CN113736132B - Low-density epoxy foaming grinding wheel and preparation method thereof - Google Patents
Low-density epoxy foaming grinding wheel and preparation method thereof Download PDFInfo
- Publication number
- CN113736132B CN113736132B CN202111230420.5A CN202111230420A CN113736132B CN 113736132 B CN113736132 B CN 113736132B CN 202111230420 A CN202111230420 A CN 202111230420A CN 113736132 B CN113736132 B CN 113736132B
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- low
- foaming
- grinding wheel
- density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0066—Use of inorganic compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a low-density epoxy foaming grinding wheel and a preparation method thereof, comprising the following steps: (1) preparation of modified epoxy resin powder: uniformly mixing liquid epoxy resin, epoxy resin powder and dicyandiamide powder at 100-120 ℃, cooling and crushing into powder to prepare modified epoxy resin powder; (2) Uniformly mixing modified epoxy resin powder, an abrasive, a liquid wetting agent, a microsphere foaming agent and an auxiliary agent to prepare a mixture; (3) And (3) filling the mixture into a mold for sealing and preserving, then putting the mold into an oven at 70-110 ℃ for heating for a certain time, and then continuously heating to 150-170 ℃ for heating for a certain time, and foaming to obtain the low-density epoxy foaming grinding wheel. The low-density epoxy foaming grinding wheel prepared by the method has the advantages of high porosity, uniform foam holes, good grinding effect, low roughness, strong cutting force, simple preparation method process, low cost and no harmful gas discharge.
Description
Technical Field
The invention relates to the technical field of foaming grinding wheels, in particular to a low-density epoxy foaming grinding wheel and a preparation method thereof.
Background
The low-density grinding wheel commonly used in China is generally developed by combining phenolic resin with abrasive materials, and is characterized by dense and uniform pore distribution, certain elasticity, good polishing effect, complex manufacturing process, high cost, poor grinding wheel strength, short service life, and the like, and the problems of harmful gas discharge in the production process are solved. Still others produce grinding wheels by means of hollow microspheres and epoxy resin combined with abrasive, but in order to achieve low density, the volume of the hollow microspheres needs to be increased, but the difficult problems of poor dispersion and the risks of scratches are brought.
Therefore, there is a need to develop a low-density epoxy foaming grinding wheel and a preparation method thereof to solve the above-mentioned drawbacks.
Disclosure of Invention
The invention aims to provide a preparation method of a low-density epoxy foaming grinding wheel, which has the advantages that the prepared low-density epoxy foaming grinding wheel has high porosity, uniform cells, good grinding effect, low roughness and strong cutting force, and the preparation method has simple process, low cost and no harmful gas discharge.
The invention also aims to provide a low-density epoxy foaming grinding wheel which is manufactured by the method.
In order to achieve the above purpose, the invention provides a preparation method of a low-density epoxy foaming grinding wheel, comprising the following steps:
(1) Preparation of modified epoxy resin powder: uniformly mixing liquid epoxy resin, epoxy resin powder and dicyandiamide powder at 100-120 ℃, cooling and crushing into powder to prepare modified epoxy resin powder;
(2) Uniformly mixing modified epoxy resin powder, an abrasive, a liquid wetting agent, a microsphere foaming agent and an auxiliary agent to prepare a mixture;
(3) And (3) filling the mixture into a mold for sealing and preserving, then putting the mold into an oven at 70-110 ℃ for heating for a certain time, and then continuously heating to 150-170 ℃ for heating for a certain time, and foaming to obtain the low-density epoxy foaming grinding wheel.
Compared with the prior art, in the preparation method of the low-density epoxy foaming grinding wheel, the epoxy resin is modified, and the dicyandiamide powder is difficult to dissolve in the liquid epoxy resin, so that the dicyandiamide powder can be uniformly dispersed in the epoxy resin powder in a hot melting mode at 100-120 ℃ to obtain the modified epoxy resin powder. Then, the liquid wetting agent and the liquid epoxy resin react at 70-110 ℃, a semi-solidified state is formed in the early stage of shaping, a network structure is formed, the temperature is continuously raised to 150-170 ℃ to foam the microsphere foaming agent and solidify the powder resin when the epoxy resin powder is continuously heated and melted in the follow-up process, certain elasticity exists in resin molecules due to the network structure in the semi-solidified state, the fusion of every two microspheres can be better prevented when the microspheres expand, the generation of large pores is caused, each microsphere is expanded independently to form dense small pores, the porosity is high, the pores are uniform, the grinding effect is good, the roughness is low, and the preparation method has the advantages of simple process, low cost and no discharge of harmful gas.
Preferably, the liquid epoxy resin is at least one selected from bisphenol A epoxy resin and bisphenol F epoxy resin with the viscosity below 25000cps at 25 ℃, and the bisphenol F epoxy resin is relatively brittle and drops off quickly, so that the bisphenol A epoxy resin is preferably adopted, and the service life of the prepared foaming molding wheel is longer.
Preferably, the epoxy resin powder is selected from at least one of bisphenol a epoxy resin and phenol novolac epoxy resin. The curing temperature of the bisphenol A epoxy resin powder is 150-170 ℃.
Preferably, the particle size D50 of the epoxy powder is 1-30um, for example, the particle size D50 of the epoxy powder may be, but is not limited to, 1um, 5um, 10um, 15um, 20um, 25um, 30um.
Preferably, in step (1), the amount of each material is 3 to 5 parts of liquid epoxy resin, 40 to 45 parts of epoxy resin powder and 1 to 3 parts of dicyandiamide powder, respectively.
Preferably, in the step (2), the usage amount of each material is respectively 30-50 parts of modified epoxy resin powder, 60-80 parts of abrasive, 3-8 parts of liquid wetting agent, 1-4 parts of microsphere foaming agent and 0.5-3 parts of auxiliary agent.
Preferably, the dicyandiamide powder has a particle size D50 of 1-15um, which may be, but is not limited to, 1um, 5um, 10um, 15um.
Preferably, the abrasive is at least one selected from green silicon carbide, black silicon carbide, alumina, silica, boron nitride, hollow silica, hollow alumina.
Preferably, the particle diameter D50 of the abrasive is 1-120um, which may be, but is not limited to, 1um, 10um, 20um, 30um, 40um, 50um, 60um, 70um, 80um, 90um, 100um, 110um, 120um.
Preferably, the liquid wetting agent is at least one of alicyclic amine, polyamide, polyether amine having a viscosity of 2000cps or less at 25 ℃.
Preferably, the microsphere shell in the microsphere foaming agent is acrylic resin, the expansion temperature is 80-140 ℃, and the use of the acrylic resin for the microsphere shell can effectively avoid the scratch on the ground object when the foaming grinding wheel is used.
Preferably, the auxiliary agent is at least one selected from epoxy diluents, dextrins, surfactants, organosilane coupling agents and pigments.
Correspondingly, the invention also provides a low-density epoxy foaming grinding wheel which is prepared by adopting the method.
Detailed Description
The following examples are intended to illustrate the present invention, but not to limit the scope of the claims.
Example 1
A preparation method of a low-density epoxy foaming grinding wheel comprises the following steps:
(1) Adding 4 parts of liquid bisphenol A epoxy resin E51 (with the viscosity of 20000 cps), 40 parts of bisphenol A epoxy resin powder and 0.8 part of dicyandiamide powder into a double-roller mixer, mixing for 2 hours at 110 ℃, cooling, grinding into powder in a wall breaking machine, and sieving with a 300-mesh screen to obtain modified epoxy resin powder;
(2) Mixing 40 parts of modified epoxy resin powder, 70 parts of silicon carbide, 4 parts of polyether amine wetting agent (viscosity is 1500 cps), 2 parts of acrylic microsphere foaming agent and 0.8 part of coupling agent on a V-type mixer for 2 hours to prepare a mixture;
(3) And (3) filling the mixture into a mold for sealing and preserving, putting the mold into an electrothermal blowing oven for heating at 70 ℃ for 1h, continuously heating to 160 ℃ for 3h, and foaming to obtain the low-density epoxy foaming grinding wheel.
Example 2
A preparation method of a low-density epoxy foaming grinding wheel comprises the following steps:
(1) Adding 3 parts of liquid bisphenol F epoxy resin NPEF-170 (with the viscosity of 15000 cps), 42 parts of bisphenol A epoxy resin powder and 0.9 part of dicyandiamide powder into a double-roller mixer, mixing for 2 hours at the temperature of 100 ℃, cooling, grinding into powder in a wall breaking machine, and sieving with a 300-mesh screen to obtain modified epoxy resin powder;
(2) 42 parts of modified epoxy resin powder, 75 parts of alumina, 4.5 parts of polyamide wetting agent (viscosity of 2000 cps), 0.8 part of acrylic microsphere foaming agent and 0.8 part of coupling agent are mixed on a V-type mixer for 2 hours to prepare a mixture;
(3) And (3) filling the mixture into a mold for sealing and preserving, putting the mold into an electrothermal blowing oven for heating at 90 ℃ for 1h, continuously heating to 150 ℃ for 3h, and foaming to obtain the low-density epoxy foaming grinding wheel.
Example 3
A preparation method of a low-density epoxy foaming grinding wheel comprises the following steps:
(1) Adding 3.5 parts of liquid bisphenol A epoxy resin E51 (with the viscosity of 20000 cps), 35 parts of bisphenol A epoxy resin powder and 0.7 part of dicyandiamide powder into a double-roller mixer, mixing for 2 hours at 120 ℃, cooling, grinding into powder in a wall breaking machine, and sieving with a 300-mesh screen to obtain modified epoxy resin powder;
(2) 36 parts of modified epoxy resin powder, 67 parts of silicon carbide, 4 parts of alicyclic amine wetting agent (viscosity is 1000 cps), 2 parts of acrylic microsphere foaming agent and 0.8 part of coupling agent are mixed on a V-type mixer for 2 hours to prepare a mixture;
(3) And (3) filling the mixture into a mold for sealing and preserving, putting the mold into an electrothermal blowing oven for heating at 110 ℃ for 1h, continuously heating to 160 ℃ for 3h, and foaming to obtain the low-density epoxy foaming grinding wheel.
Comparative example 1
A preparation method of a low-density epoxy foaming grinding wheel comprises the following steps:
(1) Adding 4 parts of liquid bisphenol A epoxy resin E51 (with the viscosity of 20000 cps), 40 parts of bisphenol A epoxy resin powder and 0.8 part of dicyandiamide powder into a double-roller mixer, mixing for 2 hours at 110 ℃, cooling, grinding into powder in a wall breaking machine, and sieving with a 300-mesh screen to obtain modified epoxy resin powder;
(2) Mixing 40 parts of modified epoxy resin powder, 70 parts of silicon carbide, 2 parts of acrylic microsphere foaming agent and 0.8 part of coupling agent on a V-type mixer for 2 hours to prepare a mixture;
(3) And (3) filling the mixture into a mold for sealing and preserving, putting the mold into an electrothermal blowing oven for heating at 70 ℃ for 1h, continuously heating to 160 ℃ for 3h, and foaming to obtain the low-density epoxy foaming grinding wheel.
Comparative example 2
A preparation method of a low-density epoxy foaming grinding wheel comprises the following steps:
(1) 4 parts of liquid bisphenol A epoxy resin E51 (viscosity 20000 cps), 40 parts of bisphenol A epoxy resin powder, 0.8 part of dicyandiamide powder, 70 parts of silicon carbide, 4 parts of polyether amine wetting agent (viscosity 1500 cps), 2 parts of acrylic microsphere foaming agent and 0.8 part of coupling agent are mixed on a V-type mixer for 2 hours to prepare a mixture;
(2) And (3) filling the mixture into a mold for sealing and preserving, putting the mold into an electrothermal blowing oven for heating at 70 ℃ for 1h, continuously heating to 160 ℃ for 3h, and foaming to obtain the low-density epoxy foaming grinding wheel.
Comparative example 3
A preparation method of a low-density epoxy foaming grinding wheel comprises the following steps:
(1) Adding 45 parts of bisphenol A epoxy resin powder and 0.8 part of dicyandiamide powder into a double-roller mixer, mixing for 2 hours at 110 ℃, cooling, grinding into powder in a wall breaking machine, and sieving with a 300-mesh screen to obtain modified epoxy resin powder;
(2) 45 parts of modified epoxy resin powder, 70 parts of silicon carbide, 4 parts of polyether amine wetting agent (viscosity is 1500 cps), 2 parts of acrylic microsphere foaming agent and 0.8 part of coupling agent are mixed on a V-type mixer for 2 hours to prepare a mixture;
(3) And (3) filling the mixture into a mold for sealing and preserving, putting the mold into an electrothermal blowing oven for heating at 70 ℃ for 1h, continuously heating to 160 ℃ for 3h, and foaming to obtain the low-density epoxy foaming grinding wheel.
The low-density epoxy foaming grinding wheels obtained in examples 1 to 3 and comparative examples 1 to 3 were subjected to the following performance tests, and the test results are shown in Table 1.
The pore size is obtained by adopting a metallographic microscope;
the roughness is measured by a Sanfeng roughness tester;
the density and porosity are calculated from the volume of the finished product.
Table 1 test results
| Test group | Pore size/um | roughness/Ra/um | Porosity/% | Density/g/cm 3 |
| Example 1 | 40-60 | 0.15 | 58 | 0.8 |
| Example 2 | 45-60 | 0.15 | 55 | 0.85 |
| Example 3 | 50-65 | 0.16 | 57 | 0.82 |
| Comparative example 1 | 100-300 | 0.45 | 75 | 0.5 |
| Comparative example 2 | 50-500 | 0.6 | 70 | 0.55 |
| Comparative example 3 | 150-300 | 0.5 | 77 | 0.48 |
From the test results of examples 1 to 3 and comparative examples 1 to 3, the cells of the epoxy foaming type grinding wheel prepared by the preparation method of the low-density epoxy foaming type grinding wheel are well controlled and are relatively uniform, the grinding effect is good, and the roughness is low.
In the technical schemes in examples 1-3, the product obtained by pre-curing and then post-curing foaming is well controlled and uniform in the cells in the system, and has better grinding effect and lower roughness.
In comparative examples 1 and 3, the polyether amine wetting agent is absent in comparative example 1, and liquid epoxy resin bisphenol A is not added in comparative example 3, and the two are critical materials for early pre-curing in the system, if the two materials are absent, a certain network structure cannot be formed in the early stage in the system, the overall structure has poor viscoelasticity, the microsphere foaming agent begins to expand after the molecular chain is expanded, so that pores cannot be well controlled, the direct curing heat release is large after reheating, the pores are promoted to be in an increasing trend, and a plurality of relatively large pores are formed.
In comparative example 2, there was no heat-melting treatment, and no pretreatment of the epoxy resin powder and dicyandiamide powder, and as a result, ultra-large pores were generated because the epoxy resin powder and dicyandiamide powder were not well dispersed, resulting in local enrichment, severe reaction temperature was too high, and the microsphere foaming agent was expanded beyond the limit to crack and generate large pores.
The present invention is not limited to the above-mentioned embodiments, but is not limited to the above-mentioned embodiments, and any person skilled in the art can make some changes or modifications to the equivalent embodiments without departing from the scope of the technical solution of the present invention, but any simple modification, equivalent changes and modifications to the above-mentioned embodiments according to the technical substance of the present invention are still within the scope of the technical solution of the present invention.
Claims (8)
1. The preparation method of the low-density epoxy foaming grinding wheel is characterized by comprising the following steps of:
(1) Preparation of modified epoxy resin powder: uniformly mixing liquid epoxy resin, epoxy resin powder and dicyandiamide powder at the temperature of 100-120 ℃, cooling and crushing the mixture into powder to obtain modified epoxy resin powder, wherein the epoxy resin powder is at least one selected from bisphenol A epoxy resin and phenol novolac epoxy resin;
(2) Uniformly mixing modified epoxy resin powder, an abrasive, a liquid wetting agent, a microsphere foaming agent and an auxiliary agent to prepare a mixture, wherein the liquid wetting agent is at least one of alicyclic amine, polyamide and polyether amine with the viscosity below 2000cps at 25 ℃;
(3) And (3) filling the mixture into a mold for sealing and preserving, then putting the mold into an oven at 70-110 ℃ for heating for a certain time, and then continuously heating to 150-170 ℃ for heating for a certain time, and foaming to obtain the low-density epoxy foaming grinding wheel.
2. The method of manufacturing a low density epoxy foaming grinding wheel as claimed in claim 1, wherein the liquid epoxy resin is selected from at least one of bisphenol a epoxy resin and bisphenol F epoxy resin having a viscosity of 25000cps or less at 25 ℃.
3. The method of manufacturing a low-density epoxy foaming grinding wheel as claimed in claim 1, wherein in the step (1), the amount of each material is 3-5 parts of liquid epoxy resin, 40-45 parts of epoxy resin powder and 1-3 parts of dicyandiamide powder, respectively.
4. The method for producing a low-density epoxy foaming grinding wheel according to claim 1, wherein in the step (2), the amount of each material is 30 to 50 parts of modified epoxy resin powder, 60 to 80 parts of abrasive, 3 to 8 parts of liquid wetting agent, 1 to 4 parts of microsphere foaming agent and 0.5 to 3 parts of auxiliary agent, respectively.
5. The method for producing a low-density epoxy foaming grinding wheel according to claim 1, wherein the abrasive is at least one selected from the group consisting of green silicon carbide, black silicon carbide, alumina, silica, boron nitride, hollow silica, and hollow alumina.
6. The method for preparing a low-density epoxy foaming grinding wheel according to claim 1, wherein the microsphere foaming agent is characterized in that the microsphere shell is acrylic resin, and the expansion temperature is 80-140 ℃.
7. The method for producing a low-density epoxy foaming grinding wheel according to claim 1, wherein the auxiliary agent is at least one selected from the group consisting of epoxy diluents, dextrins, surfactants, organosilane coupling agents and pigments.
8. A low-density epoxy foam grinding wheel, characterized in that it is manufactured by the manufacturing method of the low-density epoxy foam grinding wheel according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111230420.5A CN113736132B (en) | 2021-10-21 | 2021-10-21 | Low-density epoxy foaming grinding wheel and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111230420.5A CN113736132B (en) | 2021-10-21 | 2021-10-21 | Low-density epoxy foaming grinding wheel and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113736132A CN113736132A (en) | 2021-12-03 |
| CN113736132B true CN113736132B (en) | 2023-06-06 |
Family
ID=78727034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111230420.5A Active CN113736132B (en) | 2021-10-21 | 2021-10-21 | Low-density epoxy foaming grinding wheel and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113736132B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5089032A (en) * | 1990-07-05 | 1992-02-18 | Moran Joseph F | Grinding wheel |
| JPH09300221A (en) * | 1996-05-21 | 1997-11-25 | Hitachi Chem Co Ltd | Manufacture of resinoid grinding wheel |
| CN108264729B (en) * | 2016-12-30 | 2020-02-07 | 比亚迪股份有限公司 | Epoxy resin composition, epoxy resin mixture, preparation method of epoxy resin mixture, epoxy resin prepreg and composite material |
| CN110877302B (en) * | 2019-12-04 | 2021-09-14 | 东莞市鼎泰鑫电子有限公司 | Scouring pad reinforced organic ceramic grinding tool and preparation method thereof |
| CN110877303B (en) * | 2019-12-04 | 2021-10-22 | 东莞市鼎泰鑫电子有限公司 | Organic ceramic grinding brush and preparation method thereof |
| CN112708244B (en) * | 2020-12-21 | 2022-12-20 | 东莞市鼎泰鑫电子有限公司 | Epoxy microsphere foaming rubstone and preparation method thereof |
-
2021
- 2021-10-21 CN CN202111230420.5A patent/CN113736132B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113736132A (en) | 2021-12-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102378772B (en) | Epoxy resin based core filler material developing low exothermic heat | |
| CN103030921B (en) | Clutch facing without rubber winding and preparation method thereof | |
| CN110003426B (en) | Polyurethane sponge composite polishing disk | |
| CN113736132B (en) | Low-density epoxy foaming grinding wheel and preparation method thereof | |
| CN110078890B (en) | Polyurethane rigid foam and preparation method thereof | |
| CN111647266A (en) | Polyurethane foam material and preparation method thereof | |
| CN110317510B (en) | Intumescent fire-retardant coating and preparation method thereof | |
| CN112708244B (en) | Epoxy microsphere foaming rubstone and preparation method thereof | |
| CN112662357B (en) | Epoxy foaming structure adhesive film resisting 177 ℃ hot oxygen for 3000 hours and preparation method thereof | |
| CN113773726B (en) | Two-component curing composition for metal surface treatment, method for mounting a membrane on a metal surface, and surface structure | |
| CN115122559A (en) | Low-density three-dimensional carbon fiber composite product and production method thereof | |
| CN113774672A (en) | Novel physical foaming agent and application thereof | |
| CN117464580A (en) | Elastic coated abrasive tool and preparation method thereof | |
| CN106965100A (en) | A kind of wet type polishing pad and preparation method thereof | |
| CN107868400A (en) | Intermediate temperature setting prepreg resin matrix and preparation method thereof | |
| CN116003963B (en) | Environment-friendly grinding brush roller and preparation method thereof | |
| CN106513567A (en) | Novel environment-friendly casting coating and preparation method and using method thereof | |
| WO1997043091A1 (en) | Abrasive foam grinding composition | |
| CN111100537A (en) | Application of polyether ketone resin in bicycle brake cable or speed changing cable | |
| CN117185706B (en) | Phase-change microcapsule energy-storage heat-preservation centrifugal glass wool board and preparation method thereof | |
| CN111100320A (en) | Whisker reinforced resin composite hollow sphere and preparation method thereof | |
| CN116079581B (en) | Laminated foaming non-woven fabric grinding wheel and preparation method thereof | |
| CN109397117A (en) | A kind of fire resistant resin grinding wheel | |
| CN107673777A (en) | A kind of environmental protection and energy saving material and preparation method thereof | |
| KR102188525B1 (en) | Polishing pad, preparation method thereof, and preparation method of semiconductor device using same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |