CN113744636A - Display module and electronic terminal - Google Patents
Display module and electronic terminal Download PDFInfo
- Publication number
- CN113744636A CN113744636A CN202010481149.1A CN202010481149A CN113744636A CN 113744636 A CN113744636 A CN 113744636A CN 202010481149 A CN202010481149 A CN 202010481149A CN 113744636 A CN113744636 A CN 113744636A
- Authority
- CN
- China
- Prior art keywords
- module
- sub
- layer
- neutral layer
- stress neutral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007935 neutral effect Effects 0.000 claims abstract description 153
- 239000000203 mixture Substances 0.000 claims abstract description 72
- 238000005452 bending Methods 0.000 claims abstract description 52
- 239000010410 layer Substances 0.000 claims description 299
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000012528 membrane Substances 0.000 claims description 7
- 238000012360 testing method Methods 0.000 description 23
- 239000000463 material Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 238000011056 performance test Methods 0.000 description 4
- 238000004590 computer program Methods 0.000 description 3
- 230000003190 augmentative effect Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application provides a display module assembly and electronic terminal, wherein, display module assembly includes: the first sub-module and the second sub-module and the third sub-module are respectively bonded with the first sub-module; the film layers in the first sub-module, the second sub-module and the third sub-module are parallel to each other; and the composition parameters of the second sub-module and the third sub-module are used for enabling the stress neutral layer of the module and the stress neutral layer of the first sub-module to reach a position coincidence condition. The application provides a technical scheme can improve the testability of the bending performance of display module assembly.
Description
Technical Field
The application relates to the field of modules, in particular to a display module and an electronic terminal.
Background
With the continuous development of material technology, the application of the module is more and more extensive. In order to meet the requirements of various practical applications, the structure of the module is also more and more complex, and the reliability of the module gradually becomes a key problem to be considered when the module is applied.
The module usually includes a plurality of retes that have multiple functions, bonds through the tie coat between each rete, when carrying out the bending test to the module, the rete among the module probably takes place problem such as fracture.
At present, in order to meet the bending performance target of the module, the module with various compositions needs to be subjected to bending test so as to determine the appropriate composition, which results in time and labor waste in the module test.
Disclosure of Invention
The application provides a display module assembly and electronic terminal, and the technical scheme provided by the embodiment of the application can improve the testability of the bending performance of a product.
In a first aspect, the present application provides a display module, including: the first sub-module and the second sub-module and the third sub-module are respectively bonded with the first sub-module; the film layers in the first sub-module, the second sub-module and the third sub-module are parallel to each other;
and the composition parameters of the second sub-module and the third sub-module are used for enabling the stress neutral layer of the module and the stress neutral layer of the first sub-module to reach a position coincidence condition.
In this application embodiment, when the composition parameter of second submodule group and third submodule group can make the stress neutral layer of display module assembly and the stress neutral layer of first submodule group reach the position coincidence condition, if the display module group does not reach the bending performance target, can not need to adjust the composition parameter in the first submodule group, and only need adjust the composition parameter of second submodule group and third submodule group, thereby can reduce the number of times that need try, reduce the work load that the display module assembly tested.
In an alternative embodiment, the second and third sub-modules further comprise an adhesive layer;
and the bonding layer of the second sub-module and the bonding layer of the third sub-module are used for enabling the stress neutral layer of the module and the stress neutral layer of the first sub-module to reach the position coincidence condition.
Make the stress neutral layer of display module assembly and the stress neutral layer of first submodule assembly reach the position coincidence condition through the constitution parameter of the tie coat in the second submodule assembly and the third submodule assembly that set up in the module, if the display module assembly does not reach the bending performance target, can not need to constitute the parameter in the first submodule assembly, and, the constitution parameter of the rete in second submodule assembly and the third submodule assembly is adjusted, therefore, can be under the basic function's of ensureing each rete prerequisite, reduce the number of times that need try, reduce the work load of display module assembly test by a wide margin.
In an optional implementation manner, the display module further includes a fourth sub-module and a fifth sub-module; the fourth sub-module comprises at least one film layer and a bonding layer; the fifth sub-module comprises at least one film layer and a bonding layer;
the composition parameters of the bonding layer of the fourth sub-module and the bonding layer of the fifth sub-module are used for enabling the stress neutral layer of the display module and the stress neutral layer of the sub-module combination to reach a position coincidence condition; the sub-module combination comprises the first sub-module, the second sub-module and the third sub-module.
In an alternative embodiment, the first sub-module comprises one membrane layer, and the stress-neutral layer of the first sub-module is the same as the stress-neutral layer of the membrane layer in the first sub-module.
In an alternative embodiment, the first sub-module comprises at least two membrane layers; and the position of the stress neutral layer of the first sub-module is determined according to the composition parameters of the at least two film layers.
In an alternative embodiment, the first sub-module comprises at least two film layers and a bonding layer for bonding the at least two film layers; the position of the stress neutral layer of the first sub-module is determined according to the composition parameters of the at least two film layers and the bonding layer in the first sub-module.
In an optional embodiment, the stress neutral layer of the display module comprises: a first module neutral layer, a second module neutral layer and a third module neutral layer respectively corresponding to the first sub-module, the second sub-module and the third sub-module;
and the composition parameters of the bonding layer of the second sub-module and the bonding layer of the third sub-module are used for enabling the first module neutral layer and the module neutral layer of the first sub-module to reach a position coincidence condition, and the stress neutral layer of the second sub-module and the stress neutral layer of the third sub-module respectively reach a position coincidence condition with the second module neutral layer and the third module neutral layer.
In an optional embodiment, the display module comprises at least two first sub-module combinations.
In an optional embodiment, the number of the stress neutral layers of the display module is multiple;
any stress neutral layer of the display module corresponds to at least one sub-module in the display module;
the composition parameters of the bonding layers in the display modules are also used for enabling the position of the bending neutral layer of each display module to belong to the safety interval of the corresponding sub-module; the position of the bending neutral layer of the display module is the stress neutral layer of the display module when the display module is in a bending state, and the safety interval is the maximum moving range of the stress neutral layer of the corresponding sub-module when the corresponding sub-module is in the bending state and is not damaged.
In an alternative embodiment, the composition parameters of any of the film layers include thickness and/or modulus; the compositional parameters of any of the bond layers include thickness and/or modulus.
In an alternative embodiment, the first sub-module comprises a display film layer.
In an alternative embodiment, the position coincidence condition includes:
and the distance between the stress neutral layer of the display module and the stress neutral layer of the first sub-module is smaller than a coincidence threshold value.
Wherein the coincidence threshold is 0; or the coincidence threshold is determined according to the thickness of the module and the coincidence error coefficient; or the coincidence threshold is determined according to the thickness of the module and the coincidence error coefficient; or the coincidence threshold is determined according to the thickness of the first sub-module and the coincidence error coefficient.
In an optional embodiment, the overlay threshold is a product of a thickness of the display module and the overlay error coefficient; or the coincidence threshold is the product of the thickness of the sub-module and the coincidence error coefficient; wherein the coincidence error coefficient is 0.1.
In a second aspect, the present application provides an electronic terminal, including the module and the housing according to any one of the first aspect.
Drawings
Fig. 1 is a first schematic structural diagram of a display module according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;
fig. 4 is a fourth schematic structural diagram of the display module according to the embodiment of the present application.
Detailed Description
The terminology used in the description of the embodiments section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.
The display module generally includes a plurality of layers having different functions, and each layer may have different functions, for example, a display layer, a polarizing layer, a protective layer, and the like. In order to enable the display module to achieve better bending performance indexes on the basis of meeting various functional requirements, the display module with various different composition structures needs to be subjected to bending performance tests. The indexes of the bending performance test can include any one or more of bending angle, bending radius, bending times, bending frequency and the like.
The display module assembly in this application embodiment can include two at least retes, can bond through the tie coat between each rete. Each film layer and the bonding layer in the display module can be arranged in parallel with each other. The display module is hereinafter referred to as a module. When various film materials in the module are arranged in parallel, a bending shaft can be selected to test the bending performance of the module. When considering the influence of the bending test on the module, the section perpendicular to the bending axis can be selected for analysis and observation, and if the film layer in the module is not broken or the bonding layer is not split in the bending test process, the module can be considered to reach the bending performance index.
When the module fails the test, the film in the module needs to be replaced for retesting, and because the influence of the replaced film on the bending performance of the module is uncertain, the module after replacing the film still may fail the test, for example, the film which is broken when failing the test may be different, therefore, the film may need to be replaced for many times to find the composition of the module which can enable the module to reach the index, resulting in lower test efficiency.
The embodiment of the application provides a display module assembly, has better bending performance testability, therefore can be more convenient set up in devices such as wearable equipment, terminal that need buckle, have the electronic terminal of flexible Organic Light-Emitting Diode (OLED) screen promptly, for example folding cell-phone, computer, augmented reality/virtual reality AR/VR equipment, wearable equipment etc..
The module provided by the embodiment of the present application is exemplarily described below.
Example one
Fig. 1 is a first schematic structural diagram of a module according to an embodiment of the present disclosure. As shown in fig. 1, a module 100 provided in the embodiment of the present application includes: a first sub-module (B1 in the figure), a second sub-module (B2 in the figure), and a third sub-module (B3 in the figure).
The second sub-module and the third sub-module are respectively positioned on two sides of the first sub-module; the film layer in the first sub-module, the film layer in the second sub-module and the film layer in the third sub-module are arranged in parallel; the composition parameters of the second and third sub-modules are used to make the stress neutral layer of the module 100 and the stress neutral layer of the first sub-module reach a position coincidence condition.
In the embodiment of the present application, referring to fig. 1, the first sub-module, the second sub-module, and the third sub-module respectively include at least one film layer. Illustratively, the film layers may be bonded to each other by adhesive layers. When the module is in an unstressed state, all the film layers are parallel to each other.
In this application embodiment, the stress neutral layer of module is for the face that the module internal stress when not receiving the external force that makes the module take place deformation is 0, is as the stress neutral layer of a holistic module when being in the undeformed state promptly. The stress neutral layer of the first sub-module is a surface of which the stress of the first sub-module is 0 when the first sub-module is not subjected to an external force for enabling the first sub-module to deform, namely the stress neutral layer of the first sub-module in a state when the first sub-module is in an undeformed state. The position of the stress neutral layer of the module is determined according to the composition parameters of the module, and the position of the stress neutral layer of the first sub-module is determined according to the composition parameters of the first sub-module.
For example, the composition parameters of the module may include the modulus and thickness of the various films that make up the module, and the composition parameters of the first sub-module may include the modulus and thickness of the various films that make up the first sub-module. In the present embodiment, the modulus is referred to as an elastic modulus.
In embodiments of the present application, the first sub-module may comprise one or more membrane layers. The film layers in the first sub-module can be bonded by adhesive layers, or can be fixed by other methods, for example, by using an attractive force or an adsorption force.
When the first sub-module comprises the bonding layer, the composition parameters of the first sub-module comprise the composition parameters of each film layer in the first sub-module and the composition parameters of the bonding layer. The position of the stress neutral layer of the first sub-module is determined according to the composition parameters of each film layer and the bonding layer in the first sub-module.
When the first sub-module does not comprise the bonding layer, the position of the stress neutral layer of the first sub-module is determined according to the composition parameters of each film layer in the first sub-module. When the first sub-module only comprises one film layer, the position of the stress neutral layer of the first sub-module is the position of the film layer neutral layer of the film layer determined according to the composition parameters of the film layer in the first sub-module. It should be noted that, in the embodiment of the present application, the film neutral layer of any film is a stress neutral layer of the film when the film is not subjected to an external force that causes the film to deform, that is, the stress neutral layer of the film in an undeformed state.
In this embodiment, the second sub-module and the third sub-module may also include an adhesive layer, where the adhesive layer in the second sub-module is used to bond the second sub-module and the first sub-module, and the adhesive layer in the third sub-module is used to bond the third sub-module and the first sub-module.
In other embodiments of the present application, the second sub-module may include two or more film layers, and the second sub-module may further include an adhesive layer for adhering the film layers in the second sub-module. The third sub-module may include two or more film layers, and the third sub-module may further include a bonding layer for bonding each film layer in the third sub-module. Accordingly, the composition parameters of the second sub-module may include thicknesses and moduli of the respective film layers and the respective bonding layers constituting the second sub-module, and the composition parameters of the third sub-module may include thicknesses and moduli of the respective film layers and the respective bonding layers constituting the second sub-module.
In embodiments of the present application, the relationship of various films, moduli, and stress neutral layers of the module can be used to determine the desired compositional parameters. Illustratively, when the thickness of any one of the film materials in the module is increased, the position of the stress neutral layer of the module is shifted toward the side where the thickness is increased, and when the module includes a plurality of film materials, the position of the stress neutral layer of the module is shifted toward the film material having the side where the modulus is larger. In one example, for a module of two films, the square of the distance from the surface of the first film on the side away from the second film to the stress neutral layer of the module is inversely proportional to the modulus of the first film.
In the examples of the present application, the position registration condition has various modes.
In an alternative embodiment, the distance between the stress-neutral layer of the module and the stress-neutral layer of the first sub-module may be equal to 0.
In another alternative embodiment, the distance between the stress-neutral layer of the module and the stress-neutral layer of the first sub-module may be less than a coincidence threshold.
In one example, the coincidence threshold may be a numerical value, such as 2 μm.
In another example, the registration threshold may be determined based on the thickness of the die set and the registration error coefficient. For example, the registration threshold may be the product of the thickness of the die set and the registration error coefficient.
In yet another example, the registration threshold may be determined based on a thickness of the first sub-module and a registration error coefficient. For example, the registration threshold may be a product of a thickness of the first sub-module and a registration error coefficient.
For example, the coincidence error coefficient may be 0.1. In other embodiments of the present application, the coincidence threshold and the coincidence error coefficient will be exemplified in connection with practical applications.
In the embodiment of the present application, there are various implementations of the composition parameters of the second sub-module and the composition parameters of the third sub-module in the module to make the stress neutral layer of the first sub-module of the stress neutral layer of the module reach the position-overlapping condition.
In an alternative embodiment, the composition parameters of the second sub-module and the composition parameters of the third sub-module may be determined according to the position of the stress-neutral layer of the module and the composition parameters of the respective film layers in the module, wherein the position of the stress-neutral layer of the module may be determined according to the position and position coincidence condition of the stress-neutral layer of the first sub-module, and the position of the stress-neutral layer of the first sub-module is determined according to the composition parameters of the first sub-module.
In another alternative embodiment, when the bonding layers are included in the first sub-module and the third sub-module, if the composition parameters of the film layers of the second sub-module and the third sub-module are determined, the stress neutral layer of the module and the stress neutral layer of the first sub-module can reach the position coincidence condition by setting the composition parameters of the bonding layers in the second sub-module and the composition parameters of the bonding layers in the third sub-module.
For example, the composition parameters of the bonding layer in the second sub-module and the composition parameters of the bonding layer in the third sub-module may be determined according to the position of the stress neutral layer of the module and the composition parameters of the respective film layers in the module, wherein the position of the stress neutral layer of the module may be determined according to the position and position coincidence condition of the stress neutral layer of the first sub-module, and the position of the stress neutral layer of the first sub-module is determined according to the composition parameters of the first sub-module.
In one example, the stress neutral layer of the module may be brought into a position-coincident condition with the stress neutral layer of the first sub-module by setting the thickness and modulus of the bonding layer in the second sub-module and the thickness and modulus of the bonding layer in the third sub-module.
In another example, when the thicknesses of the bonding layers in the second and third sub-modules have been determined, the stress neutral layer of the module may be brought into a position-coincident condition with the stress neutral layer of the first sub-module by setting the modulus of the bonding layer in the second sub-module and the modulus of the bonding layer in the third sub-module.
In yet another example, when the modulus of the bonding layer in the second and third sub-modules has been determined, the stress neutral layer of the module may be brought into a positionally coincident condition with the stress neutral layer of the first sub-module by setting the thickness of the bonding layer in the second sub-module and the thickness of the bonding layer in the third sub-module.
It should be noted that, in the embodiment of the present application, the total thickness of each film layer and the adhesive layer in the module cannot exceed the target thickness of the module, which can be determined by the product requirement.
In this embodiment, the film layer in the first sub-module can be a display film layer, and accordingly, the module can be a display module. The adhesive layer may be PSA or OCA or the like.
In the embodiment of the present application, it should be noted that, in practical applications, if the module product is formed by fixedly connecting the first module and the second module, only the first module may be disposed therein to satisfy the condition that the stress neutral layer of the first module and the stress neutral layer of the first sub-module in the first module reach the position coincidence condition. In this way, the number of tests to be tried for the first die set can be simplified at least when the bending performance of the first die set in the die set product is tested.
In the embodiment of the present application, when the composition parameters of the second and third sub-modules enable the stress neutral layer of the module and the stress neutral layer of the first sub-module to reach the position coincidence condition, the module provided in the embodiment of the present application has good bending performance testability.
For example, referring to fig. 1, a module 100 (C1 in the figure) may comprise: a first sub-module B1, a second sub-module B2, and a third sub-module B3. Wherein, the B1 can comprise two film layers A0 and A1, and a bonding layer Z1 for bonding the A0 and the A1; b2 may include a film layer a2, and, a tie layer Z2 for bonding B2 and B1; b3 may include a film layer A3, and a tie layer Z3 for bonding B3 and B1.
The stress neutral layer of B1 may be located at the position shown by the dashed line Y _ B1, and the stress neutral layer of C1 may be located at the position shown by the dashed line Y _ B1. When Y _ B1 and Y _ C1 reach the position overlapping condition, if the stress neutral layer of B1 is located at Y _ B1 and can meet the bending performance target O1, when C1 is tested according to the bending performance target O2, the target O2 may be lower than the target O1, and if C1 does not pass the O2 test, the part of C1 where the breakage occurs should not be B1, and therefore, the composition parameters of only the part of C1 other than the B1 may be adjusted. In an example, the thickness or modulus of Z2 in B2 and Z3 in B3 may be adjusted on the premise of ensuring that the composition parameters of Z2 and Z3 can enable Y _ C1 and Y _ B1 to reach the position coincidence condition, i.e., the thickness and modulus of B1, a2 in B2, and A3 in B3 may not need to be adjusted. Thereafter, the adjusted C1 may be tested until Z2 and Z3 are selected that enable C1 to reach test target O2.
Therefore, when the composition parameters of the second sub-module and the third sub-module enable the stress neutral layer of the module and the stress neutral layer of the first sub-module to reach the position coincidence condition, if the module does not reach the bending performance target, the composition parameters in the first sub-module can be adjusted, and only the composition parameters of the second sub-module and the third sub-module need to be adjusted, so that the number of times of trying can be reduced, and the workload of module testing is reduced.
Further, make the stress neutral layer of module and the stress neutral layer of first submodule group reach the position coincidence condition through the constitution parameter of the tie coat in the second submodule group that sets up in the module and the third submodule group, if the module does not reach the bending performance target, can not need to constitute the parameter in the first submodule group, and, the constitution parameter of rete in second submodule group and the third submodule group is adjusted, therefore, can be under the prerequisite of ensureing the basic function of each rete, reduce the number of times that need try, reduce the work load of module test by a wide margin.
Example two
The embodiment of the present application further provides a module, which may include at least five sub-modules, a first sub-module, a second sub-module, a third sub-module, a fourth sub-module, and a fifth sub-module, wherein each sub-module may include at least one film layer. The composition parameters of the sub-module positioned at the outermost layer can be used for enabling the stress neutral layer of the whole module and the stress neutral layer of the sub-module combination of other sub-modules except the sub-module positioned at the outermost layer to reach a position coincidence condition.
In embodiments of the present application, the individual film layers may be bonded by adhesive layers. When the composition parameters of the film layer in the outermost sub-module are determined, the composition parameters of the bonding layer in the outermost sub-module may be set so that the stress neutral layer of the entire module and the stress neutral layer of the sub-module combination of other sub-modules except the outermost sub-module reach a position coincidence condition.
Fig. 2 is a second schematic structural diagram of a module according to an embodiment of the present disclosure. As shown in fig. 2, the module 200 (D1 in the figure) provided in the embodiment of the present application includes: a sub-module combination (C1 in the figure) composed of a first sub-module (B1 in the figure), a second sub-module (B2 in the figure), and a third sub-module (B3 in the figure), and a fourth sub-module (B4 in the figure) and a fifth sub-module (B4 in the figure). Wherein, each sub-module comprises at least one film layer. The film layers in each sub-module are arranged in parallel.
The module D1 further includes a fourth sub-module B4 and a fifth sub-module B5; the fourth sub-module B4 comprises at least one film layer and an adhesive layer (A4 and Z4 in FIG. 2); the fifth sub-module B5 includes at least one film layer and an adhesive layer (e.g., a5 and Z5 in fig. 2).
In the embodiment of the present application, the composition parameters of Z2 and Z3 in C1 are used to make the stress neutral layer Y _ C1 of C1 and the stress neutral layer Y _ B1 of B1 reach a position coincidence condition. On the basis, after the bending test is carried out on C1, and after C1 is determined to be capable of reaching a bending performance target O2, B4 and B5 can be added on the outer side of C1 to obtain a module D1, wherein when the composition parameters of A4 and A5 are determined, the composition parameters of Z4 in B4 and Z5 in B5 can be set so that the stress neutral layer of the module D1 and the stress neutral layer of the sub-module combination C1 reach a position coincidence condition. Then, the test of D1 was performed, and if D1 did not reach the bending test target O2, it could be determined that the C1 portion was not broken, and then, the composition parameters of the C1 portion could be adjusted only for the portions other than C1 in D1 without adjusting the composition parameters. For example, the composition parameters of Z4 and Z5 may be adjusted on the premise that the position coincidence condition of Y _ D1 and Y _ C1 is satisfied. Then, D1 after adjusting the composition parameters may be tested.
The adoption sets up the sub-module combination in module and the module and all satisfies the implementation mode of position coincidence condition, can reduce the number of times that the multi-membrane combination needs the combination module repeatedly, reduces the work load of module test.
EXAMPLE III
The embodiment of the present application further provides a module, which may include at least three sub-modules, for example, a first sub-module, and a second sub-module and a third sub-module located at two sides of the first sub-module. Each sub-module comprises at least one film layer. The film layers in the module can be bonded through bonding layers. The number of the stress neutral layers of the module can be multiple.
In the embodiment of the present application, the number of the stress neutral layers of the module may be the same as or different from the number of the sub-modules in the module. When the number is the same, the stress neutral layers of the modules correspond to the sub-modules one by one; when the number of stress neutral layers of the module is different from the number of sub-modules in the module, each stress neutral layer in the module corresponds to at least one sub-module in each sub-module in the module, and each sub-module corresponds to one of the stress neutral layers of the module. And the stress neutral layer of the corresponding module and the stress neutral layer of the sub-module reach a position coincidence condition. In one example, the positional registration condition between the stress neutral layer of the corresponding module and the stress neutral layer of the sub-module may be achieved by setting the composition parameters of the bonding layers in the second and third sub-modules.
For example, the number of stress neutral layers of a module is the same as the number of submodules in the module. For example, the stress neutral layer of the module may include: and the first module neutral layer, the second module neutral layer and the third module neutral layer respectively correspond to the first sub-module, the second sub-module and the third sub-module. And the composition parameters of the bonding layer of the second sub-module and the bonding layer of the third sub-module are used for enabling the stress neutral layer of the first sub-module and the stress neutral layer of the first module to reach the position coincidence condition, and the stress neutral layer of the second sub-module and the stress neutral layer of the third sub-module respectively reach the position coincidence condition with the stress neutral layer of the second module and the stress neutral layer of the third module.
Fig. 3 is a third schematic structural diagram of a module according to an embodiment of the present disclosure. As shown in fig. 3, the module 300 (C1 in the drawing) provided in the embodiment of the present application includes: the module comprises a first sub-module B1, a second sub-module B2 and a third sub-module B3, wherein a stress neutral layer of the module C1 comprises Y _ C1_1, Y _ C1_2 and Y _ C1_ 3.
The composition parameters of Z2 and Z3 are used for enabling Y _ C1_1 and Y _ B1 to reach a position coincidence condition, enabling Y _ C1_2 and Y _ B2 to reach a position coincidence condition, and enabling Y _ C1_3 and Y _ B3 to reach a position coincidence condition. The position overlapping conditions corresponding to the sub-modules may be the same or different, and refer to the description in the first embodiment. The position of the neutral layer in the module can be determined computationally using known techniques.
In the embodiment of the application, bending tests can be respectively carried out on a1, a2 and A3, and if a1, a2 and A3 can all reach a bending performance target O3, it can be directly determined that C1 can reach O3.
By adopting the implementation mode that the stress neutral layers of the module and the stress neutral layers of the sub-modules in the module respectively correspond one to one and meet the position coincidence condition, the bending performance index of the module consisting of the sub-modules can be directly determined according to the bending performance target which can be reached by each sub-module, namely, the whole module does not need to be subjected to bending performance test, and the workload of module test is greatly reduced.
Example four
The embodiment of the application also provides a module. On the basis of any one of the foregoing embodiments, the composition parameters of each bonding layer in the module in the embodiment of the present application may also be used to enable the position of each stress-neutral layer of the module to belong to the safety zone of the sub-module corresponding to the stress-neutral layer of each module.
It should be noted that the number of the stress neutral layers in the module may be the same as or different from the number of the sub-modules, and it is only necessary to ensure that the stress neutral layer of each module is located in a safety zone corresponding to one sub-module. In the embodiment of the present application, the number of the stress neutral layers of the module may be the same as or different from the number of the sub-modules in the module. When the number is the same, the stress neutral layers of the modules correspond to the sub-modules one by one; when the number of stress neutral layers of the module is different from the number of sub-modules in the module, each stress neutral layer in the module corresponds to at least one sub-module in each sub-module in the module, and each sub-module corresponds to one of the stress neutral layers of the module. The position of the stress neutral layer of the corresponding module belongs to the safety interval of the corresponding sub-module. In one example, the position of the stress-neutral layer of the corresponding module may be made to belong to the safety interval of the stress-neutral layer of the corresponding sub-module by setting the composition parameters of the bonding layers in the second and third sub-modules.
In this application embodiment, the composition parameters of each bonding layer in the module can also be specifically used for making the position of each neutral layer of buckling in the module belong to the safety interval of the sub-module corresponding to each neutral layer of buckling respectively.
In the embodiment of the present application, the safety zone of any sub-module may be the maximum moving range of the stress neutral layer of the sub-module when any sub-module is in a bent state and is not damaged as a whole.
In one example, the safety interval may be determined according to a bending performance target that the sub-module can achieve. The bend performance targets may include bend radius, number of bends, and the like. When the bending radius is smaller or the bending times are more, the strength of various film materials is reduced more quickly, and at the moment, the film layer in the sub-module is more easily damaged. For example, the safety interval of each sub-module may be determined according to the thickness, strength, modulus, bending radius and bending times of each film layer in the module.
It should be noted that, when any film material of the module is stressed and bent, and the lower surface of the film material is stretched, the stress neutral layer of the film material moves towards the upper surface; when the upper surface of the film is stretched, the stress neutral layer of the film moves toward the lower surface. When the surface of the film layer is farther away from the stress neutral layer of the module, the larger the tensile force or extrusion force borne by the surface of the film layer is, the easier the film layer is to be damaged. In the embodiment of the present application, the film material in the module may be a film layer or an adhesive layer having a function.
Fig. 4 is a fourth schematic structural diagram of a module according to an embodiment of the present application. As shown in fig. 4, the module 300 (C1 in the drawing) provided in the embodiment of the present application includes: the module comprises a first sub-module B1, a second sub-module B2 and a third sub-module B3, wherein a stress neutral layer of the module C1 comprises Y _ C1_1, Y _ C1_2 and Y _ C1_ 3. The safety intervals corresponding to the first sub-module, the second sub-module and the third sub-module are S _ B1, S _ B2 and S _ B3 respectively. The compositional parameters of Z2 and Z3 may be used such that Y _ C1_1 belongs to S _ B1, Y _ C2_1 belongs to S _ B2, and Y _ C3_1 belongs to S _ B3.
In an example, the composition parameters of Z2 and Z3 may be used to make the module satisfy both the conditions that Y _ C1_1 belongs to S _ B1, Y _ C2_1 belongs to S _ B2, and Y _ C3_1 belongs to S _ B3, and also satisfy the conditions that Y _ C1_1 and Y _ B1 reach the position coincidence condition, Y _ C1_2 and Y _ B2 reach the position coincidence condition, and Y _ C1_3 and Y _ B3 reach the position coincidence condition.
When the embodiment is adopted, if the composition parameters of the bonding layer in the module can enable the position of the stress neutral layer in the module to belong to the safety range of the corresponding sub-module, if each sub-module can reach the bending performance target, the module formed by each sub-module can be directly determined to reach the bending performance target, namely, the bending performance test of the whole module can be omitted, and the workload of the module test is greatly reduced.
In the above embodiments, the implementation may be wholly or partially realized by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the procedures or functions described in accordance with the present application are generated, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another, for example, the computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by wire (e.g., coaxial cable, fiber optic, digital subscriber line) or wirelessly (e.g., infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device, such as a server, a data center, etc., that incorporates one or more of the available media. The usable medium may be a magnetic medium (e.g., floppy Disk, hard Disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., Solid State Disk), among others.
Claims (15)
1. A display module, comprising: the first sub-module and the second sub-module and the third sub-module are respectively bonded with the first sub-module; the film layers in the first sub-module, the second sub-module and the third sub-module are parallel to each other;
and the composition parameters of the second sub-module and the third sub-module are used for enabling the stress neutral layer of the module and the stress neutral layer of the first sub-module to reach a position coincidence condition.
2. The display module of claim 1, wherein the second and third sub-modules further comprise an adhesive layer;
and the bonding layer of the second sub-module and the bonding layer of the third sub-module are used for enabling the stress neutral layer of the module and the stress neutral layer of the first sub-module to reach the position coincidence condition.
3. A display module according to claim 1 or 2, wherein the module further comprises a fourth sub-module and a fifth sub-module; the fourth sub-module comprises at least one film layer and a bonding layer; the fifth sub-module comprises at least one film layer and a bonding layer;
the composition parameters of the bonding layer of the fourth sub-module and the bonding layer of the fifth sub-module are used for enabling the stress neutral layer of the module and the stress neutral layer of the sub-module combination to reach a position coincidence condition; the sub-module combination comprises the first sub-module, the second sub-module and the third sub-module.
4. A display module according to any one of claims 1-3, wherein the first sub-module comprises a membrane layer, and the stress neutral layer of the first sub-module is the same as the stress neutral layer of the membrane layer of the first sub-module.
5. The display module according to any one of claims 1-3, wherein the first sub-module comprises at least two layers; and the position of the stress neutral layer of the first sub-module is determined according to the composition parameters of the at least two film layers.
6. The display module according to any one of claims 1 to 3, wherein the first sub-module comprises at least two film layers and an adhesive layer for adhering the at least two film layers; the position of the stress neutral layer of the first sub-module is determined according to the composition parameters of the at least two film layers and the bonding layer in the first sub-module.
7. A display module according to any one of claims 1-6, wherein the stress neutral layer of the module comprises: a first module neutral layer, a second module neutral layer and a third module neutral layer respectively corresponding to the first sub-module, the second sub-module and the third sub-module;
and the composition parameters of the bonding layer of the second sub-module and the bonding layer of the third sub-module are used for enabling the first module neutral layer and the module neutral layer of the first sub-module to reach a position coincidence condition, and the stress neutral layer of the second sub-module and the stress neutral layer of the third sub-module respectively reach a position coincidence condition with the second module neutral layer and the third module neutral layer.
8. A display module according to claim 7, characterised in that the module comprises at least two of said first sub-module combinations.
9. The display module of claim 1, wherein the number of stress neutral layers of the module is plural;
any stress neutral layer of the module corresponds to at least one sub-module in the module;
the composition parameters of the bonding layers in the modules are also used for enabling the position of the bending neutral layer of each module to belong to the safety interval of the corresponding sub-module; the position of the bending neutral layer of the module is the stress neutral layer of the module when the module is in a bending state, and the safety interval is the maximum moving range of the stress neutral layer of the corresponding sub-module when the corresponding sub-module is in the bending state and is not damaged.
10. The display module according to any one of claims 1 to 9, wherein the composition parameters of any one of the layers include thickness and/or modulus; the compositional parameters of any of the bond layers include thickness and/or modulus.
11. The display module of any one of claims 1-10, wherein the first sub-module comprises a display film layer.
12. The display module according to any one of claims 1-11, wherein the position registration condition comprises:
the distance between the stress neutral layer of the module and the stress neutral layer of the first sub-module is smaller than a coincidence threshold.
Wherein the coincidence threshold is 0; or the coincidence threshold is determined according to the thickness of the module and the coincidence error coefficient; or the coincidence threshold is determined according to the thickness of the module and the coincidence error coefficient; or the coincidence threshold is determined according to the thickness of the first sub-module and the coincidence error coefficient.
13. The display module of claim 12, wherein the registration threshold is a product of a thickness of the module and the registration error coefficient; or the coincidence threshold is the product of the thickness of the sub-module and the coincidence error coefficient; wherein the coincidence error coefficient is 0.1.
14. The display module according to claim 12, wherein the display module is a flexible Organic Light Emitting Diode (OLED) display module.
15. An electronic terminal, comprising a housing and a display module connected to the housing, wherein the display module is the display module according to any one of claims 1 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010481149.1A CN113744636B (en) | 2020-05-31 | 2020-05-31 | Display module and electronic terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010481149.1A CN113744636B (en) | 2020-05-31 | 2020-05-31 | Display module and electronic terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113744636A true CN113744636A (en) | 2021-12-03 |
| CN113744636B CN113744636B (en) | 2022-11-04 |
Family
ID=78727877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010481149.1A Expired - Fee Related CN113744636B (en) | 2020-05-31 | 2020-05-31 | Display module and electronic terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113744636B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150179722A1 (en) * | 2013-12-19 | 2015-06-25 | Samsung Display Co., Ltd. | Organic light emitting display device |
| CN107134538A (en) * | 2017-06-29 | 2017-09-05 | 京东方科技集团股份有限公司 | A kind of display base plate, preparation method and display device |
| CN107516472A (en) * | 2017-08-31 | 2017-12-26 | 昆山国显光电有限公司 | Flexible display apparatus |
| CN108470853A (en) * | 2018-04-12 | 2018-08-31 | 京东方科技集团股份有限公司 | A kind of flexible display panels and preparation method thereof and display device |
| CN208422962U (en) * | 2018-08-09 | 2019-01-22 | 京东方科技集团股份有限公司 | Folding flexible display panels and display device |
| CN208607860U (en) * | 2018-08-07 | 2019-03-15 | 京东方科技集团股份有限公司 | Flexible Displays mould group, flexible display apparatus |
| CN110189638A (en) * | 2019-06-28 | 2019-08-30 | 武汉天马微电子有限公司 | Display module and display device |
| CN110429123A (en) * | 2019-08-12 | 2019-11-08 | 京东方科技集团股份有限公司 | Display panel and its manufacturing method, display device |
-
2020
- 2020-05-31 CN CN202010481149.1A patent/CN113744636B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150179722A1 (en) * | 2013-12-19 | 2015-06-25 | Samsung Display Co., Ltd. | Organic light emitting display device |
| CN107134538A (en) * | 2017-06-29 | 2017-09-05 | 京东方科技集团股份有限公司 | A kind of display base plate, preparation method and display device |
| CN107516472A (en) * | 2017-08-31 | 2017-12-26 | 昆山国显光电有限公司 | Flexible display apparatus |
| CN108470853A (en) * | 2018-04-12 | 2018-08-31 | 京东方科技集团股份有限公司 | A kind of flexible display panels and preparation method thereof and display device |
| CN208607860U (en) * | 2018-08-07 | 2019-03-15 | 京东方科技集团股份有限公司 | Flexible Displays mould group, flexible display apparatus |
| CN208422962U (en) * | 2018-08-09 | 2019-01-22 | 京东方科技集团股份有限公司 | Folding flexible display panels and display device |
| CN110189638A (en) * | 2019-06-28 | 2019-08-30 | 武汉天马微电子有限公司 | Display module and display device |
| CN110429123A (en) * | 2019-08-12 | 2019-11-08 | 京东方科技集团股份有限公司 | Display panel and its manufacturing method, display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113744636B (en) | 2022-11-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106530973B (en) | Curved surface display device | |
| JP6382652B2 (en) | Flexible display device | |
| KR20150108990A (en) | Flexible display device | |
| US7130498B2 (en) | Multi-layer optical circuit and method for making | |
| US20170045693A1 (en) | Multi-layer flexible optical circuit | |
| US20210150941A1 (en) | Flexible Display Device and Hetero-Shaped Double-Sided Adhesive Tape | |
| JP2011237573A (en) | Optical component for optical fiber coupling, optical module, manufacturing method of optical component for optical fiber coupling and manufacturing method of optical module | |
| CN113744636B (en) | Display module and electronic terminal | |
| CN113570963A (en) | Display device | |
| JP3805731B2 (en) | Fiber sheet and fiber sheet manufacturing method | |
| US6272263B1 (en) | Fibre optic routing system | |
| CN107357459B (en) | Flexible structure | |
| JP2000066034A (en) | Optical wiring board | |
| CN113748451B (en) | Flexible display device and electronic apparatus | |
| US6370293B1 (en) | Flexible optical circuits having optical fibers encapsulated between porous substrates and methods for fabricating same | |
| KR20190143014A (en) | Touch sensor module, window stack structure including the same and image display device including the same | |
| CN116097035A (en) | Waveguide with 2-layer stack | |
| US7043107B2 (en) | Flexible optical connecting part | |
| CN108174508B (en) | Folding display module, flexible circuit board and manufacturing method thereof | |
| CN217085310U (en) | Optical film and optical film assembly | |
| CN210122555U (en) | Thick double-sided adhesive tape | |
| US11536910B2 (en) | Optical fiber cable assembly for monitoring functions | |
| CN114596786A (en) | Display cover plate, display device and preparation method | |
| CN113632255B (en) | Symmetrical foldable display stack for electronic devices | |
| CN116744716A (en) | display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20221104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |