CN113789149A - Single-component organic silicon molding repair daub and preparation method thereof - Google Patents
Single-component organic silicon molding repair daub and preparation method thereof Download PDFInfo
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- CN113789149A CN113789149A CN202111123579.7A CN202111123579A CN113789149A CN 113789149 A CN113789149 A CN 113789149A CN 202111123579 A CN202111123579 A CN 202111123579A CN 113789149 A CN113789149 A CN 113789149A
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- daub
- ketoxime
- linking agent
- filler
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- 230000008439 repair process Effects 0.000 title claims abstract description 22
- 238000000465 moulding Methods 0.000 title claims abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 12
- 239000010703 silicon Substances 0.000 title claims abstract description 12
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 30
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 28
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 25
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 25
- 239000003292 glue Substances 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 235000011837 pasties Nutrition 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 41
- 238000002156 mixing Methods 0.000 claims description 27
- 239000000945 filler Substances 0.000 claims description 24
- 239000003054 catalyst Substances 0.000 claims description 17
- 239000007822 coupling agent Substances 0.000 claims description 15
- 239000000049 pigment Substances 0.000 claims description 11
- 229920001296 polysiloxane Polymers 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical group CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000004568 cement Substances 0.000 claims description 2
- 230000018044 dehydration Effects 0.000 claims description 2
- 238000006297 dehydration reaction Methods 0.000 claims description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims description 2
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 239000013521 mastic Substances 0.000 claims 8
- OUGKFJZADGTJRG-UHFFFAOYSA-N [SiH4].CC(OC(CCC)=NO)C(COC(CCC)=O)OC(CCC)=O Chemical compound [SiH4].CC(OC(CCC)=NO)C(COC(CCC)=O)OC(CCC)=O OUGKFJZADGTJRG-UHFFFAOYSA-N 0.000 claims 1
- 239000013522 chelant Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 abstract description 5
- 239000004033 plastic Substances 0.000 abstract description 5
- 238000006243 chemical reaction Methods 0.000 description 18
- 238000010992 reflux Methods 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000004590 silicone sealant Substances 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 240000005428 Pistacia lentiscus Species 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000003544 oxime group Chemical group 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
Abstract
The invention relates to a repair daub, in particular to a single-component organic silicon molding repair daub and a preparation method thereof. The specific scheme of the invention is that the single-component organic silicon molding repair daub is pasty daub, the base glue is poly-ketoxime group end-capped polydimethylsiloxane, and the base glue is prepared by reacting 107 glue with a ketoxime type cross-linking agent; the viscosity was 80000-2000000 Cps. The organosilicon plastic repairing daub prepared by the invention is pasty before use, has high plasticity, is firm and durable after use, and has high toughness; the adhesive is convenient to use and can be firmly adhered to the surface of a repaired object; the product can work in the temperature range of-50 ℃ to 180 ℃ and has waterproof property.
Description
Technical Field
The invention relates to a repair daub, in particular to a single-component organic silicon molding repair daub and a preparation method thereof.
Background
The repair daub sold in the market at present is a two-component product of epoxy or unsaturated polyester, is a product with high hardness, good reinforcing effect, strong bonding force, good durability, excellent impermeability, impact resistance and compactness, has extremely high bonding force and extremely strong waterproof effect, and is mainly used for repairing thickening and leakage water seepage of wall structures, collapse grouting of various basic projects, various rush repair projects and crack treatment of old concrete structures. The application field of the organic silicon plastic shape repairing daub is different from that of the organic silicon plastic shape repairing daub.
The organic silicon has many excellent characteristics, and silicone sealant, silicone rubber products, silane coupling agents, silicone oil and the like are applied to the aspects of production and life of people. The silicone sealant has a bonding and sealing effect and can be used as a repairing material, but a special glue gun is needed during use, and residual glue during construction is easy to deteriorate and is overdue. In addition, in the daily life, the method cannot be applied to data line repair due to insufficient toughness, strength, and the like.
Publication No. CN103073723A discloses a high-viscosity organosilicon elastic daub for a buffer and a preparation method thereof, wherein the high-viscosity organosilicon elastic daub is prepared from a high-viscosity organosilicon elastic daub with the viscosity of 6.0 multiplied by 105mPas to 1.5X 107methyl phenyl organosilicon elastic daub of mPas. When the conventional alkaline catalyst is adopted for ring-opening polymerization, a proper amount of catalyst and chain stopper are firstly added to enable methyl cyclosiloxane and phenyl cyclosiloxane to be capable of ring-opening polymerization until the system is transparent, and then a proper amount of catalyst is added to continue reaction, so that transparent methyl phenyl organosilicon elastic daub can be obtained, and high-viscosity organosilicon elastic daub can also be obtained. The cement is not suitable for scenes such as repairing data lines, manufacturing hooks, repairing tables and chairs and the like.
Disclosure of Invention
In order to solve the problems, the invention provides the single-component organic silicon molding repair daub which is paste daub, can be molded randomly within a certain time and is used for repairing articles and bonding and sealing, the reaction crosslinking points of the polyketone oxime groups are more, the curing speed of the prepared molding glue is higher, and the molding glue has high strength and high toughness after being cured.
The specific scheme of the invention is a single-component organic silicon shaping repair daub, which is a paste daub and comprises the following components in parts by mass:
the base adhesive is poly ketoxime group end-blocked polydimethylsiloxane, and is prepared by reacting 107 adhesive with a ketoxime type cross-linking agent; the viscosity was 80000-2000000 Cps.
The viscosity of the base adhesive is 80000-2000000Cps, the base adhesive is prepared by reacting 107 adhesive with a ketoxime type cross-linking agent, the hydroxyl content of the prepared poly ketoxime group-terminated polysiloxane is far lower than that of the 107 adhesive, the reaction activity of the poly ketoxime group polydimethylsiloxane is high, and the prepared plastic adhesive is quick in curing reaction. The hydroxyl groups at the two ends of 107 are the functional groups needed for preparing the multi-ketoximino-terminated polysiloxane. Other methoxy-terminated, ethoxy-terminated, vinyl-terminated polydiorganosiloxanes are not capable of reacting with ketoxime-type crosslinkers to produce a multi-ketoxime-group-terminated polydimethylsiloxane. Thus presenting a macroscopic non-stick character. The poly-ketoxime group end-capped polydimethylsiloxane can be hydrolyzed and crosslinked into a paste with a network structure under the action of a catalyst and a crosslinking agent, and has better shaping property. The filler is added to improve the toughness and the strength of the product, the coupling agent is used for enabling the components to be dispersed more uniformly, and organic groups of the coupling agent can be mutually crosslinked with the multi-ketoxime group end-capped polydimethylsiloxane, the crosslinking agent and the like, so that the crosslinking degree of the product is improved, and the toughness and the strength are enhanced.
Preferably, the viscosity of the base gel is 100000-1500000 Cps.
Preferably, the ratio of the 107 glue to the ketoxime type crosslinking agent is 100: 7-16.
Preferably, the cross-linking agent is one or more of methyl tributyl ketoxime silane, vinyl tributonyl silicone and tetrabutoxime silane;
preferably, the filler is one or more of nano calcium carbonate, aluminum hydroxide, magnesium oxide, aluminum oxide, talcum powder and fumed silica.
Preferably, the coupling agent is one or more of 550, 560, 540, KH792, 1146 and 1145.
Preferably, the catalyst is dibutyltin dilaurate or chelated tin.
The invention also provides a preparation method of any one of the single-component organic silicon molding repairing daubs, which comprises the following steps:
(1) mixing 107 glue with ketoxime type cross-linking agent, and reacting at the temperature of 100-110 ℃ and under the pressure of-0.05-0.1 MPa to prepare poly ketoxime group end-blocked polydimethylsiloxane;
(2) uniformly mixing a filler and the poly ketoxime group-terminated polydimethylsiloxane obtained in the step (1), adding the mixture into a kneader, and dehydrating and dispersing to obtain a base material;
(3) adding a cross-linking agent and a coupling agent which are mixed in advance into the base material, uniformly dispersing, then adding a filler, and continuously dispersing at the temperature lower than 80 ℃ to obtain a prefabricated material;
(4) adding catalyst and pigment into the prefabricated material, mixing uniformly to obtain paste daub, discharging and packaging.
Preferably, in the step (2), the dehydration dispersion is maintained at 120-140 ℃ for 2-4h under vacuum, and then cooled to room temperature.
Preferably, in the step (4), the pasty daub is discharged and packaged in a size of 10-50 g.
The invention has the beneficial effects that:
1. the organosilicon plastic repairing daub prepared by the invention is pasty before use, has high plasticity, is firm and durable after use, and has high toughness;
2. the adhesive is convenient to use and can be firmly adhered to the surface of a repaired object;
3. the product can work in the temperature range of-50 to 180 ℃ and has waterproof property.
Detailed Description
In order to better understand the technical content of the invention, specific examples are provided below to further illustrate the invention.
Example 1
(1) And (3) mixing 100: adding the 107 glue of 7 and ketoxime type cross-linking agent into a reaction kettle, and carrying out condensation reflux stirring reaction for 2.5h at the temperature of 107 ℃ and under the vacuum of-0.08 MPa to obtain the poly ketoxime group end-blocked polydimethylsiloxane with the viscosity of 1400000 Cps;
(2) uniformly mixing 60 parts of filler and 60 parts of the poly ketoxime group-terminated polydimethylsiloxane obtained in the step (1), adding the mixture into a kneader, dehydrating at 130 ℃, and dispersing in vacuum for 3 hours to obtain a base material;
(3) adding 5 parts of cross-linking agent and 0.5 part of coupling agent into the base material, uniformly dispersing, then adding filler, and continuously dispersing at the temperature lower than 80 ℃ to obtain a prefabricated material;
(4) adding catalyst and pigment into the prefabricated material, mixing uniformly to obtain paste daub, discharging and packaging.
Example 2
(1) Adding 107 glue of 100:9 and ketoxime type cross-linking agent into a reaction kettle, and carrying out condensation reflux stirring reaction for 2.5h at the temperature of 107 ℃ and under the vacuum of-0.08 MPa to obtain the poly ketoxime group end-blocked polydimethylsiloxane with the viscosity of 1000000 Cps;
(2) uniformly mixing 60 parts of filler and 60 parts of the poly ketoxime group-terminated polydimethylsiloxane obtained in the step (1), adding the mixture into a kneader, dehydrating at 130 ℃, and dispersing in vacuum for 3 hours to obtain a base material;
(3) adding 5 parts of cross-linking agent and 0.5 part of coupling agent into the base material, uniformly dispersing, then adding filler, and continuously dispersing at the temperature lower than 80 ℃ to obtain a prefabricated material;
(4) adding catalyst and pigment into the prefabricated material, mixing uniformly to obtain paste daub, discharging and packaging.
Example 3
(1) And (3) mixing 100: adding the 107 glue of 11 and ketoxime type cross-linking agent into a reaction kettle, and carrying out condensation reflux stirring reaction for 2.5 hours at the temperature of 107 ℃ under the vacuum condition of-0.08 MPa to obtain the poly ketoxime group end-capped polydimethylsiloxane with the viscosity of 600000 Cps;
(2) uniformly mixing 60 parts of filler and 60 parts of the poly ketoxime group-terminated polydimethylsiloxane obtained in the step (1), adding the mixture into a kneader, dehydrating at 130 ℃, and dispersing in vacuum for 3 hours to obtain a base material;
(3) adding 5 parts of cross-linking agent and 0.5 part of coupling agent into the base material, uniformly dispersing, then adding filler, and continuously dispersing at the temperature lower than 80 ℃ to obtain a prefabricated material;
(4) adding catalyst and pigment into the prefabricated material, mixing uniformly to obtain paste daub, discharging and packaging.
Example 4
(1) Adding a 107 glue of 100:13 and a ketoxime type cross-linking agent into a reaction kettle, and carrying out condensation reflux stirring reaction for 2.5 hours at the temperature of 107 ℃ and under the vacuum condition of-0.08 MPa to obtain the poly ketoxime group end-blocked polydimethylsiloxane with the viscosity of 300000 Cps;
(2) uniformly mixing 60 parts of filler and 60 parts of the poly ketoxime group-terminated polydimethylsiloxane obtained in the step (1), adding the mixture into a kneader, dehydrating at 130 ℃, and dispersing in vacuum for 3 hours to obtain a base material;
(3) adding 5 parts of cross-linking agent and 0.5 part of coupling agent into the base material, uniformly dispersing, then adding filler, and continuously dispersing at the temperature lower than 80 ℃ to obtain a prefabricated material;
(4) adding catalyst and pigment into the prefabricated material, mixing uniformly to obtain paste daub, discharging and packaging.
Example 5
(1) And (3) mixing 100: adding the 16 adhesive 107 and the ketoxime type cross-linking agent into a reaction kettle, and carrying out condensation reflux stirring reaction for 2.5 hours at the temperature of 107 ℃ and under the vacuum condition of-0.08 MPa to obtain the poly ketoxime group end-blocked polydimethylsiloxane with the viscosity of 150000Cps
(2) Uniformly mixing 60 parts of filler and 60 parts of the poly ketoxime group-terminated polydimethylsiloxane obtained in the step (1), adding the mixture into a kneader, dehydrating at 130 ℃, and dispersing in vacuum for 3 hours to obtain a base material;
(3) adding 5 parts of cross-linking agent and 0.5 part of coupling agent into the base material, uniformly dispersing, then adding filler, and continuously dispersing at the temperature lower than 80 ℃ to obtain a prefabricated material;
(4) adding catalyst and pigment into the prefabricated material, mixing uniformly to obtain paste daub, discharging and packaging.
Comparative example 1
(1) Uniformly mixing 60 parts of filler and 60 parts of 1400000Cps 107 glue, adding into a kneader, dehydrating at 130 ℃, and dispersing in vacuum for 3 hours to obtain a base material;
(2) adding 5 parts of cross-linking agent and 0.5 part of coupling agent into the base material, uniformly dispersing, then adding filler, and continuously dispersing at the temperature lower than 80 ℃ to obtain a prefabricated material;
(3) adding catalyst and pigment into the prefabricated material, mixing uniformly to obtain paste daub, discharging and packaging.
Comparative example 2
(1) And (3) mixing 100: adding the 107 glue of 5 and ketoxime type cross-linking agent into a reaction kettle, condensing, refluxing and stirring for reaction for 2.5 hours at the temperature of 107 ℃ under the vacuum condition of-0.08 MPa to prepare the poly ketoxime group end-blocked polydimethylsiloxane with the viscosity of 2100000Cps
(2) Uniformly mixing 60 parts of filler and 60 parts of the poly ketoxime group-terminated polydimethylsiloxane obtained in the step (1), adding the mixture into a kneader, dehydrating at 130 ℃, and dispersing in vacuum for 3 hours to obtain a base material;
(3) adding 5 parts of cross-linking agent and 0.5 part of coupling agent into the base material, uniformly dispersing, then adding filler, and continuously dispersing at the temperature lower than 80 ℃ to obtain a prefabricated material;
(4) adding catalyst and pigment into the prefabricated material, mixing uniformly to obtain paste daub, discharging and packaging.
Comparative example 3
(1) And (3) mixing 100: adding the 20 adhesive 107 and ketoxime type cross-linking agent into a reaction kettle, and carrying out condensation reflux stirring reaction for 2.5 hours at the temperature of 107 ℃ and under the vacuum condition of-0.08 MPa to obtain the poly ketoxime group end-capped polydimethylsiloxane with the viscosity of 50000Cps
(2) Uniformly mixing 60 parts of filler and 60 parts of the poly ketoxime group-terminated polydimethylsiloxane obtained in the step (1), adding the mixture into a kneader, dehydrating at 130 ℃, and dispersing in vacuum for 3 hours to obtain a base material;
(3) adding 5 parts of cross-linking agent and 0.5 part of coupling agent into the base material, uniformly dispersing, then adding filler, and continuously dispersing at the temperature lower than 80 ℃ to obtain a prefabricated material;
(4) adding catalyst and pigment into the prefabricated material, mixing uniformly to obtain paste daub, discharging and packaging.
The performance of examples 1-5 and comparative examples 1-3 were tested and the results are shown in table 1.
TABLE 1
The organosilicon molding repair mortar prepared according to the embodiments 1 to 5 has high bonding strength, good storage stability, high curing speed and no stickiness during construction. The pipe repair mastics prepared according to comparative examples 1 to 2 have good overall performance, but are slightly sticky to hands, which is not beneficial to construction, and comparative example 3 is not sticky to hands, but has too low curing speed and too high hardness, which is easy to fall off.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The single-component organic silicon molding repair daub is characterized by being a paste daub and comprising the following components in parts by mass:
base rubber 30-60
2-5 crosslinking agents
40-60 parts of filler
Coupling agent 0.1-1
Catalyst 0.05-0.5
Pigment number
The base adhesive is poly ketoxime group terminated polydimethylsiloxane, is prepared by reacting 107 adhesive with ketoxime type cross-linking agent, and has viscosity of 80000-2000000 Cps.
2. The one-component silicone molding repair mastic of claim 1, wherein the base cement viscosity is 100000-1500000 Cps.
3. The one-component silicone molding repair mastic of claim 1, wherein the ratio of 107 glue to ketoxime-type cross-linking agent is 100: 7-16.
4. The one-component silicone molding repair mastic of claim 1, wherein the cross-linking agent is one or more of methyl tributyrinoxime silane, vinyl tributyrine silicone, and tetrabutoximino silane.
5. The single-component silicone molding repair mastic of claim 1, wherein the filler is one or more of nano calcium carbonate, aluminum hydroxide, magnesium oxide, aluminum oxide, talc powder and fumed silica.
6. The one-component silicone molding repair mastic of claim 1, wherein the coupling agent is one or more of 550, 560, 540, KH792, 1146, and 1145.
7. The one-part silicone molding repair mastic of claim 1, wherein the catalyst is dibutyltin dilaurate or tin chelate.
8. The method of preparing the one-component silicone molding repair mastic of any of claims 1-7, comprising the steps of:
(1) mixing 107 glue with a ketoxime type cross-linking agent, and reacting at the temperature of 100-110 ℃ and under the pressure of-0.05 to-0.1 MPa to prepare the poly ketoxime group end-blocked polydimethylsiloxane;
(2) uniformly mixing a filler and the poly ketoxime group-terminated polydimethylsiloxane obtained in the step (1), adding the mixture into a kneader, and dehydrating and dispersing to obtain a base material;
(3) adding a cross-linking agent and a coupling agent which are mixed in advance into the base material, uniformly dispersing, then adding a filler, and continuously dispersing at the temperature lower than 80 ℃ to obtain a prefabricated material;
(4) adding catalyst and pigment into the prefabricated material, mixing uniformly to obtain paste daub, discharging and packaging.
9. The method as claimed in claim 8, wherein in the step (2), the dehydration dispersion is maintained at 120-140 ℃ under vacuum for 2-4h, and then cooled to room temperature.
10. The method of claim 8, wherein in step (4), the pasty mastic is discharged and packaged in a size of 10-50 g.
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| CN114621724A (en) * | 2022-04-20 | 2022-06-14 | 浙江励德有机硅材料有限公司 | Bi-component organosilicon sealant and preparation method thereof |
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Address after: 324000 No. 20 Huayin North Road, Quzhou City, Zhejiang Province, China Applicant after: Zhejiang Zhongtian Dongfang fluorosilicone Material Co.,Ltd. Address before: 324000 No. 20 Huayin North Road, Quzhou City, Zhejiang Province, China Applicant before: ZHONGTIAN DONGFANG FLUORINE SILICON MATERIAL Co.,Ltd. |
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Application publication date: 20211214 |