CN113835501A - Server heat dissipation method and device, BMC and computer readable storage medium - Google Patents
Server heat dissipation method and device, BMC and computer readable storage medium Download PDFInfo
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Abstract
The application discloses a server heat dissipation method which comprises the steps of obtaining real-time power and real-time temperature of components in a server at intervals; predicting a predicted temperature of the component based on the real-time power and the real-time temperature; and adjusting the rotating speed of the fan according to the relation between the predicted temperature and the highest working temperature of the component, so that the fan can radiate the server. The server heat dissipation method in this application obtains the real-time power and the real-time temperature of part through the interval, and then predicts the prediction temperature of part according to real-time power and real-time temperature, realizes the prediction to the part temperature, and then adjusts the rotational speed of fan according to the relation of the temperature that predicts and the part highest temperature, owing to can predict the temperature of part in advance, can regulate and control the fan in advance in this application, avoid too high temperature to influence the performance of part, bring better heat dissipation for the server. The present application also provides a device, a BMC, and a computer-readable storage medium having the above advantages.
Description
Technical Field
The present application relates to the field of server heat dissipation technologies, and in particular, to a server heat dissipation method, apparatus, BMC, and computer-readable storage medium.
Background
Especially with the development of artificial intelligence, big data and video APP services in recent years, some high-power component interconnect express (PCIe) components such as a GPU (Graphics Processing Unit), a high-bandwidth network card and the like are increasingly mounted in a server system, and it is important to regulate and control heat dissipation of the server. At present, when heat is dissipated from a service, the temperature of each component is measured, each temperature is compared with a set temperature threshold, and the rotating speed of a fan is adjusted according to the comparison result to dissipate the heat. The temperature of the components is measured in real time through the sensors, then the fans are regulated and controlled, the regulation and control of the fans need a certain time, particularly for the condition that the temperature of the components is higher, the components are already at higher temperature, and then the heat dissipation regulation and control are carried out, so that the higher temperature easily causes adverse effects on the performance of the components, and further affects the performance of the server.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The application aims to provide a server heat dissipation method, a server heat dissipation device, a BMC and a computer readable storage medium, so that the temperature of components in a server can be estimated and heat dissipation can be carried out in time.
In order to solve the above technical problem, the present application provides a server heat dissipation method, including:
acquiring real-time power and real-time temperature of components in the server at intervals;
predicting a predicted temperature of the component based on the real-time power and the real-time temperature;
and adjusting the rotating speed of the fan according to the relation between the predicted temperature and the highest working temperature of the component, so that the fan can radiate the server.
Optionally, the predicting the predicted temperature of the component according to the real-time power and the real-time temperature includes:
fitting a temperature prediction polynomial for the component based on the real-time power and the real-time temperature;
determining the predicted temperature from the temperature prediction polynomial;
wherein the temperature prediction polynomial is:
Tcard=An Pcard n+An-1 Pcard n-1+…+A1 Pcard+A0
in the formula, A0,A1,…,AnIs a coefficient, PcardFor real-time power, TcardIs the predicted temperature.
Optionally, before predicting the predicted temperature of the component according to the real-time power and the real-time temperature, the method further includes:
reading the model number of the component;
correspondingly, the fitting the temperature prediction polynomial of the component according to the real-time power and the real-time temperature comprises:
fitting the temperature prediction polynomial of the component corresponding to the model according to the real-time power and the real-time temperature.
Optionally, the adjusting the rotation speed of the fan according to the relationship between the predicted temperature and the highest operating temperature of the component so that the fan dissipates heat from the server includes:
determining a difference between the predicted temperature and a maximum operating temperature of the component;
determining the fan rotating speed adjusting degree corresponding to the difference value according to the relation between the preset difference value and the fan rotating speed adjusting degree;
and adjusting the rotating speed of the fan according to the adjusting degree of the rotating speed of the fan so that the fan can radiate the server.
Optionally, the method further includes:
when the difference value meets a preset condition, acquiring the current rotating speed of the fan;
and determining the initial rotating speed of the fan according to the current rotating speed.
Optionally, when the number of the current rotation speeds is multiple, the determining the initial rotation speed of the fan according to the current rotation speed includes:
and determining the average value of the current rotating speeds as the initial rotating speed.
Optionally, after determining the initial rotation speed of the fan according to the current rotation speed, the method further includes:
and sending the initial rotating speed, the names of the components and the corresponding models to a computer so that the computer can store the names of the components and the corresponding models of the initial rotating speed.
The present application further provides a BMC, comprising:
a memory for storing a computer program;
and the processor is used for realizing the steps of any one of the server heat dissipation methods when executing the computer program.
The present application further provides a computer-readable storage medium, having a computer program stored thereon, where the computer program, when executed by a processor, implements the steps of any of the server heat dissipation methods described above.
The application provides a server heat dissipation method, which comprises the following steps: acquiring real-time power and real-time temperature of components in the server at intervals; predicting a predicted temperature of the component based on the real-time power and the real-time temperature; and adjusting the rotating speed of the fan according to the relation between the predicted temperature and the highest working temperature of the component, so that the fan can radiate the server.
Therefore, the server heat dissipation method in the application can be used for acquiring the real-time power and the real-time temperature of the component at intervals, predicting the predicted temperature of the component according to the real-time power and the real-time temperature, predicting the temperature of the component, adjusting the rotating speed of the fan according to the relationship between the predicted temperature and the highest temperature of the component, and regulating and controlling the fan in advance due to the fact that the temperature of the component can be predicted in advance, so that the situation that the performance of the component is influenced by the overhigh temperature is avoided, and better heat dissipation is brought to the server.
In addition, the application also provides a device, a BMC and a computer readable storage medium with the advantages.
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For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flowchart of a server heat dissipation method according to an embodiment of the present disclosure;
fig. 2 is a flowchart illustrating a method for adjusting a rotation speed of a fan to dissipate heat according to an embodiment of the disclosure;
fig. 3 is a block diagram illustrating a heat dissipation device of a server according to an embodiment of the present disclosure;
fig. 4 is a block diagram of a BMC according to an embodiment of the present disclosure.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As described in the background section, in the prior art, when heat is dissipated from a service, the temperature of each component is measured, each temperature is compared with a set temperature threshold, and the rotation speed of a fan is adjusted according to the comparison result to dissipate the heat. The temperature of the components is measured in real time through the sensors, then the fans are regulated and controlled, the regulation and control of the fans need a certain time, particularly for the condition that the temperature of the components is higher, the components are already at higher temperature, and then the heat dissipation regulation and control are carried out, so that the higher temperature easily causes adverse effects on the performance of the components, and further affects the performance of the server.
In view of this, the present application provides a server heat dissipation method, please refer to fig. 1, where fig. 1 is a flowchart of a server heat dissipation method according to an embodiment of the present application, the method includes:
step S101: the real-time power and real-time temperature of the components in the server are acquired at intervals.
In the present application, the number of components is not limited, and may be one or a plurality of components, for example. Further, the types of components are not specifically limited in this application, and may be high-power PCIe components, such as a GPU and a high-bandwidth network card, or non-high-power components, such as a CPU (Central Processing Unit), a memory, and a hard disk.
It should be further noted that, in the present application, the time interval Δ T for acquiring the interval of the real-time power and the real-time temperature is not limited, and may be set by itself. For example Δ T may be 500ms, or 1s, etc. Further, the number of real-time power and real-time temperature is not specifically limited in this application, as the case may be.
The real-time power and real-time temperature of the interval acquisition component are: and acquiring real-time power, acquiring real-time temperature after delta T time, acquiring real-time power after delta T time, and repeating the steps until the quantity requirement is met.
Step S102: predicting a predicted temperature of the component based on the real-time power and the real-time temperature.
As an embodiment, said predicting a predicted temperature of said component based on said real-time power and said real-time temperature comprises:
fitting a temperature prediction polynomial for the component based on the real-time power and the real-time temperature;
determining the predicted temperature from the temperature prediction polynomial;
wherein the temperature prediction polynomial is:
Tcard=An Pcard n+An-1 Pcard n-1+…+A1 Pcard+A0 (1)
in the formula, A0,A1,…,AnIs a coefficient, PcardFor real-time power, TcardIs the predicted temperature.
The number of coefficients is not limited in the present application, for example, the number of coefficients may be 11, i.e., n is equal to 10, or the number of coefficients may be 16, i.e., n is equal to 15, and the larger the number is, the more accurate the predicted temperature is.
The specific values of all the coefficients in the formula (1) are obtained through the real-time power and the real-time temperature obtained at intervals, for example, when n is 10, 11 sets of real-time power and real-time temperature are read and are substituted into the formula (1), all the coefficients are obtained through solving an equation set, and then the read current real-time power is substituted into the formula (1), so that the real-time temperature after the next time interval can be predicted.
Step S103: and adjusting the rotating speed of the fan according to the relation between the predicted temperature and the highest working temperature of the component, so that the fan can radiate the server.
Specific adjustments to the fan speed are described below.
The server heat dissipation method in this application obtains the real-time power and the real-time temperature of part through the interval, and then predicts the prediction temperature of part according to real-time power and real-time temperature, realizes the prediction to the part temperature, and then adjusts the rotational speed of fan according to the relation of the temperature that predicts and the part highest temperature, owing to can predict the temperature of part in advance, can regulate and control the fan in advance in this application, avoid too high temperature to influence the performance of part, bring better radiating effect for the server.
On the basis of the above embodiments, in an embodiment of the present application, before predicting the predicted temperature of the component according to the real-time power and the real-time temperature, the method further includes:
reading the model number of the component;
correspondingly, the fitting the temperature prediction polynomial of the component according to the real-time power and the real-time temperature comprises:
fitting the temperature prediction polynomial of the component corresponding to the model according to the real-time power and the real-time temperature.
Because the same type of parts can be divided into different types, and the parts of different types are different in power, size, thickness and the like, the heat generated by the parts of different types is different, and the temperature is different. In the embodiment, the parts of different models are distinguished, so that the parts of different models are subjected to heat dissipation to different degrees.
Further, after fitting the temperature prediction polynomial of the component corresponding to the model, the method further includes:
and sending the model, the name of the component and the temperature prediction polynomial corresponding to the model to a computer so that the computer stores the model, the name of the component and the temperature prediction polynomial corresponding to the model.
When the components with the same model are subsequently cooled again, the stored temperature prediction polynomial can be directly called, the temperature can be directly predicted without fitting again, and the rotating speed of the fan can be adjusted.
As an embodiment, referring to fig. 2, the adjusting the rotation speed of the fan according to the relationship between the predicted temperature and the maximum operating temperature of the component so that the fan dissipates heat to the server includes:
step S201: determining a difference between the predicted temperature and a maximum operating temperature of the component.
The maximum operating temperature of a component refers to the maximum temperature at which the component can operate, and the maximum operating temperature is different for different components. The maximum operating temperature of the component is known.
The difference is equal to the current temperature minus the maximum operating temperature of the component.
Step S202: and determining the fan rotating speed adjusting degree corresponding to the difference value according to the relation between the preset difference value and the fan rotating speed adjusting degree.
Step S203: and adjusting the rotating speed of the fan according to the adjusting degree of the rotating speed of the fan so that the fan can radiate the server.
The relation between the preset difference value and the adjusting degree of the rotating speed of the fan is not specifically limited in the application, and the relation can be a table, a curve and self-setting.
When the difference is larger than or equal to the first difference threshold, the rotating speed is increased by y 1%;
when the difference is greater than or equal to the second difference threshold and smaller than the first difference threshold, the rotating speed is increased by y 2%;
when the difference is greater than or equal to the third difference threshold and smaller than the second difference threshold, the rotating speed is kept unchanged;
when the difference is greater than or equal to the fourth difference threshold and less than the third difference threshold, the rotating speed is reduced by y 3%;
when the difference is smaller than a fourth difference threshold, the rotating speed is reduced by y 4%;
the first difference threshold, the second difference threshold, the third difference threshold and the fourth difference threshold are sequentially reduced in size, and the second difference threshold is zero.
Further, the first difference threshold, the second difference threshold, the third difference threshold, and the fourth difference threshold are not limited in this application, as the case may be. For example, the first difference threshold may be 1 ℃, the third difference threshold may be-1 ℃, and the fourth difference threshold may be-2 ℃; alternatively, the first difference threshold may be 3 deg.C, the third difference threshold may be-2 deg.C, the fourth difference threshold may be-3 deg.C, and so on. Similarly, y1, y2, y3 and y4 are not specifically limited in this application, and may be set by themselves. For example, y1, y2, y3, y4 are 10, 5, 10, respectively, or 8, 5, 4, 8, respectively, and so on.
In this embodiment, the difference between the temperature and the maximum operating temperature of the component is predicted first, and then the fan speed adjustment degree of the fan is obtained according to the difference and the relationship between the preset difference and the fan speed adjustment degree, and then the fan speed is adjusted according to the fan speed adjustment degree.
However, the method for adjusting the fan speed is not limited in the present application, and as another embodiment, the method may be further controlled as follows: and when the predicted temperature is lower than the highest working temperature of the component and the difference between the predicted temperature and the highest working temperature of the component is lower than the preset threshold, reducing the rotating speed of the fan.
The fan has an initial rotation speed when radiating, and the determination process of the initial rotation speed is as follows:
when the difference value meets a preset condition, acquiring the current rotating speed of the fan;
and determining the initial rotating speed of the fan according to the current rotating speed.
It should be noted that, in the present application, the preset condition is not specifically limited, and may be set. For example, when the difference is greater than or equal to the third difference threshold and less than the second difference threshold, or the difference is equal to the second difference threshold, etc.
Further, in order to improve the accuracy of the initial rotation speed, when the number of the current rotation speeds is multiple, the determining the initial rotation speed of the fan according to the current rotation speed includes:
and determining the average value of the current rotating speeds as the initial rotating speed.
On the basis of the foregoing embodiment, in an embodiment of the present application, after determining the initial rotation speed of the fan according to the current rotation speed, the method further includes:
and sending the initial rotating speed, the names of the components and the corresponding models to a computer so that the computer can store the initial rotating speed, the names of the components and the corresponding models.
When the components with the same model are subsequently cooled again, the stored initial rotating speed of the fan is directly called to cool, and the cooling is very convenient.
The heat dissipation method of the server in the present application is described below with PCIe components.
Step 1, designing a PCIe component power monitoring circuit on a motherboard, for example, using an INA233AIDGSR scheme, and obtaining a model of a PCIe component by a BMC (Baseboard Management Controller);
step 2, the BMC acquires real-time power of the PCIe component, the interval delta T is 500ms, acquires real-time temperature of the PCIe component, and constantly reads the real-time power and the real-time temperature at intervals by taking delta T time as an interval;
step 3, fitting the established polynomial according to the acquired real-time power and real-time temperature to obtain a temperature prediction polynomial corresponding to the model of the PCIe component, namely a formula (1);
step 4, substituting the acquired real-time power into a formula to obtain a predicted temperature T after the time delta T is 500mscardI.e. the predicted real-time temperature;
step 5, if Tcard-TmaxThe rotating speed of the fan is increased by 10 percent when the temperature is more than or equal to 1 ℃; t is not less than 0 DEG Ccard-TmaxIf the temperature is less than 1 ℃, the rotating speed of the fan is increased by 5 percent; if T is less than or equal to-2 DEG Ccard-TmaxIf the temperature is lower than-1 ℃, reducing the rotating speed of the fan by 5 percent; if T iscard-TcardIf the temperature is lower than-2 ℃, reducing the rotating speed of the fan by 10 percent; if T is less than or equal to-1 ℃card-TmaxIf the temperature is less than 0 ℃, the rotating speed of the fan is kept unchanged; wherein T ismaxFor the maximum operating temperature of the PCIe component,
step 6, if the temperature is less than or equal to T at minus 1 DEG Ccard-Tmax<And if the temperature is 0 ℃, recording the SPEED of the current fan rotating SPEED value by the BMC, and calculating the rotating SPEED average value according to the recorded n times of current fan rotating SPEED values meeting the conditions, wherein the average value calculation formula is as follows:
Aspeed=(SPEEDn+SPEEDn-1+…+SPEED1)/n (2)
and 7, uploading the rotating speed average value, the PCIe component model and the temperature prediction polynomial to computer software by the BMC for storage.
In the following, the server heat dissipation device provided by the embodiment of the present application is introduced, and the server heat dissipation device described below and the server heat dissipation method described above may be referred to correspondingly.
Fig. 3 is a block diagram of a server heat dissipation device according to an embodiment of the present application, where the server heat dissipation device according to fig. 3 may include:
an obtaining module 100, configured to obtain real-time power and real-time temperature of components in a server at intervals;
a prediction module 200 for predicting a predicted temperature of the component based on the real-time power and the real-time temperature;
and the adjusting module 300 adjusts the rotating speed of the fan according to the relationship between the predicted temperature and the highest working temperature of the component, so that the fan can radiate the heat of the server.
The server heat dissipation device of this embodiment is used to implement the aforementioned server heat dissipation method, and therefore specific implementations of the server heat dissipation device can be found in the embodiments of the server heat dissipation method in the foregoing, for example, the obtaining module 100, the predicting module 200, and the adjusting module 300 are respectively used to implement steps S101, S102, and S103 in the server heat dissipation method, and therefore, the specific implementations thereof may refer to descriptions of corresponding embodiments of each part, and are not described herein again.
The server heat abstractor in this application obtains the real-time power and the real-time temperature of part through the interval, and then predicts the prediction temperature of part according to real-time power and real-time temperature, realizes the prediction to the part temperature, and then adjusts the rotational speed of fan according to the temperature that predicts and the relation of part highest temperature, owing to can predict the temperature of part in advance, can regulate and control the fan in advance in this application, avoid too high temperature to influence the performance of part, bring better heat dissipation for the server.
Optionally, the prediction module 200 specifically includes:
a fitting unit for fitting a temperature prediction polynomial of the component according to the real-time power and the real-time temperature;
a first determination unit configured to determine the predicted temperature from the temperature prediction polynomial;
wherein the temperature prediction polynomial is:
Tcard=An Pcard n+An-1 Pcard n-1+…+A1 Pcard+A0 (1)
in the formula, A0,A1,…,AnIs a coefficient, PcardFor real-time power, TcardIs the predicted temperature.
Optionally, the server heat dissipation device further includes:
the reading module is used for reading the model of the component;
correspondingly, the fitting unit is specifically configured to fit the temperature prediction polynomial of the component corresponding to the model according to the real-time power and the real-time temperature.
Optionally, the adjusting module 300 includes:
a second determination unit for determining a difference between the predicted temperature and a maximum operating temperature of the component;
the third determining unit is used for determining the fan rotating speed adjusting degree corresponding to the difference value according to the relation between the preset difference value and the fan rotating speed adjusting degree;
and the adjusting unit is used for adjusting the rotating speed of the fan according to the rotating speed adjusting degree of the fan so that the fan can radiate the server.
Optionally, the server heat dissipation device further includes:
the rotating speed obtaining module is used for obtaining the current rotating speed of the fan when the difference value meets a preset condition;
and the rotating speed determining module is used for determining the initial rotating speed of the fan according to the current rotating speed.
Optionally, when the number of the current rotation speeds is multiple, the rotation speed determination module is configured to determine an average value of the multiple current rotation speeds as the initial rotation speed.
Optionally, the server heat dissipation device further includes:
and the sending module is used for sending the initial rotating speed, the names of the components and the corresponding models to a computer so that the computer can store the names of the components and the corresponding models of the initial rotating speed.
In the following, the BMC provided in the embodiment of the present application is introduced, and the BMC described below and the server heat dissipation method described above may be referred to correspondingly. Fig. 4 is a block diagram of a BMC provided in the present application, including:
a memory 11 for storing a computer program;
the processor 12 is configured to implement the steps of the server heat dissipation method according to any one of the above embodiments when executing the computer program.
BMC in this application obtains the real-time power and the real-time temperature of part through the interval, and then predicts the prediction temperature of part according to real-time power and real-time temperature, realizes the prediction to the part temperature, and then adjusts the rotational speed of fan according to the temperature that predicts and the relation of part highest temperature, owing to can predict the temperature of part in advance, can regulate and control the fan in advance in this application, avoid too high temperature to influence the performance of part, bring better heat dissipation for the server.
The following describes a computer-readable storage medium provided in an embodiment of the present application, and the computer-readable storage medium described below and the server heat dissipation method described above may be referred to correspondingly.
A computer-readable storage medium, having a computer program stored thereon, where the computer program is executed by a processor to implement the steps of the server heat dissipation method according to any of the above embodiments.
The computer-readable storage medium in this application obtains the real-time power and the real-time temperature of part through the interval, and then predicts the prediction temperature of part according to real-time power and real-time temperature, realizes the prediction to the part temperature, and then adjusts the rotational speed of fan according to the relation of the temperature that predicts and the part highest temperature, owing to can predict the temperature of part in advance, can regulate and control the fan in advance in this application, avoid too high temperature to influence the performance of part, bring better heat dissipation for the server.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The server heat dissipation method, the server heat dissipation device, the BMC, and the computer-readable storage medium provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. A server heat dissipation method is characterized by comprising the following steps:
acquiring real-time power and real-time temperature of components in the server at intervals;
predicting a predicted temperature of the component based on the real-time power and the real-time temperature;
and adjusting the rotating speed of the fan according to the relation between the predicted temperature and the highest working temperature of the component, so that the fan can radiate the server.
2. The server thermal dissipation method of claim 1, wherein said predicting the predicted temperature of the component based on the real-time power and the real-time temperature comprises:
fitting a temperature prediction polynomial for the component based on the real-time power and the real-time temperature;
determining the predicted temperature from the temperature prediction polynomial;
wherein the temperature prediction polynomial is:
Tcard=AnPcard n+An-1Pcard n-1+…+A1Pcard+A0
in the formula, A0,A1,…,AnIs a coefficient, PcardFor real-time power, TcardIs the predicted temperature.
3. The server heat dissipation method of claim 2, wherein prior to predicting the predicted temperature of the component based on the real-time power and the real-time temperature, further comprising:
reading the model number of the component;
correspondingly, the fitting the temperature prediction polynomial of the component according to the real-time power and the real-time temperature comprises:
fitting the temperature prediction polynomial of the component corresponding to the model according to the real-time power and the real-time temperature.
4. The server heat dissipation method of claim 1, wherein the adjusting the rotation speed of the fan according to the relationship between the predicted temperature and the maximum operating temperature of the component so that the fan dissipates heat to the server comprises:
determining a difference between the predicted temperature and a maximum operating temperature of the component;
determining the fan rotating speed adjusting degree corresponding to the difference value according to the relation between the preset difference value and the fan rotating speed adjusting degree;
and adjusting the rotating speed of the fan according to the adjusting degree of the rotating speed of the fan so that the fan can radiate the server.
5. The server heat dissipation method of claim 4, further comprising:
when the difference value meets a preset condition, acquiring the current rotating speed of the fan;
and determining the initial rotating speed of the fan according to the current rotating speed.
6. The server heat dissipation method of claim 5, wherein when the number of the current rotation speeds is plural, the determining the initial rotation speed of the fan according to the current rotation speed comprises:
and determining the average value of the current rotating speeds as the initial rotating speed.
7. The server heat dissipation method of claim 5, wherein after determining the initial rotational speed of the fan according to the current rotational speed, further comprising:
and sending the initial rotating speed, the names of the components and the corresponding models to a computer so that the computer can store the names of the components and the corresponding models of the initial rotating speed.
8. A server heat sink, comprising:
the acquisition module is used for acquiring real-time power and real-time temperature of components in the server at intervals;
a prediction module to predict a predicted temperature of the component based on the real-time power and the real-time temperature;
and the adjusting module is used for adjusting the rotating speed of the fan according to the relation between the predicted temperature and the highest working temperature of the component so as to facilitate the fan to radiate the server.
9. A BMC, comprising:
a memory for storing a computer program;
a processor for implementing the steps of the server heat dissipation method according to any one of claims 1 to 7 when executing the computer program.
10. A computer-readable storage medium, having stored thereon a computer program which, when executed by a processor, carries out the steps of the server heat dissipation method according to any one of claims 1 to 7.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114898784A (en) * | 2022-04-07 | 2022-08-12 | 北京中关村水木医疗科技有限公司 | Test system and method for data storage device of breathing machine |
CN115097920A (en) * | 2022-07-29 | 2022-09-23 | 苏州浪潮智能科技有限公司 | Method, device, server and medium for adjusting temperature of server case |
-
2021
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114898784A (en) * | 2022-04-07 | 2022-08-12 | 北京中关村水木医疗科技有限公司 | Test system and method for data storage device of breathing machine |
CN114898784B (en) * | 2022-04-07 | 2023-07-04 | 北京中关村水木医疗科技有限公司 | System and method for testing data storage device of breathing machine |
CN115097920A (en) * | 2022-07-29 | 2022-09-23 | 苏州浪潮智能科技有限公司 | Method, device, server and medium for adjusting temperature of server case |
CN115097920B (en) * | 2022-07-29 | 2023-08-08 | 苏州浪潮智能科技有限公司 | Method and device for adjusting temperature of server case, server and medium |
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