CN113777163A - Sensing device for frequency test - Google Patents
Sensing device for frequency test Download PDFInfo
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- CN113777163A CN113777163A CN202111221332.9A CN202111221332A CN113777163A CN 113777163 A CN113777163 A CN 113777163A CN 202111221332 A CN202111221332 A CN 202111221332A CN 113777163 A CN113777163 A CN 113777163A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/045—Analysing solids by imparting shocks to the workpiece and detecting the vibrations or the acoustic waves caused by the shocks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/12—Analysing solids by measuring frequency or resonance of acoustic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
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- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
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- G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
- G01N29/42—Detecting the response signal, e.g. electronic circuits specially adapted therefor by frequency filtering or by tuning to resonant frequency
Abstract
The present application relates to a sensing device for frequency testing. The device includes: the PCB board is arranged on the analog circuit and the transducer on the PCB board; the PCB is provided with a welding position, the transducer is arranged on the welding position in an SMT mode, the transducer is electrically connected with the analog circuit, the back surface of the PCB is provided with a back adhesive, and the PCB is adhered to one side of a measured object through the back adhesive; and the PCB is also provided with an MCU, and the MCU is electrically connected with the analog circuit and is used for processing the signals transmitted by the transducer. The scheme that this kind of a sensing device for frequency test, components and parts direct integration such as transducer, analog line, MCU on same PCB, simple to operate can satisfy high integration characteristic, can reduce installation space for product miniaturization and frivolousization more.
Description
Technical Field
The application relates to the technical field of sensors, in particular to a sensing device for frequency testing.
Background
In the related art, the consumer electronics market has made higher demands on the high integration and the light weight of products, and meanwhile, the light weight, the miniaturization and the compactness of electronic products such as mobile intelligent terminals and personal PCs have correspondingly increased demands on the complexity of industrial processing. At present, the sensor is independently installed on a PCB (printed circuit board), integration is not realized, more components are required to be installed to realize the required functions, and a larger installation space and more complicated assembling procedures are required during the whole device.
Disclosure of Invention
For overcoming the problem that exists among the prior art, this application provides a sensing device for frequency test, this kind of sensing device for frequency test with components and parts direct integration such as transducer, analog line, MCU on same PCB board, simple to operate can satisfy high integration characteristic, can reduce installation space for product miniaturization and frivolousization more.
A first aspect of the present application provides a sensing device for frequency testing, comprising: the PCB board is arranged on the analog circuit and the transducer on the PCB board; the PCB is provided with a welding position, the transducer is arranged on the welding position in an SMT mode, the transducer is electrically connected with the analog circuit, the back surface of the PCB is provided with a back adhesive, and the PCB is adhered to one side of a measured object through the back adhesive; and the PCB is also provided with an MCU, and the MCU is electrically connected with the analog circuit and is used for processing the signals transmitted by the transducer.
Preferably, the test method comprises the following steps:
s1, the transducer generates a voltage, current or charge analog signal after receiving the appointed action;
s2, the signal processing module collects the analog signal of the transducer;
s3, converting the analog signal into a digital signal through the ADC;
s4, transmitting the digital signal to the MCU, and analyzing by the digital control system to obtain the frequency of the object to be measured;
and S5, identifying the material of the object to be measured according to the frequency of the object to be measured.
Preferably, in S4, the digital control system analyzes, pre-stores the value of the identification characteristic peak in the system, compares the detected characteristic peak of the object to be measured with the value of the identification characteristic peak in the system, and identifies the material of the object to be measured according to the frequency of the object to be measured.
Preferably, in S2, after acquiring the analog signal on the transducer, filtering, amplifying and impedance converting are performed.
Preferably, in S1, the object is impacted, the object is vibrated to generate a frequency, the frequency is transmitted to the transducer, and the transducer is operated to generate an analog signal of voltage, current or charge after receiving the frequency.
Preferably, the transducer is provided with a piezoelectric ceramic piece, the outer side of the piezoelectric ceramic piece is respectively provided with a positive electrode and a negative electrode which are arranged on the same side, and the positive electrode and the negative electrode are respectively provided with a first bonding pad and a second bonding pad.
Preferably, the transducer is connected with an analog line, the analog line is provided with a first amplifier, a first capacitor, a first resistor and an ADC converter, impedance conversion is performed through an operational amplifier, a digital signal is obtained through an ADC after signal amplification, and the signal amplification is adjusted by adjusting a capacitance value of the first capacitor and a resistance value of the first resistor.
Preferably, a filtering circuit is arranged before or after the signal is amplified to remove unnecessary noise; the filtered signal is re-amplified through a secondary amplification circuit, the amplification gain is adjusted and controlled through the proportional value of a second resistor and a third resistor, and the gained analog signal is converted into a digital signal through an ADC (analog to digital converter).
Preferably, a second amplifier, the second resistor and the third resistor are arranged on the secondary amplification line, the first amplifier is connected with the second amplifier, and the second amplifier is connected with the ADC converter.
Preferably, the thickness of the back adhesive is more than 0.05 mm, and the back adhesive is a hard adhesive.
The technical scheme provided by the application can comprise the following beneficial effects: this kind of a sensing device for frequency test directly integrates components and parts such as transducer, analog line, MCU on same PCB, and simple to operate can satisfy high integration characteristic, can reduce installation space for product miniaturization and frivolousization more.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application, as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.
FIG. 1 is a schematic structural diagram of a transducer of a sensing device for frequency testing according to an embodiment of the present application;
FIG. 2 is a schematic diagram of another structure of a transducer of a sensing device for frequency measurement according to an embodiment of the present application;
fig. 3 is a schematic flowchart illustrating a testing method of a sensing device for frequency testing according to an embodiment of the present application;
FIG. 4 is a schematic circuit diagram of an analog circuit of a sensing device for frequency measurement according to an embodiment of the present application;
FIG. 5 is another schematic circuit diagram of an analog circuit of a sensing device for frequency testing according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of an electronic device shown in an embodiment of the present application.
Detailed Description
Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of a transducer of a sensing device for frequency testing according to an embodiment of the present application; fig. 2 is another schematic structural diagram of a transducer of a sensing device for frequency testing according to an embodiment of the present application.
Referring to fig. 1 and 2, a sensing apparatus for frequency testing includes: the PCB board, the analog circuit and the transducer which are arranged on the PCB board; the PCB is provided with a welding position, the transducer is arranged on the welding position in an SMT mode and is electrically connected with the analog circuit, the back surface of the PCB is provided with a back adhesive, and the PCB is adhered to one side of a measured object through the back adhesive; the PCB is also provided with an MCU which is electrically connected with the analog circuit and used for processing signals transmitted by the transducer. This a sensing device for frequency test, with transducer and MCU all integrated on the PCB board, realize that the module integrates, small-size, the transducer passes through SMT's mode setting on welding position simultaneously, simple to operate saves installation space simultaneously, does benefit to miniaturized design. In addition, MCU, analog circuit, transducer all integrate at the PCB board, directly paste this PCB board near the testee or around just can directly use for this a sensing device for frequency test has realized the modularization, has integrated, easily installation, has solved the painful point and the difficult point among the prior art. The sensing device for frequency testing is mainly used for object frequency detection testing, such as impact testing or vibration testing and other testing structure devices which generate object vibration frequency.
Fig. 3 is a flowchart illustrating a testing method of a sensing device for frequency testing according to an embodiment of the present application.
Referring to fig. 3, a sensing apparatus for frequency testing includes a testing method of:
s1, the transducer generates an analog signal of voltage, current or charge after receiving the specified action.
And S2, acquiring the analog signal of the transducer by the signal processing module.
S3, the analog signal is converted into a digital signal by the ADC.
And S4, transmitting the digital signal to the MCU, and analyzing by the digital control system to obtain the frequency of the object to be measured.
And S5, identifying the material of the impact object according to the frequency of the object to be measured.
In S4, the digital control system analyzes, pre-stores the value of the identification characteristic peak in the system, compares the detected characteristic peak of the object to be measured with the value of the identification characteristic peak in the system, and identifies the material of the object to be measured according to the frequency of the object to be measured.
In S2, after the analog signal on the transducer is acquired, filtering, amplifying and impedance converting are performed.
In S1, the object is impacted, the object is vibrated to generate a frequency, the frequency is transmitted to the transducer, and the transducer receives the frequency and starts to work to generate an analog signal of voltage, current or charge.
When an ultrasonic transducer generates an ultrasonic signal, a piezoelectric effect is used in which a piezoelectric ceramic is vibrated by applying an electric signal having a reverse pulse or an ac waveform. In this case, the frequency of the pulse wave or the ac waveform is preferably set to a natural frequency at which the piezoelectric ceramic can resonate. When the ultrasonic transducer receives an acoustic wave signal having a natural frequency, the ultrasonic transducer resonates with the received acoustic wave signal to vibrate. A phenomenon of converting such vibration into an electric signal and detecting the electric signal is called inverse piezoelectric effect. The transducer of the sensing device for frequency test is an ultrasonic transducer and works by utilizing the inverse piezoelectric effect principle. When the object to be measured is impacted, the object to be measured vibrates to generate vibration frequency, the sound wave signal of the vibration frequency is received by the ultrasonic transducer, the ultrasonic transducer and the received sound wave signal generate resonance vibration, the vibration is converted into an electric signal, and an analog signal is output. The analog signal is filtered, amplified and impedance-converted, the analog signal is filtered, the noise is removed, and a useful signal is extracted. The filtered signal is converted to a digital signal by the ADC. The converted digital signal is transmitted to the MCU for signal processing, the MCU is provided with a digital control system for analyzing the digital signal and obtaining the frequency of the object to be measured, thereby judging the material of the object impacting the object to be measured. And the numerical value of the identification characteristic peak is prestored on the MCU, the detected characteristic peak of the measured object and the numerical value of the identification characteristic peak in the system are compared and analyzed, and the material of the impact object is identified according to the frequency of the measured object.
Referring to fig. 1 and 2, in some embodiments, a piezoelectric ceramic plate 1 is disposed on the transducer, a positive electrode 2 and a negative electrode 3 disposed on the same side surface are disposed on the outer side of the piezoelectric ceramic plate 1, and a first bonding pad 5 and a second bonding pad 4 are disposed on the positive electrode 2 and the negative electrode 3, respectively. The first pads 5 and the second pads 4 solder the transducer directly to the PCB board. The surface of the piezoelectric ceramic sheet 1 is also printed with green oil for protection, and is packaged by a braid.
When voltage is applied to the piezoelectric ceramic plate, the transducer generates mechanical deformation along with the change of the voltage and the frequency. When the piezoelectric ceramic plate is vibrated, an electric charge is generated. When an electric signal is applied to the piezoelectric ceramic sheet, ultrasonic waves are emitted due to bending vibration. The ultrasonic signal is converted into an analog signal through an analog circuit, the analog signal is subjected to amplification processing after being filtered or is subjected to filtering processing after being amplified, the processed analog signal is converted into a digital signal through an analog-to-digital converter (ADC), the digital signal is subjected to processing analysis of a Micro Control Unit (MCU), the frequency of the digital signal is identified, and a result is obtained by comparing the frequency with an identification characteristic peak prestored on the MCU.
FIG. 4 is a schematic circuit diagram of an analog circuit of a sensing device for frequency measurement according to an embodiment of the present application; fig. 5 is another circuit schematic diagram of an analog circuit of a sensing device for frequency testing according to an embodiment of the present application.
Referring to fig. 4, in some embodiments, the transducer is connected to an analog line, the analog line is provided with a first amplifier, a first capacitor, a first resistor, and an ADC converter, impedance conversion is performed by an operational amplifier, a signal is amplified, and then the signal is processed by an ADC to obtain a digital signal, and the amplification of the signal is adjusted by adjusting a capacitance value of the first capacitor and a resistance value of the first resistor. The signal is analog signal when starting oscillation, filtering and frequency division, the analog signal path is short, and the signal can be quickly converted into digital signal by the ADC, and the anti-interference performance is strong compared with the existing method.
Referring to fig. 5, in some embodiments, a filtering line is disposed before or after the signal is amplified, so as to perform unnecessary noise removal on the signal, improve the signal-to-noise ratio, and improve the accuracy of identification. The filtered signal is re-amplified through a secondary amplification circuit, the amplification gain is adjusted and controlled through the proportional value of a second resistor and a third resistor, and the gained analog signal is converted into a digital signal through an ADC (analog to digital converter). And a second amplifier, a second resistor and a third resistor are arranged on the secondary amplification circuit, the first amplifier is connected with the second amplifier to realize secondary amplification of signals, and the second amplifier is connected with the ADC. The signal that the transducer sent carries out impedance conversion through fortune, and signal amplification back obtains digital signal through high accuracy analog-to-digital converter ADC converter, and the regulation is carried out through the resistance of adjusting the appearance value of first electric capacity and first resistance to the enlargeing accessible of signal. Before or after the signal is amplified, a filtering circuit can be added to remove unnecessary noise; the signals can be re-amplified through a secondary amplification circuit after being filtered, the amplification gain can be adjusted and controlled through the proportional value of the second resistor and the third resistor, the analog signals after being gained are subjected to digital signals through a high-precision analog-to-digital converter (ADC), the MCU is used for carrying out intelligent algorithm to process characteristic frequency signals generated by different substances of the MCU, and the substances are measured in different frequencies.
Before or after the signal is amplified, a filtering circuit is arranged to remove unnecessary noise, so that the signal-to-noise ratio is improved. A high-pass filter circuit or a low-pass filter circuit is generally used. In some embodiments, a low-pass filter is disposed in the low-pass filtering circuit, and the low-pass filter implements a band-pass function, and reduces energy loss and suppresses high-frequency harmonic components and system noise. Meanwhile, the signal to noise ratio is improved, in some embodiments, corresponding noise spectrums, such as periodic noise, impulse noise and the like, are identified and eliminated through algorithm up-conversion subtraction, and useful signals are identified and extracted.
Use the gum to paste the PCB board near the measured object or around can directly use this a sensing device for frequency test, need not carry out installation or debugging again, convenient to use person's use, the scope that is suitable for simultaneously is wider, can use after the personnel that do not need the specialty debug, can directly use after ordinary masses purchase the product. The thickness of the back adhesive is greater than 0.05 mm, the back adhesive is a hard adhesive, and in some embodiments, the hardness of the hard adhesive is greater than 80D.
With regard to the apparatus in the above-described embodiment, the specific manner in which each module performs the operation has been described in detail in the embodiment related to the method, and will not be elaborated here.
Fig. 6 is a schematic structural diagram of an electronic device shown in an embodiment of the present application.
Referring to fig. 6, the electronic device 1000 includes a memory 1010 and a processor 1020.
The Processor 1020 may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components, etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory 1010 may include various types of storage units, such as system memory, Read Only Memory (ROM), and permanent storage. Wherein the ROM may store static data or instructions that are needed by the processor 1020 or other modules of the computer. The persistent storage device may be a read-write storage device. The persistent storage may be a non-volatile storage device that does not lose stored instructions and data even after the computer is powered off. In some embodiments, the persistent storage device employs a mass storage device (e.g., magnetic or optical disk, flash memory) as the persistent storage device. In other embodiments, the permanent storage may be a removable storage device (e.g., floppy disk, optical drive). The system memory may be a read-write memory device or a volatile read-write memory device, such as a dynamic random access memory. The system memory may store instructions and data that some or all of the processors require at runtime. Further, the memory 1010 may include any combination of computer-readable storage media, including various types of semiconductor memory chips (DRAM, SRAM, SDRAM, flash memory, programmable read-only memory), magnetic and/or optical disks, among others. In some embodiments, memory 1010 may include a removable storage device that is readable and/or writable, such as a Compact Disc (CD), a read-only digital versatile disc (e.g., DVD-ROM, dual layer DVD-ROM), a read-only Blu-ray disc, an ultra-density optical disc, a flash memory card (e.g., SD card, min SD card, Micro-SD card, etc.), a magnetic floppy disc, or the like. Computer-readable storage media do not contain carrier waves or transitory electronic signals transmitted by wireless or wired means.
The memory 1010 has stored thereon executable code that, when processed by the processor 1020, may cause the processor 1020 to perform some or all of the methods described above.
The aspects of the present application have been described in detail hereinabove with reference to the accompanying drawings. In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. Those skilled in the art should also appreciate that the acts and modules referred to in the specification are not necessarily required in the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application may be sequentially adjusted, combined, and deleted according to actual needs, and the modules in the device of the embodiment of the present application may be combined, divided, and deleted according to actual needs.
Furthermore, the method according to the present application may also be implemented as a computer program or computer program product comprising computer program code instructions for performing some or all of the steps of the above-described method of the present application.
Alternatively, the present application may also be embodied as a non-transitory machine-readable storage medium (or computer-readable storage medium, or machine-readable storage medium) having stored thereon executable code (or a computer program, or computer instruction code) which, when executed by a processor of an electronic device (or electronic device, server, etc.), causes the processor to perform part or all of the various steps of the above-described method according to the present application.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the applications disclosed herein may be implemented as electronic hardware, computer software, or combinations of both.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems and methods according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. A sensing device for frequency testing, comprising:
the PCB board is arranged on the analog circuit and the transducer on the PCB board;
the PCB is provided with a welding position, the transducer is arranged on the welding position in an SMT mode, the transducer is electrically connected with the analog circuit, the back surface of the PCB is provided with a back adhesive, and the PCB is adhered to one side of a measured object through the back adhesive;
and the PCB is also provided with an MCU, and the MCU is electrically connected with the analog circuit and is used for processing the signals transmitted by the transducer.
2. The sensing device for frequency test according to claim 1, wherein the test method is as follows:
s1, the transducer generates a voltage, current or charge analog signal after receiving the appointed action;
s2, the signal processing module collects the analog signal of the transducer;
s3, converting the analog signal into a digital signal through the ADC;
s4, transmitting the digital signal to the MCU, and analyzing by the digital control system to obtain the frequency of the object to be measured;
and S5, identifying the material of the object to be measured according to the frequency of the object to be measured.
3. The sensing device for frequency measurement according to claim 2, wherein the digital control system analyzes in S4, pre-stores the value of the identification characteristic peak in the system, compares the detected characteristic peak of the object to be measured with the value of the identification characteristic peak in the system, and identifies the material of the object to be measured according to the frequency of the object to be measured.
4. A sensing device for frequency testing according to claim 2, wherein: in S2, after the analog signal on the transducer is acquired, filtering, amplifying and impedance converting are performed.
5. A sensing device for frequency testing according to claim 2, wherein: in S1, the object is impacted, the object is vibrated to generate a frequency, the frequency is transmitted to the transducer, and the transducer receives the frequency and starts to work to generate an analog signal of voltage, current or charge.
6. The sensing device for frequency testing according to claim 1, wherein: the energy converter is provided with a piezoelectric ceramic piece, the outer side of the piezoelectric ceramic piece is respectively provided with a positive electrode and a negative electrode which are arranged on the same side face, and the positive electrode and the negative electrode are respectively provided with a first bonding pad and a second bonding pad.
7. The sensing device for frequency testing according to claim 1, wherein: the energy converter is connected with an analog circuit, a first amplifier, a first capacitor, a first resistor and an ADC (analog to digital converter) are arranged on the analog circuit, impedance conversion is carried out through operational amplifier, a digital signal is obtained through the ADC after the signal is amplified, and the amplification of the signal is adjusted by adjusting the capacitance value of the first capacitor and the resistance value of the first resistor.
8. The sensing device for frequency testing according to claim 7, wherein: before or after the signal is amplified, a filtering circuit is arranged to remove unnecessary noise; the filtered signal is re-amplified through a secondary amplification circuit, the amplification gain is adjusted and controlled through the proportional value of a second resistor and a third resistor, and the gained analog signal is converted into a digital signal through an ADC (analog to digital converter).
9. The sensing device for frequency testing according to claim 8, wherein: and a second amplifier, a second resistor and a third resistor are arranged on the secondary amplification circuit, the first amplifier is connected with the second amplifier, and the second amplifier is connected with the ADC.
10. The sensing device for frequency testing according to claim 1, wherein: the thickness of gum is greater than 0.05 millimeter, the gum is the ebonite.
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| CN202111221332.9A CN113777163A (en) | 2021-10-20 | 2021-10-20 | Sensing device for frequency test |
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| CN202111221332.9A CN113777163A (en) | 2021-10-20 | 2021-10-20 | Sensing device for frequency test |
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Citations (8)
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