CN113778245B

CN113778245B - Touch pad and electronic equipment

Info

Publication number: CN113778245B
Application number: CN202111102358.1A
Authority: CN
Inventors: 郭益平; 张�荣
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2021-09-19
Filing date: 2021-09-19
Publication date: 2022-09-16
Anticipated expiration: 2041-09-19
Also published as: CN113778245A

Abstract

The application provides a touch pad and an electronic device, which have better touch feedback performance. The touch panel includes a piezoelectric ceramic component for detecting pressure and outputting vibration corresponding to the pressure, the piezoelectric ceramic component includes: a piezoelectric ceramic array; and the substrate comprises a plurality of fixing areas and a flexible area positioned between the adjacent fixing areas, the fixing areas are respectively used for arranging the piezoelectric ceramics in the piezoelectric ceramic array, and the flexible area is used for connecting the adjacent fixing areas so as to ensure that the piezoelectric ceramics are jointly fixed on the substrate and absorb the vibration interference between the piezoelectric ceramics on the adjacent fixing areas.

Description

Touch pad and electronic equipment

Technical Field

The embodiment of the application relates to the field of touch control, and more particularly relates to a touch pad and an electronic device.

Background

The touch pad senses the position and movement of a user's finger through the touch sensor and controls the movement of a pointer on a display interface. The conventional touch pad detects a pressing action of a user through a physical key to execute functions such as confirming or calling a menu. However, the pressing operation by the user can be performed only in the area below 1/2 of the touch pad, and the pressing operation cannot be performed in any area of the entire panel.

The pressure touch pad replaces physical pressing through tactile feedback, so that operations such as confirming and calling out a menu are realized, and the problem that the traditional touch pad can only be pressed locally is solved. The pressure touch pad can adjust the response force and the vibration feedback intensity of the pressing action of the user according to the use habit of the user, and provides more convenient and comfortable operation experience for the user.

In order to continue the usage habit of the conventional touch pad for the user, the pressure touch pad generally uses the tactile feedback device to simulate the pressing and bouncing feel of the physical key, and the user experience is greatly dependent on the design of the tactile feedback device. Therefore, how to improve the performance of the haptic feedback device to improve the performance of the touch pad is a problem to be solved.

Disclosure of Invention

The embodiment of the application provides a touch pad and electronic equipment, which have better touch feedback performance.

In a first aspect, a touch panel is provided, which includes a piezoelectric ceramic element for detecting a pressure and outputting a vibration corresponding to the pressure, the piezoelectric ceramic element including:

a piezoelectric ceramic array; and the number of the first and second groups,

the substrate comprises a plurality of fixing areas and a flexible area located between the adjacent fixing areas, the fixing areas are respectively used for arranging the piezoelectric ceramics in the piezoelectric ceramic array, and the flexible area is used for connecting the adjacent fixing areas so that the piezoelectric ceramics are jointly fixed on the substrate and used for absorbing vibration interference between the piezoelectric ceramics on the adjacent fixing areas.

In an embodiment of the present application, a piezoelectric ceramic element is disposed in a touch panel to implement a pressure feedback function of the touch panel, where the piezoelectric ceramic element includes a substrate and a piezoelectric ceramic array, the substrate includes a plurality of fixing regions and a flexible region located between adjacent fixing regions, and a plurality of piezoelectric ceramics in the piezoelectric ceramic array are disposed in the plurality of fixing regions, respectively. Because the adjacent fixed areas in the plurality of fixed areas are connected through the flexible area, the plurality of piezoelectric ceramics are jointly fixed on the substrate, and the flexible area absorbs coplanarity tolerance among the piezoelectric ceramics at different positions and vibration interference among the piezoelectric ceramics on the adjacent fixed areas, so that the performance of the touch panel is improved. Meanwhile, when the piezoelectric ceramic assembly bears pressure for a long time, the flexible area on the substrate can reduce the risk of microcrack generation caused by excessive deformation of the piezoelectric ceramic, and the service life of the touch panel is prolonged.

In one possible implementation, the flexible region is serpentine or S-shaped. Due to the long pressure and vibration transmission path of the serpentine area or the S-shaped area, the flexible area can better absorb coplanarity tolerance between the piezoelectric ceramics at different positions and vibration interference between the piezoelectric ceramics on the adjacent fixed areas.

In a possible implementation manner, the substrate further includes a mounting region located between the adjacent fixing regions, wherein two ends of the mounting region are respectively connected to the adjacent fixing regions through the two flexible regions, and a mounting member is disposed on the mounting region, and the mounting member is used for mounting the piezoelectric ceramic component on a housing for carrying the piezoelectric ceramic component.

In one possible implementation, the piezoelectric ceramic assembly further includes a flexible circuit board FPC for connecting electrodes of the same polarity of adjacent piezoelectric ceramics.

In a possible implementation manner, the adjacent piezoelectric ceramics include a first piezoelectric ceramic and a second piezoelectric ceramic, the first piezoelectric ceramic and the second piezoelectric ceramic are arranged side by side along a length direction thereof, the FPC includes a first connection region and a second connection region, wherein, along the length direction, a first electrode of the first piezoelectric ceramic is connected to a first side of the first connection region, a second electrode of the first piezoelectric ceramic is connected to a second side of the first connection region, a first electrode of the second piezoelectric ceramic is connected to a second side of the second connection region, and a second electrode of the second piezoelectric ceramic is connected to a first side of the second connection region.

When adjacent piezoelectric ceramics are fixed on the FPC along the length direction, the first electrodes with the same polarity of the adjacent piezoelectric ceramics are connected at the positions close to each other on the FPC, and the second electrodes with the same polarity are connected at the positions far away from each other on the FPC.

In a possible implementation manner, the plurality of fixing regions include a first fixing region and a second fixing region adjacent to each other for disposing a first piezoelectric ceramic and a second piezoelectric ceramic, respectively, wherein the first fixing region and the second fixing region are respectively located on two first arms in a first direction of the substrate, and each first arm is connected between two second arms in a second direction of the substrate through the flexible regions at two ends of each first arm, and the first direction is perpendicular to the second direction.

In a possible implementation manner, the first direction is a length direction of the first piezoelectric ceramic and the second piezoelectric ceramic, the second direction is a width direction of the first piezoelectric ceramic and the second piezoelectric ceramic, and the first piezoelectric ceramic and the second piezoelectric ceramic are arranged side by side along the second direction.

In a possible implementation, one end of the flexible zone is connected to one end of the first arm, and the other end of the flexible zone is connected to one end of the second arm or to a zone between the two ends of the second arm.

In a possible implementation, the flexible zone is located on the first arm, or on the second arm.

In one possible implementation, the piezoelectric ceramic assembly further includes an FPC for connecting electrodes of the same polarity of the first piezoelectric ceramic and the second piezoelectric ceramic.

In one possible implementation, a mounting is provided on the substrate, and the mounting is used for mounting the piezoceramic component on a housing for carrying the piezoceramic component.

In one possible implementation, the first electrode of each piezoelectric ceramic is located on a first region and a second surface of the first surface of each piezoelectric ceramic, and the first electrodes located on the first region and the second surface are connected through a conductive material penetrating through each piezoelectric ceramic. The second electrode is located in a second area of the first surface of each piezoelectric ceramic, an insulating material is arranged between the first electrode located in the first area and the second electrode located in the second area, and the insulating material is used for separating the first electrode located in the first area and the second electrode located in the second area and connecting each piezoelectric ceramic and the FPC.

Generally, two electrodes of the piezoelectric ceramic are located on the upper and lower surfaces of the piezoelectric ceramic, respectively, and when the two electrodes of the piezoelectric ceramic are connected to the FPC, the two electrodes need to be led from the upper and lower surfaces of the piezoelectric ceramic to the FPC by using lead wires, respectively, so that the thickness of the piezoelectric ceramic assembly is increased. In the embodiment, the first electrode on the first surface of the piezoelectric ceramic is guided to the first area on the second surface through the conductive material, the second area on the second surface is the second electrode of the piezoelectric ceramic, and the first electrode in the first area and the second electrode in the second area are isolated from each other on the second surface through the insulating material, so that the two electrodes of the piezoelectric ceramic are both positioned on the second surface of the piezoelectric ceramic, the connection with the FPC is facilitated, and the thickness of the piezoelectric ceramic assembly is reduced.

In one possible implementation, the insulating material is epoxy-based low-temperature thermosetting adhesive. Therefore, the insulating material can be used for isolating two electrodes of the piezoelectric ceramic, and the adhesive force between the piezoelectric ceramic and the FPC is improved.

In one possible implementation, the piezoelectric ceramic component further includes: the transmission structure is arranged on the substrate and is respectively positioned on two sides of the substrate together with the piezoelectric ceramics, and the transmission structure is used for transmitting and inputting the pressure of the piezoelectric ceramics and the vibration generated by the piezoelectric ceramics.

In one possible implementation, the piezoelectric ceramic component further includes: and the buffer structure is arranged on the substrate and is respectively positioned at two sides of the substrate together with the piezoelectric ceramics, and the buffer structure is used for absorbing aftershocks generated by the piezoelectric ceramics.

In a possible implementation manner, the touch panel further includes a touch component, wherein the piezoelectric ceramic component is disposed below the touch component.

In one possible implementation, the touch component includes: a protective layer; the touch control functional layer is pasted on the lower surface of the protective layer and used for detecting touch information; and the limiting layer is pasted on the protective layer or the lower surface of the touch functional layer and used for limiting the deformation of the touch functional layer.

In a possible implementation manner, the touch function layer includes a touch electrode layer and a printed circuit board PCB, wherein the touch electrode layer and the PCB are adhered together, or the touch electrode layer is integrated on the PCB.

In one possible implementation, the PCB includes: the driving circuit is connected with the piezoelectric ceramics and used for detecting the pressure input into the piezoelectric ceramics and driving the piezoelectric ceramics to generate vibration; and the booster circuit comprises a voltage generating circuit and a charge pump circuit, wherein the voltage generating circuit is used for generating a first voltage, the charge pump circuit is connected between the voltage generating circuit and the driving circuit and is used for receiving the first voltage and outputting a second voltage to the driving circuit, and the second voltage is greater than the first voltage and is used for driving the piezoelectric ceramic to generate vibration.

Because the charge pump circuit can use lower input voltage to generate higher output voltage, the requirement of piezoelectric ceramics on high voltage during working can be met, the number of layers of the piezoelectric ceramics is reduced, and the cost is reduced.

In a second aspect, an electronic device is provided, which includes the first aspect or the touch pad in any possible implementation manner of the first aspect, where the touch pad includes a piezoelectric ceramic component and a touch component; and the shell is provided with a containing groove, the containing groove is provided with a first assembling surface, and the piezoelectric ceramic component is installed on the first assembling surface through an installing piece.

In a possible implementation manner, the housing further has a second mounting surface located in a peripheral area of the accommodating groove, and the touch control assembly is fixed on the second mounting surface through an adhesive layer.

Drawings

Fig. 1 is a schematic diagram of a touch system according to an embodiment of the present application.

Fig. 2 is a structural diagram of a piezoelectric ceramic component in one implementation of an embodiment of the present application.

Fig. 3 is a structural diagram of a piezoelectric ceramic component in one implementation of an embodiment of the present application.

Fig. 4 is a structural diagram of a piezoelectric ceramic component in one implementation of the embodiment of the present application.

Fig. 5 is a structural diagram of a piezoelectric ceramic component in one implementation of the embodiments of the present application.

Fig. 6 is a structural diagram of a piezoelectric ceramic component in one implementation of the embodiment of the present application.

Fig. 7 is a schematic view of a connection manner between the piezoelectric ceramic and the FPC according to the embodiment of the present application.

FIG. 8 is a schematic view showing the electrode connection method of a piezoelectric ceramic according to an embodiment of the present invention.

Fig. 9 is an exploded view of a touch pad having the piezoelectric ceramic element shown in fig. 2.

Fig. 10 is a cross-sectional view of the touch pad of fig. 9.

Fig. 11 is an exploded view of a touch pad having the piezoelectric ceramic element shown in fig. 3.

Fig. 12 is a cross-sectional view of the touch panel shown in fig. 11.

Fig. 13 is an exploded view of a touch pad having the piezoelectric ceramic element shown in fig. 4.

Fig. 14 is a schematic diagram of a driving circuit of the piezoelectric ceramic element.

Fig. 15 is a schematic diagram of a voltage generation circuit of the piezoelectric ceramic element.

Fig. 16 is a schematic diagram of a charge pump circuit for a piezo ceramic assembly.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

The touch panel usually utilizes the piezoelectric effect of piezoelectric ceramics to simulate the pressing and bouncing hand feeling of physical keys. When a user presses the touch pad, the piezoelectric ceramic is deformed, a current signal is generated based on the positive piezoelectric effect of the piezoelectric ceramic, and the pressing force of the user is detected based on the current signal; after the pressure is detected, the control unit outputs a signal to the piezoelectric ceramic, and the piezoelectric ceramic generates an electric field in the polarization direction based on the inverse piezoelectric effect of the piezoelectric ceramic, so that mechanical deformation is generated, and the vibration effect is achieved.

Here, the positive piezoelectric effect and the negative piezoelectric effect are collectively referred to as a piezoelectric effect. When some substances exert pressure or tension along a certain direction, along with the generation of deformation, charges with opposite signs are generated on two opposite surfaces of the substances, and when external force is removed and the deformation disappears, the substances return to an uncharged state again, and the phenomenon is called positive piezoelectric effect; on the contrary, applying an electric field in the polarization direction of these substances will cause mechanical deformation, and when the electric field is removed, the deformation will disappear, which is called inverse piezoelectric effect. The substance with piezoelectric effect is called piezoelectric material, and piezoelectric ceramics is one kind of piezoelectric material.

Two or more piezoelectric ceramics are typically used in a piezoelectric ceramic assembly, and are disposed at different locations in a touch pad to achieve tactile feedback at each location. However, coplanarity between piezoelectric ceramics at different positions is poor, and a large coplanarity tolerance causes a low assembly yield of the touch panel, and piezoelectric ceramics at any position cannot be assembled in place, which results in poor consistency of pressing and vibration feedback, thereby affecting user experience.

The embodiment of the application provides a touch pad, through set up flexible construction between the piezoceramics in different positions, absorb coplanarity tolerance and the vibrations interference between the adjacent piezoceramics between each piezoceramics, obviously improved the performance of touch pad, improved user experience.

Fig. 1 is a schematic view of a touch pad 10 according to an embodiment of the present disclosure. The touch panel 10 includes a touch element 100 and a piezoelectric ceramic element 200. The touch assembly 100 includes a touch electrode layer and a touch chip, and the touch chip is configured to collect a signal output by the touch electrode layer and detect a touch operation of a user according to the signal. The piezoelectric ceramic assembly 200 is used for detecting a pressing force when a user presses the touch pad, and generating corresponding vibration according to the pressing force to feed back a pressing operation of the user. The touch pad 10 can be wired to a main controller of an electronic device, such as a CPU, via I2C for information interaction.

Fig. 2 to 6 are schematic diagrams of several possible structures of a piezoelectric ceramic component 200 according to an embodiment of the present disclosure. As shown in fig. 2 to 6, the piezoelectric ceramic assembly 200 for detecting a pressure and outputting a vibration corresponding to the pressure includes a piezoelectric ceramic array composed of a plurality of piezoelectric ceramics 210, and a substrate 220 for fixing the plurality of piezoelectric ceramics 210.

The substrate 220 may be a metal substrate, such as a stainless steel substrate.

Piezoelectric ceramic 210 may be referred to as a piezoelectric ceramic stack or a piezoelectric ceramic sheet, or the like. FIG. 2 shows two rows of piezoelectric ceramics along the Y direction, where each row is provided with four piezoelectric ceramics 210. Fig. 3 to 6 show two piezoelectric ceramics, i.e., a first piezoelectric ceramic 2110 and a second piezoelectric ceramic 2120, which are arranged side by side in the Y direction. It should be understood that the piezoelectric ceramic assembly 200 shown in fig. 2 to 6 is merely an example, and the number, shape, and positional relationship of the piezoelectric ceramics in the piezoelectric ceramic assembly 200 are not limited in the embodiments of the present application.

In one implementation, the flexible region 222 may be serpentine or S-shaped. The serpentine or S-shaped regions provide a longer path for pressure and vibration to travel, allowing the flexure region 222 to better absorb coplanarity tolerances between the different locations of the piezoceramics, as well as vibration interference between adjacent piezoceramics.

In the following, several possible implementations of the piezoelectric ceramic component 200 provided in the embodiments of the present application are described with reference to fig. 2 to 6.

First, description will be made of a piezoelectric ceramic assembly 200 shown in fig. 2, in the piezoelectric ceramic assembly 200 of fig. 2, a plurality of piezoelectric ceramics form a piezoelectric ceramic array.

As shown in fig. 2, a plurality of fixing regions 221 on the substrate 220 and a flexible region 222 between adjacent fixing regions 221 are integrated to form the substrate 220. That is, the fixed region 221 is integrally formed with the flexible region 222. Each of the piezoelectric ceramics 210 may be fixed to one of the fixing regions 221, and the area of the piezoelectric ceramics 210 may be smaller than or equal to the area of the fixing region 221. As shown in fig. 2, the piezoelectric ceramic 210 may be attached to the lower surface of the fixing region 221 through an adhesive layer.

Because the plurality of piezoelectric ceramics 210 in the piezoelectric ceramic array are respectively arranged in the plurality of fixing regions 221 of the substrate 220, and adjacent fixing regions 221 in the plurality of fixing regions 221 are connected through the flexible region 222, the plurality of piezoelectric ceramics 210 can be jointly fixed on the substrate 220, and the flexible region 222 absorbs coplanarity tolerance between the piezoelectric ceramics 210 at different positions and vibration interference between the piezoelectric ceramics 210 on the adjacent fixing regions 221, so that the pressure feedback performance of the touch panel is improved. Meanwhile, when the touch panel is subjected to a long-term pressure, the flexible region 222 can also reduce the risk of microcracks caused by excessive deformation of the piezoelectric ceramic 210, and improve the service life of the touch panel 10.

The adjacent fixing regions 221 are connected by the flexible region 222, and it is understood that the flexible region 222 belongs to a part of the substrate 200, and is used for forming flexible connection between the adjacent fixing regions 221, namely, a connection mode which allows a certain range of displacement of the connection position in some directions. When the flexible connection is formed between the adjacent fixing regions 221 through the flexible region 222, not only is the constraint generated between the adjacent fixing regions 221 allowed, the coplanarity tolerance between the piezoelectric ceramics 210 on the adjacent fixing regions 221 is reduced, but also a certain displacement is allowed to be generated between the adjacent fixing regions 221, thereby absorbing the vibration interference between the piezoelectric ceramics 210 on the adjacent fixing regions 221.

In one implementation, as shown in fig. 2, the substrate 220 further includes a mounting region 225 located between two adjacent fixing regions 221, the mounting region 225 is a region where the mounting member 223 is located, and two ends of the mounting region 225 are respectively connected to two adjacent fixing regions 221 through two flexible regions 222. The mounting member 223 is used to mount the piezo ceramic assembly on the housing 400 for carrying the piezo ceramic assembly 200. By way of example, the mounting member 223 shown in fig. 2 is a nut and thus may be used in conjunction with a screw 224 to mount the piezo ceramic assembly on the housing 400 for carrying the piezo ceramic assembly 200.

Taking fig. 2 as an example, adjacent fixing regions 221 are connected by two flexible regions 222, and there is also a mounting region 225 between the two flexible regions 222, each flexible region 222 being connected to the fixing region 221 on one side and to the mounting region 225 on the other side.

Specifically, two opposing S-shapes form a flexible region 222, each S-shape having one end connected to the fastening region 221 and the other end connected to the mounting region 225. In practical applications, the fixing region 221, the flexible region 222, and the mounting region 225 are all part of the substrate 220, and the substrate 220 having the fixing region 221, the flexible region 222, and the mounting region 225 can be directly fabricated and formed on a complete material.

Of course, the mounting region 225 may be provided in other regions with the substrate 220, not in the region between the adjacent fixing regions 211. For example, when the area of the fixing region 221 is larger than the area of the piezoelectric ceramics 210 attached therebelow, the region of the fixing region 221 not covered with the piezoelectric ceramics 210 may be used as the mounting region 225 and the nut 223 may be provided. For another example, an arm parallel to the Y direction may be provided on the substrate 220 to connect two adjacent rows of the piezoelectric ceramics 210 as the mounting region 225. For another example, the mounting region 225 may not be provided, and the piezoelectric ceramic assembly 200 may be adhered to the housing 400 by other means, such as gluing. The embodiment of the present application does not limit the position and number of the mounting regions 225.

In one implementation, piezoceramic assembly 200 further includes an FPC230 for connecting like polarity electrodes of adjacent piezoceramic's 210 in each row of piezoceramic array. That is, one FPC230 is disposed between every two adjacent piezoelectric ceramics 210. Hereinafter, the connection relationship between FPC230 and piezoelectric ceramic 210 will be described by taking first piezoelectric ceramic 2110 and second piezoelectric ceramic 2120 provided adjacently as an example.

FPC230 may include first connection region 231 and second connection region 232 for connecting first piezoelectric ceramic 2110 and second piezoelectric ceramic 2120, respectively. For example, as shown in fig. 2, an FPC230 is provided between the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120, the FPC230 including a first connection region 231 and a second connection region 232, the first connection region 231 and the second connection region 232 being used to connect the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120, respectively. That is, the first connection region 231 of the FPC230 is used to connect the first electrode and the second electrode of the first piezoelectric ceramics 2110, and the second connection region 232 is used to connect the first electrode and the second electrode of the second piezoelectric ceramics 2120.

Wherein, optionally, FPC230 may also be configured to include a serpentine, S-shaped, or other curved region to further reduce the coplanarity tolerance between the two piezoceramics 210 that it connects and to absorb shock interference between the two piezoceramics 210.

In one implementation, when two adjacent piezoelectric ceramics 210 are arranged side by side along their length direction (i.e., Y direction), for example, as shown in fig. 2, for a first piezoelectric ceramic 2110 and a second piezoelectric ceramic 2120, along their length direction, a first electrode of first piezoelectric ceramic 2110 is connected to a first side of first connection region 231, a second electrode of first piezoelectric ceramic 2110 is connected to a second side of first connection region 231, a first electrode of second piezoelectric ceramic 2120 is connected to a second side of second connection region 232, and a second electrode of second piezoelectric ceramic 2120 is connected to a first side of second connection region 232.

Specifically, the FPC230 makes electrical connection with the electrodes of the piezoelectric ceramics 210 through the conductive material. As shown in fig. 2, the conductive material 233A on the first connection region 231 of the FPC230 is used to connect the first electrode of the first piezoelectric ceramic 2110 with the FPC230, the conductive material 233A on the second connection region 232 is used to connect the first electrode of the second piezoelectric ceramic 2120 with the FPC230, the conductive material 233B in the first connection region 231 is used to connect the second electrode of the first piezoelectric ceramic 2110 with the FPC230, and the conductive material 233B in the second connection region 232 is used to connect the second electrode of the second piezoelectric ceramic 2120 with the FPC 230. The first electrode is a positive electrode and the second electrode is a negative electrode, or the first electrode is a negative electrode and the second electrode is a positive electrode.

As can be seen from fig. 2, the first electrode of the first piezoelectric ceramic 2110 and the first electrode of the second piezoelectric ceramic 2120 are connected to the inner side of the first connection region 231 and the inner side of the second connection region 232, respectively, by the conductive material 233A; the second electrode of the first piezoelectric ceramic 2110 and the second electrode of the second piezoelectric ceramic 2120 are connected to the outside of the first connection region 231 and the outside of the second connection region 232, respectively, via the conductive material 233B. Here, as shown in fig. 2, the inner side of the first connection region 231 is a side close to the second connection region 232, the outer side of the first connection region 231 is a side far from the second connection region 232, the inner side of the second connection region 232 is a side close to the first connection region 231, and the outer side of the second connection region 232 is a side far from the first connection region 231.

As shown in fig. 7 (a), taking adjacent first piezoelectric ceramic 2110 and second piezoelectric ceramic 2120 as an example, based on a conventional arrangement, in order to make conduction between first electrodes a of first piezoelectric ceramic 2110 and second piezoelectric ceramic 2120 and conduction between second electrodes B of first piezoelectric ceramic 2110 and second piezoelectric ceramic 2120, the length of FPC230 in the Y direction should be at least greater than L1; however, in the connection manner of the present application as shown in fig. 7 (B), in order to make the conduction between the first electrodes a of the first piezoelectric ceramics 2110 and the second piezoelectric ceramics 2120 and the conduction between the second electrodes B of the first piezoelectric ceramics 2110 and the second piezoelectric ceramics 2120 under the condition that the pitches between the first piezoelectric ceramics 2110 and the second piezoelectric ceramics 2120 are equal, the length of the FPC230 in the Y direction should be at least larger than L2, and L1 is significantly smaller than L2. Therefore, when the adjacent piezoelectric ceramics 210 are fixed on the FPC230 along the length direction thereof, the first electrodes of the same polarity of the adjacent piezoelectric ceramics 210 are connected at positions close to each other on the FPC230, and the second electrodes of the same polarity are connected at positions away from each other on the FPC230, and by this arrangement, the area of the FPC230, particularly the area in the Y direction, can be reduced, thereby reducing the cost and saving the space.

Several other possible implementations of the piezoelectric ceramic assembly 200 shown in fig. 3 to 6 are described below, in which the piezoelectric ceramic assembly 200 of fig. 3 to 6 includes a first piezoelectric ceramic 2110 and a second piezoelectric ceramic 2120.

As shown in fig. 3 to 6, the substrate 220 includes a first fixing region 2211, a second fixing region 2212, and a flexible region 222, the first fixing region 2211 and the second fixing region 2212 are respectively used for disposing the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120, and the flexible region 222 is used for connecting the first fixing region 2211 and the second fixing region 2212, so that the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120 are commonly fixed to the substrate 220, and is used for absorbing vibration interference between the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120.

First piezoelectric ceramic 2110 and second piezoelectric ceramic 2120 may be attached to lower surfaces of first fixing area 2211 and second fixing area 2212, respectively, by an adhesive layer.

The first and

second fixing regions

2211 and 2212, and the flexible region 222 between the first and

second fixing regions

2211 and 2212 are integral and are all part of the substrate 220. That is, the first fixing area 2211, the second fixing area 2212, and the flexible area 222 therebetween are integrally formed. The first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120 are fixed to the first fixing region 2211 and the second fixing region 2212, respectively, the area of the first piezoelectric ceramic 2110 may be smaller than or equal to the area of the first fixing region 2211, and the area of the second piezoelectric ceramic 2120 may be smaller than or equal to the area of the second fixing region 2212.

Since the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120 are respectively disposed on the first fixing region 2211 and the second fixing region 2212 of the substrate 220, and the first fixing region 2211 and the second fixing region 2212 are connected by the flexible region 222, the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120 are commonly fixed on the substrate 220, and the tolerance of coplanarity between the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120 and the vibration interference between the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120 can be absorbed by the flexible region 222, so that the performance of the touch pad 10 is improved. Meanwhile, when the piezoelectric ceramic element 200 is subjected to a long-term pressure, the flexible region 222 on the substrate 220 can reduce the risk of microcracks caused by excessive deformation of the piezoelectric ceramic, and improve the service life of the touch panel.

The first fixed region 2211 and the second fixed region 2212 are connected by a flexible structure 222, and it can be understood that the flexible region 222 belongs to a part of the substrate 200, and is used for forming flexible connection between the adjacent first fixed region 2211 and second fixed region 2212, namely, a connection mode which allows a certain range of displacement of a connection part in some directions. Thus, when the flexible connection is formed between the first fixing area 2211 and the second fixing area 2212 through the flexible area 222, not only is the constraint generated between the first fixing area 2211 and the second fixing area 2212 allowed, the coplanarity tolerance between the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120 pasted on the first fixing area 2211 and the second fixing area 2212 is reduced, but also a certain displacement amount is allowed between the first fixing area 2211 and the second fixing area 2212, and thus the vibration interference between the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120 is absorbed.

In one implementation, the first and

second fixing regions

2211 and 2212 are respectively located on two first arms 201 of the substrate 220 in the first direction X, wherein each first arm 201 is connected between two second arms 202 of the substrate 220 in the second direction Y through flexible regions 222 at two ends of each first arm 201.

The first direction X is perpendicular to the second direction Y. For example, the first direction X is a width direction of the first piezoelectric ceramics 2110 and the second piezoelectric ceramics 2120, and the second direction Y is a length direction of the first piezoelectric ceramics and the second piezoelectric ceramics. It is to be understood that each of the first piezoelectric ceramics 2110 and the second piezoelectric ceramics 2120 shown in fig. 3 to 6 exemplifies a rectangular piezoelectric ceramic, and the first piezoelectric ceramics 2110 and the second piezoelectric ceramics 2120 are arranged side by side in the first direction X.

In one implementation, one end of the flexible region 222 is connected to one end of the first arm 201, and the other end of the flexible region 222 is connected to one end of the second arm 202 or to a region between the two ends of the second arm 202.

When one end of the flexible region 222 is connected to one end of the first arm 201 and the other end of the flexible region 222 is connected to one end of the second arm 202, for example, as shown in fig. 3, one end of each S-shaped flexible region is connected to one end of the first arm 201 of the substrate 220 and the other end of each S-shaped flexible region is connected to one end of the second arm 202 of the substrate 220.

The first arm 201 is an arm arranged along a first direction, namely the X direction, that is, the first arm 201 is parallel to the Y direction; the second arm 202 is an arm disposed in a second direction, i.e., the Y direction, i.e., the second arm 202 is parallel to the X direction.

When one end of the flexible region 222 is connected to one end of the first arm 201 and the other end of the flexible region 222 is connected to a region between two ends of the second arm 202, in one implementation, the flexible region 222 may be located on the first arm 201 or may also be located on the second arm 202.

For example, as shown in fig. 5, the flexible regions 222 are located on the second arm 202, and the forward direction of the S-shape is the first direction X, wherein one end of each S-shaped flexible region 222 is connected to one end of the first arm 201, and the other end of each S-shaped flexible region 222 is located in a region between the two ends of the second arm 202.

For another example, as shown in fig. 4, the flexible regions 222 are located on the first arm 201, and the forward direction of the S-shape is the second direction Y, wherein one end of each S-shaped flexible region 222 is connected to one end of the second arm 202, and the other end is connected to one end of the second arm 202.

For another example, as shown in fig. 6, the flexible regions 222 are located on the first arm 201, the forward direction of the S-shape is the second direction Y, wherein one end of each S-shaped flexible region 222 is connected to a region between two ends of the second arm 202 of the substrate 220, and the other end is located at one end of the first arm 201 of the substrate 220.

In fig. 3 and 4, the first arm 201 of the substrate 220 is two arms of the substrate 220 disposed along the first direction and located at the edge. In fig. 5 and 6, the first arm 201 of the substrate 220 is two arms of the middle region of the substrate 220. The number and the positions of the first arm 201 and the second arm 202 are not limited in the embodiment of the present application. When the substrate 200 includes a plurality of first arms 201, one or more piezoelectric ceramics may be disposed on each of the first arms 201, and as an example, in the piezoelectric ceramic assembly 200 shown in fig. 5 and 6, two first arms 201 are disposed in a space between two second arms 202, and one piezoelectric ceramic is disposed on each of the first arms 201.

In one implementation, a mount 223 is disposed on the substrate 220, and the mount 223 is used to mount the piezoceramic assembly 200 on a housing 400 used to carry the piezoceramic assembly 200. By way of example, the mounting member 223 shown in FIG. 3 is a nut and thus may be used in conjunction with a screw 224 to mount the piezoceramic assembly 200 on a housing 400 for carrying the piezoceramic assembly 200.

The number and position of the mounting members 223 are not limited in the embodiment of the present application, and as an example, in the piezoelectric ceramic assembly 200 shown in fig. 3 and 4, the mounting members 223 are provided on the second arms 202, and one mounting member 223 is provided at each of both end portions of each of the second arms 202. As an example, in the piezoelectric ceramic assembly 200 shown in fig. 5 and 6, the mounts 223 are provided on the second arms 202, and both end portions of each second arm 202 and a region between both end portions are provided with the mounts 223. At this time, the aforementioned region between both end portions of the second arm 202 may be a region between the adjacent two mounts 223.

For example, as shown in fig. 3 and 4, one FPC230 is disposed between the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120, wherein optionally, the FPC230 may also be disposed in a serpentine, S-shaped, or other bent region to further reduce the coplanarity tolerance between the two piezoelectric ceramics connected thereto and to absorb the shock interference between the two piezoelectric ceramics.

Both ends of FPC230 are used to connect first piezoelectric ceramic 2110 and second piezoelectric ceramic 2120, respectively. That is, one end of the FPC230 is used to connect the first electrode and the second electrode of the first piezoelectric ceramics 2110, and the other end is used to connect the first electrode and the second electrode of the second piezoelectric ceramics 2120.

Specifically, FPC230 makes electrical connection between electrodes of the same polarity of first piezoelectric ceramic 2110 and second piezoelectric ceramic 2120 through a conductive material. As shown in fig. 3 and 4, the conductive material 233A is used to connect the first electrode a of the first piezoelectric ceramic 2110 and the first electrode a of the second piezoelectric ceramic 2120 through the FPC230, and the conductive material 233B is used to connect the second electrode B of the first piezoelectric ceramic 2110 and the second electrode B of the second piezoelectric ceramic 2120 through the FPC 230. The first electrode is a positive electrode and the second electrode is a negative electrode, or the first electrode is a negative electrode and the second electrode is a positive electrode.

Optionally, the FPC230 also has a paste area 234 and pins 235 thereon. For example, as shown in fig. 2, the FPC230 further has an adhesive region 234 and a pin 235 thereon. The pins 235 serve as an interface of the FPC230, and are used to lead out wiring between the FPC230 and other circuits, such as the PCB 533. The adhesive glue on the adhesive area 234 can play a role of pre-fixing in the connection process of the FPC230 and the PCB533, so as to ensure that the pins 235 of the FPC230 can be aligned with the corresponding welding points on the PCB533 for facilitating welding.

The positive electrode and the negative electrode of the piezoelectric ceramic are usually located on different surfaces of the piezoelectric ceramic, and when the positive electrode and the negative electrode of the piezoelectric ceramic are respectively connected to the FPC230, the positive electrode and the negative electrode of the piezoelectric ceramic on different surfaces are guided to the same surface in the embodiment of the present application, so that the connection between the piezoelectric ceramic and the FPC230 is more easily realized in the process.

For example, as shown in fig. 8, taking the first piezoelectric ceramic 2110 as an example, it is assumed that a first surface and a second surface of the first piezoelectric ceramic 2110 are a lower surface and an upper surface of the first piezoelectric ceramic 2110 shown in fig. 2 to 6, respectively. The first electrodes A of the first piezoelectric ceramics 2110 are located on the first region 2101 and the second surface of the first piezoelectric ceramics 2110, and the first electrodes A located on the first region 2101 and the second surface are connected by the conductive material 2104 penetrating the first piezoelectric ceramics 2110. The second electrode B is located in a second region 2102 of the first surface of the first piezoelectric ceramic 2110, an insulating material 2103 is disposed between the first electrode a located in the first region 2101 and the second electrode B located in the second region 2102, and the insulating material 2103 is used for spacing the first electrode a and the second electrode B and connecting the first piezoelectric ceramic 2110 and the FPC 230.

The insulating material 2103 may be, for example, an epoxy-based low temperature thermosetting adhesive. Since the adhesion of the conductive material 223A and the conductive material 223B is weak, the insulating material 2103 may be used to separate the electrode a and the electrode B of the first piezoelectric ceramic 2110, and may also improve the adhesion of the first piezoelectric ceramic 2110 and the FPC230 to make up for the lack of the adhesion of the conductive material 233A and the conductive material 233B. Generally, the insulative material 2103 and the conductive material 2104 may be cured together. The conductive material 233A and the conductive material 233B are soldered on the FPC230 through a solder spot 2342 and a solder spot 2341, respectively.

The Conductive material 223A and the Conductive material 223B are, for example, a Conductive silver paste or an Anisotropic Conductive Film (ACF).

The insulating material 2103 may be, for example, an epoxy-based low temperature thermosetting adhesive. Since the adhesion of the conductive material 223A and the conductive material 223B is weak, the insulating material 2103 may be used to separate the electrode a and the electrode B of the first piezoelectric ceramic 2110, and may also improve the adhesion of the first piezoelectric ceramic 2110 and the FPC230 to make up for the lack of the adhesion of the conductive material 233A and the conductive material 233B. Generally, the insulative material 2103 and the conductive material 2104 may be cured together. The via material 233A and the via material 233B are soldered on the FPC230 through a solder joint 2342 and a solder joint 2341, respectively.

Similarly, the first electrode a and the second electrode B of other piezoelectric ceramics may also be connected to the FPC230 in this way.

Generally, two electrodes of the piezoelectric ceramic are respectively located on the upper and lower surfaces of the piezoelectric ceramic, and when the two electrodes of the piezoelectric ceramic are connected to the FPC, the two electrodes need to be respectively led onto the FPC from the upper and lower surfaces of the piezoelectric ceramic by using lead wires, so that the thickness of the piezoelectric ceramic assembly is large. In the embodiment of the present application, the first electrode a on the first surface of the piezoelectric ceramic 210 is guided to the first area 2101 on the second surface through the conductive material 2104, the second area 2102 on the second surface is the second electrode B of the piezoelectric ceramic 210, and the first electrode a of the first area 2101 and the second electrode B of the second area 2102 are isolated on the second surface by the insulating material 2103, so that both electrodes of the piezoelectric ceramic 210 are located on the second surface of the piezoelectric ceramic 210, which facilitates the connection with the FPC230, and reduces the thickness of the piezoelectric ceramic assembly 200.

In one implementation, as shown in fig. 2 to 6, the piezoelectric ceramic assembly 200 further includes a transmission structure 240, the transmission structure 240 is disposed on the substrate 220 and is located on two sides of the substrate 220 respectively with the piezoelectric ceramic, for example, the transmission structure 240 is disposed on two sides of the fixing region of the substrate 220 opposite to the piezoelectric ceramic. The transmission structure 240 may be, for example, a double-sided adhesive plastic, a metal gasket, or an incompressible double-sided adhesive material, and is used for transmitting the pressure input into the piezoelectric ceramic and transmitting the vibration generated by the piezoelectric ceramic.

When the touch assembly 100 is pressed, the transmission structure 240 can transmit the pressing force to the fixed area of the substrate 220, the deformation of the fixed area can drive the piezoelectric ceramic attached to the back surface of the fixed area to generate elastic deformation, and the piezoelectric ceramic generates an electrical signal after being deformed for pressure detection. Then, the piezoelectric ceramic receives the alternating current and generates an electric field in the polarization direction thereof, thereby causing mechanical deformation, which is transmitted to the touch device 100 through the transmission structure 240, thereby driving the touch device 100 to generate vibration.

In one implementation, as shown in fig. 3 to 6, the piezoelectric ceramic component 200 further includes a limiting member 260, such as the attachment alignment mark 260 shown in fig. 3 or the limiting hole shown in fig. 4 to 6, for marking and positioning during the process of mounting the piezoelectric ceramic component 200, so as to ensure the accuracy of assembly.

In one implementation, as shown in fig. 2 to 6, the piezoelectric ceramic assembly 200 may further include a buffer structure 250 disposed on the substrate 220 and located at two sides of the substrate 220 respectively with the plurality of piezoelectric ceramics, wherein the buffer structure 250 is used for absorbing aftershocks generated by the piezoelectric ceramics.

The cushioning structure 250 may be, for example, a foam material with a single-sided adhesive or a double-sided adhesive and having a certain compression resilience ratio, such as a foam material with a compression ratio of 50% and a resilience ratio of 80%. The adhesive may be attached to any position of the substrate 200, such as to the upper surface of the second arm 202 of the substrate 220 as shown in fig. 3 and 4, and to the periphery of the substrate 220 as shown in fig. 5 and 6. The buffer structure 250 is used to absorb the aftershocks generated by the first piezoelectric ceramic 2110 and the second piezoelectric ceramic 2120, so as to reduce the tailing and improve the user experience.

It should be understood that the piezo-ceramic assembly 200 shown in fig. 2-6 may be adapted for different application scenarios. Among them, the piezoelectric ceramic element 200 shown in fig. 2 is more preferably applied to a large-sized touch panel 10. Specifically, by setting the number of rows of piezoelectric ceramics in the piezoelectric ceramic array and the number of piezoelectric ceramics in each row, a piezoelectric ceramic assembly 200 of a larger area can be realized. For example, as shown in fig. 5, in the case of a notebook computer, the housing 400 covers the area under the keyboard, i.e. the entire "chin area", so that the recess, i.e. the first mounting surface 401, on the housing 400 has a larger area to accommodate the piezoelectric ceramic element 200 with a larger area. The piezoelectric ceramics are arranged in an array manner and uniformly distributed on the lower surface of the touch pad 10 in the functional region 501, so that the large-sized touch pad 10 can realize a pressure feedback function in the whole area, and a vibration effect is improved. More preferably, the piezoelectric ceramic element 200 shown in fig. 3 to 6 is suitable for use in a small-to-medium-sized touch panel 10. For example, as shown in fig. 9, taking a notebook computer as an example, the housing 400 covers a partial Area under the keyboard, and the Area of the partial Area is, for example, equal to or slightly larger than the size of a functional Area of the touch pad 100, i.e., the size of an Active Area (AA Area), and the functional Area 501 is a touch Area of a user. The first piezoelectric ceramics 2110 and the second piezoelectric ceramics 2120 are symmetrically distributed on the lower surface of the touch pad 10 in the functional region 501, so that the small and medium-sized touch pad 10 can achieve a pressure feedback function in the whole area, and a vibration effect is improved.

Fig. 9 to 13 show a touch pad 10 in a possible implementation manner of an embodiment of the present application.

Fig. 9 shows a touch panel 10 having the piezoelectric ceramic device 200 of fig. 2, and fig. 10 is a cross-sectional view of the touch panel 10 of fig. 9 along the X-direction. The specific structure of the piezoelectric ceramic assembly 200 shown in fig. 9 and 10 can refer to fig. 2 and the corresponding description, and no reference and repeated explanation are made here.

Fig. 11 shows a touch panel 10 having the piezoelectric ceramic device 200 of fig. 3, fig. 12 is a cross-sectional view of the touch panel 10 of fig. 11 taken along the X-direction, and fig. 13 shows a mounting position of the touch panel 10 having the piezoelectric ceramic device 200 of fig. 4 in a notebook computer. The specific structure of the piezoelectric ceramic assembly 200 shown in fig. 11 to 13 can refer to fig. 3 to 6 and the corresponding text, and no reference and repeated explanation are made here.

The touch panel 10 includes a touch element 100 and a piezoelectric ceramic element 200. As shown in fig. 11 to 12, the piezoelectric ceramic element 200 is disposed below the touch element 100. The touch assembly 100 includes a protection layer 510, a touch function layer 530 and a limiting layer 540.

The touch function layer 530 is fixed to the lower surface of the protective layer 510 by the adhesive layer 520, and detects touch information input by a user. Specifically, the touch function layer 530 may be attached to the lower surface of the functional region 501 of the protective layer 510. The touch function layer 530 includes, for example, a touch electrode layer 531 and a PCB533, wherein the touch electrode layer 531 and the PCB533 can be connected together by an adhesive layer 532 as shown in fig. 9, or the touch electrode layer 531 can be integrated on the PCB533 as shown in fig. 11 to form the touch function layer 530.

The touch layer electrode layer 531 may be provided with a capacitance detection array made of copper, silver, or ITO material, for example, and when a finger of a user touches the touch pad 10, the capacitance detection array may convert a capacitance signal into a voltage signal and transmit the voltage signal to the control unit of the touch pad 10, so that the control unit may determine the touch operation of the user according to the voltage signal.

Electronic components and circuits can be mounted on the PCB533 for transmitting and processing signals such as touch signals in the touch device 100, pressure and vibration in the piezoelectric ceramic device 200, and the like, so as to implement the function of the touch pad 10. The FPC230 of the piezoelectric ceramic element 200, a control circuit of the piezoelectric ceramic element 200, such as a driving circuit and a boosting circuit, the touch electrode layer 531 of the touch element 100, and the touch chip of the touch element 100, may be connected to or integrated with the PCB 533.

The control circuit of the piezo-ceramic element 200 includes, for example, a driver circuit 340 and a booster circuit 350. When the touch panel 10 has a plurality of piezoelectric ceramics, a plurality of driving circuits 340 corresponding to the plurality of piezoelectric ceramics may be provided, and each driving circuit 340 is configured to detect a pressure input to a corresponding piezoelectric ceramic and drive the corresponding piezoelectric ceramic to generate a vibration. Hereinafter, the related driving circuit 340 and the boosting circuit 350 will be described by taking the first piezoelectric ceramic 2110 as an example.

Fig. 14 shows a driving circuit 340 of the first piezoelectric ceramic 2110, and the driving circuit 340 is connected to two electrodes of the first piezoelectric ceramic 2110 for detecting a pressure input to the first piezoelectric ceramic 2110 and driving the first piezoelectric ceramic 2110 to generate a vibration. As shown in fig. 14, the PD1 can output a high level or a low level, where when the PD1 is at the high level, the switches Q1 and Q2 are turned on, a high voltage signal VH is applied to the first piezoelectric ceramic 2110, VH may be equal to 105V to 420V, for example, and the first piezoelectric ceramic 2110 generates vibration according to the inverse piezoelectric effect; when the PD1 is at a low level, the switches Q1 and Q2 are turned off, if the first piezoelectric ceramic 2110 is under pressure, a potential difference is generated between two poles of the first piezoelectric ceramic 2110 according to a positive piezoelectric effect, after the resistors R3 and R6 divide the voltage, the AD interface detects the voltage signal PF1, and detects the pressure borne by the first piezoelectric ceramic 2110 according to the voltage signal PF 1.

The boosting circuit 350 includes a voltage generation circuit 351 and a charge pump circuit 352. The voltage generating circuit 351 is used for generating a first voltage, and the charge pump circuit 352 is connected between the voltage generating circuit 351 and the driving circuit 340 and is used for receiving the first voltage and outputting a second voltage to the driving circuit 340, wherein the second voltage is greater than the first voltage, and the second voltage is used for driving the piezoelectric ceramic to generate vibration.

As shown in fig. 15, the voltage generating circuit 351 may adopt a BOOST topology, for example, wherein GATE is a high-frequency digital Pulse Width Modulation (PWM) signal output by the voltage generating circuit 351 for controlling the transistor Q3 to be turned on and off, so as to BOOST the input voltage VIN to VOUT by using an inductor L1. VIN is typically 3.3V to 5V, for example, and VOUT may be equal to 105V, for example.

As shown in fig. 16, the charge pump circuit 352 is connected between the voltage generation circuit 351 and the drive circuit 340, and the VH power supply in the drive circuit 340 shown in fig. 14 is connected to the output terminal thereof, so as to supply the second voltage, which is a large voltage capable of vibrating the piezoelectric ceramic, to the drive circuit 340. Specifically, the charge pump circuit 352 is configured to receive a first voltage, i.e., VOUT, and output the second voltage to the driving circuit 340, which may be, for example, 210V, 315V, 420V, etc.

The limiting layer 540 may be, for example, a single-sided adhesive-backed film, and is attached to the lower surface of the protection layer 510, the touch electrode layer 331, or the PCB 531, especially the lower surface of the long-side area, for limiting the deformation of the touch panel 10.

The piezo ceramic element 200 may be fixed to the first mounting surface 401 of the housing 400 by the mounting element 223. For example, as shown in fig. 9 and 10, the piezoelectric ceramic assembly 200 is fixed to the first mounting surface 401 of the housing 400 by the engagement of the nut 223 and the screw 224. Further, optionally, the protective layer 510 may be adhered to the second mounting surface 402 of the housing 400 by an adhesive layer 550, and the adhesive layer 550 may buffer the pressing force on the touch pad 10 in addition to being used for fixing the touch assembly 100 to the housing 400.

For another example, as shown in fig. 11 to 13, the piezoelectric ceramic element 200 is fixed to the first mounting surface 401 of the case 400 by fitting a nut 223 to a screw 224. Referring to the housing 400 in fig. 13, a positioning post 404 is disposed on the first mounting surface 401 for cooperating with the limiting hole 260 on the substrate 220 to perform the functions of marking and positioning. An insertion hole 405 on the first mounting surface 401 is used to receive a mounting member 223, such as a nut, on the substrate 220. The avoidance zone 402 is used to avoid the flexible region 220, and the avoidance zone 403 is used to avoid the piezoelectric ceramic.

The Adhesive layer 520, the Adhesive layer 532, the Adhesive layer 550, the Adhesive layer 234, the Adhesive layer between the piezoelectric ceramic and the substrate, and the like are, for example, a mesh double-sided tape, an Optically Clear Adhesive (OCA) or glue, so as to reduce an air gap between the adhered components and ensure the transmission quality of signals.

The embodiment of the present application also provides an electronic device, which includes the touch pad 10 in the various embodiments of the present application.

By way of example and not limitation, the electronic device in the embodiments of the present application may be a portable or mobile computing device such as a terminal device, a mobile phone, a tablet computer and its accessory keyboard, a notebook computer, a desktop computer, a game device, an in-vehicle electronic device or a wearable smart device, and other electronic devices such as an electronic database, an automobile, and an Automated Teller Machine (ATM). This wearable smart machine includes that the function is complete, the size is big, can not rely on the smart mobile phone to realize complete or partial functional equipment, for example smart watch or smart glasses etc to and include only be concentrated on a certain kind of application function and need with other equipment like the equipment that the smart mobile phone cooperation was used, for example all kinds of intelligent bracelet, intelligent ornament etc. that carry out the physical sign monitoring.

It should be noted that, without conflict, the embodiments and/or technical features in the embodiments described in the present application may be arbitrarily combined with each other, and the technical solutions obtained after the combination also fall within the protection scope of the present application.

It should be understood that the specific examples in the embodiments of the present application are for the purpose of promoting a better understanding of the embodiments of the present application, and are not intended to limit the scope of the embodiments of the present application, and that various modifications and variations can be made by those skilled in the art based on the above embodiments and fall within the scope of the present application.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a touch-control board, its characterized in that, includes piezoceramics subassembly and touch-control subassembly, piezoceramics subassembly pastes to be fixed the below of touch-control subassembly, the touch-control subassembly includes printed circuit board PCB and sets up touch electrode layer on the PCB board, touch electrode layer is used for touching or pressing at the finger the touch-control board time detects the touch information of finger to output corresponding touch-sensitive signal, piezoceramics subassembly is used for detecting finger touches or presses the pressure that produces during the touch-control board and output with the vibrations that the pressure corresponds, in order to provide tactile feedback to the user, piezoceramics subassembly includes:

a piezoelectric ceramic array; and the number of the first and second groups,

the substrate comprises a plurality of fixing areas and a flexible area positioned between adjacent fixing areas, wherein the flexible area is in a snake shape or an S shape, the fixing areas and the flexible area are integrally formed to form the substrate, the piezoelectric ceramics in the piezoelectric ceramic array are respectively adhered to the fixing areas so as to be jointly fixed on the substrate, and the flexible area is connected with the adjacent fixing areas so as to absorb vibration interference between the piezoelectric ceramics on the adjacent fixing areas.

2. The touch pad of claim 1, wherein the substrate further comprises a mounting region located between the adjacent fixing regions, wherein two ends of the mounting region are respectively connected to the adjacent fixing regions through the two flexible regions, and the mounting region is provided with a mounting member for mounting the piezoelectric ceramic component on a housing for carrying the piezoelectric ceramic component.

3. The touch panel of claim 2, wherein the piezoelectric ceramic assembly further comprises a flexible circuit board (FPC) for connecting electrodes of the same polarity of adjacent piezoelectric ceramics.

4. The touch pad of claim 3, wherein the adjacent piezoelectric ceramics comprise a first piezoelectric ceramic and a second piezoelectric ceramic, the first piezoelectric ceramic and the second piezoelectric ceramic being arranged side by side along a length direction thereof,

FPC includes first connection region and second connection region, wherein, follows length direction, first piezoceramics's first electrode is connected first connection region's first side, first piezoceramics's second electrode is connected first connection region's second side, second piezoceramics's first electrode is connected second connection region's second side, second piezoceramics's second electrode is connected second connection region's first side.

5. The touch panel according to any one of claims 1 to 4, wherein the plurality of fixing regions includes a first fixing region and a second fixing region adjacent to each other for disposing a first piezoelectric ceramic and a second piezoelectric ceramic, respectively,

the first fixing region and the second fixing region are respectively located on two first arms in a first direction of the substrate, wherein each first arm is connected between two second arms in a second direction of the substrate through the flexible regions at two ends of each first arm, and the first direction is perpendicular to the second direction.

6. The touch panel of claim 5, wherein the first direction is a length direction of the first piezoelectric ceramic and the second piezoelectric ceramic, and the second direction is a width direction of the first piezoelectric ceramic and the second piezoelectric ceramic, and the first piezoelectric ceramic and the second piezoelectric ceramic are arranged side by side along the second direction.

7. The touchpad as defined in claim 5, wherein one end of the flexible region is connected to one end of the first arm and the other end of the flexible region is connected to one end of the second arm or to a region between the two ends of the second arm.

8. The trackpad of claim 5, wherein the flexible region is located on the first arm or on the second arm.

9. The touchpad as claimed in claim 5, wherein the piezoelectric ceramic assembly further comprises an FPC for connecting electrodes of the same polarity of the first piezoelectric ceramic and the second piezoelectric ceramic.

10. The trackpad of claim 5, wherein the substrate has a mounting member disposed thereon for mounting the piezo-ceramic element to a housing for carrying the piezo-ceramic element.

11. The touch panel according to any one of claims 1 to 4, wherein the first electrode of each piezoelectric ceramic is located on a first area and a second area of the first surface of each piezoelectric ceramic, and the first electrodes located on the first area and the second surface are connected to each other through a conductive material penetrating through each piezoelectric ceramic,

the second electrode of each piezoelectric ceramic is located in a second area of the first surface of each piezoelectric ceramic, an insulating material is arranged between the first electrode located in the first area and the second electrode located in the second area, and the insulating material is used for separating the first electrode located in the first area and the second electrode located in the second area and connecting each piezoelectric ceramic and the FPC.

12. The touch pad of any one of claims 1-4, wherein the piezoceramic assembly further comprises:

the transmission structure is arranged on the substrate and is respectively positioned on two sides of the substrate together with the piezoelectric ceramics, and the transmission structure is used for transmitting and inputting the pressure of the piezoelectric ceramics and the vibration generated by the piezoelectric ceramics.

13. The touch pad of any one of claims 1-4, wherein the piezoceramic assembly further comprises:

and the buffer structure is arranged on the substrate and is respectively positioned at two sides of the substrate together with the piezoelectric ceramics, and the buffer structure is used for absorbing aftershocks generated by the piezoelectric ceramics.

14. The touch panel of any one of claims 1 to 4, wherein the touch assembly further comprises a protective layer and a limiting layer, the PCB is adhered to the lower surface of the protective layer, and the limiting layer is adhered to the protective layer or the lower surface of the PCB so as to limit the deformation of the PCB.

15. The touch pad of any one of claims 1 to 4, wherein the PCB comprises:

the driving circuit is connected with the piezoelectric ceramics and used for detecting the pressure input into the piezoelectric ceramics and driving the piezoelectric ceramics to generate vibration; and (c) a second step of,

the booster circuit comprises a voltage generation circuit and a charge pump circuit, wherein the voltage generation circuit is used for generating a first voltage, the charge pump circuit is connected between the voltage generation circuit and the drive circuit and is used for receiving the first voltage and outputting a second voltage to the drive circuit, and the second voltage is greater than the first voltage and is used for driving the piezoelectric ceramic to generate vibration.

16. An electronic device, comprising:

the touch panel of any one of claims 1 to 15, comprising a piezoelectric ceramic element and a touch element; and the number of the first and second groups,

the casing, the casing has the holding tank, the holding tank has first assembly surface, the piezoceramics subassembly passes through the installed part, installs first assembly surface.

17. The electronic device of claim 16, wherein the housing further has a second mounting surface located at a peripheral region of the receiving groove, and the touch sensing assembly is fixed to the second mounting surface by an adhesive layer.