CN113745264B - Light-emitting substrate, backlight module and display panel - Google Patents
Light-emitting substrate, backlight module and display panel Download PDFInfo
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- CN113745264B CN113745264B CN202110952690.0A CN202110952690A CN113745264B CN 113745264 B CN113745264 B CN 113745264B CN 202110952690 A CN202110952690 A CN 202110952690A CN 113745264 B CN113745264 B CN 113745264B
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- 239000000758 substrate Substances 0.000 title claims abstract description 73
- 230000002093 peripheral effect Effects 0.000 claims abstract description 57
- 230000003068 static effect Effects 0.000 abstract description 26
- 230000005611 electricity Effects 0.000 abstract description 23
- 239000010409 thin film Substances 0.000 description 12
- 230000001052 transient effect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003760 hair shine Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a luminescent substrate, a backlight module and a display panel, wherein the luminescent substrate is provided with a display area and a non-display area, the non-display area is positioned at the periphery of the display area, and the luminescent substrate comprises: the signal line is arranged in the display area; peripheral wiring provided in the non-display area; and an electrostatic protection unit disposed in the non-display area, the electrostatic protection unit including: the anode of the at least one first diode is electrically connected with the signal wire, and the cathode of the at least one first diode is electrically connected with the peripheral wiring; and/or, at least one second diode, the positive pole of at least one second diode is connected with peripheral wiring electricity, the negative pole of at least one first diode is connected with signal line electricity. The electrostatic protection unit formed by at least one first diode and/or at least one second diode has small leakage current when the light-emitting substrate emits light so as to ensure that the light-emitting substrate emits light normally, and is conducted when the light-emitting substrate generates static electricity, so that static electricity burst of the signal line is prevented.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a light emitting substrate, a backlight module, and a display panel.
Background
At present, an active sub-millimeter light-emitting diode display screen prepared by taking a glass substrate as a substrate has cost advantages compared with a sub-millimeter light-emitting diode display screen prepared by taking a flexible printed circuit board as a substrate, and the active sub-millimeter light-emitting diode display screen is beneficial to realizing smaller-space display, so that the active sub-millimeter light-emitting diode display screen is widely developed and focused. However, the active sub-millimeter light emitting diode display screen prepared by using the glass substrate as the substrate is easy to generate static electricity in the preparation process, and the static electricity can cause static electricity damage to the active sub-millimeter light emitting diode display screen.
Therefore, a technical solution is needed to solve the problem of electrostatic damage of the active sub-millimeter led display.
Disclosure of Invention
The application aims to provide a light-emitting substrate, a backlight module and a display panel, which are used for solving the problem that a signal line on the light-emitting substrate is damaged by static electricity.
In order to achieve the above purpose, the technical scheme is as follows:
a light-emitting substrate having a display region and a non-display region, the non-display region being located at a periphery of the display region, the light-emitting substrate comprising:
a signal line arranged in the display area;
peripheral wiring provided in the non-display area; and
an electrostatic protection unit disposed in the non-display area, the electrostatic protection unit including:
at least one first diode, an anode of the at least one first diode is electrically connected with the signal line, and a cathode of the at least one first diode is electrically connected with the peripheral wiring; and/or the number of the groups of groups,
and the anode of the at least one second diode is electrically connected with the peripheral wiring, and the cathode of the at least one first diode is electrically connected with the signal line.
A backlight module comprises the light-emitting substrate.
A display panel comprises the light-emitting substrate.
The beneficial effects are that: the application provides a luminescent substrate, a backlight module and a display panel, wherein an electrostatic protection unit is connected between a signal line of a display area and peripheral wiring of a non-display area, and the electrostatic protection unit comprises: the anode of the at least one first diode is electrically connected with the signal wire, and the cathode of the at least one first diode is electrically connected with the peripheral wiring; and/or, at least one second diode, the positive pole of at least one second diode is connected with peripheral wiring electricity, the negative pole and the signal line electric connection of at least one first diode for the static protection unit is in the state of cutting off and leakage current is little and then guarantees that the luminous base plate normally shines when the luminous base plate shines, and the static protection unit switches on when the luminous base plate takes place static, and the static protection unit plays voltage clamping's effect when switching on discharge, prevents that the signal line from appearing static and exploding. In addition, the first diode and the second diode of the present application have a higher capability of preventing electrostatic discharge from being damaged than the thin film transistor connected as a diode as an electrostatic discharge protection element.
Drawings
FIG. 1 is a schematic plan view of a light-emitting substrate according to an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of the light-emitting substrate shown in FIG. 1;
FIG. 3 is a schematic diagram showing a first embodiment of the light-emitting substrate of FIG. 1 in which an electrostatic protection unit is connected between a signal line and a peripheral wiring;
FIG. 4 is a graph showing I-V characteristics of the electrostatic protection unit of FIG. 3 when the electrostatic protection unit is composed of a bi-directional transient diode;
FIG. 5 is a second schematic diagram of the light-emitting substrate of FIG. 1 in which the electrostatic protection unit is connected between the signal line and the peripheral wiring;
FIG. 6 is a third schematic diagram of the light-emitting substrate of FIG. 1 in which an electrostatic protection unit is connected between a signal line and a peripheral wiring;
FIG. 7 is a fourth schematic diagram of the light-emitting substrate of FIG. 1 in which an electrostatic protection unit is connected between a signal line and a peripheral wiring;
fig. 8 is a schematic diagram of an electrostatic protection unit composed of diode-connected thin film transistors connected between a signal line and a conductive wiring.
The drawings are identified as follows:
100a light emitting substrate; 100a display area; 100b non-display area; 10 a substrate; a 20 light emitting element; 30 signal lines; 301 data lines; 302 scan lines; 40 peripheral wiring; 50 an electrostatic protection unit; 501a first electrostatic protection unit; 501a first branch circuit; 502a second electrostatic protection unit; 502a second branch circuit; 5011 a first diode; 5012 a second diode; 60 thin film transistor array layers; 701 a first conductive pad; 702 a second conductive pad; 801 a first current limiting unit; 802 a second current limiting unit.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
Referring to fig. 1 and 2, fig. 1 is a schematic plan view of a light emitting substrate according to an embodiment of the application, and fig. 2 is a schematic cross-sectional view of the light emitting substrate shown in fig. 1. The light emitting substrate 100 has a display region 100a and a non-display region 100b, and the non-display region 100b is located at the periphery of the display region 100a. The light emitting substrate 100 includes a substrate 10, a plurality of light emitting elements 20, a plurality of signal lines 30, a peripheral wiring 40, and a plurality of electrostatic protection units 50.
In the present embodiment, the substrate 10 is a glass substrate.
In the present embodiment, the plurality of light emitting elements 20 are disposed in the display area 100a of the substrate 10. The plurality of light emitting elements 20 emit different color lights. The light emitting element 20 is an inorganic light emitting diode. The light emitting element 20 includes a red inorganic light emitting diode that emits red light, an inorganic light emitting diode that emits blue light, and an inorganic light emitting diode that emits green light. The inorganic light emitting diode may be a sub-millimeter light emitting diode or a micro light emitting diode. Specifically, the inorganic light emitting diode is a sub-millimeter light emitting diode.
In this embodiment, the plurality of signal lines 30 are disposed in the display area 100a of the substrate 10 and extend to the non-display area 100b, the plurality of signal lines 30 include a plurality of data lines 301 and a plurality of scan lines 302, the plurality of data lines 301 and the plurality of scan lines 302 are located in different layers, the plurality of data lines 301 extend along a column direction and are arranged along a row direction, the plurality of scan lines 302 extend along the row direction and are arranged along the column direction, and the plurality of data lines 301 and the plurality of scan lines 302 are arranged in an insulating and crossing manner. In the process of manufacturing the light emitting substrate 100, the ports of the plurality of signal lines 30 are exposed, and static electricity is easily accumulated at the ports of the plurality of signal lines 30.
In the present embodiment, the peripheral wiring 40 is disposed in the non-display area 100b of the substrate 10, the peripheral wiring 40 is rectangular and closed ring-shaped and is disposed around the display area 100a, the peripheral wiring 40 is connected to a constant voltage low level signal, for example, the peripheral wiring 40 is grounded, i.e. the peripheral wiring 40 is an electrostatic ring. The peripheral wiring 40 may be provided in the same layer as the scan line 302. The peripheral wiring 40 may be provided in the same layer as the data line 301. The peripheral wiring 40 may be partially disposed in the same layer as the scan line 302 and partially disposed in the same layer as the data line 301. The peripheral wiring 40 at different positions can be designed by using different layers of metals, and the different metal layers are electrically connected through the via holes. It will be appreciated that the peripheral wiring 40 may be provided in a segmented configuration, for example, the peripheral wiring 40 is provided in two or four segments, and each segment of the peripheral wiring 40 is connected to a constant voltage low level signal. In addition, the peripheral wiring 40 may be connected to a flip-chip film (not shown), which loads the ground signal GND or the low voltage power signal VSS to the peripheral wiring 40. The present application is advantageous in simplifying the circuit on the light emitting substrate 100 by employing the ring-shaped peripheral wiring 40 when the number of the signal lines 30 on the light emitting substrate 100 is large, as compared to the circuit design of the light emitting substrate is complicated by directly connecting the antistatic device between the opposite ends of the plurality of signal lines 30.
In the present embodiment, a plurality of electrostatic protection units 50 are disposed in the non-display area 100b of the substrate 10, the electrostatic protection units 50 are connected between the plurality of signal lines 30 and the peripheral wiring 40, and the electrostatic protection units 50 include: at least one first diode 5011, an anode of the at least one first diode 5011 is electrically connected to the signal line 30, and a cathode of the at least one first diode 5011 is electrically connected to the peripheral wiring 40; and/or, at least one second diode 5012, an anode of the at least one second diode 5012 is electrically connected to the peripheral wiring 40, and a cathode of the at least one first diode 5011 is electrically connected to the signal line 30. Wherein the at least one first diode 5011 functions to prevent a positive electrostatic charge from exploding the signal line, and the at least one first diode 5011 may prevent a negative charge from exploding the signal line.
As shown in fig. 3, which is a first schematic diagram of the light-emitting substrate shown in fig. 1, in which the electrostatic protection units are connected between the signal lines and the peripheral wiring, each electrostatic protection unit 50 includes at least one first diode 5011 and at least one second diode 5012, the cathode of the at least one first diode 5011 is electrically connected with the cathode of the at least one second diode 5012, the anode of the at least one first diode 5011 is electrically connected with the signal line 30, and the anode of the at least one second diode 5012 is electrically connected with the peripheral wiring 40, so that the electrostatic protection unit 50 can prevent the signal line 30 from being burst with positive electrostatic charges and negative charges.
Specifically, opposite ends of each data line 301 are respectively connected to two electrostatic protection units 50, and opposite ends of each scan line 302 are respectively connected to two electrostatic protection units 50, so as to prevent electrostatic discharge from occurring at the opposite ends of each data line 301 and the opposite ends of each scan line 302. Each electrostatic protection unit 50 is composed of one first diode 5011 and one second diode 5012, the cathode of the first diode 5011 is directly connected to the cathode of the second diode 5012, the anode of the first diode 5011 is directly connected to the signal line 30, and the anode of the second diode 5012 is directly connected to the peripheral wiring 40. The first diode 5011 and the second diode 5012 are transient diodes TVS, and the first diode 5011 and the second diode 5012 form a bidirectional transient diode TVS, as shown in fig. 4, when static electricity occurs and the transient diodes are turned on, the voltages at two ends of the transient diodes are almost unchanged, and the transient diodes play a role of voltage clamping. It is understood that the first diode 5011 and the second diode 5012 may be zener diodes.
It should be noted that, when one end of the data line 301 is electrically connected to the driving chip (not shown), one end of the data line 301 electrically connected to the driving chip is protected by the protection layer, one end of the data line 301 connected to the driving chip may not be connected to the electrostatic protection unit 50, and the other end of the data line 301 in a suspended state is connected to the electrostatic protection unit 50, so as to avoid the data line 301 from being damaged by explosion. Similarly, when the scan line 302 is electrically connected to the driving chip, one end of the scan line 302 electrically connected to the driving chip is protected by the protection layer, and the other end of the scan line 302 in a suspended state is connected to the electrostatic protection unit 50, so as to avoid the scan line from being damaged.
In this embodiment, the light emitting substrate 100 further includes a thin film transistor array layer 60, a plurality of first conductive pads 701 and a plurality of second conductive pads 702, the thin film transistor array layer 60 and the plurality of first conductive pads 701 are disposed in the display area 100a, the plurality of thin film transistor array layer 60 includes a plurality of thin film transistors (not illustrated) arranged in an array, the plurality of first conductive pads 701 are disposed on the thin film transistor array layer 60, a portion of the first conductive pads 701 are electrically connected with the thin film transistors, the light emitting element 20 is bound to the first conductive pads 701, the plurality of second conductive pads 702 are disposed in the non-display area 100b, and the second conductive pads are electrically connected with the peripheral wiring 40, and the first diode 5011 and the second diode 5012 that constitute the electrostatic protection unit 50 are bound to the second conductive pads.
In this embodiment, when the light-emitting substrate 100 emits light normally, the bias voltage on the electrostatic protection unit 50 is small, the electrostatic protection unit 50 is in an off state, and the leakage current is small, i.e. when the electrostatic protection unit 50 is in an off state, the signal line 30 is not conductive with the peripheral wiring 40. When static electricity is generated on the signal line 30, the amount of static electricity charge on the signal line 30 increases dramatically, if the static charge is positive, a current generated by the static electricity flows from the signal line 30 to the peripheral wiring 40, the peripheral wiring 40 is grounded, and the positive charge flows into the ground; if the electrostatic charge is negative, a current flows from the peripheral wiring 40 to the signal line 30, and the grounded peripheral wiring 40 transfers the positive charge to the peripheral wiring 40 and neutralizes the negative charge to eliminate the negative charge, so that the electrostatic protection unit 50 functions to protect the port of the signal line 30 when it is static. In addition, in the electrostatic protection unit formed by the diode-connected thin film transistors 90 as shown in fig. 8, the problem of structural burst of the thin film transistors is easy to occur in the electrostatic protection process, and the normal light emission of the light emitting substrate 100 is affected due to the drift or leakage of the threshold voltage of the thin film transistors in the light emitting substrate 100, while in the electrostatic protection unit 50 of the embodiment of the present application, the first diode 5011 and the second diode 5012 are both transient diodes, or the first diode 5011 and the second diode 5012 are both zener diodes, the leakage currents of the transient diodes and the zener diodes are small, so that the effect of the display of the light emitting substrate 100 is less affected, and the transient diodes and the zener diodes have a voltage clamping effect in the electrostatic protection process, so as to ensure that the electrostatic protection unit 50 cannot generate structural burst to cause the failure of the electrostatic protection unit 50.
It should be noted that, the transient diode and the zener diode are used as components of the electrostatic protection unit 50 and are bonded to the substrate 10 through the die bonding process after being transferred to the substrate 10, and the selection of the transient diode and the zener diode is selected according to the antistatic capability of the electrostatic protection unit 50.
Fig. 5 is a second schematic diagram of the light-emitting substrate shown in fig. 1, in which the electrostatic protection unit is connected between the signal line and the peripheral wiring. The electrostatic protection unit in fig. 5 is substantially similar to the electrostatic protection unit in fig. 3, except that the first diode 5011 and the second diode 5012 of the electrostatic protection unit 50 in fig. 5 are both inorganic light emitting diodes, and the light emitting element 20 is the same as the first diode 5011 and the second diode 5012.
Specifically, the light emitting element 20, the first diode 5011, and the second diode 5012 are all sub-millimeter light emitting diodes.
Compared to the size of the transient diode and the size of the zener diode being different from the size of the light emitting device 20, the electrostatic protection unit 50 needs to be independently transferred and bound, which results in more complex manufacturing process of the light emitting substrate, and when the light emitting device 20, the first diode 5011 and the second diode 5012 are the same, the same transferring process can be used to transfer the light emitting device to the substrate 10, which is beneficial to simplifying the manufacturing process of the light emitting substrate 100. In addition, the normal current interval of the inorganic light-emitting diode is large, and the requirement of electrostatic discharge can be met. In addition, when static electricity occurs on the light-emitting substrate, one of the first diode 5011 and the second diode 5012 is normally turned on to emit light, which is favorable for judging the occurrence of static electricity and recording a high probability station of static electricity.
In addition, when the first diode 5011 and the second diode 5012 are both inorganic light emitting diodes, the color of the light emitted from the first diode 5011 is different from the color of the light emitted from the second diode 5012 so as to identify the type of static electricity. For example, the first diode 5011 emits red light when turned on, the second diode 5012 emits green light when turned on, and static electricity can be judged to be positive based on the red light, and static electricity can be judged to be negative based on the green light.
As shown in fig. 6, which is a third schematic diagram of the light-emitting substrate shown in fig. 1 in which the electrostatic protection unit is connected between the signal line and the peripheral wiring, the electrostatic protection unit 50 shown in fig. 6 is substantially similar to the electrostatic protection unit 50 shown in fig. 5, except that the electrostatic protection unit 50 further includes: a first current limiting unit 801 connected between the anode of at least one first diode 5011 and the signal line 30; and/or a second current limiting unit 802 connected between the anode of the at least one second diode 5012 and the peripheral wiring 40.
Specifically, the electrostatic protection unit 50 further includes a first current limiting unit 801 and a second current limiting unit 802, the first current limiting unit 801 is connected between the anode of the first diode 5011 and the signal line 30, and the second current limiting unit 802 is connected between the anode of the second diode 5012 and the peripheral wiring 40. The first current limiting unit 801 and the second current limiting unit 802 are resistors, and when the first current limiting unit 801 and the second current limiting unit 802 are resistors, the resistance of the first current limiting unit 801 and the resistance of the second current limiting unit 802 may be equal or unequal.
The high-resistance design of the first current limiting unit 801 and the second current limiting unit 802 in the electrostatic protection unit 50 enables the first current limiting unit 801 and the second current limiting unit 802 to play a role in preventing the electrostatic protection unit 50 from leaking electricity when the light-emitting substrate 100 emits light normally, and enables the first current limiting unit 801 and the second current limiting unit 802 to play a role in dividing and limiting current when the light-emitting substrate 100 generates static electricity.
Fig. 7 is a fourth schematic diagram of the light-emitting substrate of fig. 1 in which the electrostatic protection unit is connected between the signal line and the peripheral wiring. The electrostatic protection unit 50 shown in fig. 7 is substantially similar to the electrostatic protection unit 50 shown in fig. 5, except that the electrostatic protection unit 50 includes a first electrostatic protection unit 501 and a second electrostatic protection unit 502 connected in series, the first electrostatic protection unit 501 includes at least two parallel first branch circuits 501a, each first branch circuit 501a includes at least one first diode 5011, an anode of the at least one first diode 5011 is electrically connected to the signal line 30, the second electrostatic protection unit 502 includes at least two parallel second branch circuits 502a, each second branch circuit 502a includes at least one second diode 5012, an anode of the at least one second diode 5012 is electrically connected to the peripheral wiring 40, and a cathode of the at least one second diode 5012 is electrically connected to a cathode of the at least one first diode 5011.
Specifically, the first electrostatic protection unit 501 is composed of two parallel first branch circuits 501a, each first branch circuit 501a is composed of two series-connected first diodes 5011, the anode of one of the two series-connected first diodes 5011 is directly connected to the signal line 30 and the cathode is directly connected to the anode of the other of the two series-connected first diodes 5011; the second electrostatic protection circuit 502 is composed of two parallel second branch circuits 502a, each second branch circuit 502a is composed of two series-connected second diodes 5012, an anode of one of the two series-connected second diodes 5012 is directly connected with the peripheral wiring 40 and a cathode is directly connected with an anode of the other of the two series-connected second diodes 5012, and a cathode of the other of the two series-connected second diodes 5012 is directly connected with a cathode of the other of the two series-connected first diodes 5011.
The electrostatic protection unit 50 shown in fig. 7 is more advantageous to the electrostatic protection of the light emitting substrate when static electricity occurs than the electrostatic protection unit 50 shown in fig. 5.
The application also provides a liquid crystal display device, which comprises a liquid crystal display panel and a backlight module, wherein the backlight module comprises the light-emitting substrate 100.
The application also provides a display panel, which comprises the light-emitting substrate 100.
The above description of the embodiments is only for helping to understand the technical solution of the present application and its core ideas; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.
Claims (8)
1. A light-emitting substrate having a display region and a non-display region, the non-display region being located at a periphery of the display region, the light-emitting substrate comprising:
a signal line arranged in the display area;
peripheral wiring provided in the non-display area; and
an electrostatic protection unit disposed in the non-display area, the electrostatic protection unit including:
at least one first diode, an anode of the at least one first diode is electrically connected with the signal line, and a cathode of the at least one first diode is electrically connected with the peripheral wiring; and/or the number of the groups of groups,
at least one second diode, the anode of the at least one second diode is electrically connected with the peripheral wiring, and the cathode of the at least one second diode is electrically connected with the signal line;
the first diode and the second diode are inorganic light emitting diodes, and the color of light emitted by the first diode is different from that of light emitted by the second diode.
2. The light-emitting substrate according to claim 1, wherein the electrostatic protection unit further comprises:
the first current limiting unit is connected between the anode of at least one first diode and the signal line; and/or the number of the groups of groups,
a second current limiting unit connected between an anode of at least one of the second diodes and the peripheral wiring;
wherein, the first current limiting unit and the first current limiting unit both comprise resistors.
3. The light-emitting substrate according to claim 1, further comprising:
a plurality of light emitting elements disposed in the display region and connected to the signal lines;
wherein the light emitting element is identical to the first diode and the second diode.
4. The light-emitting substrate according to claim 1, wherein the peripheral wiring is in a closed loop shape and is provided around the display region, and the peripheral wiring is connected to a constant voltage low level signal.
5. The light-emitting substrate according to claim 1, wherein the signal line comprises:
a plurality of data lines; and
the scanning lines are arranged in an insulating and crossing mode with the data lines;
the opposite ends of each data line are respectively connected with the two electrostatic protection units, and the opposite ends of each scanning line are respectively connected with the two electrostatic protection units.
6. The light-emitting substrate according to claim 1, wherein the electrostatic protection unit comprises:
the first electrostatic protection unit comprises at least two first branch circuits connected in parallel, wherein each first branch circuit comprises at least one first diode, and the anode of the at least one first diode is electrically connected with the signal line; and
the second electrostatic protection unit comprises at least two second branch circuits connected in parallel, each second branch circuit comprises at least one second diode, the anode of the at least one second diode is electrically connected with the peripheral wiring, and the cathode of the at least one second diode is electrically connected with the cathode of the at least one first diode.
7. A backlight module comprising the light-emitting substrate according to any one of claims 1-6.
8. A display panel comprising the light-emitting substrate according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110952690.0A CN113745264B (en) | 2021-08-19 | 2021-08-19 | Light-emitting substrate, backlight module and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110952690.0A CN113745264B (en) | 2021-08-19 | 2021-08-19 | Light-emitting substrate, backlight module and display panel |
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| Publication Number | Publication Date |
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| CN113745264A CN113745264A (en) | 2021-12-03 |
| CN113745264B true CN113745264B (en) | 2023-11-28 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993579A (en) * | 2017-11-29 | 2018-05-04 | 武汉天马微电子有限公司 | A kind of display panel and its driving method, display device |
| CN110310950A (en) * | 2018-03-27 | 2019-10-08 | 三星电子株式会社 | Display module and display panel |
| CN110599955A (en) * | 2019-09-19 | 2019-12-20 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and display device |
| CN111103718A (en) * | 2020-01-14 | 2020-05-05 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
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- 2021-08-19 CN CN202110952690.0A patent/CN113745264B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993579A (en) * | 2017-11-29 | 2018-05-04 | 武汉天马微电子有限公司 | A kind of display panel and its driving method, display device |
| CN110310950A (en) * | 2018-03-27 | 2019-10-08 | 三星电子株式会社 | Display module and display panel |
| CN110599955A (en) * | 2019-09-19 | 2019-12-20 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and display device |
| CN111103718A (en) * | 2020-01-14 | 2020-05-05 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
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| CN113745264A (en) | 2021-12-03 |
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