CN113766755A - Selective rapid differential etching process for printed circuit - Google Patents

Abstract

The invention discloses a selective rapid differential etching process for printed circuits, wherein a corrosion inhibitor is added into differential etching solution, the corrosion inhibitor is imidazole derivatives, the imidazole derivatives act on electroplated thickened circuits, and protective agents, namely the imidazole derivatives can be adsorbed at the sharp corners of the circuits to well protect the circuits, so that the circuits are prevented from being over-etched. The minimum line width/line distance of the printed circuit is 50 mu m/50 mu m, and the etching factor exceeds 4.

Description

Selective rapid differential etching process for printed circuit

Technical Field

The invention belongs to the field of circuit board preparation, and particularly belongs to a selective rapid differential etching process for a printed circuit.

Background

The miniaturization, the light weight and the high density of the multifunctional printed circuit of the electronic product can not be separated, the high density of the circuit is realized, and meanwhile, the circuit has higher circuit thickness, and the method is an important scheme for solving the transmission of the large circuit. The differential etching method for manufacturing fine circuits is a solution which is commonly used in the industry, and the technical process of the differential method is as follows: copper clad laminate pattern transfer making circuit negative direction → electroplating thickening circuit → removing negative direction dry film → differential etching. In the differential etching process, the thin circuit and the thickened circuit are etched by spraying external pressure, and the etching amount of the thickened circuit is larger. For this reason, it is desirable to develop a selective, fast differential etch technique.

Disclosure of Invention

(1) Technical problem to be solved

In view of the deficiencies of the prior art, it is an object of the present invention to provide a selective fast differential etching process for printed circuits.

(2) Technical scheme

In order to solve the technical problem, the invention provides a selective rapid differential etching process for a printed circuit, wherein a corrosion inhibitor is added into a differential etching solution, the corrosion inhibitor is an imidazole derivative, the imidazole derivative acts on a circuit which is thickened by electroplating, and a protective agent, namely the imidazole derivative can be adsorbed at the sharp corner of the circuit to well protect the circuit, so that the circuit is prevented from being over-etched.

(3) Advantageous effects

Compared with the prior art, the invention has the beneficial effects that: the minimum line width/line distance of the printed circuit is 50 mu m/50 mu m, and the etching factor exceeds 4.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easily understood and obvious, the technical solutions in the embodiments of the present invention are clearly and completely described below to further illustrate the invention, and obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments.

Example 1

A selective rapid differential etching process for printed circuits is characterized in that a corrosion inhibitor is added into differential etching solution, the corrosion inhibitor is an imidazole derivative, the imidazole derivative acts on electroplated and thickened circuits, and a protective agent, namely the imidazole derivative can be adsorbed at the sharp corners of the circuits to well protect the circuits, so that the circuits are prevented from being over-etched. The minimum line width/line distance of the printed circuit is 50 mu m/50 mu m, and the etching factor exceeds 4.

Having thus described the principal technical features and basic principles of the invention, and the advantages associated therewith, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Furthermore, it should be understood that although the present description is described in terms of various embodiments, not every embodiment includes only a single embodiment, and such descriptions are provided for clarity only, and those skilled in the art will recognize that the embodiments described herein can be combined as a whole to form other embodiments as would be understood by those skilled in the art.

Claims (1)

1. A selective rapid differential etching process for printed circuits is characterized in that a corrosion inhibitor is added into differential etching solution, the corrosion inhibitor is imidazole derivatives, the imidazole derivatives act on electroplated and thickened circuits, and protective agents, namely the imidazole derivatives can be adsorbed at the sharp corners of the circuits to well protect the circuits, so that the circuits are prevented from being over-etched.