CN113861893A - Epoxy modified chlorinated polypropylene adhesive - Google Patents
Epoxy modified chlorinated polypropylene adhesive Download PDFInfo
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- CN113861893A CN113861893A CN202111256919.3A CN202111256919A CN113861893A CN 113861893 A CN113861893 A CN 113861893A CN 202111256919 A CN202111256919 A CN 202111256919A CN 113861893 A CN113861893 A CN 113861893A
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- chlorinated polypropylene
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- 239000004743 Polypropylene Substances 0.000 title claims abstract description 104
- 229920001155 polypropylene Polymers 0.000 title claims abstract description 104
- -1 polypropylene Polymers 0.000 title claims abstract description 102
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 70
- 239000000853 adhesive Substances 0.000 title claims abstract description 68
- 239000004593 Epoxy Substances 0.000 title claims abstract description 27
- 239000003822 epoxy resin Substances 0.000 claims abstract description 61
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 61
- 239000003960 organic solvent Substances 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 239000003999 initiator Substances 0.000 claims abstract description 24
- 229920002492 poly(sulfone) Polymers 0.000 claims abstract description 24
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 23
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 18
- 229920000570 polyether Polymers 0.000 claims abstract description 18
- 238000002156 mixing Methods 0.000 claims abstract description 13
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims abstract description 10
- 239000011521 glass Substances 0.000 claims abstract description 8
- 229920000098 polyolefin Polymers 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims abstract description 6
- 150000002739 metals Chemical class 0.000 claims abstract description 6
- 239000011259 mixed solution Substances 0.000 claims description 25
- 238000003756 stirring Methods 0.000 claims description 25
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 18
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 239000000460 chlorine Substances 0.000 claims description 9
- 229910052801 chlorine Inorganic materials 0.000 claims description 9
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 9
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 8
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 8
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 8
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 8
- 239000008096 xylene Substances 0.000 claims description 8
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 6
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 8
- 239000004033 plastic Substances 0.000 abstract description 8
- 229920003023 plastic Polymers 0.000 abstract description 8
- 230000004048 modification Effects 0.000 abstract description 3
- 238000012986 modification Methods 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
- C09J123/28—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by reaction with halogens or compounds containing halogen
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses an epoxy modified chlorinated polypropylene adhesive, and belongs to the technical field of chlorinated polypropylene modification and adhesives. The epoxy modified chlorinated polypropylene adhesive comprises the following components in parts by weight: 60-85 parts of chlorinated polypropylene, 20-40 parts of epoxy resin, 10-15 parts of polysulfone resin, 0.15-0.22 part of initiator, 0.4-1.6 parts of silane coupling agent and 200 parts of organic solvent 140-. The epoxy modified chlorinated polypropylene adhesive is prepared by blending and modifying chlorinated polypropylene, hydrogenated bisphenol A epoxy resin, polyether epoxy resin and polysulfone resin according to a proportion, and can be used for bonding most metals, ceramics and glass and bonding plastics such as polyolefin and other materials at room temperature.
Description
Technical Field
The invention belongs to the technical field of chlorinated polypropylene modification and adhesives, and particularly relates to an epoxy modified chlorinated polypropylene adhesive.
Background
Chlorinated polypropylene (CPP) is a chemical modification of polypropylene (PP) containing carbon-chlorine bonds in the structure, and is a polar thermoplastic resin obtained by introducing chlorine atoms into the molecular chain of polypropylene. The carbon-chlorine bond with larger polarity endows the chlorinated polypropylene with better weather resistance, ozone resistance and chemical medium resistance, has good adhesive force to the plastic with low surface energy, and is widely applied to the fields of adhesives and coatings. In addition, other monomers or plastics are often adopted in the prior art to graft/copolymerize and modify the chlorinated polypropylene so as to improve the comprehensive use performance of the chlorinated polypropylene adhesive. The modified chlorinated polypropylene adhesive has the advantages of easily available raw materials, simple production process and wide utilization prospect, so that the domestic modified research on the chlorinated polypropylene is increased day by day, and more modified chlorinated polypropylene adhesives with different types and performances are available.
Epoxy resin (EP) is a thermosetting resin which is excellent in adhesion, mechanical strength, electrical insulation, and in addition to being inferior in adhesion to nonpolar plastics such as polyolefin, for various metal materials such as aluminum, steel, iron, copper; non-metallic materials such as glass, wood, concrete; and thermosetting plastics such as phenolic, amino, unsaturated polyester have excellent adhesive properties. However, epoxy resins have disadvantages such as brittleness, poor fatigue resistance, heat resistance, and impact toughness. Therefore, how to combine the advantages of chlorinated polypropylene and epoxy resin to prepare an adhesive with more perfect performance becomes a topic of intense research.
Disclosure of Invention
Aiming at the defects of chlorinated polypropylene adhesives and epoxy resin adhesives in the background art, the invention researches an epoxy modified chlorinated polypropylene adhesive, and the prepared epoxy modified chlorinated polypropylene adhesive has wide application range, can be used for adhesion among most metals, ceramics and glass, and can also be used for room-temperature adhesion of plastics such as polyolefin and the like and other materials.
Optical fibers, optical materials, and most metals, ceramics, glass, and plastics, among others, can be bonded.
The invention is realized by the following technical scheme:
an epoxy-modified chlorinated polypropylene adhesive comprising the following components: chlorinated polypropylene, epoxy resin, polysulfone resin, an initiator, a silane coupling agent and an organic solvent;
wherein the epoxy resin comprises hydrogenated bisphenol A epoxy resin and polyether epoxy resin.
Further, the components are as follows according to parts by weight: 60-85 parts of chlorinated polypropylene, 20-40 parts of epoxy resin, 10-15 parts of polysulfone resin, 0.15-0.22 part of initiator, 0.4-1.6 parts of silane coupling agent and 200 parts of organic solvent 140-.
Further, the chlorinated polypropylene is low chlorinated isotactic polypropylene with chlorine content of 35% -45%.
Further, the mass ratio of the hydrogenated bisphenol A type epoxy resin to the polyether epoxy resin is (2.3-2.8): 1.
Further, the hydrogenated bisphenol A epoxy resin has an epoxy value of 0.50 to 0.54; the epoxy value of the polyether epoxy resin is 0.55-0.58.
Epoxy resin is a thermosetting resin, and is widely used in the fields of electronic material packaging, coating materials, adhesives, and the like because of its excellent adhesion, mechanical strength, electrical insulation, and the like. The hydrogenated bisphenol A epoxy resin has low viscosity, long gel time and excellent weather resistance; the polyether epoxy resin has good flexibility and low temperature resistance, has good compatibility with other epoxy resins, and can be mixed to prepare epoxy resin adhesives with good toughness.
Because the pure epoxy resin has a high crosslinking structure, the adhesive force of the chlorinated polypropylene as the adhesive can be improved by modifying the chlorinated polypropylene with the epoxy resin, but the molecular weight of the chlorinated polypropylene adhesive can be greatly improved by excessive crosslinking, and although the adhesive force of the chlorinated polypropylene adhesive is greatly increased, the cohesive force of the chlorinated polypropylene adhesive can be obviously reduced, so that the mechanical strength of the chlorinated polypropylene adhesive is greatly reduced. The inventor researches and discovers that the cross-linking degree among molecules can be controlled in a proper range and the uniformity of molecular cross-linking can be damaged by blending and modifying the chlorinated polypropylene, the hydrogenated bisphenol A epoxy resin, the polyether epoxy resin and the polysulfone resin and controlling the blending ratio of the chlorinated polypropylene, the hydrogenated bisphenol A epoxy resin, the polyether epoxy resin and the polysulfone resin under the action of an initiator through free radical copolymerization reaction, so that the epoxy modified chlorinated polypropylene adhesive with high toughness, good bonding performance and excellent peeling resistance can be prepared.
Further, the initiator is one of benzoyl peroxide and azobisisobutyronitrile.
Further, the silane coupling agent is KH-792.
Further, the organic solvent is at least one of toluene, xylene and cyclohexane.
Further, the preparation method of the epoxy modified chlorinated polypropylene adhesive comprises the following steps:
1) taking epoxy resin, polysulfone resin and a reaction kettle, adding 1/2 amounts of organic solvent and silane coupling agent, mixing, heating to 110-;
2) placing chlorinated polypropylene into a reaction kettle, adding the residual organic solvent, stirring and heating to 75-85 ℃ under the nitrogen atmosphere, then slowly dripping the mixed solution obtained in the step 1) and the initiator into the mixed solution at the same time, wherein the dripping time is 90-150 minutes, and finally keeping the temperature and stirring for 60 minutes to obtain the epoxy modified chlorinated polypropylene adhesive.
Furthermore, the epoxy modified chlorinated polypropylene adhesive can be used for bonding most metals, ceramics and glass, and can also be used for room temperature bonding of plastics such as polyolefin and other materials.
Compared with the prior art, the invention has the beneficial effects that:
1. the epoxy modified chlorinated polypropylene adhesive prepared by the invention has wide application range, not only can be used for bonding most of metals, ceramics and glass, but also can be used for room temperature bonding of plastics such as polyolefin and the like and other materials.
2. The preparation process has simple steps and lower requirements on reaction conditions, and is suitable for industrial production.
3. According to the invention, the epoxy modified chlorinated polypropylene adhesive is prepared by blending and modifying chlorinated polypropylene, hydrogenated bisphenol A epoxy resin, polyether epoxy resin and polysulfone resin, has good adhesion performance to polyolefin, overcomes the problem that the materials are difficult to bond, and has good application prospect.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the embodiments. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
Example 1
An epoxy-modified chlorinated polypropylene adhesive:
1) according to parts by weight, 72 parts of chlorinated polypropylene (low chlorinated isotactic polypropylene with 40% of chlorine content), 30 parts of epoxy resin (the mass ratio of hydrogenated bisphenol A type epoxy resin to polyether epoxy resin is 2.5:1), 12 parts of polysulfone resin, 0.19 part of initiator (benzoyl peroxide), 0.8 part of silane coupling agent (KH-792) and 175 parts of organic solvent (xylene) are taken.
2) Taking epoxy resin, polysulfone resin and a reaction kettle, adding 1/2 amounts of organic solvent and silane coupling agent, mixing, heating to 110 ℃, and slowly stirring for 30 minutes to obtain a mixed solution; placing chlorinated polypropylene into a reaction kettle, adding the residual organic solvent, stirring and heating to 80 ℃ under the nitrogen atmosphere, then slowly dripping the mixed solution obtained in the step 1) and the initiator into the mixed solution at the same time, wherein the dripping time is 110 minutes, and finally keeping the temperature and stirring for 60 minutes to obtain the epoxy modified chlorinated polypropylene adhesive.
The modified chlorinated polypropylene adhesive prepared in the embodiment is tested for performance: the tensile strength was 37.9MPa, and the peel strength was 2681N/m (aluminum/polypropylene; GB/T2790-1995, GB/T2791-1995; the same applies below).
Example 2
An epoxy-modified chlorinated polypropylene adhesive:
1) 85 parts of chlorinated polypropylene (low chlorinated isotactic polypropylene with the chlorine content of 40%), 30 parts of epoxy resin (the mass ratio of hydrogenated bisphenol A type epoxy resin to polyether epoxy resin is 2.5:1), 12 parts of polysulfone resin, 0.20 part of initiator (azobisisobutyronitrile), 0.8 part of silane coupling agent (KH-792) and 175 parts of organic solvent (cyclohexane) are taken according to parts by weight.
2) Taking epoxy resin, polysulfone resin and a reaction kettle, adding 1/2 amounts of organic solvent and silane coupling agent, mixing, heating to 110 ℃, and slowly stirring for 30 minutes to obtain a mixed solution; placing chlorinated polypropylene into a reaction kettle, adding the residual organic solvent, stirring and heating to 80 ℃ under the nitrogen atmosphere, then slowly dripping the mixed solution obtained in the step 1) and the initiator into the mixed solution at the same time, wherein the dripping time is 110 minutes, and finally keeping the temperature and stirring for 60 minutes to obtain the epoxy modified chlorinated polypropylene adhesive.
The modified chlorinated polypropylene adhesive prepared in the embodiment is tested for performance: the tensile strength was 38.9MPa, and the peel strength was 3024N/m.
Example 3
An epoxy-modified chlorinated polypropylene adhesive:
1) according to the weight portion, 72 portions of chlorinated polypropylene (low chlorinated isotactic polypropylene with 40 percent of chlorine content), 30 portions of epoxy resin (the mass ratio of hydrogenated bisphenol A type epoxy resin to polyether epoxy resin is 2.5:1), 12 portions of polysulfone resin, 0.18 portion of initiator (benzoyl peroxide), 1.4 portions of silane coupling agent (KH-792) and 165 portions of organic solvent (toluene, xylene and the like).
2) Taking epoxy resin, polysulfone resin and a reaction kettle, adding 1/2 amounts of organic solvent and silane coupling agent, mixing, heating to 115 ℃, and slowly stirring for 30 minutes to obtain a mixed solution; placing chlorinated polypropylene into a reaction kettle, adding the residual organic solvent, stirring and heating to 75 ℃ under the nitrogen atmosphere, then slowly dripping the mixed solution obtained in the step 1) and the initiator into the mixed solution simultaneously for 120 minutes, and finally keeping the temperature and stirring for 60 minutes to obtain the epoxy modified chlorinated polypropylene adhesive.
The modified chlorinated polypropylene adhesive prepared in the embodiment is tested for performance: the tensile strength was 36.2MPa, and the peel strength was 2445N/m.
Example 4
An epoxy-modified chlorinated polypropylene adhesive:
1) 82 parts of chlorinated polypropylene (low chlorinated isotactic polypropylene with the chlorine content of 45%), 25 parts of epoxy resin (the mass ratio of hydrogenated bisphenol A type epoxy resin to polyether epoxy resin is 2.3:1), 15 parts of polysulfone resin, 0.22 part of initiator (benzoyl peroxide), 0.5 part of silane coupling agent (KH-792) and 150 parts of organic solvent (xylene) are taken according to parts by weight.
2) Taking epoxy resin, polysulfone resin and a reaction kettle, adding 1/2 amounts of organic solvent and silane coupling agent, mixing, heating to 110 ℃, and slowly stirring for 30 minutes to obtain a mixed solution; placing chlorinated polypropylene into a reaction kettle, adding the residual organic solvent, stirring and heating to 85 ℃ under the nitrogen atmosphere, then slowly dripping the mixed solution obtained in the step 1) and the initiator into the mixed solution at the same time, wherein the dripping time is 100 minutes, and finally keeping the temperature and stirring for 60 minutes to obtain the epoxy modified chlorinated polypropylene adhesive.
The modified chlorinated polypropylene adhesive prepared in the embodiment is tested for performance: the tensile strength was 37.7MPa, and the peel strength was 2593N/m.
Comparative example 1
1) According to parts by weight, 72 parts of chlorinated polypropylene (low chlorinated isotactic polypropylene with 40% of chlorine content), 30 parts of epoxy resin (the mass ratio of hydrogenated bisphenol A type epoxy resin to polyether epoxy resin is 1.2:1), 12 parts of polysulfone resin, 0.19 part of initiator (benzoyl peroxide), 0.8 part of silane coupling agent (KH-792) and 175 parts of organic solvent (xylene) are taken.
2) Taking epoxy resin, polysulfone resin and a reaction kettle, adding 1/2 amounts of organic solvent and silane coupling agent, mixing, heating to 110 ℃, and slowly stirring for 30 minutes to obtain a mixed solution; placing chlorinated polypropylene into a reaction kettle, adding the residual organic solvent, stirring and heating to 80 ℃ under the nitrogen atmosphere, then slowly dripping the mixed solution obtained in the step 1) and the initiator into the mixed solution at the same time, wherein the dripping time is 110 minutes, and finally keeping the temperature and stirring for 60 minutes to obtain the epoxy modified chlorinated polypropylene adhesive.
The performance of the modified chlorinated polypropylene adhesive prepared by the comparative example is detected as follows: the tensile strength was 38.4MPa, and the peel strength was 1679N/m.
Comparative example 2
1) According to parts by weight, 72 parts of chlorinated polypropylene (low chlorinated isotactic polypropylene with 40% of chlorine content), 30 parts of epoxy resin (the mass ratio of hydrogenated bisphenol A type epoxy resin to polyether epoxy resin is 2.5:1), 0.19 part of initiator (benzoyl peroxide), 0.8 part of silane coupling agent (KH-792) and 175 parts of organic solvent (xylene) are taken.
2) Taking epoxy resin and a reaction kettle, adding 1/2 amounts of organic solvent and silane coupling agent, mixing, heating to 110 ℃, and slowly stirring for 30 minutes to obtain a mixed solution; placing chlorinated polypropylene into a reaction kettle, adding the residual organic solvent, stirring and heating to 80 ℃ under the nitrogen atmosphere, then slowly dripping the mixed solution obtained in the step 1) and the initiator into the mixed solution at the same time, wherein the dripping time is 110 minutes, and finally keeping the temperature and stirring for 60 minutes to obtain the epoxy modified chlorinated polypropylene adhesive.
The performance of the modified chlorinated polypropylene adhesive prepared by the comparative example is detected as follows: the tensile strength was 24.7MPa, and the peel strength was 1497N/m.
Comparative example 3
1) 72 parts of chlorinated polypropylene (low chlorinated isotactic polypropylene with the chlorine content of 40 percent), 30 parts of epoxy resin (hydrogenated bisphenol A epoxy resin), 12 parts of polysulfone resin, 0.19 part of initiator (benzoyl peroxide), 0.8 part of silane coupling agent (KH-792) and 175 parts of organic solvent (xylene) are taken according to parts by weight.
2) Taking epoxy resin, polysulfone resin and a reaction kettle, adding 1/2 amounts of organic solvent and silane coupling agent, mixing, heating to 110 ℃, and slowly stirring for 30 minutes to obtain a mixed solution; placing chlorinated polypropylene into a reaction kettle, adding the residual organic solvent, stirring and heating to 80 ℃ under the nitrogen atmosphere, then slowly dripping the mixed solution obtained in the step 1) and the initiator into the mixed solution at the same time, wherein the dripping time is 110 minutes, and finally keeping the temperature and stirring for 60 minutes to obtain the epoxy modified chlorinated polypropylene adhesive.
The performance of the modified chlorinated polypropylene adhesive prepared by the comparative example is detected as follows: the tensile strength was 23.5MPa, and the peel strength was 1472N/m.
As can be seen from the detection data of the modified chlorinated polypropylene adhesives prepared in the embodiments 1-4, the modified adhesive has good cohesive force performance and is suitable for the adhesion of various materials such as metal, glass, polyolefin and the like; as is clear from the data of comparative example 1 and comparative examples 1 to 3, the adhesive properties were reduced to various degrees by reducing the proportion of the hydrogenated bisphenol A type epoxy resin in the epoxy resin and by deleting the polyether epoxy resin or the polysulfone resin.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solutions of the present application and not to limit them; although the present application has been described in detail with reference to preferred embodiments, those of ordinary skill in the art will understand that: modifications to the embodiments of the present application or equivalent replacements of some technical features may still be made, which should all be covered by the scope of the technical solution claimed in the present application.
Claims (10)
1. An epoxy-modified chlorinated polypropylene adhesive, characterized by comprising the following components: chlorinated polypropylene, epoxy resin, polysulfone resin, an initiator, a silane coupling agent and an organic solvent;
wherein the epoxy resin comprises hydrogenated bisphenol A epoxy resin and polyether epoxy resin.
2. The epoxy modified chlorinated polypropylene adhesive as claimed in claim 1, wherein the adhesive comprises the following components in parts by weight: 60-85 parts of chlorinated polypropylene, 20-40 parts of epoxy resin, 10-15 parts of polysulfone resin, 0.15-0.22 part of initiator, 0.4-1.6 parts of silane coupling agent and 200 parts of organic solvent 140-.
3. The epoxy-modified chlorinated polypropylene adhesive according to claim 1, wherein the chlorinated polypropylene is a low chlorinated isotactic polypropylene having a chlorine content of 35% to 45%.
4. The epoxy-modified chlorinated polypropylene adhesive according to claim 1, wherein the mass ratio of the hydrogenated bisphenol a epoxy resin to the polyether epoxy resin is (2.3-2.8): 1.
5. The epoxy-modified chlorinated polypropylene adhesive according to claim 4, wherein the epoxy resin of hydrogenated bisphenol A type has an epoxy value of 0.50 to 0.54; the epoxy value of the polyether epoxy resin is 0.55-0.58.
6. The epoxy-modified chlorinated polypropylene adhesive according to claim 1, wherein the initiator is one of benzoyl peroxide and azobisisobutyronitrile.
7. The epoxy-modified chlorinated polypropylene adhesive according to claim 1, wherein the silane coupling agent is KH-792.
8. The epoxy-modified chlorinated polypropylene adhesive according to claim 1, wherein the organic solvent is at least one of toluene, xylene, and cyclohexane.
9. The epoxy-modified chlorinated polypropylene adhesive according to claim 1, wherein the epoxy-modified chlorinated polypropylene adhesive is prepared by the following steps:
1) taking epoxy resin and polysulfone resin into a reaction kettle, adding 1/2 amounts of organic solvent and silane coupling agent for mixing, heating to 110-;
2) placing chlorinated polypropylene into a reaction kettle, adding the residual organic solvent, stirring and heating to 75-85 ℃ under the nitrogen atmosphere, then slowly dripping the mixed solution obtained in the step 1) and the initiator into the mixed solution at the same time, wherein the dripping time is 90-150 minutes, and finally keeping the temperature and stirring for 60 minutes to obtain the epoxy modified chlorinated polypropylene adhesive.
10. The epoxy-modified chlorinated polypropylene adhesive according to any one of claims 1 to 9, wherein the chlorinated polypropylene adhesive is used for room temperature bonding between metals, ceramics, glass, polyolefins.
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| JP2006307104A (en) * | 2005-05-02 | 2006-11-09 | Yokohama Rubber Co Ltd:The | Adhesive composition |
| CN106459703A (en) * | 2014-06-11 | 2017-02-22 | 东洋纺株式会社 | Polyolefin-based adhesive composition |
| CN109852311A (en) * | 2018-12-29 | 2019-06-07 | 南京大学 | Adhesive composition for polyolefin composite insulator |
| CN113322027A (en) * | 2021-06-29 | 2021-08-31 | 南京大学 | Epoxy modified chlorinated polypropylene adhesive |
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2021
- 2021-10-27 CN CN202111256919.3A patent/CN113861893B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006307104A (en) * | 2005-05-02 | 2006-11-09 | Yokohama Rubber Co Ltd:The | Adhesive composition |
| CN106459703A (en) * | 2014-06-11 | 2017-02-22 | 东洋纺株式会社 | Polyolefin-based adhesive composition |
| CN109852311A (en) * | 2018-12-29 | 2019-06-07 | 南京大学 | Adhesive composition for polyolefin composite insulator |
| CN113322027A (en) * | 2021-06-29 | 2021-08-31 | 南京大学 | Epoxy modified chlorinated polypropylene adhesive |
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| Publication number | Publication date |
|---|---|
| CN113861893B (en) | 2022-08-19 |
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Denomination of invention: An epoxy modified chlorinated polypropylene adhesive Effective date of registration: 20230804 Granted publication date: 20220819 Pledgee: China Postal Savings Bank Co.,Ltd. Ruichang City Branch Pledgor: Ruiyide new materials Co.,Ltd. Registration number: Y2023980051106 |
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