CN113771108A - Device and method for removing back plate of photovoltaic module - Google Patents
Device and method for removing back plate of photovoltaic module Download PDFInfo
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- CN113771108A CN113771108A CN202111056967.8A CN202111056967A CN113771108A CN 113771108 A CN113771108 A CN 113771108A CN 202111056967 A CN202111056967 A CN 202111056967A CN 113771108 A CN113771108 A CN 113771108A
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 115
- 238000005520 cutting process Methods 0.000 claims abstract description 60
- 238000000227 grinding Methods 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims description 23
- 238000007493 shaping process Methods 0.000 claims description 12
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 238000011144 upstream manufacturing Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 7
- 229910052710 silicon Inorganic materials 0.000 abstract description 7
- 239000010703 silicon Substances 0.000 abstract description 7
- 238000011084 recovery Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/125—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis for thin material, e.g. for sheets, strips or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
- B29C53/16—Straightening or flattening
- B29C53/18—Straightening or flattening of plates or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention discloses a device for removing a back plate of a photovoltaic module, which comprises: a frame; the assembly conveying mechanism is arranged on the rack and used for conveying the photovoltaic assembly on the back plate along a first direction; the backboard thickness measuring mechanism is arranged below the component conveying mechanism and used for detecting the backboard thickness of the passing photovoltaic component; and the cutting mechanism is arranged above the component conveying mechanism, is arranged at the downstream of the backboard thickness measuring mechanism in the first direction, and is used for grinding and cutting the backboard of the photovoltaic component passing below according to the thickness of the backboard measured by the backboard thickness measuring mechanism. The invention also discloses a method for removing the back plate of the photovoltaic module. According to the invention, the photovoltaic module is transmitted in a mode that the back plate faces upwards, the thickness of the back plate of the passing photovoltaic module is firstly detected, and then the back plate of the passing photovoltaic module below is ground and cut according to the detected thickness of the back plate, so that the back plate can be accurately removed, the silicon battery layer is not damaged, no harmful gas is generated in the process, the environment is protected, and the removal efficiency is high.
Description
Technical Field
The invention relates to the technical field of photovoltaic cell recovery, in particular to a device and a method for removing a back plate of a photovoltaic module.
Background
With the continuous reduction of the photovoltaic power generation cost and the increase of the energy conservation and emission reduction pressure in China, the assembly machine loading amount in China increases year by year, and with the fact that the photovoltaic assemblies which are put into use at an early stage reach the service life, a large number of photovoltaic assemblies are going to be retired, and more waste assemblies are generated. Aluminum frames, silicon battery pieces, copper, tin, precious metal silver and the like in the photovoltaic module have considerable recovery value and economic profit, and on the other hand, reasonable recovery can reduce damage to the ecological environment, so that the recovery and utilization of the waste photovoltaic module have great significance in the aspects of environmental protection and resource recovery.
For the treatment of the retired photovoltaic module, a burying and burning method is mainly adopted. However, the back plate material in the photovoltaic module contains a large amount of fluorine elements, and if the back plate material is directly buried or incinerated, a large amount of harmful substances are generated, so that the damage to the ecological environment and the human body is serious. Therefore, the back plates of the retired photovoltaic modules need to be separated in advance, and for a general method for peeling the back plates of the retired photovoltaic modules, the photovoltaic modules are heated firstly, and then the back plates are torn by a mechanical method, so that the back plates are separated. When the method is adopted for heating, a fluorine-containing back plate still emits a large amount of harmful gas, and the silicon battery layer is easily damaged in the tearing process, so that a photovoltaic module back plate removing mode which is green and environment-friendly and does not damage the silicon battery layer needs to be developed.
Disclosure of Invention
In view of the defects in the prior art, the invention provides a device and a method for removing a back plate of a photovoltaic module, which can remove the back plate on the premise of not damaging a silicon battery layer, do not generate harmful gas, are green and environment-friendly and have high removal efficiency.
In order to achieve the purpose, the invention adopts the following technical scheme:
a photovoltaic module backsheet removal apparatus comprising:
a frame;
the assembly conveying mechanism is arranged on the rack and used for conveying the photovoltaic assembly on the back plate along a first direction;
the backboard thickness measuring mechanism is arranged below the component conveying mechanism and used for detecting the backboard thickness of the passing photovoltaic component;
and the cutting mechanism is arranged above the assembly conveying mechanism, is arranged at the downstream of the back plate thickness measuring mechanism in the first direction, and is used for grinding and cutting the back plate of the photovoltaic assembly passing below according to the thickness of the back plate measured by the back plate thickness measuring mechanism.
As one embodiment, the back plate removing device of the photovoltaic module further comprises a feed amount adjusting mechanism, and the feed amount adjusting mechanism is connected with the cutting mechanism and is used for gradually adjusting the cutting depth of the cutting mechanism along the vertical direction according to the thickness of the back plate measured by the back plate thickness measuring mechanism.
As one embodiment, the cutting mechanism includes a spiral cutter and a cutter holder, the spiral cutter is rotatably disposed on the cutter holder, the cutter holder is disposed on a side portion of the frame, and the feed amount adjusting mechanism is connected to the cutter holder to adjust a height of the cutter holder.
As one embodiment, the feed amount adjusting mechanism includes a motor and a screw rod driven by the motor, the screw rod is inserted into the tool holder and is in threaded fit with the tool holder, and the tool holder is driven by the motor to move along the axial direction of the screw rod.
As one of the implementation modes, the cutting mechanism further comprises a belt pulley and a belt, and the belt is sleeved on the rotating shaft of the spiral cutter and the belt pulley at the same time so as to drive the spiral cutter to rotate at a high speed through the belt pulley.
As one embodiment, the photovoltaic module back plate removing device further comprises a flattening and shaping mechanism, the flattening and shaping mechanism comprises two flattening rollers, the two flattening rollers are respectively arranged on the upstream side of the back plate thickness measuring mechanism and the downstream side of the cutting mechanism in the first direction and are located right above the transmission path, so as to flatten the passing photovoltaic module.
As one of the implementation modes, the flattening and shaping mechanism further comprises a pressing plate, and two ends of the pressing plate are respectively connected with the roll shafts of the two flattening rollers so as to flatten the photovoltaic module passing through the lower portion of the pressing plate.
As one embodiment, the flattening and shaping mechanism further comprises two lifting assemblies, one end of each lifting assembly is fixed relative to the frame, and the other end of each lifting assembly is used for controlling the height of the corresponding flattening roller.
Another object of the present invention is to provide a method for removing a back sheet of a photovoltaic module, comprising:
transporting the photovoltaic module on the backsheet in a first direction;
detecting the thickness of the back plate of the passing photovoltaic module;
and grinding and cutting the back plate of the photovoltaic module passing below according to the measured thickness of the back plate.
As one embodiment, the step of grinding and cutting the back sheet of the photovoltaic module passing below according to the measured thickness of the back sheet comprises:
and gradually adjusting the cutting depth along the vertical direction according to the measured thickness of the back plate.
According to the invention, the photovoltaic module is transmitted in a mode that the back plate faces upwards, the thickness of the back plate of the passing photovoltaic module is firstly detected, and then the back plate of the passing photovoltaic module below is ground and cut according to the detected thickness of the back plate, so that the back plate can be accurately removed, the silicon battery layer is not damaged, no harmful gas is generated in the process, the environment is protected, and the removal efficiency is high.
Drawings
Fig. 1 is a schematic structural diagram of a device for removing a back plate of a photovoltaic module according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for removing a back plate of a photovoltaic module according to an embodiment of the present invention.
Detailed Description
In the present invention, the terms "disposed", "provided" and "connected" are to be understood in a broad sense. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
The terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like, are used in an orientation or positional relationship indicated in the drawings for convenience in describing the application and for simplicity of description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, an embodiment of the present invention provides a back plate removing device for a photovoltaic module, including a rack 1, a module conveying mechanism 2, a back plate thickness measuring mechanism 3, and a cutting mechanism 4, where the rack 1 is used as a support of the whole device and is used to be placed on a fixed platform or the ground, and the module conveying mechanism 2 is disposed on the rack 1 and is used to convey the photovoltaic module on the back plate along a first direction. The backboard thickness measuring mechanism 3 is arranged below the component conveying mechanism 2 and used for detecting the backboard thickness of the passing photovoltaic component, the cutting mechanism 4 is arranged above the component conveying mechanism 2 and is arranged at the downstream of the backboard thickness measuring mechanism 3 in the first direction and used for grinding and cutting the backboard of the passing photovoltaic component according to the backboard thickness measured by the backboard thickness measuring mechanism 3. In the actual cutting process, the thickness of the cut photovoltaic module is equal to or slightly larger than the thickness of the back plate, so that the back plate can be completely removed, and the silicon cell layer cannot be cut.
As shown in fig. 1, the first direction is a direction from left to right, and the photovoltaic module is fed from the left side, sequentially passes through the back plate thickness measuring mechanism 3 and the cutting mechanism 4, and then is discharged from the right side. It will be appreciated that the module feeding means 2 may be arranged continuously in this first direction, i.e. the module feeding means 2 is continuous at both the back plate thickness measuring means 3 and the cutting means 4. Preferably, a conveying roller is used as the component conveying mechanism 2, and the axial direction of the conveying roller is perpendicular to the first direction and also perpendicular to a guard plate (not shown) which provides a rotating fulcrum for the conveying roller on two sides of the machine frame 1. The frame 1 of this embodiment also has a support frame at the bottom, rollers at the bottom of the support frame, and a brake mechanism, which can conveniently move and position the backboard removing device.
In order to accurately control the cutting depth of the cutting mechanism 4, the back plate removing device further comprises a feed amount adjusting mechanism 5, wherein the feed amount adjusting mechanism 5 is connected with the cutting mechanism 4 and used for gradually adjusting the cutting depth of the cutting mechanism 4 along the vertical direction according to the thickness of the back plate measured by the back plate thickness measuring mechanism 3 in the cutting process, so that the back plate is removed in a layered mode.
Specifically, the cutting mechanism 4 of the present embodiment employs a spiral cutter, which includes a spiral cutter 41 and a cutter holder 42, two ends of the spiral cutter 41 are rotatably disposed on the cutter holder 42, the cutter holder 42 is disposed on the inner side or the outer side of the frame 1, the spiral cutter 41 faces the component conveying mechanism 2 downward relative to the cutter holder 42, and the feed amount adjusting mechanism 5 is connected to the cutter holder 42 to adjust the height of the cutter holder 42. Alternatively, the feed amount adjusting mechanism 5 includes a motor and a screw rod (not shown) driven by the motor, a through hole (not shown) with an internal thread is formed in the tool holder 42, the screw rod is inserted into the tool holder 42 and is in threaded fit with the tool holder 42, and the tool holder 42 is driven by the motor to move along the axial direction of the screw rod. The present embodiment shows a case where the motor is fixed to the bottom of the frame 1 and the screw rod extends upward above the component conveying mechanism 2, and the screw rod should not physically intersect with the component conveying mechanism 2 to avoid unnecessary interference, for example, the screw rod may be disposed outside the component conveying mechanism 2 in the width direction.
It is understood that the cutter holder 42 has arms supporting the spiral cutter 41 to rotate at both axial ends, and the screw of the feed amount adjusting mechanism 5 may be provided only on one side of the cutter holder 42 (a guard plate near the frame 1) or may be provided on both sides of the cutter holder 42, and when the screw is provided only on one side of the cutter holder 42, a slide rail guiding the movement of the cutter holder 42 in the vertical direction may be specially designed.
The spiral cutter 41 needs to be rotated at a high speed to achieve cutting of the back plate. Optionally, the cutting mechanism 4 further includes a belt pulley 43 and a belt 44, and the belt 44 is simultaneously sleeved on the rotating shaft of the spiral cutter 41 and the belt pulley 43, so that the spiral cutter 41 can be driven to rotate at a high speed by the operation of the belt pulley 43.
The back plate thickness measuring mechanism 3 may use a light sensor such as infrared light or laser to determine the distance from the object by emitting light toward the object above and detecting the reflected light signal. Because the photovoltaic module of this embodiment is placed with backplate up, cover plate glass mode down in transmission process, and detection light can directly pass cover plate glass and shine the backplate internal surface, through surveying the distance D between backplate thickness measurement mechanism 3 and the clamp plate 62, can obtain the initial cutting position of cutter cutting, through the distance that detects backplate thickness measurement mechanism 3 to backplate internal surface, can determine the maximum depth of cutter cutting.
Considering that the retired photovoltaic module itself may not be flat, if the thickness of the back plate is directly measured, a large deviation may occur, resulting in inaccurate cutting thickness, and for this reason, the back plate removing device of the present embodiment further includes a flattening and shaping mechanism 6. The flattening and shaping mechanism 6 at least comprises two flattening rollers 61, and the two flattening rollers 61 are respectively arranged on the upstream side (left side in fig. 1) of the back plate thickness measuring mechanism 3 and the downstream side (right side in fig. 1) of the cutting mechanism 4 in the first direction and are located right above the transmission path to flatten the passing photovoltaic modules. Therefore, before the photovoltaic module enters the back plate thickness measuring mechanism 3, the flattening roller 61 on the upstream side is matched with the module conveying mechanism 2 below in the rolling process, and the photovoltaic module in the middle is flattened and conveyed towards the downstream; when the photovoltaic module moves to the position below the cutting mechanism 4, the thickness of the photovoltaic module is uniform, so that the cutting depth of the photovoltaic module by the cutting mechanism 4 is kept consistent everywhere, and the cutting effect is ensured; after the photovoltaic module cutting is completed, the cutting mechanism 4 is lifted, the photovoltaic module is flattened again between the flattening roller 61 on the downstream side and the module conveying mechanism 2, and the photovoltaic module at the discharge port is guaranteed to have good flatness.
Furthermore, the flattening and shaping mechanism 6 of the present embodiment may further include a pressing plate 62, two ends of the pressing plate 62 are respectively connected to the roller shaft ends of the two flattening rollers 61, the connection manner may be a hinged connection, and the lower surface of the pressing plate is substantially tangent to the lowest point of the flattening rollers 61 so as to be flush, so that the photovoltaic module passing through the lower surface of the pressing plate can be flattened. The flattening and shaping mechanism 6 may specifically include two lifting assemblies 60, one end of each lifting assembly 60 is fixed opposite to the frame 1, and the other end is used for controlling the height of the corresponding flattening roller 61.
The lifting assembly 60 specifically can include the cylinder, baffle and slider, two baffles are fixed respectively on the both sides backplate of frame 1, the cylinder can be fixed in frame 1, be located the below of subassembly conveying mechanism 2, the tip at the cylinder is fixed to the slider, and can be along the guide rail longitudinal movement of baffle under the drive of cylinder piston, the roller shaft tip of flattening roller 61 then rotates with the slider that corresponds to change the subassembly conveying mechanism 2's with the below distance under the drive of slider, adjust and compress tightly the degree.
In the process of controlling the height of the flattening roller 61, the height of the pressing plate 62 is changed, and since the backboard thickness measuring mechanism 3 is over against the pressing plate 62 above, when the photovoltaic module does not enter the thickness measuring area but is pressed by the pressing plate 62, the thickness measured by the backboard thickness measuring mechanism 3 is the distance D between the backboard thickness measuring mechanism 3 and the pressing plate 62; when the photovoltaic module enters the thickness measuring area and is pressed by the pressing plate 62, the thickness measured by the backboard thickness measuring mechanism 3 is the distance D between the backboard thickness measuring mechanism 3 and the backboard, and finally the distance D measured at the last time is subtracted by the distance D measured at the last time, so that the thickness of the backboard is obtained. Wherein, clamp plate 62 can adopt the fretwork design, can remove after flattening moreover, has both played the effect of flattening, can not influence the cutting process again. Therefore, the pressing plate 62 can play a role in auxiliary measurement of the thickness of the back plate, and can also be used for auxiliary flattening of the photovoltaic assembly after thickness measurement, so that the effect of one object with multiple purposes is achieved, and materials are saved.
As shown in fig. 2, the present invention also provides a method for removing a back sheet of a photovoltaic module, including:
and S01, conveying the photovoltaic module on the back plate along the first direction.
And S02, detecting the thickness of the back plate of the passing photovoltaic module.
In the process of detecting the thickness of the back plate of the passing photovoltaic module, the position of the upper surface of the photovoltaic module and the thickness of the back plate can be detected.
Before the photovoltaic module enters the backboard thickness measuring mechanism 3, the flattening roller 61 on the upstream side is matched with the module conveying mechanism 2 below in the rolling process to flatten the photovoltaic module in the middle and convey the photovoltaic module towards the downstream. In the process, the downstream flattening rollers 61 also synchronously act, and the height of the pressing plate 62 is changed accordingly, so that the photovoltaic module is pressed, and when the photovoltaic module does not enter a thickness measuring area but is pressed by the pressing plate 62, the thickness measured by the backboard thickness measuring mechanism 3 is the distance D between the backboard thickness measuring mechanism 3 and the pressing plate 62, and the distance D is the determination reference of the upper surface position of the photovoltaic module. When the photovoltaic module enters the thickness measuring area and is pressed by the pressing plate 62, the thickness measured by the backboard thickness measuring mechanism 3 is the distance D between the backboard thickness measuring mechanism 3 and the backboard, and finally the distance D measured at the last time is subtracted by the distance D measured at the last time, so that the thickness of the backboard is obtained.
And S03, grinding and cutting the back plate of the photovoltaic module passing below according to the measured thickness of the back plate.
When the photovoltaic module advances below the cutting mechanism 4, the feed amount adjusting mechanism 5 controls the height of the cutting mechanism 4 to be positioned at an initial cutting position (for example, determined according to the distance D above), and then, according to the thickness of the back plate, the back plate is cut layer by feeding for multiple times until the back plate is completely removed; after the photovoltaic module is cut, the feed amount adjusting mechanism 5 controls the cutting mechanism 4 to lift up, and the photovoltaic module is continuously transmitted; when the photovoltaic module is transported to pass under the downstream-side flattening roller 61, the downstream-side flattening roller 61 presses down, and also brings the pressing plate 62 to press the downstream portion of the photovoltaic module again, and the photovoltaic module is flattened again between the downstream-side flattening roller 61 and the module transport mechanism 2.
In the process of grinding and cutting the back plate of the photovoltaic module passing below according to the measured thickness of the back plate, the cutting depth is gradually adjusted along the vertical direction according to the measured thickness of the back plate after the initial position of the cutting mechanism 4 is positioned according to the pressing position (namely the upper surface position of the photovoltaic module) of the pressing plate measured by the back plate thickness measuring mechanism 3 in advance, so that the accuracy of the cutting precision can be realized.
The foregoing is directed to embodiments of the present application and it is noted that numerous modifications and adaptations may be made by those skilled in the art without departing from the principles of the present application and are intended to be within the scope of the present application.
Claims (10)
1. A photovoltaic module's backplate remove device which characterized in that includes:
a frame (1);
the assembly conveying mechanism (2) is arranged on the rack (1) and is used for conveying the photovoltaic assembly on the back plate along a first direction;
the backboard thickness measuring mechanism (3) is arranged below the component conveying mechanism (2) and used for detecting the backboard thickness of the passing photovoltaic component;
and the cutting mechanism (4) is arranged above the component conveying mechanism (2), is arranged at the downstream of the backboard thickness measuring mechanism (3) in the first direction, and is used for grinding and cutting the backboard of the photovoltaic component passing below according to the backboard thickness measured by the backboard thickness measuring mechanism (3).
2. The photovoltaic module back plate removing device according to claim 1, further comprising a feed amount adjusting mechanism (5), wherein the feed amount adjusting mechanism (5) is connected to the cutting mechanism (4) and is used for gradually adjusting the cutting depth of the cutting mechanism (4) along the vertical direction according to the back plate thickness measured by the back plate thickness measuring mechanism (3).
3. The photovoltaic module back plate removing device according to claim 2, wherein the cutting mechanism (4) comprises a spiral cutter (41) and a cutter holder (42), the spiral cutter (41) is rotatably arranged on the cutter holder (42), the cutter holder (42) is arranged on the side of the rack (1), and the feed amount adjusting mechanism (5) is connected with the cutter holder (42) to adjust the height of the cutter holder (42).
4. The photovoltaic module back plate removing device according to claim 3, wherein the feed amount adjusting mechanism (5) comprises a motor and a screw rod driven by the motor, the screw rod is arranged in the knife rest (42) in a penetrating manner and is in threaded fit with the knife rest (42), and the knife rest (42) is driven by the motor to move along the axial direction of the screw rod.
5. The photovoltaic module back plate removing device according to claim 3, wherein the cutting mechanism (4) further comprises a belt pulley (43) and a belt (44), and the belt (44) is simultaneously sleeved on the rotating shaft of the spiral cutter (41) and the belt pulley (43) so as to drive the spiral cutter (41) to rotate at a high speed through the belt pulley (43).
6. The device for removing the back plate of the photovoltaic module according to any one of claims 1 to 5, further comprising a flattening and shaping mechanism (6), wherein the flattening and shaping mechanism (6) comprises two flattening rollers (61), and the two flattening rollers (61) are respectively arranged on the upstream side of the back plate thickness measuring mechanism (3) and the downstream side of the cutting mechanism (4) in the first direction and are located right above the conveying path so as to flatten the passing photovoltaic module.
7. The device for removing the back plate of the photovoltaic module according to claim 6, wherein the flattening and shaping mechanism (6) further comprises a pressing plate (62), and two ends of the pressing plate (62) are respectively connected with the roll shafts of the two flattening rolls (61) to flatten the photovoltaic module passing below the pressing plate.
8. The method for removing the back plate of the photovoltaic module according to claim 7, wherein the flattening and shaping mechanism (6) further comprises two lifting assemblies (60), one end of each lifting assembly (60) is fixed opposite to the machine frame (1), and the other end is used for controlling the height of the corresponding flattening roller (61).
9. A method for removing a back plate of a photovoltaic module is characterized by comprising the following steps:
transporting the photovoltaic module on the backsheet in a first direction;
detecting the thickness of the back plate of the passing photovoltaic module;
and grinding and cutting the back plate of the photovoltaic module passing below according to the measured thickness of the back plate.
10. The method of claim 9, wherein the step of abrasive cutting the photovoltaic module backsheet passing thereunder based on the measured thickness of the backsheet comprises:
and gradually adjusting the cutting depth along the vertical direction according to the measured thickness of the back plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111056967.8A CN113771108A (en) | 2021-09-09 | 2021-09-09 | Device and method for removing back plate of photovoltaic module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111056967.8A CN113771108A (en) | 2021-09-09 | 2021-09-09 | Device and method for removing back plate of photovoltaic module |
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| CN202111056967.8A Pending CN113771108A (en) | 2021-09-09 | 2021-09-09 | Device and method for removing back plate of photovoltaic module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116314411A (en) * | 2023-05-17 | 2023-06-23 | 赫里欧新能源有限公司 | Folding photovoltaic board encapsulation backplate |
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2021
- 2021-09-09 CN CN202111056967.8A patent/CN113771108A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116314411A (en) * | 2023-05-17 | 2023-06-23 | 赫里欧新能源有限公司 | Folding photovoltaic board encapsulation backplate |
| CN116314411B (en) * | 2023-05-17 | 2023-08-01 | 赫里欧新能源有限公司 | Folding photovoltaic board encapsulation backplate |
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Effective date of registration: 20220722 Address after: 810008 No. 43, Wusi West Road, Chengxi District, Xining City, Qinghai Province Applicant after: Huanghe Hydropower Development Co., Ltd. Applicant after: CHANGSHA RESEARCH INSTITUTE OF MINING AND METALLURGY Co.,Ltd. Address before: No.20, Kunlun East Road, Xining Economic and Technological Development Zone, Xining City, Qinghai Province Applicant before: PHOTOVOLTAIC INDUSTRY TECHNOLOGY BRANCH OF QINGHAI HUANGHE HYDROPOWER DEVELOPMENT Co.,Ltd. Applicant before: YELLOW RIVER HYDROPOWER PHOTOVOLTAIC INDUSTRY TECHNOLOGY Co.,Ltd. Applicant before: Huanghe Hydropower Development Co., Ltd. Applicant before: HUANGHE HYDROPOWER DEVELOPMENT Co.,Ltd. |