CN113814624A

CN113814624A - Welding device and welding method for laser

Info

Publication number: CN113814624A
Application number: CN202111398229.1A
Authority: CN
Inventors: 王志文; 廖传武; 张亮; 宋小飞; 侯炳泽; 贺亮
Original assignee: Dalian Youxun Technology Co Ltd; Shenyang Aomeide Technology Co ltd
Current assignee: Dalian Youxun Technology Co Ltd; Shenyang Aomeide Technology Co ltd
Priority date: 2021-11-24
Filing date: 2021-11-24
Publication date: 2021-12-21

Abstract

The application relates to a welding device and a welding method for a laser, and belongs to the field of optical communication. The welding device includes: a base (10); and a fastening device comprising at least one pressure plate (40). A first height at which the first stage protrudes relative to the base (10) is adaptively adjustable in response to depression of the pressure plate (40), and a second height at which the second stage protrudes relative to the top surface of the base (10) is fixed. According to the welding device disclosed by the invention, the laser and the flexible circuit board can be firmly clamped conveniently.

Description

Welding device and welding method for laser

Technical Field

The present application relates generally to lasers in the field of optical communications, and more particularly, to a welding apparatus and a welding method for a laser.

Background

With the development of communication technologies (e.g., 5G, 6G), optical communication devices are increasingly widely used. Semiconductor lasers are the primary light source for optical communication applications. Semiconductor lasers typically include a flexible circuit board. However, the conventional soldering process of the flexible circuit board and the semiconductor laser partially or totally depends on manual work, which causes technical problems of low soldering efficiency and high soldering cost. It is expected that the automation level of the welding process of the laser can be further improved.

Disclosure of Invention

The application provides a welding device and a welding method for a laser, aiming at improving the automation level of the welding process of the laser.

According to a first aspect of the present application, a welding device for a laser is provided. A soldering apparatus for a laser for soldering the laser with a flexible circuit board, the soldering apparatus comprising: a base including a first stage for carrying the laser and a second stage adapted to carry the flexible circuit board, wherein the first stage protrudes a first height relative to a top surface of the base and the second stage protrudes a second height relative to the top surface of the base; a fastening device comprising at least one platen rotatable relative to the base to move between a first position in which the platen is open at an angle relative to a bearing surface to receive the flexible circuit board and a second position in which the platen surface of the platen compresses the laser and the flexible circuit board against a first and second carrier table, respectively; wherein the first height at which the first stage protrudes relative to the base is adaptively adjustable in response to pressing of the pressure plate, and the second height at which the second stage protrudes relative to the top surface of the base is fixed.

Lasers used for optical communications typically include a flexible circuit board (also referred to as a flexible ribbon). The technology is characterized in that solder paste is printed and coated on a pad of a flexible circuit board, a surface-mounted component is accurately attached to the pad coated with the solder paste, the circuit board is heated according to a specific reflux temperature curve, the solder paste is melted, and alloy components of the solder paste are cooled and solidified to form a welding spot between the component and the flexible circuit board so as to realize metallurgical connection. The solder paste is used as a soldering material and is a paste formed by mixing solder powder, soldering flux and other additives. The soldering paste has certain viscosity at normal temperature, can initially adhere the electronic component to a set position, and can be welded together with the electronic component and the flexible circuit bonding pad to form permanent connection along with the volatilization of the solvent and part of the additives at the welding temperature.

According to the welding device disclosed by the invention, the laser and the flexible circuit board can be conveniently and firmly clamped, so that the laser and the flexible circuit board can be conveniently welded, and the welding efficiency of welding and the automation level of welding operation are improved.

In some variations, the first carrier stage comprises a linear array of a plurality of openings extending from a top side towards a bottom side, each opening of the plurality of openings being adapted to arrange a support sleeve such that the laser is floatingly supported on the base via the support sleeve.

In some variations, the support sleeve includes a protrusion projecting from an inner surface of the support sleeve, the protrusion adapted to abut a corresponding portion of the laser to support the laser.

In some variations, the support sleeve includes a barrel portion adapted to be inserted into the opening and a flange portion sized larger than an inner diameter of the opening, the welding device further including a compression spring disposed between the flange portion and the floor of the base.

In some variations, the second carrier includes a beam protruding from the top surface of the base and a plurality of guide recesses disposed in the beam in a linear array, each of the plurality of guide recesses adapted to support the flexible circuit board.

In some variations, the base further includes a plurality of support arms in a linear arrangement protruding from the bearing surface, the plurality of support arms arranged parallel to the beam, each support arm of the plurality of support arms including an axial bore, each platen rotatably mounted to the base via a first shaft passing through the plurality of support arms.

In some variations, the securing device further comprises a locking device adapted to releasably lock the pressure plate when the pressure plate is in the second position.

In some variations, the locking device comprises: a lock plate rotatably mounted on the base via a second shaft; a biasing spring compressed between the locking plate and the base to maintain the locking plate in a predetermined position and capable of driving the locking plate to move away from the pressure plate to release the pressure plate in response to a force applied to the locking plate in a first direction.

In some variations, the base includes a recess in which the lock plate is pivotably disposed and includes a lock portion that protrudes toward the pressure plate, wherein the lock plate and the pressure plate cooperate with each other such that, when pushed as the pressure plate moves from the first position to the second position, the pressure plate pushes the lock portion against the action of the biasing spring to pivot the lock plate in a first direction, and after the pressure plate moves past the lock portion, the lock plate pivots in a second direction opposite to the first direction by the restoring force of the biasing spring to press the pressure plate via the lock portion.

According to a second aspect of the present application, there is provided a welding method of the welding apparatus according to the first aspect. The welding method comprises the following steps: placing a pressure plate of a fastening device in an open position; disposing a laser and the flexible circuit board on a base, respectively, wherein the laser is floatingly supported on the base; pivoting the platen to a closed position to compress the laser and the flexible circuit board against each other; performing a soldering operation for the laser and the flexible circuit board.

It should be understood that what is described in this summary section is not intended to limit key or critical features of the embodiments of the application, nor is it intended to limit the scope of the application. Other features of the present application will become apparent from the following description.

Drawings

The above and other objects, features and advantages of the embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. In the drawings, several embodiments of the present application are illustrated by way of example and not by way of limitation.

Fig. 1 shows a schematic structural view of a welding device for a laser according to an embodiment of the present application, wherein the fastening device is in an unlocked state.

Fig. 2 shows a schematic structural view of a welding device for a laser according to an embodiment of the present application, wherein the fastening device is in a locked state.

Fig. 3 shows an exploded view of a welding device for a laser according to an embodiment of the present application.

Fig. 4 shows a cross-sectional view of a welding device for a laser according to an embodiment of the present application.

Fig. 5 shows a flow diagram of a method for a welding device for a laser according to an embodiment of the present application.

Like or corresponding reference characters designate like or corresponding parts throughout the several views.

Detailed Description

Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

The term "include" and variations thereof as used herein is meant to be inclusive in an open-ended manner, i.e., "including but not limited to". Unless specifically stated otherwise, the term "or" means "and/or". The term "based on" means "based at least in part on". The terms "one example embodiment" and "one embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "upper," "lower," "front," "rear," "left," "right," and the like, refer to placement or positional relationships based on the orientation or positional relationship as shown in the drawings, merely for convenience in describing the principles of the application, and do not indicate or imply that the referenced elements must be in a particular orientation, be constructed or operated in a particular orientation, and therefore should not be considered limiting of the application.

According to the present disclosure, a welding device for a laser is provided for enabling welding of the laser and a flexible circuit board, and more particularly for improving an automation level of welding of the laser and the flexible circuit board.

As shown in fig. 1-4, a soldering apparatus 100 may be used to solder the laser 90 to the flexible circuit board 80 (shown in fig. 3). The welding device 100 includes a base 10 and a fastening device. The base 10 comprises a first carrier stage for carrying the laser 90 and a second carrier stage 20 adapted to carry the flexible circuit board 80. The fastening means comprises a pressure plate 40. The platen 40 is rotatable relative to the base 10 to move between a first position and a second position. In the first position, the platen 40 is open at an angle relative to the carrier surface to receive the flexible circuit board 80, and in the second position, the platen surface of the platen 40 presses the laser 90 and the flexible circuit board 80 against the first and second carrier tables 20, respectively. Thus, the relative positions of the laser 90 and the flexible circuit board 80 can be fixed by the fastening device, and the welding work is performed with the relative positions of the two fixed. In some embodiments, as shown in FIGS. 1-3, the platen 40 includes a plurality of openings 44, and the laser 90 may be adapted to be exposed through the openings 44 to facilitate a welding operation.

In some embodiments, as shown, the first carrier stage projects a first height relative to the top surface of the base 10 and the second carrier stage 20 projects a second height relative to the top surface of the base 10. As shown in fig. 3 and 4, the laser 90 may be supported on the base 10, for example, upside down and vertically by gravity. Thereby, the placement of the laser can be facilitated and the exposure of the welding portion of the laser 90 can be facilitated. Further, since the welding portion of the laser 90 is exposed from the top side and the pressing plate 40 is pivotably disposed between the first position and the second position, the position of the welding portion of the laser 90 can be easily adjusted and no additional equipment is required, and the load bearing is achieved only depending on the weight of the laser 90.

In some embodiments, a first height at which the first stage protrudes relative to the base 10 is adaptively adjustable in response to pressing of the pressing plate 40, and a second height at which the second stage 20 protrudes relative to the top surface of the base 10 is fixed. Since the first height can be adaptively adjusted, this way a secure grip between the laser 90 on the first carrier stage and the flexible circuit board 80 can be conveniently achieved. This is particularly suitable where the lasers 90 are different sizes or models. Furthermore, this is also suitable in cases where the lasers differ in size due to manufacturing tolerances.

In some embodiments, the first carrier table comprises a linear array of a plurality of openings extending from the top side towards the bottom side, each of the plurality of openings being adapted for arranging a support sleeve 30. In this case, the laser 90 is floatingly supported on the base 10 via the support sleeve 30. Thereby, a plurality of lasers can be welded at the same time. It is worth noting that in the illustrated embodiment, 4 openings are shown, which is merely exemplary. The number of openings can be set as desired. In some embodiments, the number of openings may be 1 or more.

In some embodiments, as shown in fig. 4, the support sleeve 30 includes a protrusion 36 that protrudes from an inner surface of the support sleeve 30. The projection 36 is adapted to abut a corresponding portion of the laser 90 to support the laser 90. For example, the projection 36 may be formed in the form of an annular flange, a stop. It is worth noting that this is merely exemplary, and that the protrusion 36 may be formed in any other suitable shape.

In some embodiments, the support sleeve 30 includes a barrel portion 34 and a flange portion 32. The barrel 34 may define a cavity adapted to receive the laser 90. The outer surface of the skirt 34 may be adapted to be inserted into the opening. The flange portion 32 is larger in size than the inner diameter of the opening. Thereby, the flange portion 32 can abut against the bottom surface of the base. The base may form a plurality of steps, in the illustrated embodiment the base 10 comprises two steps, one of which abuts the flange portion 32; another step may be associated with the base plate 12. The welding device 100 also includes a compression spring 14 disposed between the flange portion 32 and the bottom plate 12 of the base 10. By holding the compression spring 14 between the bottom plate 12 and the step of the base 10. Thereby, an adjustable displacement of the laser in the vertical direction may be achieved by a compression displacement of the compression spring 14.

In some embodiments, as shown in FIG. 1, the second carrier 20 includes a beam protruding from the top surface of the base 10 and a plurality of linear recesses 22 disposed in the beam. The plurality of recesses may be used to guide the movement of the recesses 22, and for example, the flexible circuit board 80 may be guided along the guide recesses 22 when the pressing plate 40 presses the flexible circuit board 80, so that the flexible circuit board 80 is firmly clamped. Each recess 22 may support a flexible circuit board 80.

In some embodiments, as shown in fig. 1 and 2, the base 10 further includes a plurality of support arms 48 in a linear arrangement protruding from the bearing surface, the plurality of support arms 48 being arranged parallel to the cross beam, each support arm 48 of the plurality of support arms 48 including an axial bore 16, each platen 40 being rotatably mounted to the base 10 via a first shaft 46 extending through the plurality of support arms. In some embodiments, one first shaft 46 may be used to effect the driving of all of the platens. Such a layout structure ensures miniaturization and compactness of the welding apparatus.

In some embodiments, the fastening means comprises, in addition to the pressing means, locking means adapted to releasably lock the pressure plate 40 when the pressure plate 40 is in the second position. Any movement of the flexible circuit board 80 and the laser can be prevented by the locking means.

In some embodiments, as shown in fig. 1-3, the locking device comprises: a lock plate 50 rotatably mounted on the base 10 via a second shaft 58; a biasing spring 56 compressed between the locking plate 50 and the base 10 to maintain the locking plate 50 in a predetermined position. In some embodiments, the base includes an axial bore 18. The lock plate 50 is pivotally mounted to the base via a second shaft 58 that extends through the axial bore 18. As shown in fig. 1 and 2, the lock plate 50 is held in the lock position by a simple structure by means of the biasing spring 56. Further, the pressure plate 40 may be released by the biasing spring 56, and when the lock is released, only a force is required to the lock plate 50 to compress the biasing spring 56 so that the end of the lock plate 50 moves away from the pressure plate 40. In the illustrated embodiment, the second shaft 58 can realize the locking plate 50 to be operated in a lever-like manner, whereby unlocking and locking of the locking device can be realized with as small a movement distance as possible.

In some embodiments, the base 10 includes a recess 15, and the locking plate 50 is pivotably disposed in the recess 15 and includes a locking portion 52 protruding toward the pressure plate 40. With such a configuration, the size of the welding apparatus can be further reduced.

In some embodiments, the locking plate 50 and the pressure plate 40 cooperate with each other such that when the pressure plate 40 is pushed as it moves from the first position to the second position, the pressure plate 40 pushes the locking portion 52 against the action of the biasing spring 56 to pivot the locking plate 50 in a first direction, and after the pressure plate 40 moves past the locking portion, the locking plate 50 pivots in a second direction opposite to the first direction under the restoring force of the biasing spring 56 to press the pressure plate 40 via the locking portion 52. The locking plate 50 includes a locking portion 52 and the pressure plate 40 includes a mating locking portion 42. In the illustrated embodiment, the locking portion 52 may be formed in the shape of a tapered edge, an arc, or a hook, and the locking portion 42 may be formed in a corresponding shape that mates with the locking portion. Such a shape can reduce contact resistance between the locking portions 52 and the locking portions 42 as much as possible so that the locking plate 50 and the pressure plate 40 are fitted to each other.

A welding method 500 is also provided according to an embodiment of the present disclosure. As shown in fig. 5, the welding method includes: at step 502, the platen is in an open position; at step 504, a laser and a flexible circuit board are respectively disposed on the base. In some embodiments, the laser 90 is floatingly supported on the base 10. At step 506, the platen is pivoted to the closed position to press the laser and the flexible circuit board against each other. At step 508, a soldering job is performed for the laser and the flexible circuit board.

Further, while operations are depicted in a particular order, this should be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. Under certain circumstances, multitasking and parallel processing may be advantageous. Likewise, while several specific implementation details are included in the above discussion, these should not be construed as limitations on the scope of the application. Certain features that are described in the context of separate embodiments can also be implemented in combination in a single implementation. Conversely, various features that are described in the context of a single implementation can also be implemented in multiple implementations separately or in any suitable subcombination.

Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.

Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A soldering apparatus for a laser, for soldering the laser (90) and a flexible circuit board (80) together, the soldering apparatus comprising:

a base (10) comprising a first carrier for carrying the laser (90) and a second carrier for carrying the flexible circuit board (80), wherein the first carrier protrudes with respect to a top surface of the base (10) by a first height and the second carrier protrudes with respect to the top surface of the base (10) by a second height; and

a fastening device comprising at least one platen (40), the platen (40) being rotatable relative to the base (10) to move between a first position in which the platen (40) is open at an angle relative to a bearing surface to receive the flexible circuit board (80) and a second position in which the platen surface of the platen (40) presses the laser (90) and the flexible circuit board (80) against a first and second carrier table, respectively;

wherein the first height at which the first stage protrudes relative to the base (10) is adaptively adjusted in response to pressing of the pressure plate (40), and the second height at which the second stage protrudes relative to the top surface of the base (10) is fixed.

2. Welding device according to claim 1, wherein the first carrier stage comprises a linear array of a plurality of openings extending from a top side towards a bottom side, each opening of the plurality of openings being arranged with a support sleeve (30) such that the laser (90) is floatingly supported on the base (10) via the support sleeve (30).

3. Welding device according to claim 2, wherein the support sleeve (30) comprises a protrusion (36) protruding from an inner surface of the support sleeve, the protrusion (36) abutting a corresponding portion of the laser (90) for supporting the laser (90).

4. Welding device according to claim 3, wherein the support sleeve (30) comprises a cylindrical portion (34) and a flange portion (32), the cylindrical portion (34) being inserted into the opening, the welding device further comprising a compression spring (14) arranged between the flange portion (32) and the bottom plate (12) of the base (10).

5. Welding device according to any one of claims 1-4, wherein the second carrier comprises a beam protruding from the top surface of the base (10) and a plurality of guide recesses (22) arranged in line in the beam, each guide recess (22) of the plurality of guide recesses supporting the flexible circuit board (80).

6. Welding device according to claim 5, wherein the base (10) further comprises a plurality of support arms in line projecting from the bearing surface, arranged parallel to the cross beam, each support arm of said plurality of support arms comprising an axial hole, each pressure plate (40) being rotatably mounted to the base (10) via a first shaft (46) passing through said plurality of support arms.

7. Welding device according to any one of claims 1-4, wherein the fastening means further comprise locking means for releasably locking the pressure plate (40) in the second position of the pressure plate (40).

8. The welding device of claim 7, wherein the locking device comprises:

a lock plate (50) rotatably mounted on the base (10) via a second shaft (58);

a biasing spring (56) compressed between the locking plate (50) and the base (10) to maintain the locking plate (50) in a predetermined position and to drive the locking plate (50) to move away from the pressure plate (40) to release the pressure plate (40) in response to a force of a first direction applied to the locking plate (50).

9. Welding device according to claim 8, wherein the base (10) comprises a recess, in which the locking plate (50) is pivotally arranged and comprises a locking portion (52) protruding towards the pressure plate (40),

wherein the lock plate (50) and the pressure plate (40) are fitted to each other such that, when pushed as the pressure plate (40) moves from the first position to the second position, the pressure plate (40) pushes the lock portion (52) against the action of the biasing spring (56) to pivot the lock plate (50) in a first direction, and after the pressure plate (40) moves past the lock portion, the lock plate (50) pivots in a second direction opposite to the first direction under the restoring force of the biasing spring (56) to press the pressure plate (40) via the lock portion (52).

10. A welding method of a welding apparatus according to any one of claims 1 to 9,

-bringing a pressure plate (40) of the fastening device in an open position;

arranging a laser (90) and the flexible circuit board (80) on a base (10), respectively;

pivoting the platen (40) to a closed position to compress the laser (90) and the flexible circuit board (80) against each other;

performing a soldering operation for the laser and the flexible circuit board (80).