CN113758333A - Method and device for determining temperature control power of loop heat pipe and storage medium - Google Patents

Method and device for determining temperature control power of loop heat pipe and storage medium Download PDF

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CN113758333A
CN113758333A CN202111119185.4A CN202111119185A CN113758333A CN 113758333 A CN113758333 A CN 113758333A CN 202111119185 A CN202111119185 A CN 202111119185A CN 113758333 A CN113758333 A CN 113758333A
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working medium
determining
state
liquid
value
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CN113758333B (en
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方泽农
周佐新
苗建印
张红星
曹剑峰
王录
黄金印
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Beijing Institute of Spacecraft System Engineering
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Beijing Institute of Spacecraft System Engineering
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor

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  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The application provides a method and a device for determining temperature control power of a loop heat pipe and a storage medium, wherein the loop heat pipe comprises an evaporator, a liquid storage device and a semiconductor refrigerator, and heat leakage heat of a working medium from a capillary core in the evaporator to the liquid storage device is obtained when the evaporator is heated to enable the working medium in the evaporator to generate liquid-gas conversion; when the semiconductor refrigerator refrigerates the liquid storage device, the refrigerating capacity of the semiconductor refrigerator is determined, and when the liquid storage device receives a gaseous working medium which generates liquid-gas conversion, the refrigerating capacity liquid working medium is controlled to flow to the liquid storage device, and the working medium cold quantity of the liquid storage device is obtained; and determining the temperature control power of the loop heat pipe to be detected based on the heat leakage quantity, the working medium cold quantity and the refrigerating quantity of the semiconductor refrigerator. Therefore, the temperature control power of the loop heat pipe to be detected can be accurately determined according to the heat leakage quantity, the working medium cold quantity and the refrigerating quantity, and the loop heat pipe is designed according to the temperature control power.

Description

Method and device for determining temperature control power of loop heat pipe and storage medium
Technical Field
The application relates to the technical field of spacecraft control, in particular to a method and a device for determining temperature control power of a loop heat pipe and a storage medium.
Background
The loop heat pipe is efficient two-phase heat transfer equipment, has the characteristics of high heat transfer performance, long-distance heat transfer, excellent temperature control characteristic, optional bending of a pipeline, convenience in installation and the like, and has incomparable advantages of other heat transfer equipment, so that the loop heat pipe has very wide application prospects in various fields of aviation, aerospace, ground electronic equipment heat dissipation and the like.
The working principle of the temperature control loop heat pipe is that through the charging amount and the structural design of the loop heat pipe, the working medium in the liquid storage device is in a gas-liquid two-phase state, and the liquid storage device is cooled or heated to control the temperature of the two-phase state, so that the temperature control of the evaporator and the heat source is realized. According to the temperature control principle, the energy balance of the liquid storage device directly determines the temperature control effect of the loop heat pipe. In the current stage, in the current loop heat pipe development process, the temperature control power of the liquid reservoir is often designed according to the maximum envelope according to experience, a large amount of data is needed in the process of designing by using the maximum envelope to obtain a design result, and then the design result is verified through a heat balance test. However, the implementation of this method requires a large amount of data, which increases the difficulty in developing the loop heat pipe and is not favorable for precise design of the loop heat pipe. Therefore, a temperature control power calculation method is urgently needed to be established, a basis is provided for temperature control power design, and design accuracy and development efficiency of the loop heat pipe are improved.
Disclosure of Invention
In view of this, an object of the present application is to provide a method and an apparatus for determining a temperature control power of a loop heat pipe, and a storage medium, which can quickly and accurately determine the temperature control power of the loop heat pipe to be detected according to a heat leakage amount, a working medium cooling amount, and a cooling amount of the loop heat pipe to be detected, and are helpful to improve the accuracy of the design of the loop heat pipe.
The embodiment of the application provides a method for determining temperature control power of a loop heat pipe, wherein the loop heat pipe comprises an evaporator, a liquid storage device and a semiconductor refrigerator, and the determining method comprises the following steps:
obtaining heat leakage heat of the working medium from a capillary core in the evaporator to the liquid reservoir when the evaporator is heated to enable the working medium in the evaporator to generate liquid-gas conversion;
when the semiconductor refrigerator cools the liquid storage tank, determining the refrigerating capacity of the semiconductor refrigerator, wherein the refrigerating capacity of the semiconductor refrigerator is determined based on the mapping relation between the devices of the semiconductor refrigerator and the refrigerating capacity;
when the liquid accumulator receives a gaseous working medium which generates liquid-gas conversion, controlling a cooling capacity of the liquid working medium to flow to the liquid accumulator, and acquiring the cooling capacity of the working medium of the liquid accumulator;
and determining the temperature control power of the loop heat pipe to be detected based on the heat leakage quantity, the working medium cold quantity and the refrigerating quantity of the semiconductor refrigerator.
Further, the heat leakage heat is determined by the following method:
detecting state parameters of the capillary core and temperature difference values of the inner surface and the outer surface of the capillary core under the condition that the working medium leaks from the capillary core to the liquid reservoir;
determining a target parameter value of the capillary core and a temperature difference value between the inner surface and the outer surface of the capillary core based on the state parameters of the core and the state parameters of the working medium;
and determining the product of the target parameter value of the capillary wick and the temperature difference value of the inner surface and the outer surface of the capillary wick as the heat leakage heat quantity.
Further, determining a target parameter value of the capillary wick by the following method:
determining the ratio of the inner diameter parameter to the outer diameter parameter of the capillary core based on the inner diameter parameter and the outer diameter parameter of the capillary core;
and determining a target parameter value of the capillary core based on the mass flow of the working medium in the heat leakage state, the product value of the specific heat capacity of the working medium in the heat leakage state, the length parameter of the capillary core, the heat conductivity parameter of the capillary core and the ratio of the inner diameter parameter to the outer diameter parameter of the capillary core.
Further, the temperature difference between the inner surface and the outer surface of the capillary wick is determined by the following method:
and determining the temperature difference value of the inner surface and the outer surface of the capillary core based on the average temperature of the inner surface and the outer surface of the capillary core, the pressure difference of the inner surface and the outer surface of the capillary core, the volume change of the working medium in the heat leakage state and the latent heat of vaporization parameter of the working medium.
Further, the working medium cold quantity of the liquid accumulator is determined by the following method:
determining the current working state of the loop heat pipe to be detected;
determining a target parameter value and a working medium temperature difference of the liquid storage device according to the current working state of the loop heat pipe to be detected;
and determining the product of the target parameter value of the liquid accumulator and the temperature difference of the working medium as the working medium cooling capacity of the liquid accumulator.
Further, when the working state is a gravity state, determining a target parameter value of the reservoir by the following method:
acquiring an outer diameter value of a silk screen in the liquid storage device and an inner diameter value of the liquid guide pipe in a gravity state, and determining a first inner-outer diameter ratio;
determining a first product of the mass flow of the working medium and the specific heat capacity of the working medium based on the mass flow of the working medium and the specific heat capacity of the working medium in a gravity state;
determining a target parameter value for the reservoir under gravity conditions based on the first inner-to-outer diameter ratio, the first product, the length of the reservoir, and a first thermal conductivity coefficient.
Further, when the working state is an on-orbit state, determining a target parameter value of the reservoir by the following method:
acquiring an inner diameter value of a liquid guide pipe in the liquid reservoir and an outer diameter value of a liquid film in an on-orbit state, and determining a second inner-outer diameter ratio;
determining a second product of the mass flow of the working medium and the specific heat capacity of the working medium in the on-orbit state based on the mass flow of the working medium and the specific heat capacity of the working medium in the on-orbit state;
and determining a target parameter value of the liquid storage device in the on-orbit state based on the second inner-outer diameter ratio, the second product, the length of the liquid storage device and the second heat conductivity coefficient.
Further, when the working state is a gravity state, the working medium temperature difference is determined by the following method:
acquiring a temperature value of a reference inlet working medium of the liquid storage device in a gravity state;
acquiring a saturation temperature value of a reference working medium of the liquid storage device in a gravity state;
and determining the temperature difference of the working medium under the gravity state based on the difference value of the saturated temperature value of the reference working medium and the temperature value of the reference inlet working medium.
Further, when the working state is in an on-track state, the working medium temperature difference is determined by the following method:
acquiring a temperature value of a target port working medium of the liquid storage device in a rail bar piece state;
acquiring a saturation temperature value of a target working medium of the liquid storage device in a rail piece state;
and determining the temperature difference of the working media in the on-orbit state based on the difference value between the saturation temperature value of the target working media and the temperature value of the target inlet working media.
The embodiment of the present application further provides a device for determining temperature control power of a loop heat pipe, where the device for determining temperature control power of a loop heat pipe includes:
the heat leakage determining module is used for acquiring heat leakage heat of the working medium from a capillary core in the evaporator to the liquid storage device when the evaporator is heated to enable the working medium in the evaporator to generate liquid-gas conversion;
the refrigerating capacity determining module is used for determining the refrigerating capacity of the semiconductor refrigerator when the semiconductor refrigerator cools the liquid storage device, wherein the refrigerating capacity of the semiconductor refrigerator is determined based on the mapping relation between the devices of the semiconductor refrigerator and the refrigerating capacity;
the working medium cold quantity determining module is used for controlling the flow of the liquid working medium with the cooling capacity to the liquid storage device and acquiring the working medium cold quantity of the liquid storage device when the liquid storage device receives the gaseous working medium which is converted from liquid to gas;
and the temperature control power determining module is used for determining the temperature control power of the loop heat pipe to be detected based on the heat leakage quantity, the working medium cold quantity and the refrigerating capacity of the semiconductor refrigerator.
An embodiment of the present application further provides an electronic device, including: the device comprises a processor, a memory and a bus, wherein the memory stores machine readable instructions executable by the processor, when an electronic device runs, the processor and the memory are communicated through the bus, and the machine readable instructions are executed by the processor to execute the steps of the method for determining the temperature control power of the loop heat pipe.
The embodiment of the present application further provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method for determining temperature control power of a loop heat pipe are performed as described above.
The application provides a method and a device for determining temperature control power of a loop heat pipe and a storage medium, wherein the loop heat pipe comprises an evaporator, a liquid storage device and a semiconductor refrigerator, and heat leakage heat of a working medium from a capillary core in the evaporator to the liquid storage device is obtained when the evaporator is heated to enable the working medium in the evaporator to generate liquid-gas conversion; when the semiconductor refrigerator cools the liquid storage device, determining the refrigerating capacity of the semiconductor refrigerator, wherein the refrigerating capacity of the semiconductor refrigerator is determined based on the mapping relation between the devices of the semiconductor refrigerator and the refrigerating capacity; when the liquid accumulator receives the gaseous working medium which is converted from liquid to gas, the liquid working medium with the refrigerating capacity is controlled to flow to the liquid accumulator, and the refrigerating capacity of the working medium of the liquid accumulator is obtained; and determining the temperature control power of the loop heat pipe to be detected based on the heat leakage quantity, the working medium cold quantity and the refrigerating quantity of the semiconductor refrigerator.
Therefore, the temperature control power of the loop heat pipe to be detected can be rapidly and accurately determined according to the heat leakage quantity, the working medium cooling quantity and the refrigerating quantity of the loop heat pipe to be detected, and the design accuracy of the loop heat pipe is improved.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a flowchart of a method for determining temperature control power of a loop heat pipe according to an embodiment of the present disclosure;
fig. 2 is a schematic view of capillary wick heat leakage provided by an embodiment of the present application;
FIG. 3 is a schematic diagram of an energy balance of a loop heat pipe liquid reservoir according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a device for determining temperature control power of a loop heat pipe according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
To make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it should be understood that the drawings in the present application are for illustrative and descriptive purposes only and are not used to limit the scope of protection of the present application. Additionally, it should be understood that the schematic drawings are not necessarily drawn to scale. The flowcharts used in this application illustrate operations implemented according to some embodiments of the present application. It should be understood that the operations of the flow diagrams may be performed out of order, and that steps without logical context may be performed in reverse order or concurrently. One skilled in the art, under the guidance of this application, may add one or more other operations to, or remove one or more operations from, the flowchart.
In addition, the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
First, an application scenario to which the present application is applicable will be described. The loop heat pipe is efficient two-phase heat transfer equipment, has the characteristics of high heat transfer performance, long-distance heat transfer, excellent temperature control characteristic, optional bending of a pipeline, convenience in installation and the like, and has incomparable advantages compared with other heat transfer equipment, so that the loop heat pipe has very wide application prospects in various fields of aviation, aerospace, ground electronic equipment heat dissipation and the like.
The method, the apparatus, the electronic device, or the computer-readable storage medium described in the embodiments of the present application may be applied to any scenario that requires a spacecraft control technology, and the embodiments of the present application do not limit a specific application scenario, and any scheme that uses the method and the apparatus for determining the temperature control power of the loop heat pipe provided in the embodiments of the present application is within the scope of protection of the present application.
Research shows that in the current stage, in the current loop heat pipe development process, the temperature control power of the liquid reservoir is usually designed according to the maximum envelope according to experience, a large amount of data is needed in the maximum envelope design process to obtain a design result, and then the design result is verified through a heat balance test. However, the implementation of this method requires a large amount of data, which may increase the difficulty and technical risk of developing the loop heat pipe, and also may not facilitate the precise design of the loop heat pipe. Therefore, a temperature control power calculation method is urgently needed to be established, a basis is provided for temperature control power design, and design accuracy and development efficiency of the loop heat pipe are improved.
Based on this, an object of the present application is to provide a method and an apparatus for determining temperature control power of a loop heat pipe, and a storage medium, which can quickly and accurately determine the temperature control power of the loop heat pipe to be detected according to the heat leakage amount, the working medium cooling amount, and the cooling amount of the loop heat pipe to be detected, and are helpful to improve the accuracy of the design of the loop heat pipe.
Referring to fig. 1, fig. 1 is a flowchart illustrating a method for determining a temperature control power of a loop heat pipe according to an embodiment of the present disclosure. As shown in fig. 1, a method for determining temperature control power of a loop heat pipe according to an embodiment of the present application includes:
s101: and obtaining heat leakage heat of the working medium from a capillary core in the evaporator to the liquid reservoir when the evaporator is heated to enable the working medium in the evaporator to generate liquid-gas conversion.
In the step, when heating load is applied to the evaporator, the working medium is evaporated on the outer surface of the capillary core of the evaporator, at the moment, the state of the working medium is converted from a liquid state to a gas state, and the working medium leaks to the liquid reservoir from the capillary core because the outer surface of the capillary core is porous, so that heat leakage heat of the capillary core to the liquid reservoir is generated.
Here, the loop heat pipe is a loop heat pipe having a closed loop, and generally includes an evaporator, a reservoir, a semiconductor cooler, a condenser, a liquid line, and the like.
The heat leakage heat is the heat generated when the working medium flows from the outer surface of the capillary core to the liquid reservoir.
In the above step, the heat leakage heat is determined by the following method:
a: and detecting the state parameters of the capillary core and the state parameters of the working medium in a state that the working medium leaks from the capillary core to the liquid reservoir.
Detecting state parameters of the capillary core and state parameters of the working medium under the state that the working medium leaks from the capillary core to the liquid storage device, wherein the state parameters of the capillary core comprise other state parameters of the capillary core, such as temperature difference of the capillary core, heat conductivity of the capillary core, pressure difference between the inner surface and the outer surface of the capillary core, inner diameter of the capillary core, outer diameter of the capillary core and the like; the state parameters of the working medium comprise other state parameters of the working medium, such as the latent heat of vaporization of the working medium, the specific heat capacity of the working medium, the volume change of vaporization of the working medium, the mass flow of the working medium and the like.
B: and determining a target parameter value of the capillary core and a temperature difference value between the inner surface and the outer surface of the capillary core based on the state parameters of the capillary core and the state parameters of the working medium.
And respectively determining a target parameter value of the capillary core and a target parameter value of the working medium according to the obtained state parameter of the capillary core and the obtained state parameter of the working medium.
Here, the target parameter value of the capillary wick is determined by:
a: and determining the ratio of the inner diameter parameter to the outer diameter parameter of the capillary core based on the inner diameter parameter and the outer diameter parameter of the capillary core.
To make the heat leakage process of the wick structure more clear, please refer to fig. 2, fig. 2 is a schematic diagram of the heat leakage of the wick according to the embodiment of the present application, as shown in fig. 2, the heat flows from the outer surface of the wick to the liquid lead tube in the liquid reservoir and the inner diameter (D) of the wickInner part) The outer diameter (D) of the capillary wick is determined by the vertical distance from the first inner surface of the capillary wick to the second inner surface of the capillary wickOuter cover) Is determined by the perpendicular distance from the first outer surface of the capillary wick to the second outer surface of the capillary wick, so that the ratio of the inner and outer diameter parameters of the capillary wick is DInner part/DOuter cover。
b: and determining a target parameter value of the capillary core based on the mass flow of the working medium in the heat leakage state, the product value of the specific heat capacity of the working medium in the heat leakage state, the length parameter of the capillary core, the heat conductivity parameter of the capillary core and the ratio of the inner diameter parameter to the outer diameter parameter of the capillary core.
Wherein, the target parameter value of the capillary core is determined by the following formula:
Figure BDA0003276389530000091
wherein D isInner part/DOuter coverIs the parameter ratio of the inner diameter and the outer diameter of the capillary core,
Figure BDA0003276389530000093
is the mass flow of the working medium in the heat leakage state, CpIs the specific heat capacity of the working medium in a heat leakage state, lambda is the thermal conductivity parameter of the capillary core, L is the length parameter of the capillary core,
Figure BDA0003276389530000092
the target parameter value of the capillary wick is obtained.
The target parameter value of the capillary core is determined by substituting the obtained mass flow of the working medium, the specific heat capacity of the working medium, the length parameter of the capillary core, the thermal conductivity parameter of the capillary core and the inner and outer diameter parameters of the capillary core in a calculation formula of the target parameter value of the capillary core in a heat leakage state.
In the above step, the temperature difference between the inner and outer surfaces of the capillary wick is determined by the following method:
and determining the temperature difference value of the inner surface and the outer surface of the capillary core based on the average temperature of the inner surface and the outer surface of the capillary core, the pressure difference of the inner surface and the outer surface of the capillary core, the volume change of the working medium in the heat leakage state and the latent heat of vaporization parameter of the working medium.
Wherein the temperature difference between the inner and outer surfaces of the capillary core is calculated according to the krabbelon-clausius equation:
Figure BDA0003276389530000101
wherein, Delta T is the temperature difference between the inner surface and the outer surface of the capillary core, Delta V is the volume change of the working medium gasification in the heat leakage state, Delta P is the pressure difference between the inner surface and the outer surface of the capillary core, and LfgT is the average temperature of the inner and outer surfaces of the capillary core.
The temperature difference value of the inner surface and the outer surface of the capillary core is determined by substituting the obtained mass flow of the working medium in a heat leakage state, the specific heat capacity of the working medium and the temperature difference value of the inner surface and the outer surface of the capillary core into a calculation formula of a target parameter value of the working medium. Wherein, the delta T is the temperature difference between the inner surface and the outer surface of the capillary core,
Figure BDA0003276389530000104
is the mass flow of the working medium in the heat leakage state, CpThe specific heat capacity of the working medium in a heat leakage state.
C: and determining the product of the target parameter value of the capillary wick and the temperature difference value of the inner surface and the outer surface of the capillary wick as the heat leakage heat quantity.
And multiplying the calculated target parameter value of the capillary core by the temperature difference value between the inner surface and the outer surface of the capillary core to determine the heat leakage quantity, and calculating the heat leakage quantity directly by the following formula.
Figure BDA0003276389530000102
Wherein Q isLeakage netFor heat leakage, DInner part/DOuter coverIs the parameter ratio of the inner diameter and the outer diameter of the capillary core,
Figure BDA0003276389530000103
is the mass flow of the working medium in the heat leakage state, CpThe specific heat capacity of the working medium in a heat leakage state, lambda is a heat conductivity parameter of the capillary core, L is a length parameter of the capillary core, delta T is a temperature difference value of the inner surface and the outer surface of the capillary core, delta V is a volume change amount of the gasified working medium in the heat leakage state, delta P is a pressure difference value of the inner surface and the outer surface of the capillary core, and L isfgT being latent heat of vaporisation of working medium, T being capillary wickThe average temperature of the inner and outer surfaces, where the loop heat pipe leakage can be evaluated based on the calculated leakage heat quantity.
S102: when the semiconductor refrigerator cools the liquid storage device, the refrigerating capacity of the semiconductor refrigerator is determined, wherein the refrigerating capacity of the semiconductor refrigerator is determined based on the mapping relation between the devices of the semiconductor refrigerator and the refrigerating capacity.
In the step, the refrigerating capacity released by the semiconductor refrigerator in the process of refrigerating the liquid storage device is obtained, and the refrigerating capacity of the refrigerator is determined according to the mapping relation between the adopted device of the semiconductor refrigerator and the refrigerating capacity.
For example, the device a is adopted, the corresponding cooling capacity is 100KJ, and this part is not limited, and the device-cooling capacity mapping relationship of the existing semiconductor cooler can be queried.
S103: and when the liquid accumulator receives the gaseous working medium which is converted from liquid to gas, controlling the flow of the liquid working medium with a cooling capacity to flow to the liquid accumulator, and acquiring the cooling capacity of the working medium of the liquid accumulator.
In this step, the supercooled liquid working medium flows to the liquid reservoir, so that the working medium cold is generated in the liquid reservoir.
In the above steps, the working medium cold quantity of the liquid accumulator is determined by the following method:
1): and determining the current working state of the loop heat pipe to be detected.
Wherein, the operating condition includes in-orbit operating condition and gravity operating condition.
2): and determining a target parameter value and a working medium temperature difference of the liquid accumulator according to the current working state of the loop heat pipe to be detected.
And when the current state of the loop heat pipe to be detected is determined, determining a target parameter value and a working medium temperature difference of the liquid storage device according to the current working state.
Here, when the operating state is a gravitational state, a target parameter value of the reservoir is determined by:
i: and acquiring the outer diameter value of the silk screen in the liquid storage device and the inner diameter value of the liquid guide pipe in the gravity state, and determining a first inner-outer diameter ratio.
Wherein the value of the inner diameter (D) of the liquid lead in the reservoir is determined under the gravity condition1) And the outer diameter value (D) of the screen3) Determining the first inner/outer diameter ratio as D3/D1。
II: determining a first product of the mass flow of the working medium and the specific heat capacity of the working medium based on the mass flow of the working medium and the specific heat capacity of the working medium in a gravity state.
The method comprises the steps of obtaining the mass flow of a working medium and the specific heat capacity of the working medium under the gravity state, and accordingly determining a first product of the mass flow of the working medium and the specific heat capacity of the working medium.
III: determining a target parameter value for the reservoir under gravity conditions based on the first inner-to-outer diameter ratio, the first product, the length of the reservoir, and a first thermal conductivity coefficient.
The heat exchange between the liquid phase working medium in the liquid guide pipe and the liquid storage device is determined to be forced convection heat exchange, liquid guide pipe heat conduction, liquid guide pipe outer wire mesh area heat conduction and natural convection heat exchange between the wire mesh and the liquid phase working medium in sequence according to the distribution and heat transfer conditions of the working medium in the liquid storage device in the gravity state, and the heat transfer process of the forced convection heat exchange, the liquid guide pipe heat conduction, the liquid guide pipe outer wire mesh area heat conduction and the natural convection heat exchange between the wire mesh and the liquid phase working medium is equivalent to a heat transfer coefficient which is a first heat transfer coefficient.
Here, a target value of the parameter of the reservoir under gravity is determined based on the determined first ratio of the inner diameter to the outer diameter, the first product, the length of the reservoir, and the first thermal conductivity, and the target value of the parameter of the reservoir under gravity is determined by the following formula:
Figure BDA0003276389530000121
wherein λ iseqIs a first thermal conductivity, LStore upFor the length of the reservoir, D3/D1 is the firstThe ratio of the inner diameter to the outer diameter,
Figure BDA0003276389530000131
mass flow of the working medium under gravity, CpIs the specific heat capacity of the working medium in the gravity state,
Figure BDA0003276389530000132
is the first product in the gravity state,
Figure BDA0003276389530000133
is the target parameter value for the reservoir.
Here, when the operating state is a gravity state, the working medium temperature difference is determined by:
acquiring a temperature value of a reference inlet working medium of the liquid storage device in a gravity state; acquiring a saturation temperature value of a reference working medium of the liquid storage device in a gravity state; and determining the temperature difference of the working medium under the gravity state based on the difference value of the saturated temperature value of the reference working medium and the temperature value of the reference inlet working medium.
The method comprises the steps of obtaining a temperature value of a reference inlet working medium of a liquid storage device and a saturation temperature value of the reference working medium of the liquid storage device in a gravity state, and determining a working medium temperature difference in the gravity state according to a difference value between the saturation temperature value of the reference working medium and the temperature value of the reference inlet working medium.
Such as TFull of-T0，TFull ofFor reference to the saturation temperature, T, of the working medium in the gravitational state0The temperature value of the inlet working medium is referred in a gravity state.
Here, when the operating state is an in-orbit state, a target parameter value of the accumulator is determined by:
i: and acquiring the inner diameter value of the liquid guide pipe in the liquid reservoir and the outer diameter value of the liquid film in the on-orbit state, and determining a second inner-outer diameter ratio.
Wherein the value of the inner diameter (D) of the liquid lead in the reservoir is determined under the gravity condition1) And the outer diameter value (D) of the liquid film4) Determining the second inner/outer diameter ratio as D4/D1。
ii: and determining a second product of the mass flow of the working medium and the specific heat capacity of the working medium in the on-orbit state based on the mass flow of the working medium and the specific heat capacity of the working medium in the on-orbit state.
The mass flow of the working medium and the specific heat capacity of the working medium in the on-orbit state are obtained, and therefore a second product of the mass flow of the working medium and the specific heat capacity of the working medium is determined.
iii: and determining a target parameter value of the liquid storage device in the on-orbit state based on the second inner-outer diameter ratio, the second product, the length of the liquid storage device and the second heat conductivity coefficient.
The distribution and heat transfer conditions of working media in the liquid storage device in the on-rail state are determined, the heat exchange between the liquid-phase working media in the liquid guide pipe and the liquid storage device is sequentially forced convection heat exchange, liquid guide pipe heat conduction, liquid guide pipe outer wire mesh area heat conduction, liquid film heat conduction and liquid film surface film state condensation, and the heat transfer process of the forced convection heat exchange, the liquid guide pipe heat conduction, the liquid guide pipe outer wire mesh area heat conduction, the liquid film heat conduction and the liquid film surface film state condensation is equivalent to a heat transfer coefficient which is a second heat transfer coefficient.
Here, a target parameter value of the reservoir in the on-orbit state is determined according to the determined second inner-outer diameter ratio, the second product, the length of the reservoir, and the second thermal conductivity coefficient, and the target parameter value of the reservoir in the on-orbit state is determined by the following formula:
Figure BDA0003276389530000141
wherein λ iseqIs a second thermal conductivity, LStore upIs the length of the reservoir, D4/D1Is the ratio of the second inner diameter to the second outer diameter,
Figure BDA0003276389530000142
mass flow of the working medium under gravity, CpFor the specific heat capacity of the working medium in the on-rail state,
Figure BDA0003276389530000143
mass flow of working medium in on-orbit state, CpIs the specific heat capacity of the working medium in the on-rail state,
Figure BDA0003276389530000144
for the second product in the on-track condition,
Figure BDA0003276389530000145
is the target parameter value for the reservoir in the on-track condition.
Here, when the operating state is an on-track state, the working medium temperature difference is determined by:
acquiring a temperature value of a target port working medium of the liquid storage device in a rail bar piece state; acquiring a saturation temperature value of a target working medium of the liquid storage device in a rail piece state; and determining the temperature difference of the working media in the on-orbit state based on the difference value between the saturation temperature value of the target working media and the temperature value of the target inlet working media.
The method comprises the steps of obtaining a temperature value of a target inlet working medium of a liquid storage device and a saturation temperature value of the target working medium of the liquid storage device in an on-orbit state, and determining a working medium temperature difference in the on-orbit state according to a difference value between the saturation temperature value of the target working medium and the temperature value of the target inlet working medium.
Such as TFull of-T0，TFull ofIs the saturation temperature, T, of the target working medium in the on-track state0Is the temperature value of the target inlet working medium in the on-orbit state.
3): and determining the product of the target parameter value of the liquid accumulator and the temperature difference of the working medium as the working medium cooling capacity of the liquid accumulator.
When the working state is a gravity state, the working medium cold quantity of the liquid accumulator is determined by the following formula:
Figure BDA0003276389530000151
wherein λ iseqIs a first thermal conductivity, LStore upIs the length of the reservoir, D3/D1Is the ratio of the first inner diameter to the first outer diameter,
Figure BDA0003276389530000152
mass flow of the working medium under gravity, CpIs the specific heat capacity of the working medium in the gravity state,
Figure BDA0003276389530000153
is the first product in the gravity state,
Figure BDA0003276389530000154
is the target parameter value for the reservoir.
TFull ofFor reference to the saturation temperature, T, of the working medium in the gravitational state0The temperature value of the inlet working medium is referred in a gravity state.
When the working state is in an on-track state, the working medium cold quantity of the liquid accumulator is determined by the following formula:
Figure BDA0003276389530000155
wherein λ iseqIs a second thermal conductivity, LStore upIs the length of the reservoir, D4/D1Is the ratio of the second inner diameter to the second outer diameter,
Figure BDA0003276389530000161
mass flow of the working medium under gravity, CpFor the specific heat capacity of the working medium in the on-rail state,
Figure BDA0003276389530000162
mass flow of working medium in on-orbit state, CpIs the specific heat capacity of the working medium in the on-rail state,
Figure BDA0003276389530000163
for the second product in the on-track condition,
Figure BDA0003276389530000164
is the target parameter value for the reservoir in the on-track condition.
TFull ofIs the saturation temperature, T, of the target working medium in the on-track state0Is the temperature value of the target inlet working medium in the on-orbit state.
S104: and determining the temperature control power of the loop heat pipe to be detected based on the heat leakage quantity, the working medium cold quantity and the refrigerating quantity of the semiconductor refrigerator.
In the step, the temperature control power of the loop heat pipe to be detected is determined according to the heat leakage quantity, the working medium cold quantity and the refrigerating quantity of the semiconductor refrigerator.
Further, referring to fig. 3, in order to how energy balance is achieved in the loop heat pipe liquid reservoir, fig. 3 is a schematic diagram of energy balance of the loop heat pipe liquid reservoir according to an embodiment of the present disclosure. As shown in fig. 3, the sum of the temperature control power and the heat leakage quantity of the liquid accumulator is equal to the sum of the cold quantity of the working medium and the cold quantity of the semiconductor refrigerator. Namely, the heat leakage quantity, the working medium cold quantity, the refrigerating quantity of the semiconductor refrigerator and the temperature control power form the energy balance of the liquid accumulator in the loop heat pipe.
Wherein, the temperature control power is calculated by the following formula:
Qrefrigerating capacity+QWorking medium cold quantity＝QHeat leakage heat quantityQTemperature controlled power；
Wherein Q isRefrigerating capacityThe temperature sensor is determined according to a device-cooling capacity mapping relation of the semiconductor cooler, or according to an operating characteristic curve of the semiconductor cooler, which is not limited in this section.
Therefore, the power of the temperature control heater in the loop heat pipe is adjusted according to the determined temperature control power of the loop heat pipe, so that the design accuracy of the loop heat pipe is improved. For example, if the determined temperature control power is higher, the power of the temperature control heater is adjusted to be increased, and if the determined temperature control power is lower, the power of the temperature control heater is adjusted to be decreased.
The application provides a method and a device for determining temperature control power of a loop heat pipe and a storage medium, wherein the loop heat pipe comprises an evaporator, a liquid storage device and a semiconductor refrigerator, and heat leakage heat of a working medium from a capillary core in the evaporator to the liquid storage device is obtained when the evaporator is heated to enable the working medium in the evaporator to generate liquid-gas conversion; when the semiconductor refrigerator cools the liquid storage device, determining the refrigerating capacity of the semiconductor refrigerator, wherein the refrigerating capacity of the semiconductor refrigerator is determined based on the mapping relation between the devices of the semiconductor refrigerator and the refrigerating capacity; when the liquid accumulator receives the gaseous working medium which is converted from liquid to gas, the liquid working medium with the refrigerating capacity is controlled to flow to the liquid accumulator, and the refrigerating capacity of the working medium of the liquid accumulator is obtained; and determining the temperature control power of the loop heat pipe to be detected based on the heat leakage quantity, the working medium cold quantity and the refrigerating quantity of the semiconductor refrigerator.
Therefore, the temperature control power of the loop heat pipe to be detected can be rapidly and accurately determined according to the heat leakage quantity, the working medium cooling quantity and the refrigerating quantity of the loop heat pipe to be detected, and the design accuracy of the loop heat pipe to be detected is improved.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a device for determining temperature control power of a loop heat pipe according to an embodiment of the present disclosure. As shown in fig. 4, the determining means 400 includes:
the heat leakage determining module 410 is configured to obtain heat leakage heat of the working medium leaking from the capillary wick in the evaporator to the liquid reservoir when the working medium in the evaporator is heated to perform liquid-gas conversion;
a cooling capacity determining module 420, configured to determine a cooling capacity of the semiconductor cooler when the semiconductor cooler cools the liquid reservoir, where the cooling capacity of the semiconductor cooler is determined based on a mapping relationship between devices of the semiconductor cooler and the cooling capacity;
the working medium cold quantity determining module 430 is used for controlling the flow of the liquid working medium with the cooling capacity to the liquid storage device and acquiring the working medium cold quantity of the liquid storage device when the liquid storage device receives the gaseous working medium which is converted from liquid to gas;
and the temperature control power determining module 440 is configured to determine the temperature control power of the loop heat pipe to be detected based on the heat leakage amount, the working medium cooling amount, and the cooling amount of the semiconductor cooler.
Further, the heat leakage determination module 410 is further configured to determine the heat leakage heat quantity by:
detecting the state parameters of the capillary core and the state parameters of the working medium in a state that the working medium leaks from the capillary core to the liquid storage device;
determining a target parameter value of the capillary core and a temperature difference value between the inner surface and the outer surface of the capillary core based on the state parameters of the core and the state parameters of the working medium;
and determining the product of the target parameter value of the capillary core and the temperature difference value of the inner surface and the outer surface of the capillary core as the heat leakage heat quantity.
Further, as shown in fig. 4, the heat leakage determining module 410 is further configured to determine the target parameter value of the capillary wick by:
determining the ratio of the inner diameter parameter to the outer diameter parameter of the capillary core based on the inner diameter parameter and the outer diameter parameter of the capillary core;
and determining a target parameter value of the capillary core based on the mass flow of the working medium in the heat leakage state, the product value of the specific heat capacity of the working medium in the heat leakage state, the length parameter of the capillary core, the heat conductivity parameter of the capillary core and the ratio of the inner diameter parameter to the outer diameter parameter of the capillary core.
Further, as shown in fig. 4, the heat leakage determining module 410 is further configured to determine the temperature difference between the inner surface and the outer surface of the capillary wick by the following method:
and determining the temperature difference value of the inner surface and the outer surface of the capillary core based on the average temperature of the inner surface and the outer surface of the capillary core, the pressure difference of the inner surface and the outer surface of the capillary core, the volume change of the working medium in the heat leakage state and the latent heat of vaporization parameter of the working medium.
Further, as shown in fig. 4, the working medium cold quantity determining module 430 is further configured to determine the working medium cold quantity of the liquid accumulator by the following method:
determining the current working state of the loop heat pipe to be detected;
determining a target parameter value and a working medium temperature difference of the liquid storage device according to the current working state of the loop heat pipe to be detected;
and determining the product of the target parameter value of the liquid accumulator and the temperature difference of the working medium as the working medium cooling capacity of the liquid accumulator.
Further, as shown in fig. 4, the working medium cold quantity determining module 430 is further configured to determine a target parameter value of the liquid accumulator by the following method when the working state is the gravity state:
acquiring an outer diameter value of a silk screen in the liquid storage device and an inner diameter value of the liquid guide pipe in a gravity state, and determining a first inner-outer diameter ratio;
determining a first product of the mass flow of the working medium and the specific heat capacity of the working medium based on the mass flow of the working medium and the specific heat capacity of the working medium in a gravity state;
determining a target parameter value for the reservoir under gravity conditions based on the first inner-to-outer diameter ratio, the first product, the length of the reservoir, and a first thermal conductivity coefficient.
Further, as shown in fig. 4, the working medium cold amount determining module 430 is further configured to determine a target parameter value of the accumulator by the following method when the working state is the on-track state:
acquiring an inner diameter value of a liquid guide pipe in the liquid reservoir and an outer diameter value of a liquid film in an on-orbit state, and determining a second inner-outer diameter ratio;
determining a second product of the mass flow of the working medium and the specific heat capacity of the working medium in the on-orbit state based on the mass flow of the working medium and the specific heat capacity of the working medium in the on-orbit state;
and determining a target parameter value of the liquid storage device in the on-orbit state based on the second inner-outer diameter ratio, the second product, the length of the liquid storage device and the second heat conductivity coefficient.
Further, as shown in fig. 4, the working medium cold quantity determining module 430 is further configured to determine the working medium temperature difference by the following method when the working state is the gravity state:
acquiring a temperature value of a reference inlet working medium of the liquid storage device in a gravity state;
acquiring a saturation temperature value of a reference working medium of the liquid storage device in a gravity state;
and determining the temperature difference of the working medium under the gravity state based on the difference value of the saturated temperature value of the reference working medium and the temperature value of the reference inlet working medium.
Further, as shown in fig. 4, the working medium cold amount determining module 430 is further configured to determine the working medium temperature difference by the following method when the working state is the on-rail state:
acquiring a temperature value of a target port working medium of the liquid storage device in a rail bar piece state;
acquiring a saturation temperature value of a target working medium of the liquid storage device in a rail piece state;
and determining the temperature difference of the working media in the on-orbit state based on the difference value between the saturation temperature value of the target working media and the temperature value of the target inlet working media.
The device for determining the temperature control power of the loop heat pipe provided by the embodiment of the application comprises: the heat leakage determining module is used for acquiring heat leakage heat of the working medium from a capillary core in the evaporator to the liquid storage device when the evaporator is heated to enable the working medium in the evaporator to generate liquid-gas conversion; the refrigerating capacity determining module is used for determining the refrigerating capacity of the semiconductor refrigerator when the semiconductor refrigerator cools the liquid storage device, wherein the refrigerating capacity of the semiconductor refrigerator is determined based on the mapping relation between the devices of the semiconductor refrigerator and the refrigerating capacity; the working medium cold quantity determining module is used for controlling the flow of the liquid working medium with the cooling capacity to the liquid storage device and acquiring the working medium cold quantity of the liquid storage device when the liquid storage device receives the gaseous working medium which is converted from liquid to gas; and the temperature control power determining module is used for determining the temperature control power of the loop heat pipe to be detected based on the heat leakage quantity, the working medium cold quantity and the refrigerating capacity of the semiconductor refrigerator.
Therefore, the temperature control power of the loop heat pipe to be detected can be rapidly and accurately determined according to the heat leakage quantity, the working medium cooling quantity and the refrigerating quantity of the loop heat pipe to be detected, and the design accuracy of the loop heat pipe to be detected is improved.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. As shown in fig. 5, the electronic device 500 includes a processor 510, a memory 520, and a bus 530.
The memory 520 stores machine-readable instructions executable by the processor 510, when the electronic device 500 runs, the processor 510 communicates with the memory 520 through the bus 530, and when the machine-readable instructions are executed by the processor 510, the steps of the method for determining the temperature control power of the loop heat pipe in the embodiment of the method shown in fig. 1 may be executed.
An embodiment of the present application further provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the step of the method for determining temperature control power of a loop heat pipe in the embodiment of the method shown in fig. 1 may be executed.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a non-volatile computer-readable storage medium executable by a processor. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present application, and are used for illustrating the technical solutions of the present application, but not limiting the same, and the scope of the present application is not limited thereto, and although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope disclosed in the present application; such modifications, changes or substitutions do not depart from the spirit and scope of the exemplary embodiments of the present application, and are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. A method for determining temperature control power of a loop heat pipe is characterized in that the loop heat pipe comprises an evaporator, a liquid storage device and a semiconductor cooler, and the determining method comprises the following steps:
obtaining heat leakage heat of the working medium from a capillary core in the evaporator to the liquid reservoir when the evaporator is heated to enable the working medium in the evaporator to generate liquid-gas conversion;
when the semiconductor refrigerator cools the liquid storage tank, determining the refrigerating capacity of the semiconductor refrigerator, wherein the refrigerating capacity of the semiconductor refrigerator is determined based on the mapping relation between the devices of the semiconductor refrigerator and the refrigerating capacity;
when the liquid accumulator receives a gaseous working medium which generates liquid-gas conversion, controlling a cooling capacity of the liquid working medium to flow to the liquid accumulator, and acquiring the cooling capacity of the working medium of the liquid accumulator;
and determining the temperature control power of the loop heat pipe to be detected based on the heat leakage quantity, the working medium cold quantity and the refrigerating quantity of the semiconductor refrigerator.
2. The determination method according to claim 1, wherein the heat leakage amount is determined by:
detecting the state parameters of the capillary core and the state parameters of the working medium in a state that the working medium leaks from the capillary core to the liquid storage device;
determining a target parameter value of the capillary core and a temperature difference value between the inner surface and the outer surface of the capillary core based on the state parameter of the capillary core and the state parameter of the working medium;
and determining the product of the target parameter value of the capillary wick and the temperature difference value of the inner surface and the outer surface of the capillary wick as the heat leakage heat quantity.
3. The method for determining according to claim 2, wherein the target parameter value of the capillary wick is determined by:
determining the ratio of the inner diameter parameter to the outer diameter parameter of the capillary core based on the inner diameter parameter and the outer diameter parameter of the capillary core;
and determining a target parameter value of the capillary core based on the mass flow of the working medium in the heat leakage state, the product value of the specific heat capacity of the working medium in the heat leakage state, the length parameter of the capillary core, the heat conductivity parameter of the capillary core and the ratio of the inner diameter parameter to the outer diameter parameter of the capillary core.
4. The method of determining as claimed in claim 2, wherein the temperature difference between the inner and outer surfaces of the capillary wick is determined by:
and determining the temperature difference value of the inner surface and the outer surface of the capillary core based on the average temperature of the inner surface and the outer surface of the capillary core, the pressure difference of the inner surface and the outer surface of the capillary core, the volume change of the working medium in the heat leakage state and the latent heat of vaporization parameter of the working medium.
5. The determination method according to claim 1, characterized in that the working medium cold of the accumulator is determined by the following method:
determining the current working state of the loop heat pipe to be detected;
determining a target parameter value and a working medium temperature difference of the liquid storage device according to the current working state of the loop heat pipe to be detected;
and determining the product of the target parameter value of the liquid accumulator and the temperature difference of the working medium as the working medium cooling capacity of the liquid accumulator.
6. The method of determining according to claim 5, wherein when the operating condition is a gravitational condition, the target parameter value for the reservoir is determined by:
acquiring an outer diameter value of a silk screen in the liquid storage device and an inner diameter value of the liquid guide pipe in a gravity state, and determining a first inner-outer diameter ratio;
determining a first product of the mass flow of the working medium and the specific heat capacity of the working medium based on the mass flow of the working medium and the specific heat capacity of the working medium in a gravity state;
determining a target parameter value for the reservoir under gravity conditions based on the first inner-to-outer diameter ratio, the first product, the length of the reservoir, and a first thermal conductivity coefficient.
7. The method of determining according to claim 5, wherein when the operating condition is an in-orbit condition, the target parameter value for the accumulator is determined by:
acquiring an inner diameter value of a liquid guide pipe in the liquid reservoir and an outer diameter value of a liquid film in an on-orbit state, and determining a second inner-outer diameter ratio;
determining a second product of the mass flow of the working medium and the specific heat capacity of the working medium in the on-orbit state based on the mass flow of the working medium and the specific heat capacity of the working medium in the on-orbit state;
and determining a target parameter value of the liquid storage device in the on-orbit state based on the second inner-outer diameter ratio, the second product, the length of the liquid storage device and the second heat conductivity coefficient.
8. The determination method according to claim 5, wherein when the working state is a gravity state, the working medium temperature difference is determined by:
acquiring a temperature value of a reference inlet working medium of the liquid storage device in a gravity state;
acquiring a saturation temperature value of a reference working medium of the liquid storage device in a gravity state;
and determining the temperature difference of the working medium under the gravity state based on the difference value of the saturated temperature value of the reference working medium and the temperature value of the reference inlet working medium.
9. The determination method according to claim 5, wherein when the operating state is an on-track state, the working medium temperature difference is determined by:
acquiring a temperature value of a target port working medium of the liquid storage device in a rail bar piece state;
acquiring a saturation temperature value of a target working medium of the liquid storage device in a rail piece state;
and determining the temperature difference of the working media in the on-orbit state based on the difference value between the saturation temperature value of the target working media and the temperature value of the target inlet working media.
10. A device for determining temperature control power of a loop heat pipe is characterized by comprising:
the heat leakage determining module is used for acquiring heat leakage heat of the working medium from a capillary core in the evaporator to the liquid storage device when the evaporator is heated to enable the working medium in the evaporator to generate liquid-gas conversion;
the refrigerating capacity determining module is used for determining the refrigerating capacity of the semiconductor refrigerator when the semiconductor refrigerator cools the liquid storage device, wherein the refrigerating capacity of the semiconductor refrigerator is determined based on the mapping relation between the devices of the semiconductor refrigerator and the refrigerating capacity;
the working medium cold quantity determining module is used for controlling the flow of the liquid working medium with the cooling capacity to the liquid storage device and acquiring the working medium cold quantity of the liquid storage device when the liquid storage device receives the gaseous working medium which is converted from liquid to gas;
and the temperature control power determining module is used for determining the temperature control power of the loop heat pipe to be detected based on the heat leakage quantity, the working medium cold quantity and the refrigerating capacity of the semiconductor refrigerator.
11. An electronic device, comprising: a processor, a memory and a bus, wherein the memory stores machine readable instructions executable by the processor, the processor and the memory communicate via the bus when an electronic device is running, and the machine readable instructions are executed by the processor to perform the steps of the method for determining loop heat pipe temperature control power according to any one of claims 1 to 9.
12. A computer-readable storage medium, wherein the computer-readable storage medium stores thereon a computer program, and the computer program is executed by a processor to perform the steps of the method for determining temperature control power of a loop heat pipe according to any one of claims 1 to 9.
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