FIG. 3;
in the figure, 1 is a substrate, 2 is glue, 3 is a chip, 4 is a first metal layer, 5 is a first substrate, 6 is a frequency point group, 61 is a metal layer, 62 is a substrate, 63 is a glue-free area,
Detailed Description
The invention is shown in figure 1-2, which comprises a substrate 1, glue 2, a chip 3, a metal layer I4, a substrate I5, a frequency point group 6, glue 2 and a surface material 7 which are arranged from bottom to top in sequence,
the chip 3 is connected with the first metal layer 4 through conductive adhesive,
the frequency point group 6 comprises glue 2, a metal layer 61 and a base material 62 which are sequentially arranged from bottom to top, and the metal layer 61 and the metal layer one 4 are partially overlapped in the vertical direction.
In the working process, the chip is arranged at the lower part of the label, so that the production efficiency is improved; the frequency point group is arranged on the upper portion of the first metal layer connected with the chip, and the first base material is arranged between the frequency point group and the first metal layer, so that the metal layer in the frequency point group and the first metal layer are in a non-contact state, and meanwhile, the metal layer and the first metal layer are partially overlapped, and therefore the label performance frequency point is enabled to reach the optimal state in a non-contact coupling mode.
The first metal layer is in contact with the chip to form a first product frequency point; forming a product frequency point two by the metal layers in the chip, the metal layer I and the frequency point group; can be torn off according to the use requirement.
The chip is arranged at the lower part, and meanwhile, the phenomenon that the label performance is influenced by the fact that the label tearing glue is strong in viscosity and damages the chip when in use is avoided.
The frequency point group 6 includes at least two. Like this, can select the multilayer setting according to the demand, convenient processing forms the frequency point of a plurality of different combinations on the cubical space.
Two metal layers 61 in adjacent frequency bin groups 6 have a partial overlap in the vertical direction.
And a glue-free area 63 is arranged on the outer side of the glue in the frequency point group. The glue-free area is arranged, so that a user can tear off the corresponding frequency point group conveniently, required frequency points can be obtained, the operation is convenient, and the reliability is high.
The first metal layer 4 and the metal layer 61 are both made of conductive materials, and comprise AI, copper, silver paste or graphene. Can be selected according to the processing requirement.
The first substrate 5 and the substrate 62 are both non-conductive materials, and the materials have certain softness and comprise PET, PVC, PTFE or resin. Can be selected according to the processing requirement.
The metal layer 61 and the substrate 62 have a weight thickness in the range of 1-100 um.
The label processed by the invention has flexibility and wider application range.
The number of the metal layers can be a plurality, the metal layers are connected in a sticky mode through glue, and the total thickness of the metal layers matched with the glue is not more than 800 microns.
The plurality of metal layers are in a non-contact state pairwise, and the performance frequency points of the labels are in an optimal state by partially overlapping the metal layers and utilizing a non-contact coupling mode.
In a specific application, as shown in fig. 3-5, if two frequency point groups are set, including a surface material 7, glue 2, a substrate three 92, a metal layer three 91, glue 2, a substrate two 82, a metal layer two 81, glue 2, a substrate one 5, a metal layer one 4, a chip 3, glue 2, and a substrate 1,
the antenna is formed by combining and matching a plurality of metal layer antennas, the metal layers are connected and fixed through glue of each layer, and the performance frequency point diversification of the tag is realized through mutual electromagnetic coupling among the layers;
the first metal layer is in contact with the chip to form a first product frequency point; a product frequency point two is formed by the chip, the metal layer I and the metal layer II; the chip, the first metal layer, the second metal layer and the third metal layer form a third product frequency point, and the non-conductive base material and glue are arranged among the metal layers at intervals and are not in direct contact with each other.
Aiming at the required frequency point three, a user can directly use the multilayer composite product when using the composite material; the surface material and the metal layer III can be torn off for direct use aiming at the required frequency point II; aiming at the first required frequency point, the user can tear off the second metal layer again for direct use;
the production and processing method comprises the following steps: connecting the chip with a first metal layer (including a first substrate) through a conductive adhesive to form a first semi-finished product; compounding the semi-finished product I and the metal layer II (including the base material) by removable glue to form a semi-finished product II; compounding the semi-finished product II, the metal layer III (including the base material) and the surface material by removable glue to form a final product label;
the connected chip types in the invention are as follows: ucode9, Ucode8, Ucode7 series, Monza 700 series, Monza R6, Monza 5, Monza 4, H3, H4, H9.
The invention is convenient and practical, and has the following advantages:
1) the multi-frequency-point performance of the tag can be realized by carrying out non-contact structural design through the multi-layer metal layer antenna, and the application range of the product is widened;
2) the multilayer metal antenna is wirelessly coupled by adopting the overlapping area (namely, partial overlapping), so that the difficulty of the production process is reduced, and the production efficiency is improved;
3) the product chip is designed downwards, and glue can be removed by matching each layer, so that the use of the product is not damaged, the safety of the product is improved, and the service life of the product is guaranteed;
4) the product is realized in the RFID field, and has different reading distance performances;
5) and innovatively providing the combination of the multiple layers of RFID antennas, and performing multi-field application in a layer-by-layer label tearing mode.
The disclosure of the present application also includes the following points:
(1) the drawings of the embodiments disclosed herein only relate to the structures related to the embodiments disclosed herein, and other structures can refer to general designs;
(2) in case of conflict, the embodiments and features of the embodiments disclosed in this application can be combined with each other to arrive at new embodiments;
the above embodiments are only embodiments disclosed in the present disclosure, but the scope of the disclosure is not limited thereto, and the scope of the disclosure should be determined by the scope of the claims.
Claims (8)
1. A multipurpose wireless RFID tag suitable for different frequency bands is characterized by comprising a substrate, glue, a chip, a first metal layer, a first substrate, a frequency point group, glue and a surface material which are sequentially arranged from bottom to top,
the chip is connected with the first metal layer through conductive adhesive,
the frequency point group comprises glue, a metal layer and a base material which are sequentially arranged from bottom to top, and the metal layer are partially overlapped in the vertical direction.
2. The multi-use wireless RFID tag suitable for different frequency bands of claim 1, wherein the frequency point groups include at least two.
3. The multi-use wireless RFID tag suitable for different frequency bands of claim 2, wherein two metal layers in adjacent frequency point groups have a partial overlap in a vertical direction.
4. The multi-purpose wireless RFID tag suitable for different frequency bands according to any one of claims 1 to 3, wherein the outside of the glue in the frequency point group is provided with a glue-free area.
5. The multi-purpose wireless RFID tag for different frequency bands of claim 4, wherein the glue is a removable glue, and the thickness of the removable glue is 10-30 um.
6. The multi-purpose wireless RFID tag suitable for different frequency bands of claim 1, wherein the first metal layer and the metal layer are both conductive materials, and comprise AI, copper, silver paste or graphene.
7. The multi-use wireless RFID tag for different frequency bands of claim 1, wherein the first substrate and the second substrate are both non-conductive materials, and comprise PET, PVC, PTFE or resin.
8. The multi-purpose wireless RFID tag suitable for different frequency bands of claim 1, wherein the metal layer and the substrate have a weight thickness ranging from 1 um to 100 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111141953.6A CN113869479A (en) | 2021-09-28 | 2021-09-28 | Multi-purpose wireless RFID (radio frequency identification) tag suitable for different frequency bands |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111141953.6A CN113869479A (en) | 2021-09-28 | 2021-09-28 | Multi-purpose wireless RFID (radio frequency identification) tag suitable for different frequency bands |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113869479A true CN113869479A (en) | 2021-12-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111141953.6A Pending CN113869479A (en) | 2021-09-28 | 2021-09-28 | Multi-purpose wireless RFID (radio frequency identification) tag suitable for different frequency bands |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113869479A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101006457A (en) * | 2004-08-13 | 2007-07-25 | 传感电子公司 | Tunable spiral antenna for security tag |
| JP2007233508A (en) * | 2006-02-28 | 2007-09-13 | Tdk Corp | Auxiliary sheet for ic tag and wireless ic tag sheet |
| CN101095177A (en) * | 2004-11-15 | 2007-12-26 | 传感电子公司 | Combination eas and rfid label or tag |
| US20120018505A1 (en) * | 2010-07-23 | 2012-01-26 | Sensormatic Electronics , Llc | Tag having dipole-loop antenna |
| CN207852909U (en) * | 2017-08-30 | 2018-09-11 | 江苏稻源微电子有限公司 | A kind of RFID tag and radio-frequency recognition system |
| CN111226227A (en) * | 2017-11-14 | 2020-06-02 | Nok株式会社 | IC tag |
| CN210691372U (en) * | 2019-12-31 | 2020-06-05 | 扬州久元电子有限公司 | RFID label destroyed by tearing |
| CN112418375A (en) * | 2020-11-23 | 2021-02-26 | 江苏科睿坦电子科技有限公司 | Multi-frequency band anti-counterfeiting RFID label |
-
2021
- 2021-09-28 CN CN202111141953.6A patent/CN113869479A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101006457A (en) * | 2004-08-13 | 2007-07-25 | 传感电子公司 | Tunable spiral antenna for security tag |
| CN101095177A (en) * | 2004-11-15 | 2007-12-26 | 传感电子公司 | Combination eas and rfid label or tag |
| JP2007233508A (en) * | 2006-02-28 | 2007-09-13 | Tdk Corp | Auxiliary sheet for ic tag and wireless ic tag sheet |
| US20120018505A1 (en) * | 2010-07-23 | 2012-01-26 | Sensormatic Electronics , Llc | Tag having dipole-loop antenna |
| CN207852909U (en) * | 2017-08-30 | 2018-09-11 | 江苏稻源微电子有限公司 | A kind of RFID tag and radio-frequency recognition system |
| CN111226227A (en) * | 2017-11-14 | 2020-06-02 | Nok株式会社 | IC tag |
| CN210691372U (en) * | 2019-12-31 | 2020-06-05 | 扬州久元电子有限公司 | RFID label destroyed by tearing |
| CN112418375A (en) * | 2020-11-23 | 2021-02-26 | 江苏科睿坦电子科技有限公司 | Multi-frequency band anti-counterfeiting RFID label |
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