CN113865738A - Temperature measuring device, temperature detecting method, client and medium - Google Patents
Temperature measuring device, temperature detecting method, client and medium Download PDFInfo
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- CN113865738A CN113865738A CN202111139192.0A CN202111139192A CN113865738A CN 113865738 A CN113865738 A CN 113865738A CN 202111139192 A CN202111139192 A CN 202111139192A CN 113865738 A CN113865738 A CN 113865738A
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- G—PHYSICS
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Abstract
The application discloses a temperature measuring device, a detection method, a client and a medium, wherein the temperature measuring device comprises a chuck and a temperature sensing element detachably connected with the chuck, the chuck is used for fixing the temperature sensing element, a control circuit and an acquisition circuit connected with the control circuit are arranged in the chuck, the control circuit is used for controlling to provide a detection signal for the temperature sensing element, and the acquisition circuit is used for acquiring a current signal on the control circuit; the temperature sensing element comprises a sensing point for measuring the temperature of the piece to be measured and a contact electrically connected with the control circuit. The temperature measuring device provided by the embodiment of the application can be used for detecting the temperature of the binding area of the display panel. The simultaneous measurement is carried out aiming at different positions, so that the interference to the operation environment is avoided, and meanwhile, no extra wire loss event exists.
Description
Technical Field
The present application relates generally to the field of optoelectronic display binding technologies, and in particular, to a temperature measurement device, a detection method, a client, and a medium.
Background
In the Bonding process in the photoelectric display industry, temperature control is the most central and important key parameter. The Bonding failure can be caused by improper control and inaccurate measurement of the entity temperature, and serious poor product reliability exists, which cannot be found in time. Inaccurate measuring instruments or difficult management and easy damage can influence the normal production plan of equipment, so that the customer requirements cannot be met in time.
The existing measuring equipment is realized in a wired connection mode, and can only meet the theoretical measuring precision requirement, but in practical application: the space adaptability is poor, special wires are needed for connection, the wire is high in loss (representing use and maintenance cost is high), the high-speed moving characteristic satisfaction with the process is poor, and the like, so that the working efficiency is low as a direct result, and the requirement of mass production efficiency of a manufacturing factory is very unfavorable.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a temperature measuring device, a detection method, a client and a medium, which can monitor the temperature of a bonded area in real time.
In a first aspect, the present application provides a temperature measuring device comprising a cartridge and a temperature sensing element removably coupled to the cartridge, wherein,
the chuck is used for fixing the temperature sensing element, a control circuit and an acquisition circuit connected with the control circuit are arranged in the chuck, the control circuit is used for controlling the temperature sensing element to be provided with a detection signal, and the acquisition circuit is used for acquiring a current signal on the control circuit;
the temperature sensing element comprises a sensing point for measuring the temperature of the piece to be measured and a contact electrically connected with the control circuit.
Optionally, a first channel for accommodating the temperature sensing element and a second channel perpendicular to the first channel are disposed on the chuck, and a pull rod for fixing the temperature sensing element is disposed in the second channel.
Optionally, the pull rod is configured to reciprocate in the direction of the second channel to achieve a pressed state and a released state for the temperature sensing element, the pressed state is configured such that the temperature sensing element is electrically connected with the control circuit, and the released state is configured such that the temperature sensing element is disconnected from the control circuit.
Optionally, a limiting hole for limiting the movement of the pull rod is further formed in the chuck, and a limiting rod matched with the limiting hole is arranged on the pull rod.
Optionally, a contact spring sheet matched with the contact is arranged on the chuck.
Optionally, the temperature-sensitive element comprises a thermistor.
Optionally, the chuck further comprises a signal amplifying circuit, an analog-to-digital conversion circuit, and a wireless communication module connected to the collecting circuit, wherein,
the signal amplification circuit is used for amplifying the current on the control circuit, wherein the current signal acquired by the acquisition circuit is an amplified signal after amplification;
the analog-to-digital conversion circuit is used for converting the amplified signal into a digital signal;
and the wireless communication module is used for sending the digital signal to a client.
Further, the client is used for converting the digital signal into a temperature curve based on a preset temperature-current relation.
In a second aspect, the present application provides a temperature detection method using a temperature measurement device as described in any one of the above, the method comprising:
selecting a plurality of points to be measured in a binding region, and fixing sensing points of the temperature measuring device at the points to be measured in the binding region, wherein the temperature measuring device corresponds to the points to be measured one by one;
in the binding process, temperature detection is carried out through the temperature measuring device, and data collected in real time are uploaded to the client;
and acquiring a temperature curve of the point to be measured in the binding region according to a temperature-current relation preset by the client.
Further, the method further comprises:
acquiring a temperature curve corresponding to each point to be measured and the highest temperature corresponding to each temperature curve;
and judging whether the corresponding temperature curve is abnormal or not based on the temperature curve and the highest temperature.
Optionally, the determining whether the corresponding temperature curve is abnormal based on the temperature curve and the maximum temperature includes:
acquiring a temperature value at a first set time point;
judging whether the ratio of the temperature value to the highest temperature is in a preset range or not;
if yes, the temperature curve is normal; if not, the temperature curve is abnormal.
Optionally, the determining whether the corresponding temperature curve is abnormal based on the temperature curve and the maximum temperature includes:
selecting a first temperature curve of a point to be measured, and acquiring a second temperature curve corresponding to at least one adjacent point to be measured adjacent to the position of the point to be measured;
judging whether the temperature difference value of the first temperature curve and the second temperature curve at the corresponding time point is in a threshold range in a preset time period or not based on the first temperature curve and the second temperature curve;
if so, calibrating the temperature curve to be normal; if not, the temperature curve is calibrated to be abnormal.
In a third aspect, the present application provides a client, including a memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the processor executes the program to implement the temperature detection method as described in any one of the above.
In a fourth aspect, the present application provides a computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a temperature detection method as described in any of the above.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
the temperature measuring device provided by the embodiment of the application is detachably connected with the temperature sensing element through the chuck, the temperature of the sensing point is measured through the independent temperature measuring circuit arranged in the chuck, and the temperature is sent to the client side in a wireless mode, so that the remote measurement of the measuring point is realized.
The temperature measuring device provided by the embodiment of the application can be used for detecting the temperature of the binding area of the display panel. The simultaneous measurement is carried out aiming at different positions, so that the interference to the operation environment is avoided, and meanwhile, no extra wire loss event exists.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic connection diagram of a temperature measuring device according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a chuck provided in an embodiment of the present application;
FIG. 3 is a schematic diagram of a temperature sensing element according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a connection for temperature measurement of a bonded area according to an embodiment of the present application;
FIG. 5 is a flow chart of a temperature detection method provided by an embodiment of the present application;
fig. 6 is a flowchart of a method for determining a temperature curve according to an embodiment of the present disclosure;
FIG. 7 is a schematic diagram of a temperature curve calibration process according to an embodiment of the present application;
FIG. 8 is a temperature profile provided by an embodiment of the present application;
fig. 9 is a schematic structural diagram of a client according to an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1-2 in detail, the present application provides a temperature measuring device comprising a cartridge 10 and a temperature sensing element 20 removably connected to the cartridge 10.
The chuck 10 is used for fixing the temperature sensing element 20, a control circuit 101 and an acquisition circuit 102 connected with the control circuit 101 are arranged in the chuck 10, the control circuit 101 is used for controlling to provide a detection signal for the temperature sensing element 20, and the acquisition circuit 102 is used for acquiring a current signal on the control circuit 101.
The temperature sensing element 20 includes a sensing point 21 for measuring the temperature of the object to be measured and a contact point 22 electrically connected to the control circuit 101.
In the embodiment of the present application, the temperature sensing element 20 is fixed by the chuck 10, the sensing point 21 at one end of the temperature sensing element 20 is in contact with a temperature measuring area, and in the control circuit 101 to which the temperature sensing element 20 is connected, when the impedance of the sensing point 21 changes with the temperature, the current in the control circuit 101 also changes, and the temperature change condition of the sensing point 21 can be represented by collecting the current information in the control circuit 101.
In addition, in the embodiment of the present application, the temperature sensing element 20 and the cartridge 10 are detachably connected, and different temperature sensing elements 20 can be selected according to different application environments, devices or scenes. In the embodiment of the present application, the temperature sensing element 20 is a thermistor. The material of the thermistor may be an oxide of various metals, such as copper oxide, iron oxide, aluminum oxide, manganese oxide, cobalt oxide, nickel oxide, rhenium oxide, and the like.
As shown in fig. 3, the temperature sensing element 20 is in the shape of a strip, one end of which is a sensing point 21 that is in contact with a point to be measured, a thermistor is arranged on the sensing point 21, and the other end of which is two metal contact points 22 that are connected with the control circuit 101 and are used for inputting and outputting signals, respectively.
In the embodiment of the application, the temperature change at the sensing point causes the impedance change of the sensing point, so as to influence the current change on the control circuit, wherein the current is equal to the voltage/contact point impedance; the current is restored to be a standard temperature value through the client by collecting the current on the control circuit, and the temperature of the area to be measured is measured.
In a specific arrangement, the chuck 10 is provided with a first channel for accommodating the temperature sensing element 20 and a second channel perpendicular to the first channel, and the second channel is provided with a pull rod 11 for fixing the temperature sensing element 20.
Wherein the pull rod 11 is configured to reciprocate in the direction of the second passage to achieve a pressed state and a released state of the temperature sensing element 20, the pressed state is configured such that the temperature sensing element 20 is electrically connected to the control circuit 101, and the released state is configured such that the temperature sensing element 20 is disconnected from the control circuit 101. The chuck 10 is provided with a contact spring 12 which is matched with the contact point 22.
In addition, the chuck 10 is further provided with a limiting hole 13 for limiting the movement of the pull rod 11, and the pull rod 11 is provided with a limiting rod 14 matched with the limiting hole 13.
When the temperature sensing device is used, the temperature sensing element 20 is placed in the first channel, the contact 22 in the temperature sensing element 20 is moved to the position of the contact elastic sheet 12, the pull rod 11 moves downwards along the second channel, the temperature sensing element 20 is pressed on the contact elastic sheet 12, and then the limiting rod 14 is clamped through the limiting hole 13, so that the fixing effect is realized. In the embodiment of the present application, the limiting hole 13 is disposed on the second channel, and by rotating the pull rod 11, the limiting rod 14 on the pull rod 11 can be moved into the limiting hole 13, so as to limit the pull rod 11 through the limiting hole 13.
It should be noted that, in the embodiment of the present application, the limiting for the pull rod 11 may also include other limiting mechanisms, for example, implemented by a thread manner. In addition, in the embodiment of the present application, the contact elastic sheet 12 is made of metal having elastic protrusions, and the positioning between the contact elastic sheet 12 and the contact point 22 of the temperature sensing element 20 can be improved by the relaxed state, and in the pressed state, the contact elastic sheet 12 can be pressed downward, so that the contact reliability is increased, and at the same time, the distance between the temperature sensing element 20 and the lower surface of the chuck 10 can be reduced.
The inside of the chuck 10 further includes a signal amplifying circuit 103, an analog-to-digital conversion circuit 104, and a wireless communication module 105, which are connected to the acquisition circuit 102.
The signal amplification circuit 103 is configured to amplify the current in the control circuit 101, where the current signal acquired by the acquisition circuit 102 is an amplified signal.
The analog-to-digital conversion circuit 104 is configured to convert the amplified signal into a digital signal; through converting analog signals into digital signals, data wireless transmission and data analysis are conveniently carried out.
The wireless communication module 105 is configured to send the digital signal to the client 200. In the embodiment of the present application, the wireless communication method between the client 200 and the temperature measuring device is different, such as 3G/4G, WIFI, bluetooth, etc. This is not particularly limited in the embodiments of the present application. On the basis of not deviating from the concept of the invention, different wireless communication modes can be selected according to different transmission distances and the like.
In the embodiment of the present application, the chuck 10 further includes a microcontroller 106 and a memory 107, which are connected to the control circuit 101, the acquisition circuit 102, the signal amplification circuit 103, the analog-to-digital conversion circuit 104, and the wireless communication module 105. The microcontroller is used for acquiring and processing digital temperature measurement information, operating a wireless temperature measurement program, and realizing functions such as wireless communication and the like; the memory adopts DRAM or ROM, wherein, DRAM: the dynamic random access memory is used for storing a quick cache of the quickly acquired digital signals, and the microprocessor processes the digital information stored in the DRAM; ROM: and the read-only memory is used for storing the digital information read by the microprocessor, the firmware, the program and the like of the wireless chuck 10.
It should be noted that in the embodiment of the present application, other circuit elements for implementing the temperature measurement function, such as the battery 108, the charging module, the rectifying module, and the like, may also be disposed in the chuck 10. This is not particularly limited by the present application. In the embodiment of the present application, the current signal in the control circuit 101 is converted into a digital signal, and the digital signal of the current is sent to the client 200 through the wireless communication module 105, where the client 200 is configured to convert the digital signal into a temperature curve based on a preset temperature-current relationship.
In the embodiment of the present application, a program for analyzing temperature measurement data is provided on the client 200, and the calibrated temperature-current relationship is pre-stored in the program, so as to obtain the temperature of the sensing point in real time.
As shown in fig. 4, the temperature measuring device provided in the embodiment of the present application can perform temperature detection on the bonding area of the display panel. The simultaneous measurement is carried out aiming at different positions, so that the interference to the operation environment is avoided, and meanwhile, no extra wire loss event exists.
The conventional technology includes a COG (Chip On glass) technology and a COF (Chip On Flex, or, Chip On Film) technology, in which a driving circuit is usually fabricated On a driving Chip, and the driving Chip is directly connected with a display panel to realize the electrical connection between the driving circuit and the display panel; the COF technology usually manufactures the driving circuit on a Chip On Film (COF), and the COF is directly connected to the display panel to electrically connect the driving circuit and the display panel. In the embodiments of the present application, COF is exemplified.
Bonding, also called Bonding or Bonding, means that the drive carrier is thermally bonded to the panel by an ACF (Anisotropic Conductive Film) under various conditions (temperature, pressure, time), and the Bonding mainly includes two main processes of ACF attachment and local pressure (hot pressing).
In the binding process, a layer of ACF is covered on the binding structure, then the control circuit 101 board and the display substrate are aligned and vacuum-absorbed, and the connection is realized by achieving a solidification joint through the connection ends of the ACF and the display substrate in a butt joint pressurizing and heating mode.
Referring to fig. 5, the present application provides a temperature detecting method, which uses the temperature measuring device as described above to measure the temperature of the binding region, and during the setting, the temperature sensing element 20 and the chuck 10 are placed on the panel, and the sensing point 21 is set above the binding structure 30 to detect the binding temperature.
The method comprises the following steps:
s01, selecting a plurality of points to be measured in a binding area, and fixing the sensing points 21 of the temperature measuring device at the points to be measured in the binding area, wherein the temperature measuring device corresponds to the points to be measured one by one;
s02, in the binding process, temperature detection is carried out through the temperature measuring device, and data collected in real time are uploaded to the client 200;
and S03, acquiring a temperature curve of the point to be measured in the binding region according to the preset temperature-current relation of the client 200.
In the embodiment of the present application, the client 200 automatically determines that the stitching state is optimal in the binding process, and determines whether two temperature conditions are met.
(1) Whether the temperature of the temperature measurement curve reaches 80% of the highest temperature within 1s or not is judged to achieve the best pressing effect;
(2) whether the temperature measurement curve is continuous and smooth or not is not allowed to fluctuate.
In the embodiment of the application, the client 200 is used for judging the bonding state in the bonding process, so that the condition that the temperature curve needs to be judged manually and visually after the temperature curve is received by a traditional temperature measuring instrument is overcome, and the bonding state in the bonding process is judged according to experience.
Correspondingly, the method further comprises:
s10, acquiring a temperature curve corresponding to each point to be measured and the highest temperature corresponding to each temperature curve;
and S20, judging whether the corresponding temperature curve is abnormal or not based on the temperature curve and the highest temperature.
In a specific determination, as shown in fig. 6, the method for determining whether the corresponding temperature curve is abnormal based on the temperature curve and the maximum temperature includes:
ST11, acquiring a temperature value at a first set point in time;
ST12, judging whether the ratio of the temperature value to the highest temperature is in a preset range;
ST13, if yes, the temperature curve is normal; if not, the temperature curve is abnormal.
In the embodiment of the present application, the first set time point is 1s, and in application, the time is counted from when the indenter starts heating the bonding area, and the temperature measuring device starts measuring the temperature and recording the temperature while heating is started. And when the obtained temperature curve corresponds to 1s, judging whether the temperature of the temperature measurement curve reaches 80% of the highest temperature within 1s so as to realize the optimal pressing effect.
In a specific judgment, the method of judging whether the corresponding temperature curve is abnormal or not based on the temperature curve and the maximum temperature includes:
ST21, selecting a first temperature curve of a point to be measured, and acquiring a second temperature curve corresponding to at least one adjacent point to be measured adjacent to the position of the point to be measured;
ST22, judging whether the temperature difference value of the first temperature curve and the second temperature curve at the corresponding time point in a preset time period is in a threshold value range or not based on the first temperature curve and the second temperature curve;
ST23, if yes, calibrating the temperature curve to be normal; if not, the temperature curve is calibrated to be abnormal.
In the embodiment of the present application, it is determined whether or not the condition (1) is satisfied in correspondence with steps ST11 to ST13, and it is determined whether or not the condition (2) is satisfied in correspondence with steps ST21 to ST 23. In the embodiment of the application, when the two conditions are simultaneously met by judgment, the pressing state is judged to be optimal.
According to the binding region temperature measuring device and the binding region temperature detecting method, accurate temperature measuring curves can be fitted by means of analog-to-digital conversion under the condition that the acquisition period is extremely short, whether the temperature measuring curves meet requirements or not is judged, and judgment results are output.
Fig. 7 is a schematic diagram illustrating a correction process of a temperature curve obtained by the temperature detection method according to the embodiment of the present application, where the positions of the points in the solid line are temperature points obtained by the temperature measurement device, the dotted line is a temperature curve obtained by correcting the temperature correction relationship pre-stored in the client 200 according to the present application, and the corrected temperature curve is displayed for the user, as shown in fig. 8. The calibration curve provided in the present application outputs the determination result after the client 200 automatically determines the temperature curve, and automatically identifies the standard temperature values at different time points in the curve.
The binding area temperature measuring device and the detection method break through the limitation of the airtight space of the equipment, are compatible with efficient moving characteristics, solve the problems that the traditional temperature measuring tool is poor in space adaptability, high in wire loss, low in measuring speed and complex in judgment, reduce operation cost, reduce equipment shutdown and improve equipment utilization rate.
In this embodiment, a client 200 is provided on the basis of the foregoing embodiments, and fig. 9 is a schematic structural diagram of the client 200 provided in the embodiment of the present application, as shown in fig. 9, the client 200 includes: memory 201, processor (CPU) 202, peripheral interfaces 203, RF (Radio Frequency) circuitry 205, audio circuitry 206, speaker 211, power management chip 208, input/output (I/O) subsystem 209, touch screen 212, communication module 213, other input/control devices 210, and external port 204, which communicate via one or more communication buses or signal lines 207.
It should be understood that the illustrated client 200 is merely one example of the client 200, and that the client 200 may have more or fewer components than shown in the figures, may combine two or more components, or may have a different configuration of components. The various components shown in the figures may be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and/or application specific integrated circuits.
The following describes in detail the client 200 for temperature measurement provided in this embodiment, where the client 200 is a smart phone as an example.
A memory 201, the memory 201 being accessible by the CPU202, the peripheral interface 203, and the like, the memory 201 may include high speed random access memory, and may also include non-volatile memory, such as one or more magnetic disk storage devices, flash memory devices, or other volatile solid state storage devices.
A peripheral interface 203, said peripheral interface 203 may connect input and output peripherals of the device to the CPU202 and the memory 201.
An I/O subsystem 209, the I/O subsystem 209 may connect input and output peripherals on the device, such as a touch screen 212 and other input/control devices 210, to the peripheral interface 203. The I/O subsystem 209 may include a display controller 2091 and one or more input controllers 2092 for controlling the other input/control devices 210. Where one or more input controllers 2092 receive electrical signals from or transmit electrical signals to other input/control devices 210, the other input/control devices 210 may include physical buttons (push buttons, rocker buttons, etc.), dials, slide switches, joysticks, click wheels. It is noted that the input controller 2092 may be coupled to any one of: a keyboard, an infrared port, a USB interface, and a pointing device such as a mouse.
A touch screen 212, the touch screen 212 being an input interface and an output interface between the user terminal and the user, displaying visual output to the user, which may include graphics, text, icons, video, and the like.
The communication module 213 is used for bluetooth network connection and data communication with other devices having wireless communication modules.
The display controller 2091 within the I/O subsystem 209 receives electrical signals from the touch screen 212 or transmits electrical signals to the touch screen 212. The touch screen 212 detects a contact on the touch screen, and the display controller 2091 converts the detected contact into an interaction with a user interface object displayed on the touch screen 212, i.e., implements a human-machine interaction, and the user interface object displayed on the touch screen 212 may be an icon for running a game, an icon networked to a corresponding network, or the like. It is worth mentioning that the device may also comprise a light mouse, which is a touch sensitive surface that does not show visual output, or an extension of the touch sensitive surface formed by the touch screen.
The RF circuit 205 is mainly used to establish communication between the mobile phone and the wireless network (i.e., network side), and implement data reception and transmission between the mobile phone and the wireless network. Such as sending and receiving short messages, e-mails, etc. In particular, the RF circuitry 205 receives and transmits RF signals, also referred to as electromagnetic signals, through which the RF circuitry 205 converts electrical signals to or from electromagnetic signals and communicates with communication networks and other devices. RF circuitry 205 may include known circuitry for performing these functions including, but not limited to, an antenna system, an RF transceiver, one or more amplifiers, a tuner, one or more oscillators, a digital signal processor, a CODEC (CODEC) chipset, a Subscriber Identity Module (SIM), and so forth.
The audio circuit 206 is mainly used to receive audio data from the peripheral interface 203, convert the audio data into an electric signal, and transmit the electric signal to the speaker 211.
And a speaker 211 for reproducing the voice signal received by the handset from the wireless network through the RF circuit 205 into sound and playing the sound to the user.
And the power management chip 208 is used for supplying power and managing power to the hardware connected with the CPU202, the I/O subsystem and the peripheral interface.
The embodiment of the present application further provides a storage medium containing executable instructions of the client 200, and the executable instructions of the client 200 are used for executing a binding region temperature detection method when being executed by a processor of the client 200
It should be noted that the computer readable medium shown in the present application may be a computer readable signal medium or a computer readable storage medium or any combination of the two. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing.
More specific examples of the computer readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
In the present application, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In this application, however, a computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take many forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof.
A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, fiber optic cable, RF, etc., or any suitable combination of the foregoing.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s).
It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Terms such as "disposed" and the like, as used herein, may refer to one element being directly attached to another element or one element being attached to another element through intervening elements. Features described herein in one embodiment may be applied to another embodiment, either alone or in combination with other features, unless the feature is otherwise inapplicable or otherwise stated in the other embodiment.
The present invention has been described in terms of the above embodiments, but it should be understood that the above embodiments are for purposes of illustration and description only and are not intended to limit the invention to the scope of the described embodiments. It will be appreciated by those skilled in the art that many variations and modifications may be made to the teachings of the invention, which fall within the scope of the invention as claimed.
Claims (14)
1. A temperature measuring device is characterized by comprising a chuck and a temperature sensing element detachably connected with the chuck, wherein,
the chuck is used for fixing the temperature sensing element, a control circuit and an acquisition circuit connected with the control circuit are arranged in the chuck, the control circuit is used for controlling the temperature sensing element to be provided with a detection signal, and the acquisition circuit is used for acquiring a current signal on the control circuit;
the temperature sensing element comprises a sensing point for measuring the temperature of the piece to be measured and a contact electrically connected with the control circuit.
2. The temperature measuring device of claim 1, wherein the chuck has a first channel for receiving the temperature sensing element and a second channel perpendicular to the first channel, and a pull rod is disposed in the second channel for securing the temperature sensing element.
3. The temperature measurement device of claim 2, wherein the pull rod is configured to reciprocate in the direction of the second channel to achieve a compressed state and a relaxed state for the temperature sensing element, the compressed state being configured for electrical connection of the temperature sensing element to the control circuit, and the relaxed state being configured for disconnection of the temperature sensing element from the control circuit.
4. The temperature measuring device of claim 3, wherein the chuck is further provided with a limiting hole for limiting the movement of the pull rod, and the pull rod is provided with a limiting rod matched with the limiting hole.
5. The temperature measuring device of claim 1, wherein the clip is provided with a contact spring piece which is matched with the contact.
6. The temperature measurement device of claim 1, wherein the temperature sensing element comprises a thermistor.
7. The temperature measuring device of claim 1, further comprising a signal amplifying circuit, an analog-to-digital conversion circuit, and a wireless communication module connected to the collecting circuit, wherein,
the signal amplification circuit is used for amplifying the current on the control circuit, wherein the current signal acquired by the acquisition circuit is an amplified signal after amplification;
the analog-to-digital conversion circuit is used for converting the amplified signal into a digital signal;
and the wireless communication module is used for sending the digital signal to a client.
8. The temperature measurement device of claim 7, wherein the client is configured to convert the digital signal into a temperature profile based on a preset temperature-current relationship.
9. A temperature detection method using the temperature measurement device according to any one of claims 1 to 8, the method comprising:
selecting a plurality of points to be measured in a binding region, and fixing sensing points of the temperature measuring device at the points to be measured in the binding region, wherein the temperature measuring device corresponds to the points to be measured one by one;
in the binding process, temperature detection is carried out through the temperature measuring device, and data collected in real time are uploaded to the client;
and acquiring a temperature curve of the point to be measured in the binding region according to a temperature-current relation preset by the client.
10. The method of claim 9, further comprising:
acquiring a temperature curve corresponding to each point to be measured and the highest temperature corresponding to each temperature curve;
and judging whether the corresponding temperature curve is abnormal or not based on the temperature curve and the highest temperature.
11. The method according to claim 10, wherein the determining whether the corresponding temperature curve is abnormal based on the temperature curve and the maximum temperature comprises:
acquiring a temperature value at a first set time point;
judging whether the ratio of the temperature value to the highest temperature is in a preset range or not;
if yes, the temperature curve is normal; if not, the temperature curve is abnormal.
12. The method according to claim 10, wherein the determining whether the corresponding temperature curve is abnormal based on the temperature curve and the maximum temperature comprises:
selecting a first temperature curve of a point to be measured, and acquiring a second temperature curve corresponding to at least one adjacent point to be measured adjacent to the position of the point to be measured;
judging whether the temperature difference value of the first temperature curve and the second temperature curve at the corresponding time point is in a threshold range in a preset time period or not based on the first temperature curve and the second temperature curve;
if so, calibrating the temperature curve to be normal; if not, the temperature curve is calibrated to be abnormal.
13. A client comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor, when executing the program, implements the temperature detection method according to any one of claims 9 to 12.
14. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the temperature detection method according to any one of claims 9 to 12.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111139192.0A CN113865738A (en) | 2021-09-27 | 2021-09-27 | Temperature measuring device, temperature detecting method, client and medium |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111139192.0A CN113865738A (en) | 2021-09-27 | 2021-09-27 | Temperature measuring device, temperature detecting method, client and medium |
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| CN113865738A true CN113865738A (en) | 2021-12-31 |
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