CN113784065A - High-speed imaging system for water and underwater photography - Google Patents
High-speed imaging system for water and underwater photography Download PDFInfo
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- CN113784065A CN113784065A CN202110995054.6A CN202110995054A CN113784065A CN 113784065 A CN113784065 A CN 113784065A CN 202110995054 A CN202110995054 A CN 202110995054A CN 113784065 A CN113784065 A CN 113784065A
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- 238000003384 imaging method Methods 0.000 title claims abstract description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims abstract description 30
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 238000012545 processing Methods 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 230000003068 static effect Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Structure And Mechanism Of Cameras (AREA)
Abstract
The invention relates to a high-speed imaging system capable of being used for water and underwater photography, which comprises high-speed camera equipment, ground power supply equipment, image acquisition and storage equipment and camera control equipment, wherein the high-speed camera equipment comprises a shell, an optical objective assembly, an imaging assembly, a circuit assembly, a front end cover, a rear end cover and an optical pressure-resistant window; the rear end cover is provided with a sealing opening for the cable to pass through. Compared with the prior art, the invention has the advantages of good universality, good sealing performance, good performance and the like.
Description
Technical Field
The invention relates to the technical field of high-speed shooting, in particular to a high-speed imaging system for water and underwater photography.
Background
The high-speed camera is an important component for constructing a high-speed video measurement sensor network, belongs to one of industrial cameras, and has the unique advantages of high stability, high frame frequency, high transmission capability, high anti-interference capability and the like. Depending on the sensor chip, most high-speed imaging systems are currently cameras based on cmos (complementary Metal Oxide semiconductor) or ccd (charge Coupled device) chips. The two sensor chips are in thousands of autumn, the CCD technology is relatively mature, and noise is isolated by adopting a PN junction or a silicon dioxide isolation layer, so that the two sensor chips have certain advantages in imaging quality, but the CCD detector with a large area array and a high frame frequency is expensive indirectly; CMOS has the advantages of low power consumption, high integration, high frame rate, and low cost. At present, in the era of high-speed informatization, the development of hardware of high-speed imaging systems is important.
In the prior art, most of underwater high-speed cameras are sealed by epoxy glue, a potting adhesive layer is formed in a sealed cavity, the sealing mode can only meet the waterproof requirement of IP68, the pressure resistance and the waterproof capability are poor, and the underwater high-speed camera cannot be effectively prevented from being corroded.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a high-speed imaging system which has good universality, good sealing performance and good performance and can be used for underwater and underwater photography.
The purpose of the invention can be realized by the following technical scheme:
a high-speed imaging system for underwater and on-water photography comprises high-speed camera equipment, ground power supply equipment, image acquisition and storage equipment and camera control equipment; the high-speed camera equipment comprises a shell, an optical objective lens assembly, an imaging assembly, a circuit assembly, a front end cover, a rear end cover and an optical pressure-resistant window; the optical objective lens assembly, the imaging assembly and the circuit assembly are respectively fixed in the shell; the optical objective lens assembly, the imaging assembly and the circuit assembly are electrically connected in sequence; the front end cover and the rear end cover are respectively arranged at the front end and the rear end of the shell; the optical pressure-resistant window is arranged on the front end cover; the circuit assembly is respectively connected with the ground power supply equipment, the image acquisition and storage equipment and the camera control equipment through cables; the rear end cover is provided with a sealing opening for the cable to pass through.
Preferably, the housing, the front end cover and the rear end cover are all made of stainless steel materials.
More preferably, the outer surfaces of the shell, the front end cover and the rear end cover are respectively provided with an anti-corrosion coating.
Preferably, the front end cover and the rear end cover are respectively connected with the shell through screws.
More preferably, the screw is wet-mounted after uniformly coating silicon rubber.
Preferably, the housing is subjected to high-temperature drying treatment after the optical objective lens assembly, the imaging assembly and the circuit assembly are installed, and then the front end cover and the rear end cover are installed.
Preferably, the circuit assembly comprises:
the focal plane is provided with a visible light CMOS detector for converting optical signals into electric signals;
the signal processing board comprises an FPGA board and a peripheral circuit thereof, a DDR storage unit and a signal processing board power supply and distribution unit;
the interface board comprises a power supply interface, a data transmission interface, a control interface and an interface board power and power supply interface;
the DDR storage unit, the signal processing board power supply and distribution unit and the visible light CMOS detector are respectively connected with the FPGA board; the power supply interface, the data transmission interface and the control interface are connected with the ground power supply equipment, the image acquisition and storage equipment and the camera control equipment through cables; the interface board power supply and distribution interface is electrically connected with the signal processing board power supply and distribution interface and the visible light CMOS detector respectively.
Preferably, the imaging assembly is provided with a metal substrate; the imaging assembly is fixedly connected with the shell through the metal substrate.
Preferably, the joint of the optical pressure-resistant window and the front end cover and the joint of the rear end cover and the shell are both sealed by static pressure.
Preferably, the outer surface of the outer shell is provided with a mounting lug for mounting the fixing bracket.
Compared with the prior art, the invention has the following beneficial effects:
firstly, the universality is good: the high-speed imaging system can meet the requirements of integrated high-speed video measurement on water and underwater, and has good universality.
Secondly, the sealing performance is good: according to the invention, the high-speed camera is coated with silicon rubber on the fastening piece, and the sealing effect is ensured in a wet connection mode; meanwhile, before the end cover is installed, the whole machine is subjected to high-temperature drying treatment to remove internal moisture and ensure the drying of the internal environment of the product; in addition, the main sealing parts, namely the joint of the optical pressure-resistant window and the front end cover and the joint of the rear end cover and the shell, are sealed by static pressure, so that the sealing performance of the camera is effectively ensured.
Thirdly, the performance is good: the resolution of the high-speed imaging system can reach 2336 multiplied by 1728, the frame rate is more than or equal to 500fps, optical fibers are adopted for transmission, and the transmission bandwidth can reach 200 Gbps.
Drawings
FIG. 1 is a schematic structural diagram of a high-speed camera device according to the present invention;
fig. 2 is a schematic structural diagram of a circuit assembly of the high-speed camera device of the present invention.
The reference numbers in the figures indicate:
1. the device comprises a shell, 2, an optical objective lens assembly, 3, an imaging assembly, 4, a circuit assembly, 5, a front end cover, 6, a rear end cover, 7, an optical pressure-resistant window, 401, a focal plane, 402, a signal processing board, 403 and an interface board.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.
A high-speed imaging system for underwater and on-water photography comprises a high-speed camera device, a ground power supply device, an image acquisition and storage device and a camera control device. The high-speed camera device is structured as shown in fig. 1, and includes a housing 1, an optical objective lens assembly 2, an imaging assembly 3, a circuit assembly 4, a front cover 5, a rear cover 6, and an optical pressure-resistant window 7.
The optical objective lens assembly 2, the imaging assembly 3 and the circuit assembly 4 are respectively fixed in the shell 1, the imaging assembly 3 is provided with a metal substrate, and the imaging assembly 3 is fixedly connected with the shell 1 through the metal substrate. The optical objective lens assembly 2, the imaging assembly 3 and the circuit assembly 4 are electrically connected in sequence. A front end cap 5 and a rear end cap 6 are mounted at the front end and the rear end of the housing 1, respectively. An optical pressure-resistant window 7 is mounted on the front end cover 5. The circuit component 4 is respectively connected with the ground power supply equipment, the image acquisition and storage equipment and the camera control equipment through cables. The rear end cover 6 is provided with a sealing opening for the cable to pass through, and the sealing opening can adopt sealant, sealing strips or sealing pipes to realize the sealing of the cable connector.
In consideration of high pressure resistance, high corrosion resistance, strong sealing and other factors, the housing 1, the front end cover 5 and the rear end cover 6 all need high-strength, pressure-resistant and corrosion-resistant materials, so the housing 1, the front end cover 5 and the rear end cover 6 in this embodiment are all made of stainless steel materials, and the outer surface of the housing 1 is provided with a corrosion-resistant coating.
The front end cover 5 and the rear end cover 6 are respectively connected with the shell 1 through screws, the screws are wet-mounted after silicon rubber is uniformly coated on the screws, and effective sealing is carried out on the periphery of fastening holes so as to prevent the near-fastening part from being corroded too fast. The housing 1 is subjected to a high-temperature drying process after the installation of the optical objective lens assembly 2, the imaging assembly 3 and the circuit assembly 4 to remove internal moisture and ensure drying of the internal environment of the product, and then the front and rear end caps 5 and 6 are installed. Furthermore, the joint of the optical pressure-resistant window 7 and the front end cover 5 and the joint of the rear end cover 6 and the housing 1 are both sealed by static pressure.
The structure of the circuit component 4 in this embodiment is shown in fig. 2, and includes:
a focal plane 401 on which a visible light CMOS detector for converting an optical signal into an electrical signal is mounted, and which functions to convert an optical signal into an electrical signal;
the signal processing board 402 comprises an FPGA board and a peripheral circuit thereof, a DDR storage unit and a signal processing board power supply and distribution unit; the function of the system is to provide parameter configuration, clock and the like for the CMOS detector; in addition, the signal processing board needs to receive multiple paths of differential signals sent by the detector at the same time, convert the differential signals into single-ended signals and perform image framing, and further send the framed images to the interface board data transmission interface;
the interface board 403 includes a power interface, a data transmission interface, a control interface, and an interface board power supply and distribution interface, and is configured to complete operations such as power input, data export, synchronization signal control, and camera parameter adjustment.
The DDR storage unit, the signal processing board power supply and distribution unit and the visible light CMOS detector are respectively connected with the FPGA board. The power supply interface, the data transmission interface and the control interface are connected with the ground power supply equipment, the image acquisition and storage equipment and the camera control equipment through cables. The interface board power and power supply interface is electrically connected with the signal processing board power and power supply interface and the visible light CMOS detector respectively.
The high-speed camera interface comprises a mechanical mounting interface and an electrical interface for power supply, image transmission and control, wherein the mechanical mounting interface is connected with the fixed support when working underwater. The mechanical interface of the camera can be designed according to the installation requirements of the fixed bracket, namely, an installation lug is arranged on the shell 1 of the product, and the camera is tightly installed by using a screw. The electric interface of the camera is directly led out from the interior of the camera through a cable and is connected with ground power supply equipment, image acquisition and storage equipment and camera control equipment.
The main technical indexes of the high-speed imaging system in the embodiment are shown in table 1, and the index comparison table of the main domestic and foreign high-speed camera pendant is shown in fig. 2. The applicant has completed an engineering prototype of a split silicon-based area-array camera with 500fps and 400 ten thousand pixel resolution, and the interface adopts the most advanced CameraLink HS transmission mode in the world at present. The high-speed image acquisition, storage and processing system finishes the processing speed from 650MB/s to 2000MB/s and then to the current processing speed of 5000MB/s, a development team can provide a reasonable software and hardware integrated scheme aiming at systems with different performance requirements, the system can be applied to various fields such as industry, scientific research and the like, and compared with similar products at home and abroad, the high-speed imaging system in the embodiment has the highest comprehensive performance, is suitable for water and underwater working environments and has good universality.
TABLE 1 Main technical indexes of the high-speed imaging system in the present embodiment
TABLE 2 key index comparison table for domestic and foreign main high-speed cameras
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A high-speed imaging system for underwater and on-water photography is characterized by comprising high-speed camera equipment, ground power supply equipment, image acquisition and storage equipment and camera control equipment; the high-speed camera equipment comprises a shell (1), an optical objective lens assembly (2), an imaging assembly (3), a circuit assembly (4), a front end cover (5), a rear end cover (6) and an optical pressure-resistant window (7); the optical objective lens assembly (2), the imaging assembly (3) and the circuit assembly (4) are respectively fixed in the shell (1); the optical objective lens assembly (2), the imaging assembly (3) and the circuit assembly (4) are electrically connected in sequence; the front end cover (5) and the rear end cover (6) are respectively arranged at the front end and the rear end of the shell (1); the optical pressure-resistant window (7) is arranged on the front end cover (5); the circuit component (4) is respectively connected with a ground power supply device, an image acquisition and storage device and a camera control device through cables; the rear end cover (6) is provided with a sealing opening for the cable to pass through.
2. A high speed imaging system for use in above-water and underwater photography according to claim 1, wherein the housing (1), the front end cap (5) and the rear end cap (6) are made of stainless steel material.
3. A high speed imaging system for use in underwater and on-water photography according to claim 2, wherein the outer surfaces of the housing (1), the front end cap (5) and the rear end cap (6) are each provided with a corrosion-resistant coating.
4. A high speed imaging system for use in underwater and on-water photography according to claim 1, wherein the front end cap (5) and the rear end cap (6) are attached to the housing (1) by screws, respectively.
5. A high speed imaging system for use in underwater and on-water photography according to claim 4, wherein said screws are wet mounted after silicone rubber is evenly applied.
6. A high speed imaging system for use in underwater and on-water photography according to claim 1, wherein the housing (1) is subjected to a high temperature drying process after mounting the optical objective lens assembly (2), imaging assembly (3) and circuitry assembly (4) and then mounting the front end cap (5) and rear end cap (6).
7. A high speed imaging system usable for underwater and on-water photography according to claim 1, characterized in that said circuit assembly (4) comprises:
a focal plane (401) on which a visible light CMOS detector for converting an optical signal into an electrical signal is mounted;
the signal processing board (402) comprises an FPGA board and a peripheral circuit thereof, a DDR storage unit and a signal processing board power supply and distribution unit;
the interface board (403) comprises a power supply interface, a data transmission interface, a control interface and an interface board power and power supply interface;
the DDR storage unit, the signal processing board power supply and distribution unit and the visible light CMOS detector are respectively connected with the FPGA board; the power supply interface, the data transmission interface and the control interface are connected with the ground power supply equipment, the image acquisition and storage equipment and the camera control equipment through cables; the interface board power supply and distribution interface is electrically connected with the signal processing board power supply and distribution interface and the visible light CMOS detector respectively.
8. A high speed imaging system for use in underwater and on-water photography according to claim 1, wherein the imaging assembly (3) is provided with a metal substrate; the imaging component (3) is fixedly connected with the shell (1) through the metal substrate.
9. A high speed imaging system for underwater and above-water photography according to claim 1, wherein the junction of the optical pressure-resistant window (7) and the front end cap (5) and the junction of the rear end cap (6) and the housing (1) are both sealed by static pressure.
10. A high speed imaging system for use in above-water and underwater photography according to claim 1, wherein the outer surface of the housing (1) is provided with mounting lugs for mounting a fixing bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110995054.6A CN113784065A (en) | 2021-08-27 | 2021-08-27 | High-speed imaging system for water and underwater photography |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110995054.6A CN113784065A (en) | 2021-08-27 | 2021-08-27 | High-speed imaging system for water and underwater photography |
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| CN113784065A true CN113784065A (en) | 2021-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110995054.6A Pending CN113784065A (en) | 2021-08-27 | 2021-08-27 | High-speed imaging system for water and underwater photography |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116761069A (en) * | 2023-08-18 | 2023-09-15 | 三亚深海科学与工程研究所 | Separated deep sea camera |
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| CN201653384U (en) * | 2010-04-28 | 2010-11-24 | 陕西致深电子科技有限公司 | Underwater slope form imaging and detection device |
| CN201674574U (en) * | 2010-04-30 | 2010-12-15 | 陕西致深电子科技有限公司 | Bar type shallow water underwater detection camera device |
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Application publication date: 20211210 |