CN113764892A - Millimeter wave antenna, antenna array, antenna module and electronic equipment - Google Patents
Millimeter wave antenna, antenna array, antenna module and electronic equipment Download PDFInfo
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- CN113764892A CN113764892A CN202111024459.1A CN202111024459A CN113764892A CN 113764892 A CN113764892 A CN 113764892A CN 202111024459 A CN202111024459 A CN 202111024459A CN 113764892 A CN113764892 A CN 113764892A
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- 239000000758 substrate Substances 0.000 claims abstract description 66
- 230000005855 radiation Effects 0.000 claims abstract description 49
- 230000005540 biological transmission Effects 0.000 claims description 74
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 17
- 230000010287 polarization Effects 0.000 description 6
- 238000005388 cross polarization Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0037—Particular feeding systems linear waveguide fed arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0478—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with means for suppressing spurious modes, e.g. cross polarisation
Abstract
The invention discloses a millimeter wave antenna, an antenna array, an antenna module and electronic equipment.A first radiation patch is arranged on the upper surface of a first dielectric substrate, a second dielectric substrate, a floor and a third dielectric substrate which are sequentially stacked from top to bottom, a first differential feed network and a second differential feed network of a coplanar waveguide are arranged on the lower surface of the third dielectric substrate to form orthogonal radiation, and the two differential feed networks are electrically connected with the first radiation patch through penetrating through holes; the first differential feed network and the second differential feed network are arranged on the same layer, the number of layers of the PCB is reduced on the basis of ensuring the antenna performance, meanwhile, the used signal holes are mechanical holes, the processing cost is low, and the problems that the number of layers is large and the cost is high in the design of the conventional millimeter wave antenna are solved.
Description
Technical Field
The invention belongs to the technical field of antennas, and particularly relates to a millimeter wave antenna, an antenna array, an antenna module and electronic equipment.
Background
With the evolution of the fifth generation communication technology, communication devices are moving toward low latency, high reliability and large bandwidth. Millimeter waves are gradually pushed on the stage of fifth-generation communication technology because of their short wavelength and wide bandwidth to meet these demands more easily. In order to make the millimeter wave communication technology have more obvious advantages, the millimeter wave antenna needs to meet the requirements of wide bandwidth, high port isolation, high gain, low cross polarization and the like.
At present, in order to improve the performance of the millimeter wave antenna, indexes such as isolation, cross polarization ratio and gain among polarization ports of the antenna are generally improved by adopting a differential feed mode. Due to the complex design of the differential feed network, the differential feed network is usually required to be designed into a dual-polarization and array form and is required to be connected with a radio frequency chip through a feeder line. Therefore, the number of layers of the PCB needs to be designed to meet the wiring requirement, and the processing cost of the millimeter wave antenna is increased.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a millimeter wave antenna, an antenna array, an antenna module and an electronic device, so as to solve the problems of more design layers and higher cost of the existing millimeter wave antenna.
In order to solve the problems, the technical scheme of the invention is as follows:
the millimeter wave antenna comprises a first radiation patch, a first dielectric substrate, a second dielectric substrate, a floor, a third dielectric substrate and a first differential feed network from top to bottom in sequence; the feed circuit also comprises a second differential feed network and a plurality of through holes;
the first radiation patch is positioned on the upper surface of the first dielectric substrate;
the floor is positioned on the lower surface of the second dielectric substrate or the upper surface of the third dielectric substrate;
the first differential feed network and the second differential feed network are respectively arranged on the lower surface of the third dielectric substrate; the first differential feed network and the second differential feed network are positioned on the same layer, are coplanar waveguides and are used for forming orthogonal radiation of the antenna;
the plurality of via holes penetrate through the floor, the first dielectric substrate, the second dielectric substrate and the third dielectric substrate, and two ends of each via hole are respectively and electrically connected with the first radiation patch and the corresponding first differential feed network and the second differential feed network.
According to the millimeter wave antenna, the first differential feed network and the second differential feed network are coplanar waveguide transmission lines with the ground.
In the millimeter wave antenna of the present invention, the first differential feed network includes a first feed input transmission line and a first feed output transmission line; the first feeding input transmission line is directly and electrically connected with the first feeding output transmission line, and the transmission phase of the first feeding output transmission line is 180 degrees.
According to the millimeter wave antenna, the second differential feed network comprises a second feed input transmission line, a second feed output transmission line and a third feed output transmission line; the second feeding input transmission line is electrically connected with the second feeding output transmission line and the third feeding output transmission line through T-shaped junctions respectively, and the transmission phase difference of the second feeding output transmission line and the third feeding output transmission line is 180 degrees.
In the millimeter wave antenna of the present invention, the second differential feed network further comprises an impedance match line; the impedance match line is electrically connected between the second feed input transmission line and the T-junction.
The millimeter wave antenna also comprises a plurality of shielding holes, wherein the shielding holes are respectively arranged on the peripheral sides of the first differential feed network and the second differential feed network and used for inhibiting the generation of high-order modes around the coplanar waveguide transmission line with the ground.
In the millimeter wave antenna of the invention, the shape of the first radiation patch is a circular or polygonal shape or a combined structure of a circular shape and a polygonal shape.
The millimeter wave antenna also comprises a second radiation patch; the second radiation patch is arranged on the upper layer of the first radiation patch; and a projection of the second radiation patch on the floor partially overlaps with a projection of the first radiation patch on the floor.
In the millimeter wave antenna of the invention, the shape of the second radiation patch is a circular or polygonal shape or a combined structure of the circular and the polygonal shapes.
The millimeter wave antenna also comprises a fourth dielectric substrate and a fifth dielectric substrate; the fifth dielectric substrate is arranged between the first radiation patch and the fourth dielectric substrate, and the second radiation patch is arranged on the upper surface of the fourth dielectric substrate.
The array antenna comprises the millimeter wave antenna, a plurality of first series power dividers and second series power dividers, wherein the millimeter wave antenna comprises a plurality of millimeter wave antennas;
the first series power divider is electrically connected with the plurality of first differential feed networks respectively and is used for realizing the parallel connection of the plurality of first differential feed networks;
the second series power divider is electrically connected to the plurality of second differential feed networks, and is configured to implement parallel connection of the plurality of second differential feed networks.
In the array antenna of the present invention, the first series power divider and the first differential feed network are located in the same layer.
In the array antenna of the present invention, the second series power divider and the second differential feed network are located in the same layer.
The invention provides an antenna module, which comprises the array antenna.
The antenna module further comprises a power supply data connector, a first radio frequency chip, a second radio frequency chip, a first radio frequency connecting wire and a second radio frequency connecting wire;
the power supply data connector is electrically connected with partial ports of the first radio frequency chip and the second radio frequency chip and is used for realizing power supply and control of the first radio frequency chip and the second radio frequency chip;
the radio frequency output ends of the first radio frequency chips are respectively and electrically connected with the first radio frequency connecting lines, and the first radio frequency connecting lines are respectively and electrically connected with the first series power dividers;
the radio frequency output ends of the second radio frequency chips are electrically connected with the second radio frequency connecting lines respectively, and the second radio frequency connecting lines are electrically connected with the second series power dividers respectively;
the first radio frequency chip and the second radio frequency chip are attached to the lower surface of the third dielectric substrate and are located in the area outside the first series power divider and the second series power divider.
According to the antenna module, the first radio frequency chip and the second radio frequency chip are packaged in a BGA mode.
According to the antenna module, the first radio frequency connecting line and the second radio frequency connecting line are strip lines, and the transmission phase difference of the strip lines is smaller than 360 degrees.
According to the antenna module, the first radio frequency chip and the second radio frequency chip are packaged in a QFN (quad Flat No lead) package mode.
According to the antenna module, the first radio frequency connecting line and the second radio frequency connecting line are grounded coplanar waveguide transmission lines, and the transmission phase difference of the grounded coplanar waveguide transmission lines is smaller than 360 degrees.
An electronic device according to the present invention includes the millimeter wave antenna described above, or includes the array antenna described above.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects:
according to the embodiment of the invention, the first dielectric substrate, the second dielectric substrate, the floor and the third dielectric substrate which are sequentially stacked from top to bottom are arranged, the first radiation patch is arranged on the upper surface of the first dielectric substrate, the first differential feed network and the second differential feed network of the coplanar waveguide are arranged on the lower surface of the third dielectric substrate to form orthogonal radiation, and the two differential feed networks are electrically connected with the first radiation patch through the through holes; the first differential feed network and the second differential feed network are arranged on the same layer, the number of layers of the PCB is reduced on the basis of ensuring the antenna performance, meanwhile, the used signal holes are mechanical holes, the processing cost is low, and the problems that the number of layers is large and the cost is high in the design of the conventional millimeter wave antenna are solved.
Drawings
FIG. 1 is a 3D perspective view of a millimeter wave antenna according to one embodiment of the present invention;
FIG. 2 is a bottom view of a millimeter-wave antenna in accordance with an embodiment of the present invention;
FIG. 3 is a side view of a millimeter-wave antenna in accordance with an embodiment of the present invention;
FIG. 4 is a 3D perspective view of a millimeter wave antenna according to an embodiment of the present invention;
FIG. 5 is a simulated S parameter of an embodiment of the present invention;
FIG. 6 is a simulated gain of an embodiment of the present invention;
FIG. 7 is a simulated cross-polarization ratio of an embodiment of the present invention;
fig. 8 is a 3D perspective view of a 1 x 4 array antenna in accordance with an embodiment of the present invention;
fig. 9 is a perspective plan view of an 8 x 8 array antenna in accordance with an embodiment of the present invention;
fig. 10 is a block diagram of an antenna module system according to an embodiment of the invention;
fig. 11 is a plan perspective view of an antenna module according to an embodiment of the invention.
Description of reference numerals: 1: a first radiating patch; 201: a first differential feed network; 2011: a first feed input transmission line; 2012: a first feed output transmission line; 202: a second differential feed network; 2021: a second feed input transmission line; 20211: an impedance match line; 2022: a second feed output transmission line; 2023: a third feed output transmission line; 3: a floor; 4: a via hole; 401: a first metallized via; 402: a second metallized via; 403: a third metallized via; 404: a fourth metallized via; 5: a first dielectric substrate; 6: a second dielectric substrate; 7: a third dielectric substrate; 8: a second radiating patch; 9: a fourth dielectric substrate; 10: a fifth dielectric substrate; 11: a first series power divider; 12: a second series power divider; 1301: a first radio frequency chip; 1302: a second radio frequency chip; 1401: a first radio frequency connector; 1402: a second radio frequency connector; 15: and the radio frequency connecting line.
Detailed Description
The millimeter wave antenna, the antenna array, the antenna module and the electronic device according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims.
Referring to fig. 1 to 3, in one embodiment, a millimeter wave antenna includes, in order from top to bottom, a first radiating patch 1, a first dielectric substrate 5, a second dielectric substrate 6, a floor 3, a third dielectric substrate 7, and a first differential feed network 201. The millimeter wave antenna further comprises a second differential feed network 202 and a number of vias 4.
Wherein, the first radiation patch 1 is located on the upper surface of the first dielectric substrate 5. The floor board 3 is located on the lower surface of the second dielectric substrate 6 or the upper surface of the third dielectric substrate 7, and the second dielectric substrate 6 may be a prepreg. The first differential feed network 201 and the second differential feed network 202 are respectively arranged on the lower surface of the third dielectric substrate 7. The first and second differential feed networks 201 and 202 are located in the same layer, are coplanar waveguides and are used to form the orthogonal radiation of the antenna. The plurality of via holes 4 penetrate through the floor 3, the first dielectric substrate 5, the second dielectric substrate 6 and the third dielectric substrate 7, and two ends of each via hole 4 are electrically connected with the first radiation patch 1 and the corresponding first differential feed network 201 and the second differential feed network 202 respectively.
In the embodiment, a first dielectric substrate 5, a second dielectric substrate 6, a floor 3 and a third dielectric substrate 7 which are stacked in sequence from top to bottom are arranged, a first radiation patch 1 is arranged on the upper surface of the first dielectric substrate 5, a first differential feed network 201 and a second differential feed network 202 of a coplanar waveguide are arranged on the lower surface of the third dielectric substrate 7 to form orthogonal radiation, and the two differential feed networks are electrically connected with the first radiation patch 1 through a through hole 4; the first differential feed network 201 and the second differential feed network 202 are arranged on the same layer, the number of layers of a PCB is reduced on the basis of ensuring the performance of an antenna, meanwhile, the used signal holes are mechanical through holes, the processing cost is low, and the problems that the number of layers is large and the cost is high in the design of the conventional millimeter wave antenna are solved.
The millimeter wave antenna of the present embodiment is processed by a PCB multi-layer board process, and the specific structure of the millimeter wave antenna of the present embodiment is further described below:
in the present embodiment, the first and second differential feed networks 201 and 202 are both implemented by coplanar waveguide transmission lines with ground.
The first differential feeding network 201 includes a first feeding input transmission line 2011 and a first feeding output transmission line 2012. The first feed input transmission line 2011 is directly connected to the first feed output transmission line 2012. The two ends of the first feeding output transmission line 2012 are connected to the first radiating patch 1 through the first metalized via 401 and the second metalized via 402. The first feeding output transmission line 2012 has a transmission phase of 180 degrees. For achieving a +45 degree polarization direction radiation of the first radiating patch 1.
The second differential feed network 202 includes a second feed input transmission line 2021, a second feed output transmission line 2022, and a third feed output transmission line 2023. The first feeding input transmission line 2011 is connected to the second feeding output transmission line 2022 and the third feeding output transmission line 2023 through T-junctions, respectively. The second feeding output transmission line 2022 and the third feeding output transmission line 2023 are connected to the first radiating patch 1 through a third metalized via 403 and a fourth metalized via 404, respectively. The second feed output transmission line 2022 and the third feed output transmission line 2023 transmit a phase difference of 180 degrees. For achieving-45 degree polarization direction radiation of the first radiating patch 1. The second feeding input transmission line 2021 further comprises an impedance matching line 20211 electrically connected between the second feeding input transmission line 2021 and the T-junction, and the impedance matching line 20211 may be specifically an 1/4 wavelength impedance matching line 20211, 1/4 wavelength impedance matching line 20211 for implementing impedance matching of a millimeter wave antenna.
In this embodiment, the millimeter wave antenna further includes a plurality of shielding holes, and the shielding holes are distributed around the first differential feed network 201 and the second differential feed network 202 to suppress generation of higher-order modes around the coplanar waveguide transmission line with the ground.
The shape of the first radiation patch 1 is a circular shape or a polygonal shape or a combined structure of a circular shape and a polygonal shape. In order to meet the requirement of orthogonal radiation of the millimeter wave antenna, in the present embodiment, the shape of the first radiation patch 1 is a square, but the shape is not limited thereto and is not particularly limited.
Example two
Referring to fig. 4, the present embodiment provides another millimeter wave antenna based on the first embodiment, and the millimeter wave antenna of the present embodiment further includes a second radiation patch 8, a fourth dielectric substrate 9, and a fifth dielectric substrate 10 stacked above the first radiation patch 1 in sequence from top to bottom. And the projection of the second radiation patch 8 on the floor 3 overlaps with the projection of the first radiation patch 1 on the floor 3. The fifth dielectric substrate 10 may be a prepreg.
Specifically, the second radiation patch 8 may be square in shape, and the second radiation patch 8 coincides with the central axis of the first radiation patch 1. The first radiating patch 11 excites a new resonant mode on the second radiating patch 88 in a coupling manner, thereby widening the bandwidth of a millimeter wave antenna.
FIG. 5 shows the simulated S-parameters of the embodiment of the present invention, showing that the +45 degree polarization 10dB return loss bandwidth is 26-30.4GHz, the-45 degree polarization 10dB return loss bandwidth is 26.4-30.1GHz, and the isolation between the two polarization ports is greater than 30 dB. The N257 and N261 bands can be covered.
FIG. 6 is a graph of simulated gain variation with frequency according to the embodiment of the present invention, which shows that the gain is greater than 5dBi at 26.5-29.5 GHz.
FIG. 7 shows the simulated cross polarization ratio of the embodiment of the present invention, and it can be seen that the E-plane and H-plane cross polarization ratios are both greater than 25dB in the range of-60 deg. to +60 deg. at 28GHz cut.
EXAMPLE III
The present embodiment is an array antenna including the millimeter wave antenna in the first embodiment or the second embodiment. On the basis of the millimeter wave antenna, the power divider further comprises a plurality of first series power dividers 11 and second series power dividers 12. The first series power divider 11 is electrically connected to the plurality of first differential feed networks 201, respectively, and is configured to implement parallel connection of the plurality of first differential feed networks 201. The second series power divider 12 is electrically connected to the plurality of second differential feed networks 202, respectively, and is configured to implement parallel connection of the plurality of second differential feed networks 202. The one-to-multiple millimeter wave antenna units are realized by arranging the series power divider, so that the feeding of the antenna array is realized in a compact space.
In this embodiment, a 1 × 4 dual-polarized millimeter wave antenna sub-array is implemented by providing the first series power divider 11 and the second series power divider 12. As shown in fig. 8, the first serial power divider 11 is a divide-by-four power divider, and is connected to four +45 degree polarized millimeter wave antenna units by outputting equal-amplitude and in-phase radio frequency signals, so as to enhance the antenna directivity; the second series power divider 12 is also a divide-by-four power divider, and it outputs radio frequency signals with equal amplitude and in phase to connect with four millimeter wave antenna units polarized at-45 degrees, so as to enhance the antenna directivity. In addition, the first series power divider 11, the second series power divider 212, the first differential feed network 201, and the second differential feed network 202 are all located in the same layer. And the number of layers of the PCB is less, so that the processing cost is reduced.
Further, an 8 × 8 array antenna is realized by arranging 1 × 4 sub-arrays in a 2 × 8 matrix, as shown in fig. 9. The array line has higher gain and fewer feed input ports, and the use number of radio frequency chips can be effectively reduced.
Example four
The present embodiment provides an antenna module including the array antenna in the third embodiment. The antenna module of this embodiment further includes a power data connector, a first rf chip 1301, a second rf chip 1302, a first rf connection line, and a second rf connection line.
The power data connector is electrically connected with part of ports of the first radio frequency chip 1301 and the second radio frequency chip 1302, and is used for realizing power supply and control of the first radio frequency chip 1301 and the second radio frequency chip 1302. The rf output terminals of the first rf chips 1301 are electrically connected to the first rf connection lines, and the first rf connection lines are electrically connected to the first series power dividers 11. The rf output terminals of the second rf chips 1302 are electrically connected to the second rf connection lines, and the second rf connection lines are electrically connected to the second series power splitters 12. Meanwhile, a first radio frequency connector 1401 and a second radio frequency connector 1402 which are connected with the first radio frequency chip 1301 and the second radio frequency chip 1302 are also provided.
The first radio frequency chip 1301 and the second radio frequency chip 1302 are packaged in a BGA package. The first radio frequency connecting line and the second radio frequency connecting line are strip lines, and the transmission phase difference of the strip lines is less than 360 degrees.
In other embodiments, the first rf chip 1301 and the second rf chip 1302 may be packaged in a QFN package. At this time, the first radio frequency connecting line and the second radio frequency connecting line are grounded coplanar waveguide transmission lines, and the transmission phase difference of the plurality of grounded coplanar waveguide transmission lines is less than 360 degrees.
Fig. 10 is a system block diagram of the antenna module, and fig. 11 is a perspective view of the antenna module. In the second embodiment, an 8 × 8 antenna array is designed in the center of the module, and the first rf chip 13011301 and the second rf chip 13021302 are respectively located around the 8 × 8 antenna array. The radio frequency chip is a multichannel millimeter wave phased array chip, in this embodiment, is a 16-channel millimeter wave phased array chip, and is BGA packaged, wherein 8 channels are polarized at +45 degrees, and 8 channels are polarized at-45 degrees. The output ports of the rf chip are respectively connected to the plurality of first series power dividers 11 and the plurality of second series power dividers 12 through rf connection lines 15. The rf connection 15 is a strip line and is connected to the first or second series power divider 11, 12 at a suitable location and through the metalized via 4 to the surface layer. The first rf chip 1301, that is, the +45 polarized rf chip channel, is connected to the first series power divider 11 through the first rf connection line with the same phase difference; the second rf chip 1302, i.e., the-45 degree polarized rf chip channel, is connected to the second series power divider 12 through a second rf connection line with the same phase difference. Thereby achieving beam scanning over a wide band. The first rf chip 1301 and the second rf chip 1302 are attached to the lower surface of the third dielectric substrate 7, and are located outside the first series power divider 11 and the second series power divider 12. The radio frequency chip is arranged outside the area of the radiation patch projected on the PCB, so that the design of the active antenna module is realized under the condition of not increasing the number of layers of the PCB.
EXAMPLE five
Based on the same inventive concept, the present embodiment further provides an electronic device, which includes the millimeter wave antenna of the first embodiment or the second embodiment, or includes the array antenna of the third embodiment, or includes the array antenna of the fourth embodiment.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is still within the scope of the present invention if they fall within the scope of the claims of the present invention and their equivalents.
Claims (20)
1. A millimeter wave antenna is characterized by sequentially comprising a first radiation patch, a first dielectric substrate, a second dielectric substrate, a floor, a third dielectric substrate and a first differential feed network from top to bottom; the feed circuit also comprises a second differential feed network and a plurality of through holes;
the first radiation patch is positioned on the upper surface of the first dielectric substrate;
the floor is positioned on the lower surface of the second dielectric substrate or the upper surface of the third dielectric substrate;
the first differential feed network and the second differential feed network are respectively arranged on the lower surface of the third dielectric substrate; the first differential feed network and the second differential feed network are positioned on the same layer, are coplanar waveguides and are used for forming orthogonal radiation of the antenna;
the plurality of via holes penetrate through the floor, the first dielectric substrate, the second dielectric substrate and the third dielectric substrate, and two ends of each via hole are respectively and electrically connected with the first radiation patch and the corresponding first differential feed network and the second differential feed network.
2. The millimeter-wave antenna of claim 1, wherein the first and second differential feed networks are coplanar waveguide transmission lines with ground.
3. The millimeter-wave antenna of claim 2, wherein the first differential feed network comprises a first feed input transmission line and a first feed output transmission line; the first feeding input transmission line is directly and electrically connected with the first feeding output transmission line, and the transmission phase of the first feeding output transmission line is 180 degrees.
4. The millimeter-wave antenna of claim 2, wherein the second differential feed network comprises a second feed input transmission line, a second feed output transmission line, and a third feed output transmission line; the second feeding input transmission line is electrically connected with the second feeding output transmission line and the third feeding output transmission line through T-shaped junctions respectively, and the transmission phase difference of the second feeding output transmission line and the third feeding output transmission line is 180 degrees.
5. The millimeter-wave antenna of claim 4, wherein the second differential feed network further comprises an impedance match line; the impedance match line is electrically connected between the second feed input transmission line and the T-junction.
6. The millimeter wave antenna according to claim 2, further comprising a plurality of shielding holes provided on the peripheral sides of the first and second differential feed networks, respectively, for suppressing generation of higher order modes around the coplanar waveguide transmission line with ground.
7. The millimeter-wave antenna according to claim 1, wherein the first radiation patch has a shape of a circle or a polygon or a combined structure of a circle and a polygon.
8. The millimeter-wave antenna of claim 1, further comprising a second radiating patch; the second radiation patch is arranged on the upper layer of the first radiation patch; and a projection of the second radiation patch on the floor partially overlaps with a projection of the first radiation patch on the floor.
9. The millimeter-wave antenna of claim 8, wherein the second radiating patch is circular or polygonal in shape or a combination of circular and polygonal.
10. The millimeter-wave antenna of claim 8, further comprising a fourth dielectric substrate and a fifth dielectric substrate; the fifth dielectric substrate is arranged between the first radiation patch and the fourth dielectric substrate, and the second radiation patch is arranged on the upper surface of the fourth dielectric substrate.
11. An array antenna, comprising the millimeter wave antenna according to any one of claims 1 to 10, further comprising a plurality of first series power dividers and second series power dividers;
the first series power divider is electrically connected with the plurality of first differential feed networks respectively and is used for realizing the parallel connection of the plurality of first differential feed networks;
the second series power divider is electrically connected to the plurality of second differential feed networks, and is configured to implement parallel connection of the plurality of second differential feed networks.
12. The array antenna of claim 11, wherein the first series power divider is located at the same layer as the first differential feed network.
13. The array antenna of claim 11, wherein the second series power divider is located at the same layer as the second differential feed network.
14. An antenna module comprising a millimeter wave antenna according to any of claims 1 to 10 or an array antenna according to any of claims 11 to 13.
15. The antenna module of claim 14, further comprising a power data connector, a first rf chip, a second rf chip, a first rf connection line, and a second rf connection line;
the power supply data connector is electrically connected with partial ports of the first radio frequency chip and the second radio frequency chip and is used for realizing power supply and control of the first radio frequency chip and the second radio frequency chip;
the radio frequency output ends of the first radio frequency chips are respectively and electrically connected with the first radio frequency connecting lines, and the first radio frequency connecting lines are respectively and electrically connected with the first series power dividers;
the radio frequency output ends of the second radio frequency chips are electrically connected with the second radio frequency connecting lines respectively, and the second radio frequency connecting lines are electrically connected with the second series power dividers respectively;
the first radio frequency chip and the second radio frequency chip are attached to the lower surface of the third dielectric substrate and are located in the area outside the first series power divider and the second series power divider.
16. The antenna module of claim 15, wherein the first rf chip and the second rf chip are packaged in the form of a BGA package.
17. The antenna module of any one of claims 15 or 16, wherein the first rf connection line and the second rf connection line are strip lines, and a transmission phase difference of the plurality of strip lines is less than 360 degrees.
18. The antenna module of claim 15, wherein the first RF chip and the second RF chip are packaged in a QFN package.
19. The antenna module of any one of claims 15 or 18, wherein the first and second rf connection lines are ground coplanar waveguide transmission lines, and wherein a transmission phase difference of a plurality of the ground coplanar waveguide transmission lines is less than 360 degrees.
20. An electronic device comprising a millimeter wave antenna according to any of claims 1 to 10, or comprising an array antenna according to any of claims 11 to 13, or comprising an antenna module according to any of claims 14 to 19.
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| CN202111024459.1A CN113764892A (en) | 2021-09-02 | 2021-09-02 | Millimeter wave antenna, antenna array, antenna module and electronic equipment |
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| CN202111024459.1A CN113764892A (en) | 2021-09-02 | 2021-09-02 | Millimeter wave antenna, antenna array, antenna module and electronic equipment |
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| CN108695597A (en) * | 2018-06-20 | 2018-10-23 | 深圳市深大唯同科技有限公司 | A kind of dual-polarized patch antenna unit with engraved structure |
| CN108899644A (en) * | 2018-06-20 | 2018-11-27 | 深圳市深大唯同科技有限公司 | A kind of low section, miniaturization, high-isolation dual-polarized patch antenna unit |
| US20200212596A1 (en) * | 2018-12-28 | 2020-07-02 | AAC Technologies Pte. Ltd. | Millimeter wave array antenna and mobile terminal |
| CN111987435A (en) * | 2020-07-03 | 2020-11-24 | 华南理工大学 | Low-profile dual-polarized antenna, array antenna and wireless communication equipment |
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| CN108695597A (en) * | 2018-06-20 | 2018-10-23 | 深圳市深大唯同科技有限公司 | A kind of dual-polarized patch antenna unit with engraved structure |
| CN108899644A (en) * | 2018-06-20 | 2018-11-27 | 深圳市深大唯同科技有限公司 | A kind of low section, miniaturization, high-isolation dual-polarized patch antenna unit |
| WO2019242088A1 (en) * | 2018-06-20 | 2019-12-26 | 深圳市深大唯同科技有限公司 | Dual-polarized patch antenna unit with hollowed-out structure |
| US20200212596A1 (en) * | 2018-12-28 | 2020-07-02 | AAC Technologies Pte. Ltd. | Millimeter wave array antenna and mobile terminal |
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