CN113811080A - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
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- CN113811080A CN113811080A CN202010549777.9A CN202010549777A CN113811080A CN 113811080 A CN113811080 A CN 113811080A CN 202010549777 A CN202010549777 A CN 202010549777A CN 113811080 A CN113811080 A CN 113811080A
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- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000012792 core layer Substances 0.000 claims abstract description 221
- 239000010410 layer Substances 0.000 claims abstract description 180
- 238000005553 drilling Methods 0.000 claims abstract description 69
- 239000003814 drug Substances 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 238000010030 laminating Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 37
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 239000002131 composite material Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 239000011148 porous material Substances 0.000 claims description 16
- 238000000059 patterning Methods 0.000 claims description 7
- 238000000608 laser ablation Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000032798 delamination Effects 0.000 abstract description 14
- 239000011229 interlayer Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000006087 Brown hydroboration reaction Methods 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 241000587161 Gomphocarpus Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a preparation method of a circuit board, which comprises the following steps: providing a first core layer, wherein the outermost layer of the first core layer is a conductive layer; forming a pore-forming auxiliary body on the conducting layer; laminating a second core layer on one side of the first core layer on which the pore-forming auxiliary body is formed; drilling a region, corresponding to the pore-forming auxiliary body, on the surface, far away from the first core layer, of the second core layer to form a first conductive hole communicated to the pore-forming auxiliary body; the theoretical value of the bottom area of the first conductive hole is smaller than the orthographic projection area of the pore-forming auxiliary body on the first core layer, and the drilling mode comprises laser drilling; removing the pore-forming auxiliary body to form a second conductive hole communicated with the first conductive hole at the bottom of the first conductive hole; and filling liquid medicine into the first conductive hole and the second conductive hole to form a conductor at least on the hole walls of the first conductive hole and the second conductive hole. Through the mode, the risk of circuit board delamination can be reduced.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board and a preparation method thereof.
Background
With the integration of functions of electronic products, the structure of a Printed Circuit Board (PCB) tends to be more dense, which requires the use of laser blind holes with smaller size to replace mechanical holes, especially High Density Interconnect (HDI) products.
At present, in the laser drilling process, a copper surface (which cannot be completely smooth) at the bottom of a hole reflects laser, and the reflected light ablates the side wall of the bottom of the hole to form a small crack or to enable nearby resin to be fluffy. The crack or nearby fluffy resin forms a smaller and smaller wedge-shaped crack through the procedures of dirt removal and the like, and subsequent electroplating liquid medicine cannot fully enter the wedge-shaped crack with smaller size, so that copper cannot be completely plated, and the risk of product delamination is greatly improved.
Disclosure of Invention
In view of the above, the present invention provides a circuit board and a method for manufacturing the same, which can reduce the risk of circuit board delamination.
In order to solve the technical problems, the invention adopts a technical scheme that: the preparation method of the circuit board comprises the steps of providing a first core layer, wherein the outermost layer of the first core layer is a conductive layer; forming a pore-forming auxiliary body on the conducting layer; laminating a second core layer on one side of the first core layer on which the pore-forming auxiliary body is formed; drilling a region, corresponding to the pore-forming auxiliary body, on the surface, far away from the first core layer, of the second core layer to form a first conductive hole communicated to the pore-forming auxiliary body; the theoretical value of the bottom area of the first conductive hole is smaller than the orthographic projection area of the pore-forming auxiliary body on the first core layer, and the drilling mode comprises laser drilling; removing the pore-forming auxiliary body to form a second conductive hole communicated with the first conductive hole at the bottom of the first conductive hole; and filling liquid medicine into the first conductive hole and the second conductive hole to form a conductor at least on the hole walls of the first conductive hole and the second conductive hole.
In an embodiment of the invention, a dimension of the pore-forming auxiliary body in a first direction is greater than or equal to a theoretical value of a dimension of a pore bottom of the first conductive pore in the first direction, wherein the first direction is perpendicular to an axial direction of the first conductive pore.
In an embodiment of the invention, the size of the pore-forming auxiliary body in the first direction is the sum of a theoretical value of the size of the pore bottom of the first conductive pore in the first direction and a size threshold, wherein the size threshold is 10-100 μm.
In an embodiment of the present invention, the step of forming the pore-forming auxiliary body on the conductive layer at the outermost layer of the first core layer includes: forming a pore-forming auxiliary layer on the conducting layer at the outermost layer of the first core layer; and patterning the pore-forming auxiliary layer to reserve a part of the pore-forming auxiliary layer at a target position so as to form a pore-forming auxiliary body, wherein the target position is over against the bottom of the first conductive hole formed subsequently.
In an embodiment of the present invention, the step of laminating the second core layer on the side of the first core layer where the pore-forming auxiliary body is formed comprises: forming a mask structure for coating the pore-forming auxiliary body on the pore-forming auxiliary body; and forming a brown layer in the area, which is not covered by the pore-forming auxiliary body and the mask structure, on the surface of the first core layer, wherein the pore-forming auxiliary body is formed.
In an embodiment of the present invention, the step of forming a mask structure covering the pore-creating auxiliary body on the pore-creating auxiliary body includes: forming a mask material layer on the surface of the first core layer on which the pore-forming auxiliary body is formed, wherein the mask material layer covers the pore-forming auxiliary body; and patterning the mask material layer to reserve the part of the mask material layer covering the pore-forming auxiliary body so as to form a mask structure.
In an embodiment of the invention, after the step of forming the browning layer in the region where the pore-forming auxiliary body is not covered by the pore-forming auxiliary body and the mask structure on the surface of the first core layer, the method includes: and removing the mask structure.
In one embodiment of the invention, the circuit board comprises a composite core layer, the composite core layer comprises a first core layer and a second core layer, wherein the first conductive hole is positioned at the outermost layer of the composite core layer relative to the hole opening of the hole bottom; or the step of filling the first conductive hole and the second conductive hole with the conductive body is followed by: laminating the second core layer on the side away from the first core layer to form a third core layer; wherein the third core layer covers the aperture of the first conductive hole opposite to the bottom of the hole.
In an embodiment of the invention, the second core layer includes at least two insulating layers and at least two conductive layers, and the first conductive hole penetrates through the at least two insulating layers and the at least two conductive layers.
In an embodiment of the present invention, the step of drilling the region of the second core layer away from the surface of the first core layer corresponding to the pore-forming auxiliary body includes: laser drilling is carried out on the area, corresponding to the pore-forming auxiliary body, on the surface, far away from the first core layer, of the second core layer, so that the first conductive hole penetrates through the at least two insulating layers and the at least two conductive layers; or drilling a region of the second core layer, which is far away from the surface of the first core layer and corresponds to the pore-forming auxiliary body, wherein the drilling step comprises the following steps: and mechanically drilling a region corresponding to the pore-forming auxiliary body on the surface of the second core layer far away from the first core layer, drilling the insulating layer or the conducting layer closest to the pore-forming auxiliary body in the second core layer by using laser, and drilling the insulating layer or the conducting layer to the pore-forming auxiliary body, so that the first conducting hole penetrates through at least two insulating layers and at least two conducting layers.
In order to solve the technical problem, the invention adopts another technical scheme that: the circuit board comprises a first core layer and a second core layer which are arranged in a stacking mode, a first conductive hole and a second conductive hole which are communicated are arranged on the second core layer, the second conductive hole is close to the first core layer relative to the first conductive hole and is communicated with the first core layer, an extending hole body portion formed due to laser ablation is arranged at the bottom of the first conductive hole communicated with the second conductive hole, and conductive bodies are formed on the hole walls of at least the first conductive hole and the second conductive hole.
In an embodiment of the invention, a dimension of the second conductive via in the first direction is greater than or equal to a dimension of a theoretical value of a bottom of the first conductive via in the first direction, wherein the first direction is perpendicular to an axial direction of the first conductive via.
In an embodiment of the present invention, the dimension of the second conductive via in the first direction is a sum of a theoretical value of a dimension of the via bottom of the first conductive via in the first direction and a size threshold, wherein the size threshold is 10-100 μm.
In an embodiment of the invention, the second conductive hole has a depth of 5-200 μm.
In one embodiment of the invention, the circuit board comprises a composite core layer, the composite core layer comprises a first core layer and a second core layer, wherein the first conductive hole is positioned at the outermost layer of the composite core layer relative to the hole opening of the hole bottom; or the circuit board comprises a third core layer, the third core layer is arranged on one side, far away from the first core layer, of the second core layer, and the third core layer covers the hole opening, opposite to the hole bottom, of the first conductive hole.
In an embodiment of the invention, the second core layer includes at least two insulating layers and at least two conductive layers, and the first conductive hole penetrates through the at least two insulating layers and the at least two conductive layers.
The invention has the beneficial effects that: the invention provides a circuit board and a preparation method thereof, which are different from the prior art. In the preparation method, a pore-forming auxiliary body is formed on the conducting layer on the outermost layer of the first core layer, so that a second conducting hole is formed after the pore-forming auxiliary body is removed. Because the theoretical value of the hole bottom area of the first conductive hole is smaller than the orthographic projection area of the pore-forming auxiliary body on the first core layer, the micro space of cracks generated at the hole bottom of the first conductive hole due to laser drilling is enlarged as much as possible through the second conductive hole, so that the liquid medicine can fully enter the cracks to form the electric conductor, and the risk of circuit board delamination can be reduced. In addition, due to the mode of laser drilling, the first conductive hole is in an inverted cone shape, and the aperture of the first conductive hole is gradually reduced in the direction close to the pore-forming auxiliary body. Meanwhile, the theoretical value of the hole bottom area of the first conductive hole is smaller than the orthographic projection area of the pore-forming auxiliary body on the first core layer, namely, the second conductive hole enlarges the space corresponding to the hole bottom of the first conductive hole, so that after at least the hole walls of the first conductive hole and the second conductive hole form a conductor, the conductor limited by the first conductive hole and the second conductive hole is riveted, the interlayer bonding force of the first core layer and the second core layer is favorably improved, and the risk of circuit board layering is further reduced.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. Moreover, the drawings and the description are not intended to limit the scope of the inventive concept in any way, but rather to illustrate it by those skilled in the art with reference to specific embodiments.
FIG. 1 is a schematic flow chart of one embodiment of a method for manufacturing a circuit board according to the present invention;
FIG. 2 is a schematic flow chart of another embodiment of a method for manufacturing a circuit board according to the present invention;
FIGS. 3A-3J are schematic structural views of steps in a method of manufacturing the circuit board shown in FIG. 2;
fig. 4 is a schematic structural diagram of a circuit board according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1, fig. 1 is a schematic flow chart of a method for manufacturing a circuit board according to an embodiment of the invention. It should be noted that the method for manufacturing the circuit board described in this embodiment is not limited to the following steps.
S101: providing a first core layer;
in this embodiment, the first core layer includes conductive layers and insulating layers, and the conductive layers and the insulating layers are alternately stacked, where an outermost layer of the first core layer is a conductive layer. Specifically, the first core layer may be a conventional core board or the like, that is, the first core layer includes two conductive layers and an insulating layer located between the two conductive layers. Of course, the first core layer may include other numbers of conductive layers and insulating layers, which are alternately stacked one on another, and is not limited herein. The conductive layer may be a copper layer or the like.
S102: forming a pore-forming auxiliary body on the conducting layer;
in this embodiment, a pore-forming auxiliary body is formed on the conductive layer at the outermost layer of the first core layer, so as to form a second conductive hole after the pore-forming auxiliary body is subsequently removed.
S103: laminating a second core layer on one side of the first core layer on which the pore-forming auxiliary body is formed;
in this embodiment, the second core layer is laminated on the side of the first core layer where the pore-forming auxiliary body is formed, so that the first core layer and the second core layer can be tightly combined. The second core layer, just like the first core layer, also comprises conductive layers and insulating layers, which are alternately stacked. The second core layer comprises at least one conductive layer and at least one insulating layer, and the conductive layers and the insulating layers are alternately stacked one on another.
S104: drilling a region, corresponding to the pore-forming auxiliary body, on the surface, far away from the first core layer, of the second core layer to form a first conductive hole communicated to the pore-forming auxiliary body;
in this embodiment, before drilling the second core layer, the position of the pore-forming auxiliary body is determined, then drilling is performed on the area, corresponding to the pore-forming auxiliary body, on the surface of the second core layer, which is far away from the first core layer, and the drilling is conducted to the pore-forming auxiliary body, so that the first conductive hole is formed.
Due to the laser drilling, cracks are generated at the bottom of the first conductive hole and extend along the diameter direction of the first conductive hole. In this embodiment, the theoretical value of the area of the bottom of the first conductive hole is smaller than the area of the orthographic projection of the pore-forming auxiliary body on the first core layer, so that the micro space of the crack generated at the bottom of the first conductive hole due to laser drilling is enlarged as much as possible through the second conductive hole, the liquid medicine can enter the crack more sufficiently to form a subsequent conductor, and the risk of circuit board delamination can be reduced.
In addition, the laser drilling mode is favorable for obtaining the first conductive hole with smaller aperture, and is favorable for the production and the manufacture of the circuit board.
S105: removing the pore-forming auxiliary body to form a second conductive hole communicated with the first conductive hole at the bottom of the first conductive hole;
in this embodiment, the second conductive hole is formed after the pore-forming auxiliary body is removed, and the first conductive hole and the second conductive hole are arranged in a communicating manner. Because the theoretical value of the hole bottom area of the first conductive hole is smaller than the orthographic projection area of the pore-forming auxiliary body on the first core layer, the micro space of cracks generated at the hole bottom of the first conductive hole due to laser drilling can be enlarged as much as possible through the second conductive hole, so that the liquid medicine can enter the cracks more fully to form a subsequent electric conductor, and the risk of circuit board delamination can be reduced.
The pore-forming auxiliary body can be removed in various ways, for example, by removing a chemical, and the pore-forming auxiliary body only needs to satisfy the requirement that the conductive layer is not removed by the chemical when the pore-forming auxiliary body is removed by the subsequent chemical. The pore-forming auxiliary body may be made of tin, zirconium, iron, aluminum, water-soluble resin, etc. If the pore-forming auxiliary body is tin, removing the tin by using nitric acid; when the pore-forming aid is mentioned as a water-soluble resin, it can be removed by washing with water. The shape of the pore-forming auxiliary body can be any shape, such as a cylinder shape.
S106: and filling liquid medicine into the first conductive hole and the second conductive hole to form a conductor at least on the hole walls of the first conductive hole and the second conductive hole.
In this embodiment, after the liquid medicine is poured into the first conductive hole and the second conductive hole to form the conductor at least on the hole walls of the first conductive hole and the second conductive hole, the conductor defined by the first conductive hole and the second conductive hole is riveted, which is beneficial to improving the interlayer bonding force between the first core layer and the second core layer, and further reducing the risk of circuit board delamination.
Referring to fig. 2, fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing a circuit board according to the present invention. Fig. 3A to 3I are schematic structural views of steps in the manufacturing method of the circuit board shown in fig. 2. It should be noted that the method for manufacturing the circuit board described in this embodiment is not limited to the following steps.
S201: providing a first core layer;
referring to fig. 3A, the first core layer 1 includes conductive layers 7 and insulating layers 8, and the conductive layers 7 and the insulating layers 8 are alternately stacked, wherein the outermost layer of the first core layer 1 is the conductive layer 7. In particular, the first core layer 1 may be a conventional core board or the like, i.e. the first core layer comprises two electrically conductive layers 7 and an insulating layer 8 between the two electrically conductive layers 7. Of course, the first core layer 1 may include other numbers of conductive layers 7 and insulating layers 8, and the conductive layers 7 and the insulating layers 8 are alternately stacked one on another, which is not limited herein. The conductive layer 7 may be a copper layer or the like.
S202: forming a pore-forming auxiliary layer on the conducting layer at the outermost layer of the first core layer;
in this embodiment, the pore-forming auxiliary layer is located on the outermost conductive layer of the first core layer, and is used to form a subsequent pore-forming auxiliary body.
S203: patterning the pore-forming auxiliary layer to reserve the part of the pore-forming auxiliary layer at the target position so as to form a pore-forming auxiliary body;
in the embodiment, a target position of the pore-forming auxiliary body is predetermined, and the target position is directly opposite to the bottom of a subsequently formed first conductive pore; patterning the pore-forming auxiliary layer to retain a portion of the pore-forming auxiliary layer at the target position, where the portion of the pore-forming auxiliary layer is the pore-forming auxiliary body 2, as shown in fig. 3B. Specifically, the thickness of the pore-forming auxiliary body 2 is 5-200 μm, so that on one hand, the thickness of the pore-forming auxiliary body 2 is considered not to be too thin, and the situation that liquid medicine with too small channel can not fully enter after the pore-forming auxiliary body 2 is removed is avoided; on the other hand, the pore-forming auxiliary body 2 is prevented from being too thick, so that the later electroplating time is too long.
S204: forming a mask structure for coating the pore-forming auxiliary body on the pore-forming auxiliary body;
in this embodiment, the mask structure may be a dry film or a wet film, and the dry film or the wet film cures a specific pattern through exposure, thereby covering the pore-forming auxiliary body and protecting the pore-forming auxiliary body from being bitten by the liquid medicine in the subsequent browning process.
Specifically, the step of forming a mask structure covering the pore-creating auxiliary body on the pore-creating auxiliary body specifically includes the following steps:
step 1: forming a mask material layer on the surface of the first core layer on which the pore-forming auxiliary body is formed, wherein the mask material layer covers the pore-forming auxiliary body;
in this embodiment, the mask material layer is a dry film or a wet film, and the mask material layer only needs to cover the pore-forming auxiliary body and is not bitten by the liquid medicine in the browning process.
Step 2: and patterning the mask material layer to reserve the part of the mask material layer covering the pore-forming auxiliary body so as to form a mask structure.
In this embodiment, the remaining mask material can cover the pore-forming auxiliary body, so that the mask material can cover the pore-forming auxiliary body and protect the pore-forming auxiliary body from being bitten by the liquid medicine in the subsequent browning process.
S205: forming a brown layer in a region, which is not covered by the pore-forming auxiliary body and the mask structure, on the surface of the first core layer, wherein the pore-forming auxiliary body is formed;
in this embodiment, after the pore-forming auxiliary body on the first core layer forms the mask structure, the conductive layer provided with the pore-forming auxiliary body is further subjected to a browning process. Because the liquid medicine that uses in the brown oxidation process can not exert an influence to mask structure, consequently can protect the pore-forming auxiliary body not receive the influence of brown oxidation process, avoid the pore-forming auxiliary body because of being too crude by the erosion of the liquid medicine that brown oxidation was handled, influence follow-up electroplating liquid medicine and get into. In the browning process treatment, a browning layer can be formed on the conductive layer except for the pore-forming auxiliary body. The browning layer roughens the surface of the conductive layer, so that the binding force between the conductive layer of the first core layer and the second core layer is improved.
Of course, the step of forming the browning layer in the region of the first core layer where the pore-forming auxiliary body is formed and the region of the first core layer where the pore-forming auxiliary body is not covered by the pore-forming auxiliary body and the mask structure includes: and removing the mask structure. Specifically, the mask structure can be removed with conventional sodium hydroxide.
S206: laminating a second core layer on one side of the first core layer on which the pore-forming auxiliary body is formed;
referring to fig. 3C, the second core layer 3 is laminated on the side of the first core layer 1 where the pore-forming auxiliary body 2 is formed, so that the first core layer 1 and the second core layer 3 can be tightly bonded. The second core layer 3 is just like the first core layer 1 and also comprises conductive layers 7 and insulating layers 8, the conductive layers 7 and the insulating layers 8 being alternately stacked. The second core layer 3 comprises at least one conductive layer 7 and at least one insulating layer 8, and the conductive layers 7 and the insulating layers 8 are alternately stacked one on another. And the insulating layer 8 of the second core layer 3 is laminated to the conductive layer 7 of the outermost layer of the first core layer 1.
Fig. 3C shows a case where the second core layer 3 includes one conductive layer 7 and one insulating layer 8, wherein the insulating layer 8 is laminated on the conductive layer 7 of the outermost layer of the first core layer 1.
S207: drilling a region, corresponding to the pore-forming auxiliary body, on the surface, far away from the first core layer, of the second core layer to form a first conductive hole communicated to the pore-forming auxiliary body;
referring to fig. 3D, when the second core layer 3 has only one conductive layer 7 and one insulating layer 8, laser drilling is performed on a region of the second core layer 3 away from the first core layer 1 corresponding to the hole-forming auxiliary body 2, and the drilling is conducted to the hole-forming auxiliary body 2, so as to form a first conductive hole 21.
In other embodiments, as shown in fig. 3E and 3F, when the second core layer 3 includes multiple conductive layers 7 and multiple insulating layers 8, for example, the second core layer 3 shown in fig. 3E and 3F includes two conductive layers 7 and two insulating layers 8, and the first conductive via 21 extends through the multiple conductive layers 7 and the multiple insulating layers 8 of the second core layer 3. The first conductive hole 21 may be formed by laser drilling or by mechanical drilling in combination with laser drilling.
Referring to fig. 3E, the direct laser drilling process includes: and laser drilling is carried out on the surface of the second core layer 3 far away from the first core layer 1, corresponding to the pore-forming auxiliary body 2, so that the first conductive hole 21 penetrates through the at least two insulating layers 8 and the at least two conductive layers 7. The aperture can be provided to be smaller through the mode of laser drilling, satisfies the requirement of HDI product. The direct laser drilling may cause a problem that the middle conductive layer 7 still has a micro crack, but the rivet structure in this embodiment can compensate for the interlayer bonding force affected by the crack at the middle conductive layer 7.
Referring to fig. 3F, in consideration of the direct laser drilling to generate cracks at the middle conductive layer 7, in other embodiments, a combination of mechanical drilling and laser drilling may be used to avoid the cracks at the middle conductive layer 7. The matching process of mechanical drilling and laser drilling comprises the following steps: and mechanically drilling a region corresponding to the pore-forming auxiliary body 2 on the surface of the second core layer 3 far away from the first core layer 1, drilling the insulating layer 8 or the conducting layer 7 closest to the pore-forming auxiliary body 2 in the second core layer 3 by using laser, and drilling the insulating layer or the conducting layer to the pore-forming auxiliary body 2, so that the first conducting hole 21 is communicated with the pore-forming auxiliary body 2. In this embodiment, the mechanical drilling and the laser drilling are combined, so that cracks between the second core layer 3 can be avoided, and the stability of the hole shape of the first conductive hole 21 formed by the mechanical drilling is good.
S208: removing the pore-forming auxiliary body to form a second conductive hole communicated with the first conductive hole at the bottom of the first conductive hole;
in this embodiment, since the theoretical value of the hole bottom area of the first conductive hole is smaller than the area of the orthographic projection of the pore-forming auxiliary body on the first core layer, after the pore-forming auxiliary body is removed to form the second conductive hole, the micro space of the crack generated at the hole bottom of the first conductive hole due to laser drilling is enlarged as much as possible through the second conductive hole, so that the liquid medicine can more fully enter the crack to form the conductive body, and the risk of circuit board delamination can be reduced.
Specifically, referring to fig. 3G, the dimension of the pore-forming auxiliary body in the first direction is greater than or equal to the theoretical value of the dimension of the bottom of the first conductive hole 21 in the first direction, wherein the first direction is the direction indicated by the arrow X shown in fig. 3G, and the first direction is perpendicular to the axial direction of the first conductive hole 21. Namely, after the auxiliary hole-forming body is removed, the wedge-shaped crack formed on the side wall of the bottom of the first conductive hole 21 is completely integrated with the space of the second conductive hole 22 to form a larger space, which is convenient for the subsequent electroplating liquid medicine to enter.
Further, in the laser drilling process, the length of the wedge-shaped crack formed by laser ablation is not controllable due to the uncontrollable factors of the drilling process, so that the size of the pore-forming auxiliary body is as large as possible. In view of this, the size of the pore-forming auxiliary body in the first direction in the present embodiment is the sum of the theoretical value of the size of the pore bottom of the first conductive pore 21 in the first direction and a size threshold. The theoretical value of the dimension of the bottom of the first conductive via 21 in the first direction is the dimension of the bottom of the first conductive via 21 in the first direction after laser drilling, without considering laser ablation. Preferably, the size threshold is set to 10-100 μm, such as 10 μm, 100 μm, 50 μm, etc. The inventors have found that, in the above manner, it is ensured that the wedge-shaped cracks formed on the hole bottom side walls of the first conductive holes 21 are completely merged with the spaces of the second conductive holes 22 after the removal of the pore-forming aids.
For example, when the pore-forming auxiliary body 2 is circular, the diameter of the pore-forming auxiliary body 2 is the sum of the theoretical value of the diameter of the bottom of the first conductive hole 21 and the sizes of 5-50 μm on both sides of the first conductive hole 21.
In the present embodiment, please continue to refer to fig. 3G, the circuit board includes a composite core layer, the composite core layer includes a first core layer 1 and a second core layer 3, wherein the first conductive via 21 is located at an outermost layer of the composite core layer relative to the opening of the bottom of the first conductive via, i.e., the first conductive via 21 is a blind via.
In an alternative embodiment, referring to fig. 3H, a third core layer 5 is laminated on the side of the second core layer 3 away from the first core layer 1; the third core layer 5, like the first core layer 1 and the second core layer 3, also comprises at least one conductive layer 7 and at least one insulating layer 8, the conductive layers 7 and the insulating layers 8 being alternately stacked. The third core layer 5 covers the aperture of the first conductive hole 11 relative to the bottom of the hole, so that the first conductive hole 21 is a buried hole.
That is, the first conductive via 21 formed by the method of the present embodiment may be a blind via or a buried via, and is not limited herein.
S209: and filling liquid medicine into the first conductive hole and the second conductive hole to form a conductor at least on the hole walls of the first conductive hole and the second conductive hole.
In this embodiment, the second conductive hole enlarges a space corresponding to the bottom of the first conductive hole, so that at least after the conductive bodies are formed on the hole walls of the first conductive hole and the second conductive hole, the conductive bodies defined by the first conductive hole and the second conductive hole are riveted, as shown in fig. 3I and 3J, which is beneficial to improving the interlayer bonding force between the first core layer and the second core layer, and further reducing the risk of circuit board delamination.
In one embodiment, referring to fig. 3I, the conductive body 4 completely fills the first conductive via 21 and the second conductive via 22. In an alternative embodiment, referring to fig. 3J, the conductive body 4 may be formed only on the wall of the first conductive via 21 and the second conductive via 22. Namely, no matter the conductor 4 is completely filled in the first conductive hole 21 and the second conductive hole in the blind hole and the buried hole; or the conductor 4 is partially formed on the hole walls of the first conductive hole 21 and the second conductive hole 22, so that the conductor 4 can be riveted, the interlayer bonding force between the first core layer 1 and the second core layer 3 is improved, and the risk of circuit board delamination is further reduced.
In summary, the present invention provides a method for manufacturing a circuit board, in which a pore-forming auxiliary is formed on the outermost conductive layer of the first core layer, so as to form a second conductive hole after removing the pore-forming auxiliary. Because the theoretical value of the hole bottom area of the first conductive hole is smaller than the orthographic projection area of the pore-forming auxiliary body on the first core layer, the micro space of cracks generated at the hole bottom of the first conductive hole due to laser drilling is enlarged as much as possible through the second conductive hole, so that the liquid medicine can fully enter the cracks to form the electric conductor, and the risk of circuit board delamination can be reduced. In addition, due to the mode of laser drilling, the first conductive hole is in an inverted cone shape, and the aperture of the first conductive hole is gradually reduced in the direction close to the pore-forming auxiliary body. Meanwhile, the theoretical value of the hole bottom area of the first conductive hole is smaller than the orthographic projection area of the pore-forming auxiliary body on the first core layer, namely, the second conductive hole enlarges the space corresponding to the hole bottom of the first conductive hole, so that after at least the hole walls of the first conductive hole and the second conductive hole form a conductor, the conductor limited by the first conductive hole and the second conductive hole is riveted, the interlayer bonding force of the first core layer and the second core layer is favorably improved, and the risk of circuit board layering is further reduced. The preparation method of the circuit board can be suitable for the mechanical and laser processing processes of the PCB, such as mechanically drilling nail heads, laser drilling wedge-shaped cracks and the like.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a circuit board according to an embodiment of the invention. It should be noted that the circuit board described in the present embodiment is not limited to the following structure.
The circuit board comprises a first core layer 1 and a second core layer 3 which are arranged in a stacked mode, a first conductive hole 21 and a second conductive hole 22 which are communicated with each other are arranged on the second core layer 3, the second conductive hole 22 is close to the first core layer 1 relative to the first conductive hole 21 and is conducted to the first core layer 1, and an extending hole body portion 6 formed due to laser ablation is arranged at the hole bottom of the first conductive hole 21 communicated with the second conductive hole 22. Specifically, the extended hole body 6 is a part of the bottom of the first conductive hole 21.
Although the extension hole body 6 is not completely integrated with the second conductive hole 22, there is still a crack with a small space, but due to the design of the second conductive hole 22 in this embodiment, the extension hole body 6 has a part of crack space integrated with the second conductive hole 22, that is, the micro space of the crack generated at the bottom of the first conductive hole 21 due to laser drilling is already enlarged, so that the liquid medicine can more fully enter the crack to form a conductive body, and the risk of circuit board delamination can be reduced.
Of course, in other embodiments of the present invention, the extended hole body 6 may be completely integrated with the second conductive hole 22, and is not limited herein.
Specifically, the conductive body 4 is formed on at least the hole walls of the first conductive hole 21 and the second conductive hole 22, so that the conductive body 4 defined by the first conductive hole 21 and the second conductive hole 22 is riveted, which is beneficial to improving the interlayer bonding force between the first core layer 1 and the second core layer 3, and further reducing the risk of circuit board delamination.
In one embodiment, the conductive body 4 may be formed only on the hole walls of the first conductive hole 21 and the second conductive hole 22. In an alternative embodiment, referring to fig. 3I, the conductive body 4 completely fills the first conductive via 21 and the second conductive via 22. Namely, no matter the conductive body 4 is completely filled in the first conductive hole 21 and the second conductive hole 22 in the blind hole and the buried hole; or the conductor 4 is partially formed on the hole walls of the first conductive hole 21 and the second conductive hole 22, so that the conductor 4 can be riveted, the interlayer bonding force between the first core layer 1 and the second core layer 3 is improved, and the risk of circuit board delamination is further reduced.
It should be noted that the circuit board described in this embodiment is manufactured by the method for manufacturing the circuit board described in the above embodiment, and details are not described herein again.
In an embodiment, referring back to fig. 4, the dimension of the second conductive via 22 in the first direction is greater than or equal to the theoretical value of the dimension of the bottom of the first conductive via 21 in the first direction, wherein the first direction is the direction indicated by the arrow X shown in fig. 4, and the first direction is perpendicular to the axial direction of the first conductive via 21. The inventor finds that, by adopting the mode, the extending hole body part 6 formed on the hole bottom side wall of the first conductive hole 21 can be completely integrated with the space of the second conductive hole 22 to form a larger space, and the subsequent electroplating liquid medicine can be conveniently fed.
In the laser drilling process, the extended hole body portion 6 formed by laser ablation has an uncontrollable length due to uncontrollable factors in the drilling process, so that the size of the second conductive hole 22 is formed as large as possible. The dimension of the second conductive via 22 in the first direction is the sum of the theoretical value of the dimension of the bottom of the first conductive via 21 in the first direction and a dimension threshold, wherein the dimension threshold is 10-100 μm, such as 10 μm, 100 μm, 50 μm, etc.
In one embodiment, the second conductive holes 22 have a depth of 5-200 μm and a height formed by removing the hole-forming auxiliary body during the circuit board manufacturing method. The depth of the second conductive hole 22 is set to be 5-200 μm, so that the situation that the liquid medicine cannot sufficiently enter the second conductive hole 22 even if the passage of the second conductive hole is too small is prevented; on the other hand, preventing the second conductive via 22 from being too thick can make the post-plating time too long. Specifically, the depth of the second conductive hole 22 may be 5 μm, 50 μm, 100 μm, 200 μm, or the like.
In one embodiment, referring to fig. 3G, the circuit board includes a composite core layer, the composite core layer includes a first core layer 1 and a second core layer 3, wherein the first conductive via 21 is located at the outermost layer of the composite core layer relative to the opening at the bottom of the first conductive via 21, that is, the first conductive via 21 is formed as a blind via.
In an alternative embodiment, referring to fig. 3H, the circuit board includes a third core layer 5, the third core layer 5 is disposed on a side of the second core layer 3 away from the first core layer 1, the third core layer 5 is similar to the first core layer 1 and the second core layer 3 and includes at least one conductive layer 7 and at least one insulating layer 8, and the conductive layer 7 and the insulating layer 8 are alternately stacked. The third core layer 5 covers the aperture of the first conductive hole 21 relative to the bottom of the hole, so that the first conductive hole 21 is a buried hole. That is, the first conductive via 21 formed by the method of the present embodiment may be a blind via or a buried via, and is not limited herein.
Specifically, referring to fig. 3E, the second core layer 3 may include at least two insulating layers 8 and at least two conductive layers 7, and the first conductive hole 21 penetrates through the at least two insulating layers 8 and the at least two conductive layers 7, so that the first conductive hole 21 may be formed by laser drilling or by mechanical drilling and laser drilling.
In addition, in the present invention, unless otherwise expressly specified or limited, the terms "connected," "stacked," and the like are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (16)
1. A method for manufacturing a circuit board, the method comprising:
providing a first core layer, wherein the outermost layer of the first core layer is a conductive layer;
forming a pore-forming auxiliary body on the conducting layer;
laminating a second core layer on one side of the first core layer on which the pore-forming auxiliary body is formed;
drilling a region, corresponding to the pore-forming auxiliary body, on the surface, far away from the first core layer, of the second core layer to form a first conductive hole communicated to the pore-forming auxiliary body; wherein the theoretical value of the bottom area of the first conductive hole is smaller than the orthographic projection area of the pore-forming auxiliary body on the first core layer, and the drilling mode comprises laser drilling;
removing the pore-forming auxiliary body to form a second conductive pore communicated with the first conductive pore at the bottom of the first conductive pore;
and filling liquid medicine into the first conductive hole and the second conductive hole so as to form a conductor at least on the hole walls of the first conductive hole and the second conductive hole.
2. The method of claim 1, wherein the dimension of the pore-forming auxiliary body in a first direction is greater than or equal to a theoretical value of the dimension of the pore bottom of the first conductive pore in the first direction, wherein the first direction is perpendicular to the axial direction of the first conductive pore.
3. The method of claim 2, wherein the dimension of the pore-forming auxiliary body in the first direction is a sum of a theoretical value of a dimension of the pore bottom of the first conductive pore in the first direction and a dimension threshold, wherein the dimension threshold is 10-100 μm.
4. The method of manufacturing a circuit board according to claim 1, wherein the step of forming a pore-forming auxiliary body on the conductive layer at the outermost layer of the first core layer comprises:
forming a pore-forming auxiliary layer on the conductive layer at the outermost layer of the first core layer;
and patterning the pore-forming auxiliary layer to reserve a part of the pore-forming auxiliary layer at a target position so as to form the pore-forming auxiliary body, wherein the target position is over against the bottom of the first conductive hole formed subsequently.
5. The method for preparing a circuit board according to claim 1, wherein the step of laminating a second core layer on the side of the first core layer on which the pore-forming auxiliary body is formed comprises:
forming a mask structure for coating the pore-forming auxiliary body on the pore-forming auxiliary body;
and forming a brown layer in the area, which is not covered by the pore-forming auxiliary body and the mask structure, on the surface of the first core layer on which the pore-forming auxiliary body is formed.
6. The method according to claim 5, wherein the step of forming a mask structure over the pore-creating auxiliary body comprises:
forming a mask material layer on the surface of the first core layer on which the pore-forming auxiliary body is formed, wherein the mask material layer covers the pore-forming auxiliary body;
and patterning the mask material layer to reserve the part of the mask material layer covering the pore-forming auxiliary body so as to form the mask structure.
7. The method for preparing a circuit board according to claim 5, wherein the step of forming a browning layer in the area of the first core layer where the pore-forming auxiliary body is formed and the area of the first core layer where the pore-forming auxiliary body is not covered by the pore-forming auxiliary body and the mask structure is followed by:
and removing the mask structure.
8. The method for producing a circuit board according to any one of claims 1 to 7,
the circuit board comprises a composite core layer comprising the first core layer and the second core layer, wherein the first conductive via is located outermost of the composite core layer relative to an aperture at a bottom of the first conductive via; or
The step of filling the first conductive via and the second conductive via with a conductive material is followed by:
laminating a third core layer on the side of the second core layer away from the first core layer; wherein the third core layer covers the aperture of the first conductive hole relative to the bottom of the hole.
9. The method for manufacturing a circuit board according to any one of claims 1 to 7, wherein the second core layer includes at least two insulating layers and at least two conductive layers, and the first conductive hole penetrates through the at least two insulating layers and the at least two conductive layers.
10. The method for manufacturing a circuit board according to claim 9,
the step of drilling the area, corresponding to the pore-forming auxiliary body, on the surface of the second core layer far away from the first core layer comprises the following steps:
laser drilling is carried out on the area, corresponding to the pore-forming auxiliary body, on the surface, far away from the first core layer, of the second core layer, so that the first conductive hole penetrates through the at least two insulating layers and the at least two conductive layers; or
The step of drilling the area, corresponding to the pore-forming auxiliary body, on the surface of the second core layer far away from the first core layer comprises the following steps:
and mechanically drilling a region, corresponding to the pore-forming auxiliary body, on the surface of the second core layer, which is far away from the first core layer, and drilling the insulating layer or the conducting layer, which is closest to the pore-forming auxiliary body, in the second core layer by using laser instead of drilling and drilling to the pore-forming auxiliary body, so that the first conducting hole penetrates through the at least two insulating layers and the at least two conducting layers.
11. The circuit board is characterized by comprising a first core layer and a second core layer which are arranged in a stacked mode, wherein a first conductive hole and a second conductive hole which are communicated are formed in the second core layer, the second conductive hole is close to the first core layer relative to the first conductive hole and is communicated with the first core layer, the first conductive hole is communicated with the hole bottom of the second conductive hole and is provided with an extending hole body portion formed by laser ablation, and at least electric conductors are formed on the hole walls of the first conductive hole and the second conductive hole.
12. The circuit board of claim 11, wherein the dimension of the second conductive via in a first direction is greater than or equal to a theoretical value of the dimension of the bottom of the first conductive via in the first direction, wherein the first direction is perpendicular to the axial direction of the first conductive via.
13. The circuit board of claim 12, wherein the dimension of the second conductive via in the first direction is a sum of a theoretical value of a dimension of a via bottom of the first conductive via in the first direction and a size threshold, wherein the size threshold is 10-100 μ ι η.
14. The circuit board of claim 11, wherein the second conductive hole has a depth of 5-200 μm.
15. The circuit board of claim 11,
the circuit board comprises a composite core layer comprising the first core layer and the second core layer, wherein the first conductive via is located outermost of the composite core layer relative to an aperture at a bottom of the first conductive via; or
The circuit board comprises a third core layer, the third core layer is arranged on one side, far away from the first core layer, of the second core layer, and the third core layer covers the hole opening, opposite to the hole bottom, of the first conductive hole.
16. The circuit board of claim 11, wherein the second core layer comprises at least two insulating layers and at least two conductive layers, and the first conductive via extends through the at least two insulating layers and the at least two conductive layers.
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Application publication date: 20211217 |