CN113770351B - Copper-gold powder slurry for mechanical plating and preparation method thereof - Google Patents
Copper-gold powder slurry for mechanical plating and preparation method thereof Download PDFInfo
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- CN113770351B CN113770351B CN202111097215.6A CN202111097215A CN113770351B CN 113770351 B CN113770351 B CN 113770351B CN 202111097215 A CN202111097215 A CN 202111097215A CN 113770351 B CN113770351 B CN 113770351B
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Abstract
The invention provides copper-gold powder slurry for mechanical plating and a preparation method thereof, and relates to the technical field of mechanical plating. The copper-gold powder slurry for mechanical plating comprises, by mass, 25% of copper-gold powder, 4% -7% of organic acid, 4% -6% of silicon dioxide, 0.4% -0.9% of stearate, 1% -2% of thixotropic agent and the balance of water, wherein the organic acid is salicylic acid, the thixotropic agent is bentonite, the stearate is mainly prepared by reacting stearic acid with metal salt, and the preparation method of the copper-gold powder slurry for mechanical plating comprises the following specific steps: the method comprises the following steps: the prepared water is first added into a stirring barrel. The organic acid, the silicon dioxide and the stearate are added into the sizing agent of the bronze powder, so that the bronze powder is coated by the organic acid and the silicon dioxide, the bronze powder can be effectively inhibited from oxygen absorption corrosion, the surface of the bronze powder can be modified by the stearate, the glossiness of the bronze powder can be effectively improved, and the influence of dull and lightless bronze powder corrosion on attractiveness is avoided.
Description
Technical Field
The invention relates to the technical field of mechanical plating, in particular to copper-gold powder slurry for mechanical plating and a preparation method thereof.
Background
Mechanical plating is a process of forming a plating layer on the surface of a workpiece by using metal powder through physical, chemical adsorption deposition and mechanical collision at normal temperature and pressure. The metal powder can be metallic zinc, zinc-aluminum, zinc-tin or other non-ferrous metals and alloys. The mechanical plating technology is adopted to plate a zinc layer with a certain thickness on the surface of the steel matrix at first, and then mechanically plate a copper layer with a certain thickness on the surface of the zinc layer, so that a zinc-copper composite plating layer is obtained on the surface of the steel matrix, and the dual effects of protection and decoration are achieved.
Disclosure of Invention
Technical problem to be solved
The invention provides copper-gold powder slurry for mechanical plating and a preparation method thereof, aiming at the defects of the prior art that copper-gold powder slurry in the market is easy to generate oxygen absorption corrosion after being used, so that copper-gold powder becomes dull and dull, and the attractiveness is influenced.
(II) technical scheme
In order to realize the purpose, the invention is realized by the following technical scheme: the copper-gold powder slurry for mechanical plating comprises, by mass, 25% of copper-gold powder, 4-7% of organic acid, 4-6% of silicon dioxide, 0.4-0.9% of stearate, 1-2% of thixotropic agent and the balance of water.
Preferably, the organic acid is salicylic acid, the thixotropic agent is bentonite, and the stearate is mainly prepared by reacting stearic acid with a metal salt.
The preparation method of the copper-gold powder slurry for mechanical plating comprises the following specific steps:
the method comprises the following steps: firstly, adding prepared water into a stirring barrel, then adding organic acid and silicon dioxide into the water, and uniformly stirring;
step two: then adding the copper-gold powder into a mixed solution of organic acid, silicon dioxide and water, and then adding stearate;
step three: then stirring by using a blade type stirrer, adding a thixotropic agent into the stirring barrel in the stirring process, continuously stirring for a certain time, and generating the copper-gold powder slurry after stirring
Preferably, the stirring time using the blade stirrer is 8 to 10 minutes.
(III) advantageous effects
The invention provides a copper-gold powder slurry for mechanical plating and a preparation method thereof. The method has the following beneficial effects:
1. according to the invention, the organic acid, the silicon dioxide and the stearate are added into the slurry of the bronze powder, so that the bronze powder is coated by the organic acid and the silicon dioxide, the bronze powder can be effectively inhibited from oxygen absorption corrosion, the stearate can modify the surface of the bronze powder, the glossiness of the bronze powder can be effectively improved, and the influence of dull and dull corrosion on the bronze powder on the appearance is avoided.
2. According to the invention, the copper-gold powder slurry adopts the blade type stirrer in the stirring process, so that the phenomenon that the copper-gold powder is precipitated in a standing state due to the fact that copper-gold powder particles are curled and broken in the dispersion process to reduce the optical effect is effectively avoided, and a certain amount of thixotropic agent is added in the stirring process.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The first embodiment is as follows:
the embodiment of the invention provides copper-gold powder slurry for mechanical plating, which comprises 25% of copper-gold powder, 4% of organic acid, 4% of silicon dioxide, 0.5% of stearate, 1% of thixotropic agent and the balance of water in percentage by mass, wherein the salicylic acid can coat the copper-gold powder and improve the oxidation resistance of the copper-gold powder.
The preparation method of the copper-gold powder slurry for mechanical plating comprises the following specific steps:
the method comprises the following steps: firstly, adding prepared water into a stirring barrel, then adding organic acid and silicon dioxide into the water, and uniformly stirring;
step two: then adding the bronze powder into a mixed solution of organic acid, silicon dioxide and water, and then adding stearate, wherein the stearate can modify the surface of the bronze powder, so that the glossiness of the bronze powder can be effectively improved;
step three: and then stirring by using a blade type stirrer, effectively avoiding the copper-gold powder particles from curling and breaking in the dispersion process to reduce the optical effect by using the blade type stirrer, adding a thixotropic agent into the stirring barrel in the stirring process, continuously stirring for a certain time, and generating copper-gold powder slurry after stirring is finished, wherein the stirring time by using the blade type stirrer is 9 minutes.
The second embodiment:
the difference between the present embodiment and the first embodiment is: the copper-gold alloy material comprises, by mass, 25% of copper-gold powder, 5% of organic acid, 5% of silicon dioxide, 0.7% of stearate, 1% of thixotropic agent and the balance of water, wherein the organic acid is salicylic acid, the thixotropic agent is bentonite, and the stearate is mainly prepared by reacting stearic acid and metal salt.
The preparation method of the copper-gold powder slurry for mechanical plating comprises the following specific steps:
the method comprises the following steps: firstly, adding prepared water into a stirring barrel, then adding organic acid and silicon dioxide into the water, and uniformly stirring;
step two: then adding the copper-gold powder into a mixed solution of organic acid, silicon dioxide and water, and then adding stearate;
step three: and then stirring by using a blade type stirrer, adding a thixotropic agent into the stirring barrel in the stirring process, continuously stirring for a certain time, and generating the copper-gold powder slurry after stirring, wherein the stirring time by using the blade type stirrer is 9 minutes.
Example three:
the difference between the present embodiment and the first embodiment is: the copper-gold alloy wire comprises, by mass, 25% of copper-gold powder, 7% of organic acid, 6% of silicon dioxide, 0.9% of stearate, 2% of thixotropic agent and the balance of water, wherein the organic acid is salicylic acid, the thixotropic agent is bentonite, and the stearate is mainly prepared by reacting stearic acid with metal salt.
The preparation method of the copper-gold powder slurry for mechanical plating comprises the following specific steps:
the method comprises the following steps: firstly, adding prepared water into a stirring barrel, then adding organic acid and silicon dioxide into the water, and uniformly stirring;
step two: then adding the copper-gold powder into a mixed solution of organic acid, silicon dioxide and water, and then adding stearate;
step three: and then stirring by using a blade type stirrer, adding a thixotropic agent into the stirring barrel in the stirring process, continuously stirring for a certain time, and generating copper-gold powder slurry after stirring, wherein the stirring time by using the blade type stirrer is 9 minutes.
In summary, the copper-gold powder slurry prepared in the above 3 examples is detected, and the obtained detection data is as follows:
| example one | Example two | EXAMPLE III | |
| Rate of corrosion prevention | 85％ | 94％ | 98％ |
| Degree of gloss | 80％ | 87％ | 94％ |
| Amount of precipitate | 5％ | 5％ | 3％ |
( Note: the metal corrosion speed is determined by adopting a resistance method, the cross section area is reduced due to the corrosion action according to a metal sample, so that the resistance is increased, the metal glossiness is detected by using a professional glossiness instrument, the sedimentation amount of the slurry is detected by using a hollow glass tube, the hollow glass tube is inserted into the bottom of the slurry, then the top end of the hollow glass tube is plugged by a hand and taken out, and the color depth of the slurry in the hollow glass tube is observed )
As can be seen from the table, the higher the amount of organic acid and silicon dioxide, the higher the corrosion prevention rate of the bronze powder, the gloss of the bronze powder is increased with the increase of the amount of stearate, and the precipitation amount of the bronze powder is decreased with the increase of the amount of the thixotropic agent.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. The copper-gold powder slurry for mechanical plating is characterized in that: the copper-gold alloy material comprises, by mass, 25% of copper-gold powder, 4% to 7% of organic acid, 4% to 6% of silicon dioxide, 0.4% to 0.9% of stearate, 1% to 2% of thixotropic agent and the balance of water, wherein the organic acid is salicylic acid, and the thixotropic agent is bentonite.
2. The method for preparing copper-gold powder slurry for mechanical plating according to claim 1, characterized in that: the method comprises the following specific steps:
the method comprises the following steps: firstly, adding prepared water into a stirring barrel, then adding organic acid and silicon dioxide into the water, and uniformly stirring;
step two: then adding the copper-gold powder into a mixed solution of organic acid, silicon dioxide and water, and then adding stearate;
step three: and then, stirring by using a blade type stirrer, adding a thixotropic agent into the stirring barrel in the stirring process, continuously stirring for a certain time, and generating the copper-gold powder slurry after stirring.
3. The method for preparing a copper-gold powder slurry for mechanical plating according to claim 2, characterized in that: the stirring time by using a blade type stirrer is 8-10 minutes.
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| CN202111097215.6A CN113770351B (en) | 2021-09-18 | 2021-09-18 | Copper-gold powder slurry for mechanical plating and preparation method thereof |
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| CN202111097215.6A CN113770351B (en) | 2021-09-18 | 2021-09-18 | Copper-gold powder slurry for mechanical plating and preparation method thereof |
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| CN113770351B true CN113770351B (en) | 2023-04-18 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102151823B (en) * | 2011-01-26 | 2013-02-27 | 宁波广博纳米新材料股份有限公司 | Antioxidation method of nano copper powder |
| CN102151835B (en) * | 2011-03-17 | 2012-12-19 | 昆明理工大学 | Method for preparing ultrafine platy copper-zinc alloy powder |
| CN106498455B (en) * | 2016-10-18 | 2018-07-24 | 昆明理工大学 | A kind of mechanical zinc-plating-copper process deposition copper additive |
| CN106521572B (en) * | 2016-10-18 | 2018-05-25 | 昆明理工大学 | A kind of zinc-copper compound mechanical plating additive |
| CN106637317B (en) * | 2016-12-16 | 2018-05-25 | 昆明理工大学 | A kind of mechanical plating Cu-Zn alloy powder slurry and its preparation method |
| CN109401366B (en) * | 2018-08-02 | 2021-03-12 | 中国人民解放军军事科学院防化研究院 | High-temperature-resistant bronze powder |
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