CN113857139A - Cryopump purge - Google Patents
Cryopump purge Download PDFInfo
- Publication number
- CN113857139A CN113857139A CN202111064372.7A CN202111064372A CN113857139A CN 113857139 A CN113857139 A CN 113857139A CN 202111064372 A CN202111064372 A CN 202111064372A CN 113857139 A CN113857139 A CN 113857139A
- Authority
- CN
- China
- Prior art keywords
- cryopump
- liquid medicine
- purge
- cleaning
- acetone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010926 purge Methods 0.000 title claims description 11
- 239000007788 liquid Substances 0.000 claims abstract description 23
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000003814 drug Substances 0.000 claims abstract description 20
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000243 solution Substances 0.000 claims abstract description 12
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000002360 preparation method Methods 0.000 claims abstract description 11
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims abstract description 4
- 238000007664 blowing Methods 0.000 claims abstract description 3
- 238000003756 stirring Methods 0.000 claims description 6
- 235000009161 Espostoa lanata Nutrition 0.000 claims description 5
- 240000001624 Espostoa lanata Species 0.000 claims description 5
- 238000007598 dipping method Methods 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 17
- 238000004140 cleaning Methods 0.000 abstract description 16
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- 238000005498 polishing Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000012528 membrane Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention relates to the technical field of cleaning, and discloses a cryopump cleaning method, which comprises the following steps: s1: preparing a liquid medicine from a pure NMP solution, n-butanol and ethylene glycol ethyl ether according to the volume ratio of 6:3: 1; s2: carrying out ultrasonic cleaning on the cryopump for more than 2 hours by using a preparation liquid medicine; s3: rinsing with pure water for 5 minutes to remove residual preparation liquid medicine on the cryopump; s4: blowing the film by using compressed air, and detecting the condition of residual films on the surface by using an ultraviolet lamp; s5: after the surface of the cryopump is cleaned by the steam gun, repeating the steps S2-S4 again; s6: the cryopump surfaces were wiped with acetone to remove particles. The cryopump cleaning method can solve the problems that the conventional mainstream cleaning technology adopts a liquid cleaning and mechanical polishing method, but the film layer is not thoroughly cleaned or the surface corrosion-resistant coating is scratched.
Description
Technical Field
The invention relates to the technical field of cleaning, in particular to cryopump cleaning.
Background
The cryopump is used as precision equipment for quickly establishing low vacuum in an oversized cavity and is widely applied to coating and evaporation process cavities. The PI glue can be attached to the cryopump in the using process, and the cryopump can be continuously used only by cleaning when the film layer of the cryopump reaches a certain thickness. The existing mainstream cleaning technology adopts a liquid cleaning and mechanical polishing method, but the problems of incomplete cleaning of a film layer or scratching of a corrosion-resistant coating on the surface are easy to occur.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the cryogenic pump cleaning method, has the advantage of thoroughly cleaning the film layer, solves the problem that the film layer is not thoroughly cleaned or the surface corrosion-resistant coating is scratched easily due to the adoption of a liquid cleaning and mechanical polishing method in the current mainstream cleaning technology, and reduces the local corrosion phenomenon in the subsequent use of the cryogenic pump.
(II) technical scheme
In order to thoroughly clean the film layer, the invention provides the following technical scheme: cryopump purge, comprising the steps of:
s1: preparing a liquid medicine from a pure NMP solution, n-butanol and ethylene glycol ethyl ether according to the volume ratio of 6:3: 1;
s2: carrying out ultrasonic cleaning on the cryopump for more than 2 hours by using a preparation liquid medicine;
s3: rinsing with pure water for 5 minutes to remove residual preparation liquid medicine on the cryopump;
s4: blowing the film by using compressed air, and detecting the condition of residual films on the surface by using an ultraviolet lamp;
s5: after the surface of the cryopump is cleaned by the steam gun, repeating the steps S2-S4 again;
s6: the cryopump surfaces were wiped with acetone to remove particles.
Preferably, in the step S1, the pure NMP solution is an industrial grade pure NMP solution, and the raw material for preparing the chemical solution is stirred by a vacuum stirrer, wherein the stirring speed is 2300 rpm and the stirring time is 10 minutes.
Preferably, in the step S2, the cryopump is placed in the ultrasonic tank, the dispensing chemical is added to submerge the cryopump, and the dispensing chemical is heated to 60 ℃ and then subjected to ultrasonic cleaning.
Preferably, in the step S3, the cryopump taken out is rinsed by a pure water tank.
Preferably, in the S4 step, the compressed air is blown to the surface of the cryopump at an angle of inclination of 45 ° in one direction.
Preferably, in the step S5, the step is repeated 1 time.
Preferably, in the step S6, the surface of the cryopump is wiped with acetone by dipping the surface with a cotton ball, and the cotton ball after wiping is discarded without repeatedly dipping the acetone.
(III) advantageous effects
Compared with the prior art, the invention provides the cryogenic pump cleaning, and has the following beneficial effects:
the cryopump is cleaned, an industrial grade pure NMP solution and n-butyl alcohol can dissolve an organic membrane layer on the surface of the cryopump, ethylene glycol ethyl ether is used as a surfactant, and ultrasonic cleaning promotes medicinal water to dissolve most of the membrane layer; the residual film layer after the first ultrasonic cleaning with the liquid medicine is cleaned by a steam-water gun, the binding force between the film layer and the substrate can be weakened, the film layer can be removed by the second ultrasonic cleaning with the liquid medicine, the removal rate of the film layer on the surface of the low-temperature pump reaches 99.9 percent, a mechanical polishing method is not used, and the damage to the corrosion-resistant coating on the surface of the low-temperature pump is avoided.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Cryopump purge, comprising the steps of:
s1: mixing an industrial grade pure NMP solution, n-butanol and ethylene glycol ethyl ether according to the volume ratio of 6:3:1, stirring the mixed raw materials by a vacuum stirrer at the stirring speed of 2300 revolutions per minute for 10 minutes, and preparing a liquid medicine;
s2: placing the cryopump into an ultrasonic groove, adding a preparation liquid medicine to submerge the cryopump, heating the preparation liquid medicine to 60 ℃, and then performing ultrasonic cleaning for more than 2 hours;
s3: putting the taken-out cryopump into a pure water tank for rinsing for 5 minutes, and removing residual preparation liquid medicine on the cryopump;
s4: the method comprises the steps of drying surface moisture by using compressed air, drying the surface of the cryopump by the compressed air in one direction at an inclined angle of 45 degrees, enabling water on the surface of the cryopump to flow in one direction, preventing water drops on the surface of the cryopump from being blown by wind and being disordered, improving the drying effect, and then checking the surface residual film condition by using an ultraviolet lamp;
s5: after the surface of the cryopump is cleaned by the steam gun, repeating the steps S2-S4 for 1 time;
s6: the surface of the cryopump is wiped by using acetone to remove particles, and the cotton ball after wiping is discarded without repeatedly dipping the acetone for packaging.
The cryopump is cleaned, an industrial grade pure NMP solution and n-butyl alcohol can dissolve an organic membrane layer on the surface of the cryopump, ethylene glycol ethyl ether is used as a surfactant, and ultrasonic cleaning promotes medicinal water to dissolve most of the membrane layer; the residual film layer after the first ultrasonic cleaning with the liquid medicine is cleaned by a steam-water gun, the binding force between the film layer and the substrate can be weakened, the film layer can be removed by the second ultrasonic cleaning with the liquid medicine, the removal rate of the film layer on the surface of the low-temperature pump reaches 99.9 percent, a mechanical polishing method is not used, and the damage to the corrosion-resistant coating on the surface of the low-temperature pump is avoided.
It is to be noted that the term "comprises," "comprising," or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. Cryopump purge, comprising the steps of:
s1: preparing a liquid medicine from a pure NMP solution, n-butanol and ethylene glycol ethyl ether according to the volume ratio of 6:3: 1;
s2: carrying out ultrasonic cleaning on the cryopump for more than 2 hours by using a preparation liquid medicine;
s3: rinsing with pure water for 5 minutes to remove residual preparation liquid medicine on the cryopump;
s4: blowing the film by using compressed air, and detecting the condition of residual films on the surface by using an ultraviolet lamp;
s5: after the surface of the cryopump is cleaned by the steam gun, repeating the steps S2-S4 again;
s6: the cryopump surfaces were wiped with acetone to remove particles.
2. The cryopump purge of claim 1, wherein: in the step S1, the pure NMP solution is an industrial grade pure NMP solution, and the raw materials for preparing the liquid medicine are stirred by a vacuum stirrer, wherein the stirring speed is 2300 rpm, and the stirring time is 10 minutes.
3. The cryopump purge of claim 1, wherein: and in the step S2, the cryopump is placed in an ultrasonic tank, the preparation liquid medicine is added to submerge the cryopump, and the preparation liquid medicine is heated to 60 ℃ and then is subjected to ultrasonic cleaning.
4. The cryopump purge of claim 1, wherein: in the step S3, the cryopump taken out is rinsed by a pure water tank.
5. The cryopump purge of claim 1, wherein: in the step S4, the compressed air is blown to the surface of the cryopump at an angle of inclination of 45 ° in one direction.
6. The cryopump purge of claim 1, wherein: in the step S5, the step is repeated 1 time.
7. The cryopump purge of claim 1, wherein: in the step S6, the surface of the cryopump is wiped with acetone by dipping the cotton ball with acetone, and the cotton ball after wiping is discarded without repeatedly dipping acetone.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111064372.7A CN113857139A (en) | 2021-09-10 | 2021-09-10 | Cryopump purge |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111064372.7A CN113857139A (en) | 2021-09-10 | 2021-09-10 | Cryopump purge |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113857139A true CN113857139A (en) | 2021-12-31 |
Family
ID=78995442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111064372.7A Pending CN113857139A (en) | 2021-09-10 | 2021-09-10 | Cryopump purge |
Country Status (1)
Country | Link |
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CN (1) | CN113857139A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114904835A (en) * | 2022-05-06 | 2022-08-16 | 合肥升滕半导体技术有限公司 | Method for cleaning ceramic insulating ring suitable for physical vapor deposition process |
CN114985366A (en) * | 2022-05-25 | 2022-09-02 | 合肥升滕半导体技术有限公司 | Method for cleaning silicon carbide part suitable for dry etching process |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1399242A (en) * | 2001-07-25 | 2003-02-26 | 胜华科技股份有限公司 | Eliminating method of anisotropic conductive adhesive tape of LCD |
CN102782012A (en) * | 2010-02-26 | 2012-11-14 | 佳能株式会社 | Optical member, polyimide, method for manufacturing optical member, and method for producing polyimide |
CN103008310A (en) * | 2012-12-26 | 2013-04-03 | 西安北方捷瑞光电科技有限公司 | Non-defect optical element cleaning method |
CN103157619A (en) * | 2011-12-15 | 2013-06-19 | 东友Fine-Chem股份有限公司 | Washing method for mask used in vapor deposition step in production of organic EL device and cleaning agent |
CN107037697A (en) * | 2016-02-03 | 2017-08-11 | 李长荣化学工业股份有限公司 | Composition for removing polyimide, use thereof and method for removing polyimide by using composition |
CN107983717A (en) * | 2017-12-20 | 2018-05-04 | 东莞丰卓机电设备有限公司 | A kind of full-automatic demoulding line for being used to remove workpiece surface mucous membrane |
CN108906763A (en) * | 2018-05-16 | 2018-11-30 | 深圳仕上电子科技有限公司 | Utilize the method for acetone detergent solution removing workpiece surface film |
CN109622503A (en) * | 2018-12-04 | 2019-04-16 | 天津津航技术物理研究所 | A kind of lossless cleaning method after laser gyro cavity optical manufacturing |
CN110941142A (en) * | 2014-03-17 | 2020-03-31 | 旭化成株式会社 | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device |
-
2021
- 2021-09-10 CN CN202111064372.7A patent/CN113857139A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1399242A (en) * | 2001-07-25 | 2003-02-26 | 胜华科技股份有限公司 | Eliminating method of anisotropic conductive adhesive tape of LCD |
CN102782012A (en) * | 2010-02-26 | 2012-11-14 | 佳能株式会社 | Optical member, polyimide, method for manufacturing optical member, and method for producing polyimide |
CN103157619A (en) * | 2011-12-15 | 2013-06-19 | 东友Fine-Chem股份有限公司 | Washing method for mask used in vapor deposition step in production of organic EL device and cleaning agent |
CN103008310A (en) * | 2012-12-26 | 2013-04-03 | 西安北方捷瑞光电科技有限公司 | Non-defect optical element cleaning method |
CN110941142A (en) * | 2014-03-17 | 2020-03-31 | 旭化成株式会社 | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device |
CN107037697A (en) * | 2016-02-03 | 2017-08-11 | 李长荣化学工业股份有限公司 | Composition for removing polyimide, use thereof and method for removing polyimide by using composition |
CN107983717A (en) * | 2017-12-20 | 2018-05-04 | 东莞丰卓机电设备有限公司 | A kind of full-automatic demoulding line for being used to remove workpiece surface mucous membrane |
CN108906763A (en) * | 2018-05-16 | 2018-11-30 | 深圳仕上电子科技有限公司 | Utilize the method for acetone detergent solution removing workpiece surface film |
CN109622503A (en) * | 2018-12-04 | 2019-04-16 | 天津津航技术物理研究所 | A kind of lossless cleaning method after laser gyro cavity optical manufacturing |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114904835A (en) * | 2022-05-06 | 2022-08-16 | 合肥升滕半导体技术有限公司 | Method for cleaning ceramic insulating ring suitable for physical vapor deposition process |
CN114985366A (en) * | 2022-05-25 | 2022-09-02 | 合肥升滕半导体技术有限公司 | Method for cleaning silicon carbide part suitable for dry etching process |
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PB01 | Publication | ||
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RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211231 |
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