CN113865483B - Method, device and system for monitoring substrate position in coating machine and coating machine - Google Patents
Method, device and system for monitoring substrate position in coating machine and coating machine Download PDFInfo
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- CN113865483B CN113865483B CN202111076240.6A CN202111076240A CN113865483B CN 113865483 B CN113865483 B CN 113865483B CN 202111076240 A CN202111076240 A CN 202111076240A CN 113865483 B CN113865483 B CN 113865483B
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- 239000000758 substrate Substances 0.000 title claims abstract description 300
- 238000012544 monitoring process Methods 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000000576 coating method Methods 0.000 title claims description 22
- 239000011248 coating agent Substances 0.000 title claims description 21
- 238000007747 plating Methods 0.000 claims abstract description 88
- 230000008569 process Effects 0.000 claims abstract description 15
- 238000012806 monitoring device Methods 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 12
- 238000004891 communication Methods 0.000 claims description 6
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- 238000010276 construction Methods 0.000 claims description 4
- 230000010365 information processing Effects 0.000 claims description 4
- 239000007888 film coating Substances 0.000 abstract description 8
- 238000009501 film coating Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000004364 calculation method Methods 0.000 description 6
- 230000001960 triggered effect Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 238000000605 extraction Methods 0.000 description 1
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- 230000007246 mechanism Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
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Abstract
The embodiment of the application provides a method, a device and a system for monitoring the position of a substrate in a film plating machine and the film plating machine. The method for monitoring the substrate position in the film plating machine comprises the following steps: acquiring a scene image acquired by a camera device; determining three-dimensional position information of a target substrate based on the scene image; and sending out alarm information when the target substrate is determined to be in a preset target area based on the three-dimensional position information. The embodiment of the application is used for solving the technical problem that the substrate cannot be found to fall off the umbrella stand in time in the film coating process in the prior art.
Description
Technical Field
The application relates to the technical field of coating machines, in particular to a method, a device and a system for monitoring the position of a substrate in a coating machine and the coating machine.
Background
In the coating equipment, a coated substrate is usually placed on an umbrella stand for coating, and positioning holes for installing the substrate are uniformly distributed on the umbrella stand. The substrate is fixed to the positioning hole by clamping the four corners of the substrate. When the umbrella stand is in operation, the umbrella stand is driven by the central rotation mechanism to perform rotation and/or revolution, and the substrate can possibly fall off from the positioning hole. At present, the falling condition of the substrate is usually observed through human eyes, and the falling of the substrate cannot be timely found.
Disclosure of Invention
Aiming at the defects of the existing mode, the application provides a method, a device and a system for monitoring the position of a substrate in a film plating machine and the film plating machine, which are used for solving the technical problem that the substrate cannot be found to fall off an umbrella stand in time in the film plating process in the prior art.
In a first aspect, an embodiment of the present application provides a method for monitoring a position of a substrate in a film plating machine, where the method includes:
Acquiring a scene image acquired by a camera device;
determining three-dimensional position information of a target substrate based on the scene image;
and sending out alarm information when the target substrate is determined to be in a preset target area based on the three-dimensional position information.
In some embodiments, the method further comprises:
Matching the three-dimensional position information of the target substrate with the substrate three-dimensional coordinates predicted based on a pre-constructed motion model;
If not, triggering and detecting whether the target substrate is in the target area; otherwise, the current operation is ended.
In some embodiments, the construction of the motion model comprises:
Before an umbrella stand of the film plating machine rotates, initial position information of a substrate placed on the umbrella stand is obtained;
determining rotation information of the umbrella stand, wherein the rotation information comprises a rotation type and a rotation speed corresponding to the rotation type;
And constructing a motion model of the substrate according to the rotation information of the umbrella stand and the initial position information of the substrate.
In some embodiments, the triggering detecting whether the target substrate is within the target area comprises:
And when the target substrate is detected not to be in the target area, updating the model parameters of the motion model according to the three-dimensional position information of the current target substrate.
In some embodiments, the determining the target substrate based on the scene image includes:
respectively performing differential operation on the current scene image frame, the previous scene image frame and the previous two scene image frames to extract a dynamic target;
And determining a target substrate from the dynamic target according to the pre-acquired relative position of the substrate on an umbrella stand of the coating machine.
In some embodiments, the sending an alarm message when the target substrate is determined to be in the preset target area based on the three-dimensional position information includes:
acquiring substrate three-dimensional coordinates predicted by a target substrate falling into the target area based on the motion model;
screening out the area with the most distributed substrate three-dimensional coordinates in the target area, and taking the area as an observation area;
and if foreign objects exist in the observation area in the scene image frames of at least two continuous frames, sending out alarm information.
In a second aspect, an embodiment of the present application provides a device for monitoring a position of a substrate in a film plating machine, where the device includes:
The scene image acquisition module is used for acquiring the scene image acquired by the camera device;
The substrate information processing module is used for determining a target substrate and three-dimensional position information of the target substrate based on the scene image;
And the substrate drop detection module is used for sending out alarm information when the target substrate is determined to be in a preset target area based on the three-dimensional position information.
In a third aspect, an embodiment of the present application provides a system for monitoring a position of a substrate in a film plating machine, including: a camera device and a monitoring device for the substrate position in the film plating machine according to the embodiment;
the camera device is used for collecting scene images;
the monitoring device of the substrate position in the film plating machine is in communication connection with the camera device and is used for executing the monitoring method of the substrate position in the film plating machine.
In a fourth aspect, an embodiment of the present application provides a film plating machine, including: the system for monitoring the position of a substrate in a coating machine according to the above embodiment.
Compared with the prior art, the method and the device for monitoring the substrate position in the film plating machine have the following beneficial technical effects:
And determining a target substrate and three-dimensional position information of the target substrate based on the scene image by acquiring the scene image acquired by the camera device, and sending alarm information when the target substrate is determined to be in a preset target area based on the three-dimensional position information. Therefore, a three-dimensional video monitoring system is constructed by adopting the camera device with the three-dimensional positioning function, the situation that the target area divided in advance and a non-alarm object (namely, a target substrate which does not fall into the target area) are overlapped together on different depth levels in a scene image to cause false alarm can be effectively prevented, and the accuracy and the efficiency of substrate monitoring are improved. Meanwhile, whether the target invades the target area or not is monitored in real time, and accordingly an alarm prompt is sent when a moving target substrate is detected in the target area, real-time monitoring of the condition of the substrate is achieved, the substrate can be found to fall off in time, and therefore the technical problem that the substrate cannot be found to fall off from an umbrella stand in time in a film coating process in the prior art is solved.
The embodiment of the application provides a monitoring system for the position of a substrate in a film plating machine, which is characterized in that a camera device and the monitoring device for the position of the substrate in the film plating machine are arranged; the camera device is used for collecting scene images; the monitoring device of the substrate position in the film plating machine is in communication connection with the camera device and is used for executing the monitoring method of the substrate position in the film plating machine, so that the camera device with the three-dimensional positioning function is combined to obtain the three-dimensional position coordinates of the target substrate, and the accuracy and the efficiency of substrate monitoring are improved. Meanwhile, whether the target invades the target area is monitored in real time, so that the accuracy and the efficiency of monitoring the substrate are improved, the substrate can be timely found to fall off, timely warning is realized, and the reliability and the usability of the system are improved.
According to the film plating machine provided by the embodiment of the application, the condition of the substrate in the film plating process is monitored in real time by arranging the monitoring system for the position of the substrate in the film plating machine, the falling of the substrate can be timely found, and an alarm can be timely sent out, so that a worker is reminded to overhaul and maintain, and the film plating efficiency of the film plating machine is improved.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic diagram of a system for monitoring the position of a substrate in a coating machine according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a preferred structure of a system for monitoring the position of a substrate in a coating machine according to an embodiment of the present application;
FIG. 3 is a schematic flow chart of a method for monitoring a substrate position in a coating machine according to an embodiment of the present application;
Fig. 4 is a schematic diagram of an installation position of an image capturing apparatus according to an embodiment of the present application;
Fig. 5 is a schematic structural diagram of a device for monitoring a substrate position in a film plating machine according to an embodiment of the present application.
Detailed Description
The present application is described in detail below, examples of embodiments of the application are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. Further, if detailed description of the known technology is not necessary for the illustrated features of the present application, it will be omitted. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. The term "and/or" as used herein includes all or any element and all combination of one or more of the associated listed items.
Referring to fig. 1, a schematic structural diagram of a system for monitoring a substrate position in a film plating machine according to an embodiment of the present application is provided, where the system for monitoring a substrate position in a film plating machine includes: a camera device 11 and a monitoring device 12 for the substrate position in the film plating machine;
The camera device 11 is used for acquiring scene images;
the monitoring device 12 of the substrate position in the film plating machine is connected with the camera device 11 in a communication way and is used for executing the monitoring method of the substrate position in the film plating machine.
It should be noted that, the camera device 11 of the present application is a camera with a three-dimensional coordinate positioning function, such as a binocular camera device, where the camera device 11 is used to collect images of a scene in a film plating machine, and then construct a three-dimensional video monitoring system to obtain three-dimensional coordinate positioning of all devices (such as an umbrella stand and a substrate on the umbrella stand) in the film plating machine. The binocular camera device comprises a left camera and a right camera, and is used for acquiring a left image and a right image so as to construct a three-dimensional video monitoring system for three-dimensional coordinate positioning of three-dimensional space points. The camera device 11 is connected with or establishes communication connection with the monitoring device 12 of the substrate position in the film plating machine, and is used for transmitting data interaction such as scene images and the like in the film plating machine acquired in real time to the monitoring device 12 of the substrate position in the film plating machine by the camera device 11. The monitoring device 12 for the substrate position in the film plating machine is a computer device with functions of data receiving, processing, sending and the like, such as an electronic device comprising a processor, and is used for calculating three-dimensional position information of a target substrate according to the acquired scene image, monitoring whether the target substrate invades a target area in real time, sending an alarm prompt and the like. The connection of the monitoring device 12 for the substrate position in the film plating machine and the camera device 11 can be through a wired network or a wireless network, wherein the wired network includes but is not limited to: universal serial bus, wireless network includes but is not limited to: wiFi, bluetooth, etc.
Based on the above embodiment, preferably, referring to fig. 2, a schematic diagram of a preferred structure of a system for monitoring a substrate position in a film plating machine according to an embodiment of the present application is provided, where the system for monitoring a substrate position in a film plating machine further includes a monitoring platform 13, and the monitoring platform 13 is communicatively connected with a device 12 for monitoring a substrate position in a film plating machine, so as to monitor a substrate in real time, and receive an alarm prompt from the device 12 for monitoring a substrate position in a film plating machine, so that a worker is notified in time, and the operation efficiency of the system is improved. The monitoring platform 13 may also issue a control instruction for controlling shooting parameters such as a shooting angle of the camera device 11 to the monitoring device 12 of the substrate position in the film plating machine through the network, and the monitoring device 12 of the substrate position in the film plating machine receives the control instruction to control the camera device 11 to adjust. The monitoring platform 13 may be disposed at the cloud end, and a worker may access the monitoring platform through a terminal such as a computer, a tablet, a mobile phone, etc. to perform data viewing and control processing, for example, through mobile phone application, remote login control, so as to improve the intelligent degree of the real-time monitoring and control process.
The embodiment of the application provides a monitoring system for the position of a substrate in a film plating machine, which is characterized in that a camera device and the monitoring device for the position of the substrate in the film plating machine are arranged; the camera device is used for collecting scene images; the monitoring device of the substrate position in the film plating machine is in communication connection with the camera device and is used for executing the monitoring method of the substrate position in the film plating machine, so that the camera device with the three-dimensional coordinate positioning function is combined to obtain the three-dimensional position coordinate of the target substrate, and the accuracy and the efficiency of substrate monitoring are improved. Meanwhile, whether the target invades the target area is monitored in real time, so that the accuracy and the efficiency of monitoring the substrate are improved, the substrate can be timely found to fall off, timely warning is realized, and the reliability and the usability of the system are improved.
Referring to fig. 3, a flow chart of a method for monitoring a substrate position in a film plating machine according to an embodiment of the present application is shown, where the method for monitoring a substrate position in a film plating machine includes steps S301 to S303.
S301, acquiring a scene image acquired by an imaging device.
In the application, the camera device can be arranged on the inner side wall of the cavity of the film plating machine and can also be arranged outside the film plating machine, so that the scene image in the cavity of the film plating machine can be acquired through the visible window on the side wall of the film plating machine. In a specific embodiment, referring to fig. 4, a schematic diagram of an installation position of an image capturing device according to an embodiment of the present application is shown, where the image capturing device 11 is disposed below the umbrella stand 14, and captures an image of a scene in the film plating machine from a bottom view to an up view, so as to monitor a situation that a substrate falls into a target area in real time. Preferably, at least one camera device 11 is arranged on the inner side wall of the cavity of the film plating machine, so that the situation that the substrate cannot be monitored in real time due to the fact that the camera device 11 has a visual blind area is prevented, and the specific number of the camera devices 11 is not limited.
S302, determining three-dimensional position information of a target substrate based on the scene image.
In this embodiment, the subject camera acquires scene video data composed of a plurality of frames of scene images. In the film coating process, an umbrella stand hung on the top of the cavity in the film coating machine cavity makes revolution and/or autorotation movement, and a substrate positioned on the umbrella stand moves along with the umbrella stand, so that a moving target party can be found in the visual field range of the camera device to trigger the monitoring of the state of the substrate, and the reliability and the flexibility of the system are improved. Therefore, a dynamic object needs to be extracted from the scene image, and the dynamic object comprises an umbrella stand and a substrate, so that the substrate is identified from the dynamic object for real-time monitoring.
In some embodiments, the determining the target substrate based on the scene image includes:
respectively performing differential operation on the current scene image frame, the previous scene image frame and the previous two scene image frames to extract a dynamic target;
And determining a target substrate from the dynamic target according to the pre-acquired relative position of the substrate on an umbrella stand of the coating machine.
In this embodiment, continuous three-frame scene images (or other number of continuous image frames, which are not limited in particular in the application) are selected from the scene video data acquired in real time by the image pickup device, and differential operation is performed, so that the influence of exposure of the background due to motion is eliminated, the contour information of the moving object is extracted, the computational complexity is reduced, the processing speed is increased, the monitoring time delay is reduced, and the timeliness of monitoring is improved. Further, the relative position of the substrate on the umbrella stand is used for identifying the substrate, and the umbrella stand and the substrate are in a moving state in the film coating process, so that the umbrella stand is prevented from being used as a monitoring target by identifying the target substrate, and the actual condition of the substrate cannot be monitored.
Further, the identified substrate is used as a target substrate, three-dimensional position information of the target substrate is calculated by combining the scene image acquired by the camera device, for example, three-dimensional coordinates of the target substrate in the scene image are calculated based on a binocular vision algorithm by combining the binocular camera device. The video monitoring system in the prior art mainly aims at the situation that a target area and a non-alarm object (namely, a target substrate which does not fall into the target area) are overlapped together on different depth layers in a monitored image to cause false alarm, if the monitoring camera device in the prior art is adopted, the target area and the non-falling substrate in an image obtained by elevation shooting are overlapped in layers, the non-falling substrate can be considered to fall into the target area visually by adopting a two-dimensional plane monitoring method, false alarm is caused, and the falling situation of the substrate can not be accurately monitored. Therefore, the application combines the camera device with the three-dimensional coordinate positioning function to construct a three-dimensional video monitoring system, accurately positions the three-dimensional coordinates of the three-dimensional space points, and improves the reliability of substrate monitoring.
Illustratively, in combination with the binocular camera apparatus, calculating three-dimensional position information of the target substrate by the steps comprising:
And acquiring pixel coordinates (ul, vl) of the target substrate on the left image and pixel coordinates (ur, vr) of the target substrate on the right image, and calculating a parallax value d (pixel), wherein the calculation formula is as follows:
d＝ul-ur
Three-dimensional coordinate values (X, Y, Z) of the target substrate in the current three-dimensional space are restored by combining a triangulation principle, and a calculation formula is as follows:
wherein B is the distance between the optical axes of the left camera and the right camera in the binocular camera device, and f is the focal length of the binocular camera device.
S303, when the target substrate is determined to be in a preset target area based on the three-dimensional position information, alarm information is sent out.
In some embodiments, the target area is a region of space located below an umbrella stand of the film plating machine.
In the present application, before step S303, it includes:
And detecting whether the target substrate is in a preset target area or not based on the three-dimensional position information.
In the application, the position of one of the camera devices is used as the origin of coordinates to construct a three-dimensional video monitoring system so as to obtain the three-dimensional position information of the target substrate. The target area is not limited to a two-dimensional coordinate plane, but extends to a three-dimensional coordinate plane. Therefore, the target area consists of a plurality of independent three-dimensional space subareas, and when the three-dimensional position information of the target substrate is positioned in one or a plurality of three-dimensional space subareas, the target substrate is considered to fall into the target area, and the substrate is considered to fall; otherwise, the target substrate is not considered to fall into the target area, i.e., the substrate is not dropped.
In an alternative embodiment, when it is detected that the target substrate is not in the target area, that is, the three-dimensional position information of the target substrate does not belong to any three-dimensional space subarea, the substrate is considered to be not dropped and is still fixed on the umbrella stand, and no alarm prompt is sent out at the moment.
According to the method for monitoring the substrate position in the film plating machine, provided by the embodiment of the application, the scene image acquired by the camera device is acquired, the target substrate and the three-dimensional position information of the target substrate are determined based on the scene image, and when the target substrate is determined to be in a preset target area based on the three-dimensional position information, alarm information is sent out. Therefore, a three-dimensional video monitoring system is constructed by adopting the camera device with the three-dimensional coordinate positioning function, the situation that the target area divided in advance and the non-alarm object (namely the target substrate which does not fall into the target area) are overlapped together on different depth layers in the scene image to cause false alarm can be effectively prevented, and the accuracy and the efficiency of substrate monitoring are improved. Meanwhile, whether the target invades the target area or not is monitored in real time, and accordingly an alarm prompt is sent when a moving target substrate is detected in the target area, real-time monitoring of the condition of the substrate is achieved, the substrate can be found to fall off in time, and therefore the technical problem that the substrate cannot be found to fall off from an umbrella stand in time in a film coating process in the prior art is solved.
In some embodiments, the camera device may also capture an image of a scene in the film plating machine from a top-down view, where the camera device may be on the same horizontal line as the umbrella stand or may be located below the umbrella stand. Specifically, a scene image captured at a top view angle of the imaging device is acquired, and the target substrate and the target region are hierarchically overlapped when visually seen. And determining a target substrate and three-dimensional position information of the target substrate from the scene image, and sending out an alarm prompt when determining whether the target substrate is in a preset target area or not based on the three-dimensional position information of the target substrate. According to the embodiment, by establishing a three-dimensional video monitoring system, the situation that the target area and the target substrate are overlapped together on different depth layers in the scene image to cause false alarm can be effectively prevented, and the accuracy and the efficiency of substrate monitoring are improved.
In some embodiments, the construction of the motion model comprises:
Before an umbrella stand of the film plating machine rotates, initial position information of a substrate placed on the umbrella stand is obtained;
determining rotation information of the umbrella stand, wherein the rotation information comprises a rotation type and a rotation speed corresponding to the rotation type;
And constructing a motion model of the substrate according to the rotation information of the umbrella stand and the initial position information of the substrate.
In this embodiment, since the substrate revolves and/or rotates along with the umbrella stand, the movement of the substrate is continuous and regular, and thus the movement track of the substrate is predicted by the rotation information of the umbrella stand, so that it is determined whether the substrate falls from the umbrella stand. The rotation type comprises revolution and/or rotation, and the rotation speed corresponding to the rotation type comprises revolution and/or rotation speed. Specifically, before film coating starts, the substrate is fixed at a designated position of the umbrella stand, and initial position information of the substrate positioned on the umbrella stand at the moment is acquired, wherein the initial position information can be three-dimensional coordinates based on the three-dimensional video monitoring system. And constructing a motion model corresponding to the substrate according to the rotation information of the umbrella stand and the initial position information of the substrate, wherein the motion model is used for predicting at least one of a motion track of the substrate and three-dimensional coordinates of the substrate at each moment on the motion track.
Preferably, when the rotation information of the umbrella stand is changed, the motion model of the substrate is adjusted according to the changed rotation information of the umbrella stand, so that the accuracy of the motion model can be effectively improved, and the accuracy of substrate coordinate prediction is improved.
In some embodiments, the method further comprises:
Matching the three-dimensional position information of the target substrate with the substrate three-dimensional coordinates predicted based on a pre-constructed motion model;
If not, triggering and detecting whether the target substrate is in the target area; otherwise, the current operation is ended.
In this embodiment, in the film plating process, the three-dimensional position information of the target substrate is matched with the three-dimensional coordinates of the substrate predicted by the motion model, that is, whether the target substrate deviates from the motion track predicted by the motion model is determined. If the three-dimensional position information of the target substrate is not matched with the substrate three-dimensional coordinates predicted by the motion model, namely the target substrate deviates from the predicted motion track, the detection of whether the target substrate is in a preset target area can be triggered. In addition, if the three-dimensional position information of the target substrate is matched with the three-dimensional coordinates of the substrate predicted by the motion model, namely, the target substrate is not deviated from the predicted motion track, the substrate can be considered to be not fallen off and still fixed on the umbrella stand, namely, the detection of whether the target substrate is in a preset target area is not required to be triggered, the current operation is ended at the moment, and no alarm prompt is sent out. Preferably, if the deviation value of the three-dimensional position information of the target substrate and the predicted three-dimensional coordinate of the substrate at the current moment is within the preset error range, the target substrate is still considered to be not deviated from the predicted motion trail.
It should be noted that, since whether the target substrate falls within the preset target region is detected by calculating the stereo parallax of the target substrate, the calculation complexity of the stereo parallax algorithm is high. Therefore, the operation step of detecting whether the target substrate falls into the target area is triggered only when the target substrate deviates from the predicted motion track is judged, and the step of detecting the substrate intrusion is not required to be triggered when the target substrate does not deviate from the predicted motion track is judged, so that the calculation complexity and the calculation amount can be greatly reduced, the intrusion detection is not required to be triggered under any condition, the calculation speed is greatly improved, and the real-time performance of monitoring the substrate is optimized.
On the basis of the foregoing embodiments, in some embodiments, the detecting whether the target substrate falls within a preset target area includes:
And when the target substrate is detected not to be in the target area, updating the model parameters of the motion model according to the three-dimensional position information of the current target substrate.
In this embodiment, the three-dimensional position information of the target substrate deviates from the predicted motion track but does not fall into the target area, so that the predicted motion track of the motion model can be considered to deviate from the actual motion states of the umbrella stand and the substrate, the three-dimensional coordinates of the substrate at the current moment on the motion track are modified according to the three-dimensional position information of the current target substrate, and the motion model is updated accordingly.
In some embodiments, the sending an alarm message when the target substrate is determined to be in the preset target area based on the three-dimensional position information includes:
acquiring substrate three-dimensional coordinates predicted by a target substrate falling into the target area based on the motion model;
screening out the area with the most distributed substrate three-dimensional coordinates in the target area, and taking the area as an observation area;
and if foreign objects exist in the observation area in the scene image frames of at least two continuous frames, sending out alarm information.
In this embodiment, the motion track of the target substrate falling into the target area is obtained, that is, the three-dimensional coordinates of the substrate at each moment on the motion track of the dropped target substrate are obtained, where the motion track of the dropped target substrate includes the motion track when not dropped from the umbrella stand (that is, the track moving outside the target area) and the motion track when dropped from the umbrella stand (that is, the track moving in the target area). Further, the region with the most overlapping of the motion trails when the umbrella stand is detached, namely the region with the most dense three-dimensional coordinate distribution of the substrate, is selected as the important observation region. The automatic tracking of the observation area is realized by detecting whether the observation area has a foreign object or not, and the foreign object is a falling target substrate, so that the falling substrate can be rapidly detected in the observation area, and the automatic tracking device is suitable for a rapidly moving target, so that the falling of the substrate can be timely found.
Referring to fig. 5, a schematic structural diagram of a device for monitoring a substrate position in a film plating machine according to an embodiment of the present application includes:
A scene image acquisition module 501, configured to acquire a scene image acquired by an image capturing device;
A substrate information processing module 502, configured to determine a target substrate and three-dimensional position information of the target substrate based on the scene image;
and a substrate drop detection module 503, configured to send out alarm information when it is determined that the target substrate is within a preset target area based on the three-dimensional position information.
In some embodiments, the apparatus further comprises:
The motion track matching unit is used for matching the three-dimensional position information of the target substrate with the substrate three-dimensional coordinates predicted based on the pre-constructed motion model;
The intrusion detection triggering unit is used for triggering and detecting whether the target substrate is in the target area or not if the intrusion detection triggering unit is not matched with the target substrate; otherwise, the current operation is ended.
In some embodiments, the motion trajectory matching unit further comprises:
the substrate initial position acquisition unit is used for acquiring initial position information of a substrate placed on the umbrella stand before the umbrella stand of the film plating machine rotates;
the umbrella stand rotation information acquisition unit is used for determining rotation information of the umbrella stand, wherein the rotation information comprises a rotation type and a rotation speed corresponding to the rotation type;
And the substrate motion model construction unit is used for constructing a motion model of the substrate according to the rotation information of the umbrella stand and the initial position information of the substrate.
In some embodiments, the substrate drop detection module 503 includes:
And when the target substrate is detected not to be in the target area, updating the model parameters of the motion model according to the three-dimensional position information of the current target substrate.
In some embodiments, the target area is a region of space located below an umbrella stand of the film plating machine.
In some embodiments, the substrate information processing module 502 includes:
The dynamic target extraction unit is used for respectively carrying out differential operation on the current scene image frame, the previous scene image frame and the previous two scene image frames so as to extract a dynamic target;
and the target substrate determining unit is used for determining a target substrate from the dynamic targets according to the pre-acquired relative positions of the substrates on the umbrella stand.
In some embodiments, the substrate drop detection module 503 includes:
the three-dimensional coordinate acquisition unit of the falling substrate is used for acquiring the three-dimensional coordinate of the substrate predicted by the target substrate falling into the target area based on the motion model;
The observation area acquisition unit is used for screening out an area with the most distribution of the three-dimensional coordinates of the substrate in the target area and taking the area as an observation area;
And the observation area detection unit is used for sending out alarm information if foreign object exists in the observation area in the scene image frames of at least two continuous frames.
According to the monitoring device for the substrate position in the film plating machine, provided by the embodiment of the application, the scene image acquired by the camera device is acquired, the target substrate and the three-dimensional position information of the target substrate are determined based on the scene image, and when the target substrate is determined to be in a preset target area based on the three-dimensional position information, alarm information is sent out. Therefore, a three-dimensional video monitoring system is constructed by adopting the camera device with the three-dimensional coordinate positioning function, the situation that the target area divided in advance and the non-alarm object (namely the target substrate which does not fall into the target area) are overlapped together on different depth layers in the scene image to cause false alarm can be effectively prevented, and the accuracy and the efficiency of substrate monitoring are improved. Meanwhile, whether the target invades the target area or not is monitored in real time, and accordingly an alarm prompt is sent when a moving target substrate is detected in the target area, real-time monitoring of the condition of the substrate is achieved, the substrate can be found to fall off in time, and therefore the technical problem that the substrate cannot be found to fall off from an umbrella stand in time in a film coating process in the prior art is solved.
The embodiment of the application provides a film plating machine, which comprises: the system for monitoring the position of a substrate in a film plating machine according to the above embodiment.
According to the film plating machine provided by the embodiment of the application, the condition of the substrate in the film plating process is monitored in real time by arranging the monitoring system for the position of the substrate in the film plating machine, the falling of the substrate can be timely found, and an alarm can be timely sent out, so that a worker is reminded to overhaul and maintain, and the film plating efficiency of the film plating machine is improved.
The foregoing is only a partial embodiment of the present application, and it should be noted that it will be apparent to those skilled in the art that modifications and adaptations can be made without departing from the principles of the present application, and such modifications and adaptations are intended to be comprehended within the scope of the present application.
Claims (9)
1. The method for monitoring the position of the substrate in the film plating machine is characterized in that the method is applied to the film plating process of the film plating machine, and in the film plating process, a target substrate is positioned on an umbrella stand hung in a cavity of the film plating machine and moves along with the umbrella stand;
the method comprises the following steps:
acquiring a scene image acquired by a camera device with a three-dimensional coordinate positioning function;
Determining three-dimensional position information of a moving target substrate based on the scene image;
Matching the three-dimensional position information of the target substrate with the substrate three-dimensional coordinates predicted based on a pre-constructed motion model;
If the target substrate is not matched with the target substrate, determining whether the target substrate is in a preset target area or not based on the three-dimensional position information; the target area comprises a space area positioned below an umbrella stand of the film plating machine;
Determining that the target substrate falls when the target substrate is in a preset target area based on the three-dimensional position information, and sending out alarm information, wherein the alarm information comprises: acquiring substrate three-dimensional coordinates predicted by a target substrate falling into the target area based on the motion model; screening out the area with the most distributed substrate three-dimensional coordinates in the target area, and taking the area as an observation area; and if the target substrate exists in the observation area in the scene image frames of at least two continuous frames, sending out alarm information.
2. The method of claim 1, further comprising:
If so, ending the current operation.
3. The method for monitoring the position of a substrate in a coating machine according to claim 2, wherein the construction of the motion model comprises:
Before an umbrella stand of the film plating machine rotates, initial position information of a substrate placed on the umbrella stand is obtained;
determining rotation information of the umbrella stand, wherein the rotation information comprises a rotation type and a rotation speed corresponding to the rotation type;
And constructing a motion model of the substrate according to the rotation information of the umbrella stand and the initial position information of the substrate.
4. The method of claim 2, further comprising:
And when the target substrate is detected not to be in the target area, updating the model parameters of the motion model according to the three-dimensional position information of the current target substrate.
5. The method of claim 1, wherein the target area is a spatial area below an umbrella stand of the coating machine.
6. The method of claim 1, wherein determining a target substrate based on the scene image comprises:
respectively performing differential operation on the current scene image frame, the previous scene image frame and the previous two scene image frames to extract a dynamic target;
And determining a target substrate from the dynamic target according to the pre-acquired relative position of the substrate on an umbrella stand of the coating machine.
7. The monitoring device for the substrate position in the film plating machine is characterized in that the monitoring device is applied to the film plating process of the film plating machine, and in the film plating process, a target substrate is positioned on an umbrella stand hung in a cavity of the film plating machine and moves along with the umbrella stand; the device comprises:
The scene image acquisition module is used for acquiring a scene image acquired by the camera device with the three-dimensional coordinate positioning function;
the substrate information processing module is used for determining a moving target substrate and three-dimensional position information of the target substrate based on the scene image;
The motion track matching unit is used for matching the three-dimensional position information of the target substrate with the substrate three-dimensional coordinates predicted based on the pre-constructed motion model;
The intrusion detection triggering unit is used for determining whether the target substrate is in a preset target area or not based on the three-dimensional position information if the target substrate is not matched with the three-dimensional position information; the target area comprises a space area positioned below an umbrella stand of the film plating machine;
The substrate drop detection module is configured to send out alarm information when it is determined that the target substrate is in a preset target area based on the three-dimensional position information, and includes: acquiring substrate three-dimensional coordinates predicted by a target substrate falling into the target area based on the motion model; screening out the area with the most distributed substrate three-dimensional coordinates in the target area, and taking the area as an observation area; and if the target substrate exists in the observation area in the scene image frames of at least two continuous frames, sending out alarm information.
8. A system for monitoring the position of a substrate in a coating machine, the system being adapted to be used in a coating process of the coating machine, the system comprising: a camera device and a monitoring device for the position of a substrate in the film plating machine according to claim 7;
the camera device is used for collecting scene images;
The monitoring device of the substrate position in the film plating machine is connected with the camera device in a communication way and is used for executing the monitoring method of the substrate position in the film plating machine according to any one of claims 1-6.
9. A film plating machine, comprising: the system for monitoring the position of a substrate in a coating machine of claim 8.
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| CN106872488A (en) * | 2017-04-20 | 2017-06-20 | 广东振华科技股份有限公司 | A kind of double surface defect visible detection methods of rapid large-area transparent substrate and device |
| KR101866139B1 (en) * | 2017-08-25 | 2018-06-08 | 캐논 톡키 가부시키가이샤 | Alignment method, alignmenet apparatus, vacuum evaporation method and vacuum evaporation apparatus including the same |
| CN210837088U (en) * | 2019-11-11 | 2020-06-23 | 王逸馨 | Static three-dimensional image display device |
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| CN101586231A (en) * | 2008-05-21 | 2009-11-25 | 鸿富锦精密工业（深圳）有限公司 | Film deposition device |
| CN103407283A (en) * | 2013-08-21 | 2013-11-27 | 日东电子科技(深圳)有限公司 | Solder paste printing press and vision aligning method thereof |
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