CN113766806A - Black box for recording - Google Patents
Black box for recording Download PDFInfo
- Publication number
- CN113766806A CN113766806A CN202110952532.5A CN202110952532A CN113766806A CN 113766806 A CN113766806 A CN 113766806A CN 202110952532 A CN202110952532 A CN 202110952532A CN 113766806 A CN113766806 A CN 113766806A
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- Prior art keywords
- black box
- ground wire
- recording
- storage device
- power supply
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- 238000004891 communication Methods 0.000 claims description 41
- 238000013016 damping Methods 0.000 claims description 16
- 230000001012 protector Effects 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052802 copper Inorganic materials 0.000 abstract description 11
- 239000010949 copper Substances 0.000 abstract description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
- G07C5/00—Registering or indicating the working of vehicles
- G07C5/08—Registering or indicating performance data other than driving, working, idle, or waiting time, with or without registering driving, working, idle or waiting time
- G07C5/0841—Registering performance data
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a black box for recording, which comprises a shell and a storage device arranged in the shell, wherein the storage device is connected with a power supply ground wire and a power supply wire, and the diameter of the power supply ground wire is increased; one end of the power supply ground wire is welded with the storage device, and the other end of the power supply ground wire extends to the outside of the black box and is connected with the electric conduction and heat conduction medium. The internal storage device of the black box is connected to a power ground wire, the internal end of the power ground wire is welded with the storage device, the external end is connected with an electric conduction and heat conduction medium for heat dissipation, the temperature difference is manufactured, the internal temperature of the black box is easy to conduct to the low-temperature external copper sheet, and heat is dissipated from the inside of the black box without heat exchange almost through the power ground wire. By adopting the technical scheme of the invention, the volume of the black box can be effectively reduced, the heat dissipation efficiency of the black box is improved, the transmission speed is improved, and the requirements of high-capacity and high-speed transmission are met.
Description
Technical Field
The invention belongs to the technical field of black boxes, and particularly relates to a black box for recording.
Background
The rail transit industry requires that a judicial recording unit is configured on each train, key data recorded by the judicial recording unit are stored in a reinforced memory (namely a black box of the train, hereinafter referred to as the black box), when the train breaks down or has an accident, information data of an internal storage device is used for analyzing and diagnosing the fault reason, but the black box is possibly damaged by high-temperature combustion, impact, water immersion and the like, so that the requirements on indexes of the vehicle-mounted black box such as high temperature resistance, impact resistance, IP grade and the like are high.
Because the vehicle-mounted black box needs to ensure that stored data is not damaged in a high-temperature environment, the test needs to bear the high-temperature environment of 700 ℃ for 5 minutes, and a heating process is not included, a heat insulating material is added between a functional module (PCB) and an outer layer, and the heat insulating material can insulate high temperature under the condition of high temperature at the periphery and conduct to the inside, but in most normal time periods, heat generated by an internal controller and a memory is also insulated, heat dissipation cannot be carried out, a transmission line has a certain probability of conducting the high temperature to the inside under the condition of high temperature, and a circuit board is burnt out. Therefore, the conventional vehicle-mounted black box is generally large in size, generally 160mm (wide) 160mm (high) 257mm (long), low in heat dissipation efficiency and low in transmission speed, and cannot meet the development trend of large data and high-speed storage of modern rail transit.
Disclosure of Invention
Aiming at the problems, the invention provides a black box for recording, which adopts the following technical scheme:
a black box for recording comprises a shell and a storage device arranged in the shell, wherein the storage device is connected with a power supply ground wire and a power supply wire, and the diameter of the power supply ground wire is increased; one end of the power supply ground wire is welded with the storage device, and the other end of the power supply ground wire extends to the outside of the black box and is connected with the electric conduction and heat conduction medium.
Preferably, the power ground wire and the power wire are respectively connected with a temperature protector in series.
Preferably, the black box is provided with a communication interface, and a relay is connected to the communication interface in series.
Preferably, a PCB is arranged inside the black box, one half of the pins of the relay are welded on the PCB, and the other half of the pins of the relay are connected in series with the communication interface by being welded on the communication line.
Preferably, the black box does not include a processor and the storage device is a solid state electronic memory chip.
Preferably, the laying area of the electric and heat conducting medium is greater than or equal to 240mm2。
Preferably, the shell comprises an inner layer and an outer layer, and a filling heat insulation layer is arranged between the inner layer and the outer layer.
Preferably, a damping filling layer is arranged between the storage device and the shell.
Preferably, the temperature protector is arranged in the damping filling layer.
Preferably, the relay is arranged in the damping filling layer, and a pin connected with the communication line is suspended.
The invention has the following beneficial effects: the internal storage device of the black box is connected to a power ground wire, the internal end of the power ground wire is welded with the storage device, the external end is connected with an electric conduction and heat conduction medium for heat dissipation, the temperature difference is manufactured, the internal temperature of the black box is easy to conduct to the low-temperature external copper sheet, and heat is dissipated from the inside of the black box without heat exchange almost through the power ground wire. By adopting the technical scheme of the invention, the volume of the black box can be effectively reduced by 95%, the heat dissipation efficiency of the black box is improved, the transmission speed is improved, and the requirements of high capacity and high speed transmission are met.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 shows a schematic cross-sectional structure of a black box according to the present invention;
FIG. 2 illustrates a front view of an outer layer of a black box according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating an internal structure of a black box according to an embodiment of the present invention;
in the figure: 1. an outer layer; 2. an inner layer; 3. a thermal insulation layer; 4. and a damping filling layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A black box for recording, illustratively, as shown in fig. 1, has a width of 85mm, a height of 37mm, and a length of 120mm, and includes a housing and an SSD chip (solid state electronic memory chip, i.e., memory device, illustratively SSD chip) disposed inside the housing, the housing includes an inner layer 2 made of aluminum alloy and an outer layer 1 made of high strength stainless steel. Wherein, the height of inlayer 2 is 23mm, and the width is 53mm, and inlayer 2 is the semicircle that the radius is 11.5mm along width direction both ends, and the thickness along the direction of height between inlayer 2 and the internal circuit board structure is 6 mm. As shown in fig. 2, the circuit board structure inside the casing protrudes to the outside of the casing, the four corners of the outside of the outer layer 1 of the casing are provided with mounting holes, the circle centers of the mounting holes above and below the outer layer 1 are respectively 15mm apart from the upper and lower boundaries, and the distance between the mounting holes in the width direction is69.9-70.1mm, the distance between the mounting holes in the length direction is 89.9-90.1mm, the mounting holes are tapered holes, the diameter of the mounting holes close to the outer part of the outer layer 1 is 12mm, the diameter of the mounting holes close to the inner part of the outer layer 1 is 6mm, and the chamfer radius of the bottom corner of the outer layer 1 is 2 mm. As shown in fig. 3, a heat insulation layer 3 is filled between the inner layer 2 and the outer layer 1, a damping filling layer 4 is arranged between the SSD chip and the inner layer 2, the SSD chip is connected with a power ground wire and a power line, and the diameter of the power ground wire is 1.38 mm; one end of the power supply ground wire is welded with the storage device, the other end of the power supply ground wire extends to the outside of the black box and is connected with copper (namely, an electric conduction and heat conduction medium, copper is selected for an exemplary use), and the floor area of the copper is 240mm2(in order to prevent heat from diffusing in the black box without paving the ground, the copper-coated area is calculated according to the necessary wiring, the wiring with the width of 3mm is calculated, and the wiring with the length of 40mm is calculated (the ground wire and the power wire are multiplied by 2)), the power ground wire and the power wire are respectively connected with a temperature protector in series; the black box is provided with a communication interface, a high-speed communication relay is connected to the communication interface in series, a PCB is arranged inside the black box, one half of pins of the high-speed communication relay are welded to the PCB, and the other half of pins of the high-speed communication relay are connected to the communication interface in series by being welded to a communication line. Illustratively, the present embodiment includes one reception communication line and one transmission communication line. The high-speed communication relay is internally provided with a coil and elastic pieces, the two communication lines are respectively connected with the elastic pieces in series, one end of the coil is connected with a power ground wire, the other end of the coil is connected with a power line, the attraction of the elastic pieces is controlled by the energization of the coil, and the disconnection of the elastic pieces is controlled by the power-off of the coil.
The black box is filled with damping materials, so that the impact and vibration of the outside on the internal storage unit are mainly absorbed, the outer layer 1 of the shell is made of high-strength stainless steel materials, the shell can bear the stress impact of the outside and cannot deform, and the thermal insulation materials are filled between the inner layer 2 and the outer layer 1, so that the internal storage device is not damaged in a high-temperature environment. The power line and the power ground wire are directly welded on an internal circuit board, and the temperature protector is placed in the damping material and is solidified along with the damping material. The communication wire is a double-layer shielded superfine connecting wire with the diameter of 1mm, is directly welded on a pin of the high-speed communication relay and is solidified together with the damping material.
The black box has the following beneficial effects:
heat dissipation is performed by using a power supply ground wire (ground wire of a power supply): the SSD chip power ground wire in the black box is led out, the power ground wire is thickened and is independently wired, and one end of the power ground wire is welded with a radiating fin of the SSD chip, so that heat cannot be easily diffused in the black box; the other end of the black box is led out to be connected with copper (namely, an electric conduction and heat conduction medium, copper is selected exemplarily), the copper is laid on the main board in a large area, a fan blows air to promote air flow, the temperature difference is manufactured, the internal temperature of the black box is easily conducted to the low-temperature external copper sheet, and therefore heat is more effectively dissipated. In order to enable the black box to have excellent heat dissipation performance, the SSD chip (solid-state electronic storage chip) is directly used, a processor is removed, and the heat productivity is reduced; the SSD chip is directly used as a storage unit, and the SATA protocol is used as a communication interface, the capacity is usually 64G, the maximum capacity can reach 256G, and the communication speed can reach 1.5 Gbis/s. The capacity of the conventional vehicle-mounted black box is smaller, the capacity is usually 1GB, the maximum capacity does not exceed 16GB, and the problem of large capacity is difficult to overcome in consideration of heat dissipation because the larger the volume of the black box is, the higher the storage power is, so that the transmission rate is high and the volume is small compared with the traditional scheme;
the temperature protector is characterized in that the power ground wire and the power wire are respectively connected in series with the temperature protector, the temperature protector utilizes the mechanical principle that the node expansion coefficients of the metal sheets are different, when the metal sheets reach a certain temperature (85 ℃ in the invention) due to high temperature outside, the metal sheets automatically bounce open to block the conduction path of the high temperature outside, and the temperature protector is arranged in the damping layer, so that the possible interference caused by external impact and vibration can be effectively prevented;
the communication interface is connected with a high-speed communication relay in series, and a path for introducing high temperature from the communication interface after high temperature appears outside is blocked: the power supply controls the on-off of the high-speed communication relay, when the power is normally supplied, the high-speed communication relay is switched on, the black box normally communicates and works, when the temperature protector is switched off due to high temperature, the power supply loop is switched off, the high-speed communication relay is also switched off, the node is switched off, and all paths conducted from the outside high temperature to the inside of the black box are switched off. The external communication lines are all welded on pins of the high-speed communication relay, and the positions of the PCB (printed circuit board) corresponding to the pins welded with the communication lines are hollowed out to suspend the pins, so that the outside of the high-speed communication relay can only be burnt out even if high temperature is led in from the data lines, and the SSD storage device cannot be influenced by heat conducted by taking the PCB as a medium. The suspended high-speed communication relay end is fixed after being cured by means of a follow-up damping material, so that the condition that external high temperature cannot be conducted to a PCB (printed circuit board) is guaranteed, and the condition that an internal storage unit is not influenced is guaranteed. The invention overcomes the problems that the communication interface of the existing vehicle-mounted black box usually adopts USB, hundred mega Ethernet and other buses, the speed is not high, the large data volume storage is not satisfied, and a processor is required to be additionally arranged for protocol conversion and control, so that the heat productivity is increased.
In summary, the internal storage device of the black box is connected to the power ground, the internal power ground is used for reducing the copper-clad area, the power ground is directly welded inside, the power ground of the external main board is clad with large area copper, the heat is radiated from the inside of the black box with almost no heat exchange through the ground wire by adopting the modes of fan heat dissipation and the like, so that the volume of the black box is reduced to 85mm (width) X37mm (height) X120mm (length), and is reduced by 95 percent relative to the volume of a similar product 160mm (width) X160mm (height) X257mm (length); the temperature protectors are added on the power line and the power ground wire and are solidified by the damping layer, so that the shock resistance is realized, and a temperature conduction path can be cut off from a physical path when the external high-temperature environment exists, so that the high-temperature introduction is prevented; the communication relay is connected in series on the communication interface, the inner end of the relay is welded on the PCB, the outer interface end is suspended, the communication line is directly welded on the pin and fixed through the damping material, when the power supply is powered off due to the starting of the temperature protector, the node of the relay is disconnected, the temperature conduction path is cut off from the material path, and the PCB cannot be damaged by high temperature; the SSD is used as a storage medium, the controller is removed, and the SATA communication interface of the SSD chip is directly led out, so that the storage space is increased, the storage speed is improved, and the heat productivity is reduced due to the fact that no controller is used for heat dissipation.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A black box for recording is characterized by comprising a shell and a storage device arranged in the shell, wherein the storage device is connected with a power supply ground wire and a power supply wire, and the diameter of the power supply ground wire is increased; one end of the power supply ground wire is welded with the storage device, and the other end of the power supply ground wire extends to the outside of the black box and is connected with the electric conduction and heat conduction medium.
2. The black box for recording as claimed in claim 1, wherein a temperature protector is connected in series to the power ground line and the power line, respectively.
3. The black box for recording according to claim 1, wherein the black box is provided with a communication interface, and a relay is connected in series to the communication interface.
4. The black box for recording as claimed in claim 3, wherein a PCB is disposed inside the black box, and one half of the pins of the relay are soldered on the PCB, and the other half of the pins of the relay are connected in series with the communication interface by soldering on the communication line.
5. The black box for recording as claimed in claim 1, wherein the black box does not include a processor and the storage device is a solid state electronic memory chip.
6. The black box for recording as claimed in any one of claims 1 to 5, wherein the area of the electrically and thermally conductive medium is 240mm or more2。
7. The black box for recording as claimed in claim 6, wherein the housing comprises an inner layer and an outer layer with a filled insulation layer therebetween.
8. The black box for recording as claimed in claim 6, wherein a damping filling layer is provided between the storage device and the housing.
9. The black box for recording as claimed in claim 8, wherein the temperature protector is provided in a damping filling layer.
10. The black box for recording as claimed in claim 8, wherein the relay is disposed in the damping filling layer, and a pin of the relay connected to the communication line is suspended.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110952532.5A CN113766806B (en) | 2021-08-19 | 2021-08-19 | Black box for recording |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110952532.5A CN113766806B (en) | 2021-08-19 | 2021-08-19 | Black box for recording |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113766806A true CN113766806A (en) | 2021-12-07 |
| CN113766806B CN113766806B (en) | 2024-01-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110952532.5A Active CN113766806B (en) | 2021-08-19 | 2021-08-19 | Black box for recording |
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| Country | Link |
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| CN (1) | CN113766806B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114596886A (en) * | 2022-03-04 | 2022-06-07 | 苏州科美信息技术有限公司 | Solid state hard drives for new energy automobile-mounted device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007294619A (en) * | 2006-04-24 | 2007-11-08 | Nec Saitama Ltd | Heat dissipation structure |
| WO2015167075A1 (en) * | 2014-04-30 | 2015-11-05 | 현대엠엔소프트 주식회사 | Electronic device for vehicle |
| KR20160133222A (en) * | 2015-05-12 | 2016-11-22 | 한국산업기술대학교산학협력단 | A black box apparatus for recognizing the owner of a vehicle |
| CN210377575U (en) * | 2019-08-19 | 2020-04-21 | 北京全路通信信号研究设计院集团有限公司 | Vehicle-mounted black box protector |
| US20210108823A1 (en) * | 2018-03-26 | 2021-04-15 | Mitsubishi Electric Corporation | Air conditioner |
-
2021
- 2021-08-19 CN CN202110952532.5A patent/CN113766806B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007294619A (en) * | 2006-04-24 | 2007-11-08 | Nec Saitama Ltd | Heat dissipation structure |
| WO2015167075A1 (en) * | 2014-04-30 | 2015-11-05 | 현대엠엔소프트 주식회사 | Electronic device for vehicle |
| KR20160133222A (en) * | 2015-05-12 | 2016-11-22 | 한국산업기술대학교산학협력단 | A black box apparatus for recognizing the owner of a vehicle |
| US20210108823A1 (en) * | 2018-03-26 | 2021-04-15 | Mitsubishi Electric Corporation | Air conditioner |
| CN210377575U (en) * | 2019-08-19 | 2020-04-21 | 北京全路通信信号研究设计院集团有限公司 | Vehicle-mounted black box protector |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114596886A (en) * | 2022-03-04 | 2022-06-07 | 苏州科美信息技术有限公司 | Solid state hard drives for new energy automobile-mounted device |
| CN114596886B (en) * | 2022-03-04 | 2024-03-08 | 苏州科美存储技术有限公司 | Solid state disk for vehicle-mounted device of new energy automobile |
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|---|---|
| CN113766806B (en) | 2024-01-19 |
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