CN113831855B - Preparation method and application of heat transfer type magnetic stripe suitable for low-temperature magnetic lamination of PLA (polylactic acid) substrate - Google Patents
Preparation method and application of heat transfer type magnetic stripe suitable for low-temperature magnetic lamination of PLA (polylactic acid) substrate Download PDFInfo
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- CN113831855B CN113831855B CN202111129012.0A CN202111129012A CN113831855B CN 113831855 B CN113831855 B CN 113831855B CN 202111129012 A CN202111129012 A CN 202111129012A CN 113831855 B CN113831855 B CN 113831855B
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- 238000012546 transfer Methods 0.000 title claims abstract description 51
- 239000004626 polylactic acid Substances 0.000 title claims abstract description 50
- 229920000747 poly(lactic acid) Polymers 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 238000003475 lamination Methods 0.000 title claims abstract description 17
- 239000010410 layer Substances 0.000 claims abstract description 93
- 239000011248 coating agent Substances 0.000 claims abstract description 39
- 238000000576 coating method Methods 0.000 claims abstract description 39
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 33
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000012790 adhesive layer Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 25
- 230000008569 process Effects 0.000 claims abstract description 23
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920001634 Copolyester Polymers 0.000 claims abstract description 17
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 16
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 16
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 16
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 16
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 238000001035 drying Methods 0.000 claims abstract description 10
- 229920006381 polylactic acid film Polymers 0.000 claims abstract description 10
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 10
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 9
- 238000002844 melting Methods 0.000 claims abstract description 8
- 230000008018 melting Effects 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007765 extrusion coating Methods 0.000 claims description 2
- 238000007756 gravure coating Methods 0.000 claims description 2
- 238000007763 reverse roll coating Methods 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract 1
- 239000002346 layers by function Substances 0.000 description 25
- 239000004800 polyvinyl chloride Substances 0.000 description 25
- 229920000915 polyvinyl chloride Polymers 0.000 description 25
- 238000012360 testing method Methods 0.000 description 14
- 238000013329 compounding Methods 0.000 description 9
- 239000004576 sand Substances 0.000 description 9
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000007731 hot pressing Methods 0.000 description 7
- 239000002002 slurry Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- TUNFSRHWOTWDNC-UHFFFAOYSA-N Myristic acid Natural products CCCCCCCCCCCCCC(O)=O TUNFSRHWOTWDNC-UHFFFAOYSA-N 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- -1 alkyl tin salt Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Magnetic Record Carriers (AREA)
Abstract
The preparation method of the heat transfer type magnetic stripe suitable for low-temperature magnetic lamination of the PLA substrate is characterized in that the magnetic stripe can be suitable for a low-temperature magnetic lamination process of a PLA film below 130 ℃: coating a stripping layer and a decorative layer on the tape base in a coating mode; coating a magnetic layer on the stripping layer and the decorative layer; coating a sticking layer on the magnetic layer, drying and cutting to obtain a heat transfer type magnetic stripe suitable for low-temperature magnetic mounting of a PLA (polylactic acid) substrate; wherein the adhesive layer comprises the following components in parts by weight: 10-20 parts of low-Tg-value thermoplastic acrylic resin, 50-80 parts of low-crystallinity copolyester, 5-20 parts of silicon dioxide or wax powder, 5-10 parts of silane coupling agent, 100-160 parts of toluene and 150-240 parts of butanone. The low Tg thermoplastic acrylic resin has a Tg value of 20-50 ℃ and a low melting heat absorption; the low-crystallinity copolyester has Tg value of-20-0 ℃ and melting point of 70-100 ℃, and has low melting heat absorption.
Description
Technical Field
The invention relates to a preparation method and application of a magnetic stripe, in particular to a heat transfer type magnetic stripe suitable for low-temperature magnetic mounting of PLA (polylactic acid) base materials and application of the magnetic stripe.
Background
The heat transfer type magnetic stripe is used for manufacturing intelligent card products such as credit cards, savings cards, gift cards, membership cards and the like, and has mature technology and convenient use and is widely popularized.
At present, the general process for manufacturing a magnetic card by using a heat transfer type magnetic stripe comprises the steps of firstly thermally mounting the heat transfer type magnetic stripe on a PVC film, then hot-pressing and compounding the heat transfer type magnetic stripe and a PVC card base, and punching the heat transfer type magnetic stripe and the PVC card base to manufacture the magnetic card. The magnetic mounting temperature of the magnetic mounting process is generally 150-200 ℃, and the heat transfer type magnetic stripe suitable for the card manufacturing process cannot be firmly mounted with a PVC film at the magnetic mounting temperature lower than 150 ℃, and is easy to fall off in the processing process.
Polylactic acid (PLA) is a novel bio-based and biodegradable material, and is an increasingly urgent requirement for environmental protection at home and abroad, and PLA replaces PVC to become a smart card base, so that the market is gradually promoted, and various smart card distributors at home and abroad are also performing technical storage work of PLA-based smart cards at present. The melting point of the PLA substrate is about 130 ℃, and accordingly the magnetic mounting temperature of a peel-off magnetic strip used for the smart card is required to be below 130 ℃, otherwise the PLA film is easily damaged by hot rollers in the magnetic mounting process. The current transfer type magnetic stripe on the market can not adapt to the new PLA substrate card making and magnetic mounting process.
CN 102501681A discloses a transfer type magnetic stripe for passbooks, which can be preferably used in processing paper base materials such as passbooks, but is prone to glue overflow and steel plate sticking in the PVC magnetic card and PLA magnetic card hot pressing compounding process.
CN 108148518A discloses a peel-off magnetic stripe and a preparation method thereof, which is composed of a release layer, a UV layer, a magnetic layer and an adhesive layer sequentially coated on a carrier film. In the high-temperature heat transfer process, the carrier layer is easily separated from the UV layer through the release layer, and the UV layer is used as a protective layer of the magnetic layer to enable the magnetic stripe to be resistant to abrasion and alcohol wiping.
CN101661824A discloses a magnetic stripe, which comprises a tape base layer, a magnetic layer, and a protective layer, wherein the adhesive layer comprises the following components: 12-18 parts of nano silicon dioxide, 12-18 parts of thermoplastic polyurethane, 50-60 parts of a vinyl chloride-vinyl acetate copolymer, 0.4-0.6 part of tetradecanoic acid, 0.8-1.2 parts of alkyl tin salt, 1.0-1.4 parts of epoxy resin, and a mixed solvent of toluene and butanone, wherein the ratio of toluene to butanone is = 2: 3.
CN1622127A discloses a magnetic stripe, which is composed of (1) a sticking layer, (2) a tape base, (3) a magnetic layer, and (4) a protective layer, and is characterized in that the formula of the protective layer (parts by weight) is as follows: 5-90 parts of a terpolymer; 5-100 parts of polyurethane; 2-30 parts of an auxiliary agent; 3-30 parts of an antistatic agent; 1-20 parts of a grinding agent; 0.1-10 parts of a dispersing agent; 2-30 parts of a curing agent; 400-1400 parts of a solvent.
CN 108099444A discloses a transfer type magnetic stripe for processing single cards and a preparation method thereof, which comprises a base tape, a stripping layer, a magnetic layer and an adhesive layer, wherein the components and the parts by weight of the stripping layer and the components and the parts by weight of the magnetic layer are limited.
However, although the above prior arts all disclose a magnetic stripe and some prior arts also disclose a preparation method of an adhesive layer, after practical experiments and applications by those skilled in the art, none of the above prior arts can satisfy the low-temperature lamination process of the PLA film below 130 ℃.
Disclosure of Invention
The invention aims to provide a heat transfer type magnetic stripe suitable for a PLA substrate smart card magnetic mounting process, which can meet the requirement of a PLA film magnetic mounting process at a low temperature below 130 ℃.
In order to solve the technical problems, the invention discloses a heat transfer type magnetic stripe suitable for low-temperature magnetic mounting of a PLA substrate, wherein a pasting layer of the heat transfer type magnetic stripe is improved to be suitable for a low-temperature magnetic mounting process of a PLA film below 130 ℃, and a tape base, a functional layer and a magnetic layer of the heat transfer type magnetic stripe are not changed, and the technical scheme is as follows:
a preparation method of a heat transfer type magnetic stripe suitable for low-temperature magnetic lamination of a PLA substrate adopts the following technical scheme: the adhesive comprises an adhesive layer, wherein the adhesive layer comprises the following components in parts by weight:
wherein said low Tg thermoplastic acrylic resin has a Tg of from 20 ℃ to 50 ℃; the low-crystallinity copolyester has Tg value of-20-0 ℃ and melting point of 70-100 ℃, and both have lower melting heat absorption, and can be melted within 0.05-0.1 seconds after being heated by a hot roller at 125 ℃.
The low Tg thermoplastic acrylic resins described therein, commercially available for use in the present invention, include B-48N available from rohm and haas, and ACR7400 available from sandex.
The low crystallinity copolyesters described therein, commercially available grades suitable for use in the present invention, include S600 from Hangao GmbH, S1401 from Wingndegsi.
Wherein the preferred ratio of the resin (including the thermoplastic acrylic resin and the low crystallinity copolyester) to the filler (including silica or polymeric wax) is from 4 to 7, more preferably from 5 to 6. When the ratio of the resin to the filler is less than 4, the magnetic stripe adhesive layer is easy to adhere in the coating and rolling process, and the adhesive is easy to overflow in the magnetic card hot-pressing compounding process; when the ratio of resin to filler is greater than 7, problems of poor mounting at temperatures below 130 ℃ may result.
The resin in the sticking layer can be melted within 0.05-0.1 second in the hot roller heating and pressurizing magnetic pasting process of the heat transfer type magnetic stripe which is made by the sticking layer and is suitable for low-temperature magnetic pasting of PLA substrate, and the like, and can realize firm sticking to the PLA substrate and the like.
Compared with the prior art, the heat transfer type magnetic stripe suitable for low-temperature magnetic lamination of the PLA substrate has the following advantages:
1. the magnetic material is suitable for a low-temperature magnetic mounting process of a PLA base material smart card below 130 ℃, has good adhesion with the PLA base material, and is suitable for the environmental protection trend that the PLA base material replaces a PVC base material in the smart card industry.
2. Meanwhile, the invention is also suitable for a PVC film low-temperature magnetic mounting process below 130 ℃ or a PVC film high-speed magnetic mounting process at 150 ℃, the heat transfer type magnetic stripe has good adhesive force as same as PVC, and for the current PVC smart card manufacturing process, the magnetic mounting temperature can be reduced or the magnetic mounting speed can be improved, thus meeting the current environmental protection trend of saving energy.
Detailed Description
The applicant's related company patent application, application No.: CN2007101853618, publication no: CN 101178779A discloses a heat transfer magnetic stripe with a decorative layer, which comprises a tape base, a stripping layer, a magnetic layer and an adhesive layer, wherein the decorative layer is arranged between the stripping layer and the magnetic layer, and an isolating layer is arranged between the decorative layer and the magnetic layer, and the components which limit the weight parts of the isolating layer are prepared. Although the prior art can be better used on a PVC substrate smart card, the mounting adaptation temperature is 160-200 ℃, but the prior art is not suitable for the mounting process of the PLA substrate smart card below 130 ℃, the prior art cannot be mounted with a PVC film at the mounting temperature below 130 ℃, and the PVC film is easy to fall off in the processing process. On the basis, engineering technicians in the field design a heat transfer type magnetic strip suitable for low-temperature magnetic mounting of a PLA (polylactic acid) base material through long-term research and experiments, the low-temperature magnetic mounting process of a PLA film below 130 ℃ can be met, the magnetic strip and the PLA base material have good adhesive force, and the heat transfer type magnetic strip is suitable for the environmental protection trend that the PLA base material replaces a PVC base material in the current smart card industry.
The preparation method of the heat transfer type magnetic stripe suitable for low-temperature magnetic lamination of the PLA substrate is capable of being suitable for a low-temperature magnetic lamination process of a PLA film below 130 ℃, and is characterized in that:
step 1: coating a stripping layer and a decorative layer on the belt base in a coating mode;
and 2, step: coating a magnetic layer on the stripping layer and the decoration layer;
and step 3: and coating a sticking layer on the magnetic layer, drying and cutting to obtain the heat transfer type magnetic stripe suitable for low-temperature magnetic mounting of the PLA substrate. The coating modes comprise bar coating, gravure coating, extrusion coating and reverse roll coating. The preparation method of the bonding layer comprises the following steps: the low Tg thermoplastic acrylic resin, the low crystallinity copolyester, the silicon dioxide, the high molecular wax, the silane coupling agent and the solvent are stirred uniformly and are sanded and dispersed by a basket-type or horizontal sand mill to prepare the adhesive laminating slurry. The low Tg thermoplastic acrylic resin includes B-48N available from Rohm and Haas company and ACR7400 available from Tongde resin company. The low crystallinity copolyester comprises S600 from hangaku corporation and S1401 from woundplast corporation. The preparation method of the heat transfer type magnetic stripe suitable for low-temperature magnetic mounting of the PLA substrate comprises the following steps of:
the present invention will be further described with reference to specific embodiments, but is not limited thereto.
Example 1
Preparation of adhesive layer paste
2kg of low Tg thermoplastic acrylic resin (B-48N, rohm and Haas) and 10kg of low crystallinity copolyester (Hangao, S600) are added into 20kg of toluene and 30kg of butanone, heated to 50 ℃ and completely dissolved, then 2kg of silicon dioxide (Yingchuang, R972) and 1kg of silane coupling agent (Tianshi, tmax-1623) are added and evenly stirred, and a basket type sand mill is used for sand grinding and dispersion to prepare adhesive layer slurry for standby.
Coating a functional layer such as a stripping layer on a 20 mu m PET tape base, then coating a magnetic layer on the functional layer, finally coating the pasting layer of the invention on the magnetic layer, drying and cutting to obtain the thermal transfer type magnetic stripe which is suitable for low-temperature magnetic pasting of the PLA substrate and has the functional layer thickness of 5 mu m, the magnetic layer thickness of 12 mu m and the pasting layer thickness of 4 mu m, and testing the performance of the thermal transfer type magnetic stripe.
Example 2
Preparation of adhesive layer paste
Adding 3kg of low Tg thermoplastic acrylic resin (B-48N, rohm and Haas) and 14kg of low crystallinity copolyester (Yingchuang, S1401) into 24kg of toluene and 36kg of butanone, heating to 50 ℃ to completely dissolve, then adding 3kg of high molecular wax (Tianshi, tmax-1623) and 1.4kg of silane coupling agent (Tianshi, tmax-1623), uniformly stirring, and dispersing and sanding by using a horizontal sand mill to prepare adhesive layer slurry for later use.
Coating functional layers such as a stripping layer and the like on a 20-micron PET tape base, then coating a magnetic layer on the functional layer, finally coating the adhesive layer of the invention on the magnetic layer, drying and cutting to obtain the heat transfer type magnetic stripe which is suitable for low-temperature magnetic mounting of a PLA substrate and has the functional layer thickness of 5 microns, the magnetic layer thickness of 12 microns and the adhesive layer thickness of 4 microns, and testing the performance of the heat transfer type magnetic stripe.
Example 3
Preparation of adhesive layer paste
4kg of low Tg thermoplastic acrylic resin (ACR 7400, tongde resin) and 16kg of low crystallinity copolyester (Hangao, S600) are added into 32kg of toluene and 48kg of butanone, heated to 50 ℃ and completely dissolved, then 4kg of silicon dioxide (Yingchuang, R972) and 2kg of silane coupling agent (Shitian, tmax-1623) are added and evenly stirred, and the mixture is sanded and dispersed by a basket type sand mill to prepare adhesive layer slurry for standby.
Coating functional layers such as a stripping layer and the like on a 20-micron PET tape base, then coating a magnetic layer on the functional layer, finally coating the adhesive layer of the invention on the magnetic layer, drying and cutting to obtain the heat transfer type magnetic stripe which is suitable for low-temperature magnetic mounting of a PLA substrate and has the functional layer thickness of 5 microns, the magnetic layer thickness of 12 microns and the adhesive layer thickness of 4 microns, and testing the performance of the heat transfer type magnetic stripe.
Example 4
Preparation of adhesive layer paste
4kg of low Tg thermoplastic acrylic resin (ACR 7400, tongde resin) and 16kg of low crystallinity copolyester (Hangao, S600) are added into 32kg of toluene and 48kg of butanone and heated to 50 ℃ for complete dissolution, then 3kg of silicon dioxide (Yingchuang, R972), 1kg of high molecular wax (Tianshi, tmax-1623) and 2kg of silane coupling agent (Tianshi, tmax-1623) are added and evenly stirred, and the mixture is sanded and dispersed by a basket type sand mill to prepare adhesive layer slurry for standby.
Coating a functional layer such as a stripping layer on a 20 mu m PET tape base, then coating a magnetic layer on the functional layer, finally coating the pasting layer of the invention on the magnetic layer, drying and cutting to obtain the thermal transfer type magnetic stripe which is suitable for low-temperature magnetic pasting of the PLA substrate and has the functional layer thickness of 5 mu m, the magnetic layer thickness of 12 mu m and the pasting layer thickness of 4 mu m, and testing the performance of the thermal transfer type magnetic stripe.
Comparative example 1
Preparation of adhesive layer paste
Adding 6kg of low Tg thermoplastic acrylic resin (ACR 7400, tongde resin) and 20kg of low crystallinity copolyester (Hangao, S600) into 32kg of toluene and 48kg of butanone, heating to 50 ℃ to completely dissolve, then adding 2kg of silicon dioxide (Yingchuang, R972), 1kg of high molecular wax (Tianshi, tmax-1623) and 2kg of silane coupling agent (Tianshi, tmax-1623), stirring uniformly, and using a basket type sand mill to sand and disperse to prepare adhesive layer slurry for later use.
Coating a functional layer such as a stripping layer on a 20 mu m PET tape base, then coating a magnetic layer on the functional layer, finally coating the pasting layer of the invention on the magnetic layer, drying and cutting to obtain the thermal transfer type magnetic stripe which is suitable for low-temperature magnetic pasting of the PLA substrate and has the functional layer thickness of 5 mu m, the magnetic layer thickness of 12 mu m and the pasting layer thickness of 4 mu m, and testing the performance of the thermal transfer type magnetic stripe.
Comparative example 2
Preparation of adhesive layer paste
4kg of low Tg thermoplastic acrylic resin (B-48N, rohm and Haas) and 16kg of low crystallinity copolyester (Yingchuang, S1401) are added into 32kg of toluene and 48kg of butanone, heated to 50 ℃ and completely dissolved, then 3kg of silicon dioxide (Yingchuang, R972), 2.5kg of high molecular wax (Tianshi, tmax-1623) and 2kg of silane coupling agent (Tianshi, tmax-1623) are added and uniformly stirred, and a basket type sand mill is used for dispersing to prepare adhesive layer slurry for standby.
Coating a functional layer such as a stripping layer on a 20 mu m PET tape base, then coating a magnetic layer on the functional layer, finally coating the pasting layer of the invention on the magnetic layer, drying and cutting to obtain the thermal transfer type magnetic stripe which is suitable for low-temperature magnetic pasting of the PLA substrate and has the functional layer thickness of 5 mu m, the magnetic layer thickness of 12 mu m and the pasting layer thickness of 4 mu m, and testing the performance of the thermal transfer type magnetic stripe.
Comparative example 3
A functional layer such as a peel-off layer is coated on a 20 μm PET tape base, then a magnetic layer is coated on the functional layer, finally an adhesive layer disclosed in patent CN 101178779A is coated on the magnetic layer, and the magnetic layer is dried and cut to obtain a common transfer type magnetic stripe with the functional layer thickness of 5 μm, the magnetic layer thickness of 12 μm and the adhesive layer thickness of 4 μm, and the performance of the magnetic stripe is tested.
Comparative example 4
Coating a functional layer such as a stripping layer on a 20 μm PET tape substrate, coating a magnetic layer on the functional layer, coating an adhesive layer disclosed in patent CN 102501681A on the magnetic layer, drying, and cutting to obtain a common transfer type magnetic stripe with a functional layer thickness of 5 μm, a magnetic layer thickness of 12 μm, and an adhesive layer thickness of 4 μm, and testing the performance.
Table 1: table of Performance data for each example and comparative example
The test methods for the properties in the table are as follows:
(1) Peeling property test method:
and (3) rolling and thermally compounding on a magnet mounting machine with the temperature of a hot roller of 150 ℃, transferring the magnetic strip to a PVC film, and simultaneously carrying out online stripping, wherein the strip base has no coating residue, and the strip base is completely stripped to be qualified.
The PVC film mounting magnetic property testing method at 125 ℃ comprises the following steps:
rolling and thermally compounding the magnetic strips on a magnet mounting machine with the temperature of a hot roller of 125 ℃ at the speed of 6M/min, transferring the magnetic strips to a PVC film, stripping the base tape, sticking the base tape on the surface of the magnetic strips by using a 3M transparent adhesive tape for forced stripping, and ensuring that the magnetic strips are qualified after falling off.
The method for testing the mounting magnetic property of the PLA film at 125 ℃ comprises the following steps:
rolling and thermally compounding the magnetic strips on a magnet mounting machine with the temperature of a hot roller of 125 ℃ at the speed of 6M/min, transferring the magnetic strips to a PLA film, stripping the base tape, sticking the base tape on the surface of the magnetic strips by using a 3M transparent adhesive tape for forced stripping, and enabling the magnetic strips to fall off to be qualified.
The method for testing the high-speed lamination magnetic property of the PVC film comprises the following steps:
rolling and thermally compounding on a magnet mounting machine with the temperature of a hot roller of 150 ℃ at the speed of 12M/min, transferring the magnetic strip to a PVC film, stripping the base tape, adhering the base tape on the surface of the magnetic strip by using a 3M transparent adhesive tape for forced stripping, and enabling the magnetic strip to fall off to be qualified.
The hot-pressing composite test method comprises the following steps:
performing hot-pressing compounding on the magnetic card by using a magnetic stripe laminating machine under the conditions that the temperature is set to be 130 ℃, the pressure is set to be 2.5MPa and the time is set to be 20 min; cooling to below 45 deg.C, releasing pressure, uncovering the steel plate, and observing that the non-magnetic strip coating layer is adhered on the steel plate and the surface of the magnetic card has no glue overflow.
Sixthly, a wear-resisting characteristic testing method:
and (3) carrying out hot-pressing composite card making on the magnetic stripe sample, and carrying out wear resistance test by using a card swiping machine or a magnetic stripe wear resistance tester.
Output characteristic test method:
the test and evaluation were carried out using a magnetic stripe MT3000 tester.
The test results in the table show that the thermal transfer type magnetic stripe suitable for low-temperature magnetic lamination of PLA (Poly lactic acid) substrates, which is prepared by the invention, has stripping characteristic, hot-pressing compounding characteristic, wear-resisting characteristic and output characteristic which meet the card making requirement of smart cards, and simultaneously meets the low-temperature magnetic lamination process of PLA (or PVC) substrates smart cards below 130 ℃ and the high-speed magnetic lamination process of PVC films at 150 ℃. The transfer type magnetic stripe prepared by the invention is suitable for the environmental protection trend of replacing a PVC (polyvinyl chloride) base material with a PLA (polylactic acid) base material in the current smart card industry; for the current card manufacturing process of the PVC smart card, the magnetic mounting temperature can be reduced or the magnetic mounting speed can be increased, and the current environment-friendly trend of saving energy is met.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. The preparation method of the heat transfer type magnetic stripe suitable for low-temperature magnetic lamination of the PLA substrate is characterized in that the magnetic stripe can be suitable for a low-temperature magnetic lamination process of a PLA film below 130 ℃, and the preparation method comprises the following steps:
step 1: coating a stripping layer and a decorative layer on the belt base in a coating mode;
and 2, step: coating a magnetic layer on the stripping layer and the decorative layer;
and step 3: coating a sticking layer on the magnetic layer, drying and cutting to obtain a heat transfer type magnetic stripe suitable for low-temperature magnetic mounting of a PLA (polylactic acid) substrate;
the adhesive layer is prepared by adopting the following formula:
10 to 20 parts of low-Tg thermoplastic acrylic resin
50 to 80 parts of low-crystallinity copolyester
5 to 20 parts of silicon dioxide or polymer wax
5 to 10 portions of silane coupling agent
100 to 160 parts of toluene
150 to 240 parts of butanone;
the low Tg value thermoplastic acrylic resin has a Tg value of 20-50 ℃; the low-crystallinity copolyester has Tg of-20-0 ℃ and a melting point of 70-100 ℃, and the low-crystallinity copolyester and the melting point can be melted by heating with a hot roller at 125 ℃ for 0.05-0.1 second and can be firmly adhered to a PLA base material; the silicon dioxide is prepared by winning wound, R972; the polymer wax adopts Tianshi, tmax-1623;
the ratio of the sum of the parts by weight of the low Tg thermoplastic acrylic resin and the low crystallinity copolyester to the parts by weight of the silica or polymeric wax is 4 to 7.
2. The preparation method of the thermal transfer type magnetic stripe adapting to low-temperature lamination of PLA substrate as claimed in claim 1, is characterized in that: the coating modes comprise bar coating, gravure coating, extrusion coating and reverse roll coating.
3. A thermal transfer type magnetic stripe characterized in that: the preparation method of the heat transfer type magnetic stripe adapting to low-temperature magnetic lamination of the PLA substrate is adopted, and the preparation method is as claimed in any one of claims 1-2.
4. A PLA substrate for the smart card industry, characterized by: comprising the thermal transfer magnetic stripe of claim 3.
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| CN101178779A (en) * | 2007-12-11 | 2008-05-14 | 中国乐凯胶片集团公司 | Heat displace magnetic stripe having decorative layer |
| CN103320036A (en) * | 2013-06-17 | 2013-09-25 | 昆山韩保胶带科技有限公司 | Biodegradable double-sided adhesive tape |
| WO2022087102A1 (en) * | 2020-10-20 | 2022-04-28 | Bostik, Inc. | Amorphous copolyester resins for use as a cold seal adhesive, coating compositions |
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| GB0716456D0 (en) * | 2007-08-23 | 2007-10-03 | Innovia Films Ltd | Packaging article |
| DE102008012516A1 (en) * | 2008-03-04 | 2009-09-10 | Lanxess Deutschland Gmbh | Crosslinkable compositions, thermoplastic elastomers obtainable therefrom and their use |
| US9573348B2 (en) * | 2012-11-05 | 2017-02-21 | Toray Plastics (America), Inc. | Lidding structure based on aromatic polyester film, coextruded with a sealable/peelable epdxy-containing thermoplastic polymer |
| AU2015236050B2 (en) * | 2014-03-26 | 2018-08-30 | Bostik, Inc. | Solvent-based low temperature heat seal coating |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10193543A (en) * | 1997-01-13 | 1998-07-28 | Teijin Ltd | Easy adhesive white polyester film |
| JP2002220577A (en) * | 2001-01-26 | 2002-08-09 | Toppan Printing Co Ltd | Adhesive resin composition, method for producing the same and readily adhesive resin film by the method |
| CN101178779A (en) * | 2007-12-11 | 2008-05-14 | 中国乐凯胶片集团公司 | Heat displace magnetic stripe having decorative layer |
| CN103320036A (en) * | 2013-06-17 | 2013-09-25 | 昆山韩保胶带科技有限公司 | Biodegradable double-sided adhesive tape |
| WO2022087102A1 (en) * | 2020-10-20 | 2022-04-28 | Bostik, Inc. | Amorphous copolyester resins for use as a cold seal adhesive, coating compositions |
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