CN113861620A - Polyhedral single-crystal alumina/aluminum nitride/epoxy resin heat-conducting composite material and preparation method thereof - Google Patents
Polyhedral single-crystal alumina/aluminum nitride/epoxy resin heat-conducting composite material and preparation method thereof Download PDFInfo
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 58
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 58
- 239000002131 composite material Substances 0.000 title claims abstract description 54
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 title claims abstract description 40
- 239000013078 crystal Substances 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims description 41
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000002156 mixing Methods 0.000 claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 19
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 238000012986 modification Methods 0.000 claims abstract description 8
- 230000004048 modification Effects 0.000 claims abstract description 8
- 239000002002 slurry Substances 0.000 claims description 20
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 14
- 239000011324 bead Substances 0.000 claims description 10
- 238000000227 grinding Methods 0.000 claims description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 3
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 2
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 claims description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 2
- 238000003801 milling Methods 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 102220043159 rs587780996 Human genes 0.000 abstract description 30
- 239000000203 mixture Substances 0.000 abstract description 4
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- 238000009413 insulation Methods 0.000 abstract 1
- 239000000945 filler Substances 0.000 description 9
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
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- 238000011049 filling Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 238000001878 scanning electron micrograph Methods 0.000 description 1
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- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
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- C08K3/28—Nitrogen-containing compounds
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Abstract
The invention relates to a polyhedral monocrystalline aluminum oxide/aluminum nitride/epoxy resin heat-conducting composite material and a preparation method thereof, and the preparation method is characterized in that: (1) taking 20-75 parts of D50= 18-22 um polyhedral single-crystal aluminum oxide powder, 5-30 parts of D50= 2-4 um aluminum nitride powder, 2-8 parts of D50= 0.3-0.5 um polyhedral single-crystal aluminum oxide and 10-50 parts of E51 epoxy resin for later use; (2) carrying out dry modification on polyhedral single crystal aluminum oxide and aluminum nitride powder; (3) adding the modified powder, the curing agent and the accelerator into a star mill for mixing; then adding the mixture into a vacuum defoaming machine for defoaming; and then curing treatment is carried out. The invention has the advantages that: a ternary granularity compact accumulation system is adopted, so that not only is compact accumulation realized, but also a high-efficiency continuous wide heat conduction channel is constructed, and the interface thermal resistance is reduced; the prepared epoxy resin composite material has the heat conductivity coefficient of 3.0-6.0W/mK and has better insulation and mechanical properties.
Description
Technical Field
The invention belongs to the technical field of preparation of heat-conducting and insulating composite materials, and particularly relates to a polyhedral monocrystalline aluminum oxide/aluminum nitride/epoxy resin heat-conducting composite material and a preparation method thereof.
Background
With the rapid development of the electronic power industry, electrical and electronic equipment is gradually developed towards high frequency, high speed, high power density and light weight, particularly, a chip for 5G communication is provided, and 5G high-frequency communication millimeter waves have the problems of chip power consumption increase and heating value increase while having ultrahigh-speed transmission, ultralow time delay and ultrahigh connection performance, so that the aging of an insulating medium is accelerated, the operation reliability of the chip is reduced, and the service life of the chip is prolonged. Therefore, the heat management of the chip becomes an important problem, and as a 5G chip substrate and a packaging material, the heat conductivity of an insulating medium is required to be improved, and the dielectric constant and the dielectric loss are required to be reduced so as to achieve the purposes of accelerating the heat dissipation of the chip and the signal transmission speed.
Epoxy resin has excellent insulating properties, chemical resistance and adhesive strength, and is widely used in electronic insulating materials. However, the pure epoxy resin has poor heat conductivity (the heat conductivity coefficient is 0.18-0.25W/mK), and the inorganic heat-conducting fillers with different structures, shapes and particle sizes are compounded and filled to effectively construct a heat-conducting passage, so that the heat conductivity of the epoxy resin composite material is finally improved. The currently filled high-thermal-conductivity inorganic filler mainly comprises spherical Al2O3(30.0W/mK), AlN (319W/mK) and flaky/spherical h-BN (300-2O3The epoxy resin heat-conducting composite material is a mainstream heat-conducting filler in the current domestic and foreign markets, and is generally used as an important framework inorganic heat-conducting filler, and the heat conductivity coefficient of the epoxy resin heat-conducting composite material is generally 1.0-3.0W/mK. As is known, the point-to-point contact heat conduction path constructed by spherical alumina is not beneficial to constructing a continuous and wide heat conduction path, resulting in poor heat conduction performance of the composite material.
Disclosure of Invention
The invention aims to solve the problem of poor heat-conducting property of an epoxy resin composite material, and provides a polyhedral single-crystal alumina/aluminum nitride/epoxy resin heat-conducting composite material and a preparation method thereof; according to the composite material, boron nitride with high cost is omitted, and alumina and aluminum nitride with low cost are used as fillers, so that the production cost of the composite material is greatly reduced; secondly, the invention adopts a ternary granularity system, and replaces the point-point contact mode between the traditional spherical alumina by the mutual lapping mode of the surface-surface and the line-line between the polyhedral alumina and between the polyhedral alumina and the aluminum nitride, thereby not only realizing the compact accumulation in the epoxy resin matrix, but also effectively reducing the interface thermal resistance while constructing a high-efficiency continuous wide heat conduction channel, and finally effectively and quickly transmitting the heat.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a polyhedral single crystal alumina/aluminum nitride/epoxy resin heat conduction composite material is characterized by being prepared from the following raw materials in percentage by weight:
a preparation method of a polyhedral single-crystal alumina/aluminum nitride/epoxy resin heat-conducting composite material is characterized by comprising the following steps:
(1) weighing the raw materials according to the proportion for later use;
(2) modification: carrying out dry modification treatment on polyhedral single crystal aluminum oxide and aluminum nitride powder;
(3) and (3) low-speed mixing: putting the epoxy resin, the polyhedral monocrystalline aluminum oxide and aluminum nitride powder, the curing agent and the accelerator into a star mill, and mixing at a low speed (the rotating speed is 100-300 rpm) to obtain epoxy resin composite slurry A;
(4) vacuum defoaming: adding the epoxy resin composite slurry obtained in the step (3) into a vacuum defoaming machine (rotating speed: 1000-3000 rpm) for defoaming to obtain epoxy resin composite slurry B;
(5) pouring-curing: and (3) adding the epoxy resin composite slurry in the step (4) into a stainless steel grinding tool for curing treatment to obtain the polyhedral monocrystalline aluminum oxide/aluminum nitride/epoxy resin heat-conducting composite material.
Further, the coupling agent for modifying the polyhedral single crystal aluminum oxide and the aluminum nitride in the step (1) is A-187 (product of Meighur, USA), and the adding amount is 1-6% of the weight of the powder.
Further, the curing agent in the step (2) is any one or more of methyl tetrahydrophthalic anhydride (MeTHPA), methyl hexahydrophthalic anhydride (MeHHPA), Methyl Nadic Anhydride (MNA) and Dicyandiamide (DICY).
Further, in the step (2), the curing accelerator is any one or more of 2-ethyl-4-methylimidazole, 2-methylimidazole, DMP-10, DMP-20 and DMP-30.
Further, a planetary ball mill is adopted for low-speed mixing, the milling medium is 0.3-2 mm zirconia beads, the mixing time is 60-240 min, and the rotating speed is 100-300 rpm.
And further, defoaming by adopting a high-speed vacuum defoaming machine, wherein 0.3-0.6mm of zirconia beads are added, the mixing time is 30-120 min, and the rotating speed is 1000-3000 rpm.
Compared with the prior art, the invention has the following advantages:
1. in order to construct a wide and effective heat conduction path, the inorganic filler adopts a large, medium and small ternary granularity system for hybrid overlapping, and a lower viscosity system, the optimal heat conduction performance and the minimum interface thermal resistance are obtained on the premise of realizing close packing (maximum filling);
2, the large-particle-size polyhedral monocrystalline alumina is selected as the framework filler, so that the spherical alumina has the advantages of line-line and surface-surface contact compared with the point-point contact among the traditional spherical alumina fillers; compared with the traditional alumina filler, the heat conduction path constructed by the large-particle-size polyhedral monocrystalline alumina is continuous and wide, and can effectively dissipate a large amount of heat in time;
3. the invention adds the polyhedral aluminum oxide with small grain diameter as the gap filler, constructs a plurality of heat conduction paths similar to rural lanes, and can effectively diffuse heat to the heat conduction paths similar to provincial lanes and passageways on the periphery in time;
4. the heat-conducting filler selected by the invention has better dielectric constant and mechanical strength, and greatly improves the heat-conducting property of the epoxy resin composite material on the premise of ensuring better insulating property and mechanical property; the epoxy resin composite material prepared by the invention has the heat conductivity of 3.0-6.0W/mK, the dielectric constant of 5.0-8.0 (1.0 MHZ) and the storage modulus of 7.0-17.0GPa (100 ℃) (the specific heat conductivity is shown in the attached table 1);
5. the preparation method is simple, is easy for industrial production, and has wide application prospect.
Drawings
FIG. 1 is a SEM and particle size distribution plot for large size polyhedral alumina;
FIG. 2 is an SEM-EDS picture of aluminum nitride;
FIG. 3 is an SEM and XRD pattern of a small size polyhedral alumina;
FIG. 4 is a SEM image of a cross section of the epoxy resin composite material.
The specific implementation case is as follows:
a preparation method of a polyhedral single-crystal alumina/aluminum nitride/epoxy resin heat-conducting composite material comprises the following specific implementation steps:
thermal conductivity of epoxy resin composites in the following examplesλ= ρ×C p ×α，Wherein alpha is the thermal diffusivity，C p The specific heat capacity is the specific heat capacity,ρis the density of the composite material, the thermal diffusivityα) The diameter of the test sample is 12.8mm, and the thickness of the test sample is 2 mm.
Example 1
(1) The formula comprises the following components in parts by weight: 45 parts of polyhedral single-crystal alumina (D50= 20 um), 12 parts of aluminum nitride (D50= 2.5 um) and 3 parts of polyhedral single-crystal alumina (D50=0.30 um);
(2) modification: adding 1% A-187 of the polyhedral single-crystal alumina (D50= 20 um), 5% A-187 of the polyhedral single-crystal alumina (D50=0.30um), 3% A-187 of the aluminum nitride (D50= 2.5 um) and modifying at 120 ℃ for 45min to obtain modified inorganic heat-conducting powder;
(3) and (3) low-speed mixing: taking 40 parts of E51 epoxy resin, 45 parts of modified polyhedral aluminum oxide (D50= 20 um), 12 parts of aluminum nitride (D50= 2.5 um) and 3 parts of polyhedral aluminum oxide (D50=0.30um), adding a curing agent MeTHPA accounting for 10% of the weight of powder and an accelerator MP-302 per mill, putting the mixture into a planetary ball mill for low-speed mixing, grinding zirconia beads with the diameter of 1mm for 180min, and rotating at 150rpm to obtain epoxy resin composite slurry A;
(4) high-speed vacuum defoaming: adding the epoxy resin composite slurry A in the step (3) into a high-speed vacuum defoaming machine for defoaming, adding 0.3mm of zirconia beads, and defoaming at the rotating speed of 2000rpm for 45min to obtain epoxy resin composite slurry B;
(5) pouring-curing: and (3) adding the epoxy resin composite slurry B in the step (4) into a stainless steel grinding tool for curing treatment, pre-curing for 1h at 170 ℃, and post-curing for 7h at 150 ℃ to obtain the polyhedral monocrystalline alumina/aluminum nitride/epoxy resin heat-conducting composite material.
Example 2
(1) The formula comprises the following components in parts by weight: 61 parts of polyhedral single-crystal alumina (D50= 22 um), 15 parts of aluminum nitride (D50= 3.5 um) and 4 parts of polyhedral single-crystal alumina (D50=0.35 um);
(2) modification: adding 1% A-187 of the polyhedral single-crystal alumina (D50= 22 um), 5% A-187 of the polyhedral single-crystal alumina (D50=0.35um), 3% A-187 of the aluminum nitride (D50= 3.5 um) and modifying at 120 ℃ for 45min to obtain modified inorganic heat-conducting powder;
(3) and (3) low-speed mixing: taking 10 parts of E51 epoxy resin, 61 parts of modified polyhedral aluminum oxide (D50= 22 um), 15 parts of aluminum nitride (D50= 3.5 um) and 4 parts of polyhedral aluminum oxide (D50=0.35um), adding 8% of curing agent MeTHHA and accelerator MP-102.5 per mill by weight of powder, putting the mixture into a planetary ball mill for low-speed mixing, grinding the mixture into 2.0mm zirconia beads, mixing for 120min, and rotating at the speed of 130rpm to obtain epoxy resin composite slurry A;
(4) high-speed vacuum defoaming: adding the epoxy resin composite slurry A in the step (3) into a high-speed vacuum defoaming machine for defoaming, wherein the defoaming time is 30min, adding 0.6mm zirconium oxide beads, the defoaming time is 60min, and the rotating speed is 1500rpm, so as to obtain epoxy resin composite slurry B;
(5) pouring-curing: and (3) adding the epoxy resin composite slurry B in the step (4) into a stainless steel grinding tool for curing treatment, pre-curing for 1h at 170 ℃, and post-curing for 7h at 150 ℃ to obtain the polyhedral monocrystalline alumina/aluminum nitride/epoxy resin heat-conducting composite material.
Example 3
(1) The formula comprises the following components in parts by weight: 65 parts of polyhedral single-crystal alumina (D50= 18 um), 16 parts of aluminum nitride (D50= 4.5 um) and 4 parts of polyhedral single-crystal alumina (D50=0.25 um);
(2) modification: adding 1.5% of A-187 by weight of the powder into the polyhedral single-crystal alumina (D50= 18 um), adding 4.5% of A-187 by weight of the powder into the polyhedral single-crystal alumina (D50=0.25um), adding 2.5% of A-187 by weight of the powder into the aluminum nitride (D50= 4.5 um), and modifying for 45min at 120 ℃ to obtain modified inorganic heat-conducting powder;
(3) and (3) low-speed mixing: taking 10 parts of E51 epoxy resin, 65 parts of modified polyhedral aluminum oxide (D50= 18 um), 16 parts of aluminum nitride (D50= 4.5 um), 4 parts of polyhedral aluminum oxide (D50=0.25um), adding 8% of curing agent DIDY (by weight of powder), 4% of accelerator 2-ethyl-4-methylimidazole and 30% of polar solvent DMF, putting into a planetary ball mill for low-speed mixing, grinding into 0.6mm zirconium oxide beads, wherein the mixing time is 170min, and the rotating speed is 200rpm, and obtaining epoxy resin composite slurry A;
(4) high-speed vacuum defoaming: adding the epoxy resin composite slurry A in the step (3) into a high-speed vacuum defoaming machine for defoaming, wherein the defoaming time is 60min, adding 0.3mm zirconium oxide beads, the defoaming time is 60min, and the rotating speed is 2500rpm to obtain epoxy resin composite slurry B;
(5) pouring-curing: and (3) adding the epoxy resin composite slurry in the step (4) into a stainless steel grinding tool for curing treatment, precuring for 1h at 170 ℃, and curing for 7h after 150 ℃ to obtain the polyhedral monocrystalline alumina/aluminum nitride/epoxy resin heat-conducting composite material.
Claims (7)
1. A polyhedral single crystal alumina/aluminum nitride/epoxy resin heat conduction composite material is characterized by being prepared from the following raw materials in percentage by weight:
2. the preparation method of the polyhedral single-crystal alumina/aluminum nitride/epoxy resin heat-conducting composite material according to claim 1, which is characterized by comprising the following steps:
(1) weighing the raw materials according to the proportion for later use;
(2) modification: carrying out dry modification treatment on polyhedral single crystal aluminum oxide and aluminum nitride powder;
(3) and (3) low-speed mixing: putting the epoxy resin, the polyhedral monocrystalline aluminum oxide and aluminum nitride powder, the curing agent and the accelerator into a star mill for low-speed mixing to obtain epoxy resin composite slurry A;
(4) vacuum defoaming: adding the epoxy resin composite slurry obtained in the step (3) into a vacuum defoaming machine for defoaming to obtain epoxy resin composite slurry B;
(5) pouring-curing: and (3) adding the epoxy resin composite slurry in the step (4) into a stainless steel grinding tool for curing treatment to obtain the polyhedral monocrystalline aluminum oxide/aluminum nitride/epoxy resin heat-conducting composite material.
3. The preparation method of the polyhedral single-crystal alumina/aluminum nitride/epoxy resin heat-conducting composite material according to claim 2, which is characterized by comprising the following steps of: in the step (1), the coupling agent for modifying the polyhedral single-crystal aluminum oxide and the aluminum nitride is A-187, and the addition amount of the coupling agent is 1-6% of the weight of the powder.
4. The preparation method of the polyhedral single-crystal alumina/aluminum nitride/epoxy resin heat-conducting composite material according to claim 2, which is characterized by comprising the following steps of: the curing agent in the step (2) is one or more of methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, methyl nadic anhydride and dicyandiamide.
5. The preparation method of the polyhedral single-crystal alumina/aluminum nitride/epoxy resin heat-conducting composite material according to any one of claims 2 to 4, which is characterized by comprising the following steps of: in the step (2), the curing accelerator is any one or more of 2-ethyl-4-methylimidazole, 2-methylimidazole, DMP-10, DMP-20 and DMP-30.
6. The preparation method of the polyhedral single-crystal alumina/aluminum nitride/epoxy resin heat-conducting composite material according to any one of claims 2 to 4, which is characterized by comprising the following steps of: and (3) mixing at low speed by adopting a planetary ball mill, wherein the milling medium is 0.3-2 mm of zirconia beads, the mixing time is 60-240 min, and the rotating speed is 100-300 rpm.
7. The preparation method of the polyhedral single-crystal alumina/aluminum nitride/epoxy resin heat-conducting composite material according to any one of claims 2 to 4, which is characterized by comprising the following steps of: defoaming by adopting a high-speed vacuum defoaming machine, wherein 0.3-0.6mm of zirconia beads are added, the mixing time is 30-120 min, and the rotating speed is 1000-3000 rpm.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04323889A (en) * | 1991-04-23 | 1992-11-13 | Matsushita Electric Works Ltd | Metal base wiring board |
| JP2013014671A (en) * | 2011-07-01 | 2013-01-24 | Hitachi Chemical Co Ltd | Resin composition sheet, resin composition sheet with metal foil, metal base wiring board material, metal base wiring board and electronic member |
| CN106590549A (en) * | 2016-12-01 | 2017-04-26 | 昆山裕凌电子科技有限公司 | High-thermal conductivity graphene composite interface material and preparation method thereof |
| WO2021200490A1 (en) * | 2020-03-31 | 2021-10-07 | デンカ株式会社 | Alumina powder, resin composition, and heat dissipation component |
-
2021
- 2021-09-25 CN CN202111124948.4A patent/CN113861620A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04323889A (en) * | 1991-04-23 | 1992-11-13 | Matsushita Electric Works Ltd | Metal base wiring board |
| JP2013014671A (en) * | 2011-07-01 | 2013-01-24 | Hitachi Chemical Co Ltd | Resin composition sheet, resin composition sheet with metal foil, metal base wiring board material, metal base wiring board and electronic member |
| CN106590549A (en) * | 2016-12-01 | 2017-04-26 | 昆山裕凌电子科技有限公司 | High-thermal conductivity graphene composite interface material and preparation method thereof |
| WO2021200490A1 (en) * | 2020-03-31 | 2021-10-07 | デンカ株式会社 | Alumina powder, resin composition, and heat dissipation component |
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