CN113769532A - Semiconductor equipment and processing by-product processing device thereof - Google Patents
Semiconductor equipment and processing by-product processing device thereof Download PDFInfo
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- CN113769532A CN113769532A CN202111138877.3A CN202111138877A CN113769532A CN 113769532 A CN113769532 A CN 113769532A CN 202111138877 A CN202111138877 A CN 202111138877A CN 113769532 A CN113769532 A CN 113769532A
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- 239000000126 substance Substances 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 6
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- 241000521257 Hydrops Species 0.000 description 4
- 206010030113 Oedema Diseases 0.000 description 4
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/002—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by condensation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
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Abstract
The invention discloses semiconductor equipment and a processing device of a process byproduct thereof, and relates to the technical field of semiconductor equipment. The process byproduct processing device comprises a cooling and separating device, a temperature sensor, a control unit and an auxiliary cooling unit, wherein the cooling and separating device is communicated with an exhaust port of a process chamber of the semiconductor equipment so as to cool the process byproducts discharged from the process chamber to realize gas-liquid separation. The temperature sensor is arranged in the cooling and separating device and used for sensing the temperature in the cooling and separating device. The auxiliary cooling unit is used for reducing the temperature in the cooling and separating device, the control unit is respectively connected with the temperature sensor and the auxiliary cooling unit, and the control unit controls the auxiliary cooling unit to be opened to reduce the temperature in the cooling and separating device under the condition that the temperature value sensed by the temperature sensor is greater than a preset value. The scheme can solve the problem that the condensation effect of the cooling system on the byproducts cannot be monitored and adjusted in the process of treating the process byproducts of the semiconductor equipment.
Description
Technical Field
The invention relates to the technical field of process equipment of semiconductor equipment, in particular to semiconductor equipment and a process byproduct treatment device thereof.
Background
With the continuous improvement of chip manufacturing processes, packaging factories are developing packaging processes to smaller sizes, and further, higher requirements are put on the treatment of by-products generated in the process of semiconductor devices.
In the related art, a byproduct line generated in the process of semiconductor equipment passes through a cooling system to cool gaseous byproducts, so that organic matters, water and the like in the byproducts can be condensed and separated according to different boiling points of different substances in the byproducts, and the difficulty in tail gas treatment is reduced. However, in the related art, the condensing effect of the cooling system on the by-products cannot be monitored and adjusted, and thus, part of non-condensed organic matters or moisture exist in the tail gas, so that the difficulty of tail gas treatment is increased.
Disclosure of Invention
The invention discloses semiconductor equipment and a processing device of a process byproduct thereof, which aim to solve the problem that the condensation effect of a cooling system on the byproduct cannot be monitored and adjusted in the processing process of the process byproduct of the semiconductor equipment.
In order to solve the problems, the invention adopts the following technical scheme:
the process byproduct processing device of the semiconductor equipment disclosed by the embodiment of the invention comprises a cooling and separating device, a temperature sensor, a control unit and an auxiliary cooling unit, wherein the cooling and separating device is communicated with an exhaust port of a process chamber of the semiconductor equipment so as to cool the process byproducts discharged from the process chamber to realize gas-liquid separation;
the temperature sensor is arranged in the cooling and separating device and used for sensing the temperature in the cooling and separating device;
the auxiliary cooling unit is used for reducing the temperature in the cooling and separating device, the control unit is respectively connected with the temperature sensor and the auxiliary cooling unit,
and under the condition that the temperature value sensed by the temperature sensor is greater than the preset value, the control unit controls the auxiliary cooling unit to be opened so as to reduce the temperature in the cooling and separating device.
Based on the processing byproduct processing device of the invention, the invention also provides semiconductor equipment. The semiconductor apparatus includes a reaction chamber and a process byproduct processing apparatus according to the present invention.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the embodiment of the invention, the temperature of the process by-product of the semiconductor equipment in the cooling and separating device is sensed by the temperature sensor, so that the controller can control the auxiliary cooling unit under the condition that the temperature in the cooling and separating device is overhigh, the auxiliary cooling unit can reduce the temperature in the cooling and separating device, and insufficient condensation caused by the temperature rise of the cooling and separating device is avoided. The temperature in the cooling separation device is reduced through the auxiliary cooling unit, so that organic matters or moisture in process byproducts can be fully condensed, and the tail gas treatment difficulty of the semiconductor equipment is reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of a process byproduct processing apparatus of a semiconductor device according to one embodiment of the present disclosure;
FIG. 2 is a schematic view of a cooling separator apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic illustration of the core disclosed in one embodiment of the present invention;
fig. 4 is a schematic view of a liquid collecting barrel according to an embodiment of the present invention.
In the figure: 100-a cooling separation device; 110 — a first air inlet; 120-a second air inlet; 130-an exhaust port; 140-a housing; 150-inner core; 151-separation sheet; 1511-through hole; 160-liquid discharge port; 200-a temperature sensor; 300-a regulating valve; 400-an exhaust manifold; 500-a condenser; 600-liquid accumulation barrel; 610-a viewing window; 700-waste liquid tray.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to fig. 1 to 4.
Referring to fig. 1 and 2, an embodiment of the invention discloses a processing byproduct processing apparatus of a semiconductor device, which includes a cooling separation apparatus 100, a temperature sensor 200, a control unit and an auxiliary cooling unit. The cooling and separating device 100 is used for communicating with an exhaust port of a process chamber of the semiconductor equipment so as to cool the process by-products exhausted from the process chamber to realize gas-liquid separation. Due to the fact that the boiling points of organic matters, moisture and other substances in the process by-products of the semiconductor equipment are different, the different substances in the process by-products can be separated from each other in a condensation mode. Illustratively, the cooling and separating device 100 cools the process by-product of the semiconductor device to condense part of the substances in the process by-product, and then separates different substances in the process by-product from each other by gas-liquid separation. Illustratively, the cooling separator 100 is used to condense organic matter or moisture within process by-products of a semiconductor device and separate the condensed organic matter or moisture from gaseous matter that has not been condensed.
In an alternative embodiment, the semiconductor device may be a device for a curing process. Illustratively, the semiconductor device may be a piq (polyimide cutting) device. When the semiconductor device is subjected to a curing process, a processed product in a process chamber of the semiconductor device generates a process byproduct formed by mixing a plurality of substances under the action of high temperature. Exemplary process byproducts generated during semiconductor processing include gamma butyrolactone, N2, water vapor, and the like. The process by-product is gaseous in a high temperature environment, and the process by-product in the process chamber of the semiconductor device is gaseous. At normal temperature, gamma-butyrolactone and water vapor are converted into a viscous oily liquid, which easily causes the blockage of an exhaust manifold and influences the stability and reliability of the semiconductor device. Therefore, it is necessary to treat the process by-products exhausted from the process chamber of the semiconductor device in advance to prevent the exhaust manifold from being clogged and affecting the stability and reliability of the semiconductor device. Illustratively, the processed product may be a wafer.
Referring to fig. 1 and 2, a temperature sensor 200 is disposed in the cooling and separating apparatus 100, and the temperature sensor 200 is used for sensing the temperature in the cooling and separating apparatus 100. For example, the temperature sensor 200 may be disposed within the cooling separator 100, such that the temperature sensor 200 may be used to sense the temperature within the cooling separator 100.
The auxiliary cooling unit is used for reducing the temperature in the cooling and separating device 100, and the control unit is respectively connected with the temperature sensor 200 and the auxiliary cooling unit. For example, in the case that the temperature value sensed by the temperature sensor 200 is greater than the preset value, the control unit controls the auxiliary cooling unit to be turned on, that is, the control unit may be used to start the auxiliary cooling unit, so as to reduce the temperature in the cooling-separating device 100 through the auxiliary cooling unit. And under the condition that the temperature value sensed by the temperature sensor 200 is less than or equal to the preset value, the control unit controls the auxiliary cooling unit to be closed.
It should be noted that the cooling separation apparatus 100 accelerates heat dissipation of organic matters or water vapor in the process by-products of the semiconductor device, so that gaseous organic matters or water vapor can be rapidly condensed, physical forms of the organic matters can be converted from gaseous states into liquid and/or solid states, and the water vapor can be converted from gaseous states into liquid, so that the organic matters or water vapor in the process by-products of the semiconductor device can be separated from gaseous substances. The transformation of the form of a substance from a gaseous state to a liquid or solid state is an exothermic process. Therefore, the higher the temperature in the cooling and separating apparatus 100, the more likely to cause insufficient condensation of organic substances or water vapor in the process by-products of the semiconductor device, thereby increasing the difficulty of tail gas treatment. Similarly, the lower the temperature in the cooling and separating device 100 is, the more fully the organic matters or water vapor in the process by-products of the semiconductor equipment can be condensed, and the difficulty in treating the tail gas can be further reduced. For this, the temperature of the cooling separation apparatus 100 may be set according to the conversion rate of the organic matter or water vapor in the process by-product of the semiconductor device into a solid or liquid state. Therefore, the preset values described in this embodiment refer to: the highest temperature value in the cooling separation device 100 is determined according to the conversion rate of organic matters or water vapor in the process by-products of the semiconductor equipment required for tail gas treatment into solid or liquid.
In the above embodiment, the temperature sensor 200 senses the temperature inside the cooling and separating apparatus 100, so that the controller can control the auxiliary cooling unit according to the temperature inside the cooling and separating apparatus 100. The condensation effect of the cooling device on organic matters or water vapor in the process byproducts of the semiconductor equipment can be monitored, the auxiliary cooling unit can be controlled to reduce the temperature in the cooling and separating device 100 under the condition that the temperature in the cooling and separating device 100 is too high by utilizing the controller, so that the condensation effect of the cooling and separating device 100 on the organic matters or water vapor in the process byproducts of the semiconductor equipment can be expected, the content of the organic matters or water vapor in tail gas can be reduced, and the difficulty in tail gas treatment can be reduced.
For example, the auxiliary cooling unit may include a heat dissipation coil, and the heat dissipation coil may be disposed in the cooling separation device 100 or disposed outside the cooling separation device 100, so as to take away heat in the cooling separation device 100 through flowing of the cooling liquid in the heat dissipation coil by passing the cooling liquid through the heat dissipation coil, and thus may reduce the temperature in the cooling separation device 100. Of course, the auxiliary cooling unit may further include a heat conducting rod, one end of the heat conducting rod is located outside the cooling and separating device 100, and the other end of the heat conducting rod is located inside the cooling and separating device 100, so as to accelerate heat dissipation in the cooling and separating device 100 through the heat conducting rod, and further reduce the temperature inside the cooling and separating device 100. There are many types of auxiliary cooling units, and for this reason, the specific type of the auxiliary cooling unit is not limited in this embodiment.
Illustratively, the control unit is of various types, such as a single chip microcomputer, a PLC control system, and the like. For this reason, the present embodiment does not limit the specific kind of the control unit.
Referring to fig. 2, the cooling and separating apparatus 100 is provided with a first air inlet 110, and an auxiliary cooling unit is connected to the first air inlet 110 and is used to supply air into the cooling and separating apparatus 100. Illustratively, the auxiliary cooling unit may be a plant side, so as to inject CDA (compressed air) or GN2 (normal nitrogen gas) of the plant side into the cooling separation device 100 through the plant side, so as to cool the inside of the cooling separation device 100 by air cooling by accelerating the flow rate of the gas in the cooling separation device 100. Illustratively, the auxiliary cooling unit includes an intake valve for blocking or communicating the first intake port 110. The inlet valve is, for example, connected to the control unit, so that the control unit can control the inlet valve to open or close. Under the condition that the temperature value sensed by the temperature sensor 200 is greater than the preset value, the control unit controls the air inlet valve to be opened, so that the auxiliary cooling unit can supply air into the cooling and separating device 100, and the air cooling and cooling inside the cooling and separating device 100 are realized.
For example, the cooling separation device 100 has a plurality of first air inlets 110, and the plurality of first air inlets 110 are distributed along the circumferential direction of the cooling separation device 100, so as to accelerate the temperature reduction inside the cooling separation device 100. Optionally, the control unit may independently control the auxiliary cooling unit to intake air to one or more of the first air inlets 110, that is, each of the first air inlets 110 is independent from each other.
For example, the number of the temperature sensors 200 may be multiple, and the multiple temperature sensors 200 are uniformly distributed in the cooling separation device 100, so that the temperature of each part of the cooling separation device 100 may be monitored, thereby preventing the local temperature in the cooling separation device 100 from being too high or too low to affect the detection and control of the internal temperature of the cooling separation device 100, and improving the accuracy of monitoring the internal temperature of the cooling separation device 100.
In an alternative embodiment, the auxiliary cooling unit may also be an air pump, so as to inject air or nitrogen into the cooling and separating device 100 through the air pump.
Referring to fig. 1, the process byproduct treating apparatus of the semiconductor device may further include a regulating valve 300 and an exhaust manifold 400. The exhaust manifold 400 is used to provide negative pressure for the gas exhaust in the cooling separator 100. Illustratively, the exhaust manifold 400 may be coupled to the plant side such that the plant side may provide negative pressure to the exhaust manifold 400, which in turn may provide negative pressure to the gas exhaust within the cooling separator 100. Illustratively, the exhaust manifold 400 includes an air pump to provide a negative pressure for the gas exhaust in the cooling separator 100.
Illustratively, the cooling and separating device 100 is provided with a second gas inlet 120 and a gas outlet 130, the second gas inlet 120 is used for communicating with a gas outlet of a process chamber of the semiconductor equipment, so that the by-products of the process can enter the cooling and separating device 100. The exhaust port 130 is used for discharging the gas in the cooling separation apparatus 100. Specifically, the process by-products of the semiconductor device enter the cooling separator 100 through the second gas inlet 120, so that the cooling separator 100 can condense organic substances or water vapor in the process by-products of the semiconductor device.
Referring to fig. 1, the exhaust manifold 400 is connected to the exhaust port 130 through the regulating valve 300 to accommodate the change in the magnitude of the negative pressure provided by the exhaust manifold 400 by adjusting the opening of the regulating valve 300.
It should be noted that, negative pressures that can be provided by different plant ends are different, or the negative pressure of the plant end is easily fluctuated by external interference, so that the process of the semiconductor device is easily affected. In the above embodiment, the regulating valve 300 is disposed between the exhaust manifold 400 and the exhaust port 130, so that the opening of the regulating valve 300 can be regulated according to the magnitude of the negative pressure at the plant end, thereby ensuring the pressure stability in the whole process of the semiconductor device. For example, in the case that the negative pressure provided by the plant side is small, that is, the negative pressure provided by the exhaust manifold 400 is small, the opening degree of the regulating valve 300 can be increased to ensure the stability of the pressure during the process of the semiconductor device. In the case that the negative pressure provided by the plant side is large, that is, the negative pressure provided by the exhaust manifold 400 is large, the opening degree of the regulating valve 300 can be reduced to ensure the stability of the pressure in the process engineering of the semiconductor device.
In an alternative embodiment, the apparatus for processing by-product of semiconductor device further comprises a pressure sensing member disposed at the exhaust manifold 400, the pressure sensing member is connected to the control unit, the control unit is connected to the regulating valve 300, and the control unit controls the opening of the regulating valve 300 according to the information sensed by the pressure sensing member. For example, the pressure sensing member may be a pressure gauge.
In the above embodiment, by providing the pressure sensing member and adjusting the opening of the regulating valve 300 by the control unit according to the pressure sensed by the pressure sensing member, the processing byproduct processing apparatus of the semiconductor device can be applied to the factory service ends with different pressures, and can also ensure stable pressure in the process of the semiconductor device under the condition that the pressure at the factory service end is unstable, which is beneficial to improving the quality of the semiconductor product. Meanwhile, the opening of the regulating valve 300 is automatically regulated according to the pressure of the plant service end, so that the automation level and the overall performance of the process byproduct processing device of the semiconductor equipment can be improved.
Referring to fig. 2 and 3, the cooling separation apparatus 100 includes a case 140 and an inner core 150. The shell 140 is a basic structural member, and can provide a mounting base for the inner core 150. Illustratively, the housing 140 has a receiving cavity, the core 150 is disposed in the receiving cavity, the second gas inlet 120 is communicated with the core 150, and the gas outlet 130 is communicated with the receiving cavity, so that the process by-product of the semiconductor device entering from the second gas inlet 120 can enter the core 150, and heat exchange between the core 150 and the process by-product of the semiconductor device is realized, so as to achieve the purpose of condensing organic matters and water vapor in the process by-product of the semiconductor device.
Referring to fig. 3, the core 150 includes a plurality of separating sheets 151, the separating sheets 151 are flat plates, and the separating sheets 151 are disposed in the accommodating cavity in parallel and at intervals.
Some of the organics in the process by-products of the semiconductor equipment condense to form viscous oily liquids. Therefore, the separating sheet 151 is set to be flat, and the plurality of separating sheets 151 are arranged in the accommodating chamber in parallel and at intervals, so that the difficulty in cleaning the separating sheets 151 can be reduced, and the later maintenance of the process byproduct processing device of the semiconductor equipment is facilitated.
Referring to fig. 3, the separation sheet 151 may be provided with a plurality of through-holes 1511 so that process by-products of the semiconductor device may pass through the separation sheet 151 along the through-holes 1511. Thereby facilitating sufficient contact between the process by-products of the semiconductor device and the separation sheet 151 to facilitate condensation of organic matter or water vapor in the process by-products of the semiconductor device. Illustratively, the through holes 1511 may be uniformly distributed on the separation sheet 151.
In an alternative embodiment, the through holes 1511 of the two connected separating sheets 151 are disposed in a staggered manner, so that the byproducts of the semiconductor device passing through the through holes 1511 can impact on the separating sheets 151, and the byproducts of the semiconductor device can be in contact with the separating sheets 151 more fully, thereby further improving the condensation effect of the cooling and separating device 100 on the organic matters or water vapor in the byproducts of the semiconductor device.
Referring to fig. 1, the process byproduct treating apparatus of the semiconductor device further includes a condenser 500, the condenser 500 having an inlet end and an outlet end, the outlet end being connected to the second gas inlet 120, the inlet end being adapted to be connected to an outlet of a process chamber of the semiconductor device. The entry end of the condenser 500 refers to: a port where process byproducts of the semiconductor device enter the condenser 500; the discharge end of the condenser 500 refers to: the process by-products of the semiconductor device are discharged out of the port of the condenser 500.
In the above embodiment, the condenser 500 is disposed such that the process by-product of the semiconductor device is condensed by the condenser 500 and then enters the cooling and separating device 100, thereby improving the condensation effect of the process by-product processing device of the semiconductor device on organic matters or water vapor in the process by-product of the semiconductor device.
Referring to fig. 1, the processing byproduct processing apparatus of a semiconductor device further includes a liquid accumulation barrel 600, the cooling and separating apparatus 100 is provided with a liquid discharge port 160, the liquid accumulation barrel 600 is connected to the liquid discharge port 160, the liquid accumulation barrel 600 is provided with an observation window 610, and the observation window 610 is used for observing the liquid level in the liquid accumulation barrel 600.
Illustratively, the observation window 610 may be an opening opened in the liquid collection barrel 600 so that a worker can directly observe the height of the liquid level in the liquid collection barrel 600 through the opening. Illustratively, the viewing window 610 may be a transparent area disposed on the effusion cell 600, such as glass embedded in the opening, so that a worker may directly observe the height of the liquid level in the effusion cell 600 through the opening.
In an alternative embodiment, the liquid collecting barrel 600 may be made of an aluminum alloy material. For example, the surface of the liquid accumulation barrel 600 may be provided with an anti-corrosion layer, such as painting anti-corrosion paint, or anodizing the surface of the liquid accumulation barrel 600 to improve the anti-corrosion performance of the liquid accumulation barrel 600.
In an alternative embodiment, the apparatus for treating a process by-product of a semiconductor device further comprises a waste liquid tray 700 disposed below the liquid collecting tank 600, wherein the waste liquid tray 700 is used for accommodating liquid overflowing or leaking from the liquid collecting tank 600. Illustratively, the waste liquid tray 700 has a receiving groove for receiving waste liquid overflowing or leaking from the liquid trap 600. In this embodiment, waste liquid tray 700 can avoid waste liquid to be detained with semiconductor device and/or subaerial under the condition that waste liquid spilled over in hydrops bucket 600. Optionally, rollers are disposed at the bottom of the waste liquid tray 700 to facilitate replacement or movement of the liquid collecting barrel 600. Exemplarily, can be through pulling waste liquid tray 700 to drive hydrops bucket 600 through waste liquid tray 700 and remove, not only can reduce the change degree of difficulty of hydrops bucket 600, can also avoid the waste liquid that hydrops bucket 600 spills over at the removal in-process to flow to ground or semiconductor equipment on.
Based on the processing byproduct processing device of the invention, the invention also provides semiconductor equipment. The semiconductor apparatus comprises a process chamber and a process byproduct processing apparatus as described in any of the embodiments above. The process chamber is illustratively used to provide the necessary process environment for the article being processed, such as the high temperature environment required for the curing process of the semiconductor article.
In an alternative embodiment, the process chamber has an exhaust for exhausting process byproducts within the process chamber. Illustratively, the exhaust port of the process chamber is connected with the process byproduct processing device, so that the process byproducts generated in the process chamber can be processed by the process byproduct processing device and then discharged, thereby avoiding blocking a manifold for discharging the process byproducts and improving the stability and reliability of the semiconductor equipment. Illustratively, the semiconductor device of the present invention may be a piq (polyimide curing) device.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. The device for processing the process byproducts of the semiconductor equipment is characterized by comprising a cooling separation device (100), a temperature sensor (200), a control unit and an auxiliary cooling unit,
the cooling and separating device (100) is communicated with an exhaust port of a process chamber of the semiconductor equipment so as to cool the process by-products discharged from the process chamber to realize gas-liquid separation;
the temperature sensor (200) is arranged in the cooling and separating device, and the temperature sensor (200) is used for sensing the temperature in the cooling and separating device (100);
the auxiliary cooling unit is used for reducing the temperature in the cooling and separating device (100), the control unit is respectively connected with the temperature sensor (200) and the auxiliary cooling unit,
and under the condition that the temperature value sensed by the temperature sensor (200) is greater than a preset value, the control unit controls the auxiliary cooling unit to be opened so as to reduce the temperature in the cooling and separating device (100).
2. The apparatus for treating a by-product of a process according to claim 1, wherein the cooling separator (100) is provided with a first gas inlet (110), the auxiliary cooling unit is connected to the first gas inlet (110), and the auxiliary cooling unit is used for supplying gas into the cooling separator (100).
3. The apparatus of claim 1 further comprising a regulator valve (300) and an exhaust manifold (400), said exhaust manifold (400) for providing a negative pressure for gas venting within said cooling separator (100),
the cooling and separating device (100) is provided with a second gas inlet (120) and a gas outlet (130), the second gas inlet (120) is used for being communicated with a gas outlet of a process chamber of the semiconductor equipment so that the process byproducts can enter the cooling and separating device (100), and the gas outlet (130) is used for discharging gas in the cooling and separating device (100);
the exhaust manifold (400) is connected to the exhaust port (130) through the regulating valve (300).
4. The apparatus of claim 3, further comprising a pressure sensor disposed at the exhaust manifold (400), wherein the pressure sensor is connected to the control unit, and the control unit is connected to the regulating valve (300), and the control unit controls the opening of the regulating valve (300) according to information sensed by the pressure sensor.
5. The process by-product treatment apparatus of claim 3, wherein the cooling separator (100) comprises a housing (140) and a core (150),
the shell (140) is provided with a containing cavity, the inner core (150) is arranged in the containing cavity, the second air inlet (120) is communicated with the inner core (150), the air outlet (130) is communicated with the containing cavity, and the temperature sensor (200) is arranged in the shell (140).
6. The apparatus for treating by-products of a process according to claim 5, wherein said core (150) comprises a plurality of separating sheets (151), said separating sheets (151) are flat plates, and a plurality of through holes (1511) are provided on said separating sheets (151), and said plurality of separating sheets (151) are arranged in parallel and at intervals in said accommodating chamber.
7. The apparatus of claim 3, further comprising a condenser (500), said condenser (500) having an inlet end and an outlet end, said outlet end being connected to said second gas inlet (120), said inlet end being adapted to be connected to an exhaust of a process chamber of said semiconductor device.
8. The apparatus for treating a by-product according to any one of claims 1 to 7, further comprising a liquid accumulation tank (600), wherein the cooling separation apparatus (100) is provided with a liquid discharge port (160), and the liquid discharge port (160) is connected to the liquid accumulation tank (600),
the liquid accumulation barrel (600) is provided with an observation window (610), and the observation window (610) is used for observing the liquid level in the liquid accumulation barrel (600).
9. The apparatus for treating by-products of process according to claim 8, further comprising a waste liquid tray (700) disposed below said liquid accumulation barrel (600), said waste liquid tray (700) being adapted to contain liquid overflowing or leaking from said liquid accumulation barrel (600).
10. A semiconductor apparatus comprising a reaction chamber and the by-product processing apparatus of any one of claims 1 to 9.
Priority Applications (1)
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