CN113770563A - LCP flexible circuit board's laser drilling device - Google Patents
LCP flexible circuit board's laser drilling device Download PDFInfo
- Publication number
- CN113770563A CN113770563A CN202111323197.9A CN202111323197A CN113770563A CN 113770563 A CN113770563 A CN 113770563A CN 202111323197 A CN202111323197 A CN 202111323197A CN 113770563 A CN113770563 A CN 113770563A
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- China
- Prior art keywords
- movable
- plate
- flexible circuit
- rod
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005553 drilling Methods 0.000 title claims abstract description 30
- 238000004140 cleaning Methods 0.000 claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 238000005406 washing Methods 0.000 claims description 12
- 238000001125 extrusion Methods 0.000 claims description 10
- 230000009471 action Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 239000000428 dust Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 241000510097 Megalonaias nervosa Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser drilling device for LCP flexible circuit boards, which belongs to the field of drilling equipment and comprises a bottom machine body, wherein an upper machine body is arranged at the upper part of the bottom machine body, a laser is arranged at the side position of the upper machine body, a laser head is arranged at the lower part of the laser, a side machine body is arranged at the side position of the bottom machine body, an axial adjusting frame is arranged on the side machine body, an adjusting workbench is arranged on the axial adjusting frame, and a first mounting plate is arranged at the side surface of the adjusting workbench. According to the laser drilling device for the LCP flexible circuit board, the workpiece replacing mechanism is arranged, so that the interval time for processing the workpiece can be shortened, the working efficiency is improved, the mounted and taken-down workpieces can be separated, the labor division of workers is facilitated, the proficiency is improved, and the cleaning mechanism can be used for cleaning in the process of replacing the workpiece, so that the time is saved, and the cleaning effect is better.
Description
Technical Field
The invention relates to the field of drilling devices, in particular to a laser drilling device for LCP flexible circuit boards.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good bending property.
The existing laser drilling device, such as the publication CN208556370U, discloses a laser drilling device for LCP flexible circuit board, which can effectively adapt to the change of laser transmission position by arranging a first reflector and a second reflector with adjustable positions, the vibrating mirror and the workbench can realize the free change of three directions, and can be used for drilling circuit boards with various specifications and models, the installation of a suction device can suck away the dust on the workbench, improve the working environment on the workbench, and improve the yield of workpiece processing, but in practical use, a worker places the circuit board on the workbench after the processing is completed, and then processes the next flexible circuit board, wherein the circuit board is fixedly installed, so that the interval time between two workpieces is prolonged, the working efficiency is reduced, and the dust is adsorbed by the suction device, however, the suction device on the worktable is not easy to suck at dead angle, and dust is slowly accumulated on the worktable.
Disclosure of Invention
The invention mainly aims to provide a laser drilling device for LCP flexible circuit boards, which can effectively solve the problems in the background art.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a LCP flexible circuit board's laser drilling device, includes the bottom organism, the upper portion position of bottom organism is provided with the upper portion organism, the side position of upper portion organism is provided with the laser instrument, the lower part position of laser instrument is provided with the laser head, the side position of bottom organism is provided with the side organism, be provided with the axial alignment jig on the side organism, be provided with the regulation workstation on the axial alignment jig, the regulation workstation side is provided with the mounting panel No. one, the side position of mounting panel No. one is provided with side mounting panel, its characterized in that: be provided with the work piece on the mounting panel and change mechanism, work piece is changed mechanism and is included a swing table, No. two swing tables, No. two movable rods, bottom cardboard and activity fixed head, a swing table, No. two swing tables are through circular connector and No. two movable rod fixed mounting, No. two movable rods and bottom cardboard fixed mounting, activity fixed head and bottom cardboard movable mounting, be provided with wiper mechanism on the mounting panel of side, wiper mechanism includes side cleaning plate, side gyro wheel and washs the pole, side gyro wheel and side cleaning plate movable mounting, wash pole and side cleaning plate movable mounting.
Preferably, the lower extreme of No. two movable rods is provided with the movable rod No. one, bottom cardboard and movable rod fixed mounting No. one, circular connector and No. two movable rod movable mounting, the side fixed mounting of a swing table, No. two swing tables and a circular connector, and a swing table and No. two swing tables are located same straight line, the upper end position of No. two movable rods is provided with upper portion and rotates the head, be provided with a spring on the movable rod, and a spring is located the below position of a mounting panel.
Preferably, a bottom support plate is arranged below the bottom clamping plate, a side connecting rod is arranged at the side position of the bottom support plate and is fixedly mounted with the first mounting plate through the side connecting rod, an upper limiting plate is arranged on the side connecting rod, and the upper limiting plate is located above the bottom clamping plate.
Preferably, the side position of bottom cardboard is provided with the draw-in groove No. one, be provided with the side fixing clip body in the bottom sprag pad, the activity fixing head is located the top position of the side fixing clip body, the equal movable mounting of activity fixing clip body can be in the draw-in groove No. one, the side position of the side fixing clip body is provided with the side mount, movable mounting has two stripper bars on the side mount, stripper bar and activity fixing clip fixed mounting, be provided with inside limiting plate on the stripper bar, be provided with No. two springs in the side position that lies in inside limiting plate on the stripper bar, No. two springs, inside limiting plate all are located the side mount.
Preferably, the side cleaning plate is movably mounted with the side mounting plate through a fixing bolt, and a locking nut is arranged on the fixing bolt.
Preferably, the side position of side cleaning plate is provided with two side rotor plates, be provided with No. two bearings on the side rotor plate, be provided with the side dwang in No. two bearings, side gyro wheel and side dwang fixed mounting.
Preferably, the outer end position of side cleaning plate is provided with two rear portion mounting panels, be provided with No. three bearings in the rear portion mounting panel, wash pole movable mounting at No. three bearings, be provided with a plurality of washing brush hair on the washing pole.
Preferably, the outer end position of side dwang is provided with the action wheel, the position that corresponds the action wheel on the washing pole is provided with from the driving wheel, the action wheel with from being provided with the drive belt on the driving wheel.
Compared with the prior art, the invention has the following beneficial effects:
the first movable worktable is adjusted to the lower position of the laser head through the arranged workpiece replacing mechanism and the axial adjusting frame, then one circuit board is placed on the first movable workbench, the laser is started to work, meanwhile, the other circuit board is placed on the second movable workbench, when the circuit board on the first movable workbench is processed, the processed workpiece is taken out, then the upper rotating head is rotated, so that the workpiece placed on the second movable workbench is rotated to the position below the laser head for processing, a new workpiece is placed on the first movable workbench rotated to the side position again to wait for the next rotation, the structure shortens the interval duration between the two workpieces, improves the working efficiency, can separate the workpieces which are installed and taken out, is beneficial to the division of labor work of workers, and improves the working proficiency;
through the wiper mechanism who sets up, after the work piece has been taken off to the workman, rotate it, thereby make a movable table or No. two movable tables, at the pivoted in-process, from the side wash board top and draw, promote the side gyro wheel through the bottom surface extrusion and roll, thereby make the washing pole of top rotate, it rotates cleanly to drive the washing brush hair, thereby clean the dust on movable table or No. two movable tables, clean effect is better, this mechanism simultaneously, can be at the in-process of the work piece of changing, wash by the way, need not occupy the extra time.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a laser drilling device for LCP flexible circuit board;
FIG. 2 is a schematic structural diagram of a workpiece replacing mechanism of a laser drilling device for LCP flexible circuit boards;
FIG. 3 is a schematic structural diagram of a side fixing frame of a laser drilling device for LCP flexible circuit boards;
FIG. 4 is a schematic structural diagram of a bottom clamping plate of the laser drilling device for LCP flexible circuit boards;
FIG. 5 is a schematic structural diagram of a side fixing card body of a laser drilling device for LCP flexible circuit board;
FIG. 6 is a schematic diagram of the bottom structure of the cleaning mechanism of the laser drilling device for LCP flexible circuit board;
FIG. 7 is a schematic structural diagram of a side rotating rod of the laser drilling device for LCP flexible circuit board;
FIG. 8 is a schematic structural diagram of a cleaning rod of a laser drilling device for LCP flexible circuit board.
In the figure: 1. a bottom body; 2. an upper body; 3. a laser; 4. a laser head; 5. a side body; 6. an axial adjusting bracket; 7. adjusting the workbench; 8. a first mounting plate; 9. a workpiece replacing mechanism; 10. a side mounting plate; 11. a cleaning mechanism; 12. a first movable rod; 13. a first round connector; 14. a second movable rod; 15. an upper rotating head; 16. a bottom clamping plate; 17. a first spring; 18. a first card slot; 19. a side connecting rod; 20. an upper limiting plate; 21. the side surface is fixed with a clamp body; 22. a side fixing frame; 23. a movable fixed head; 24. an extrusion stem; 25. a second spring; 26. an inner limiting plate; 27. a first movable workbench; 28. a second movable workbench; 29. a bottom support plate; 30. a side cleaning plate; 31. fixing the bolt; 32. locking the nut; 33. a side rotating plate; 34. a side surface rotating rod; 35. a side roller; 36. a rear mounting plate; 37. a cleaning rod; 38. cleaning the bristles; 39. a second bearing; 40. a driving wheel; 41. a third bearing; 42. a driven wheel; 43. a transmission belt.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Example one
As shown in fig. 1-5, a workpiece replacing mechanism of a laser drilling device for LCP flexible circuit board, including a bottom body 1, an upper portion position of the bottom body 1 is provided with an upper portion body 2, a side position of the upper portion body 2 is provided with a laser 3, a lower portion position of the laser 3 is provided with a laser head 4, a side position of the bottom body 1 is provided with a side body 5, the side body 5 is provided with an axial adjusting frame 6, the axial adjusting frame 6 is provided with an adjusting workbench 7, the adjusting workbench 7 is provided with a mounting plate 8 on the side, a side position of the mounting plate 8 is provided with a side mounting plate 10, which is characterized in that: the first mounting plate 8 is provided with a workpiece replacing mechanism 9, the workpiece replacing mechanism 9 comprises a first movable workbench 27, a second movable workbench 28, a second movable rod 14, a bottom clamping plate 16 and a movable fixed head 23, the first movable workbench 27 and the second movable workbench 28 are fixedly mounted with the second movable rod 14 through a first round connector 13, the second movable rod 14 is fixedly mounted with the bottom clamping plate 16, the movable fixed head 23 is movably mounted with the bottom clamping plate 16, the side mounting plate 10 is provided with a cleaning mechanism 11, the cleaning mechanism 11 comprises a side cleaning plate 30, a side roller 35 and a cleaning rod 37, the side roller 35 and the side cleaning plate 30 are movably mounted, the cleaning rod 37 is movably mounted with the side cleaning plate 30, the lower end of the second movable rod 14 is provided with a first movable rod 12, the bottom clamping plate 16 is fixedly mounted with the first movable rod 12, the first round connector 13 is movably mounted with the second movable rod 14, the first movable workbench 27, the second movable workbench 28 and the side surface of the first round connector 13 are fixedly arranged, the first movable workbench 27 and the second movable workbench 28 are positioned on the same straight line, the upper end position of the second movable rod 14 is provided with an upper rotating head 15, the first movable rod 12 is provided with a first spring 17, the first spring 17 is positioned below the first mounting plate 8, a bottom supporting plate 29 is arranged below the bottom clamping plate 16, a side surface connecting rod 19 is arranged at the side surface position of the bottom supporting plate 29 and is fixedly arranged with the first mounting plate 8 through the side surface connecting rod 19, an upper limiting plate 20 is arranged on the side surface connecting rod 19, the upper limiting plate 20 is positioned above the bottom clamping plate 16, a first clamping groove 18 is arranged at the side surface position of the bottom clamping plate 16, a side surface fixing clamping body 21 is arranged on the bottom supporting plate 29, the movable fixing head 23 is positioned above the side surface fixing clamping body 21, the side fixing clamp body 21 and the movable fixing head 23 can be movably arranged in the first clamping groove 18, a side fixing frame 22 is arranged at the side position of the side fixing clamp body 21, two extrusion rods 24 are movably arranged on the side fixing frame 22, the extrusion rods 24 and the movable fixing head 23 are fixedly arranged, an internal limiting plate 26 is arranged on the extrusion rods 24, a second spring 25 is arranged at the side position of the internal limiting plate 26 on the extrusion rods 24, the second spring 25 and the internal limiting plate 26 are both arranged in the side fixing frame 22, the first movable workbench 27 or the second movable workbench 28 is adjusted to the lower position of the laser head 4 through the axial adjusting frame 6, the first movable workbench 27 is temporarily taken as an example, the circuit board is placed on the first movable workbench 27, and when the first movable workbench 27 is positioned below the laser head 4 through the axial adjusting frame 6, then a worker is arranged at the position of the second movable workbench 28 to specially place a workpiece, a worker is arranged at the side position below the laser head 4 to specially take out the workpiece, at the moment, the laser 3 is started to process, after the workpiece on the first movable workbench 27 is processed, the workpiece is taken down, the upper rotating head 15 is pulled up, the first movable rod 12 and the second movable rod 14 are moved upwards, the first movable workbench 27 and the second movable workbench 28 are synchronously moved upwards, the bottom clamping plate 16 below the first movable rod 12 slides upwards on the side fixed clamping body 21 and the movable fixed head 23 through the first clamping groove 18, the first spring 17 is compressed, after being blocked by the upper limiting plate 20, the bottom clamping plate 16 is only mutually installed with the movable fixed head 23, the upper rotating head 15 is rotated, the bottom clamping plate 16 is rotated, and the movable fixed head 23 is extruded, so that the movable fixing head 23 moves towards the side, the movable fixing head 23 slides out of the first clamping groove 18 and slides on the side position of the bottom clamping plate 16, when the first movable workbench 27 rotates to the position of the second movable workbench 28, the movable fixing head 23 is clamped into the first clamping groove 18 of the bottom clamping plate 16 again to fix the first movable workbench 27, the second movable workbench 28 rotates to the position below the laser head 4, then the upper rotating head 15 is released, the compressed first spring 17 is expanded again, the bottom clamping plate 16 is pushed to move downwards, the bottom clamping plate 16 slides downwards to the side fixed clamping body 21, after the bottom surfaces of the first movable workbench 27 and the second movable workbench 28 are contacted with the adjusting workbench 7, the bottom clamping plate 16 stops moving downwards, the laser head 4 processes again, and an installer places a workpiece on the second movable workbench 28, waiting for workpiece replacement.
Example two
As shown in fig. 1 to 5, the same or corresponding components as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and only the differences from the first embodiment will be described below. The second embodiment is different from the first embodiment in that: as shown in fig. 6-8, a cleaning mechanism of a laser drilling device for LCP flexible circuit board, a side cleaning plate 30 is movably mounted with a side mounting plate 10 through a fixing bolt 31, a lock nut 32 is disposed on the fixing bolt 31, two side rotating plates 33 are disposed at side positions of the side cleaning plate 30, a second bearing 39 is disposed on the side rotating plates 33, a side rotating rod 34 is disposed in the second bearing 39, a side roller 35 is fixedly mounted with the side rotating rod 34, two rear mounting plates 36 are disposed at outer end positions of the side cleaning plate 30, a third bearing 41 is disposed in the rear mounting plate 36, a cleaning rod 37 is movably mounted on the third bearing 41, a plurality of cleaning bristles 38 are disposed on the cleaning rod 37, a driving wheel 40 is disposed at an outer end position of the side rotating rod 34, a driven wheel 42 is disposed at a position on the cleaning rod 37 corresponding to the driving wheel 40, driving wheel 40 and driven round 42 are last to be provided with drive belt 43, after work piece processing on movable table 27 is accomplished, take off the labour price, to side pivoted in-process movable table 27 side cleaning plate 30 of crossing the side position, movable table 27's bottom surface can extrude and promote the rotation of side gyro wheel 35, thereby make side dwang 34 rotate, thereby make driving wheel 40 rotate, through drive belt 43 and driven round 42, make washing pole 37 rotate, thereby make washing brush hair 38 on the washing pole 37 rotate, clean a movable table 27 of crossing, thereby make cleaning performance better, do not occupy extra time simultaneously.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The utility model provides a LCP flexible circuit board's laser drilling device, includes bottom organism (1), the upper portion position of bottom organism (1) is provided with upper portion organism (2), the side position of upper portion organism (2) is provided with laser instrument (3), the lower part position of laser instrument (3) is provided with laser head (4), the side position of bottom organism (1) is provided with side organism (5), be provided with axial alignment jig (6) on side organism (5), be provided with adjusting station (7) on axial alignment jig (6), adjusting station (7) side is provided with mounting panel (8), the side position of mounting panel (8) is provided with side mounting panel (10), its characterized in that: the workpiece replacing mechanism (9) is arranged on the first mounting plate (8), the workpiece replacing mechanism (9) comprises a first movable workbench (27), a second movable workbench (28), a second movable rod (14), a bottom clamping plate (16) and a movable fixing head (23), the first movable workbench (27) and the second movable workbench (28) are fixedly mounted with the second movable rod (14) through a first round connector (13), the second movable rod (14) is fixedly mounted with the bottom clamping plate (16), the movable fixing head (23) is movably mounted with the bottom clamping plate (16), a cleaning mechanism (11) is arranged on the side mounting plate (10), the cleaning mechanism (11) comprises a side cleaning plate (30), a side roller (35) and a cleaning rod (37), the side roller (35) and the side cleaning plate (30) are movably mounted, the cleaning rod (37) is movably mounted with the side cleaning plate (30).
2. The laser drilling apparatus for LCP flexible circuit board as claimed in claim 1, wherein: the lower extreme of No. two movable rods (14) is provided with movable rod (12) No. one, bottom cardboard (16) and movable rod (12) fixed mounting No. one, circular connector (13) and No. two movable rod (14) movable mounting, the side fixed mounting of a movable table (27), No. two movable tables (28) and a circular connector (13), and a movable table (27) and No. two movable tables (28) are located same straight line, the upper end position of No. two movable rods (14) is provided with upper portion and rotates head (15), be provided with spring (17) on movable rod (12), and spring (17) are located the below position of mounting panel (8).
3. A laser drilling apparatus for LCP flexible circuit board as claimed in claim 2, wherein: the lower position of bottom cardboard (16) is provided with bottom support plate (29), the side position of bottom support plate (29) is provided with side connecting rod (19), and through side connecting rod (19) and mounting panel (8) fixed mounting, be provided with upper portion limiting plate (20) on side connecting rod (19), upper portion limiting plate (20) are located the top position of bottom cardboard (16).
4. A laser drilling apparatus for LCP flexible circuit board as claimed in claim 3, wherein: a first clamping groove (18) is arranged at the side surface of the bottom clamping plate (16), a side surface fixing clamping body (21) is arranged on the bottom supporting plate (29), the movable fixing head (23) is positioned above the side fixing clamp body (21), the side fixing clamp body (21) and the movable fixing head (23) can be movably arranged in the first clamping groove (18), a side fixing frame (22) is arranged at the side position of the side fixing clamp body (21), two extrusion rods (24) are movably arranged on the side fixing frame (22), the extrusion rod (24) is fixedly arranged with the movable fixed head (23), an internal limiting plate (26) is arranged on the extrusion rod (24), a second spring (25) is arranged on the extrusion rod (24) at the side position of the inner limit plate (26), the second spring (25) and the internal limiting plate (26) are both positioned in the side fixing frame (22).
5. The laser drilling apparatus for LCP flexible circuit board as claimed in claim 1, wherein: the side cleaning plate (30) is movably mounted with the side mounting plate (10) through a fixing bolt (31), and a locking nut (32) is arranged on the fixing bolt (31).
6. The laser drilling apparatus for LCP flexible circuit board as claimed in claim 1, wherein: the side position of side cleaning plate (30) is provided with two side rotor plates (33), be provided with No. two bearings (39) on side rotor plate (33), be provided with side dwang (34) in No. two bearings (39), side gyro wheel (35) and side dwang (34) fixed mounting.
7. The laser drilling apparatus for LCP flexible circuit board as claimed in claim 6, wherein: the outer end position of side washing board (30) is provided with two rear portion mounting panels (36), be provided with No. three bearings (41) in rear portion mounting panel (36), wash pole (37) movable mounting at No. three bearings (41), be provided with a plurality of washing brush hair (38) on washing pole (37).
8. The laser drilling apparatus for LCP flexible circuit board as claimed in claim 7, wherein: the outer end position of side dwang (34) is provided with action wheel (40), the position that corresponds action wheel (40) on washing pole (37) is provided with from driving wheel (42), be provided with drive belt (43) on action wheel (40) and from driving wheel (42).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202111323197.9A CN113770563B (en) | 2021-11-10 | 2021-11-10 | LCP flexible circuit board's laser drilling device |
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CN202111323197.9A CN113770563B (en) | 2021-11-10 | 2021-11-10 | LCP flexible circuit board's laser drilling device |
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CN113770563A true CN113770563A (en) | 2021-12-10 |
CN113770563B CN113770563B (en) | 2022-02-25 |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110337188A (en) * | 2019-08-01 | 2019-10-15 | 南理工泰兴智能制造研究院有限公司 | A kind of laser hole drilling system of LCP flexible circuit board |
CN113059280A (en) * | 2021-03-25 | 2021-07-02 | 深圳市尚鼎芯科技有限公司 | Cutting device for chip wafer processing |
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2021
- 2021-11-10 CN CN202111323197.9A patent/CN113770563B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110337188A (en) * | 2019-08-01 | 2019-10-15 | 南理工泰兴智能制造研究院有限公司 | A kind of laser hole drilling system of LCP flexible circuit board |
CN113059280A (en) * | 2021-03-25 | 2021-07-02 | 深圳市尚鼎芯科技有限公司 | Cutting device for chip wafer processing |
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