CN113793352B - Laser filling method and device for single-layer outline pattern based on contour lines - Google Patents
Laser filling method and device for single-layer outline pattern based on contour lines Download PDFInfo
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Abstract
The application relates to a laser filling method, a laser filling device, computer equipment and a storage medium of a single-layer contour pattern based on contour lines. The method comprises the following steps: performing outer contour inner offset operation on the pattern to be filled according to an equidistant offset algorithm to obtain a contour offset pattern; performing grid method environment modeling on the outline bias pattern to obtain a preprocessed grid pattern; constructing a shortest path problem set aiming at the grid pattern; and solving the shortest path problem set by using an A-algorithm to obtain an optimal filling path of the grid pattern. The method can improve the laser filling efficiency of the pattern.
Description
Technical Field
The present disclosure relates to the field of data processing, and in particular, to a laser filling method, apparatus, computer device, and storage medium for a single-layer profile pattern based on contour lines.
Background
In recent years, with the improvement of performance and reliability of a laser, and the rapid development of computer technology and the development of optical devices, the development of laser marking technology is very rapid, and with the development of computer and electronic technology, at present, the laser marking technology and the computer technology are combined to modify the content of a label in the computer, so that the laser marking technology and the computer technology are widely applied to the field of pattern filling.
However, when the current laser filling technology is combined with the computer technology to perform pattern filling, the efficiency is low, the accuracy is low, and the laser energy resource is wasted.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a laser filling method, apparatus, computer device, and storage medium for a single-layer contour pattern based on contour lines, which can improve laser filling efficiency of the pattern.
A laser filling method of a single layer profile pattern based on contour lines, the method comprising:
acquiring a coordinate point data set for contour filling, and acquiring a single-layer scatter diagram in a preset coordinate system according to the coordinate point data set;
according to the scatter diagram, connecting the scatter diagrams one by one to obtain a pattern to be filled;
performing outer contour inner offset operation on the pattern to be filled according to an equidistant offset algorithm to obtain a contour offset pattern;
performing grid method environment modeling on the outline bias pattern to obtain a preprocessed grid pattern;
setting a threshold value of the distance between each grid and the outline offset pattern for the grid pattern, and obtaining a grid set to be filled according to the threshold value and the grid pattern; the grid set to be filled comprises a plurality of grids to be filled;
Constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled;
solving the shortest path problem set by using an A-algorithm to obtain an optimal filling path of the grid set to be filled; and obtaining the optimal filling path of the grid pattern according to the optimal filling path of the grid set to be filled.
In one embodiment, according to an equidistant offset algorithm, performing an outer contour inner offset operation on a pattern to be filled to obtain a contour offset pattern, including: dividing an irregular outer contour in the pattern to be filled by adopting an equidistant offset algorithm to obtain a contour line segment; according to the contour line segment and a preset offset distance, offset the parallel lines of the contour line segment to obtain offset parallel lines; intersecting the contour line segment with the offset parallel line to obtain the contour offset pattern.
In one embodiment, the modeling of the grid method environment for the contour bias pattern to obtain a preprocessed grid pattern includes: acquiring bias coordinate point set consisting of all coordinate points in contour bias pattern as A { (x) 1 ，y 1 ).....(x i ,y i ) (x) wherein i ,y i ) Representing a set of offset coordinate pointsAn ith coordinate point in (a); before laser filling, assigning values to the concentrated coordinate points of the offset coordinate points to obtain a preprocessed grid pattern; wherein, the concentrated coordinate point of the offset coordinate point is assigned as follows:
ocup(x i ,y i ) =1 denotes the area that the laser can reach, ocup (x i ,y i ) =0 denotes an area where laser light cannot reach.
In one embodiment, according to the threshold value and the grid pattern, obtaining the grid set to be filled includes: and extracting all grids with the distance between the grids and the outline of the grid pattern not greater than the threshold value from the grid pattern to obtain a grid set to be filled.
In one embodiment, constructing a shortest path problem set according to the shortest path planning problem in the to-be-filled grid set includes: extracting a first grid to be filled from the grid set to be filled; dividing a first grid to be filled into a first left half grid set and a first right half grid set, taking the highest point of the innermost grid of the first grid to be filled as a first starting point, taking the lowest point of the innermost grid of the first grid to be filled as a first end point, traversing the first left half grid set to obtain a first left half shortest path between a first starting point and the first end point, and traversing the first right half grid set to obtain a first right half shortest path between the first starting point and the first end point; obtaining a shortest path planning problem of a first grid to be filled according to the first left shortest path and the first right shortest path;
Connecting the first left shortest path and the first right shortest path to obtain a first path profile; extracting all grids with the distance between the grid pattern and the first path contour not larger than a threshold value from the grid pattern to obtain a second grid to be filled; dividing the second grid to be filled into a second left half grid set and a second right half grid set, taking the highest point of the innermost grid of the second grid to be filled as a second starting point, taking the lowest point of the innermost grid of the second grid to be filled as a second ending point, traversing the second left half grid set to obtain a second left half shortest path between the second starting point and the second ending point, and traversing the second right half grid set to obtain a second right half shortest path between the second starting point and the second ending point; obtaining a shortest path planning problem of the second grid to be filled according to the second left shortest path and the second right shortest path;
until the distance between the highest point of the innermost layer and the lowest point of the innermost layer in the grid set to be filled is less than twice the threshold value; and constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled.
In one embodiment, solving the shortest path problem set by using an a-algorithm to obtain an optimal filling path of the mesh set to be filled includes: constructing an evaluation function of an A-algorithm according to the shortest path problem set; evaluating the positions of points in the grid to be filled through an evaluation function to obtain the optimal positions in the grid to be filled; obtaining an optimal filling path of the grid to be filled according to the optimal position; and obtaining the optimal filling path of the grid set to be filled according to the optimal filling path of the grid to be filled.
A laser filling apparatus for a single layer profile pattern based on contour lines, the apparatus comprising:
the method comprises the steps of obtaining a pattern module to be filled, obtaining a coordinate point data set for contour filling, and obtaining a single-layer scatter diagram in a preset coordinate system according to the coordinate point data set; according to the scatter diagram, connecting the scatter diagrams one by one to obtain a pattern to be filled;
the contour offset module is used for carrying out an outer contour inner offset operation on the pattern to be filled according to an equidistant offset algorithm to obtain a contour offset pattern;
the grid method environment modeling module is used for conducting grid method environment modeling on the outline bias pattern to obtain a preprocessed grid pattern;
a shortest path problem set module is constructed and used for setting a threshold value of the distance between each network and the outline offset pattern according to the grid patterns, and a grid set to be filled is obtained according to the threshold value and the grid patterns; the grid set to be filled comprises a plurality of grids to be filled; constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled;
the shortest path problem set solving module is used for solving the shortest path problem set by utilizing an A-algorithm to obtain an optimal filling path of the grid set to be filled; and obtaining the optimal filling path of the grid pattern according to the optimal filling path of the grid set to be filled.
A computer device comprising a memory storing a computer program and a processor which when executing the computer program performs the steps of:
acquiring a coordinate point data set for contour filling, and acquiring a single-layer scatter diagram in a preset coordinate system according to the coordinate point data set;
according to the scatter diagram, connecting the scatter diagrams one by one to obtain a pattern to be filled;
performing outer contour inner offset operation on the pattern to be filled according to an equidistant offset algorithm to obtain a contour offset pattern;
performing grid method environment modeling on the outline bias pattern to obtain a preprocessed grid pattern;
setting a threshold value of the distance between each grid and the outline offset pattern for the grid pattern, and obtaining a grid set to be filled according to the threshold value and the grid pattern; the grid set to be filled comprises a plurality of grids to be filled;
constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled;
solving the shortest path problem set by using an A-algorithm to obtain an optimal filling path of the grid set to be filled; and obtaining the optimal filling path of the grid pattern according to the optimal filling path of the grid set to be filled.
A computer readable storage medium having stored thereon a computer program which when executed by a processor performs the steps of:
Acquiring a coordinate point data set for contour filling, and acquiring a single-layer scatter diagram in a preset coordinate system according to the coordinate point data set;
according to the scatter diagram, connecting the scatter diagrams one by one to obtain a pattern to be filled;
performing outer contour inner offset operation on the pattern to be filled according to an equidistant offset algorithm to obtain a contour offset pattern;
performing grid method environment modeling on the outline bias pattern to obtain a preprocessed grid pattern;
setting a threshold value of the distance between each grid and the outline offset pattern for the grid pattern, and obtaining a grid set to be filled according to the threshold value and the grid pattern; the grid set to be filled comprises a plurality of grids to be filled;
constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled;
solving the shortest path problem set by using an A-algorithm to obtain an optimal filling path of the grid set to be filled; and obtaining the optimal filling path of the grid pattern according to the optimal filling path of the grid set to be filled.
The laser filling method, the laser filling device, the computer equipment and the storage medium of the single-layer contour pattern based on the contour line firstly acquire a coordinate point data set for contour filling, and acquire a single-layer scatter diagram in a preset coordinate system according to the coordinate point data set; according to the scatter diagram, the scatter diagram is connected one by one to obtain a pattern to be filled, the pattern to be filled is made to be a closed curve, and according to an equidistant offset algorithm, the pattern to be filled is subjected to an outer contour inner offset operation to obtain a contour offset pattern; the boundary distance of the pattern to be filled can meet the requirement of laser filling through the inner offset operation of the outer contour, the geometric characteristics of the outer contour of the pattern are guaranteed, the contour offset pattern is subjected to grid method environment modeling, and a preprocessed grid pattern is obtained; the reasonable environment can reduce the search amount of path planning and reduce the space and time cost; setting a threshold value of the distance between each grid and the outline offset pattern for the grid pattern, and obtaining a grid set to be filled according to the threshold value and the grid pattern; constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled; solving the shortest path problem set by using an A-algorithm to obtain an optimal filling path of the grid set to be filled; according to the optimal filling path of the grid set to be filled, the optimal filling path of the grid pattern is obtained, and when laser filling is carried out according to the optimal filling path of the grid pattern, the filling of the pattern can be completed rapidly and accurately, and the laser filling efficiency of the pattern is improved.
Drawings
FIG. 1 is a flow diagram of a laser filling method of a single layer profile pattern based on contour lines in one embodiment;
FIG. 2 is a schematic diagram of a process for profile biasing in one embodiment;
FIG. 3 is a schematic diagram of a path search process for a shortest path planning problem in one embodiment;
FIG. 4 is a schematic illustration of the result of parallel filling of a single layer profile pattern with "contour" profiles in one embodiment;
FIG. 5 is a block diagram of a laser filling apparatus based on a single layer profile pattern of contours in one embodiment;
fig. 6 is an internal structural diagram of a computer device in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
In one embodiment, as shown in fig. 1, there is provided a laser filling method of a single layer profile pattern based on contour lines, comprising the steps of:
102, acquiring a coordinate point data set for contour filling, and acquiring a single-layer scatter diagram in a preset coordinate system according to the coordinate point data set; and connecting the scattered points one by one according to the scattered points to obtain the pattern to be filled.
Marking a coordinate point data set in a preset coordinate system, integrating the coordinate point data into a single-layer scatter diagram, enabling pattern filling to be a closed curve polygon, and connecting the scatter diagrams one by one in the step to form a closed curve to obtain a pattern to be filled.
And 104, performing outer contour inner offset operation on the pattern to be filled according to an equidistant offset algorithm to obtain a contour offset pattern.
The equidistant offset algorithm is based on the limit idea to divide the irregular outline into contour segments, requires the parallel lines of each contour segment to be offset by a fixed distance, and then intersects with the offset parallel lines to obtain a new equidistant outline. The method can effectively ensure the geometric characteristics of the outer contour of the model. The contour offset is actually a parallel offset of the region contour lines in different directions. The outline boundary distance is required to be certain when pattern filling is carried out, and the obtained outline offset pattern can be subjected to laser filling after the outer outline inner offset operation is carried out on the pattern to be filled.
And 106, carrying out grid method environment modeling on the outline bias pattern to obtain a preprocessed grid pattern.
Environmental modeling is an efficient description of moving object activity space, and is an efficient representation of obstacles and contours. Only a reasonable representation of the environment can reduce the amount of searches in the plan. Specifically, the grid pattern model is a mathematical model to represent the working area of the laser. Map rasterization is the division of the area where the laser performs the hatch scan task into a series of grid square structures of the same size. The position of the grating coordinate system can be accurately positioned, and environmental modeling and algorithm planning are facilitated. The laser studied in the application has good directivity and can be concentrated into a small light spot. The small light spots formed by the laser are approximated to be a small grid, the proper grid size is further selected, and the grid method is utilized for environmental modeling, so that the space and time cost during laser filling is reduced.
the distance between each grid and the outline offset pattern refers to the distance between the grid of the grid pattern and the outline of the grid pattern, a part needing laser filling in the grid pattern can be separated to form a plurality of grids to be filled by setting a threshold value of the distance, path planning is carried out on each grid to be filled, the shortest path is found, the path planning of the complete grid pattern can be divided into the path planning of the plurality of grids to be filled, and the path planning of the plurality of grids to be filled forms the path planning of the complete grid pattern according to a certain sequence.
The algorithm a is a heuristic algorithm, and each node of the grid is comprehensively evaluated by setting an evaluation function. Each node is the position reached by the robot, intelligent evaluation is carried out on each position point, the optimal position is found, and finally the target position is found. And solving the shortest path problem set through an A-algorithm, so that an optimal filling path of the grid set to be filled can be found.
The laser filling method, the laser filling device, the computer equipment and the storage medium of the single-layer contour pattern based on the contour line firstly acquire a coordinate point data set for contour filling, and acquire a single-layer scatter diagram in a preset coordinate system according to the coordinate point data set; according to the scatter diagram, the scatter diagram is connected one by one to obtain a pattern to be filled, the pattern to be filled is made to be a closed curve, and according to an equidistant offset algorithm, the pattern to be filled is subjected to an outer contour inner offset operation to obtain a contour offset pattern; the boundary distance of the pattern to be filled can meet the requirement of laser filling through the inner offset operation of the outer contour, the geometric characteristics of the outer contour of the pattern are guaranteed, the contour offset pattern is subjected to grid method environment modeling, and a preprocessed grid pattern is obtained; the reasonable environment can reduce the search amount of path planning and reduce the space and time cost; setting a threshold value of the distance between each grid and the outline offset pattern for the grid pattern, and obtaining a grid set to be filled according to the threshold value and the grid pattern; constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled; solving the shortest path problem set by using an A-algorithm to obtain an optimal filling path of the grid set to be filled; according to the optimal filling path of the grid set to be filled, the optimal filling path of the grid pattern is obtained, and when laser filling is carried out according to the optimal filling path of the grid pattern, the filling of the pattern can be completed rapidly and accurately, and the laser filling efficiency of the pattern is improved.
In one embodiment, according to an equidistant offset algorithm, performing an outer contour inner offset operation on a pattern to be filled to obtain a contour offset pattern, including: dividing an irregular outer contour in the pattern to be filled by adopting an equidistant offset algorithm to obtain a contour line segment; according to the contour line segment and a preset offset distance, offset the parallel lines of the contour line segment to obtain offset parallel lines; intersecting the contour line segment with the offset parallel line to obtain the contour offset pattern.
The process of the inner offset of the outer contour is as follows: it is assumed that the contour line can be divided into innumerable intersecting line segments. Any two line segments can be taken to observe the bias process during the bias process. As shown in FIG. 2, will Q 1 Q 2 And Q 1 Q 2 The distance d is offset inward to obtain two lines parallel to the original line segment. Wherein Q is 1 Q 2 And Q 1 Q 2 Any two segments in the pattern to be filled.
Setting the coordinates of seven points of any two sections as Q 1 (x 1 ，y 1 )，Q 2 (x 2 ，y 2 )，Q 3 (x 3 ，y 3 )，Q 1 ′(x 1 ′，y 1 ′)，Q 2 ′(x 2 ′，y 2 ′)，Q 3 ′(x 3 ′，y 3 ′)，Q″ 1 (x″ 1 ，y″ 1 )。
According to the parallel condition, the following formula (1) can be obtained:
bringing the coordinates into formula (1) yields:
from equation (2), Q can be calculated 2 ′(x 2 ′，y 2 '), similarly, Q can be calculated 1 ′(x 1 ′，y 1 '), a biased line segment Q is obtained 1 ′Q′ 2 . In the same way, Q' is calculated 1 (x″ 1 ，y″ 1 ) And Q 3 ′(x 3 ′，y 3 '), correspondingly obtains a biased line segment Q 1 Q 3 ′。
And (3) calculating the end points of the two ends of the line segment according to the above formula, and calculating the intersection point of the offset straight line in the next step.
After setting the profile offset, a new straight line Q 1 ′Q′ 2 Equation is
Wherein, the liquid crystal display device comprises a liquid crystal display device,
k represents a straight line Q 1 ′Q′ 2 Coefficients of equation, L 1 Representing straight line Q 1 ′Q′ 2 ；
Substituting a certain point coordinate into a linear equation to obtain:
b represents a straight line Q 1 ′Q′ 2 A constant of the equation;
offset straight line Q 1 ′Q′ 2 The equation is as follows:
a straight line Q' can be obtained by the same method 1 Q 3 Equation of':
wherein L is 2 Representing straight line Q 1 Q 3 ′；
And solving the intersection point coordinates according to the two new profile offset equations. Similarly, for a smooth contour line, multiple divisions can be performed, intersecting points of intersecting offset lines are found by the method, and the obtained intersecting points are sequentially connected to obtain a contour offset curve, and a contour offset pattern is obtained according to the contour offset curve.
In one embodiment, the modeling of the grid method environment for the contour bias pattern to obtain a preprocessed grid pattern includes: acquiring bias coordinate point set consisting of all coordinate points in contour bias pattern as A { (x) 1 ，y 1 ).....(x i ,y i ) (x) wherein i ,y i ) Representing an ith coordinate point in the offset coordinate point set; before laser filling, assigning values to the concentrated coordinate points of the offset coordinate points to obtain a preprocessed grid pattern; wherein, the concentrated coordinate point of the offset coordinate point is assigned as follows:
ocup(x i ,y i ) =1 denotes the area that the laser can reach, ocup (x i ,y i ) =0 denotes an area where laser light cannot reach.
The grid method environment modeling is carried out on the outline offset pattern, so that the search amount of the subsequent shortest path planning can be reduced, the space and time cost is reduced, and the laser filling efficiency of the pattern is improved.
In one embodiment, according to the threshold value and the grid pattern, obtaining the grid set to be filled includes: and extracting all grids with the distance between the grids and the outline of the grid pattern not greater than the threshold value from the grid pattern to obtain a grid set to be filled.
In another embodiment, constructing a shortest path problem set according to the shortest path planning problem in the to-be-filled grid set includes: extracting a first grid to be filled from the grid set to be filled; dividing a first grid to be filled into a first left half grid set and a first right half grid set, taking the highest point of the innermost grid of the first grid to be filled as a first starting point, taking the lowest point of the innermost grid of the first grid to be filled as a first end point, traversing the first left half grid set to obtain a first left half shortest path between a first starting point and the first end point, and traversing the first right half grid set to obtain a first right half shortest path between the first starting point and the first end point; obtaining a shortest path planning problem of a first grid to be filled according to the first left shortest path and the first right shortest path;
Connecting the first left shortest path and the first right shortest path to obtain a first path profile; extracting all grids with the distance between the grid pattern and the first path contour not larger than a threshold value from the grid pattern to obtain a second grid to be filled; dividing the second grid to be filled into a second left half grid set and a second right half grid set, taking the highest point of the innermost grid of the second grid to be filled as a second starting point, taking the lowest point of the innermost grid of the second grid to be filled as a second ending point, traversing the second left half grid set to obtain a second left half shortest path between the second starting point and the second ending point, and traversing the second right half grid set to obtain a second right half shortest path between the second starting point and the second ending point; obtaining a shortest path planning problem of the second grid to be filled according to the second left shortest path and the second right shortest path;
until the distance between the highest point of the innermost layer and the lowest point of the innermost layer in the grid set to be filled is less than twice the threshold value; and constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled.
It should be understood that the first and second embodiments are used to distinguish between defined objects, and have no particular meaning, such as priority and number.
The process of constructing the shortest path problem set is shown in fig. 3, wherein the outline of the mesh to be filled is denoted as Ω, a threshold value of the distance between the mesh and the outline is preset, the threshold value is denoted as d, and the threshold value is the offset distance when the outline is offset.
Step 1: the distance between each grid and the contour Ω is d i When d i When d is less than or equal to d, selecting the grid meeting the condition as a set C, wherein the left half grid set is C 1 The right half grid set is C 2 As shown in fig. 3 (a).
Step 2: with the highest point P of the innermost grid of set C i Starting from the lowest point P of the innermost grid of the set C j Is the end point. Traversal C 1 Find P i And P j The shortest path between the two points is shown in fig. 3 (b).
Step 3: with the lowest point P of the innermost grid of set C j Starting from the highest point P of the innermost grid of the set C i Is the end point. Traversal C 2 Find P i And P j The shortest path between the two points is shown in fig. 3 (b).
Step 4: forming the minimum path obtained in the step 2 and the step 3 into a contour omega x Each grid and contour Ω x The distance between them is d j . When d j When D is less than or equal to D, selecting the grid meeting the condition as a set D, and selecting the left half grid set as D 1 The right half grid set is D 2 As shown in fig. 3 (c).
Step 5: with the highest point P of the innermost grid of the set D i+1 Starting from the lowest point P of the innermost grid of the set D j+1 Is the end point. Traversal D 1 Find P i+1 And P j+1 The shortest path between the two points is shown in fig. 3 (d).
Step 6: with the lowest point P of the innermost mesh of set D j+1 Starting from the highest point P of the innermost grid of the set D i+1 Is the end point. Traversing the processCalendar D 2 Find P i+1 And P j+1 The shortest path between the two points is shown in fig. 3 (d).
Step 7: repeating steps 2,3,4,5,6 until the highest point P of the innermost layer i+n And the lowest point P of the innermost layer j+n Distance lP of (2) i+n P j+n ≤2d。
And obtaining the shortest path planning problem of the grid to be filled according to the steps.
In one embodiment, solving the shortest path problem set by using an a-algorithm to obtain an optimal filling path of the mesh set to be filled includes: constructing an evaluation function of an A-algorithm according to the shortest path problem set; evaluating the positions of points in the grid to be filled through an evaluation function to obtain the optimal positions in the grid to be filled; obtaining an optimal filling path of the grid to be filled according to the optimal position; and obtaining the optimal filling path of the grid set to be filled according to the optimal filling path of the grid to be filled.
The evaluation function of the a-algorithm is as follows:
F (n) ＝G (n) +H (n)
wherein F is (n) An evaluation function of the intersection points in the overall process, representing the overall estimated cost from the highest point to the lowest point, G (n) Is the actual overhead from the starting point to the next point in the particular state space, H (n) Is the current estimate of the overhead required for the starting point to reach the target point. And obtaining the optimal positions of the points of the grid to be filled according to the evaluation results of all the points of the grid to be filled by the evaluation function, planning the shortest path of the grid to be filled from the optimal positions to obtain the optimal filling path of the grid to be filled, obtaining the optimal filling path of the grid set to be filled according to the optimal filling path of the grid to be filled, and carrying out laser filling according to the optimal path, wherein the result is shown in figure 4.
It should be understood that, although the steps in the flowchart of fig. 1 are shown in sequence as indicated by the arrows, the steps are not necessarily performed in sequence as indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in fig. 1 may include multiple sub-steps or stages that are not necessarily performed at the same time, but may be performed at different times, nor do the order in which the sub-steps or stages are performed necessarily performed in sequence, but may be performed alternately or alternately with at least a portion of other steps or sub-steps of other steps.
In one embodiment, as shown in fig. 5, there is provided a laser filling apparatus based on a single layer profile pattern of contour lines, comprising: the method comprises the steps of obtaining a pattern to be filled module 501, a contour bias module 502, a grid method environment modeling module 503, a shortest path problem set constructing module 504 and a shortest path problem set solving module 505, wherein:
the to-be-filled pattern obtaining module 501 is configured to obtain a coordinate point data set for contour filling, and obtain a single-layer scatter diagram in a preset coordinate system according to the coordinate point data set; according to the scatter diagram, connecting the scatter diagrams one by one to obtain a pattern to be filled;
the contour bias module 502 is configured to perform an outer contour inner bias operation on the pattern to be filled according to an equidistant bias algorithm, so as to obtain a contour bias pattern;
a grid method environment modeling module 503, configured to perform grid method environment modeling on the contour bias pattern, so as to obtain a preprocessed grid pattern;
a shortest path problem set constructing module 504, configured to set a threshold value of a distance between each network and the profile offset pattern for the grid pattern, and obtain a grid set to be filled according to the threshold value and the grid pattern; the grid set to be filled comprises a plurality of grids to be filled; constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled;
The shortest path problem set solving module 505 is configured to solve the shortest path problem set by using an a-algorithm, so as to obtain an optimal filling path of the grid set to be filled; and obtaining the optimal filling path of the grid pattern according to the optimal filling path of the grid set to be filled.
In one embodiment, the contour bias module 502 is further configured to segment an irregular outer contour in the pattern to be filled by using an equidistant bias algorithm to obtain a contour segment; according to the contour line segment and a preset offset distance, offset the parallel lines of the contour line segment to obtain offset parallel lines; intersecting the contour line segment with the offset parallel line to obtain the contour offset pattern.
In one embodiment, the grid method environment modeling module 503 is further configured to obtain a bias coordinate point set composed of all coordinate points in the contour bias pattern as a { (x) 1 ，y 1 ).....(x i ,y i ) (x) wherein i ,y i ) Representing an ith coordinate point in the offset coordinate point set; before laser filling, assigning values to the concentrated coordinate points of the offset coordinate points to obtain a preprocessed grid pattern; wherein, the concentrated coordinate point of the offset coordinate point is assigned as follows:
ocup(x i ,y i ) =1 denotes the area that the laser can reach, ocup (x i ,y i ) =0 denotes an area where laser light cannot reach.
In one embodiment, the shortest path problem set building module 504 is further configured to extract all grids from the grid pattern, where the distance between the grids and the outline of the grid pattern is not greater than the threshold value, to obtain a grid set to be filled.
In one embodiment, the construct shortest path problem set module 504 is further configured to extract a first grid to be filled from the set of grids to be filled; dividing a first grid to be filled into a first left half grid set and a first right half grid set, taking the highest point of the innermost grid of the first grid to be filled as a first starting point, taking the lowest point of the innermost grid of the first grid to be filled as a first end point, traversing the first left half grid set to obtain a first left half shortest path between a first starting point and the first end point, and traversing the first right half grid set to obtain a first right half shortest path between the first starting point and the first end point; obtaining a shortest path planning problem of a first grid to be filled according to the first left shortest path and the first right shortest path;
connecting the first left shortest path and the first right shortest path to obtain a first path profile; extracting all grids with the distance between the grid pattern and the first path contour not larger than a threshold value from the grid pattern to obtain a second grid to be filled; dividing the second grid to be filled into a second left half grid set and a second right half grid set, taking the highest point of the innermost grid of the second grid to be filled as a second starting point, taking the lowest point of the innermost grid of the second grid to be filled as a second ending point, traversing the second left half grid set to obtain a second left half shortest path between the second starting point and the second ending point, and traversing the second right half grid set to obtain a second right half shortest path between the second starting point and the second ending point; obtaining a shortest path planning problem of the second grid to be filled according to the second left shortest path and the second right shortest path;
Until the distance between the highest point of the innermost layer and the lowest point of the innermost layer in the grid set to be filled is less than twice the threshold value; and constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled.
In one embodiment, the shortest path problem set solving module 505 is further configured to construct an evaluation function of an a-algorithm according to the shortest path problem set; evaluating the positions of points in the grid to be filled through an evaluation function to obtain the optimal positions in the grid to be filled; obtaining an optimal filling path of the grid to be filled according to the optimal position; and obtaining the optimal filling path of the grid set to be filled according to the optimal filling path of the grid to be filled.
For specific definition of the laser filling device based on the contour line single layer contour pattern, reference may be made to the definition of the laser filling method based on the contour line single layer contour pattern hereinabove, and the detailed description thereof will be omitted. The individual modules in the above-described contour-based single-layer profile-patterning laser filling apparatus may be implemented in whole or in part by software, hardware, and combinations thereof. The above modules may be embedded in hardware or may be independent of a processor in the computer device, or may be stored in software in a memory in the computer device, so that the processor may call and execute operations corresponding to the above modules.
In one embodiment, a computer device is provided, which may be a terminal, and the internal structure of which may be as shown in fig. 6. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a laser filling method for a contour pattern based on a single layer of contour lines. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, can also be keys, a track ball or a touch pad arranged on the shell of the computer equipment, and can also be an external keyboard, a touch pad or a mouse and the like.
It will be appreciated by those skilled in the art that the structure shown in fig. 6 is merely a block diagram of some of the structures associated with the present application and is not limiting of the computer device to which the present application may be applied, and that a particular computer device may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.
In an embodiment a computer device is provided comprising a memory storing a computer program and a processor implementing the steps of the method of the above embodiments when the computer program is executed.
In one embodiment, a computer readable storage medium is provided, on which a computer program is stored which, when executed by a processor, implements the steps of the method of the above embodiments.
Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the various embodiments provided herein may include non-volatile and/or volatile memory. The nonvolatile memory can include Read Only Memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous Link DRAM (SLDRAM), memory bus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), among others.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (4)
1. A laser filling method of a single-layer contour pattern based on contour lines, the method comprising:
acquiring a coordinate point data set for contour filling, and acquiring a single-layer scatter diagram in a preset coordinate system according to the coordinate point data set;
according to the scatter diagram, connecting the scatter diagrams one by one to obtain a pattern to be filled;
performing an outer contour inner offset operation on the pattern to be filled according to an equidistant offset algorithm to obtain a contour offset pattern;
Performing grid method environment modeling on the outline bias pattern to obtain a preprocessed grid pattern;
setting a threshold value of the distance between each grid and the outline offset pattern for the grid pattern, and obtaining a grid set to be filled according to the threshold value and the grid pattern; the grid set to be filled comprises a plurality of grids to be filled;
constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled;
solving the shortest path problem set by using an A-algorithm to obtain an optimal filling path of the grid set to be filled; obtaining the optimal filling path of the grid pattern according to the optimal filling path of the grid set to be filled;
performing an outer contour inner offset operation on the pattern to be filled according to an equidistant offset algorithm to obtain a contour offset pattern, including:
dividing the irregular outer contour in the pattern to be filled by adopting an equidistant offset algorithm to obtain a contour line segment;
shifting parallel lines of the contour line segments according to the contour line segments and preset shifting distances to obtain shifted parallel lines;
intersecting the contour line segment with the offset parallel line to obtain a contour offset pattern;
Performing grid method environment modeling on the outline bias pattern to obtain a preprocessed grid pattern, wherein the grid method environment modeling comprises the following steps:
acquiring a bias coordinate point set consisting of all coordinate points in the profile bias pattern as follows
Wherein->
Representing an ith coordinate point in the offset coordinate point set;
before laser filling, assigning values to the concentrated coordinate points of the offset coordinate points to obtain a preprocessed grid pattern;
wherein, assign the concentrated coordinate point of offset coordinate point as:
obtaining a grid set to be filled according to the threshold and the grid pattern, wherein the method comprises the following steps:
extracting all grids with the distance between the grids and the outline of the grid pattern not greater than the threshold value from the grid pattern to obtain a grid set to be filled;
constructing a shortest path problem set according to the shortest path planning problem in the to-be-filled grid set, including:
step 1: extracting a first grid to be filled from the grid set to be filled; dividing the first grid to be filled into a first left grid set and a first right grid set;
step 2: taking the highest point of the innermost grid of the first grid to be filled as a first starting point, taking the lowest point of the innermost grid of the first grid to be filled as a first end point, traversing the first left half grid set to obtain a first left half shortest path between the first starting point and the first end point, traversing the first right half grid set to obtain a first right half shortest path between the first starting point and the first end point; obtaining a shortest path planning problem of a first grid to be filled according to the first left shortest path and the first right shortest path;
Step 3: connecting the first left half shortest path and the first right half shortest path to obtain a first path profile; extracting all grids with the distance between the grids and the first path contour not larger than the threshold value from the grid pattern to obtain a second grid to be filled; dividing the second grid to be filled into a second left half grid set and a second right half grid set, taking the highest point of the innermost grid of the second grid to be filled as a second starting point, taking the lowest point of the innermost grid of the second grid to be filled as a second ending point, traversing the second left half grid set to obtain a second left half shortest path between the second starting point and the second ending point, traversing the second right half grid set to obtain a second right half shortest path between the second starting point and the second ending point; obtaining a shortest path planning problem of a second grid to be filled according to the second left shortest path and the second right shortest path;
repeating the steps 2 and 3 until the distance between the highest point of the innermost layer and the lowest point of the innermost layer in the grid set to be filled is less than twice the threshold value;
Constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled;
solving the shortest path problem set by using an a-x algorithm to obtain an optimal filling path of the grid set to be filled, wherein the method comprises the following steps:
constructing an evaluation function of an A algorithm according to the shortest path problem set;
evaluating the positions of the points in the grid to be filled through the evaluation function to obtain the optimal positions in the grid to be filled;
obtaining an optimal filling path of the grid to be filled according to the optimal position;
and obtaining the optimal filling path of the grid set to be filled according to the optimal filling path of the grid to be filled.
2. A laser filling device for a single layer profile pattern based on contour lines, the device comprising:
the method comprises the steps of obtaining a pattern module to be filled, obtaining a coordinate point data set for contour filling, and obtaining a single-layer scatter diagram in a preset coordinate system according to the coordinate point data set; according to the scatter diagram, connecting the scatter diagrams one by one to obtain a pattern to be filled;
the contour offset module is used for carrying out an outer contour inner offset operation on the pattern to be filled according to an equidistant offset algorithm to obtain a contour offset pattern;
The grid method environment modeling module is used for conducting grid method environment modeling on the outline bias pattern to obtain a preprocessed grid pattern;
a shortest path problem set module is constructed and is used for setting a threshold value of the distance between each network and the outline bias pattern according to the grid pattern, and a grid set to be filled is obtained according to the threshold value and the grid pattern; the grid set to be filled comprises a plurality of grids to be filled; constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled;
the shortest path problem set solving module is used for solving the shortest path problem set by utilizing an A algorithm to obtain an optimal filling path of the grid set to be filled; obtaining the optimal filling path of the grid pattern according to the optimal filling path of the grid set to be filled;
the contour bias module is further used for performing an outer contour inner offset operation on the pattern to be filled according to an equidistant bias algorithm to obtain a contour bias pattern, and the contour bias module comprises: dividing the irregular outer contour in the pattern to be filled by adopting an equidistant offset algorithm to obtain a contour line segment; shifting parallel lines of the contour line segments according to the contour line segments and preset shifting distances to obtain shifted parallel lines; intersecting the contour line segment with the offset parallel line to obtain a contour offset pattern;
The grid method environment modeling module is further configured to perform grid method environment modeling on the contour bias pattern to obtain a preprocessed grid pattern, and the grid method environment modeling module includes: acquiring a bias coordinate point set consisting of all coordinate points in the profile bias pattern as follows
Wherein->
Representing an ith coordinate point in the offset coordinate point set; before laser filling, assigning values to the concentrated coordinate points of the offset coordinate points to obtain a preprocessed grid pattern; wherein, assign the concentrated coordinate point of offset coordinate point as:
the shortest path problem set constructing module is further used for extracting all grids with the distance between the grids and the outline of the grid pattern not larger than the threshold value from the grid pattern to obtain a grid set to be filled;
the shortest path problem set solving module is further configured to solve the shortest path problem set by using an a-algorithm, to obtain an optimal filling path of the to-be-filled mesh set, where the solving module includes:
constructing an evaluation function of an A algorithm according to the shortest path problem set;
evaluating the positions of the points in the grid to be filled through the evaluation function to obtain the optimal positions in the grid to be filled;
Obtaining an optimal filling path of the grid to be filled according to the optimal position;
obtaining an optimal filling path of the grid set to be filled according to the optimal filling path of the grid to be filled;
the shortest path problem set building module is further used for step 1: extracting a first grid to be filled from the grid set to be filled; dividing the first grid to be filled into a first left grid set and a first right grid set;
step 2: taking the highest point of the innermost grid of the first grid to be filled as a first starting point, taking the lowest point of the innermost grid of the first grid to be filled as a first end point, traversing the first left half grid set to obtain a first left half shortest path between the first starting point and the first end point, traversing the first right half grid set to obtain a first right half shortest path between the first starting point and the first end point; obtaining a shortest path planning problem of a first grid to be filled according to the first left shortest path and the first right shortest path;
step 3: connecting the first left half shortest path and the first right half shortest path to obtain a first path profile; extracting all grids with the distance between the grids and the first path contour not larger than the threshold value from the grid pattern to obtain a second grid to be filled; dividing the second grid to be filled into a second left half grid set and a second right half grid set, taking the highest point of the innermost grid of the second grid to be filled as a second starting point, taking the lowest point of the innermost grid of the second grid to be filled as a second ending point, traversing the second left half grid set to obtain a second left half shortest path between the second starting point and the second ending point, traversing the second right half grid set to obtain a second right half shortest path between the second starting point and the second ending point; obtaining a shortest path planning problem of a second grid to be filled according to the second left shortest path and the second right shortest path;
Repeating the steps 2 and 3 until the distance between the highest point of the innermost layer and the lowest point of the innermost layer in the grid set to be filled is less than twice the threshold value;
and constructing a shortest path problem set according to the shortest path planning problem in the grid set to be filled.
3. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor implements the steps of the method of claim 1 when executing the computer program.
4. A computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the steps of the method of claim 1.
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