CN113834640A

CN113834640A - Thermal imaging module optical center deviation determining method, optical center aligning method and device

Info

Publication number: CN113834640A
Application number: CN202111165818.5A
Authority: CN
Inventors: 温俊阳
Original assignee: Hangzhou Micro Image Software Co ltd
Current assignee: Hangzhou Micro Image Software Co ltd
Priority date: 2021-09-30
Filing date: 2021-09-30
Publication date: 2021-12-24
Anticipated expiration: 2041-09-30
Also published as: CN113834640B

Abstract

The specification provides a thermal imaging module optical center deviation determining method, an optical center alignment method and an optical center alignment device. The optical center alignment method comprises the following steps: determining the central position of an imaging target surface of a sensor chip of the thermal imaging module; acquiring a first image signal acquired by a sensor chip in a state that a lens component of a thermal imaging module is positioned right in front of the sensor chip; determining the optical center position of the lens assembly corresponding to the imaging target surface by using the first image signal; determining the deviation of the optical center of the lens assembly relative to the center of the sensor chip according to the optical center position and the central position of the imaging target surface; when the deviation does not meet the allowable deviation condition, the relative position between the lens assembly and the sensor chip is adjusted to reduce the deviation of the optical center of the lens assembly relative to the center of the sensor chip. The alignment scheme of this specification can carry out the optical center alignment to thermal imaging module.

Description

Thermal imaging module optical center deviation determining method, optical center aligning method and device

Technical Field

The present disclosure relates to the field of thermal imaging technologies, and in particular, to a method for determining an optical center deviation of a thermal imaging module, and a method and an apparatus for aligning optical centers of the thermal imaging module.

Background

The thermal imaging module includes a Flexible Printed Circuit (FPC), a sensor chip, and a lens assembly. When the lens is in a wide angle, the thermal imaging module may cause the optical center of the lens to be not in the center of the plane of the photosensitive Die during imaging of the thermal imaging module due to a relative offset error of the Die portion of the photosensitive chip in the sensor chip in the package, a dimension processing error of the lens assembly, and an error accumulation of the lens assembly on the plane of the Flexible Printed Circuit (FPC), which may eventually cause the phenomena of decentration of the whole imaging machine (e.g., a deviation of δ L), a dark angle of the image, etc., and may even affect the shooting accuracy of the thermal imaging sighting device when the deviation is large.

Therefore, a more reliable optical center alignment scheme for thermal imaging modules is needed to perform more accurate optical center alignment for thermal imaging modules.

Disclosure of Invention

An embodiment of the present specification provides a method for determining an optical center deviation of a thermal imaging module, where the thermal imaging module includes a sensor chip and a lens assembly, and the method includes:

determining the central position of the imaging target surface of the sensor chip;

acquiring a first image signal acquired by a sensor chip in a state that a lens component is positioned right in front of the sensor chip;

determining the optical center position of the lens assembly corresponding to the imaging target surface by using the first image signal;

and determining the deviation of the optical center of the lens assembly relative to the center of the sensor chip according to the optical center position and the central position of the imaging target surface.

Optionally, determining the central position of the imaging target surface of the sensor chip includes:

after the thermal imaging module is powered on, the lens assembly is not moved to the front of the sensor chip, and a second image signal on the imaging target surface acquired by the sensor chip is acquired;

and determining the center of a second image area where the second image signal forms an image on the imaging target surface as the center position of the imaging target surface.

Further, determining an image area formed by the second image signal on the imaging target surface comprises:

acquiring an image formed on the imaging target surface by the second image signal;

and carrying out non-uniformity correction on the image formed by the second image signal on the imaging target surface to obtain a corrected image, and determining the central position of the imaging target surface according to the area of the corrected image.

Optionally, the image formed by the imaging target surface is a rectangular image, and the center of the rectangular image is the center position of the imaging target surface.

Optionally, determining the optical center of the lens assembly corresponding to the optical center position of the imaging target surface by using the first image signal includes:

determining a first image area where an image formed on the imaging target surface by the first image signal is located, wherein the first image area is a circular area;

and determining the center of the circular area as the position of the optical center of the lens assembly corresponding to the optical center of the imaging target surface.

In a second aspect, embodiments of the present description provide a method for aligning optical centers of a thermal imaging module, the thermal imaging module including a sensor chip and a lens assembly, the method including:

determining a deviation of an optical center of a lens assembly from a center of a sensor chip according to the thermal imaging module optical center deviation determining method in any one embodiment of the first aspect;

when the deviation does not meet the allowable deviation condition, the relative position between the lens assembly and the sensor chip is adjusted to reduce the deviation of the optical center of the lens assembly relative to the center of the sensor chip.

Optionally, when the deviation does not satisfy the allowable deviation condition, adjusting a relative position between the lens assembly and the sensor chip to reduce the deviation of the optical center of the lens assembly with respect to the center of the sensor chip includes:

and when the deviation does not meet the allowable deviation condition, controlling the lens assembly to move towards the center of the sensor chip by a distance of a preset step length in the radial direction at each adjustment.

Optionally, the deviation of the optical center of the lens assembly with respect to the center of the sensor chip includes:

before adjusting the relative position between the lens assembly and the sensor chip, the deviation of the optical center of the lens assembly relative to the center of the sensor chip; or

And after the relative position between the lens assembly and the sensor chip is adjusted, the deviation of the optical center of the lens assembly relative to the center of the sensor chip.

Optionally, the deviation of the optical center of the lens assembly with respect to the center of the sensor chip is a distance deviation or a horizontal and vertical coordinate deviation.

Optionally, the allowable deviation condition includes: the distance deviation is smaller than a first preset deviation threshold; or the horizontal and vertical coordinate deviations are all smaller than a second preset deviation threshold value.

In a third aspect, an embodiment of the present specification further provides a thermal imaging module optical center deviation determining apparatus, including:

the first determining module is used for determining the central position of the imaging target surface of the sensor chip of the thermal imaging module;

the acquisition module is used for acquiring a first image signal acquired by the sensor chip in a state that a lens component of the thermal imaging module is positioned right in front of the sensor chip;

the second determining module is used for determining the optical center position of the lens assembly corresponding to the imaging target surface by utilizing the first image signal;

and the third determining module is used for determining the deviation of the optical center of the lens assembly relative to the center of the sensor chip according to the optical center position and the central position of the imaging target surface.

Optionally, the first determining module is specifically configured to: after the thermal imaging module is electrified, a second image signal on the imaging target surface acquired by the sensor chip is acquired before the lens component is moved to the sensor chip; determining the center of a second image area where an image formed on the imaging target surface by the second image signal is positioned as the center position of the imaging target surface;

the third determining module is specifically configured to: determining a first image area where an image formed on the imaging target surface by the first image signal is located, wherein the first image area is a circular area; determining the center of the circular area as the optical center position of the optical center of the lens assembly corresponding to the imaging target surface;

wherein, when acquiring the second image signal on the imaging target surface acquired by the sensor chip, the first determining module is specifically configured to: acquiring a third image signal on the imaging target surface before the lens assembly is moved to the sensor chip after the thermal imaging module is powered on; and carrying out non-uniformity correction on the third image signal to obtain the second image signal.

In a fourth aspect, an embodiment of the present specification further provides a thermal imaging module optical center alignment apparatus, including:

the third determining module is used for determining the deviation of the optical center of the lens assembly relative to the center of the sensor chip according to the optical center position and the central position of the imaging target surface;

and the fine adjustment moving module adjusts the relative position between the lens assembly and the sensor chip to reduce the deviation of the optical center of the lens assembly relative to the center of the sensor chip when the deviation does not meet the allowable deviation condition.

Optionally, the first determining module is specifically configured to: after the thermal imaging module is powered on, the lens assembly is not moved to the front of the sensor chip, and a second image signal on the imaging target surface acquired by the sensor chip is acquired; determining the center of a second image area where an image formed on the imaging target surface by the second image signal is positioned as the center position of the imaging target surface;

the fine-tuning moving module is specifically configured to: when the deviation does not meet the allowable deviation condition, controlling the lens assembly to move to the center of the sensor chip by a distance of a preset step length along the radial direction during each adjustment;

wherein, when acquiring the second image signal on the imaging target surface acquired by the sensor chip, the first determining module is specifically configured to: acquiring a third image signal on the imaging target surface before the lens assembly is moved to the sensor chip after the thermal imaging module is powered on; non-uniformity correcting the third image signal to obtain the second image signal;

the deviation of the optical center of the lens assembly relative to the center of the sensor chip includes: before adjusting the relative position between the lens assembly and the sensor chip, the deviation of the optical center of the lens assembly relative to the center of the sensor chip; or after the relative position between the lens assembly and the sensor chip is adjusted, the deviation of the optical center of the lens assembly relative to the center of the sensor chip is obtained;

the deviation of the optical center of the lens assembly relative to the center of the sensor chip is a distance deviation or a horizontal and vertical coordinate deviation, and the allowable deviation condition comprises: the distance deviation is smaller than a first preset deviation threshold; or the horizontal and vertical coordinate deviations are all smaller than a second preset deviation threshold value.

In a fifth aspect, an embodiment of the present specification further provides an optical center alignment system of a thermal imaging module, including:

thermal imaging module, control module and actuating mechanism, wherein:

the thermal imaging module comprises a sensor chip and a lens assembly;

the actuating mechanism is connected with the lens assembly and is used for controlling the movement of the lens assembly;

and the control module is connected with the actuator and is used for determining the deviation of the optical center of the lens assembly relative to the center of the sensor chip according to any one of the possible implementation methods in the first aspect, and when the deviation does not meet the allowable deviation condition, driving the actuator to control the lens assembly to move so as to adjust the relative position between the lens assembly and the sensor chip, so as to reduce the deviation of the optical center of the lens assembly relative to the center of the sensor chip.

Optionally, when the deviation does not satisfy the condition of allowable deviation, the control module is configured to drive the actuator control lens assembly to move towards the center of the sensor chip by a distance of a preset step length in the radial direction at each adjustment;

wherein the deviation of the optical center of the lens assembly with respect to the center of the sensor chip comprises: before adjusting the relative position between the lens assembly and the sensor chip, the deviation of the optical center of the lens assembly relative to the center of the sensor chip; or after the relative position between the lens assembly and the sensor chip is adjusted, the deviation of the optical center of the lens assembly relative to the center of the sensor chip is obtained;

Optionally, the thermal imaging module further includes a flexible board for connecting the sensor chip and the control module, and sending an image signal acquired by the sensor chip to the control module.

Optionally, the system includes a thermostatic plate disposed at the light inlet of the lens assembly to form a thermostatic surface of the thermal imaging module.

Further, the temperature difference between the temperature of the thermostatic plate and the ambient temperature is greater than a preset temperature difference threshold value.

Embodiments of the present specification further provide an electronic device, which includes a processor and a memory electrically connected to the processor, where the memory is used to store a computer program, and the processor is used to call the computer program to execute the method of the first aspect or the second aspect.

Embodiments of the present specification also provide a computer-readable storage medium storing a computer program, which can be executed by a processor to implement the method of the first or second aspect.

On the one hand, in the embodiment of the present specification, the center position of the imaging target surface of the sensor chip and the optical center position of the lens assembly in the state right in front of the sensor chip are determined, and the deviation of the optical center relative to the center of the sensor chip is determined according to the optical center position and the center position of the imaging target surface, so that the optical center deviation of the thermal imaging module can be obtained more accurately, and the optical center alignment can be performed based on the optical center deviation.

On the other hand, in the embodiments of the present disclosure, the center position of the imaging target surface of the sensor chip and the optical center of the lens assembly in the state of being directly in front of the sensor chip are determined, the deviation of the optical center with respect to the center of the sensor chip is determined according to the optical center position and the center position of the imaging target surface, and the relative position between the lens assembly and the sensor chip is adjusted based on the optical center deviation to reduce the deviation of the optical center of the lens assembly with respect to the center of the sensor chip, so that the optical center deviation of the thermal imaging module can be obtained more accurately, and the optical center alignment is performed based on the optical center deviation.

Drawings

The accompanying drawings, which are included to provide a further understanding of the specification and are incorporated in and constitute a part of this specification, illustrate embodiments of the specification and together with the description serve to explain the specification and not to limit the specification in a non-limiting sense. In the drawings:

fig. 1 is a schematic diagram illustrating a method for determining an optical center deviation of a thermal imaging module according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a thermal imaging module according to an embodiment of the present disclosure;

fig. 3 is a schematic diagram illustrating imaging performed by using a temperature difference of relative illumination of a lens according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram illustrating an optical center alignment method of a thermal imaging module according to an embodiment of the present disclosure;

FIG. 5 is a schematic structural diagram of an optical center alignment system of a thermal imaging module according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of an optical center deviation determining apparatus of a thermal imaging module according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of an optical center alignment apparatus of a thermal imaging module according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure.

Detailed Description

In order to make the objects, technical solutions and advantages of the present disclosure more clear, the technical solutions of the present disclosure will be clearly and completely described below with reference to the specific embodiments of the present disclosure and the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments obtained by a person skilled in the art without making any inventive step based on the embodiments in this description belong to the protection scope of this document.

The technical solutions provided by the embodiments of the present description are described in detail below with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of an optical center alignment system of a thermal imaging module according to an embodiment of the present disclosure. It should be understood that, in the embodiments of the present specification, the thermal imaging module includes a sensor chip and a lens assembly. The sensor chip is used for converting incident light into image signals and outputting the image signals to an imaging target surface; the lens assembly is movable, and when the lens assembly is moved to a position right in front of the sensor chip, light is incident on the sensor chip through the lens assembly. Of course, it should be understood that the thermal imaging module may further include a flexible board connected to the sensor chip, and the flexible board may convert the signal of the sensor chip into an image signal and output the image signal. In addition, the sensor chip may include a photosensitive chip Die portion, where the center of the sensor chip mentioned in this specification refers to the center of the photosensitive surface of the photosensitive chip of the sensor chip, and is not described in detail later. The specific structure and working principle of the thermal imaging module can refer to the related content in the prior art, and the embodiments of the present description are not repeated herein. Referring to fig. 1, the method may include:

and S110, determining the central position of the imaging target surface of the sensor chip.

It should be understood that when the thermal imaging module is powered on and the lens assembly is not moved to the sensor chip, the external light of the thermal imaging module is directly incident on the sensor chip and forms an image on the imaging target surface of the sensor chip. Of course, it should be understood that the area range of the image corresponding to the image signal of the imaging target surface at this time is also the area range of the imaging target surface, or the area range of the imaging target surface may be cut according to the area range of the image of the imaging target surface at this time according to the preset rule. Therefore, from the image on the imaging target surface at this time, the center position of the imaging target surface can be determined.

Alternatively, step S110 may be implemented as:

It should be understood that in the state that the lens assembly is not moved to the front of the sensor chip after the thermal imaging module is powered on, the light is directly incident on the photosensitive Die of the sensor chip, and an image is formed on the imaging target surface of the sensor chip. The range of the imaging target surface is consistent with the range of the formed image area, or the range of the imaging target surface can be obtained by cutting according to the range of the imaging area and preset rules. Therefore, according to the second image signal acquired by the sensor chip and the related determination rule of the imaging target surface, the area of the imaging target surface can be determined, and further, the central position of the imaging target surface, that is, the first central coordinate (X ', Y') of the projection of the center of the photosensitive surface (i.e., the plane where the photosensitive chip is located) of the sensor chip onto the imaging target surface can be determined.

It is to be understood that the specific rules of determination and the specific shape of the imaging target surface may have different ways of determination depending on the brand. Optionally, the image formed by the imaging target surface is a rectangular image, and the center of the rectangular image is the central position of the imaging target surface. The first center coordinates (X ', Y') are (N/2, M/2) without assuming that the four vertex coordinates of the imaging target surface are (0,0), (0, M), (N,0), and (N, M). Of course, other shapes of the imaging target surface are not excluded, such as circular, regular hexagonal, etc.

It will of course be appreciated that in order to obtain more accurate coordinates of the centre of the sensor chip, non-uniformity correction of the image formed by the imaging target surface at that time is required. Non-Uniformity correction (NUC) is the adjustment of the thermal imaging module to the small detector drift that occurs when the scene and environment change. Generally, the thermal image module itself will interfere with its temperature readings, and in order to improve the accuracy, the thermal image module will measure the infrared radiation of its own optical device, and then adjust the image according to these readings. The NUC adjusts the gain and offset for each pixel, generating a higher quality, more accurate image.

At this time, acquiring the second image signal on the imaging target surface acquired by the sensor chip may specifically be realized as:

acquiring a third image signal on the imaging target surface before the lens assembly is moved to the sensor chip after the thermal imaging module is powered on;

and carrying out non-uniformity correction on the third image signal to obtain the second image signal.

It should be understood that the third image signal mentioned in the embodiments of the present disclosure may be an initial image signal on the imaging target surface acquired before the lens assembly is moved to the sensor chip after the thermal imaging module is powered on, or may be a corrected image signal on the imaging target surface acquired during the non-uniformity correction process.

In embodiments of the present description, NUC correction may keep all pels in monotonicity within a fixed loop. For example: all pixels of the detector are in monotonicity in a normal temperature environment by adjusting internal parameters of the detector. Meanwhile, the output difference of part of the pixels and other pixels is large (the pixels are represented as particularly bright or dark points or stripes on the image), and the conventional filtering algorithm is adopted for compensation. The specific implementation manner of performing the non-uniformity correction on the image signal on the imaging target surface acquired by the sensor chip may refer to the prior art, and the description of the embodiment is not repeated herein.

And S120, acquiring a first image signal collected by the sensor chip in a state that the lens assembly is positioned right in front of the sensor chip.

After the thermal imaging module is powered on, the lens assembly can be controlled to move to the position right in front of the sensor chip. The position of the lens assembly and other components of the thermal imaging module can be schematically illustrated in fig. 2. Referring to fig. 2, the thermal imaging module is constructed as follows:

showing an FPC soft board;

sensing a Die part in the sensor chip;

packaging the sensor chip;

lens assembly (including lens and lens holder).

It should be understood that a thermostatic plate may be disposed at the light inlet of the lens assembly, and the thermostatic plate has a constant temperature and is uniformly distributed. At this time, the plane of the thermostatic plate forms a thermostatic surface. Wherein, the sensor chip is close to the side of the target surface of the flexible plate, and the lens component is close to the side of the constant temperature surface. Of course, it should be understood that in order for the thermal imaging assembly to function properly, the temperature of the thermostatic surface may generally be set to differ from the ambient temperature by more than a predetermined threshold temperature difference, which may be empirically determined. Alternatively, the thermostatic plate may be an element or device such as a black body to provide a nominal temperature at a given emissivity.

It is understood that when the lens assembly is moved to the front of the sensor chip, the incident light of the thermal imaging module is incident on the sensor chip from the lens assembly, and then an image signal is formed on the imaging target surface. At this time, the image signal on the imaging target surface acquired by the sensor chip is the first image signal in step S120.

And S130, determining the optical center of the lens assembly corresponding to the optical center position of the imaging target surface by using the first image signal.

Referring to fig. 3, when there is a constant temperature plane (e.g., black body) in front of the thermal imaging module, because the central illumination of the lens itself is different from the edge illumination of the lens, the difference is imaged by the sensor as a regular pattern, generally in the shape of a circle. Alternatively, step S130 may be implemented as:

This is illustrated below with reference to fig. 3. For example: the central illuminance of the lens is 100%, the edge illuminance of the lens is 90%, and the temperature difference δ T at a position between the center and the edge of the lens assembly is sensed by the thermal imaging sensor and a circular image is output. The central area of the circle (the black area in fig. 3) is the center of the lens assembly. Since the coordinates of each pixel point on the circle are known, the coordinate equation of the center of the circle can be calculated by taking any three points. Namely, at least three pixel points of the circle edge in the circular image are selected, and the center coordinate of the circular image is determined based on the pixel coordinates of the at least three pixel points. Of course, to avoid generating larger errors, the distances between the three selected pixels may be required to be larger than a predetermined threshold, such as the radius length of a circle, or the radius length of 1/2, etc. Taking the following coordinates (X1, Y1), (X2, Y2), (X3, Y3) of three selected pixel points as an example, the specific calculation process of the central coordinates (X, Y) of the circular image is as follows:

X＝((x2^2-x1^2+y2^2-y1^2)*(2*(y3-y2))-(x3^2-x2^2+y3^2-y2^2)*(2*(y2-y1))/((2*(x2-x1))*(2*(y3-y2))-(2*(x3-x2))*(2*(y2-y1)))；

Y＝((2*(x3-x2))*(x2^2-x1^2+y2^2-y1^2)-(x3^2-x2^2+y3^2-y2^2)*(2*(x2-x1)))/((2*(x3-x2))*(2*(y2-y1))-(2*(y3-y2))*(2*(x2-x1)))。

of course, it should be understood that after the coordinates (X, Y) are calculated, operations such as rounding off the X, Y coordinate values may be performed according to the accuracy requirements.

And S140, determining the deviation of the optical center of the lens assembly relative to the center of the sensor chip according to the optical center position and the central position of the imaging target surface.

It should be understood that, from the coordinates of the optical center position and the coordinates of the center position of the imaging target surface, the deviation of the optical center of the lens assembly with respect to the center of the sensor chip, that is, the deviation between the center coordinates (X, Y) of the circular image and the center coordinates (X ', Y') of the imaging target surface mentioned in step S130, can be determined. It should be understood that the deviation between the two coordinates can generally be expressed in terms of a distance deviation or a horizontal-vertical coordinate deviation.

Specifically, when the deviation is a distance deviation, the distance deviation can be expressed as: (| X '-X | ^2+ | Y' -Y | ^2) ^ 1/2.

Alternatively, when the deviation is an abscissa deviation, the abscissa deviation may be expressed as: | X' -X |; the ordinate deviation can be expressed as: y' -Y |.

The embodiment of the specification determines the center position of the imaging target surface of the sensor chip and the center position of the lens component sensor chip in the state of right in front of the sensor chip, and determines the deviation of the optical center relative to the center of the sensor chip according to the optical center position and the center position of the imaging target surface, so that the optical center deviation of the thermal imaging module can be obtained more accurately, and the optical center alignment can be carried out based on the optical center deviation.

Fig. 4 is a schematic diagram illustrating an optical center alignment method of a thermal imaging module according to an embodiment of the present disclosure. As shown in fig. 4, the method may include steps S110-S140 and step S210 as shown in fig. 1. The specific implementation of steps S110 to S140 may refer to the embodiment shown in fig. 1, and will not be described again.

And S410, when the deviation does not meet the allowable deviation condition, adjusting the relative position between the lens assembly and the sensor chip so as to reduce the deviation of the optical center of the lens assembly relative to the center of the sensor chip.

It should be understood that after obtaining the deviation of the two coordinates, it can be determined whether the deviation of the two coordinates satisfies the allowable deviation condition.

Alternatively, when the deviation of the optical center coordinates (X, Y) of the lens assembly from the center coordinates (X ', Y') of the sensor chip is a distance deviation, the allowable deviation condition may be expressed by the following equation:

|X’-X|^2+|Y’-Y|^2<(δL)^2。

where δ L represents an allowable distance deviation value.

Alternatively, when the deviation of the optical center coordinates (X, Y) of the lens assembly from the center coordinates (X ', Y') of the sensor chip is a horizontal-vertical coordinate deviation, the allowable deviation condition may be expressed by the following formula:

| X '-X | < δ L' and | Y '-Y | < δ L'.

Where δ L' represents the abscissa deviation and the ordinate deviation.

Preferably, the relationship between δ L' and δ L can be expressed by the following formula:

of course, it should be understood that after completing one movement of the lens assembly, the deviation is generally not within the allowable range, and therefore, the lens assembly is generally required to be adjusted several times in a cycle while being controlled toward the center of the sensor chip. After each movement, the optical center coordinate of the lens assembly needs to be determined again, the deviation between the optical center coordinate and the center coordinate of the sensor chip needs to be calculated, if the deviation does not meet the allowable deviation condition, the lens assembly is continuously controlled to move, and the deviation is recalculated until the deviation meets the allowable deviation condition.

That is, in the embodiments of the present specification, the deviation of the optical center of the lens assembly with respect to the center of the sensor chip may include:

It should be understood that when the optical center deviation adjustment is performed, the adjustment may be performed according to a preset rule.

Alternatively, a preset step length may be set, and each time the distance of the preset step length is moved. In this case, step S410 may specifically include:

It should be understood that radial reference herein is with respect to the axial direction of the lens assembly. The axial direction generally refers to the direction of the rotation center of the cylindrical object, i.e. the direction common to the central axis, and the axis is the central axis. The axial direction of the embodiments of the present specification means a direction along the central axis of the lens assembly, and the radial direction means a direction perpendicular to the central axis of the lens assembly.

Of course, the distance of each movement may not be fixed. For example, when the deviation is greater than a preset threshold, the movement may be performed according to a first preset step length; and when the deviation is smaller than the preset threshold value, moving according to a second preset step length. The preset threshold is larger than the allowable deviation threshold, and the first preset step length is larger than the second preset step length. For example, the preset threshold is equal to 10 times of the allowable deviation threshold, the first preset step is equal to 5 times of the second preset step, and the second preset step is equal to 0.5-1 times of the allowable distance deviation threshold. Of course, it should be understood that the above numbers are merely exemplary, and other numbers may be used in practical applications, and the embodiments of the present disclosure are not limited thereto.

Optionally, the deviation of the optical center of the lens assembly from the center of the sensor chip is a distance deviation or a horizontal and vertical coordinate deviation, and the allowable deviation condition includes: the distance deviation is smaller than a first preset deviation threshold; or the horizontal and vertical coordinate deviations are all smaller than a second preset deviation threshold value.

The embodiment of the specification determines the center position of the imaging target surface of the sensor chip and the optical center position of the lens assembly in the state of being right in front of the sensor chip corresponding to the optical center position of the imaging target surface, determines the deviation of the optical center relative to the center of the sensor chip according to the optical center position and the center position of the imaging target surface, and adjusts the relative position between the lens assembly and the sensor chip based on the optical center deviation to reduce the deviation of the optical center of the lens assembly relative to the center of the sensor chip, so that the optical center deviation of the thermal imaging module can be accurately obtained, and the optical center alignment is carried out based on the optical center deviation.

Based on this, on the one hand, this specification embodiment can effectively improve thermal imaging sight product shooting precision, reduces the user and calibrates the degree of difficulty for the product ease of use improves, and the competitiveness promotes. On the other hand, when the technology is used for producing and manufacturing the thermal imaging module, the generation of undesirable phenomena such as dark corners and the like is prevented, the production yield of the module can be greatly improved, the repair cost is reduced, and the market share is obviously improved.

Fig. 5 is a schematic structural diagram of an optical center alignment system of a thermal imaging module according to an embodiment of the present disclosure, and referring to fig. 5, the optical center alignment system of the thermal imaging module may include:

thermal imaging module 510, control module 520, and actuator 530, wherein:

the thermal imaging module comprises a sensor chip 512 and a lens component 513;

the actuator 530 is connected with the lens assembly 513 and is used for controlling the movement of the lens assembly 513;

the control module 520 is connected with the actuator 530, and is used for determining the deviation of the optical center of the lens assembly 513 relative to the center of the sensor chip 512 according to the method of the embodiment shown in fig. 1, and when the deviation does not meet the allowable deviation condition, the actuator 530 is driven to control the lens assembly 513 to move so as to adjust the relative position between the lens assembly 513 and the sensor chip 512, so as to reduce the deviation of the optical center of the lens assembly 513 relative to the center of the sensor chip 512.

It should be understood that the specific implementation of the control module 520 for determining the deviation of the optical center of the lens assembly 513 from the center of the sensor chip 512 may refer to the method in the embodiment shown in fig. 1, and the embodiments of this specification are not described herein again.

Optionally, when the control module 520 drives the actuator 530 to control the lens assembly 513 to move so as to adjust the relative position between the lens assembly 513 and the sensor chip 512, reference may also be made to a method executed in corresponding steps in the embodiment shown in fig. 4, which is not described herein again in this embodiment of the present specification.

Optionally, as shown in fig. 5, the thermal imaging module 510 further comprises a flexible plate 511. The flexible board, the sensor chip 512 and the lens assembly 513 may be located as shown in fig. 2. It should be understood that the flexible board 511 can be used to connect the sensor chip 512 with the control module and transmit the image signal collected by the sensor chip 512 to the control module 520.

Optionally, the thermal imaging module optical center alignment system may further include a thermostatic plate disposed at the light inlet of the lens assembly 513 to form a thermostatic surface of the thermal imaging module. Optionally, the temperature difference between the temperature of the thermostatic plate and the ambient temperature is greater than a preset temperature difference threshold.

The control module 520 may also execute the method executed by the corresponding module in the embodiment shown in fig. 1 or fig. 4, and for specific implementation, reference may be made to the embodiment shown in fig. 1, which is not described herein again in this embodiment.

Fig. 6 is a schematic structural diagram of an optical center deviation determining apparatus 600 of a thermal imaging module according to an embodiment of the present disclosure, referring to fig. 6, the apparatus includes:

a first determining module 610, configured to determine a center position of an imaging target surface of a sensor chip of the thermal imaging module;

the acquiring module 620 is configured to acquire a first image signal acquired by a sensor chip in a state where a lens assembly of the thermal imaging module is located right in front of the sensor chip;

the second determining module 630, determining the optical center position where the optical center of the lens assembly corresponds to the imaging target surface by using the first image signal;

and a third determining module 640, which determines the deviation of the optical center of the lens assembly relative to the center of the sensor chip according to the optical center position and the central position of the imaging target surface.

The thermal imaging module optical center alignment apparatus may further perform a method performed by a corresponding module in the embodiment shown in fig. 1, and for specific implementation, reference may be made to the embodiment shown in fig. 1, and this embodiment is not described herein again.

Fig. 7 is a schematic structural diagram of an optical center alignment apparatus 700 of a thermal imaging module according to an embodiment of the present disclosure, referring to fig. 7, the apparatus includes:

a first determining module 710 for determining a central position of an imaging target surface of a sensor chip of the thermal imaging module;

the acquiring module 720 acquires a first image signal acquired by the sensor chip in a state that a lens component of the thermal imaging module is positioned right in front of the sensor chip;

the second determining module 730, which determines the optical center position of the lens assembly corresponding to the imaging target surface by using the first image signal;

and a third determining module 740, for determining the deviation of the optical center of the lens assembly relative to the center of the sensor chip according to the optical center position and the center position of the imaging target surface.

And a fine adjustment moving module 750 which adjusts the relative position between the lens assembly and the sensor chip to reduce the deviation of the optical center of the lens assembly relative to the center of the sensor chip when the deviation does not meet the allowable deviation condition.

The thermal imaging module optical center alignment apparatus may further perform a method performed by a corresponding module in the embodiments shown in fig. 1 and fig. 4, and specific implementation may refer to the embodiments shown in fig. 1 and fig. 4, which is not described herein again in this embodiment.

The above device and system embodiments are basically similar to the method embodiments, so the description is simple, and the relevant points can be referred to the partial description of the method embodiments. Further, it should be noted that, among the respective components of the apparatus of the present specification, the components thereof are logically divided according to the functions to be implemented, but the present specification is not limited thereto, and the respective components may be newly divided or combined as necessary.

Fig. 8 is a schematic structural diagram of an electronic device provided in an embodiment of the present disclosure, and referring to fig. 8, the electronic device includes a processor, an internal bus, a network interface, a memory, and a non-volatile memory, and may also include hardware required by other services. The processor reads a corresponding computer program from the nonvolatile memory to the memory and then runs the computer program to form the thermal imaging module optical center alignment device on a logic level. Of course, besides the software implementation, the present specification does not exclude other implementations, such as logic devices or a combination of software and hardware, and the like, that is, the execution subject of the following processing flow is not limited to each logic unit, and may be hardware or logic devices.

The network interface, the processor and the memory may be interconnected by a bus system. The bus may be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus, an EISA (Extended Industry Standard Architecture) bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one double-headed arrow is shown in FIG. 8, but that does not indicate only one bus or one type of bus.

The memory is used for storing programs. In particular, the program may include program code comprising computer operating instructions. The memory may include both read-only memory and random access memory, and provides instructions and data to the processor. The Memory may include a Random-Access Memory (RAM) and may also include a non-volatile Memory (non-volatile Memory), such as at least 1 disk Memory.

And the processor is used for executing the program stored in the memory and specifically executing the method of the embodiment shown in the figure 1 or the figure 4.

The methods disclosed in the embodiments of fig. 1 and fig. 4 in this specification may be applied to a processor, or may be implemented by a processor. The processor may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuits of hardware in a processor or instructions in the form of software. The Processor may be a general-purpose Processor, including a Central Processing Unit (CPU), a Network Processor (NP), and the like; but also Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components. The various methods, steps and logic blocks disclosed in the embodiments of the present specification may be implemented or performed. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of a method disclosed in connection with the embodiments of the present specification may be embodied directly in a hardware decoding processor, or in a combination of hardware and software modules in the decoding processor. The software module may be located in ram, flash memory, rom, prom, or eprom, registers, etc. storage media as is well known in the art. The storage medium is located in a memory, and a processor reads information in the memory and completes the steps of the method in combination with hardware of the processor.

The electronic device may further execute the method in the embodiments shown in fig. 1 and fig. 4, and the specific implementation may refer to the embodiments shown in fig. 1 and fig. 4, which are not described herein again in this embodiment.

Based on the same inventive creation, the present specification also provides a computer readable storage medium storing one or more programs, which when executed by an electronic device including a plurality of application programs, cause the electronic device to execute the method provided by the embodiment corresponding to fig. 1 and 4.

Based on the same invention, an embodiment of the present specification further provides an optical center alignment system of a thermal imaging module, where the optical center alignment system of the thermal imaging module includes the optical center alignment device of the thermal imaging module according to any one of the above embodiments.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.

The foregoing description has been directed to specific embodiments of this disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.

As will be appreciated by one skilled in the art, embodiments of the present description may be provided as a method, system, or computer program product. Accordingly, the description may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the description may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.

The description has been presented with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the description. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

In a typical configuration, a computing device includes one or more processors (CPUs), input/output interfaces, network interfaces, and memory.

The memory may include forms of volatile memory in a computer readable medium, Random Access Memory (RAM) and/or non-volatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM). Memory is an example of a computer-readable medium.

Computer-readable media, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device. As defined herein, a computer readable medium does not include a transitory computer readable medium such as a modulated data signal and a carrier wave.

It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The above description is only an example of the present specification, and is not intended to limit the present specification. Various modifications and alterations to this description will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present specification should be included in the scope of the claims of the present specification.

Claims

1. A method for determining deviation of optical center of thermal imaging module, wherein the thermal imaging module comprises a sensor chip and a lens component, the method comprising:

2. The method of claim 1,

determining the optical center position of the lens assembly corresponding to the imaging target surface by using the first image signal, comprising the following steps:

3. The method of claim 1,

determining a center position of an imaging target surface of the sensor chip comprises:

4. The method of claim 3, wherein the second image region is a rectangular region.

5. The method of claim 3 or 4, wherein acquiring a second image signal on the imaging target surface captured by a sensor chip before moving the lens assembly to the sensor chip after the thermal imaging module is powered on comprises:

6. A thermal imaging module optical center alignment method is characterized by comprising the following steps:

determining a deviation of an optical center of the lens assembly from a center of the sensor chip according to the thermal imaging module optical center deviation determination method of any one of claims 1 to 5;

7. The method of claim 6,

when the deviation does not meet the allowable deviation condition, adjusting the relative position between the lens assembly and the sensor chip to reduce the deviation of the optical center of the lens assembly relative to the center of the sensor chip, including:

8. The method of claim 6, wherein the deviation of the optical center of the lens assembly from the center of the sensor chip comprises:

9. The method of claim 6, wherein the deviation of the optical center of the lens assembly from the center of the sensor chip is a distance deviation or a horizontal and vertical coordinate deviation.

10. The method of claim 9,

the allowable deviation condition includes: the distance deviation is smaller than a first preset deviation threshold; or the horizontal and vertical coordinate deviations are all smaller than a second preset deviation threshold value.

11. A thermal imaging module optical center deviation determining device, comprising:

12. The apparatus of claim 11,

the first determining module is specifically configured to: after the thermal imaging module is powered on, the lens assembly is not moved to the front of the sensor chip, and a second image signal on the imaging target surface acquired by the sensor chip is acquired; determining the center of a second image area where an image formed on the imaging target surface by the second image signal is positioned as the center position of the imaging target surface; the second image area is a rectangular area;

the first determining module is specifically configured to, when the thermal imaging module is powered on and the lens assembly is not moved to a position in front of the sensor chip to acquire a second image signal on the imaging target surface acquired by the sensor chip: acquiring a third image signal on the imaging target surface before the lens assembly is moved to the sensor chip after the thermal imaging module is powered on; and carrying out non-uniformity correction on the third image signal to obtain the second image signal.

13. A thermal imaging module optical center alignment device, comprising:

14. The apparatus of claim 13,

the first determining module is specifically configured to: after the thermal imaging module is electrified, a second image signal on the imaging target surface acquired by the sensor chip is acquired before the lens component is moved to the sensor chip; determining an image area formed on the imaging target surface by the second image signal; determining the center of a second image area where an image formed on the imaging target surface by the second image signal is positioned as the center position of the imaging target surface; the second image area is a rectangular area;

the first determining module is specifically configured to, when the thermal imaging module is powered on and the lens assembly is not moved to a position in front of the sensor chip to acquire a second image signal on the imaging target surface acquired by the sensor chip: acquiring a third image signal on the imaging target surface before the lens assembly is moved to the sensor chip after the thermal imaging module is powered on; non-uniformity correcting the third image signal to obtain the second image signal;

15. An optical center alignment system for a thermal imaging module, comprising:

thermal imaging module, control module and actuating mechanism, wherein:

the thermal imaging module comprises a sensor chip and a lens assembly;

the control module is connected with the actuator and used for determining the deviation of the optical center of the lens assembly relative to the center of the sensor chip according to the method of any one of claims 1 to 6, and when the deviation does not meet the allowable deviation condition, the actuator is driven to control the lens assembly to move so as to adjust the relative position between the lens assembly and the sensor chip, so that the deviation of the optical center of the lens assembly relative to the center of the sensor chip is reduced.

16. The system of claim 15,

when the deviation does not meet the allowable deviation condition, the control module is used for driving the actuating mechanism to control the lens assembly to move towards the center of the sensor chip by a distance of a preset step length along the radial direction during each adjustment;

17. The system of claim 15,

the thermal imaging module further comprises a flexible plate which is used for connecting the sensor chip and the control module and sending image signals collected by the sensor chip to the control module.

18. The system of claim 15, comprising a thermostatic plate disposed at the light entrance of the lens assembly to form a thermostatic surface of the thermal imaging module.

19. The system of claim 18, wherein the temperature difference between the temperature of the thermostatic plate and the ambient temperature is greater than a preset temperature difference threshold.

20. An electronic device, comprising:

a processor; and

a memory arranged to store computer-executable instructions that, when executed, cause the processor to perform operations corresponding to the method of any one of claims 1-9.