CN113763836A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
- Publication number
- CN113763836A CN113763836A CN202111041600.9A CN202111041600A CN113763836A CN 113763836 A CN113763836 A CN 113763836A CN 202111041600 A CN202111041600 A CN 202111041600A CN 113763836 A CN113763836 A CN 113763836A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- display
- conductive film
- film layer
- display module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the application provides a display module assembly and display device, display module assembly include the display area and around the non-display area of display area, display module assembly includes backup pad, display panel, apron, circuit board and piezoceramics structure. Wherein, the display panel is positioned at one side of the support plate; the cover plate is positioned on one side of the display panel far away from the support plate; the circuit board is positioned on one side of the support plate far away from the display panel and is electrically connected with the display panel; the piezoelectric ceramic structure is located on one side, close to the display panel, of the cover plate, the piezoelectric ceramic structure is arranged in the non-display area of the cover plate, and the piezoelectric ceramic structure is electrically connected with the circuit board. The display module that this application embodiment provided has reduced the space occupancy of earphone structure among the display device, has improved display device's screen and has occupied than.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a display device.
Background
This section provides background information related to the present application and is not necessarily prior art.
With the development of display technology, the market demand for high-screen-ratio display devices is more and more urgent, and the display devices are developing towards full screen and light and thin.
In the related art, the display device includes a display panel and an earpiece structure disposed inside the display device. Because the traditional earphone structures such as a voice coil mobile phone earphone and the like have larger volumes, the space occupancy rate of the earphone structure is higher for a display device with smaller volume of a mobile phone. In addition, in order to ensure that the receiver structure works normally, the opening processing is required to be carried out on the display panel and the corresponding area of the receiver structure, but the opening of the display panel cannot be displayed normally, and the screen occupation ratio of the display device is reduced.
Disclosure of Invention
An object of the embodiments of the present application is to provide a display module and a display device, so as to reduce the space occupancy rate of a receiver structure in the display device and improve the screen occupation ratio of the display device. The specific technical scheme is as follows:
an aspect of the embodiment of the application provides a display module assembly, and display module assembly includes the display area and surrounds the non-display area of display area, and display module assembly includes backup pad, display panel, circuit board, apron and piezoceramics structure. Wherein the display panel is positioned at one side of the support plate; the circuit board is positioned on one side of the support plate far away from the display panel and is electrically connected with the display panel; the cover plate is positioned on one side of the display panel far away from the support plate; the piezoelectric ceramic structure is arranged in the non-display area of the cover plate and is electrically connected with the circuit board.
In some embodiments, the display module further includes a conductive film layer disposed in the non-display region of the cover plate, the conductive film layer being electrically connected to the circuit board;
the piezoelectric ceramic structure is arranged on one side of the conductive film layer, which is far away from the cover plate, and the piezoelectric ceramic structure is electrically connected with the conductive film layer.
In some embodiments, the display module further includes at least one connection structure, the conductive film layer is electrically connected to the circuit board through the at least one connection structure, wherein:
the at least one connecting structure comprises a bulge arranged on one side of the conductive film layer close to the circuit board and a groove arranged on one side of the circuit board close to the conductive film layer and matched with the bulge; or
At least one connection structure including set up in electrically conductive rete be close to the recess of circuit board one side, and set up in the circuit board be close to electrically conductive rete one side and with recess assorted arch.
In some embodiments, the conductive film layer includes at least one first input pin and at least one first output pin electrically connected to the circuit board;
one side, close to the conductive film layer, of the piezoelectric ceramic structure comprises an electric connection area, the piezoelectric ceramic structure comprises at least one second input pin and at least one second output pin which are located in the electric connection area, the at least one first output pin is connected with the at least one second input pin in a compression joint mode, and the at least one second output pin is connected with the at least one first input pin in a compression joint mode.
In some embodiments, the electrical connection region is adhesively connected to the conductive film layer by a conductive adhesive.
In some embodiments, the conductive film layer and the circuit board are of an integral structure.
In some embodiments, the material of the conductive film layer comprises a piezoelectric fiber composite.
In some embodiments, the circuit board is a flexible circuit board.
In some embodiments, the display module further comprises a backplane and a polarizer layer. Wherein the bottom plate is located between the display panel and the support; the polarizer layer is located between the display panel and the cover plate.
Another aspect of the embodiments of the present application provides a display device, where the display device includes any one of the display modules described above.
The embodiment of the application has the following beneficial effects:
the embodiment of the application provides a display module assembly and display device, display module assembly include the display area and surround the non-display area in display area. The display module comprises a display panel, a cover plate, a circuit board and a piezoelectric ceramic structure. Wherein, apron and display panel also include display area and non-display area, and the display area of apron and display panel corresponds with the display area of display module assembly, and the non-display area of apron and display panel corresponds with the non-display area of display module assembly. The piezoelectric ceramic structure is arranged in a non-display area on the inner side of the cover plate and is electrically connected with the circuit board, and the circuit board can input an electric signal to the piezoelectric ceramic structure so that the piezoelectric ceramic structure vibrates and produces sound under the action of the electric signal. In the display module assembly that this application embodiment provided, adopt piezoceramics structure to act as display device's earphone structure, piezoceramics structure sound production under the effect of signal of telecommunication need not to set up the tin hole on the apron, has increased display module assembly's display area to the screen that has increased display module assembly accounts for the ratio. In addition, the piezoceramics structure is integrated as an organic whole with the display module assembly, and compares in traditional earphone structure piezoceramics structure's volume less, has reduced the space occupancy of earphone structure among the display device. And because the display panel and the piezoelectric ceramic structure are electrically connected with the same circuit board, a separate circuit board is not required to be provided for the piezoelectric ceramic structure, and the space occupancy rate of the receiver structure in the display device is further reduced.
Of course, not all advantages described above need to be achieved at the same time in the practice of any one product or method of the present application.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and it is also obvious for a person skilled in the art to obtain other embodiments according to the drawings.
FIG. 1 is a schematic view of a display module according to some embodiments of the present disclosure;
FIG. 2 is a schematic diagram of a partial structure of a display module according to some embodiments of the present disclosure;
FIG. 3 is a schematic view of another partial structure of a display module according to some embodiments of the present disclosure;
FIG. 4 is a schematic structural view of a piezoceramic structure according to some embodiments of the present application;
fig. 5 is a sectional view taken along a-a in fig. 1.
Reference numerals: 100-a display area; 110-a non-display area; 1-a support plate; 2-a display panel; 3-cover plate; 4-a circuit board; 41-a connecting part; 5-a piezoelectric ceramic structure; 51-an electrical connection area; 52-a body region; 511-a second input pin; 512-a second output pin; 6-a conductive film layer; 61-a first input pin; 62-a first output pin; 7-a bottom plate; 8-a polarizer layer; 9-a tie layer; 10-transparent glue layer.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the description herein are intended to be within the scope of the present disclosure.
It is noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may also be present. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intermediate layer or element may also be present. Like reference numerals refer to like elements throughout.
In the related art, taking the display device as a mobile phone as an example, the display module and the handset of the mobile phone are connected to the motherboard of the mobile phone through different circuit boards, which makes the space occupancy rate of the handset and the circuit board connected to the handset higher. In addition, for guaranteeing handset normal work, need set up the earphone hole that corresponds with handset on display module's apron, display module's earphone hole department can't show, and this makes display module can't realize real comprehensive screen, has reduced the screen of cell-phone and has accounted for the ratio.
In order to reduce the space occupancy rate of a receiver structure in a display device and improve the screen occupation ratio of the display device, the embodiment of the application provides a display module and the display device. The display module and the display device provided in the above application will be described in detail with reference to the accompanying drawings. The Display module includes, but is not limited to, an LCD (Liquid Crystal Display), an OLED (Organic Light Emitting Diode), and a QLED (Quantum Dot Light Emitting Diode).
As shown in fig. 1 to 3, the display module provided in the embodiment of the present application includes a display area 100 and a non-display area 110 surrounding the display area 100. The display module comprises a support plate 1, a display panel 2, a cover plate 3, a circuit board 4 and a piezoelectric ceramic structure 5. Wherein the display panel 2 is located at one side of the support plate 1. The circuit board 4 is located on a side of the supporting plate 1 away from the display panel 2, and the circuit board 4 is electrically connected with the display panel 2. The cover plate 3 is located on the side of the display panel 2 remote from the support plate 1. The piezoelectric ceramic structure 5 is disposed in the non-display area of the cover plate 3, and the piezoelectric ceramic structure 5 is electrically connected to the circuit board 4.
In the embodiment of the present application, the display panel 2 and the cover plate 3 also include a display area and a non-display area, the display area of the display panel 2 and the cover plate 3 corresponds to the display area 100 of the display module, and the non-display area of the display panel 2 and the cover plate 3 corresponds to the non-display area 110 of the display module. The display panel 2 may be a display panel including a display functional layer, and the display panel 2 may also be a touch display panel including a display functional layer and a touch functional layer, which is not specifically limited in this embodiment of the application. The cover plate 3 may be a rigid cover plate, such as a glass cover plate or the like. The cover 3 may also be a flexible cover, such as a transparent PI (polyimide) cover, which is not specifically limited in this embodiment. Further, the support plate 1 may be a metal support plate.
In addition, circuit board 4 is connected with display panel 2 electricity, and is concrete, and display panel 2's non-display area is provided with circuit board bonding pin, and circuit board 4 is connected with circuit board bonding pin electricity. The piezoelectric ceramic structure 5 is also electrically connected to the circuit board 4, i.e. the piezoelectric ceramic structure 5 and the display panel 2 are electrically connected to the same circuit board 4.
According to the display module assembly that this application embodiment provided, the display module assembly includes backup pad 1, display panel 2, apron 3, circuit board 4 and piezoceramics structure 5. Piezoelectric ceramic structure 5 sets up in the inboard non-display area of apron 3, and piezoelectric ceramic structure 5 is connected with circuit board 4 electricity, can input the signal of telecommunication to piezoelectric ceramic structure 5 based on this circuit board 4 for piezoelectric ceramic structure 5 vibrates the sound production under the effect of the signal of telecommunication. Adopt piezoceramics structure 5 to act as display device's earphone structure, piezoceramics structure 5 is the sound production under the effect of signal of telecommunication, need not to set up the earphone hole on apron 3, has increased display module's 100 areas in the display area to the screen that has increased display module is occupied than. In addition, piezoceramics structure 5 is integrated as an organic whole with the display module assembly, and compares in traditional earphone structure piezoceramics structure 5's volume less, has reduced the space occupancy of earphone structure among the display device. And because the display panel 2 and the piezoelectric ceramic structure 5 are both electrically connected with the same circuit board 4, the piezoelectric ceramic structure 5 does not need to be provided with a separate circuit board 4, and the space occupancy rate of a receiver structure in the display device is further reduced.
In some embodiments, the piezoelectric ceramic structure 5 is disposed on the inner side of the cover plate 3, i.e. the side of the cover plate 3 close to the display panel 2, so as to hide the piezoelectric ceramic structure 5 inside the display device when the display module is mounted on the display device. In addition, the piezoelectric ceramic structure 5 is disposed in the non-display region of the cover plate 3 on the upper side of the display region. Specifically, when the display panel 2 displays a screen, the piezoelectric ceramic structure 5 is located above the display screen. Taking the display device as a mobile phone as an example, for the convenience of users, the mobile phone handset is usually disposed on the upper side of the display module of the mobile phone. Therefore, the piezoelectric ceramic structure 5 is arranged in the non-display area of the cover plate 3, which is positioned on the upper side of the display area, so that the use of a user can be facilitated, and the use experience of the user is improved.
In some embodiments, the circuit board 4 is a flexible circuit board. When the circuit board 4 is a flexible circuit board, the circuit board 4 can be adjusted according to actual requirements, for example, the circuit board 4 is bent by a specific angle, so that the circuit board 4 is suitable for more installation requirements.
In some embodiments, as shown in fig. 2 and 3, the display module further includes a conductive film layer 6, the conductive film layer 6 is disposed in the non-display region of the cover plate 3, and the conductive film layer 6 is electrically connected to the circuit board 4. The piezoelectric ceramic structure 5 is arranged on one side of the conductive film layer 6, which is far away from the cover plate 3, and the piezoelectric ceramic structure 5 is electrically connected with the conductive film layer 6.
In the embodiment of the present application, the conductive film layer 6 may be fixed to the non-display area inside the cover plate 3 by bonding or the like. Conductive film layer 6 is connected with circuit board 4 electricity, and piezoceramics structure 5 is fixed to be set up on conductive film layer 6 and is connected with conductive film layer 6 electricity to realize the electric connection of 5 surplus circuit boards 4 of piezoceramics structure, make circuit board 4 can be through conductive film layer 6 to piezoceramics structure 5 transmission signal of telecommunication. The conductive film layer 6 may be indirectly connected to the circuit board 4 through an intervening component, and the conductive film layer 6 may also be directly connected to the circuit board 4, which is not specifically limited in this embodiment of the application.
In some embodiments, the material of the conductive film layer 6 includes a piezoelectric fiber composite material, the piezoelectric fiber composite material can generate an electric field under an external force, and the piezoelectric fiber composite material can also generate a mechanical deformation under the action of the electric field force, so that the piezoelectric ceramic structure 5 can be better electrically connected with the conductive film layer 6. Specifically, the material of the conductive film layer 6 includes, but is not limited to, piezoelectric ceramic fiber, etc.
In some embodiments, the display module further includes at least one connection structure, and the conductive film layer 6 is electrically connected to the circuit board 4 through the at least one connection structure. Wherein, at least one connection structure is including setting up in the arch that is close to circuit board 4 one side of electrically conductive rete 6 to and set up in circuit board 4 be close to electrically conductive rete 6 one side and with protruding assorted recess.
In some embodiments, the at least one connecting structure includes a groove disposed on a side of the conductive film layer 6 close to the circuit board 4, and a protrusion disposed on a side of the circuit board 4 close to the conductive film layer 6 and matching with the groove.
In this application embodiment, through in going into the recess on the circuit board 4 with the arch on the electrically conductive rete 6, or go into the recess on the electrically conductive rete 6 with the arch on the circuit board 4 card, realize being connected of electrically conductive rete 6 and circuit board 4. And because the conductive film layer 6 and the circuit board 4 are made of conductive materials, after the protrusions and the grooves are clamped and connected, the conductive film layer 6 can be electrically connected with the circuit board 4, so that electric signals on the circuit board 4 can be transmitted to the conductive film layer 6, and then the electric signals are transmitted to the piezoelectric ceramic structure 5 electrically connected with the conductive film layer 6. The conductive film layer 6 and the circuit board 4 are electrically connected through at least one connecting structure, and complexity of installation and disassembly between the conductive film layer 6 and the circuit board 4 is reduced.
In some embodiments, the conductive film layer 6 is adhesively connected to the circuit board 4 by a conductive adhesive. Alternatively, the conductive film layer 6 is connected to the circuit board 4 by soldering.
In some embodiments, the conductive film layer 6 includes at least one first input pin 61 and at least one first output pin 62 electrically connected to the circuit board 4. One side of the piezoelectric ceramic structure 5 close to the conductive film layer 6 comprises an electrical connection region 51, the piezoelectric ceramic structure 5 comprises at least one second input pin 511 and at least one second output pin 512 which are positioned in the electrical connection region 51, the at least one first output pin 62 is connected with the at least one second input pin 511 in a compression joint mode, and the at least one second output pin 512 is connected with the at least one first input pin 61 in a compression joint mode. The first input pins 61 and the first output pins 62 on the conductive film layer 6 are all connected to the circuit board 4, so that the second input pins 511 can be electrically connected to the circuit board 4 through the first output pins 62, and the second output pins 512 can be electrically connected to the circuit board 4 through the first output pins 62.
Further, as shown in fig. 2 and fig. 3, the circuit board 4 includes a connection portion 41, the connection portion 41 is connected to the positive electrode and the negative electrode (the second input pin 511 and the second output pin 512) of the piezoelectric ceramic structure 5, and the connection portion 41 is used for connecting with a main board of the display device, so as to connect the piezoelectric ceramic structure 5 with the main board of the display device.
In some embodiments, the electrical connection region 51 is adhesively connected to the conductive film layer 6 by a conductive adhesive.
In the embodiment of the present application, after the electrical connection region 51 is bonded to the conductive film layer 6 through the conductive adhesive, the conductive area between the piezoelectric ceramic structure 5 and the conductive film layer 6 is increased, so that the conductive stability between the piezoelectric ceramic structure 5 and the conductive film layer 6 is increased. In one example, the whole of the electrical connection region 51 may be coated with a conductive adhesive, and then the whole of the electrical connection region 51 may be adhesively connected to the conductive film layer 6 by the conductive adhesive. In another example, a conductive paste may be coated on the regions of the electrical connection region 51 except for the second input pin 511 and the second output pin 512, and then the regions of the electrical connection region 51 except for the second input pin 511 and the second output pin 512 may be adhesively connected to the conductive film layer 6.
In some embodiments, as shown in fig. 4, the side of the piezoceramic structure 5 adjacent to the conductive film layer 6 further comprises a body region 52. The main body region 52 may be adhesively attached to the conductive film layer 6 by double-sided adhesive tape.
In some embodiments, the conductive film layer 6 and the circuit board 4 are a single-piece structure. Specifically, the conductive film layer 6 may be connected with the circuit board 4 as a whole, or the conductive film layer 6 may be integrated on the circuit board 4. Based on this, the piezoelectric ceramic structure 5 can be directly disposed on the circuit board 4, or directly disposed on the conductive film layer 6 included in the circuit board 4, so as to reduce the structural complexity.
In some embodiments, as shown in fig. 5, the display module further includes a bottom plate 7 and a polarizer layer 8. Wherein the bottom plate 7 is located between the display panel 2 and the support 1. The polarizer layer 8 is located between the display panel 2 and the cover plate 3. Wherein the bottom plate 7 may be a flexible bottom plate. The polarizer layer 8 is used for protecting the display panel 2, and the polarizer layer 8 is also used for controlling the polarization direction of light, converting and analyzing light beams generated by the display panel 2, and generating light and shade pairs, thereby generating a display picture.
In some embodiments, as shown in fig. 5, the display module further includes a connection layer 9 and a transparent adhesive layer 10. The connection layer 9 is located between the display panel 2 and the support plate 1, and the connection layer 9 is used for connecting the display panel 2 and the support plate 1. The transparent adhesive layer 10 is located between the polarizer layer 8 and the cover plate 3, and the transparent adhesive layer 10 is used for connecting the polarizer layer 8 and the cover plate 3. Wherein, the material of the transparent adhesive layer 10 may include OCA optical adhesive.
The embodiment of the application also provides a display device which comprises the display module provided by the embodiment. In the embodiment of the present application, the display device includes, but is not limited to, a mobile phone, a tablet computer, a display, a television, a picture screen, an advertisement screen, electronic paper, and the like.
In the display module assembly that the display device that application embodiment provided included, piezoceramics structure 5 sets up in the inboard non-display area of apron 3, and piezoceramics structure 5 is connected with circuit board 4 electricity, can be based on this circuit board 4 to piezoceramics structure 5 input signal of telecommunication for piezoceramics structure 5 vibrates the sound production under the effect of signal of telecommunication. Adopt piezoceramics structure 5 to act as display device's earphone structure, piezoceramics structure 5 is the sound production under the effect of signal of telecommunication, need not to set up the earphone hole on apron 3, has increased display module's display area to the screen that has increased display module is occupied than. In addition, piezoceramics structure 5 is integrated as an organic whole with the display module assembly, and compares in traditional earphone structure piezoceramics structure 5's volume less, has reduced the space occupancy of earphone structure among the display device. And because the display panel 2 and the piezoelectric ceramic structure 5 are both electrically connected with the same circuit board 4, the piezoelectric ceramic structure 5 does not need to be provided with a separate circuit board 4, and the space occupancy rate of a receiver structure in the display device is further reduced.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only for the preferred embodiment of the present application and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application are included in the protection scope of the present application.
Claims (10)
1. The utility model provides a display module assembly which characterized in that, includes the display area and surrounds the non-display area in display area, display module assembly includes:
a support plate;
a display panel positioned at one side of the support plate;
the circuit board is positioned on one side of the supporting plate far away from the display panel and is electrically connected with the display panel;
the cover plate is positioned on one side of the display panel, which is far away from the support plate;
the piezoelectric ceramic structure is arranged in the non-display area of the cover plate and is electrically connected with the circuit board.
2. The display module according to claim 1, further comprising a conductive film layer disposed in the non-display area of the cover plate, the conductive film layer being electrically connected to the circuit board;
the piezoelectric ceramic structure is arranged on one side of the conductive film layer, which is far away from the cover plate, and the piezoelectric ceramic structure is electrically connected with the conductive film layer.
3. The display module according to claim 2, wherein the display module further comprises at least one connection structure, the conductive film layer is electrically connected with the circuit board through the at least one connection structure, and wherein:
the at least one connecting structure comprises a bulge arranged on one side of the conductive film layer close to the circuit board and a groove arranged on one side of the circuit board close to the conductive film layer and matched with the bulge; or
At least one connection structure including set up in electrically conductive rete be close to the recess of circuit board one side, and set up in the circuit board be close to electrically conductive rete one side and with recess assorted arch.
4. The display module of claim 2, wherein the conductive film layer comprises at least one first input pin and at least one first output pin electrically connected to the circuit board;
one side, close to the conductive film layer, of the piezoelectric ceramic structure comprises an electric connection area, the piezoelectric ceramic structure comprises at least one second input pin and at least one second output pin which are located in the electric connection area, the at least one first output pin is connected with the at least one second input pin in a compression joint mode, and the at least one second output pin is connected with the at least one first input pin in a compression joint mode.
5. The display module of claim 4, wherein the electrical connection region is adhesively connected to the conductive film layer by a conductive adhesive.
6. The display module of claim 2, wherein the conductive film layer and the circuit board are of an integral structure.
7. The display module of claim 2, wherein the material of the conductive film layer comprises a piezoelectric fiber composite material.
8. The display module of claim 1, wherein the circuit board is a flexible circuit board.
9. The display module assembly of claim 1, wherein the display module assembly further comprises:
a chassis base between the display panel and the supporter;
a polarizer layer between the display panel and the cover plate.
10. A display device, characterized in that the display device comprises the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111041600.9A CN113763836B (en) | 2021-09-07 | 2021-09-07 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111041600.9A CN113763836B (en) | 2021-09-07 | 2021-09-07 | Display module and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113763836A true CN113763836A (en) | 2021-12-07 |
| CN113763836B CN113763836B (en) | 2023-07-11 |
Family
ID=78793302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111041600.9A Active CN113763836B (en) | 2021-09-07 | 2021-09-07 | Display module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113763836B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108416280A (en) * | 2018-02-26 | 2018-08-17 | 厦门天马微电子有限公司 | Display module and display device |
| CN108461045A (en) * | 2018-03-13 | 2018-08-28 | 京东方科技集团股份有限公司 | Display device and its manufacturing method |
| US20190087004A1 (en) * | 2017-09-15 | 2019-03-21 | Innolux Corporation | Display device |
| CN109656318A (en) * | 2017-10-12 | 2019-04-19 | 三星显示有限公司 | Panel bottom member structure and display device |
| CN110148357A (en) * | 2019-05-22 | 2019-08-20 | 云谷（固安）科技有限公司 | A kind of display sounding panel |
| CN110189632A (en) * | 2019-05-23 | 2019-08-30 | 云谷（固安）科技有限公司 | A kind of display sounding panel |
| CN209373963U (en) * | 2019-02-20 | 2019-09-10 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN209401262U (en) * | 2019-01-18 | 2019-09-17 | 苏州欧菲光科技有限公司 | Display screen, touch-control display module and electric terminal |
| US20210092528A1 (en) * | 2019-09-24 | 2021-03-25 | Samsung Electronics Co., Ltd. | Electronic device including speaker module |
-
2021
- 2021-09-07 CN CN202111041600.9A patent/CN113763836B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190087004A1 (en) * | 2017-09-15 | 2019-03-21 | Innolux Corporation | Display device |
| CN109656318A (en) * | 2017-10-12 | 2019-04-19 | 三星显示有限公司 | Panel bottom member structure and display device |
| CN108416280A (en) * | 2018-02-26 | 2018-08-17 | 厦门天马微电子有限公司 | Display module and display device |
| CN108461045A (en) * | 2018-03-13 | 2018-08-28 | 京东方科技集团股份有限公司 | Display device and its manufacturing method |
| CN209401262U (en) * | 2019-01-18 | 2019-09-17 | 苏州欧菲光科技有限公司 | Display screen, touch-control display module and electric terminal |
| CN209373963U (en) * | 2019-02-20 | 2019-09-10 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN110148357A (en) * | 2019-05-22 | 2019-08-20 | 云谷（固安）科技有限公司 | A kind of display sounding panel |
| CN110189632A (en) * | 2019-05-23 | 2019-08-30 | 云谷（固安）科技有限公司 | A kind of display sounding panel |
| US20210092528A1 (en) * | 2019-09-24 | 2021-03-25 | Samsung Electronics Co., Ltd. | Electronic device including speaker module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113763836B (en) | 2023-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20190339562A1 (en) | Electro-optical device and electronic equipment | |
| CN107315272B (en) | Frameless liquid crystal display device and manufacturing method thereof | |
| CN110018585B (en) | Display device | |
| US10823996B2 (en) | Display panel and method of manufacturing the same, display device | |
| CN109508121B (en) | Touch screen and display device | |
| CN104751743A (en) | Display device and rear chassis therein | |
| US9060438B2 (en) | Electronic device and mobile terminal including the same | |
| CN105718110A (en) | Touch panel | |
| CN101566742B (en) | Built-in type LCD module and manufacturing method thereof | |
| CN110491914A (en) | Flexible luminescent panel, the preparation method of flexible luminescent panel and display equipment | |
| JP2011221371A (en) | Display device | |
| CN103593087A (en) | Touch display module | |
| CN102346322A (en) | Touch-control type display device | |
| JPH10260398A (en) | Liquid-crystal display panel, liquid crystal dipslay device, electronic equipment, and mounting method for liquid-crystal display panel | |
| CN111999949B (en) | Display panel, preparation method thereof and display device | |
| JP3275764B2 (en) | Liquid crystal display panel, liquid crystal display device and electronic equipment using the same | |
| JPH10268268A (en) | Liquid crystal display panel, liquid crystal display device and electronic equipment using them | |
| US11259102B2 (en) | Liquid crystal display module, liquid crystal display device, and electronic device | |
| CN113763836B (en) | Display module and display device | |
| JP2010066855A (en) | Touch panel, electrooptical device having the touch panel, and electronic apparatus | |
| CN209640640U (en) | Liquid antistatic crystal display screen | |
| CN210405382U (en) | Electronic equipment | |
| CN111240097B (en) | Display device, display screen, backlight module and assembling method thereof | |
| CN212935950U (en) | Screen sounding structure and electronic equipment | |
| CN218886804U (en) | Display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |