CN113779920B - Method for detecting element - Google Patents
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- CN113779920B CN113779920B CN202010525578.4A CN202010525578A CN113779920B CN 113779920 B CN113779920 B CN 113779920B CN 202010525578 A CN202010525578 A CN 202010525578A CN 113779920 B CN113779920 B CN 113779920B
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000001514 detection method Methods 0.000 claims abstract description 93
- 238000011960 computer-aided design Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 6
- 238000012216 screening Methods 0.000 claims 1
- 238000013473 artificial intelligence Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 125000000174 L-prolyl group Chemical group [H]N1C([H])([H])C([H])([H])C([H])([H])[C@@]1([H])C(*)=O 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- Engineering & Computer Science (AREA)
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- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to a component detection method, which is implemented in computer aided design software of an electronic device and comprises the following steps: the method comprises the steps of establishing a maximum enveloping space, wherein the volume of the maximum enveloping space is not smaller than the volume of a structural component, establishing a detection space model according to the maximum enveloping space, wherein the detection space model comprises a surface to be detected of the structural component, selecting elements positioned on the surface of the structural component to obtain element information of the elements of the structural component, wherein the detection space model comprises at least one part of the elements, and collecting an element list comprising the element information.
Description
Technical Field
The present invention relates to a device detecting method, and more particularly, to a device detecting method capable of rapidly detecting a device.
Background
The computer aided design (Computer Aided Design, CAD) is a kind of computer drawing software, so that a user can draw a complex one-dimensional or multi-dimensional design drawing, and thus the computer aided design software has been widely used for drawing model drawings such as mechanical drawings, building drawings, electrical drawings, etc.
In addition, when the outer package of the structural component is designed according to the shape of the structural component, the user often performs the outer package design of the structural component with the aid of computer aided design software. However, the existing computer aided design software cannot quickly judge and select the elements located on the outer surface of the structural component, and the existing execution mode of judging the elements on the surface of the structural component still relies on a manual mode for users to select the elements one by one in the computer aided design software, so that the whole design time is too time-consuming and labor-consuming, and the risk of misjudgment caused by manual operation exists. In particular, when the structural component is, for example, a server motherboard, the outer surface of the structural component is often configured to be more complex due to the various components, for example, the components have different sizes, shapes, heights, etc., thereby further increasing the time for determining the components on the surface of the structural component.
Disclosure of Invention
In view of the foregoing, the present invention provides a device detecting method that meets the above-mentioned needs.
According to an embodiment of the invention, a method for detecting a component is performed on computer aided design software of an electronic device, and the method comprises: establishing a maximum envelope space, wherein the volume of the maximum envelope space is not less than the volume of the structural component; establishing a detection space model according to the maximum envelope space, wherein the detection space model comprises a surface to be detected of the structural component; selecting a component located on a surface of the structural component to obtain component information of the component of the structural component, wherein the detection space model comprises at least a part of the component; and compiling a component list containing the component information.
In summary, according to the component detection method of one or more embodiments of the present invention, the components on the surface of the structural component can be detected rapidly to determine which components are on the surface of the structural component, and meanwhile, the risk of misjudgment due to manual operation is reduced. Therefore, when the outer package is to be designed for the structural component, and the outer surface of the structural component has a more complex structure, the component detection method of the present invention can accelerate the acquisition of the component list on the surface of the structural component, so as to greatly reduce the time for detecting the component and generating the component list, and more rapidly understand the outer package of the structural component, compared with the mode of manually selecting the components one by one in the prior art. In addition, according to the component detection method of one or more embodiments of the present invention, the component information can help a user design the package of the structural component when other components that are easier to release are disposed around the component.
The foregoing description of the disclosure and the following description of embodiments are presented to illustrate and explain the spirit and principles of the invention and to provide a further explanation of the invention as claimed.
Drawings
FIG. 1 is a flow chart of a device detection method according to an embodiment of the invention.
Fig. 2 is a detailed flowchart according to step S10 of fig. 1.
Fig. 3A and 3B are schematic diagrams illustrating a device detection method according to an embodiment of the invention.
Fig. 3C is a side view illustrating fig. 3B.
Fig. 4A is a detailed flowchart showing step S20 of fig. 1.
Fig. 4B is a detailed flowchart showing step S201 of fig. 4A.
FIG. 5 is a flow chart of a device detection method according to another embodiment of the invention.
Reference numerals illustrate:
100. structural component
110. Surface to be detected
120. Element
200. Maximum envelope space
210. Flour with a plurality of grooves
300a initial spatial model
310a initial surface
300b detection space model
310b detection surface
320. Preset distance
X-Y-Z coordinate system
Detailed Description
The detailed features and advantages of the present invention will be set forth in the following detailed description of the embodiments, which is presented to enable any person skilled in the art to make and use the present invention, and the related objects and advantages of the present invention will be readily apparent to those of ordinary skill in the art in view of the present disclosure, claims and drawings. The following examples further illustrate the aspects of the invention in detail, but do not limit the scope of the invention in any way.
The component detection method disclosed by the invention can be used for detecting one or more components on the surface of the structural component and obtaining a component list of the components according to the component detection method. Taking a server motherboard as an example of a structural component, the surface of the server motherboard has elements such as a chip, a passive element, a connection port, etc., and the element detection method disclosed by the invention can be used for detecting the elements on the surface so as to obtain a list of the elements on the surface of the server motherboard.
In addition, the disclosed device detection method is preferably implemented in computer aided design (Computer Aided Design, CAD) software of the electronic device. For example, the electronic device is a computer, and the computer is provided with computer aided design software, wherein the computer aided design software is AutoCAD, pro/Engineer, solidWorks, etc., and the invention is not limited to the type of the computer aided design software. In order to facilitate understanding of the present invention, the method for detecting a component of the present invention is performed by an electronic device.
Referring to fig. 1, fig. 1 is a flowchart of a device detection method according to an embodiment of the invention.
Step S10: a maximum envelope space is established.
When the electronic device obtains the computer aided design file of the structural component, the electronic device can establish the maximum enveloping space of the cladding structural component, and the volume of the maximum enveloping space is not smaller than the volume of the structural component. In other words, the volume of the maximum envelope space is preferably larger than the volume of the structural component, so that the maximum envelope space encloses the entire structural component, but when the maximum envelope space encloses the structural component entirely, the volume of the maximum envelope space may be the same as the volume of the structural component. The manner in which the maximum envelope space is established will be further described in conjunction with fig. 2.
Step S20: and establishing a detection space model according to the maximum envelope space.
That is, after the electronic device obtains the maximum envelope space, the detection space model is built according to the maximum envelope space, so that the detection space model includes a surface to be detected of the structural component, and by making the detection space model include the surface to be detected of the structural component, the detection space model may further include at least a portion of the element located on the surface of the structural component.
In detail, at least a portion of the element is, for example, a face, a protrusion, etc. of the element, and the detection space model includes at least a portion of the element, for example, a portion of the structure including the element, or is in contact with a portion of the element (for example, a face, a line segment, a point, etc. of the detection space model contacting the element), and the detection space model may also include the entirety of the element. The detailed implementation of step S20 will be described in detail later.
Step S30: elements on the surface of the structural component are selected to obtain element information.
Because the detection space model includes at least a portion of the components located on the surface of the structural component, the electronic device can select the components included in the detection space model and obtain component information, where the component information is, for example, the name, type, size, location, etc. of the components. In addition, the element information may also include element information for other elements around the element, so that the element information may assist a user in designing an overwrap for the structural assembly when there is a more releasable element around the element.
Step S40: and collecting an element list containing element information.
For example, when the detected space model includes a plurality of elements, the electronic device collects the element list, for example, the element information of the plurality of elements included in the detected space model is collected into the element list, and the element list is collected. The assembled component list may be output to the terminal device for presentation, or stored in a memory for later access. In addition, the memory may store a pre-stored component list in advance, and the pre-stored component list includes, for example, all component names that will be set in the structural component, so the electronic device may screen the component information associated with the structural component from the pre-stored component list according to the component information to build and collect the component list.
Since the component list contains component information, the component list can be used in the packaging design of the structural component. For example, the component list may be used to determine whether there are particularly protruding or easily-removed portions of the structural component, so as to more quickly understand the structure of the outer package of the structural component, however, the application of the component list is not limited in the present invention.
Referring to fig. 2, fig. 2 is a detailed flowchart according to step S10 of fig. 1, wherein step S10 of fig. 1 is "build maximum envelope space", and includes steps S101, S103 and S105.
Step S101: a coordinate system is established that includes the structural components.
That is, as shown in fig. 3A, the electronic device first establishes an X-Y-Z coordinate system according to the structural component 100, so as to facilitate the subsequent establishment of the maximum envelope space and various space models, wherein the X-Y-Z coordinate system is only an example, that is, the coordinate system is preferably a three-dimensional coordinate system, but may also be a one-dimensional or two-dimensional coordinate system, and the dimension of the coordinate system is not limited by the present invention.
Step S103: the space occupied by the structural components is taken as the maximum envelope space.
After the X-Y-Z coordinate system is established, the electronic device may use the space occupied by the structural component 100 as the maximum envelope space 200 to define the maximum envelope space 200 in the X-Y-Z coordinate system. In other words, the volume of the maximum envelope space 200 may be the same as the volume of the structural component 100, such that the maximum envelope space 200 may at least encase the entire structural component 100.
Step S105: with the surface of the structural component expanding in a direction away from the structural component.
That is, in addition to the space occupied by the structural component 100 as the maximum envelope space 200 in step S103, the outer surface of the structural component 100 may be expanded in a direction away from the structural component 100, and the volume of the maximum envelope space 200 formed is larger than that of the structural component 100, so as to define the maximum envelope space 200 that can cover the entire structural component 100 in the X-Y-Z coordinate system.
After the maximum envelope space 200 is defined (step S10 shown in fig. 1), the electronic device may execute step S20 shown in fig. 1: and establishing a detection space model according to the maximum envelope space. An embodiment of creating a detection space model (step S20 shown in fig. 1) will be described below with reference to fig. 3A, 3B, 3C and fig. 4A, 4B. Referring to fig. 3A-3C and fig. 4A, fig. 3A and 3B are schematic diagrams illustrating a device detection method according to an embodiment of the invention; fig. 3C is a side view illustrating fig. 3B; fig. 4A is a detailed flowchart showing step S20 of fig. 1, including step S201 and step S203.
Step S201: an initial spatial model is established adjacent to the maximum envelope space.
In detail, as shown in fig. 3A, the maximum envelope space 200 has one surface 210, and the initial surface 310a of the initial space model 300a is attached to the surface 210 of the maximum envelope space 200, and the area of the initial surface 310a is preferably not smaller than the area of the surface 210 of the maximum envelope space 200. In other words, the initial space model 300a has an initial surface 310a, and the initial surface 310a and the surface 110 to be detected of the structural component 100 are respectively located on two different sides of the surface 210 of the maximum envelope space 200 (the surface 110 to be detected of the structural component 100 is located on one side of the surface 210, and the initial surface 310a of the initial space model 300a may be adjacent to the surface 210 and located on the other side of the surface 210).
Step S203: the initial surface is moved towards the surface to be detected, and an initial space model containing the surface to be detected is defined as a detection space model.
When the initial surface 310a of the initial spatial model 300a is adjacent to the surface 210, the electronic device can move the initial surface 310a towards the surface to be detected 110, so that the initial spatial model 300a includes the detection surface 110, and define the initial spatial model 300a including the detection surface 110 as the detection spatial model 300b. That is, when the initial surface 310a and the surface 110 to be detected are both located on the same side of the surface 210 of the maximum envelope space 200 and the initial space model 300a includes a portion of the device 120, the initial space model 300a can be used as the detection space model 300B as shown in fig. 3B and 3C.
After the detection space model 300b is obtained, the electronic device may execute step S30 shown in fig. 1, and select the component 120 located on the surface of the structural component 100 to obtain component information. That is, after the detection space model 300B is obtained, since the detection space model 300 includes at least a portion of the element 120 (gray portion of the element 120 shown in fig. 3B and 3C), the electronic device can determine that the surface of the structural component 100 at least includes the element 120, and can determine the boundary position of the element 120, and obtain the element information of the element 120 accordingly.
In addition, the device 120 shown in fig. 3A-3C is disposed on the surface of the structural component 100, however, the device 120 may also be a connection port, a slot, etc., and the electronic device may determine the device information of the connection port, the slot, etc. by determining that the surface of the structural component 100 included in the detection space model 300b is not a continuous surface.
Please continue to refer to fig. 3A-3C and fig. 4B, wherein fig. 4B shows a detailed flowchart of step S203 of fig. 4A, which includes step S2031 and step S2033. The manner in which the electronic device performs step S203 (moving the initial surface 310a toward the surface to be detected 110 and defining the initial spatial model 300a including the surface to be detected 110 as the detection spatial model 300B) may be implemented in steps S2031 and S2033 shown in fig. 4B.
Step S2031: the initial surface is moved through the surface to be detected to form a detection space model.
As shown in fig. 3A and 3B, the electronic device establishes an initial spatial model 300a, and an initial surface 310a of the initial spatial model 300a moves from the surface 210 that is attached to the maximum envelope space 200 as shown in fig. 3A toward the surface to be detected 110, and moves the initial surface 310a through the surface to be detected 110 to form a detection spatial model 300B.
Step S2033: an initial surface of the detection space model is defined as a detection surface.
After the initial surface 310a passes through the surface to be detected 110 and forms the detection space model 300b, the electronic device can define the initial surface 310a of the detection space model 300b as the detection surface 310b. In other words, the electronic device can define the initial surface 310a passing through the surface to be detected 110 as the detection surface 310b.
In other words, the initial spatial model 300a (corresponding to the initial surface 310 a) and the detection spatial model 300b (corresponding to the detection surface 310 b) may have the same shape, which is different only in the relative position to the detection surface 100. The initial space model 300a and the detection space model 300b may have different shapes, that is, the electronic device may not move the position of the entire initial space model 300a, but only expand the initial surface 310a of the initial space model 300a to a position on the same side of the plane 210 of the maximum envelope space 200 as the plane 110 to be detected, so as to obtain the detection surface 310b, where the volume of the detection space model 300b is larger than that of the initial space model 300 a.
Whether the detection space model 300b is formed by moving the entire initial space model 300a or by merely expanding the initial surface 310a of the extended initial space model 300a, the detection space model 300b is preferably formed to include a portion of the device 120 to form a device list. Thus, as shown in fig. 3B, the initial surface 310a passing through the surface to be detected 110 can be used as the detection surface 310B, and the initial spatial model 300a having the initial surface 310a can be used as the detection spatial model 300B.
Referring to fig. 4A and 4B together, it should be noted that, if the initial surface 310a of the initial space model 300a is formed and is located at the position of the detection surface 310B, the electronic device may omit step S201 and directly perform step S203 to take the initial surface 310a as the detection surface 310B.
In addition, the "moving" in step S2031 may be that the initial surface 310a passes through a moving path to move the initial surface 310a to the position of the detection surface 310b, or may be that the initial surface 310 jumps directly to the position of the detection surface 310b. In order to describe step S2031 in more detail (moving the initial surface 310a through the surface to be detected 110 to form the detection space model 300B), please refer to fig. 3C, fig. 3C shows a side view of fig. 3B.
In detail, the electronic device can move the initial surface 310a through the surface to be detected 110 so that the detection surface 310b has a predetermined distance from the surface to be detected 110. The predetermined distance 320 may be a distance set according to a user command, or the thickness of the substrate of the structural component 100 is used as the predetermined distance 320. For example, the surface 110 to be detected of the structural component 100 has a substrate for carrying the device 120, and the distance between the device 120 and the surface 110 to be detected is obtained according to the thickness of the substrate, for example. The electronic device can obtain the predetermined distance 320 according to the thickness of the substrate, so that the detection space model 300b can include at least a portion of the device 120.
In addition, only one surface of the structural component 100 (the surface to be detected 100) is taken as an illustration, however, the electronic device may also establish an initial/detection space model including the remaining five surfaces of the structural component 100, or an initial/detection space model including one or more line segments of the structural component 100, so as to accurately detect the elements on the surface of the structural component 100, and may also detect the elements on the surface to be detected 110 in addition to the elements 120. In other words, when the electronic device selects the element 120 located on the surface of the structural component 100, the electronic device may also select the element on the surface 110 to be detected and the element on the surface adjacent to the surface 110 to be detected.
Referring to fig. 5, fig. 5 is a flowchart of a device detection method according to another embodiment of the invention. After the component information is obtained in step S30 shown in fig. 1, the electronic device may execute step S50, step S51 and step S52 in addition to the step S40 to directly collect the component list.
S50: judging whether the prestored component list contains component information.
When the electronic device determines that the pre-stored component list includes component information, the component information associated with the structural component may be filtered from the pre-stored component list, and step S40 is performed to compile the component list.
On the contrary, when the electronic device determines that the pre-stored component list does not include the component information, the electronic device may execute step S51: the pre-stored component list is updated with the component information. Taking the component 120 shown in fig. 3A-3C as an example, when the electronic device determines that the pre-stored component list does not include the component information of the component 120, the electronic device can add the component information of the component 120 to the pre-stored component list to update the pre-stored component list. Accordingly, in the process of the component detection method executed later, if the component 120 is detected, the electronic device can directly screen the component information of the component 120 from the pre-stored component list and collect the component list, without updating the pre-stored component list with the component information of the component 120 again.
In addition, when it is determined in step S50 that the pre-stored component list does not include the component information, it indicates that the memory of the electronic device may not store the computer aided design file associated with the component information. Therefore, when it is determined that the pre-stored component list does not contain component information, the electronic device may execute step S52.
Step S52: the computer aided design file associated with the element information is stored in a memory.
Taking the component 120 shown in fig. 3A-3C as an example, when the pre-stored component list does not include the component information of the component 120, it indicates that the computer aided design file of the component 120 should not be stored in the memory. Therefore, by storing the computer aided design file of the element 120 into the memory accessible by the electronic device, a user can not only start the computer aided design file of the element 120 at any time without establishing the computer aided design file of the element 120 again, but also effectively save the storage space of the memory by only storing the computer aided design file of the element 120.
With continued reference to fig. 5, it should be specifically noted that the step S51 shown in fig. 5 is performed before the step S52, but the step S51 may also be performed after the step S52. In addition, when the electronic device determines in step S50 that the pre-stored component list does not include the component information, the electronic device may execute step S40 of collecting the component list after executing step S51 or step S52, and the execution sequence of steps S40, S51, S52 is not limited in the present invention.
The electronic device preferably also presents a user interface for receiving user instructions when executing the computer aided design software, so that a user can select and adjust the position and the direction of the initial surface by himself, and can select whether to display the initial/detection space model and the initial/detection surface at all positions and directions on the picture.
In summary, according to the component detection method of one or more embodiments of the present invention, the components on the surface of the structural component can be detected rapidly to determine which components are on the surface of the structural component, and meanwhile, the risk of misjudgment due to manual operation is reduced. Therefore, when the outer package is to be designed for the structural component, and the outer surface of the structural component has a more complex structure, the component detection method of the present invention can further accelerate the acquisition of the component list on the surface of the structural component, so as to greatly reduce the time for detecting the component and generating the component list, and more rapidly understand the outer package of the structural component, compared with the mode of manually selecting the components one by one in the prior art. In addition, according to the component detection method of one or more embodiments of the present invention, the component information can help a user design the package of the structural component when other components that are easier to release are disposed around the component.
In an embodiment of the present invention, the server of the present invention may be used for artificial intelligence (i.e. Artificial Intelligence, AI) operation and Edge Computing (Edge Computing) operation, and may also be used as a 5G server, a cloud server or a car networking server.
Claims (7)
1. A method for detecting a component, the method being implemented in computer aided design software of a computer readable recording medium, the method comprising:
establishing a maximum envelope space, wherein the volume of the maximum envelope space is not less than the volume of the structural component;
establishing a detection space model according to the maximum envelope space, wherein the detection space model comprises a surface to be detected of the structural component;
selecting a component located on a surface of the structural component to obtain component information of the component of the structural component, wherein the detection space model comprises at least a part of the component; and
collecting out a component list containing the component information;
after obtaining the component information and before compiling the component list containing the component information, the method further comprises: screening the element list associated with the structural component from a pre-stored element list according to the element information;
the maximum envelope space has a face, and establishing the detection space model according to the maximum envelope space includes:
establishing an initial space model adjacent to the maximum envelope space, wherein an initial surface of the initial space model is attached to the surface of the maximum envelope space; and
moving the initial surface towards the surface to be detected to enable the initial space model to contain the surface to be detected, and defining the initial space model containing the surface to be detected as the detection space model.
2. The component detecting method according to claim 1, wherein moving the initial surface toward the surface to be detected comprises:
moving the initial surface through the surface to be detected to form the detection space model, and defining the initial surface of the detection space model as a detection surface.
3. The device detection method according to claim 2, wherein moving the initial surface through the surface to be detected to form the detection space model is:
the initial surface is moved to enable a preset distance to be formed between the detection surface and the surface to be detected.
4. The device detecting method according to claim 3, wherein the surface to be detected of the structural component includes a substrate, the predetermined distance is a thickness of the substrate, and a direction of the thickness is parallel to the detecting surface.
5. The device detection method according to claim 1, wherein after obtaining the device information, the detection method further comprises:
judging whether a prestored element list contains the element information or not; and
when the pre-stored element list is judged not to contain the element information, the pre-stored element list is updated by the element information.
6. The device detection method according to claim 5, wherein when the pre-stored device list is determined not to contain the device information, the detection method further comprises:
storing the computer aided design file associated with the element information in a memory.
7. The device detection method according to claim 1, wherein obtaining the maximum envelope space comprises:
establishing a coordinate system containing the structural component; and
the space occupied by the structural component is taken as the maximum envelope space, or the surface of the structural component expands in a direction away from the structural component to define the maximum envelope space in the coordinate system.
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| US10247541B2 (en) * | 2014-03-31 | 2019-04-02 | Gorilla Technology Inc. | System and method of estimating the three-dimensional size of an object for packaging or storing the object |
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| CN102087574A (en) * | 2009-12-08 | 2011-06-08 | 宏碁股份有限公司 | Method and system for displaying file position and electronic device |
| TW201500946A (en) * | 2013-06-26 | 2015-01-01 | Inventec Corp | Checking method for referencing part file |
| KR20160136761A (en) * | 2015-05-21 | 2016-11-30 | 삼성에스디에스 주식회사 | Apparatus and method for design packing materials, system for fabricating packing materials using the same |
| KR20200058139A (en) * | 2018-11-19 | 2020-05-27 | 장다영 | System for manufacturing the 2d floor plan model |
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