CN113781992A - Miniature noise reduction module - Google Patents
Miniature noise reduction module Download PDFInfo
- Publication number
- CN113781992A CN113781992A CN202111093673.2A CN202111093673A CN113781992A CN 113781992 A CN113781992 A CN 113781992A CN 202111093673 A CN202111093673 A CN 202111093673A CN 113781992 A CN113781992 A CN 113781992A
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- coil
- noise reduction
- semiconductor
- chip
- vibrating
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- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/175—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound
- G10K11/178—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
- G10K11/1785—Methods, e.g. algorithms; Devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/025—Magnetic circuit
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/04—Construction, mounting, or centering of coil
- H04R9/045—Mounting
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/04—Construction, mounting, or centering of coil
- H04R9/046—Construction
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
- H04R2231/001—Moulding aspects of diaphragm or surround
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/027—Diaphragms comprising metallic materials
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
The invention discloses a miniature noise reduction module, which comprises a base body, a control chip and a miniature loudspeaker, wherein the control chip and the miniature loudspeaker are arranged on the base body; the micro loudspeaker comprises a vibrating body, a movable magnet and a fixed magnet, wherein the movable magnet can generate an alternating magnetic field under the action of an alternating electric signal, the fixed magnet can generate a magnetic field, and the movable magnet is a semiconductor coil chip manufactured by a semiconductor process. The invention has the advantages of small volume and good noise reduction effect.
Description
Technical Field
The invention relates to the field of audio, in particular to a miniature noise reduction module.
Background
In the field of audio frequency, the adopted noise reduction modes are mainly divided into active noise reduction and passive noise reduction; the active noise reduction is very popular with consumers due to good noise reduction effect. The control chip of the noise reduction module based on active noise reduction remote control controls the noise reduction loudspeaker to generate sound waves with opposite phases and same amplitudes with noise so as to offset environmental noise. The coil formed by winding the magnet and the metal wire inside the noise reduction loudspeaker occupies a larger space so that the noise reduction loudspeaker is large in size, and therefore the existing noise reduction module has the defect of large size.
Disclosure of Invention
The invention aims to provide a miniature noise reduction module which has the advantage of small volume.
In order to achieve the above purpose, the solution of the invention is:
a miniature noise reduction module comprises a base body, a control chip and at least one miniature loudspeaker, wherein the control chip and the at least one miniature loudspeaker are arranged on the base body; the micro loudspeaker comprises a vibrating body, a movable magnet and a fixed magnet, wherein the movable magnet can generate an alternating magnetic field under the action of an alternating electric signal; the vibrating body comprises a base matched with the base body and a vibrating plate movably matched on the base, the vibrating plate is a vibrating diaphragm or a resonance plate, an installation space is formed between the base and the vibrating plate, at least one movable magnet electrically connected with the control chip is matched on the vibrating plate of the vibrating body, and the movable magnet is a semiconductor coil chip manufactured by a semiconductor process; the fixed magnet is fitted in the installation space.
The fixed magnet is a magnet.
The fixed magnet is a semiconductor coil chip manufactured by adopting a semiconductor process, and the fixed magnet is electrically connected with the control chip.
The semiconductor coil chip is matched with a magnetizer with magnetic permeability.
The semiconductor coil chip comprises at least one coil layer, and at least one spiral coil body is etched on the coil layer; when the number of the coils on the coil layer is more than two, the coil bodies of the coil layer are connected in series and/or in parallel; when the semiconductor coil chip includes at least two coil layers, the coil bodies of the coil layers are connected in series and/or in parallel.
The semiconductor coil chip comprises at least one coil layer, at least one coil body is arranged on the coil layer, the coil body comprises a plurality of metal wire sections etched on the coil layer and distributed in a spiral shape, two ends of each metal wire section of the coil body are divided into a starting end and an ending end along the spiral direction of the coil body, the starting ends of the metal wire sections of the coil body are connected in parallel, and the ending ends of the metal wire sections of the coil body are connected in parallel.
The semiconductor coil chip also comprises an electrode layer, wherein the electrode layer is provided with a first electrode region and a second electrode region, the first electrode region is electrically connected with the initial end of each metal wire section of the coil body of the coil layer, and the second electrode region is electrically connected with the tail end of each metal wire section of the coil body of the coil layer.
The vibrating plate has magnetic permeability and/or the vibrating plate is matched with a magnetic conductive plate with magnetic permeability.
The miniature noise reduction module further comprises a microphone arranged on the base body, and the microphone is electrically connected with the control chip.
The miniature noise reduction module further comprises a wireless communication module arranged on the base body, and the wireless communication module is electrically connected with the control chip.
After the scheme is adopted, the movable magnet is a semiconductor coil chip manufactured by adopting a semiconductor process, so that the volume of the micro loudspeaker is small, and the micro noise reduction module has the advantage of small volume; and because the volume of the micro-speaker is small, the number of the micro-speakers can be set according to the requirement, thereby improving the noise reduction effect.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural diagram of a micro-speaker according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a micro-speaker according to a second embodiment of the present invention;
fig. 4 is a schematic structural diagram of a micro-speaker according to a third embodiment of the present invention;
fig. 5 is a schematic structural diagram of a fourth embodiment of a micro-speaker according to the present invention;
FIG. 6 is a schematic structural diagram of a first embodiment of a semiconductor coil chip according to the present invention;
FIG. 7 is a schematic structural diagram of a second embodiment of a semiconductor coil chip according to the present invention;
FIG. 8 is a schematic view showing the connection of an electrode layer and a coil layer of a second embodiment of a semiconductor coil chip according to the present invention;
description of reference numerals:
the base body 1 is provided with a plurality of grooves,
the control chip 2 is connected to the control chip,
the microphone (3) is arranged in the casing,
the micro-speaker 4, the installation space 40,
a vibration body 41, a base 411, a fixing piece 4111, a fixing frame 4111', a vibrating piece 412, a movable magnet 42, a fixed magnet 43,
the wireless communication module (5) is provided with a wireless communication module,
the coil comprises a semiconductor coil chip A, a coil layer A1, a coil body A11, a metal wire segment A111, a starting end A1111, a tail end A1112, a magnetizer A2, an electrode layer A3, a first electrode area A31, a first metal wire A311, a second electrode area A32 and a second metal wire A321.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following specific examples.
As shown in fig. 1 to 8, the present invention discloses a miniature noise reduction module, which comprises a substrate 1, and a control chip 2, a microphone 3, a miniature speaker 4 and a wireless communication module 5 which are arranged on the substrate 1; the microphone 3 and the micro loudspeaker 4 are electrically connected with the control chip 2; when the noise reduction device is used, the microphone 3 receives environmental noise and sends the environmental noise to the control chip 2, and the control chip 2 controls the micro loudspeaker 4 to generate sound waves with opposite phases and same amplitudes with the environmental noise so as to offset the environmental noise, so that the noise reduction effect is realized; people can connect the wireless communication module 5 through an intelligent terminal (such as a mobile phone or a tablet personal computer), so that people can control the control chip 2 through the intelligent terminal, further control the sound wave frequency generated by the micro-speaker 4, and realize manual regulation and control; the wireless communication module 5 may adopt a bluetooth communication module or a WiFi communication module. It should be noted that the microphone 3 may not be provided, so that the present invention may be applied to a scenario where a specific noise needs to be eliminated, for example, eliminating vibration noise of a motor, and the micro-speaker 4 may directly generate a sound wave with the same amplitude and opposite phase to the specific noise, so as to directly cancel the specific noise.
Specifically, as shown in fig. 2 to 5, the micro-speaker 4 includes a vibrating body 41, a movable magnet 42 capable of generating an alternating magnetic field under the action of an alternating electrical signal, and a fixed magnet 43 capable of generating a magnetic field; the vibrating body 41 comprises a base 411 fixed on the base 1 and a vibrating piece 412 movably matched on the base 411, a mounting space 40 is formed between the base 411 and the vibrating piece 412, at least one movable magnet 42 electrically connected with the control chip 2 is matched on the vibrating piece 412 of the vibrating body 41, and the movable magnet 42 can be positioned at the inner side of the vibrating piece 412; the fixed magnet 43 is fitted in the installation space 40. The working principle of the micro-speaker 4 is as follows: when the control chip 2 inputs an alternating electric signal to the movable magnet 42, the movable magnet 42 generates an alternating magnetic field to change the stress of the movable magnet 42 in the magnetic field generated by the fixed magnet 43, so that the movable magnet 42 drives the vibrating reed 412 to vibrate, and the vibrating reed 412 vibrates to emit sound waves to counteract environmental noise; the vibrating plate 412 may be a vibrating diaphragm or a resonating plate, and the vibrating diaphragm can vibrate air to generate sound waves when vibrating, and the resonating plate can make a resonating medium in contact with the vibrating diaphragm resonate to generate sound waves when vibrating. Wherein the resonance sheet may have an elastic structure so that the resonance sheet may vibrate; the resonator plate may also be a rigid structure, and the resonator plate may be movably fitted on the base 411, so that the resonator plate may also vibrate; the resonance sheet can be made of metal, plastic or a giant magnetostrictive material, wherein the resonance sheet is preferably made of the giant magnetostrictive material, the magnetostrictive coefficient of the giant magnetostrictive material is far greater than that of the traditional magnetostrictive material, and the giant magnetostrictive material has the advantages of high conversion rate between mechanical energy and electric energy at room temperature, high energy density, high response speed and good reliability, so that the vibration effect of the resonance sheet can be effectively improved, and the resonance sheet is high in vibration efficiency and high in response speedThe giant magnetostrictive material adopted by the sheet has the following requirements: coefficient of saturation magnetostriction greater than 10-5The saturation magnetization field intensity is more than 40 kA/m, and the energy conversion efficiency is more than 45%. It should be noted that, when the vibrating reed 412 of the micro-speaker 4 of the present invention is a resonator plate, the vibrating reed 412 can be attached to a sound source generating an environmental noise when the present invention is used, so that the control chip 2 can control the vibrating reed 412 to reversely vibrate the sound source according to the environmental noise, and further eliminate the vibration of the sound source, so as to reduce the noise.
As shown in fig. 2, in the first embodiment of the micro-speaker of the present invention, the base 411 of the vibrating body 41 is opened at the upper side, the number of the vibrating pieces 412 of the vibrating body 41 is one, the vibrating pieces 412 are fitted at the upper side of the base 411, the vibrating pieces 412 are fitted with a movable magnet 42, and the fixed magnet 43 is fixed at the base 411; in the first embodiment of the micro-speaker according to the present invention, the vibrating reed 412 is not limited to one movable magnet 42, and one or more movable magnets 42 may be attached to the vibrating reed 412, and the larger the number of movable magnets 42 attached to the vibrating reed 412 is, the larger the amplitude of the vibrating reed 412 when it vibrates becomes, and the better the noise reduction effect of the present invention becomes.
In the second and third embodiments of the micro-speaker according to the present invention, as shown in fig. 3 and 4, the number of the vibration plates 412 of the vibration body 41 is at least two, and the movable magnets 42 fitted to the respective vibration plates 412 are connected in series or in parallel, so that the respective vibration plates 412 of the present invention can emit sound waves in different directions, thereby enhancing the noise reduction effect of the present invention. As shown in fig. 3, in the second embodiment of the micro-speaker of the present invention, the base 411 of the vibrating body 41 is opened at the upper and lower sides, the fixing plate 4111 is provided in the base 411, the number of the vibrating pieces 412 of the vibrating body 41 is two, the two vibrating pieces 412 are respectively fitted in the openings at the upper and lower sides of the base 411, the two vibrating pieces 412 are respectively fitted with one movable magnet 42, and the fixed magnet 43 is fixed on the fixing plate 4111 of the base 411. As shown in fig. 4, in the third embodiment of the micro-speaker of the present invention, the base 411 of the vibrating body 41 is open at the upper, lower, left, and right sides, the fixing frame 4111 'is provided in the base 411, the number of the vibrating pieces 412 of the vibrating body 41 is four, the four vibrating pieces 412 are respectively fitted in the openings at the upper, lower, left, and right sides of the base 1, the four vibrating pieces 412 are respectively fitted with one movable magnet 42, and the fixed magnet 43 is fixed on the fixing frame 4111' of the base 411.
As shown in fig. 5, in the fourth embodiment of the micro-speaker according to the present invention, the number of the fixed magnets 43 is the same as that of the vibrating pieces 412, and the fixed magnets 43 are disposed to be opposite to the vibrating pieces 412 one by one, so that the fixed magnets 43 apply magnetic fields to the movable magnets 42 engaged with the vibrating pieces 412, respectively, and the movable magnets 42 engaged with the vibrating pieces 412 receive a large magnetic field from the fixed magnets 43, thereby enabling a large amplitude of vibration of the vibrating pieces 412.
As shown in fig. 2 to 8, the movable magnet 42 of the transducer 42 is a semiconductor coil chip a manufactured by a semiconductor process, when an alternating electrical signal is applied to a coil inside the semiconductor coil chip a, the semiconductor coil chip a can generate an alternating magnetic field, and since the semiconductor coil chip a is etched by a semiconductor technology, the coil body pitch in the semiconductor coil chip a can be made very small, so that the finished product of the semiconductor coil chip a has the advantages of small volume and light weight compared with a coil formed by winding a metal wire, so that the movable magnet 42 of the micro-speaker 4 is made of the semiconductor coil chip a, the movable magnet 42 can be made small in volume, and further the micro-speaker 4 of the present invention is made small in volume, so that the whole volume of the present invention is made small. And because the volume of the micro loudspeaker 4 is small, the number of the micro loudspeakers 4 can be set according to the requirement, and the larger the number of the micro loudspeakers 4 is, the wider the noise frequency range which can be counteracted by the invention is, and the better the noise reduction effect is. As shown in fig. 2 to 8, the fixed magnet 43 may also be a semiconductor coil chip a manufactured by a semiconductor process, so that the volume of the micro-speaker of the present invention is smaller, the fixed magnet 43 is electrically connected to the control chip 2, and the control chip 2 transmits an electrical signal to the fixed magnet 43 to enable the fixed magnet 43 to generate a magnetic field. Of course, the fixed magnet 43 may be a magnet directly, and the magnet itself can directly emit a magnetic field, and the cost is low.
In the first embodiment of the semiconductor coil chip a, as shown in fig. 6, the semiconductor coil chip a includes at least one coil layer a1, and at least one coil body a11 with a spiral shape is etched on the coil layer a 1; wherein in order to increase the strength of the magnetic field generated by the semiconductor coil chip A; when the number of the coil bodies A11 on the coil layer A1 is more than two, the coil bodies A11 of the coil layer A1 are connected in series and/or in parallel, so that the coil bodies A11 of the coil layer A1 can be connected with electric signals at the same time, and magnetic fields generated by the coil bodies A11 of the coil layer A1 can be superposed together; in the case that the semiconductor coil chip a includes at least two coil layers a1, the coil bodies a11 of the coil layers a1 may be connected in series and/or in parallel, so that the coil layers a1 may be simultaneously connected to electrical signals to allow the magnetic fields generated by the coil layers a1 to be superimposed, thereby increasing the strength of the magnetic field generated by the semiconductor coil chip a. As shown in fig. 6, in the first embodiment of the semiconductor coil chip a, the semiconductor coil chip a may be matched with a magnetizer a2 having magnetic permeability, and the magnetizer a2 having magnetic permeability may reduce the magnetic resistance of the semiconductor coil chip a and strengthen the magnetic lines of the magnetic field generated by the semiconductor coil chip a, thereby increasing the strength of the magnetic field generated by the semiconductor coil chip a; the semiconductor coil chip A can be provided with a matching hole, the magnetizer A2 is arranged in the matching hole, and the magnetizer A2 can be made of one of mu alloy, permalloy, electric furnace steel, nickel-zinc ferrite, manganese-zinc ferrite, pure iron (0.05 impurity), magnetic conductive alloy (5Mo79Ni), soft steel (0.2C), iron (0.2 impurity), silicon steel (4Si), 78 permalloy (78Ni), nickel, platinum, aluminum and other substances with magnetic conductivity; the material of the magnetizer a2 may also be other magnetic materials doped with magnetic conductive elements, such as iron, nickel, copper, molybdenum, manganese, zinc, platinum, aluminum, etc. with magnetic conductivity.
Specifically, in the second embodiment of the semiconductor coil chip a, as shown in fig. 7, the semiconductor coil chip a includes at least one coil layer A1, at least one coil body a11 is disposed on the coil layer A1, the coil body a11 includes a plurality of metal line segments a111 etched on the coil layer A1 and arranged in a spiral shape, two ends of the metal line segment a111 of the coil body a11 are divided into a starting end a1111 and a trailing end a1112 in a spiral direction of the coil body a11, the metal line segments a111 of the coil body a11 are connected in parallel, wherein the starting ends a1111 of the metal line segments a111 of the coil body a11 are connected in parallel and the trailing ends a1112 of the metal line segments a111 of the coil body a11 are connected in parallel. Because the metal wire segments A111 of the coil body A11 are arranged in a spiral shape, and the metal wire segments A111 of the coil body A11 are connected in parallel, the current density of the coil layer A1 can be increased, and the overall resistance of the coil body A11 can be reduced in a parallel connection mode, so that the semiconductor coil chip A can have a stronger magnetic field function when the semiconductor coil chip A is small in size. In the second embodiment of the semiconductor coil chip a, as shown in fig. 8, the semiconductor coil chip a may further include an electrode layer A3, the electrode layer A3 is provided with a first electrode region a31 and a second electrode region a32, the first electrode region a31 is electrically connected to the start end a1111 of each metal segment a111 of the coil body a11 of the coil layer A1, and the second electrode region a32 is electrically connected to the end a1112 of each metal segment a111 of the coil body a11 of the coil layer A1, so that the metal segments a111 of the coil body a11 are connected in parallel through the electrode layer A3; the first electrode regions a31 of the electrode layer A3 are connected to the beginning a1111 of the wire segments a111 of the coil body a11 of the coil layer A1 via a plurality of first wires a311, respectively, and the second electrode regions a32 of the electrode layer A3 are connected to the ending a1112 of the wire segments a111 of the coil body a11 of the coil layer A1 via a plurality of second wires a321, respectively.
In the present invention, the vibrating reed 412 may be made of a magnetic conductive material having magnetic conductivity, and the vibrating reed 412 has magnetic conductivity and can reduce the magnetic resistance of the semiconductor coil chip a and strengthen the magnetic lines of the magnetic field generated by the semiconductor coil chip a, thereby improving the strength of the magnetic field generated by the semiconductor coil chip a; the base 411 may also be made of a magnetic conductive material having magnetic conductivity, so that the base 411 has magnetic conductivity to reduce the magnetic resistance of the semiconductor coil chip a and strengthen the magnetic lines of force of the magnetic field generated by the semiconductor coil chip a, thereby improving the strength of the magnetic field generated by the semiconductor coil chip a. In addition, in the present invention, the vibrating reed 412 may be matched with a magnetic conductive sheet having magnetic conductivity, and the vibrating reed 412 may be connected to the movable magnet 42 through the magnetic conductive sheet having magnetic conductivity so as to reduce the magnetic resistance of the semiconductor coil chip a and strengthen the magnetic lines of the magnetic field generated by the semiconductor coil chip a, thereby improving the strength of the magnetic field generated by the semiconductor coil chip a.
The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications thereof by those skilled in the art should be considered as not departing from the scope of the present invention.
Claims (10)
1. A miniature noise reduction module, its characterized in that: the micro-speaker comprises a substrate, a control chip arranged on the substrate and at least one micro-speaker;
the micro loudspeaker comprises a vibrating body, a movable magnet and a fixed magnet, wherein the movable magnet can generate an alternating magnetic field under the action of an alternating electric signal; the vibrating body comprises a base matched with the base body and a vibrating plate movably matched on the base, the vibrating plate is a vibrating diaphragm or a resonance plate, an installation space is formed between the base and the vibrating plate, at least one movable magnet electrically connected with the control chip is matched on the vibrating plate of the vibrating body, and the movable magnet is a semiconductor coil chip manufactured by a semiconductor process; the fixed magnet is fitted in the installation space.
2. A miniature noise reduction module according to claim 1, wherein: the fixed magnet is a magnet.
3. A miniature noise reduction module according to claim 1, wherein: the fixed magnet is a semiconductor coil chip manufactured by adopting a semiconductor process, and the fixed magnet is electrically connected with the control chip.
4. A miniature noise reduction module according to claim 1 or 3, wherein: the semiconductor coil chip is matched with a magnetizer with magnetic permeability.
5. A miniature noise reduction module according to claim 1 or 3, wherein: the semiconductor coil chip comprises at least one coil layer, and at least one spiral coil body is etched on the coil layer; when the number of the coils on the coil layer is more than two, the coil bodies of the coil layer are connected in series and/or in parallel; when the semiconductor coil chip includes at least two coil layers, the coil bodies of the coil layers are connected in series and/or in parallel.
6. A miniature noise reduction module according to claim 1 or 3, wherein: the semiconductor coil chip comprises at least one coil layer, at least one coil body is arranged on the coil layer, the coil body comprises a plurality of metal wire sections etched on the coil layer and distributed in a spiral shape, two ends of each metal wire section of the coil body are divided into a starting end and an ending end along the spiral direction of the coil body, the starting ends of the metal wire sections of the coil body are connected in parallel, and the ending ends of the metal wire sections of the coil body are connected in parallel.
7. A miniature noise reduction module according to claim 6, wherein: the semiconductor coil chip also comprises an electrode layer, wherein the electrode layer is provided with a first electrode region and a second electrode region, the first electrode region is electrically connected with the initial end of each metal wire section of the coil body of the coil layer, and the second electrode region is electrically connected with the tail end of each metal wire section of the coil body of the coil layer.
8. A miniature noise reduction module according to claim 1, wherein: the vibrating plate has magnetic permeability and/or the vibrating plate is matched with a magnetic conductive plate with magnetic permeability.
9. A miniature noise reduction module according to claim 1, wherein: the microphone is arranged on the base body and is electrically connected with the control chip.
10. A miniature noise reduction module according to claim 1 or 9, wherein: the wireless communication module is arranged on the base body and electrically connected with the control chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111093673.2A CN113781992A (en) | 2021-09-17 | 2021-09-17 | Miniature noise reduction module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111093673.2A CN113781992A (en) | 2021-09-17 | 2021-09-17 | Miniature noise reduction module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113781992A true CN113781992A (en) | 2021-12-10 |
Family
ID=78851885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111093673.2A Pending CN113781992A (en) | 2021-09-17 | 2021-09-17 | Miniature noise reduction module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113781992A (en) |
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2021
- 2021-09-17 CN CN202111093673.2A patent/CN113781992A/en active Pending
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