CN113861870A - Combined type chip mounting device and method for accurately, simply and conveniently identifying homogenized tempered glass - Google Patents
Combined type chip mounting device and method for accurately, simply and conveniently identifying homogenized tempered glass Download PDFInfo
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- CN113861870A CN113861870A CN202111124620.2A CN202111124620A CN113861870A CN 113861870 A CN113861870 A CN 113861870A CN 202111124620 A CN202111124620 A CN 202111124620A CN 113861870 A CN113861870 A CN 113861870A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/38—Concrete; ceramics; glass; bricks
- G01N33/386—Glass
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
Abstract
The invention discloses a combined type chip mounting device and method for accurately, simply and conveniently identifying homogenized tempered glass, and belongs to the field of glass quality safety evaluation. The method comprises the following steps of arranging a plurality of homogeneous temperature lower limit limiting material layers and homogeneous temperature upper limit limiting material layers on the surface of a substrate, and completely covering the substrate by bonding and curing materials; the lower homogenizing temperature limit defines the melting point of the material layer to be higher than 260 ℃ and lower than the lowest homogenizing temperature, the upper homogenizing temperature limit defines the melting point of the material layer to be higher than the highest homogenizing temperature, the softening temperature of the bonding and curing material is lower than the heat preservation temperature of homogenizing, and the melting point is higher than the melting point of the highest homogenizing temperature and the upper homogenizing temperature limit define material; the combined type paster device is provided with one surface which is adhered with the curing material and is placed on the toughened glass and clamped through the clamp. The invention can record the temperature action history process in the tempered glass homogenizing process, accurately identify whether the tempered glass is homogenized under the specified temperature homogenizing process curve, does not need to be punched, and has simple manufacture and low cost.
Description
Technical Field
The invention relates to the field of glass quality safety evaluation, in particular to a combined type chip mounting device and a combined type chip mounting method for accurately, simply and conveniently identifying the homogenized tempered glass.
Background
The toughened glass has been widely applied in various fields such as buildings, automobiles and the like in China, which is the country with the most production and application of the toughened glass. The self-explosion of the toughened glass can not be completely stopped by the current glass production technology, and the self-explosion rate of the toughened glass after leaving a factory is about 0.1-1%. For the toughened glass installed on a high-rise building, fragments generated after the toughened glass is subjected to spontaneous explosion fall from high altitude, and serious potential safety hazards are generated to ground personnel and articles, so that the reduction of the spontaneous explosion rate of the toughened glass is one of the most concerned and urgently needed to be solved in the field of glass at present.
According to the prior art, homogenizing tempered glass is a method for effectively reducing the self-explosion rate of the tempered glass, and the part 4 of safety glass for buildings: the homogenizing toughened glass (GB15763.4-2009) stipulates that the homogenizing process comprises a temperature rising stage, a heat preservation stage and a temperature reduction stage. The ramp-up phase starts at the ambient temperature to which all the glass is exposed and ends at the moment when the surface temperature of the last piece of glass reaches 280 ℃. The incubation period starts at the moment when all the glass surface temperature reaches 280 ℃ (homogeneity minimum temperature), and throughout the incubation period, it should be ensured that the glass surface temperature is maintained within the range of 290 ℃ ± 10 ℃ (homogeneity incubation temperature) for at least 2 hours, and that the glass surface temperature should not exceed 320 ℃ (homogeneity maximum temperature) throughout the homogenization period. And after the heat preservation is finished, starting to enter a cooling stage until the temperature of the glass is reduced to below 70 ℃, discharging the glass out of the furnace, and finishing the homogenizing process. Through the technical treatment, the toughened glass with higher self-explosion risk can be detonated in a homogenizing furnace, so that the self-explosion rate is reduced to below 0.1 percent.
However, before and after the tempered glass is homogenized, the appearance and the performance of the glass do not change obviously, so that whether the tempered glass flowing into the market is homogenized or not is difficult to identify, a plurality of glass enterprises are falsified, the non-homogenized tempered glass is applied to the market according to the homogenized tempered glass, the tempered glass still has a large spontaneous explosion rate, and great loss is brought to users and great hidden danger is brought to urban public safety.
Chinese patent document CN111626384A discloses a method for intelligently detecting whether tempered glass is homogeneous, in which a small hole is drilled at the corner or edge of a glass sheet, and the glass sheet is tempered; placing a chip with pre-input information or a recognizable two-dimensional code in the small hole, filling a gap between the chip or the two-dimensional code and the small hole with low-melting-point glass slurry, and completely covering the chip or the two-dimensional code; placing the toughened glass with the chip or the two-dimensional code and the low-melting-point glass slurry in the small hole into a homogenizing furnace for homogenization, and melting, cooling and solidifying the low-melting-point glass in the homogenizing process; and the chip or the two-dimension code is firmly implanted into the toughened glass. After the toughened glass is discharged from the furnace, a signal reading device can be adopted to read the chip or scan the content of the two-dimensional code so as to detect and identify whether the toughened glass is homogeneous or not, or trace the source of the homogeneous toughened glass.
The above method has the following defects: firstly, the operation procedure is complex, holes need to be punched on the glass, and the appearance and the strength of the glass are adversely affected by the punching; secondly, the high-temperature resistant chip has high price, difficult preparation, larger volume and difficult realization of large-scale application; and thirdly, the history process of temperature action of homogenizing the toughened glass in the specified temperature upper limit value, lower limit value and heat preservation time range cannot be accurately identified.
Disclosure of Invention
In order to solve the technical problems, the invention provides the combined type chip mounting device and the combined type chip mounting method for accurately, simply and conveniently identifying the homogenized tempered glass, which can record the temperature action historical process in the tempered glass homogenization process, accurately identify whether the tempered glass is homogenized under the specified temperature homogenization process curve, do not need to be punched, and have simple manufacture and low cost.
The technical scheme provided by the invention is as follows:
a combined paster device for accurately and easily identifying that toughened glass has been homogenized, the combined paster device comprising a substrate, wherein:
a group of homogeneous temperature lower limit limiting materials and a group of homogeneous temperature upper limit limiting materials are arranged on the upper surface of the substrate, the group of homogeneous temperature lower limit limiting materials comprises a plurality of homogeneous temperature lower limit limiting material layers which are stacked up and down, adjacent two homogeneous temperature lower limit limiting material layers are contacted with each other, the group of homogeneous temperature upper limit limiting materials comprises a plurality of homogeneous temperature upper limit limiting material layers which are stacked up and down, adjacent two homogeneous temperature upper limit limiting material layers are contacted with each other, and a bonding and solidifying material which completely covers the homogeneous temperature lower limit limiting material layers and the homogeneous temperature upper limit limiting material layers is arranged on the upper surface of the substrate;
the lower homogenizing temperature limit defines the melting point of the material layer to be higher than 260 ℃ and lower than the lowest homogenizing temperature of the toughened glass, the upper homogenizing temperature limit defines the melting point of the material layer to be higher than the highest homogenizing temperature of the toughened glass, the softening temperature of the bonding and solidifying material is lower than the heat preservation temperature of the toughened glass, and the melting point of the bonding and solidifying material is higher than the highest homogenizing temperature of the toughened glass and the melting point of the upper homogenizing temperature limit defines the material layer;
the surface, provided with the bonding and curing material, of the combined type paster device is placed on the toughened glass and clamped through a clamp, so that the combined type paster device is tightly attached to the surface or the end face of the toughened glass.
Further, an information identification code is arranged on the lower surface of the substrate, and the information identification code comprises public or hidden information of the traceable homogeneous toughened glass.
Further, the melting point of the homogenizing temperature lower limit defining material layer is 280 ℃ +/-5 ℃, the melting point of the homogenizing temperature upper limit defining material layer is 320 ℃ +/-10 ℃, the softening temperature of the bonding and curing material is 200-280 ℃, and the melting point of the bonding and curing material is 320-420 ℃.
Further, the substrate is made of calcium sodium glass or metal, the homogenizing temperature lower limit defining material layer is made of tin alloy, the homogenizing temperature upper limit defining material layer is made of metal lead material, and the bonding and solidifying material is low-melting-point glass slurry or low-melting-point glass powder.
Furthermore, the substrate is rectangular or circular, the thickness of the substrate is 0.05-0.2 mm, and the side length or the diameter of the substrate is 2-10 mm; the lower homogenizing temperature limiting material layer is a metal foil with the thickness of less than 0.01mm, and the upper homogenizing temperature limiting material layer is a metal foil with the thickness of less than 0.01 mm.
A method for accurately and easily identifying that tempered glass is homogeneous, the method comprising:
s1: preparing a substrate;
s2: vertically stacking a plurality of homogeneous temperature upper limit limiting material layers on the upper surface of the substrate, and ensuring that two adjacent homogeneous temperature upper limit limiting material layers are mutually contacted; wherein the upper homogenizing temperature limit defines that the melting point of the material layer is higher than the highest homogenizing temperature of the tempered glass;
s3: stacking a plurality of lower homogeneous temperature limiting material layers above the upper homogeneous temperature limiting material layers, and ensuring that two adjacent lower homogeneous temperature limiting material layers are in contact with each other; wherein the lower homogeneity temperature limit defines a melting point of the material layer above 260 ℃ and below a lowest homogeneity temperature of the tempered glass;
s4: completely covering the homogeneous temperature lower limit defining material layer and the homogeneous temperature upper limit defining material layer on the upper surface of the substrate by using an adhesive curing material, and compacting until the adhesive curing material and the substrate are not dispersed or fall off to obtain a combined patch device; the softening temperature of the bonding and curing material is lower than the homogenizing heat preservation temperature of the toughened glass, and the melting point of the bonding and curing material is higher than the homogenizing maximum temperature and the homogenizing upper limit of the toughened glass to define the melting point of the material layer;
s5: placing one surface, provided with a bonding and curing material, of the combined type paster device on the surface or the end face of the toughened glass, and applying certain pressure through a clamp to enable the combined type paster device to be tightly attached to the surface or the end face of the toughened glass;
s6: placing the toughened glass with the combined patch device into a homogenizing furnace for heat treatment, softening the bonding and curing material under the high-temperature action of the homogenizing furnace, and fixedly bonding the combined patch device on the surface or the end face of the toughened glass with a certain bonding force in the heat preservation process;
s7: checking whether the multilayer homogenizing temperature lower limit defining material layer has melting history or not, checking whether the multilayer homogenizing temperature upper limit defining material layer has melting history or not, and checking the bonding tensile strength between the combined patch device and the toughened glass;
and if the melting history of the multiple layers of homogenizing temperature lower limit limiting material layers does not occur, and the bonding tensile strength between the combined patch device and the toughened glass exceeds a set threshold value, judging that the toughened glass is homogenized according to the requirement.
Further, the S1 further includes: and manufacturing an information identification code on the lower surface of the substrate, wherein the information identification code comprises public or hidden information of the traceable homogeneous toughened glass.
Further, if the multiple lower homogeneous temperature limiting material layers/the multiple upper homogeneous temperature limiting material layers are melt-bonded together, the multiple lower homogeneous temperature limiting material layers/the multiple upper homogeneous temperature limiting material layers have a melting history, otherwise, the melting history does not occur.
Further, the melting point of the homogenizing temperature lower limit defining material layer is 280 ℃ +/-5 ℃, the melting point of the homogenizing temperature upper limit defining material layer is 320 ℃ +/-10 ℃, the softening temperature of the bonding and curing material is 200-280 ℃, the melting point of the bonding and curing material is 320-420 ℃, and the set threshold value is 0.2 +/-0.05 MPa.
Further, the substrate is made of calcium sodium glass or metal, the homogenizing temperature lower limit defining material layer is made of tin alloy, the homogenizing temperature upper limit defining material layer is made of metal lead material, and the bonding and solidifying material is low-melting-point glass slurry or low-melting-point glass powder;
the substrate is rectangular or circular, the thickness of the substrate is 0.05-0.2 mm, and the side length or the diameter of the substrate is 2-10 mm; the lower homogeneous temperature limiting material layer is a metal foil with the thickness of less than 0.01mm, and the upper homogeneous temperature limiting material layer is a metal foil with the thickness of less than 0.01 mm.
The invention has the following beneficial effects:
according to the invention, the substrate is provided with the multiple layers of the homogenizing temperature lower limit limiting material layers, the multiple layers of the homogenizing temperature upper limit limiting material layers and the bonding curing material to form the combined patch device, the combined patch device is simply pasted on the surface of the toughened glass, the temperature action history process (temperature and heat preservation time) in the homogenizing process of the toughened glass can be recorded, and whether the toughened glass is homogenized under the specified temperature homogenizing process curve can be identified. The invention avoids punching holes on the toughened glass and does not have any adverse effect on the toughened glass. The combined type paster device is simple to manufacture and low in cost, and can be arranged on each piece of toughened glass, and if the toughened glass doubts which piece of glass or batch of glass is homogenized according to requirements in the subsequent use process, the paster is only required to be subjected to related inspection, detection and judgment according to the invention. The invention can identify each homogenized toughened glass and prevent the non-homogenized toughened glass from flowing into the market, thereby ensuring the safe application of the toughened glass.
Drawings
FIG. 1 is a schematic view of a substrate;
FIG. 2 is a schematic view of a substrate and an information identifier;
FIG. 3 is a schematic diagram illustrating the fabrication of multiple homogeneous upper temperature limiting material layers;
FIG. 4 is a schematic diagram illustrating the fabrication of multiple homogeneous lower temperature limiting material layers;
FIG. 5 is a schematic view of the combined type sheet sticking device for accurately and easily identifying the homogenized tempered glass according to the present invention;
FIG. 6 is a schematic view of the combination type surface mount device being attached to the surface of tempered glass;
fig. 7 is a schematic view of the combination type surface mount device being attached to the end face of the tempered glass.
Detailed Description
In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific embodiments.
Example 1:
the embodiment of the invention provides a combined type chip device for accurately, simply and conveniently identifying the homogenization of toughened glass, and as shown in figures 1-7, the combined type chip device 6 comprises a substrate 1, wherein:
the substrate 1 is preferably made of soda-lime ultra-thin glass, and other materials such as a metal sheet may be selected as required. The shape of the substrate is preferably rectangular or circular, the thickness of the substrate is preferably 0.05-0.2 mm, and the side length or the diameter of the substrate is preferably 2-10 mm; the substrate can also be shaped into various LOGO shapes or other decorative shapes as desired.
A group of homogeneous temperature lower limit limiting materials and a group of homogeneous temperature upper limit limiting materials are arranged on the upper surface of the substrate 1, the group of homogeneous temperature upper limit limiting materials comprises a plurality of homogeneous temperature upper limit limiting material layers 3 which are overlapped up and down, and two adjacent homogeneous temperature upper limit limiting material layers 3 are contacted with each other.
The melting point of the upper limit homogenizing temperature limiting material layer is higher than the highest homogenizing temperature of the toughened glass, the material is preferably a metal lead material, the melting point of the metal lead material is 320 +/-10 ℃, and the upper limit homogenizing temperature limiting material layer can be formed by two or more layers of metal foils, the thickness of the upper limit homogenizing temperature limiting material layer is as thin as possible, and the thickness of the upper limit homogenizing temperature limiting material layer is generally less than 0.01 mm.
A set of homogeneous temperature lower limit limiting materials comprises a plurality of homogeneous temperature lower limit limiting material layers 4 which are stacked one on top of the other, and two adjacent homogeneous temperature lower limit limiting material layers 4 are in contact with each other.
The lower limit homogeneous temperature defining material layer has a melting point higher than 260 deg.c and lower than the lowest homogeneous temperature of toughened glass, and is preferably tin alloy with a melting point of 280 deg.c +/-5 deg.c, and the lower limit homogeneous temperature defining material layers may be two or more layers of metal foil with a thickness as thin as possible, usually 0.01mm or less.
The upper surface of the substrate 1 is provided with a bonding curing material 5 that completely covers the homogeneous temperature lower limit limiting material layer 4 and the homogeneous temperature upper limit limiting material layer 3.
The softening temperature of the bonding and curing material is lower than the homogeneous heat preservation temperature of the toughened glass, the melting point is higher than the highest homogeneous temperature of the toughened glass, and the melting point is higher than the upper limit of the homogeneous temperature to define the melting point of the material layer. The bonding and curing material is preferably low-melting-point glass slurry or low-melting-point glass powder, the softening temperature of the bonding and curing material is preferably 200-280 ℃, and the melting point of the bonding and curing material is preferably 320-420 ℃.
The lower homogeneous temperature limiting material layer 4 and the upper homogeneous temperature limiting material layer 3 and the bonding and curing material 5 are fixed on the upper surface of the substrate 1 to form a combined patch device.
The surface of the combined type paster device 6 provided with the bonding curing material 5 is placed on the toughened glass (generally positioned on the surface or the end surface of the corner part of the toughened glass) and is clamped by a clamp, so that the combined type paster device 6 is tightly attached to the surface or the end surface of the toughened glass 7
And (3) placing the toughened glass 7 with the combined paster device 6 into a homogenizing furnace, carrying out heat treatment, softening the bonding and curing material after the heat action of the homogenizing furnace, and solidifying the combined paster device and the toughened glass together through the bonding and curing material.
Then, the toughened glass is judged to be homogenized according to the requirements of GB15763.4-2009 standard by the following method:
1) the multiple homogeneous temperature lower limit limiting material layers on the combined patch device are checked to determine whether the melting history occurs (whether the multiple homogeneous temperature lower limit limiting material layers are melted and bonded together can be checked), and if the melting history occurs, the lowest homogeneous temperature exceeds the melting point temperature of the multiple homogeneous temperature lower limit limiting material layers.
2) The multiple homogeneous temperature upper limit limiting material layers on the combined patch device are checked to determine whether the melting history occurs (whether the multiple homogeneous temperature upper limit limiting material layers are melted and bonded together can be checked), and if the melting history does not occur, the highest homogeneous temperature does not exceed the melting point temperature of the multiple homogeneous temperature upper limit limiting material layers.
3) Checking the bonding condition between the bonding curing material and the substrate and the toughened glass, and keeping the temperature at about 290 ℃ for 2 hours due to the bonding force related to the temperature and the acting time, wherein the bonding tensile strength is about 0.2MPa, if the bonding curing material is heated to 290 ℃ but not kept, the bonding tensile strength is not generated, which indicates that the heat preservation process is not performed, and if the bonding tensile strength is lower than 0.2-0.05MPa, the heat preservation time is not enough.
4) When the inspection finds that the multi-layer homogeneous temperature lower limit limiting material layer on the combined patch device has the over-melting history, the multi-layer homogeneous temperature upper limit limiting material layer has no melting history, and the bonding tensile strength of the bonding curing material is about 0.2MPa +/-0.05 MPa, the toughened glass can be judged to be subjected to the over-homogenizing treatment strictly according to the requirements of GB15763.4-2009 standard.
According to the invention, the substrate is provided with the multiple layers of the homogenizing temperature lower limit limiting material layers, the multiple layers of the homogenizing temperature upper limit limiting material layers and the bonding curing material to form the combined patch device, the combined patch device is simply pasted on the surface of the toughened glass, the temperature action history process (temperature and heat preservation time) in the homogenizing process of the toughened glass can be recorded, and whether the toughened glass is homogenized under the specified temperature homogenizing process curve can be identified. The invention avoids punching holes on the toughened glass and does not have any adverse effect on the toughened glass. The combined type paster device is simple to manufacture and low in cost, and can be arranged on each piece of toughened glass, and if the toughened glass doubts which piece of glass or batch of glass is homogenized according to requirements in the subsequent use process, the paster is only required to be subjected to related inspection, detection and judgment according to the invention. The invention can identify each homogenized toughened glass and prevent the non-homogenized toughened glass from flowing into the market, thereby ensuring the safe application of the toughened glass.
In the present invention, the information identification code 2 may be further provided on the lower surface of the substrate. The information identification code is preferably a two-dimensional code, the two-dimensional code is preferably engraved on the lower surface of the substrate by a laser coding machine, and can be prepared in the forms of printing, sintering and the like, the size of the two-dimensional code can facilitate a reader to read information, the two-dimensional code information can be implanted with related information according to engineering requirements, and even the related information can be hidden according to customer requirements.
Example 2:
the embodiment of the invention provides a method for accurately, simply and conveniently identifying the homogenization of tempered glass, which comprises the following steps of:
s1: the substrate 1 is prepared.
The substrate 1 is preferably made of soda-lime ultra-thin glass, and other materials such as a metal sheet may be selected as required. The shape of the substrate is preferably rectangular or circular, the thickness of the substrate is preferably 0.05-0.2 mm, and the side length or the diameter of the substrate is preferably 2-10 mm; the substrate can also be shaped into various LOGO shapes or other decorative shapes as desired.
When the substrate 1 is an ultra-thin glass, an ultra-thin glass original sheet may be cut into a square 1-1 or a circle 1-2 as shown in fig. 1 as a substrate. Because the substrate 1 is attached to the surface of the toughened glass 7, in order to not affect the appearance of the toughened glass 7 as much as possible, the thinner the substrate 1 is, the better the smaller the size is, and the edge of the substrate 1 can be properly edged.
In this step, the method may further include: manufacturing an information identification code on the lower surface of the substrate, specifically: a two-dimensional code 2 is manufactured on the lower surface of a substrate 1 in the form of screen printing or laser coding and the like, and the two-dimensional code is used for facilitating the implantation of relevant information of glass, as shown in figure 2. The size of the two-dimensional code 2 is required to be not larger than that of the substrate 1, the two-dimensional code can be tightly adhered to the substrate 1, the color of the two-dimensional code is not changed and the two-dimensional code does not fall off after the two-dimensional code is acted by a high temperature of a homogenizing furnace, and the two-dimensional code does not fall off in the future service process.
S2: a plurality of homogeneous temperature upper limit limiting material layers 3 are stacked on top of each other on the upper surface of the substrate while ensuring that adjacent two homogeneous temperature upper limit limiting material layers are in contact with each other.
The melting point of the homogenizing upper-limit temperature limiting material layer is higher than the highest homogenizing temperature of the toughened glass, the material can be a metal lead material, the melting point of the metal lead material is 320 +/-10 ℃, and the multilayer homogenizing upper-limit temperature limiting material layer can be formed by two or more layers of metal foils, and the thickness of the multilayer homogenizing upper-limit temperature limiting material layer is as thin as possible.
S3: and stacking a plurality of lower homogeneous temperature limiting material layers on the upper homogeneous temperature limiting material layers, and ensuring that two adjacent lower homogeneous temperature limiting material layers are in contact with each other.
The melting point of the homogenizing temperature lower limit defining material layer is higher than 260 ℃ and lower than the homogenizing lowest temperature of the toughened glass, the material can be tin alloy, the melting point is 280 +/-5 ℃, and the multilayer homogenizing temperature lower limit defining material layer can be composed of two or more layers of metal foils and is as thin as possible.
One specific implementation manner of the foregoing S2 and S3 is:
the upper limit homogeneous temperature limiting material is made into a square or round metal foil 3 'with the size not exceeding the size of the substrate 1, and at least two layers of metal foils 3' are overlapped in a peripheral alignment manner to obtain the multi-layer upper limit homogeneous temperature limiting material layer 3, and the thickness of the multi-layer upper limit homogeneous temperature limiting material layer is as thin as possible after being overlapped, generally below 0.01mm, as shown in figure 3.
The lower homogeneous temperature limiting material is formed into a square or circular metal foil 4 ' having a size not exceeding the size of the substrate 1, preferably the same size as the metal foil 3 ' of the upper homogeneous temperature limiting material, and at least two metal foils 3 ' are stacked in alignment with each other at their peripheries to form the multi-layered lower homogeneous temperature limiting material layer 4, which has a thickness as thin as possible, typically 0.01mm or less, as shown in fig. 4.
The lower homogeneous temperature limiting material layer 4 and the upper homogeneous temperature limiting material layer 3 are arranged on the surface of the substrate 1, which is not provided with the two-dimensional code, in an up-and-down alignment manner, and are aligned with the two-dimensional code.
S4: and completely covering the homogeneous temperature lower limit limiting material layer and the homogeneous temperature upper limit limiting material layer with the bonding and curing material on the upper surface of the substrate, and compacting until the bonding and curing material and the substrate are not dispersed or fall off to obtain the combined patch device.
The softening temperature of the bonding and curing material is lower than the homogenizing heat preservation temperature of the toughened glass, the melting point of the bonding and curing material is higher than the melting point of the material defined by the highest homogenizing temperature and the upper homogenizing temperature limit of the toughened glass, the bonding and curing material is preferably low-melting-point glass slurry or low-melting-point glass powder, the softening temperature of the bonding and curing material is preferably 200-280 ℃, and the melting point of the bonding and curing material is preferably 320-420 ℃.
The lower homogeneous temperature limiting material layer 4, the upper homogeneous temperature limiting material layer 3, the bonding curing material 5 and the information identification code 2 are fixed on the substrate 1 to form a combined patch device, as shown in fig. 5.
The structure and arrangement of the lower homogeneous temperature limiting material layer 4 and the upper homogeneous temperature limiting material layer 3, the arrangement of the bonding and curing material 5, and the shape of the combined patch device can be flexibly arranged according to the requirement, and the manner shown in fig. 5 of the present invention is only a representative and is not a limitation of the present invention.
S5: the surface of the combined type chip device 6 provided with the bonding and curing material 5 is placed on the surface or the end surface of the toughened glass 7 (generally located at the corner of the toughened glass), and a certain pressure P is applied through a clamp such as a stainless steel clamp, so that the combined type chip device 6 is tightly attached to the surface or the end surface of the toughened glass 7, as shown in fig. 6 and 7.
S6: the toughened glass with the combined paster device is put into a homogenizing furnace for heat treatment, the bonding curing material is softened under the high-temperature action of the homogenizing furnace, and the combined paster device is fixedly bonded on the surface or the end face of the toughened glass with a certain bonding force.
S7: and checking whether the melting history occurs to the lower limit material layer of the multi-layer homogenizing temperature, checking whether the melting history occurs to the upper limit material layer of the multi-layer homogenizing temperature, and checking the bonding tensile strength between the combined patch device and the toughened glass.
If the multiple layers of the lower homogenizing temperature limit material layers are fused and bonded together, the multiple layers of the lower homogenizing temperature limit material layers have a fusion history, which represents that the lowest homogenizing temperature exceeds the melting point temperature of the multiple layers of the lower homogenizing temperature limit material layers; if the multiple layers of the upper homogenizing temperature limit defining material layers are not melted and bonded together, and the melting history is represented that the highest homogenizing temperature does not exceed the melting point temperature; if the bonding tensile strength between the combined patch device and the toughened glass exceeds a set threshold (for example, 0.2 +/-0.05 MPa), the homogeneous heat preservation temperature reaches the softening temperature of the bonding curing material and is kept for a sufficient time; through the three points, the toughened glass is judged to be subjected to homogenization treatment strictly according to the requirements of GB15763.4-2009 standard.
The effect of the invention is demonstrated below by specific test examples:
the method comprises the steps of selecting 0.1 mm-thick 5 mm-long-width ultra-thin glass as a substrate 1, adopting two layers of metal lead foils as a multilayer homogenizing temperature upper limit limiting material layer 3 (melting point 327.5 ℃), adopting two layers of tin alloy foils as a multilayer homogenizing temperature lower limit limiting material layer 4 (melting point 280.0 ℃), adopting low-melting-point glass with the softening point of 230 ℃ and the melting point of 380 ℃ as an adhesive curing material 5, manufacturing a combined paster device, and carrying out heat treatment in a homogenizing furnace along with tempered glass.
After the tempered glass is taken out of the furnace, the historical sign that two layers of metal lead foils are melted and bonded together is not seen, the historical sign that two layers of tin alloy foils are obviously melted and bonded to form a whole is seen, the low-melting-point glass is melted and solidified, the substrate and the tempered glass are bonded together, the bonding strength of the substrate and the tempered glass is detected, the value is 0.18MPa, the tempered glass is proved to be homogenized according to the requirement, and the test proves the reliability and the effectiveness of the tempered glass.
The method of the embodiment of the present invention is a manufacturing and using method of embodiment 1, which includes all technical solutions of embodiment 1 and has the beneficial effects described in embodiment 1, and is not described herein again. Other parts of this embodiment not mentioned above can be referred to the corresponding parts in the foregoing embodiment 1.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A combined patch device for accurately and easily identifying the homogenization of toughened glass is characterized by comprising a substrate, wherein:
a group of homogeneous temperature lower limit limiting materials and a group of homogeneous temperature upper limit limiting materials are arranged on the upper surface of the substrate, the group of homogeneous temperature lower limit limiting materials comprises a plurality of homogeneous temperature lower limit limiting material layers which are stacked up and down, adjacent two homogeneous temperature lower limit limiting material layers are contacted with each other, the group of homogeneous temperature upper limit limiting materials comprises a plurality of homogeneous temperature upper limit limiting material layers which are stacked up and down, adjacent two homogeneous temperature upper limit limiting material layers are contacted with each other, and a bonding and solidifying material which completely covers the homogeneous temperature lower limit limiting material layers and the homogeneous temperature upper limit limiting material layers is arranged on the upper surface of the substrate;
the lower homogenizing temperature limit defines the melting point of the material layer to be higher than 260 ℃ and lower than the lowest homogenizing temperature of the toughened glass, the upper homogenizing temperature limit defines the melting point of the material layer to be higher than the highest homogenizing temperature of the toughened glass, the softening temperature of the bonding and solidifying material is lower than the heat preservation temperature of the toughened glass, and the melting point of the bonding and solidifying material is higher than the highest homogenizing temperature of the toughened glass and the melting point of the upper homogenizing temperature limit defines the material layer;
the surface, provided with the bonding and curing material, of the combined type paster device is placed on the toughened glass and clamped through a clamp, so that the combined type paster device is tightly attached to the surface or the end face of the toughened glass.
2. The combined patch device for accurately and conveniently identifying the homogenization of the tempered glass according to claim 1, wherein an information identification code is arranged on the lower surface of the substrate, and the information identification code comprises public or hidden traceable information of the homogenized tempered glass.
3. The combined patch device for accurately and easily identifying the homogenization of tempered glass according to claim 1 or 2, wherein the lower homogenization temperature limit defining material layer has a melting point of 280 ℃ ± 5 ℃, the upper homogenization temperature limit defining material layer has a melting point of 320 ℃ ± 10 ℃, the bonding and curing material has a softening temperature of 200 ℃ to 280 ℃, and the bonding and curing material has a melting point of 320 ℃ to 420 ℃.
4. The combined patch device for accurately and easily identifying the homogenization of tempered glass according to claim 3, wherein the substrate is made of soda-lime glass or metal, the lower homogenization temperature limit defining material layer is made of tin alloy, the upper homogenization temperature limit defining material layer is made of metal lead, and the bonding and solidifying material is low-melting glass paste or low-melting glass powder.
5. The combined type patch device for accurately and conveniently identifying the homogenization of the toughened glass according to claim 3, wherein the substrate is rectangular or circular, the thickness of the substrate is 0.05-0.2 mm, and the side length or the diameter of the substrate is 2-10 mm; the lower homogenizing temperature limiting material layer is a metal foil with the thickness of less than 0.01mm, and the upper homogenizing temperature limiting material layer is a metal foil with the thickness of less than 0.01 mm.
6. A method for accurately and easily identifying the homogenization of tempered glass, which is characterized by comprising the following steps:
s1: preparing a substrate;
s2: vertically stacking a plurality of homogeneous temperature upper limit limiting material layers on the upper surface of the substrate, and ensuring that two adjacent homogeneous temperature upper limit limiting material layers are mutually contacted; wherein the upper homogenizing temperature limit defines that the melting point of the material layer is higher than the highest homogenizing temperature of the tempered glass;
s3: stacking a plurality of lower homogeneous temperature limiting material layers above the upper homogeneous temperature limiting material layers, and ensuring that two adjacent lower homogeneous temperature limiting material layers are in contact with each other; wherein the lower homogeneity temperature limit defines a melting point of the material layer above 260 ℃ and below a lowest homogeneity temperature of the tempered glass;
s4: completely covering the homogeneous temperature lower limit defining material layer and the homogeneous temperature upper limit defining material layer on the upper surface of the substrate by using an adhesive curing material, and compacting until the adhesive curing material and the substrate are not dispersed or fall off to obtain a combined patch device; the softening temperature of the bonding and curing material is lower than the homogenizing heat preservation temperature of the toughened glass, and the melting point of the bonding and curing material is higher than the homogenizing maximum temperature and the homogenizing upper limit of the toughened glass to define the melting point of the material layer;
s5: placing one surface, provided with a bonding and curing material, of the combined type paster device on the surface or the end face of the toughened glass, and applying certain pressure through a clamp to enable the combined type paster device to be tightly attached to the surface or the end face of the toughened glass;
s6: placing the toughened glass with the combined patch device into a homogenizing furnace for heat treatment, softening the bonding and curing material under the high-temperature action of the homogenizing furnace, and fixedly bonding the combined patch device on the surface or the end face of the toughened glass with a certain bonding force in the heat preservation process;
s7: checking whether the multilayer homogenizing temperature lower limit defining material layer has melting history or not, checking whether the multilayer homogenizing temperature upper limit defining material layer has melting history or not, and checking the bonding tensile strength between the combined patch device and the toughened glass;
and if the melting history of the multiple layers of homogenizing temperature lower limit limiting material layers does not occur, and the bonding tensile strength between the combined patch device and the toughened glass exceeds a set threshold value, judging that the toughened glass is homogenized according to the requirement.
7. The method for accurately and easily identifying the homogenized tempered glass according to claim 6, wherein the step S1 further comprises: and manufacturing an information identification code on the lower surface of the substrate, wherein the information identification code comprises public or hidden information of the traceable homogeneous toughened glass.
8. The method for accurately and easily identifying the homogenization of the tempered glass according to claim 6 or 7, wherein if the plurality of lower homogeneous temperature limiting material layers/the plurality of upper homogeneous temperature limiting material layers are fusion-bonded together, the history of fusion of the plurality of lower homogeneous temperature limiting material layers/the plurality of upper homogeneous temperature limiting material layers occurs, and otherwise the history of fusion does not occur.
9. The method for accurately and easily identifying the homogenization of tempered glass according to claim 8, wherein the lower homogenization temperature limit defining material layer has a melting point of 280 ℃ ± 5 ℃, the upper homogenization temperature limit defining material layer has a melting point of 320 ℃ ± 10 ℃, the bonding and curing material has a softening temperature of 200 ℃ to 280 ℃, the bonding and curing material has a melting point of 320 ℃ to 420 ℃, and the set threshold value is 0.2 ± 0.05 MPa.
10. The method for accurately and easily identifying the homogenization of the toughened glass according to claim 9, wherein the substrate is made of soda-lime glass or metal, the lower homogenization temperature limit defining material layer is made of tin alloy, the upper homogenization temperature limit defining material layer is made of lead metal, and the bonding and solidifying material is low-melting-point glass slurry or low-melting-point glass powder;
the substrate is rectangular or circular, the thickness of the substrate is 0.05-0.2 mm, and the side length or the diameter of the substrate is 2-10 mm; the lower homogeneous temperature limiting material layer is a metal foil with the thickness of less than 0.01mm, and the upper homogeneous temperature limiting material layer is a metal foil with the thickness of less than 0.01 mm.
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Cited By (1)
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| CN114907006A (en) * | 2022-04-20 | 2022-08-16 | 中国国检测试控股集团股份有限公司 | Method for identifying homogenization of tempered glass |
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