CN113720679A - Method for testing mechanical constitutive equation of micron-sized electronic solder - Google Patents
Method for testing mechanical constitutive equation of micron-sized electronic solder Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000012360 testing method Methods 0.000 title claims abstract description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 70
- 238000003466 welding Methods 0.000 claims abstract description 63
- 238000006073 displacement reaction Methods 0.000 claims abstract description 59
- 238000002474 experimental method Methods 0.000 claims abstract description 10
- 238000005219 brazing Methods 0.000 claims description 54
- 239000000945 filler Substances 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 54
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 238000011068 loading method Methods 0.000 claims description 8
- 238000012805 post-processing Methods 0.000 abstract description 3
- 238000009864 tensile test Methods 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000004088 simulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013178 mathematical model Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/067—Parameter measured for estimating the property
- G01N2203/0676—Force, weight, load, energy, speed or acceleration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/067—Parameter measured for estimating the property
- G01N2203/0682—Spatial dimension, e.g. length, area, angle
Abstract
The invention discloses a method for testing a mechanical constitutive equation of micron-sized electronic solder, which is characterized in that a mechanical tensile experiment is used for obtaining a load-displacement relation curve of a nickel wire and a micro-welding point sample, and then the real stress-strain relation of micron-sized solder in a micro-welding point can be obtained by combining simple data post-processing.
Description
Technical Field
The invention relates to the technical field of mechanical testing of welding spots, in particular to a method for testing a mechanical constitutive equation of micron-sized electronic solder.
Background
In the field of microelectronics, the failure of electronic components is mostly caused by the failure of welding spots, and researchers at home and abroad generally adopt experimental and simulation methods to research the mechanical behavior of the welding spots so as to provide technical guidance for improving the reliability of the welding spots. Compared with an experimental research method, the simulation method can obtain the size and distribution condition of mechanical parameters such as stress, strain and fracture in the material, so that the failure mechanism of the welding spot can be deeply analyzed. With the development of high-density packaging in recent years, the size of solder joints has already reached the micrometer size (760 micrometers to 10 micrometers). The brazing filler metal (solder) is the main component of the welding spot, and when the mechanical finite element simulation is carried out on the brazing filler metal part in the welding spot structure, the constitutive equation of the brazing filler metal must be input. The constitutive equation is a mathematical model reflecting macroscopic properties of a substance, and is a functional expression between stress and strain.
In order to obtain the stress-strain relationship of the micro-solder point material, researchers typically measure the stress-strain relationship of the solder using conventional tensile testing in a universal testing machine. However, conventional tensile testing has used large size bulk as-cast solders (typically on the order of centimeters). Research shows that after the size of the brazing filler metal reaches the micron level, the crystal state, the tissue structure and the mechanical property of the brazing filler metal are changed violently compared with those of a large brazing filler metal sample, namely, an obvious size effect exists, and the relation between stress and strain of the micron-sized material cannot be reflected on the basis of the mechanical property measured by the large brazing filler metal sample.
Therefore, it is difficult to obtain the stress-strain relationship of the solder in the micro solder joints by the conventional tensile test method. Researchers at home and abroad develop a method for acquiring the mechanical constitutive equation of the brazing filler metal by combining a nanoindentation technology and finite element inversion analysis. However, this method is extremely cumbersome, requires precise and expensive equipment (nanoindenter), has high test costs and theoretical thresholds, and is not easy to operate. This makes it difficult for researchers to perform mechanical simulations of the micro-solder structures.
Disclosure of Invention
The invention aims to provide a method for testing a mechanical constitutive equation of a micron-sized electronic solder, and aims to solve the technical problem that the prior art is difficult and complicated to obtain the relationship between stress and strain of a solder in a micro-welding point.
In order to achieve the purpose, the invention adopts a method for testing the mechanical constitutive equation of micron-sized electronic solder, which comprises the following steps:
s1: carrying out a tensile experiment on the nickel wire and the micro-welding point sample to obtain a relation curve between the load and the displacement of the nickel wire and the micro-welding point sample;
s2: according to the obtained relation curve of the load and the displacement of the nickel wire and the micro-welding point sample, at the same load, subtracting the displacement value of the nickel wire with the corresponding length from the displacement value of the micro-welding point to obtain the relation curve of the load and the displacement of the brazing filler metal in the micro-welding point sample;
s3: converting a load-displacement relation curve of the brazing filler metal into an engineering stress-strain relation curve, and then converting the engineering stress-strain relation curve into a real stress-strain relation curve;
s4: linearly fitting the relation curve of the true stress and the strain of the brazing filler metal in the elastic stage, and fitting the relation curve of the stress and the strain of the brazing filler metal in the plastic stage by adopting a power function;
s5: and solving an expression of the relation between the stress and the strain of the brazing filler metal according to the fitting result of the relation between the stress and the strain of the brazing filler metal in the elastic stage and the plastic stage.
The method comprises the following steps of performing a tensile experiment on a nickel wire and a micro-welding point sample to obtain a relation curve between the load and the displacement of the nickel wire and the micro-welding point sample:
clamping a nickel wire on a dynamic mechanical stretching instrument, performing a uniaxial stretching experiment on the nickel wire in a displacement loading mode, and performing linear fitting on load and displacement data in an elastic stage to obtain a load and displacement relation curve in the elastic stage of the nickel wire;
and clamping the micro-welding point sample on a dynamic mechanical stretching instrument, carrying out uniaxial stretching on the micro-welding point sample by adopting a displacement loading mode until the micro-welding point sample is broken, and selecting a relation curve before the micro-welding point reaches the maximum tension to obtain a load-displacement relation curve of the micro-welding point sample.
The method comprises the following steps of converting a relation curve of load and displacement of the brazing filler metal into a relation curve of engineering stress and strain:
using sigmanom＝F/A0Calculating the engineering stress sigma at each data point of the brazing filler metalnomWhere F is the current tensile load, A0Is the initial cross-sectional area of the brazing filler metal;
using epsilonnom＝ΔL/L0Calculating the engineering strain epsilon of each data point of the brazing filler metalnomWherein, DeltaL is the current displacement of the brazing filler metal, L0Is the initial length of the solder.
The method comprises the following steps of converting an engineering stress-strain relation curve into a real stress-strain relation curve:
using sigma-sigmanom(1+εnom) Will sigmanomConverting into a true stress sigma;
using e ═ ln (1+ e)nom) Will epsilonnomTo a true strain epsilon.
Fitting the relation curve of stress and strain of the solder in the plastic stage by adopting a power function to obtain an expression of the relation of stress and strain in the plastic stage:
using a power function y ═ axnAnd fitting a stress-strain relation curve of the solder in the plasticity stage.
The invention has the beneficial effects that: the method has the advantages that the real stress and strain relation of the micron-sized brazing filler metal in the micro welding spot can be obtained by combining a mechanical tensile test with simple data post-processing, the experimental process is simple, the data processing is easy, and compared with the prior art, the cost of the constitutive relation test is greatly reduced by the mechanical tensile test method provided by the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of the steps of the method for testing mechanical constitutive equations of micron-sized electronic solder in accordance with the present invention.
Fig. 2 is a schematic view of a nickel wire of the present invention.
FIG. 3 is a graph of load versus displacement for a nickel wire of the present invention.
FIG. 4 is a schematic view of a Ni/SnBi/Ni microbump in accordance with the present invention.
FIG. 5 is a graph showing the relationship between the load and the displacement of the Ni/SnBi/Ni micro-welding spot according to the present invention.
Fig. 6 is a graph of load versus displacement for the SnBi solder of the present invention.
Fig. 7 is a graph of the relation between the true stress and the strain of the SnBi solder of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
The invention discloses a method for testing a mechanical constitutive equation of micron-sized electronic solder, which comprises the following steps of:
s1: carrying out a tensile experiment on the nickel wire and the micro-welding point sample to obtain a relation curve between the load and the displacement of the nickel wire and the micro-welding point sample;
s2: according to the obtained relation curve of the load and the displacement of the nickel wire and the micro-welding point sample, at the same load, subtracting the displacement value of the nickel wire with the corresponding length from the displacement value of the micro-welding point to obtain the relation curve of the load and the displacement of the brazing filler metal in the micro-welding point sample;
s3: converting a load-displacement relation curve of the brazing filler metal into an engineering stress-strain relation curve, and then converting the engineering stress-strain relation curve into a real stress-strain relation curve;
s4: linearly fitting the relation curve of the true stress and the strain of the brazing filler metal in the elastic stage, and fitting the relation curve of the stress and the strain of the brazing filler metal in the plastic stage by adopting a power function;
s5: and solving an expression of the relation between the stress and the strain of the brazing filler metal according to the fitting result of the relation between the stress and the strain of the brazing filler metal in the elastic stage and the plastic stage.
Specifically, the step of performing a tensile test on the nickel wire and the micro-welding point sample to obtain a relationship curve between the load and the displacement of the nickel wire and the micro-welding point sample comprises the following steps:
clamping a nickel wire on a dynamic mechanical stretching instrument, performing a uniaxial stretching experiment on the nickel wire in a displacement loading mode, and performing linear fitting on load and displacement data in an elastic stage to obtain a load and displacement relation curve in the elastic stage of the nickel wire;
and clamping the micro-welding point sample on a dynamic mechanical stretching instrument, carrying out uniaxial stretching on the micro-welding point sample by adopting a displacement loading mode until the micro-welding point sample is broken, and selecting a relation curve before the micro-welding point reaches the maximum tension to obtain a load-displacement relation curve of the micro-welding point sample.
Specifically, in the step of converting the relation curve of the load and the displacement of the brazing filler metal into the relation curve of the engineering stress and the strain:
using sigmanom＝F/A0Calculating the engineering stress sigma at each data point of the brazing filler metalnomWhere F is the current tensile load, A0Is the initial cross-sectional area of the brazing filler metal;
using epsilonnom＝ΔL/L0Calculating the engineering strain epsilon of each data point of the brazing filler metalnomWherein, DeltaL is the current displacement of the brazing filler metal, L0Is the initial length of the solder.
Specifically, the step of converting the engineering stress-strain relationship curve into the real stress-strain relationship curve comprises the following steps:
using sigma-sigmanom(1+εnom) Will sigmanomConverting into a true stress sigma;
using e ═ ln (1+ e)nom) Will epsilonnomTo a true strain epsilon.
Specifically, a power function is adopted to fit a stress-strain relation curve of the brazing filler metal in a plastic stage, and an expression of the stress-strain relation in the plastic stage is obtained, wherein the expression comprises the following steps:
using a power function y ═ axnAnd fitting a stress-strain relation curve of the solder in the plasticity stage.
The specific embodiment is as follows:
this example is the constitutive equation for testing micron size SnBi solder in a micro solder joint sample.
The nickel wire is a commercial pure nickel wire with the length of 10cm and the diameter of 500 mu m. As the commercial nickel wires purchased are not linear, in order to meet the experimental requirements, the nickel wires need to be straightened firstly. However, residual stress is generated during the drawing process, so that the drawn nickel wire needs to be annealed at 660 ℃ for 10 minutes. And then, shearing the annealed linear nickel wire into small sections of 2cm for a tensile experiment of the nickel wire and preparing a micro-welding point sample. Then, the nickel wire welding end face was polished in a special jig with 400#, 800#, 1500#, 2000#, 3000# and 5000# series sandpaper and Al2O3And polishing by using the particle polishing solution. On a special fixture, two nickel wires are welded by SnBi brazing filler metal in a reflow soldering mode, the welding height is controlled to be 500 mu m, and a linear welding spot with a Ni/SnBi/Ni sandwich structure is formed after the welding is finished.
The prepared 2cm annealed nickel wire was clamped on a dynamic mechanical tensile machine (DMA) at a clamping distance of 8mm (as shown in FIG. 2). Next, a uniaxial tensile test was performed on the nickel wire by a displacement loading method of 0.006mm/min to obtain a load-displacement curve of the 8mm nickel wire, and a linear fitting was performed on the load-displacement curve in the elastic stage (the result is shown in fig. 3).
The microwelded samples were clamped to the DMA at a distance of 8.5mm (as shown in fig. 4). And (3) carrying out uniaxial tension on the micro-welding point sample by adopting a displacement loading mode of 0.006mm/min till the micro-welding point sample is broken to obtain a load and displacement curve of the micro-welding point sample of 8.5mm, and taking the curve before the micro-welding point sample reaches the maximum tension (as shown in figure 5).
From the results of fig. 3 and 5, it can be seen that the maximum load applied to the micro-welded joint specimen during the snap-off process is smaller than the load at which the nickel wire yields, which indicates that the nickel wires at both ends of the micro-welded joint specimen are still in the elastic deformation stage during the stretching process of the micro-welded joint specimen of this example. Moreover, the experimental result shows that the fracture positions of the Ni/SnBi/Ni micro-welding point sample in the example are all positioned on the brazing filler metal, the yield strength of the pure nickel wire in the example is 164MPa, and the tensile strength of the SnBi is 48MPa, which indicates that the nickel wires at the two ends are still in the elastic deformation stage when the Ni/SnBi/Ni micro-welding point sample is fractured.
According to the load and displacement curve of the nickel wire in fig. 3, the displacement value of the nickel wire at any load position in the elastic stage can be obtained. Then, with reference to fig. 3 and 5, at the same load, subtracting the displacement value of the nickel wire with the corresponding length from the displacement value of the micro-welding point sample to obtain the displacement value of the SnBi solder in the micro-welding point sample at the load. All the data points in the figure 5 are processed according to the method to obtain the load and displacement curve of the SnBi brazing filler metal in the micro-welding point sample (as shown in figure 6)
According to the curve of FIG. 6, the formula σ is usednom＝F/A0The engineering stress sigma of the SnBi brazing filler metal at each data point can be calculatednomWhere F is the current tensile load, A0The initial cross-sectional area of the braze. By the formula epsilonnom＝ΔL/L0The engineering strain epsilon of the brazing filler metal at each data point can be calculatednomWhere Δ L is the current displacement of the brazing filler metal, L0Is the initial length of the solder. Since the cross-sectional area of the brazing filler metal can be greatly changed after the brazing filler metal is subjected to plastic deformation, the passing formula sigmanom＝F/A0And formula εnom＝ΔL/L0Errors exist in the relation between the engineering stress and the strain and the relation between the real stress and the strain (sigma-epsilon) of the obtained brazing filler metal. The present example uses the formula σ ═ σ, respectivelynom(1+εnom) And formula ═ ln (1+ ε)nom) And converting the obtained relation between the engineering stress and the strain into a real relation between the engineering stress and the strain to obtain a real stress and strain relation curve (as shown in fig. 7).
According to the relation curve of the SnBi true stress and the strain, the stress applied when the residual strain is 0.2 percent is taken as the yield strength (shown in figure 7). Then, linear fitting is carried out on the relation curve of the real stress and the strain in the elastic stage to obtain the elastic modulus of the brazing filler metal, and meanwhile, a power function y is taken as axnAnd fitting the relation curve of the stress and the strain in the plastic stage, and solving fitting parameters a and n to obtain an expression of the relation of the stress and the strain in the plastic stage. And the relational expression of the stress and the strain of the SnBi brazing filler metal in the micro-welding point sample can be obtained by combining the fitting results of the stress and strain relational curves in the elastic stage and the plastic stage.
Wherein, the nickel wire with the diameter of micron order is hardened and straightened, which is convenient for welding two sections of nickel wires. And annealing the straightened nickel wire to eliminate residual stress caused by straightening the nickel wire, so that the load of the obtained nickel wire is consistent with the data of the displacement curve. The method has the advantages that the real stress and strain relation of the micron-sized brazing filler metal in the micro welding spot can be obtained by combining a mechanical tensile test with simple data post-processing, the experimental process is simple, the data processing is easy, and compared with the prior art, the cost of the constitutive relation test is greatly reduced by the mechanical tensile test method provided by the invention.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (5)
1. A method for testing a mechanical constitutive equation of micron-sized electronic solder is characterized by comprising the following steps:
s1: carrying out a tensile experiment on the nickel wire and the micro-welding point sample to obtain a relation curve between the load and the displacement of the nickel wire and the micro-welding point sample;
s2: according to the obtained relation curve of the load and the displacement of the nickel wire and the micro-welding point sample, at the same load, subtracting the displacement value of the nickel wire with the corresponding length from the displacement value of the micro-welding point to obtain the relation curve of the load and the displacement of the brazing filler metal in the micro-welding point sample;
s3: converting a load-displacement relation curve of the brazing filler metal into an engineering stress-strain relation curve, and then converting the engineering stress-strain relation curve into a real stress-strain relation curve;
s4: linearly fitting the relation curve of the true stress and the strain of the brazing filler metal in the elastic stage, and fitting the relation curve of the stress and the strain of the brazing filler metal in the plastic stage by adopting a power function;
s5: and solving an expression of the relation between the stress and the strain of the brazing filler metal according to the fitting result of the relation between the stress and the strain of the brazing filler metal in the elastic stage and the plastic stage.
2. The method for testing mechanical constitutive equation of micron-sized electronic solder as claimed in claim 1, wherein the step of performing tensile experiment on the nickel wire and the micro-solder joint sample to obtain the relationship curve between the load and the displacement of the nickel wire and the micro-solder joint sample comprises:
clamping a nickel wire on a dynamic mechanical stretching instrument, performing a uniaxial stretching experiment on the nickel wire in a displacement loading mode, and performing linear fitting on load and displacement data in an elastic stage to obtain a load and displacement relation curve in the elastic stage of the nickel wire;
and clamping the micro-welding point sample on a dynamic mechanical stretching instrument, carrying out uniaxial stretching on the micro-welding point sample by adopting a displacement loading mode until the micro-welding point sample is broken, and selecting a relation curve before the micro-welding point reaches the maximum tension to obtain a load-displacement relation curve of the micro-welding point sample.
3. The method for testing mechanical constitutive equation of micron-sized electronic solder according to claim 2, wherein in the step of converting the relation curve of load and displacement of the solder into the relation curve of engineering stress and strain:
using sigmanom＝F/A0Calculating the engineering stress sigma at each data point of the brazing filler metalnomWhere F is the current tensile load, A0Is the initial cross-sectional area of the brazing filler metal;
using epsilonnom＝ΔL/L0Calculating the engineering strain epsilon of each data point of the brazing filler metalnomWherein, DeltaL is the current displacement of the brazing filler metal, L0Is the initial length of the solder.
4. The method for testing the mechanical constitutive equation of micron-sized electronic solder according to claim 3, wherein in the step of converting the engineering stress-strain relation curve into a true stress-strain relation curve:
using sigma-sigmanom(1+εnom) Will sigmanomConverting into a true stress sigma;
using e ═ ln (1+ e)nom) Will epsilonnomTo a true strain epsilon.
5. The method for testing the mechanical constitutive equation of micron-sized electronic solder according to claim 4, wherein the step of fitting the relation curve of stress and strain of the solder in the plastic stage by adopting a power function to obtain the expression of the relation of stress and strain in the plastic stage is as follows:
using a power function y ═ axnAnd fitting a stress-strain relation curve of the solder in the plasticity stage.
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