CN113817288B - Heat-conducting engineering plastic and preparation method thereof - Google Patents
Heat-conducting engineering plastic and preparation method thereof Download PDFInfo
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- 229920006351 engineering plastic Polymers 0.000 title claims abstract description 50
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 141
- 239000000843 powder Substances 0.000 claims abstract description 62
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000004964 aerogel Substances 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 29
- 238000005245 sintering Methods 0.000 claims abstract description 29
- 229920003023 plastic Polymers 0.000 claims abstract description 27
- 239000004033 plastic Substances 0.000 claims abstract description 27
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910001416 lithium ion Inorganic materials 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 21
- 239000000017 hydrogel Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000000498 ball milling Methods 0.000 claims abstract description 10
- 230000021523 carboxylation Effects 0.000 claims abstract description 5
- 238000006473 carboxylation reaction Methods 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 73
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 54
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 32
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 20
- 239000011159 matrix material Substances 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 18
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 16
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 16
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 16
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 claims description 12
- 229940106681 chloroacetic acid Drugs 0.000 claims description 12
- 239000008367 deionised water Substances 0.000 claims description 12
- 229910021641 deionized water Inorganic materials 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 11
- 238000004108 freeze drying Methods 0.000 claims description 9
- 238000007731 hot pressing Methods 0.000 claims description 7
- 239000003513 alkali Substances 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims description 6
- 238000009210 therapy by ultrasound Methods 0.000 claims description 6
- 238000007602 hot air drying Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 abstract description 5
- 239000002245 particle Substances 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 36
- 230000000052 comparative effect Effects 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000002386 leaching Methods 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- -1 hydroxyl ions Chemical class 0.000 description 4
- 239000012670 alkaline solution Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K9/02—Ingredients treated with inorganic substances
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
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Abstract
The invention discloses a heat-conducting engineering plastic and a preparation method thereof. The process flow of the heat conduction engineering plastic prepared by the invention is as follows: carboxylation treatment, pretreatment, sintering, ionization, drying, ball milling, hydrogel preparation, aerogel preparation and finished product. When the heat-conducting engineering plastic prepared by the method is heated, air in the modified graphene aerogel is heated and expanded, and the mixed material of copper powder and magnesia powder is extruded, so that the powder is in great contact and series connection, a heat-conducting chain is formed, and the heat conductivity of the engineering plastic is realized; lithium ions in the modified graphene powder on the modified graphene aerogel are heated and dispersed between plastic matrixes, so that the plastic among the heat conducting particles is reduced, the binding property between the filler and the matrixes is increased, the thermal resistance of the machine body is reduced, and the thermal conductivity of the heat conducting engineering plastic is improved.
Description
Technical Field
The invention relates to the technical field of new materials, in particular to a heat-conducting engineering plastic and a preparation method thereof.
Background
The ways to improve the thermal conductivity of a material include two ways: one is intrinsic heat conducting plastic, which is a material obtained by changing the molecular structure of the material by a mechanical processing method; because the cleanliness is complete, the heat conduction mechanism is mainly through phonon or electron conduction; the second is filled heat-conducting plastic, namely, a high polymer resin is used as a matrix, and a heat-conducting filler is added into the matrix resin to prepare a composite material; the intrinsic heat conduction composite material has high crystallization orientation degree, so that the processing difficulty of the material is high, the processing technology of the filling type heat conduction composite material is simple, the cost is low, the application range is wide, and the material is more and more valued along with the development of the filling type heat conduction composite material.
The heat conduction engineering plastics in the current market have a large lifting space in heat conductivity, and the heat resistance of the heat conduction plastics per se needs to be improved. When the heat-conducting engineering plastic prepared by the invention is heated, air in the modified graphene aerogel is heated and expanded, and the mixed material of copper powder and magnesia powder is extruded, so that the powder is in great contact and series connection, a heat-conducting chain is formed, and the heat conductivity of the engineering plastic is realized; lithium ions in the modified graphene powder on the modified graphene aerogel are heated and dispersed between plastic matrixes, so that the plastic among the heat conducting particles is reduced, the binding property between the filler and the matrixes is increased, the thermal resistance of the machine body is reduced, and the thermal conductivity of the heat conducting engineering plastic is improved.
Disclosure of Invention
The invention aims to provide a heat conduction engineering plastic and a preparation method thereof, which are used for solving the problems in the prior art.
In order to solve the technical problems, the invention provides the following technical scheme: the preparation method of the heat-conducting engineering plastic is characterized by comprising the following steps of:
carboxylation treatment, pretreatment, sintering, ionization, drying, ball milling, hydrogel preparation, aerogel preparation and finished product.
Further, the preparation method of the heat conduction engineering plastic is characterized by comprising the following specific steps of:
(1) Adding graphene microchip and chloroacetic acid into 37% sodium hydroxide solution, and performing ultrasonic treatment at 40KHz frequency for 2-3 h to obtain carboxylated graphene microchip;
(2) Immersing carboxylated graphene micro-sheets in alkali liquor for 1-2 h, raising the temperature to 80-90 ℃ while immersing, carrying out hot-pressing sintering on the carboxylated graphene micro-sheets subjected to alkali immersion after heat preservation for 1h, and carrying out sintering time for 3h to obtain pretreated graphene micro-sheets;
(3) Adding a lithium ion solution with the concentration of 2mol/L into a polyvinylpyrrolidone ethanol solution with the mass fraction of 30%; electrifying and ionizing the pretreated graphene microchip in a polyvinylpyrrolidone ethanol solution containing 30% of lithium ions by mass fraction for 0.5-1 h, wherein the voltage is 220V;
(4) Carrying out hot air drying on the ionized pretreated graphene microchip for 30-40 min at 40-50 ℃ to obtain a modified graphene microchip;
(5) Crushing the modified graphene microchip by using a rod type ball mill, wherein the ball milling time is 30-40 min, and obtaining modified graphene powder;
(6) Dispersing modified graphene powder in deionized water, adding ethylenediamine, and reacting at 90-100 ℃ for 5-6 hours to obtain hydrogel;
(7) Freeze-drying the hydrogel in a freeze dryer for 40-48 hours, and then carrying out microwave treatment on the freeze-dried product to obtain modified graphene aerogel;
(8) And dispersing the modified graphene aerogel in a plastic matrix, and adding the mixed material of copper powder and magnesium oxide powder to prepare the heat-conducting engineering plastic.
Further, in the step (1), the mass ratio of the graphene microchip to the 37% sodium hydroxide solution to the chloroacetic acid is 1:3:0.6-1:3:0.7.
Further, in the step (2), the alkali liquor is 40% sodium hydroxide solution, the heating rate is 5 ℃/min, the sintering pressure is 30-35 MPa, and the sintering temperature is 1000-1100 ℃.
Further, in the step (3), the mass ratio of the lithium ion solution to the polyvinylpyrrolidone ethanol solution with the mass fraction of 30% is 0.2:1.3-0.4:1.3.
Further, in the step (6), the mass ratio of the modified graphene powder to the deionized water to the ethylenediamine is 1:9:1.3-1:10:1.5.
Further, in the step (7), the temperature is-78 to-90 ℃ during freeze drying; during microwave treatment, the power is 800W, and the treatment time is 3-5 min.
Further, in the step (8), the mass ratio of the graphene aerogel to the plastic matrix is 2:31-5:78; the mass ratio of the copper powder to the magnesium oxide powder is 2:3-2:4; the mass ratio of the plastic matrix to the mixed material of the copper powder and the magnesia powder is 37:7-37:10, and the plastic matrix is liquid epoxy resin.
Further, the heat-conducting engineering plastic prepared by the preparation method of the heat-conducting engineering plastic comprises the following raw materials in parts by weight: 100-130 parts of plastic matrix, 15-20 parts of modified graphene aerogel, 25-30 parts of copper powder and magnesium oxide powder, wherein the plastic matrix is liquid epoxy resin.
Compared with the prior art, the invention has the following beneficial effects:
according to the preparation method, carboxylated graphene microplates are prepared after carboxylation treatment, the carboxylated graphene microplates are subjected to alkaline leaching and heating at the same time, and then the carboxylated graphene microplates subjected to alkaline leaching are subjected to hot-press sintering at high temperature to prepare pretreated graphene microplates; immersing the pretreated graphene microchip in a polyvinylpyrrolidone ethanol solution containing 30% of lithium ions by mass fraction, electrifying and ionizing the pretreated graphene microchip in the polyvinylpyrrolidone ethanol solution containing 30% of lithium ions by mass fraction, and drying the pretreated graphene microchip after ionizing for a period of time to obtain a modified graphene microchip; the carboxylation treatment of the graphene microchip enables the surface of the graphene microchip to have a large number of oxygen-containing functional groups, so that the dispersibility of the graphene microchip in alkaline leaching solution is improved, and meanwhile, the surface activity of the graphene microchip is improved; the alkaline leaching increases the activity of the surface of the carboxylated graphene microchip, and a large amount of free high-activity hydroxyl ions are carried, so that the activity of the hydroxyl ions in the alkaline solution is increased by heating, and the action time of the alkaline solution on the carboxylated graphene microchip is reduced; during hot-pressing sintering, a large amount of hydroxide ions erode the carboxylated graphene microplates after alkaline leaching, and hydrogen ions on the carboxylated graphene microplates are taken away at high temperature and high pressure, so that the carboxylated graphene microplates have compact structures and the bonding degree between the carboxylated graphene microplates is reduced; during ionization, lithium ions are intercalated between the pretreated graphene sheets and in micropores under the action of current, so that the pretreated graphene microplates have positive charges, and the dispersion performance in a plastic matrix is improved.
Ball milling and crushing modified graphene microplates to obtain modified graphene powder, dispersing the modified graphene powder in deionized water, washing, then reacting with ethylenediamine to obtain hydrogel, freeze-drying the hydrogel, and performing microwave operation to obtain modified graphene aerogel; dispersing the modified graphene aerogel in a plastic matrix, and adding a mixture of copper powder and magnesium oxide powder to prepare heat-conducting engineering plastic; the stability of the modified graphene powder dispersed in deionized water is gradually reduced, and the modified graphene powder starts to be slowly crosslinked to form hydrogel along with the weakening of the stability and the enhancement of the interaction among the modified graphene powder; the solvent in the hydrogel is removed through freeze drying treatment, and the microwave operation enhances the interaction between the modified graphene powder and improves the stability of the modified graphene aerogel while removing other hetero atoms; the modified graphene aerogel is dispersed in a plastic matrix, when the matrix is heated, air in the modified graphene aerogel is heated and expanded, and the mixed material of copper powder and magnesium oxide powder is extruded, so that the powder is in great contact and series connection, a heat conduction chain is formed, and the heat conductivity of engineering plastics is realized; lithium ions in the modified graphene powder on the modified graphene aerogel are heated and dispersed between plastic matrixes, so that the plastic among the heat conducting particles is reduced, the binding property between the filler and the matrixes is increased, the thermal resistance of the machine body is reduced, and the thermal conductivity of the heat conducting engineering plastic is improved.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order to more clearly illustrate the method provided by the invention, the following examples are used for describing the detailed description, and the method for testing each index of the heat-conducting engineering plastic manufactured in the following examples is as follows:
thermal conductivity: the heat conduction engineering plastics obtained in example 1 and example 2 and comparative example 1 and comparative example 2 were subjected to heat conduction test by using a transient plane heat source method ISO22007-2, and the higher the heat conduction coefficient is, the higher the heat conduction of the substance is, and the details are shown in table 1.
Example 1
The heat-conducting engineering plastic mainly comprises the following components in parts by weight: 100 parts of liquid resin, 15 parts of modified graphene aerogel, 25 parts of copper powder and magnesium oxide powder.
The preparation method of the heat-conducting engineering plastic mainly comprises the following preparation steps:
(1) Adding graphene microplates and chloroacetic acid into a 37% sodium hydroxide solution, and carrying out ultrasonic treatment for 2 hours at a frequency of 40KHz, wherein the mass ratio of the graphene microplates to the 37% sodium hydroxide solution to the chloroacetic acid is 1:3:0.6, so as to prepare carboxylated graphene microplates;
(2) Immersing carboxylated graphene micro-sheets in 40% sodium hydroxide solution for 1h, raising the temperature to 80 ℃ while immersing, keeping the temperature at a rate of 5 ℃/min, and carrying out hot-pressing sintering on the carboxylated graphene micro-sheets subjected to alkaline immersion after 1h of heat preservation, wherein the sintering pressure is 30MPa, the sintering temperature is 1000 ℃ and the sintering time is 3h, so as to obtain pretreated graphene micro-sheets;
(3) Adding a lithium ion solution with the concentration of 2mol/L into a polyvinylpyrrolidone ethanol solution with the mass fraction of 30%; electrifying and ionizing the pretreated graphene microchip in a polyvinylpyrrolidone ethanol solution containing 30% of lithium ions in a mass ratio of 0.2:1.3, wherein the ionization time is 0.5h, and the voltage is 220V;
(4) Carrying out hot air drying on the ionized pretreated graphene microchip for 30min at 40 ℃ to obtain a modified graphene microchip;
(5) Crushing the modified graphene microchip by using a rod type ball mill, wherein the ball milling time is 30min, so as to prepare modified graphene powder;
(6) Dispersing modified graphene powder in deionized water, adding ethylenediamine, and reacting at 90 ℃ for 5 hours to obtain hydrogel, wherein the mass ratio of the modified graphene powder to the deionized water to the ethylenediamine is 1:9:1.3;
(7) Freeze-drying the hydrogel in a freeze dryer for 40 hours at the temperature of-78 ℃, and then carrying out microwave treatment on the freeze-dried product with the power of 800W for 3 minutes to obtain modified graphene aerogel;
(8) Dispersing modified graphene aerogel in liquid resin, wherein the mass ratio of the graphene aerogel to the liquid resin is 2:31, and adding the mixed material of copper powder and magnesium oxide powder for uniform dispersion to prepare heat-conducting engineering plastic; the mass ratio of the copper powder to the magnesium oxide powder is 2:3; the mass ratio of the liquid resin to the mixed material of the copper powder and the magnesia powder is 37:7.
Example 2
The heat-conducting engineering plastic mainly comprises the following components in parts by weight: 130 parts of liquid resin, 20 parts of modified graphene aerogel, 30 parts of copper powder and magnesium oxide powder.
The preparation method of the heat-conducting engineering plastic mainly comprises the following preparation steps:
(1) Adding graphene microplates and chloroacetic acid into a 37% sodium hydroxide solution, and carrying out ultrasonic treatment for 3 hours at a frequency of 40KHz, wherein the mass ratio of the graphene microplates to the 37% sodium hydroxide solution to the chloroacetic acid is 1:3:0.7, so as to prepare carboxylated graphene microplates;
(2) Immersing carboxylated graphene micro-sheets in 40% sodium hydroxide solution for 2 hours, raising the temperature to 90 ℃ while immersing, keeping the temperature at a rate of 5 ℃/min, and carrying out hot-pressing sintering on the carboxylated graphene micro-sheets subjected to alkaline immersion after heat preservation for 1 hour, wherein the sintering pressure is 35MPa, the sintering temperature is 1100 ℃ and the sintering time is 3 hours, so as to obtain pretreated graphene micro-sheets;
(3) Adding a lithium ion solution with the concentration of 2mol/L into a polyvinylpyrrolidone ethanol solution with the mass fraction of 30%; electrifying and ionizing the pretreated graphene microchip in a polyvinylpyrrolidone ethanol solution containing 30% of lithium ions in a mass ratio of 0.4:1.3, wherein the ionization time is 1h, and the voltage is 220V;
(4) Carrying out hot air drying on the ionized pretreated graphene microchip for 40min at 50 ℃ to obtain a modified graphene microchip;
(5) Crushing the modified graphene microchip by using a rod type ball mill, wherein the ball milling time is 40min, so as to prepare modified graphene powder;
(6) Dispersing modified graphene powder in deionized water, adding ethylenediamine, and reacting at 100 ℃ for 6 hours to obtain hydrogel, wherein the mass ratio of the modified graphene powder to the deionized water to the ethylenediamine is 1:10:1.5;
(7) Freeze-drying the hydrogel in a freeze dryer for 48 hours at the temperature of-90 ℃, and then performing microwave treatment on the freeze-dried product with the power of 800W for 5 minutes to obtain modified graphene aerogel;
(8) Dispersing modified graphene aerogel in liquid resin, wherein the mass ratio of the graphene aerogel to the liquid resin is 5:78, and adding a mixed material of copper powder and magnesium oxide powder for uniform dispersion to prepare heat-conducting engineering plastic; the mass ratio of the copper powder to the magnesium oxide powder is 2:4; the mass ratio of the liquid resin to the mixed material of the copper powder and the magnesia powder is 37:10.
Comparative example 1
The heat-conducting engineering plastic mainly comprises the following components in parts by weight: 100 parts of liquid resin, 15 parts of modified graphene aerogel, 25 parts of copper powder and magnesium oxide powder.
The preparation method of the heat-conducting engineering plastic mainly comprises the following preparation steps:
(1) Adding graphene microplates and chloroacetic acid into a 37% sodium hydroxide solution, and carrying out ultrasonic treatment for 2 hours at a frequency of 40KHz, wherein the mass ratio of the graphene microplates to the 37% sodium hydroxide solution to the chloroacetic acid is 1:3:0.6, so as to prepare carboxylated graphene microplates;
(2) Immersing carboxylated graphene micro-sheets in 40% sodium hydroxide solution for 1h, raising the temperature to 80 ℃ while immersing, keeping the temperature at a rate of 5 ℃/min, and carrying out hot-pressing sintering on the carboxylated graphene micro-sheets subjected to alkaline immersion after 1h of heat preservation, wherein the sintering pressure is 30MPa, the sintering temperature is 1000 ℃ and the sintering time is 3h, so as to obtain pretreated graphene micro-sheets;
(3) Adding a lithium ion solution with the concentration of 2mol/L into a polyvinylpyrrolidone ethanol solution with the mass fraction of 30%; electrifying and ionizing the pretreated graphene microchip in a polyvinylpyrrolidone ethanol solution containing 30% of lithium ions in a mass ratio of 0.2:1.3, wherein the ionization time is 0.5h, and the voltage is 220V;
(4) Crushing the ionized pretreated graphene microchip by using a rod type ball mill, wherein the ball milling time is 30min, so as to prepare modified graphene powder;
(5) Dispersing modified graphene powder in deionized water, adding ethylenediamine, and reacting at 90 ℃ for 5 hours to obtain hydrogel, wherein the mass ratio of the modified graphene powder to the deionized water to the ethylenediamine is 1:9:1.3;
(6) Freeze-drying the hydrogel in a freeze dryer for 40 hours at the temperature of-78 ℃, and then carrying out microwave treatment on the freeze-dried product with the power of 800W for 3 minutes to obtain modified graphene aerogel;
(7) Dispersing modified graphene aerogel in liquid resin, wherein the mass ratio of the graphene aerogel to the liquid resin is 2:31, and adding the mixed material of copper powder and magnesium oxide powder for uniform dispersion to prepare heat-conducting engineering plastic; the mass ratio of the copper powder to the magnesium oxide powder is 2:3; the mass ratio of the liquid resin to the mixed material of the copper powder and the magnesia powder is 37:7.
Comparative example 2
The heat-conducting engineering plastic mainly comprises the following components in parts by weight: 100 parts of liquid resin, 15 parts of modified graphene powder, 25 parts of copper powder and magnesium oxide powder.
The preparation method of the heat-conducting engineering plastic mainly comprises the following preparation steps:
(1) Adding graphene microplates and chloroacetic acid into a 37% sodium hydroxide solution, and carrying out ultrasonic treatment for 2 hours at a frequency of 40KHz, wherein the mass ratio of the graphene microplates to the 37% sodium hydroxide solution to the chloroacetic acid is 1:3:0.6, so as to prepare carboxylated graphene microplates;
(2) Immersing carboxylated graphene micro-sheets in 40% sodium hydroxide solution for 1h, raising the temperature to 80 ℃ while immersing, keeping the temperature at a rate of 5 ℃/min, and carrying out hot-pressing sintering on the carboxylated graphene micro-sheets subjected to alkaline immersion after 1h of heat preservation, wherein the sintering pressure is 30MPa, the sintering temperature is 1000 ℃ and the sintering time is 3h, so as to obtain pretreated graphene micro-sheets;
(3) Adding a lithium ion solution with the concentration of 2mol/L into a polyvinylpyrrolidone ethanol solution with the mass fraction of 30%; electrifying and ionizing the pretreated graphene microchip in a polyvinylpyrrolidone ethanol solution containing 30% of lithium ions in a mass ratio of 0.2:1.3, wherein the ionization time is 0.5h, and the voltage is 220V;
(4) Carrying out hot air drying on the ionized pretreated graphene microchip for 30min at 40 ℃ to obtain a modified graphene microchip;
(5) Crushing the modified graphene microchip by using a rod type ball mill, wherein the ball milling time is 30min, so as to prepare modified graphene powder;
(6) Dispersing modified graphene powder in liquid resin, wherein the mass ratio of the graphene powder to the liquid resin is 2:31, and adding a mixed material of copper powder and magnesium oxide powder for uniform dispersion to prepare heat-conducting engineering plastics; the mass ratio of the copper powder to the magnesium oxide powder is 2:3; the mass ratio of the liquid resin to the mixed material of the copper powder and the magnesia powder is 37:7.
Effect example
The following table 1 shows the analysis results of the heat conductivity of the heat conductive engineering plastics obtained by using the components of the invention in example 1 and example 2 and the components of the invention in comparative example 1 and comparative example 2.
TABLE 1
Thermal conductivity is one of the most important thermal and moisture parameters of building materials. As can be seen from the above table, compared with the heat-conducting engineering plastics of the components of example 2, comparative example 1 and comparative example 2, the heat-conducting engineering plastics of the component of example 1 show better heat conductivity, which means that the modified graphene aerogel is dispersed in the plastic matrix, when the matrix is heated, the air in the modified graphene aerogel is heated and expanded, the mixture of copper powder and magnesia powder is extruded, so that a large amount of powder contacts and is connected in series, a heat-conducting chain is formed, and the heat conductivity of the engineering plastics is realized; lithium ions in the modified graphene powder on the modified graphene aerogel are heated and dispersed between plastic matrixes, so that the plastic among the heat conducting particles is reduced, the binding property between the filler and the matrixes is increased, the thermal resistance of the machine body is reduced, and the thermal conductivity of the heat conducting engineering plastic is improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The preparation method of the heat-conducting engineering plastic is characterized by comprising the following steps of: carboxylation treatment, pretreatment, sintering, ionization, drying, ball milling, hydrogel preparation, aerogel preparation and finished product;
the preparation method of the heat conduction engineering plastic comprises the following specific steps:
(1) Adding graphene microplates and chloroacetic acid into a 37% sodium hydroxide solution, and performing ultrasonic treatment at the frequency of 40KHz for 2-3 hours to obtain carboxylated graphene microplates;
(2) Immersing carboxylated graphene micro-sheets in alkali liquor for 1-2 h, raising the temperature to 80-90 ℃ while immersing, carrying out hot-pressing sintering on the carboxylated graphene micro-sheets subjected to alkali immersion after heat preservation for 1h, and carrying out sintering time for 3h to obtain pretreated graphene micro-sheets;
(3) Adding a lithium ion solution with the concentration of 2mol/L into a polyvinylpyrrolidone ethanol solution with the mass fraction of 30%; electrifying and ionizing the pretreated graphene microchip in a polyvinylpyrrolidone ethanol solution containing 30% of lithium ions by mass fraction for 0.5-1 h, wherein the voltage is 220V;
(4) Carrying out hot air drying on the ionized pretreated graphene microchip for 30-40 min at 40-50 ℃ to obtain a modified graphene microchip;
(5) Crushing the modified graphene microchip by using a rod type ball mill, wherein the ball milling time is 30-40 min, and obtaining modified graphene powder;
(6) Dispersing the modified graphene powder in deionized water, adding ethylenediamine, and reacting at 90-100 ℃ for 5-6 hours to obtain hydrogel;
(7) Freeze-drying the hydrogel in a freeze dryer for 40-48 hours, and then carrying out microwave treatment on the freeze-dried product to obtain modified graphene aerogel;
(8) And dispersing the modified graphene aerogel in a plastic matrix, and adding the mixed material of the copper powder and the magnesium oxide powder to uniformly disperse to prepare the heat-conducting engineering plastic.
2. The method for preparing a heat-conducting engineering plastic according to claim 1, wherein in the step (1), the mass ratio of graphene micro-sheets, 37% sodium hydroxide solution and chloroacetic acid is 1:3:0.6-1:3:0.7.
3. The method for preparing heat-conducting engineering plastic according to claim 1, wherein in the step (2), the alkali solution is 40% sodium hydroxide solution, the heating rate is 5 ℃/min, the sintering pressure is 30-35 mpa, and the sintering temperature is 1000-1100 ℃.
4. The method for preparing a heat-conducting engineering plastic according to claim 1, wherein in the step (3), the mass ratio of the lithium ion solution with the concentration of 2mol/L to the polyvinylpyrrolidone ethanol solution with the mass fraction of 30% is 0.2:1.3-0.4:1.3.
5. The method for preparing heat-conducting engineering plastic according to claim 1, wherein in the step (6), the mass ratio of the modified graphene powder to deionized water to ethylenediamine is 1:9:1.3-1:10:1.5.
6. The method for preparing heat-conducting engineering plastic according to claim 1, wherein in the step (7), the temperature is-78 to-90 ℃ during freeze drying; the power is 800W and the treatment time is 3-5 min during microwave treatment.
7. The method for preparing the heat-conducting engineering plastic according to claim 1, wherein in the step (8), the mass ratio of graphene aerogel to plastic matrix is 2:31-5:78; the mass ratio of the copper powder to the magnesium oxide powder is 2:3-2:4; the mass ratio of the plastic matrix to the mixed material of the copper powder and the magnesia powder is 37:7-37:10, and the plastic matrix is liquid resin.
8. The preparation method of the heat-conducting engineering plastic according to claim 1, which is characterized by comprising the following raw materials in parts by weight: 100-130 parts of plastic matrix, 15-20 parts of modified graphene aerogel, 25-30 parts of copper powder and magnesium oxide powder, wherein the plastic matrix is liquid resin.
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