CN113814120B - Chip adhesive deposite device is used in panel computer production - Google Patents
Chip adhesive deposite device is used in panel computer production Download PDFInfo
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- CN113814120B CN113814120B CN202111124239.6A CN202111124239A CN113814120B CN 113814120 B CN113814120 B CN 113814120B CN 202111124239 A CN202111124239 A CN 202111124239A CN 113814120 B CN113814120 B CN 113814120B
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- support frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/023—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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Abstract
The invention relates to a dispensing device, in particular to a chip dispensing device for producing a tablet computer. The chip dispensing device for producing the tablet computer, provided by the invention, can be used for quickly dispensing chips according to needs, clamping the chips, further effectively avoiding the deviation of dispensing positions and uniformly pressing glue on the chips. A chip dispensing device for producing a tablet personal computer comprises a bottom plate and a first sliding rail, wherein the top of the bottom plate is provided with the first sliding rail; the upper side of the first sliding rail is provided with a first sliding rod in a sliding manner; the rotating shaft is arranged on the first sliding rod in a sliding manner; the first support frame is arranged on the rotating shaft. According to the invention, the clamping plate and the second spring are arranged, so that the chip can be clamped by the clamping plate, the deviation of the dispensing position of the chip can be effectively avoided, and the qualified rate of dispensing the chip can be improved.
Description
Technical Field
The invention relates to a dispensing device, in particular to a chip dispensing device for producing a tablet computer.
Background
Dispensing is also called gluing or glue dripping, and dispensing usually refers to dropping electronic glue or other liquid on a product, and then can let the product play fixed or effect such as the surface is smooth, and the quantity of chip is many and the volume is less in industrial production, and the staff generally directly holds the chip and carries out the point and need expend longer time, and the manual point of staff is glued and is made the point position easily and take place the skew simultaneously to the glue that does not dry on the chip is stained with on the staff easily.
Patent application number CN111992457A discloses a general dispensing jig for chip dispensing process, which comprises a base; the pattern control mechanism is arranged on the base and comprises pattern plates, full-hole plates and blind-hole plates which are sequentially arranged from bottom to top, each pattern plate is provided with a pattern hole for dispensing patterns, the full-hole plates are provided with full holes, the blind-hole plates are provided with blind holes, and the number of the hole sites of the pattern holes and the number of the hole sites of the blind holes are the same as the number of the hole sites of the full holes after being superposed, and the positions of the hole sites of the full holes correspond to those of the hole sites.
Therefore, to the above prior art problems, we have designed a chip dispensing device for tablet computer production that can dispense chips as required quickly, and can clamp the chips to effectively avoid the deviation of dispensing positions, and can press the chips with glue uniformly.
Disclosure of Invention
In order to overcome the defects that a worker generally needs to spend a long time for dispensing by directly holding a chip by hands, the dispensing position is easy to deviate by manual dispensing of the worker, and the undried glue on the chip is easy to be stained on the hands of the worker, the technical problem of the invention is as follows: the chip dispensing device for the production of the tablet computer can rapidly dispense chips as required, can clamp the chips and further can effectively avoid the deviation of dispensing positions, and can uniformly press the chips with glue.
The technical scheme is as follows: the utility model provides a chip adhesive deposite device is used in panel computer production, including:
the top of the bottom plate is provided with a first sliding rail in a sliding manner;
the upper side of the first sliding rail is provided with a first sliding rod in a sliding manner;
the rotating shaft is rotatably arranged on the first sliding rod;
the rotating shaft is provided with a first support frame;
the first sliding rail is sleeved with a first spring, and two ends of the first spring are respectively connected to the first sliding rail and the first sliding rod;
the first support frame is provided with a clamping mechanism;
the glue dispensing mechanism is arranged between the bottom plate and the first support frame.
In a preferred embodiment of the present invention, the clamping mechanism comprises:
the upper parts of the first support frames are provided with second support frames;
the clamping plates are arranged on the two second supporting frames in a sliding manner;
and the two ends of the second spring are respectively connected to the corresponding second support frame and the clamping plate.
In a preferred embodiment of the present invention, the glue dispensing mechanism comprises:
the top of the bottom plate is provided with a third support frame;
the first pressure plate is arranged on the upper side of the third support frame;
the first pressing plate is provided with a first sliding rod;
a fourth support frame is arranged between the two second sliding rods in a sliding manner and is in contact with the third support frame;
the two second sliding rods are sleeved with third springs, and two ends of each third spring are connected to the first pressure plate and the fourth supporting frame respectively;
the material receiving frame is connected between the inner parts of the two fourth supporting frames, and the lower side of the material receiving frame is connected with the first pressing plate;
the top of the first support frame is provided with a first wedge-shaped block;
and the second wedge block is arranged on the lower side of the material receiving frame, and the first wedge block is in contact fit with the second wedge block.
In a preferred embodiment of the present invention, the present invention further comprises a material covering mechanism, wherein the material covering mechanism comprises:
the top of the material receiving frame is provided with a material baffle plate;
the material baffle plate is rotatably provided with a screw cover;
the limiting frame is arranged at the bottom of the material baffle and is in contact fit with the screw cap.
In a preferred embodiment of the present invention, the present invention further comprises an automatic feeding mechanism, wherein the automatic feeding mechanism comprises:
the middle of the upper side of the bottom plate is provided with a fifth support frame;
the motor is arranged on the upper side of the fifth support frame, and the sixth support frame is arranged in the middle of the bottom plate;
the screw rod is rotatably arranged on the sixth supporting frame, and the end part of the screw rod is connected with an output shaft of the motor;
the sliding sleeve is arranged on the screw rod in a threaded manner;
the bracing piece is equipped with the bracing piece on the sliding sleeve, and the bracing piece is connected with first slide rail downside.
In a preferred embodiment of the present invention, the present invention further comprises a turnover mechanism, wherein the turnover mechanism comprises:
the middle part of the first support frame is provided with a support column;
the straight gear is rotationally arranged on the supporting column;
a spur rack is arranged in the middle of the upper side of the bottom plate and is matched with the spur gear.
In a preferred embodiment of the present invention, the apparatus further comprises a leveling mechanism, wherein the leveling mechanism comprises:
the middle of the upper side of the bottom plate is provided with a seventh supporting frame;
a third slide bar is arranged on the seventh support frame;
the second pressing plate is arranged on the upper side of the third sliding rod in a sliding manner;
the third sliding rod is sleeved with a third spring, and two ends of the third spring are connected to the third supporting frame and the second pressing plate respectively;
the top end of the third sliding rod is symmetrically provided with a second sliding rail;
the baffle plates are arranged in the two second sliding rails in a sliding manner and are in contact fit with the bottoms of the second pressing plates;
the deflector rod is symmetrically arranged on the first support frame and is in contact fit with the baffle.
In a preferred embodiment of the present invention, the sliding sleeve is made of nylon, which can increase the service life of the sliding sleeve.
Compared with the prior art, the invention has the following advantages: 1. according to the invention, the clamping plate and the second spring are arranged, so that the chip can be clamped by the clamping plate, the deviation of the dispensing position of the chip can be effectively avoided, and the qualified rate of dispensing the chip can be improved;
2. according to the invention, the baffle plate and the screw cap are arranged, so that the baffle plate can block outside air from entering the material receiving frame, and the problem that glue in the material receiving frame is solidified due to contact with air can be effectively avoided;
3. according to the invention, the first support frame can be overturned by arranging the straight gear and the straight rack, so that the use of manpower can be reduced, and the labor intensity of workers can be effectively reduced.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a partial perspective view of the present invention.
Fig. 3 is a schematic perspective view of the clamping mechanism of the present invention.
Fig. 4 is a schematic perspective view of the dispensing mechanism of the present invention.
Fig. 5 is a schematic perspective view of the first part of the covering mechanism of the present invention.
Fig. 6 is a schematic perspective view of a second part of the covering mechanism of the present invention.
Fig. 7 is a schematic perspective view of the automatic pushing mechanism of the present invention.
Fig. 8 is a schematic perspective view of the turnover mechanism of the present invention.
Fig. 9 is a schematic perspective view of the leveling mechanism of the present invention.
Wherein the figures include the following reference numerals: 1. the automatic feeding device comprises a base plate, 2, a first sliding rail, 3, a first sliding rod, 4, a rotating shaft, 5, a first support frame, 6, a first spring, 7, a clamping mechanism, 71, a second support frame, 72, a clamping plate, 73, a second spring, 8, a glue dispensing mechanism, 81, a third support frame, 82, a first pressing plate, 83, a second sliding rod, 84, a fourth support frame, 85, a third spring, 86, a material receiving frame, 87, a first wedge-shaped block, 88, a second wedge-shaped block, 9, a covering mechanism, 91, a material baffle, 92, a screwing cover, 93, a limiting frame, 10, an automatic feeding mechanism, 101, a fifth support frame, 102, a sixth support frame, 103, a motor, 104, a screw rod, 105, a sliding sleeve, 106, a support rod, 11, a turnover mechanism, 111, a support column, 112, a straight gear, 113, a straight rack, 12, a uniform pressing mechanism, 121, a seventh support frame, 122, a third sliding rod, 123, a second pressing plate, 124, a sliding sleeve, a second sliding rod, a third support frame, a fourth wedge-shaped, A second slide rail 125, a baffle plate 126, a fourth spring 127 and a deflector rod.
Detailed Description
Although the present invention may be described with respect to particular applications or industries, those skilled in the art will recognize the broader applicability of the invention. Those of ordinary skill in the art will recognize other factors such as: terms such as above, below, upward, downward, etc. are used to describe the figures and are not meant to limit the scope of the invention as defined by the appended claims. Such as: any numerical designation of first or second, and the like, is merely exemplary and is not intended to limit the scope of the invention in any way.
Example 1
The utility model provides a chip adhesive deposite device is used in panel computer production, as shown in fig. 1-4, including bottom plate 1, first slide rail 2, first slide bar 3, pivot 4, first support frame 5, first spring 6, clamping mechanism 7 and point gum machine construct 8, bottom plate 1 top left side rear portion slidingtype is equipped with first slide rail 2, 2 upside slidingtypes of first slide rail are equipped with first slide bar 3, 3 right side rotary type of first slide bar is equipped with pivot 4, 4 right sides of pivot are equipped with first support frame 5, the cover is equipped with first spring 6 on the first slide rail 2, the both ends of first spring 6 are connected respectively on first slide rail 2 and first slide bar 3, be equipped with clamping mechanism 7 on first support frame 5, be equipped with between 1 upside rear portion of bottom plate and the 5 upside left part and get a little gum machine construct 8.
When the worker needs to glue the chips, the worker can manually make the clamping mechanism 7 slide outwards firstly, then the clamping mechanism 7 is stretched, then the worker can put the chips on the first support frame 5, then the worker can quickly loosen the clamping mechanism 7, the clamping mechanism 7 is reset to clamp the chips on the first support frame 5, then the worker can make the first slide rail 2 slide backwards on the bottom plate 1, the first slide rail 2 slides backwards to make the first slide bar 3 and the first support frame 5 move backwards, then the first support frame 5 can make the chips move backwards, when the chips are positioned under the glue dispensing mechanism 8, then the first support frame 5 can make the glue dispensing mechanism 8 slide downwards to dispense the chips, when the first support frame 5 moves forwards to temporarily stop contacting with the glue dispensing mechanism 8, the glue dispensing mechanism 8 can slide upwards to reset, therefore, the dispensing mechanism 8 stops dispensing the chips, the clamping mechanisms 7 can slide outwards again by the staff at the moment, the chips which are dispensed between the clamping mechanisms 7 can be taken out by the staff afterwards, and when the chips need to be dispensed again by the staff, the staff can repeat the operations again.
Clamping mechanism 7 is including second support frame 71, splint 72 and second spring 73, and the upper portion left and right sides of first support frame 5 all is equipped with second support frame 71, all is equipped with splint 72 on two second support frames 71 slidingtype, all overlaps on two second support frames 71 and is equipped with second spring 73, and the both ends of second spring 73 are connected respectively on corresponding second support frame 71 and splint 72.
When the staff need press from both sides tightly the chip, the staff can make splint 72 slide to the outside on second support frame 71 at first, and then second spring 73 is stretched, at this moment the staff can put the chip to first support frame 5 on, the staff can loosen splint 72 afterwards, and then second spring 73 resets and can make splint 72 slide to the inboard on second support frame 71, when splint 72 slides to contact with the chip, splint 72 can press from both sides the chip tightly, and then can effectually avoid the some glue positions of chip to take place the skew, when the staff need press from both sides the chip once more, the staff can repeat above operation once more.
The glue dispensing mechanism 8 comprises a third support frame 81, a first pressure plate 82, a second slide bar 83, a fourth support frame 84, a third spring 85, a material receiving frame 86, a first wedge-shaped block 87 and a second wedge-shaped block 88, the third support frame 81 is arranged at the right part of the rear side of the top of the bottom plate 1, the first pressure plate 82 is arranged at the left part of the upper side of the third support frame 81, the second slide bar 83 is arranged at the left side and the right side of the first pressure plate 82, the fourth support frame 84 is arranged between the two second slide bars 83 in a sliding manner, the right side of the fourth support frame 84 is contacted with the left side of the third support frame 81, the third spring 85 is sleeved on the two second slide bars 83, two ends of the third spring 85 are respectively connected to the first pressure plate 82 and the fourth support frame 84, the material receiving frame 86 is connected inside the two fourth support frames 84, the lower side of the material receiving frame 86 is connected with the first pressure plate 82, the first wedge-shaped block 87 is arranged at the left part of the front side of the top of the first support frame 5, the second wedge-shaped block 88 is arranged at the lower side of the material receiving frame 86, the first wedge 87 is in contact engagement with the second wedge 88.
When the first support frame 5 slides to the rear side, the first support frame 5 can make the first wedge-shaped block 87 slide to the rear side, when the first wedge-shaped block 87 slides to be contacted with the second wedge-shaped block 88, the first wedge-shaped block 87 can make the second wedge-shaped block 88 move to the lower side, and then the second wedge-shaped block 88 can make the material receiving frame 86 move to the lower side, so that the material receiving frame 86 can make the fourth support frame 84 slide to the lower side on the second slide rod 83, and then the third spring 85 is compressed, at this time, the bottom of the material receiving frame 86 can be dotted on the chip through the first press plate 82, after the glue is pasted, the worker can make the first support frame 5 slide to the front side, and then the first support frame 5 can make the first wedge-shaped block 87 slide to the front side, when the first wedge-shaped block 87 slides to be temporarily stopped to be contacted with the second wedge-shaped block 88, the third spring 85 is reset to make the fourth support frame 84 slide to be reset to the fourth support frame 84 to be made to slide to the upper side, and reset to the material receiving frame 86 and the second wedge-shaped block 88, at this time, the bottom of the material receiving frame 86 stops dispensing glue onto the chip through the first pressing plate 82, and when the worker needs to dispense glue onto the chip again, the worker can repeat the above operations again.
Example 2
In a preferred embodiment of the present invention, as shown in fig. 1 and fig. 5 to fig. 9, the present invention further includes a material covering mechanism 9, the material covering mechanism 9 includes a material blocking plate 91, a screw cap 92 and a limiting frame 93, the material receiving frame 86 has a material blocking plate 91 at the top, the material blocking plate 91 has a screw cap 92 rotatably disposed thereon, the limiting frame 93 is disposed at the bottom of the material blocking plate 91, and the limiting frame 93 is in contact fit with the screw cap 92.
When the staff need add glue in receiving in the frame 86, the staff can twist reverse screw cap 92, spacing frame 93 can carry on spacingly to screw cap 92 bottom simultaneously, when screw cap 92 rotates to no longer block two round holes that open on striker plate 91, the staff can add glue in receiving the frame 86, when the staff need not add glue in receiving the frame 86 for a while, the staff can twist reverse screw cap 92 to opposite direction and reset for screw cap 92 blocks two round holes that open on striker plate 91 again, striker plate 91 can block outside air and get into in receiving the frame 86, can effectually avoid receiving the glue in the frame 86 with the air contact and take place to solidify the receipts simultaneously, when the staff need add glue in the frame 86 once more, the staff can repeat above operation once more.
Still including the dynamic sending machine 10, the dynamic sending machine 10 is including the fifth support frame 101, the sixth support frame 102, motor 103, lead screw 104, sliding sleeve 105 and bracing piece 106, be equipped with the fifth support frame 101 in the middle of the 1 upside rear portion of bottom plate, motor 103 is installed to the fifth support frame 101 upside, 1 front side middle part of bottom plate is equipped with the sixth support frame 102, the last rotation type of sixth support frame 102 is equipped with lead screw 104, the rear end of lead screw 104 and the output shaft of motor 103, the threaded formula is equipped with sliding sleeve 105 on the lead screw 104, sliding sleeve 105 left side is equipped with bracing piece 106, the bracing piece 106 left end is connected with 2 downside of first slide rail.
When the worker needs to convey and collect the dispensed chips, the worker first turns on the motor 103, the output shaft of the motor 103 rotates forward to make the screw rod 104 rotate forward, then the screw rod 104 rotates forward to make the sliding sleeve 105 move forward, so the sliding sleeve 105 can make the support rod 106 slide forward, then the support rod 106 can make the first sliding rail 2 slide forward on the bottom plate 1, so the first sliding rail 2 and the first support frame 5 can make the dispensed chips slide forward, at this time, the worker can collect the dispensed chips, when the worker needs to convey the non-dispensed chips, the worker first turns the output shaft of the motor 103 in reverse direction, the output shaft turns in reverse direction to make the screw rod 104 in reverse direction, then the screw rod 104 turns in reverse direction to make the sliding sleeve 105 move backward to reset, so the sliding sleeve 105 can make the support rod 106 slide backward to reset, then the support rod 106 can make the first sliding rail 2 slide backward on the bottom plate 1 to reset, therefore, the first slide rail 2 and the first support frame 5 can make the chip which is not glued slide to the rear side, at this time, the worker can glue the chip, when the worker does not need to glue the chip temporarily, the worker can close the motor 103, the output shaft of the motor 103 can stop to rotate the screw rod 104, and when the worker needs to glue the chip again, the worker can repeat the above operations again.
Still including tilting mechanism 11, tilting mechanism 11 is including support column 111, spur gear 112 and spur rack 113, and first support frame 5 right side middle part is equipped with support column 111, and support column 111 right side rotary type is equipped with spur gear 112, and the middle of the upside right part of bottom plate 1 is equipped with spur rack 113, and spur rack 113 cooperates with spur gear 112.
When the first support frame 5 moves to the front side, the first support frame 5 can enable the support column 111 and the spur gear 112 to slide to the front side, when the spur gear 112 slides to the front side to be meshed with the spur rack 113, the spur rack 113 can enable the spur gear 112 to rotate, and further the spur gear 112 can enable the support column 111 to rotate, so that the support column 111 can enable the first support frame 5 and the rotating shaft 4 to overturn, chips on the first support frame 5 can be concentrated on the bottom plate 1 to be stacked, and further the use of manpower can be reduced, when the first support frame 5 moves to the rear side, the first support frame 5 can enable the support column 111 and the spur gear 112 to move to the rear side, when the spur gear 112 slides to the rear side to be meshed with the spur rack 113 again, the spur rack 113 can enable the spur gear 112 to rotate to the opposite direction, and further the spur gear 112 can enable the support column 111 to rotate to the opposite direction, so that the support column 111 can enable the first support frame 5 and the rotating shaft 4 to overturn and reset to the opposite direction, and then the staff can continue to put the chip that does not glue on first support frame 5, when the staff need not overturn first support frame 5 for a while, the staff can stop making first support frame 5 move, when the staff need overturn first support frame 5 once more, the staff can repeat above operation once more.
The pressing and leveling mechanism 12 is further included, the pressing and leveling mechanism 12 includes a seventh support frame 121, a third sliding rod 122, a second pressing plate 123, a second sliding rail 124, a baffle 125, a fourth spring 126 and a shifting rod 127, the seventh support frame 121 is arranged in the middle of the upper side of the bottom plate 1, the third sliding rod 122 is arranged on the front side of the seventh support frame 121, the second pressing plate 123 is arranged on the upper side of the third sliding rod 122 in a sliding manner, the fourth spring 126 is sleeved on the third sliding rod 122, two ends of the fourth spring 126 are respectively connected to the seventh support frame 121 and the second pressing plate 123, the second sliding rail 124 is symmetrically arranged at the top end of the third sliding rod 122, the baffles 125 are arranged in the two second sliding rails 124 in a sliding manner, the baffles 125 are in contact fit with the bottoms of the second pressing plates 123, the shifting rod 127 is symmetrically arranged on the left and right sides of the rear side of the first support frame 5, and the shifting rod 127 is in contact fit with the baffles 125.
When the first support frame 5 moves forward and turns over, the first support frame 5 can make the shift lever 127 rotate, when the shift lever 127 rotates to contact with the baffle 125, the shift lever 127 can make the baffle 125 slide forward on the second slide rail 124, when the baffle 125 slides to temporarily stop contacting with the second press plate 123, the fourth spring 126 resets to make the second press plate 123 slide downward on the third slide bar 122, and then the second press plate 123 can uniformly press the glued chips on the seventh support frame 121, so that the adhesive which is not dry on the chips can be effectively prevented from being stained on the hands of the worker, when the worker temporarily does not need to uniformly press the chips, the worker can make the first support frame 5 turn over and reset in the opposite direction on the support column 111, meanwhile, the worker can make the first support frame 5 move backward and reset, and the worker can make the second press plate 123 slide upward on the third slide bar 122, and the fourth spring 126 is stretched, and then the worker can slide the baffle 125 on the second slide rail 124 to the rear side, when the baffle 125 slides to contact with the second pressing plate 123, the baffle 125 can clamp the second pressing plate 123, and when the worker needs to press the chip uniformly again, the worker can repeat the above operations again.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
Claims (3)
1. A chip glue dispensing device for producing a tablet personal computer is characterized by comprising a glue dispensing device body;
the device comprises a bottom plate (1) and a first sliding rail (2), wherein the top of the bottom plate (1) is provided with the first sliding rail (2) in a sliding manner;
the upper side of the first sliding rail (2) is provided with a first sliding rod (3) in a sliding manner;
the rotating shaft (4) is arranged on the first sliding rod (3) in a rotating mode;
the first support frame (5) is arranged on the rotating shaft (4);
the first spring (6) is sleeved on the first sliding rail (2), and two ends of the first spring (6) are respectively connected to the first sliding rail (2) and the first sliding rod (3);
the clamping mechanism (7) is arranged on the first support frame (5);
the glue dispensing mechanism (8), a glue dispensing mechanism (8) is arranged between the bottom plate (1) and the first support frame (5);
the clamping mechanism (7) comprises:
the upper parts of the first support frames (5) are provided with second support frames (71);
the clamping plates (72) are arranged on the two second supporting frames (71) in a sliding manner;
the two second supporting frames (71) are sleeved with the second springs (73), and two ends of each second spring (73) are respectively connected to the corresponding second supporting frame (71) and the corresponding clamping plate (72);
the glue dispensing mechanism (8) comprises:
the top of the bottom plate (1) is provided with a third supporting frame (81);
the first pressure plate (82) is arranged on the upper side of the third supporting frame (81);
the first pressure plate (82) is provided with a first sliding rod (83);
a fourth support frame (84) is arranged between the two second sliding rods (83) in a sliding mode, and the fourth support frame (84) is in contact with the third support frame (81);
the two second sliding rods (83) are sleeved with third springs (85), and two ends of each third spring (85) are connected to the first pressing plate (82) and the fourth supporting frame (84) respectively;
the material receiving frames (86) are connected between the insides of the two fourth supporting frames (84), and the lower sides of the material receiving frames (86) are connected with the first pressing plate (82);
the top of the first support frame (5) is provided with a first wedge-shaped block (87);
the second wedge block (88) is arranged on the lower side of the material receiving frame (86), and the first wedge block (87) is in contact fit with the second wedge block (88);
still including cover material mechanism (9), cover material mechanism (9) including:
the top of the material receiving frame (86) is provided with a material baffle plate (91);
the material baffle plate (91) is rotatably provided with a screw cover (92);
the limiting frame (93) is arranged at the bottom of the material baffle plate (91), and the limiting frame (93) is in contact fit with the screw cap (92);
still including dynamic sending machine (10), dynamic sending machine (10) including:
a fifth support frame (101), wherein the middle of the upper side of the bottom plate (1) is provided with the fifth support frame (101);
the motor (103) is installed on the upper side of the fifth supporting frame (101), and the sixth supporting frame (102) is arranged in the middle of the bottom plate (1);
the screw rod (104) is rotatably arranged on the sixth supporting frame (102), and the end part of the screw rod (104) is connected with an output shaft of the motor (103);
the sliding sleeve (105) is arranged on the screw rod (104) in a threaded manner;
the supporting rod (106) is arranged on the sliding sleeve (105), and the supporting rod (106) is connected with the lower side of the first sliding rail (2);
still including tilting mechanism (11), tilting mechanism (11) including:
the middle part of the first support frame (5) is provided with a support column (111);
the support column (111) is rotatably provided with a straight gear (112);
the middle of the upper side of the bottom plate (1) is provided with a straight rack (113), and the straight rack (113) is matched with the straight gear (112).
2. The chip dispensing device for producing the tablet personal computer as claimed in claim 1, further comprising a uniform pressing mechanism (12), wherein the uniform pressing mechanism (12) comprises;
a seventh supporting frame (121), wherein the middle of the upper side of the bottom plate (1) is provided with the seventh supporting frame (121);
a third sliding rod (122) is arranged on the seventh supporting frame (121);
a second pressure plate (123) is arranged on the upper side of the third sliding rod (122) in a sliding manner;
the third sliding rod (122) is sleeved with a fourth spring (126), and two ends of the fourth spring (126) are respectively connected to the seventh supporting frame (121) and the second pressing plate (123);
the top end of the third sliding rod (122) is symmetrically provided with a second sliding rail (124);
the baffles (125) are arranged in the two second sliding rails (124) in a sliding manner, and the baffles (125) are in contact fit with the bottoms of the second pressing plates (123);
the deflector rod (127) is symmetrically arranged on the first support frame (5), and the deflector rod (127) is in contact fit with the baffle plate (125).
3. The chip dispensing device for producing the tablet personal computer as claimed in claim 2, wherein the sliding sleeve (105) is made of nylon, and the nylon can increase the service life of the sliding sleeve (105).
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| CN116214442B (en) * | 2022-12-30 | 2024-01-16 | 苏州莱尔特清洁器具有限公司 | Automatic hose end cover assembling equipment |
| CN116020705B (en) * | 2023-03-27 | 2023-06-06 | 山东泰芯电子科技有限公司 | Dispensing machine for chip packaging |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1824393A (en) * | 2005-02-24 | 2006-08-30 | 东京应化工业株式会社 | Applying apparatus |
| CN112893005A (en) * | 2021-01-14 | 2021-06-04 | 江西弘耀达通讯有限公司 | Chip adhesive deposite device is used in panel computer production |
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| JP6152248B2 (en) * | 2012-04-19 | 2017-06-21 | ファスフォードテクノロジ株式会社 | Paste coating apparatus, paste coating method, and die bonder |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1824393A (en) * | 2005-02-24 | 2006-08-30 | 东京应化工业株式会社 | Applying apparatus |
| CN112893005A (en) * | 2021-01-14 | 2021-06-04 | 江西弘耀达通讯有限公司 | Chip adhesive deposite device is used in panel computer production |
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