CN113800754B - Flexible shell and preparation method and application thereof - Google Patents

Flexible shell and preparation method and application thereof Download PDF

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Publication number
CN113800754B
CN113800754B CN202010529693.9A CN202010529693A CN113800754B CN 113800754 B CN113800754 B CN 113800754B CN 202010529693 A CN202010529693 A CN 202010529693A CN 113800754 B CN113800754 B CN 113800754B
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treatment
ion implantation
layer
strengthening
flexible
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CN113800754A (en
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李可峰
许仁
王伟
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Weidali Technology Co ltd
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Weidali Technology Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B27/00—Tempering or quenching glass products
    • C03B27/02—Tempering or quenching glass products using liquid
    • C03B27/03—Tempering or quenching glass products using liquid the liquid being a molten metal or a molten salt
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/123—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Casings For Electric Apparatus (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention relates to a flexible shell, a preparation method and application thereof. The preparation method comprises the steps of carrying out chemical strengthening treatment on a shell substrate, obtaining a strengthening piece after the chemical strengthening treatment, and then carrying out thinning treatment on one surface of the strengthening piece to adjust the thickness of the shell substrate to a required range. After the thinning treatment, the surface of the flexible shell is subjected to ion treatment, so that the surface hardness of the flexible shell is effectively improved. The preparation method can improve the surface hardness of the flexible shell, can effectively avoid damage to the shell base material with smaller thickness in the processing process, and improves the stability of the flexible shell. The flexible shell has good surface hardness, is not easy to wear, scratch, crack and other problems in the use process, and can keep good appearance.

Description

Flexible shell and preparation method and application thereof
Technical Field
The invention relates to the technical field of flexible shells, in particular to a flexible shell and a preparation method and application thereof.
Background
With the continuous popularization of consumer electronic products, flexible electronic products gradually enter people's lives. Flexible electronic products are receiving much attention because of their more diverse shapes and display effects. The housing is an important component of the electronic product, which has a great influence on the performance of the electronic product. The shell with excellent performance can keep the stable appearance of the electronic product, and the problems of abrasion, scratch, cracking and the like are not easy to occur.
In the manufacture of flexible electronic products, it is common to use a housing having a smaller thickness, such as a housing having a thickness of less than 0.2mm, to manufacture the flexible electronic products. However, while obtaining shells having a small thickness, it is difficult for the conventional manufacturing method to give these shells good surface hardness. In this way, the problems of abrasion, scratch, cracking and the like of the outer surface of the flexible electronic product are easy to occur in the using process of the flexible electronic product.
Disclosure of Invention
Based on this, it is necessary to provide a manufacturing method of a flexible housing, which can effectively improve the surface hardness of the flexible housing.
In addition, there is a need to provide a flexible housing that has good surface hardness and is less prone to wear, scratches, breakage, etc. during use.
In addition to the above method of manufacturing a flexible housing and the flexible housing, it is also necessary to provide an electronic product having good surface hardness. In the daily use process, the surface of the electronic product is not easy to wear, scratch and crack, and good appearance performance can be maintained.
The specific scheme for solving the technical problems is as follows:
an object of the present invention is to provide a method of manufacturing a flexible housing, the method comprising the steps of:
carrying out chemical strengthening treatment on the shell base material to obtain a strengthening piece;
thinning one surface of the reinforcement member to obtain a thinned member, wherein the thinned surface forms a thinned surface;
and carrying out ion implantation treatment on the thinning treatment surface.
In one embodiment, the thickness of the thinning processing is 1 μm to 200 μm.
In one embodiment, the thinning process is at least one of an etching process and a machining process.
In one embodiment, the etching process is at least one of a dry etching process, a wet etching process, and a laser etching process.
In one embodiment, the chemical strengthening treatment comprises the steps of:
and (3) carrying out chemical strengthening treatment on the shell base material by adopting strengthening liquid at the temperature of 200-600 ℃, wherein the treatment time of the chemical strengthening treatment is 0.01-3 h.
In one embodiment, the strengthening liquid is a potassium nitrate melt or the strengthening liquid is a potassium nitrate melt containing sodium ions and/or lithium ions.
In one embodiment, the ions implanted in the ion implantation process are at least one of nitrogen, carbon, aluminum, oxygen, silicon, titanium, chromium, and copper.
In one embodiment, the ion implantation process is performed at a depth of 0.01 μm to 10 μm.
In one embodiment, the ion implantation process conditions are: ion implantation energy is 1 keV-1000 keV, ion implantation dosage is 10 2 ions/cm 2 ～10 30 ions/cm 2 。
In one embodiment, the method further comprises the step of heat treating the thinned treatment member; the temperature of the heat treatment is 200-1200 ℃, and the time of the heat treatment is 0.1-120 s.
Another object of the present invention is to provide a flexible housing comprising a substrate layer, a first ion-strengthening layer, a second ion-strengthening layer, and an ion-implantation layer; the substrate layer is provided with a mounting surface and an ion implantation surface which are oppositely arranged;
the first ion strengthening layer penetrates into the substrate layer, one surface of the first ion strengthening layer is flush with the ion implantation surface, and the second ion strengthening layer penetrates into the substrate layer, one surface of the second ion strengthening layer is flush with the mounting surface;
the ion implantation layer penetrates into the substrate layer and one surface of the ion implantation layer is flush with the ion implantation surface.
In one embodiment, the substrate layer has a thickness of 1 μm to 200 μm; and/or the number of the groups of groups,
the thickness of the ion implantation layer is 0.01-10 mu m.
Still another object of the present invention is to provide an electronic product, which includes the flexible casing prepared by the preparation method described in any one of the above embodiments, wherein the surface treated by ion implantation is close to the outer surface of the electronic product;
alternatively, a flexible casing as in any of the above embodiments is included, wherein the ion implantation layer is adjacent to an outer surface of the electronic product.
The preparation method of the flexible shell comprises the following steps: and carrying out chemical strengthening treatment on the shell base material to obtain a strengthening piece, carrying out thinning treatment on one surface of the strengthening piece to obtain a thinning treatment piece, forming a thinning treatment surface on the thinning treatment surface, and carrying out ion implantation treatment on the thinning treatment surface. Because the general thickness of the flexible shell is smaller and is smaller than 0.2mm, in the preparation method, the shell base material is subjected to chemical strengthening treatment, the strength of the shell base material is improved, and the shell base material can be prevented from being damaged due to insufficient strength in the subsequent processing process. After the chemical strengthening treatment, a strengthening member is obtained, and then a thinning treatment is performed from one surface of the strengthening member, so that the thickness of the shell substrate is adjusted to a desired range. The thinning treatment from one surface of the reinforcement is convenient for controlling the thinning degree, and simultaneously, the damage to the shell substrate caused by the thinning process can be reduced as much as possible. After the thinning treatment, ion implantation treatment is carried out on the surface of the thinning treatment, so that the surface hardness of the flexible shell is effectively improved. According to the preparation method of the flexible shell, after the chemical strengthening treatment is carried out on the shell base material, the thinning treatment is carried out on one surface of the obtained strengthening piece, then the ion implantation treatment is carried out, so that the surface hardness of the flexible shell can be improved, meanwhile, the damage to the shell base material with smaller thickness in the processing process can be effectively avoided, and the stability of the flexible shell is improved.
The flexible shell comprises a substrate layer, a first ion strengthening layer, a second ion strengthening layer and an ion implantation layer. The flexible shell has good surface hardness through the matching of the first ion strengthening layer, the second ion strengthening layer and the ion implantation layer.
The electronic product has good surface hardness. In the daily use process, the surface of the electronic product is not easy to wear, scratch and crack, and good appearance performance can be maintained.
Drawings
Fig. 1 is a schematic structural view of a flexible housing according to an embodiment of the invention.
The figure indicates:
10. a flexible housing; 101. a substrate layer; 1011. a first ion-strengthening layer; 1012. a second ion-strengthening layer; 1013. an ion implantation layer; 102. an optical adhesive layer; 103. plating; 104. an anti-fingerprint layer.
Detailed Description
In order that the invention may be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments that are illustrated in the appended drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
An embodiment of the invention provides a preparation method of a flexible shell, which comprises the following steps:
carrying out chemical strengthening treatment on the shell base material to obtain a strengthening piece; thinning one surface of the reinforcement member to obtain a thinned member, wherein the thinned surface forms a thinned surface; ion implantation is performed on the thinning surface.
Because flexible casings are generally small in thickness, generally less than 0.2mm in thickness, when flexible casings are processed by conventional methods, it is difficult to make these casings have good surface hardness, and thus the surface hardness of the resulting flexible casings is poor. In the preparation method of the embodiment, the shell substrate is subjected to chemical strengthening treatment, so that the strength of the shell substrate is improved, and the shell substrate can be prevented from being damaged due to insufficient strength in the subsequent processing process. After the chemical strengthening treatment, a strengthening member is obtained, and then a thinning treatment is performed from one surface of the strengthening member, so that the thickness of the shell substrate is adjusted to a desired range. The thinning treatment from one surface of the reinforcement is convenient for controlling the thinning degree, and simultaneously, the damage to the shell substrate caused by the thinning process can be reduced as much as possible. After the thinning treatment, ion implantation treatment is carried out from the surface of the thinning treatment, so that the hardness of the flexible shell is effectively improved. According to the preparation method of the flexible shell, after the shell base material is subjected to chemical strengthening treatment, one surface of the obtained strengthening piece is subjected to thinning treatment, and then ion implantation treatment is performed, so that the surface hardness of the flexible shell can be improved, meanwhile, the damage to the shell base material with smaller thickness in the processing process can be effectively avoided, and the stability of the flexible shell is improved.
The flexible shell can be used for preparing shells, protective cover plates, functional parts and the like in electronic equipment, for example, the specific shape of the flexible shell can be plate-shaped, frame-shaped, net-shaped, groove-shaped with convex edges at the periphery and the like, such as 2D, 2.5D, 3D or multi-curved-surface special-shaped shapes, namely, the specific application of the flexible shell can be used for carrying out processing molding on a shell substrate according to the requirement to obtain any shape.
In one specific example, the housing substrate may be, but is not limited to, a glass housing substrate, a polyimide housing substrate, a polyethylene terephthalate (PET) housing substrate, a Polycarbonate (PC) housing substrate, a polyacetyl housing substrate. In particular, the glass housing substrate may be, but is not limited to, an aluminosilicate glass housing substrate, a soda lime glass housing substrate, or a lithium glass housing substrate. Preferably, the thickness of the housing substrate is no more than 0.2mm, so that the housing substrate has a certain flexibility, enabling it to be used for the preparation of flexible housings.
It is understood that the housing substrate is pre-treated prior to the chemical strengthening treatment of the housing substrate. And (3) preprocessing the shell substrate to remove impurities on the surface of the shell substrate. The impurities such as dust, greasy dirt and fingerprints on the surface of the shell substrate or the heterogeneous layer on the surface layer are removed through pretreatment, so that the shell substrate is convenient to carry out subsequent processing, and the accuracy of the subsequent processing is improved. The pretreatment comprises the steps of cleaning and the like. It can be understood that the pretreatment further comprises operations such as appearance processing, wherein the shell base material is processed into a corresponding shape according to design requirements, and then subsequent processing is performed.
In a specific example, the thickness of the thinning treatment is 1 μm to 200 μm. For example, the thickness of the thinning process may be, but is not limited to: 1 μm, 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 120 μm, 150 μm, 160 μm, 190 μm, 200 μm. The thickness of the shell base material is adjusted to a proper range through thinning treatment, so that the shell has flexibility and self stability. In the subsequent processing process, the shell is not easy to crack, break and the like. In the traditional preparation process, when the thickness of the flexible shell substrate is smaller than 0.2mm, the processing difficulty is obviously increased, and the flexible shell with excellent surface hardness is difficult to obtain, so that the use and popularization of the flexible shell and the flexible electronic product are severely restricted. According to the preparation method, the shell substrate is subjected to chemical strengthening, then one surface of the shell substrate is subjected to thinning treatment, and then the surface of the thinning treatment is subjected to ion implantation treatment.
In a specific example, the thinning process is at least one of an etching process and a machining process.
Specifically, the etching process is at least one of a dry etching process, a wet etching process, and a laser etching process.
In one specific example, the thinning process includes the steps of: a protective layer is coated on one surface of the reinforcing member, and then the reinforcing member is subjected to etching treatment. In the thinning treatment process, a protective layer is covered on one surface of the reinforcement, then etching treatment is carried out, and the protective layer can protect the reinforcement, so that the surface covered by the protective layer is free from being etched in the etching process, and the purpose of thinning one surface of the reinforcement is realized.
Preferably, the protective layer is an optical cement. For example: the OCA optical adhesive is double-sided adhesive, one surface of the OCA is adhered to one surface of the reinforcement, and the other surface of the OCA is used for being adhered to an electronic product to adhere the flexible shell to the electronic product, so that the flexible shell is used as a shell of the electronic product. During the subsequent etching process, the OCA optical adhesive covered surface is protected from etching. In the subsequent ion implantation treatment process, ion implantation treatment is not carried out on the surface covered by the OCA optical cement, and the surface of the OCA, which is used for being adhered to the electronic product, is protected by a release film.
In a specific example, the surface to be covered may be subjected to a decorative treatment before one surface of the reinforcing member is covered with the protective layer. Such as ink decorations, film decorations, etc., so that the flexible housing can exhibit a more colorful appearance.
In a specific example, the etching process employs a dry etching process, wherein the dry etching process is a plasma etching process. For example using CF 4 The plasma performs an etching process.
In one specific example, the chemical strengthening treatment includes the steps of: and (3) carrying out chemical strengthening treatment on the shell base material by adopting strengthening liquid at the temperature of 200-600 ℃, wherein the treatment time of the chemical strengthening treatment is 0.01-3 h. Specifically, the strengthening liquid is potassium nitrate melt, or the strengthening liquid is potassium nitrate melt containing sodium ions and/or lithium ions. Preferably, the temperature of the chemical strengthening treatment is 250 ℃ to 600 ℃, and more preferably, the temperature of the chemical strengthening treatment is 350 ℃ to 500 ℃. For example, the chemical strengthening treatment may be performed at a temperature of 350℃at 380℃at 450℃at 500 ℃. It will be appreciated that one or more chemical strengthening may be performed during the preparation of the flexible housing. The conditions for each chemical strengthening may be the same or different. Further, the treatment time of the chemical strengthening treatment is 0.1 to 3 hours. For example, the treatment time of the chemical strengthening treatment may be, but is not limited to, 0.2h, 0.3h, 0.4h, 0.5h, 0.6h, 0.7h, 0.8h, 0.9h, 1h, 1.2h, 1.5h, 2h.
In a specific example, the ions implanted in the ion implantation process are at least one of nitrogen, carbon, aluminum, oxygen, silicon, titanium, chromium, and copper. The surface hardness of the flexible housing can be improved while maintaining the optical properties of the flexible housing by implantation of at least one ion selected from the group consisting of nitrogen, carbon, aluminum, oxygen, silicon, titanium, chromium, and copper. Preferably, the ions implanted in the ion implantation process are nitrogen ions, carbon ions, aluminum ions, silicon ions, aluminum-nitrogen mixed ions, aluminum-oxygen mixed ions, silicon-nitrogen-oxygen mixed ions, titanium-nitrogen-oxygen mixed ions, chromium-nitrogen-oxygen mixed ions, copper-nitrogen-oxygen mixed ions.
In a specific example, the ion implantation depth in the ion implantation process is 0.01 μm to 10 μm. Preferably, the depth of ion implantation in the ion implantation treatment is 0.01 μm to 6 μm. Specifically, the depth of ion implantation in the ion implantation treatment was 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1 μm, 1.5 μm, 1.8 μm, 2 μm, 2.5 μm, 2.8 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm.
In one specific example, the ion implantation process conditions are: ion implantation energy is 1 keV-1000 keV, ion implantation dosage is 10 2 ions/cm 2 ～10 30 ions/cm 2 。
It will be appreciated that during the ion implantation process, if unwanted additional deposition layers are formed on the surface of the housing substrate during ion implantation, these unwanted additional deposition layers may be removed by etching. The etching method may employ a conventional wet etching or dry etching or laser etching or machining process. Preferably, dry etching is used to remove the excess additional deposited layer. Further, a plasma etching process is used to remove the excess additional deposited layer. The plasma may be, but is not limited to, CF 4 And (3) plasma.
In a specific example, the manufacturing method further includes a step of heat-treating the thinned treatment member; the temperature of the heat treatment is 200-1200 ℃, and the time of the heat treatment is 0.1-120 s. Specifically, the heat treatment temperature may be, but is not limited to, 200 ℃, 250 ℃, 300 ℃, 400 ℃, 500 ℃, 600 ℃, 700 ℃, 800 ℃, 900 ℃, 1000 ℃, 1100 ℃. The time of the heat treatment may be, but is not limited to, 0.2s, 0.5s, 0.7s, 1s, 1.5s, 2s, 5s, 8s, 10s, 15s, 20s, 30s, 40s, 50s, 60s, 70s, 80s, 90s, 100s, 110s.
In a specific example, the method further includes a step of processing the plating layer at the thinning treatment surface after the ion implantation treatment. The surface hardness of the flexible shell is further improved by processing the plating layer. The plating layer may be formed by conventional vacuum plating, and the plating layer may be one or more of nitride plating, carbide plating, oxide plating (such as silicon oxide plating), oxynitride plating and carbon plating.
In a specific example, the method further includes a step of processing the fingerprint-resistant layer on the thinning treatment surface after the ion implantation treatment. The touch or touch of the consumer can leave a fingerprint on the surface of the shell, affecting the appearance of the shell. Therefore, after the ion implantation treatment, the anti-fingerprint layer is processed, which is beneficial to maintaining the beautiful appearance of the shell. It is understood that in order for the case to exhibit other external appearance properties, such as an anti-glare property, during the manufacturing process of the case, the anti-glare layer may be formed on the reduced treatment surface.
In a specific example, after the ion implantation treatment, a plating layer is processed on the thinning treatment surface, and then an anti-fingerprint layer and/or an anti-glare layer is processed on the surface of the plating layer. Or processing an anti-glare layer or a textured layer prior to ion implantation.
Another embodiment of the present invention provides a flexible housing 10, the flexible housing 10 includes a substrate layer 101, a first ion strengthening layer 1011, a second ion strengthening layer 1012, and an ion implantation layer 1013; the base material layer 101 has a mounting surface and an ion implantation surface which are disposed opposite to each other. The first ion-strengthening layer 1011 penetrates into the interior of the substrate layer 101 and one surface of the first ion-strengthening layer 1011 is flush with the ion-implanted surface of the substrate layer 101, and the second ion-strengthening layer 1012 penetrates into the interior of the substrate layer 101 and one surface of the second ion-strengthening layer 1012 is flush with the mounting surface of the substrate layer 101. The ion implantation layer 1013 penetrates into the inside of the base material layer 101 and one surface of the ion implantation layer 1013 is flush with the ion implantation surface of the base material layer 101.
The mounting surface of the base material layer 101 means a surface of the base material layer 101 close to the electronic product in the process of mounting the housing on the electronic product.
In a specific example, the thickness of the base material layer 101 is 1 μm to 200 μm. The thickness of the ion implantation layer 1013 is 0.01 μm to 10 μm.
In this embodiment, an optical adhesive layer 102 is disposed on the mounting surface, a plating layer 103 is disposed on the ion implantation surface, and an anti-fingerprint layer 104 is disposed on the surface of the plating layer 103 away from the substrate layer 101.
In still another embodiment of the present invention, an electronic product is provided, where the electronic product includes a flexible housing prepared by the above-mentioned preparation method, and in particular, the housing of the electronic product is a flexible housing prepared by the above-mentioned preparation method, and an ion implantation treated surface is close to an outer surface of the electronic product. The electronic product in the embodiment has good surface hardness. In the daily use process, the surface of the electronic product is not easy to wear, scratch and crack, and good appearance performance can be maintained.
Still another embodiment of the present invention provides an electronic product, which includes the above flexible casing 10, specifically, the casing of the electronic product is the above flexible casing 10, and the ion implantation layer 1013 is near an outer surface of the electronic product. The electronic product in the embodiment has good surface hardness. In the daily use process, the surface of the electronic product is not easy to wear, scratch and crack, and good appearance performance can be maintained.
The following are specific examples.
Example 1
The housing substrate in this example is a 30 μm aluminosilicate glass substrate housing. The preparation method of the flexible shell in the embodiment is as follows:
s01, performing chemical strengthening treatment on the shell base material: and (3) carrying out chemical strengthening treatment on the shell substrate by adopting potassium nitrate melt at 360 ℃ for 10min. The reinforcement is obtained after the chemical strengthening treatment.
S02, thinning one surface of the reinforcement member to obtain a thinned member: by CF 4 The plasma performs a dry etching treatment on one surface of the reinforcing member, and the thickness of the thinning treatment member is 2 μm.
S03, performing ion implantation treatment on the surface of the thinning treatment: the conditions of the ion implantation treatment are as follows: the implanted ions are nitrogen ions, the ion implantation energy is 120keV, and the ion implantation dosage is 10 16 ions/cm 2 The ion implantation depth was 0.3 μm. The flexible casing in this embodiment is obtained after the ion implantation process.
Example 2
The housing substrate in this example is a 30 μm aluminosilicate glass substrate housing. The preparation method of the flexible shell in the embodiment is as follows:
s01, performing chemical strengthening treatment on the shell base material: and (3) carrying out chemical strengthening treatment on the shell substrate by adopting potassium nitrate melt at 360 ℃ for 10min. The reinforcement is obtained after the chemical strengthening treatment.
S02, thinning one surface of the reinforcement member to obtain a thinned member: by CF 4 The plasma performs a dry etching treatment on one surface of the reinforcing member, and the thickness of the thinning treatment member is 2 μm.
S03, performing ion on the thinned surfaceInjection treatment: the conditions of the ion implantation treatment are as follows: the implanted ions are nitrogen ions, the ion implantation energy is 120keV, and the ion implantation dosage is 10 16 ions/cm 2 The ion implantation depth was 0.3 μm.
S04, processing a coating: and processing a coating on the ion implanted surface of the thinning treatment piece, wherein the coating is an alternating coating of silicon nitride and silicon oxide, and the thickness of the coating is 0.3 mu m.
S05, processing an anti-fingerprint layer: and processing an anti-fingerprint layer on the surface of the plating layer. After processing the anti-fingerprint layer, the flexible casing in this example was obtained, and the thickness of the anti-fingerprint layer was 0.03 μm.
Example 3
The difference of this embodiment from embodiment 1 is that CF is employed 4 The plasma performs a dry etching treatment on one surface of the reinforcing member, and the thickness of the thinning-treated member was adjusted to 10 μm.
Example 4
The present embodiment differs from embodiment 3 in that the ion implantation treatment is not performed.
Example 5
Compared with embodiment 3, this embodiment is different in that: after the ion implantation treatment, the thinned treatment member was subjected to heat treatment at 600 c for 3s and 3 times.
Example 6
Compared with embodiment 5, this embodiment is different in that: the shell substrate is polyimide shell substrate with the thickness of 50 mu m, no chemical strengthening treatment is carried out, and the implanted ions are silicon.
Example 7
Compared with example 5, the difference of this example is that the alternating film layers of silicon nitride and silicon oxide are plated after ion implantation and heat treatment, and the thickness is 0.3 μm.
Test case
The flexible housings obtained in examples 1 to 7 were subjected to flexibility test and surface hardness test. Minimum bend fracture diameter test bend characteristics; the surface hardness test method is an Anton Paar nanometer hardness tester test; a maximum load of 0.5 mN; 1mN/min loading rate. The results are shown in the following table.
Flexible test results Surface hardness test results
Example 1 0.6mm 7GPa
Example 2 0.9mm 11GPa
Example 3 1.2mm 6GPa
Example 4 2.2mm 3GPa
Example 5 1.6mm 6GPa
Example 6 0.3mm 1GPa
Example 7 0.6mm 11GPa
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (11)

1. A preparation method of a flexible shell is characterized by comprising the following steps: the method comprises the following steps:
carrying out chemical strengthening treatment on the shell base material to obtain a strengthening piece;
thinning one surface of the reinforcement member to obtain a thinned member, wherein the thinned surface is formed into a thinned surface, and the thickness of the thinned member is 1-200 mu m;
and carrying out ion implantation treatment on the thinning treatment surface, wherein the ion implantation depth in the ion implantation treatment is 0.01-10 mu m.
2. A method of manufacturing a flexible cover according to claim 1, wherein: the thinning process is at least one of an etching process and a machining process.
3. A method of manufacturing a flexible cover as claimed in claim 2, wherein: the etching process is at least one of a dry etching process, a wet etching process, and a laser etching process.
4. A method of manufacturing a flexible casing according to any one of claims 1 to 3, wherein: the chemical strengthening treatment comprises the following steps:
and (3) carrying out chemical strengthening treatment on the shell substrate by adopting strengthening liquid at the temperature of 200-600 ℃, wherein the treatment time of the chemical strengthening treatment is 0.01-3 h.
5. The method of manufacturing a flexible cover according to claim 4, wherein: the strengthening liquid is potassium nitrate melt or potassium nitrate melt containing sodium ions and/or lithium ions.
6. The method for manufacturing a flexible casing according to any one of claims 1 to 3 and 5, characterized by comprising: the ions injected in the ion implantation treatment are at least one of nitrogen, carbon, aluminum, oxygen, silicon, titanium, chromium and copper.
7. The method for manufacturing a flexible casing according to any one of claims 1 to 3 and 5, characterized by comprising: the ion implantation conditions are as follows: the ion implantation energy is 1 keV-1000 keV, and the ion implantation dosage is 10 2 ions/cm 2 ~10 30 ions/cm 2 。
8. The method for manufacturing a flexible casing according to any one of claims 1 to 3 and 5, characterized by comprising: the preparation method further comprises the step of performing heat treatment on the thinning treatment piece; the temperature of the heat treatment is 200-1200 ℃, and the time of the heat treatment is 0.1-120 s.
9. A flexible casing prepared by the preparation method of any one of claims 1 to 8, characterized in that: comprises a substrate layer, a first ion strengthening layer, a second ion strengthening layer and an ion implantation layer; the substrate layer is provided with a mounting surface and an ion implantation surface which are oppositely arranged;
the first ion strengthening layer penetrates into the substrate layer, one surface of the first ion strengthening layer is flush with the ion implantation surface, and the second ion strengthening layer penetrates into the substrate layer, one surface of the second ion strengthening layer is flush with the mounting surface;
the ion implantation layer penetrates into the substrate layer and one surface of the ion implantation layer is flush with the ion implantation surface.
10. The flexible cover of claim 9, wherein the substrate layer has a thickness of 1 μm to 200 μm and the ion implantation layer has a thickness of 0.01 μm to 10 μm.
11. An electronic product, characterized in that: comprising the flexible cover of claim 10, the ion implantation layer being proximate an outer surface of the electronic product.
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JP2017031028A (en) * 2015-08-05 2017-02-09 日立化成株式会社 Glass production method
CN107922258A (en) * 2015-08-11 2018-04-17 旭硝子株式会社 Chemically reinforced glass
CN109689586A (en) * 2016-04-12 2019-04-26 旭硝子欧洲玻璃公司 Anti reflection glass substrate and its manufacturing method
CN109803939A (en) * 2016-04-12 2019-05-24 旭硝子欧洲玻璃公司 Antireflective, damage resistant glass substrate and its manufacturing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001192240A (en) * 2000-10-30 2001-07-17 Seiko Instruments Inc Display device and method for manufacturing the same
JP2017031028A (en) * 2015-08-05 2017-02-09 日立化成株式会社 Glass production method
CN107922258A (en) * 2015-08-11 2018-04-17 旭硝子株式会社 Chemically reinforced glass
CN109689586A (en) * 2016-04-12 2019-04-26 旭硝子欧洲玻璃公司 Anti reflection glass substrate and its manufacturing method
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