CN113714585B - Welding process of intelligent module antenna - Google Patents
Welding process of intelligent module antenna Download PDFInfo
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- CN113714585B CN113714585B CN202111047205.1A CN202111047205A CN113714585B CN 113714585 B CN113714585 B CN 113714585B CN 202111047205 A CN202111047205 A CN 202111047205A CN 113714585 B CN113714585 B CN 113714585B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0475—Heating appliances electric using induction effects, e.g. Kelvin or skin effects
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Dermatology (AREA)
- General Health & Medical Sciences (AREA)
- Molten Solder (AREA)
Abstract
The invention relates to a wave-soldering technology, which is used for solving the problem that the soldering effect is affected due to uneven temperature distribution of soldering tin liquid in the soldering process of a circuit board, in particular to a soldering process of an intelligent module antenna, comprising a transmission mechanism, a circuit board, a spraying mechanism, a preheating mechanism and a soldering mechanism, wherein the transmission mechanism is arranged on two sides of the outer side wall of the circuit board, the spraying mechanism is arranged on one side of the lower surface of the transmission mechanism, and the preheating mechanism is arranged on one side, close to the spraying mechanism, of the lower surface of the transmission mechanism; according to the invention, the consumption of electric power resources is saved in an electromagnetic induction heating mode, the soldering tin liquid consumed in the main soldering tin melting box is added through the auxiliary soldering tin melting box, the temperature difference of the soldering tin liquid in the two soldering tin melting boxes is small, the large change of the temperature of the soldering tin liquid for wave soldering cannot be caused, and the impurities generated by internal soldering of the soldering tin liquid through the filter screen in the circulating process are filtered out, so that the temperature in the soldering tin melting boxes is kept stable.
Description
Technical Field
The invention relates to a wave soldering technology, in particular to a welding process of an intelligent module antenna.
Background
When the intelligent module antenna is installed and welded in a conventional mode, the intelligent module antenna is manually placed at the corresponding position on the circuit board and the pin positions are welded, so that the effect of welding the intelligent module antenna on the circuit board is achieved, the method is high in labor cost, welding is carried out in a wave soldering mode, the intelligent module antenna and the circuit board are connected and then placed on a transmission mechanism of a welding machine, welding is automatically carried out, labor cost is reduced, and production efficiency is improved;
wave soldering has the following technical problems:
1. in the wave soldering process, the soldering tin liquid in the tin melting box is added into the tin melting box after being consumed, the added soldering tin bar is melted and then is supplemented, the soldering tin bar is required to wait in the melting process, the soldering operation cannot be continued, and the soldering tin bar is melted to cause uneven distribution of the temperature in the tin melting box, so that the soldering effect of the soldering tin liquid is influenced;
2. in the wave soldering process, the copper coated on the surface of the printed circuit board and the copper on the pins of the electronic components and the metal tin in the high-temperature soldering tin liquid form Cu6Sn5Intermetallic compound, this intermetallic compound density is less than the density size of soldering tin liquid, floats on the surface of soldering tin liquid more, and inside some intermetallic compound were driven into the soldering tin liquid because of the effect of crest, got into the inside Cu of soldering tin liquid6Sn5The intermetallic compound is easy to be impacted and suspended on the surface of the soldering tin liquid under the action of the electric pump to influence the contact of the soldering tin liquid and a circuit board, the quantity of the mixed intermetallic compound in the soldering tin liquid is increased in the long-time welding process, and the mixed intermetallic compound is attached to the inner wall of the tin melting box to influence the heat conduction, so that the temperature of the soldering tin liquid in a molten state in the tin melting box is difficult to stably maintain at a set temperature;
3. taking out the filtered Cu from the solder liquid6Sn5The soldering tin liquid attached to the surface of the intermetallic compound is solidified, so that the available soldering tin liquid in the main tin melting box is reduced.
In view of the above technical problem, the present application proposes a solution.
Disclosure of Invention
The invention aims to add consumed soldering tin liquid into a main soldering tin melting box through an auxiliary soldering tin melting box, the temperature difference of the soldering tin liquid in the two soldering tin melting boxes is small, the temperature of the soldering tin liquid for wave soldering cannot be greatly changed, and the soldering tin liquid is filtered out of impurities generated by internal soldering through a filter screen in the circulation process, so that the temperature in the soldering tin melting boxes is kept stable, the problem that the soldering effect is influenced due to uneven temperature distribution of the soldering tin liquid in the circuit board soldering process is solved, and the soldering process of the intelligent module antenna is provided.
The purpose of the invention can be realized by the following technical scheme:
a welding process of an intelligent module antenna comprises the following steps:
the method comprises the following steps: the circuit board is placed on the inner side of the transmission mechanism and supported by the transmission mechanism, and moves along with the transmission of the transmission mechanism, when the circuit board moves to the position of the spraying mechanism, the spraying equipment in the spraying mechanism sprays soldering flux on the lower surface of the circuit board, when the circuit board moves to the position of the preheating mechanism, the circuit board is preheated by heat generated by the heating equipment in the preheating mechanism, and then the circuit board is transmitted to the position of the welding mechanism through the movement of the transmission mechanism;
step two: after the wave soldering equipment is started, the electromagnetic induction coils on the outer sides of the main tin melting box and the auxiliary tin melting box are connected with a power supply to work so as to heat the main tin melting box and the auxiliary tin melting box, so that tin bars placed in the main tin melting box and the auxiliary tin melting box are heated and melted, and are kept in a molten state under the action of the electromagnetic induction coils and the heat insulation cotton, and the molten tin liquid drives the stirring blades through the driving motor so as to stir and fully mix the tin liquid in the main tin melting box;
step three: the bottom plate is connected with the bottom of the main tin melting box through a lifting telescopic rod, after the lifting telescopic rod contracts in length, a lifting plate connected with the bottom plate through a support rod is lifted at the position inside the main tin melting box, molten tin liquid in the main tin melting box flows upwards under the pushing of the lifting plate and flows to one position, which is not blocked by one side, when the molten tin liquid flows to the position at the upper end of the shielding plate, the molten tin liquid forms a tin liquid wave crest under the action of a plurality of uniformly distributed electric pump nozzles on the upper surface of the shielding plate, and a circuit board is subjected to wave crest welding operation when passing through the position of the tin liquid wave crest under the support of a transmission mechanism;
step four: in the wave soldering process, the copper structure on the lower surface of the circuit board and the molten metal tin generate Cu6Sn5Intermetallic compound, Cu6Sn5With melting of intermetallic compoundsThe flowing of state soldering tin liquid flows, flows out of the main tin melting box from the position of the return pipe on the rear surface of the main tin melting box, is stored in the temporary storage box after impurity filtering is carried out on the filter screen in the return pipe, and flows back to the interior of the main tin melting box through the opening of the second gate after the lifting plate which ascends is restored to the original position, and Cu filtered by the filter screen in the return pipe6Sn5The intermetallic compound can slide from the position of the rotary door to the position of the impurity material pipe along the inclined surface of the filter screen;
step five: the revolving door is under the control of adjusting the telescopic link through wave soldering equipment, makes the telescopic link shrink of adjusting drive revolving door rotate under the effect of axis of rotation and opens, makes the Cu that strains down6Sn5The intermetallic compound slides to the position of the filter screen plate in the recovery pipeline along the impurity pipe, and the heated inert gas introduced from the position of the vent pipe is blown to Cu6Sn5Intermetallic compound surface of Cu6Sn5The soldering tin liquid on the surface of the intermetallic compound is melted into liquid and drops, so that the concentrated recycling is convenient.
As a preferred embodiment of the invention, two sides of the outer side wall of the circuit board are provided with transmission mechanisms, one side of the lower surface of each transmission mechanism is provided with a spraying mechanism, one side of the lower surface of each transmission mechanism, which is close to the spraying mechanism, is provided with a preheating mechanism, one side of the lower surface of each transmission mechanism, which is close to the preheating mechanism, is provided with a welding mechanism, and the welding mechanism is internally provided with a tin melting mechanism;
the tin melting mechanism comprises a main tin melting box, the outer side wall of the main tin melting box is connected with heat insulation cotton, and the outer side wall of the heat insulation cotton is connected with an electromagnetic induction coil;
one side of the outer side wall of the main tin melting box is connected with an auxiliary tin melting box through a transmission pipeline, and the middle position of the outer side wall of the auxiliary tin melting box is connected with a first gate;
the main tin melting box is characterized in that the lower surface of the inner part of the main tin melting box is connected with a driving motor through a first rotating shaft, the first rotating shaft is close to the upper end of the main tin melting box, the upper end of the main tin melting box is connected with a stirring blade, the outer side wall of the first rotating shaft is connected with a rotating wheel, the outer side wall of the rotating wheel is connected with a driving belt, the middle position of the lower surface of the inner part of the auxiliary tin melting box is connected with a second rotating shaft, and the outer side wall of the second rotating shaft corresponds to the position of the driving belt and is also connected with the rotating wheel.
As a preferred embodiment of the invention, the main tin melting box is internally provided with an impurity removing mechanism;
the impurity removing mechanism comprises a bottom plate, lifting telescopic rods are connected to two sides of the upper surface of the bottom plate, supporting rods are connected to four corners of the upper surface of the bottom plate, a lifting plate is connected to the upper end, close to the interior of the main molten tin box, of each supporting rod, and sliding holes are formed in the upper surface of each lifting plate corresponding to the first rotating shaft;
the main tin melting box inner side wall is close to the stirring blade top is connected with a shielding plate, the main tin melting box rear surface corresponds to the shielding plate position is connected with a return pipe, the return pipe outer side wall middle position is connected with a temporary storage box, the return pipe outer side wall is close to the temporary storage box position is connected with a revolving door through rotation of a rotating shaft, and the return pipe outer side wall is close to the temporary storage box lower side is connected with a second gate.
As a preferred embodiment of the invention, one side of the outer side wall of the return pipe is provided with a recovery mechanism;
the recovery mechanism comprises a recovery pipeline, the recovery pipeline is connected to the position, corresponding to the revolving door, of the outer side wall of the return pipe through a sundry material pipe, an adjusting telescopic rod is arranged in the sundry material pipe, two ends of the adjusting telescopic rod are respectively connected with the inner upper surface of the sundry material pipe and the outer side wall of the revolving door through rotating seats, and a filter screen plate is connected below the inner side wall of the recovery pipeline;
the upper surface of the recovery pipeline is connected with a connecting hopper, and the upper end of the connecting hopper is connected with a vent pipe.
As a preferred embodiment of the present invention, the connection structure of the outer side wall of the auxiliary tin melting tank is the same as the connection structure of the outer side wall of the main tin melting tank, and the outer sides of the outer side walls of the auxiliary tin melting tank and the main tin melting tank corresponding to the positions of the electromagnetic induction coils are both connected with the protective cover, and the protective cover is connected to the outer side wall of the main tin melting tank through the mutual embedding between the buckle and the buckle groove formed on the outer side wall of the main tin melting tank.
As a preferred embodiment of the present invention, a filter screen is connected to the inner side wall of the return pipe at a position corresponding to the revolving door, the outer side wall of the temporary storage box is also connected with heat insulation cotton and an electromagnetic induction coil, and the upper surface of the shielding plate is connected with a plurality of uniformly distributed electric pump nozzles.
In a preferred embodiment of the present invention, the filter screen plate is distributed in an inclined state inside the recovery pipe, and the upper end of the vent pipe is connected to a pipe for transporting an inert gas heating device of a wave soldering device through a pipe.
Compared with the prior art, the invention has the beneficial effects that:
1. when the consumed soldering tin liquid is replenished in the main soldering tin melting box, the soldering tin liquid in a molten state stored in the auxiliary soldering tin melting box can flow into the main soldering tin melting box along a transmission pipeline through the opening of a first gate, the first gate is closed after the soldering tin liquid is replenished, soldering tin bars do not need to be added and melted directly into the main soldering tin melting box, the temperature distribution of the soldering tin liquid in the main soldering tin melting box is uneven, the melted soldering tin bars need to wait for a period of time, and the normal operation of wave soldering operation is influenced;
2. in the process that the soldering tin liquid flows through the return pipe after wave soldering, the filter screen in the return pipe can filter Cu in the soldering tin liquid6Sn5Filtering out intermetallic compounds to ensure that the soldering tin liquid reflowing to the interior of the main tin melting box does not contain Cu6Sn5Intermetallic compound impurity makes the lifting plate promote the soldering tin liquid to move upwards once more and when soldering tin operation is carried out, can not have Cu because of the soldering tin liquid is inside6Sn5The intermetallic compound influences the circulation of the soldering tin liquid, so that the soldering operation of the circuit board is influenced;
3. the adjusting telescopic rod is used for adjusting the telescopic length under the control of the welding equipment controller, the adjusting telescopic rod with one end fixed on the upper surface of the sundry material pipe can pull the revolving door connected to the lower end of the adjusting telescopic rod, the revolving door is rotated and opened under the action of the rotating shaft, and the Cu is enabled6Sn5The intermetallic compound slides down and falls into the interior of the recovery pipeline, and is conveyed through the vent pipe to the heated inertScouring of the sexual gas to adhere to Cu6Sn5The solder liquid outside the intermetallic compound is melted and dropped for recovery.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a main body structure view of the present invention;
FIG. 2 is a structural view of a tin melting mechanism of the present invention;
FIG. 3 is a bottom view of the present invention shown in FIG. 2;
FIG. 4 is a view showing the internal structure of the main tin melting tank of the present invention;
FIG. 5 is a bottom view of the present invention shown in FIG. 4;
FIG. 6 is a view showing the construction of the return pipe of the present invention;
FIG. 7 is a view of the construction of the filtration tank of the present invention;
FIG. 8 is a view showing the structure of a recovery mechanism according to the present invention.
In the figure: 1. a transport mechanism; 2. a circuit board; 3. a spraying mechanism; 4. a preheating mechanism; 5. a welding mechanism; 6. a tin melting mechanism; 61. a first gate; 62. a main tin melting tank; 63. heat preservation cotton; 64. an electromagnetic induction coil; 65. a drive motor; 66. a transmission belt; 67. a rotating wheel; 68. a second rotating shaft; 69. a transport pipeline; 610. an auxiliary tin melting tank; 611. a first rotating shaft; 612. stirring blades; 7. an impurity removal mechanism; 71. a shielding plate; 72. a lifting plate; 73. a support bar; 74. a base plate; 75. lifting the telescopic rod; 76. a temporary storage box; 77. a return pipe; 78. a revolving door; 79. a second gate; 8. a recovery mechanism; 81. a rotating seat; 82. adjusting the telescopic rod; 83. a trash material pipe; 84. a breather pipe; 85. a connecting hopper; 86. a recovery pipeline; 87. a filter screen plate.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
referring to fig. 1-4, a welding process for an intelligent module antenna includes a transmission mechanism 1, a circuit board 2, a spraying mechanism 3, a preheating mechanism 4 and a welding mechanism 5, wherein the transmission mechanism 1 is disposed on two sides of the outer side wall of the circuit board 2, the spraying mechanism 3 is disposed on one side of the lower surface of the transmission mechanism 1, the preheating mechanism 4 is disposed on one side of the lower surface of the transmission mechanism 1, which is close to the spraying mechanism 3, and the welding mechanism 5 is disposed on one side of the lower surface of the transmission mechanism 1, which is close to the preheating mechanism 4;
the transmission mechanism 1 can transmit the circuit board 2 placed in the transmission mechanism 1 along a transmission track, so that the circuit board 2 sequentially passes through the distribution areas of the spraying mechanism 3, the preheating mechanism 4 and the welding mechanism 5, when the circuit board 2 moves to the position of the spraying mechanism 3, the spraying equipment in the spraying mechanism 3 uniformly sprays the soldering flux on the lower surface of the circuit board 2, when the circuit board 2 moves to the position of the preheating mechanism 4, the heat generated by the heating equipment in the preheating mechanism 4 preheats the circuit board 2, and the sprayed soldering flux is dried, so that the situation that the soldered circuit board 2 leaks electricity due to the fact that the soldering flux on the lower surface of the circuit board 2 absorbs water during soldering is avoided, and then the circuit board 2 is transmitted to the position of the welding mechanism 5 through the movement of the transmission mechanism 1 to perform wave soldering operation;
the inside of the welding mechanism 5 is provided with a tin melting mechanism 6, the tin melting mechanism 6 comprises a main tin melting box 62, the outer side wall of the main tin melting box 62 is connected with heat insulation cotton 63, the heat insulation cotton 63 can enable the temperature generated by heating the main tin melting box 62 by an electromagnetic induction coil 64 to be not easy to dissipate to the external environment, the outer side wall of the heat insulation cotton 63 is connected with the electromagnetic induction coil 64, alternating current generated by an induction heating power supply passes through the electromagnetic induction coil 64 to generate an alternating magnetic field, the main tin melting box 62 is arranged in the main tin melting box to cut alternating magnetic lines, so that eddy current is generated in the main tin melting box 62, the eddy current enables atoms in the main tin melting box 62 to move randomly at high speed, the atoms collide with each other and generate heat energy through friction, so as to achieve the effect of heating the main tin melting box 62, one side of the outer side wall of the main tin melting box 62 is connected with an auxiliary tin melting box 610 through a transmission pipeline 69, and the heating structure connected with the outer side wall of the auxiliary tin melting box 610 is the same as the heating structure outside the main tin melting box 62, the auxiliary tin melting box 610 can be heated by the corresponding electromagnetic induction coil 64, the first gate 61 is connected to the middle position of the outer side wall of the auxiliary tin melting box 610, the first gate 61 controls the opening and closing of the internal circulation of the transmission pipeline 69 connecting the main tin melting box 62 and the auxiliary tin melting box 610, the height of the auxiliary tin melting box 610 is higher than that of the main tin melting box 62, the molten tin liquid in the auxiliary tin melting box 610 can circulate to the inside of the main tin melting box 62 along the inclined transmission pipeline 69 under the action of gravity, the lower surface of the inside of the main tin melting box 62 is connected with the driving motor 65 through the first rotating shaft 611, the upper end of the first rotating shaft 611 close to the inside of the main tin melting box 62 is connected with the stirring blade 612, the output end of the driving motor 65 is connected with the stirring blade 612 through the first rotating shaft 611, the driving motor 65 can drive the stirring blade 612 to rotate to stir and mix the molten tin liquid in the main tin melting box 62, the temperature of each part of the mixed soldering tin liquid is uniformly distributed, the outer side wall of the first rotating shaft 611 is connected with a rotating wheel 67, the outer side wall of the rotating wheel 67 is connected with a transmission belt 66, the middle position of the lower surface in the auxiliary soldering tin box 610 is connected with a second rotating shaft 68, the position of the outer side wall of the second rotating shaft 68, which corresponds to the transmission belt 66, is also connected with the rotating wheel 67, the second rotating shaft 68 is mutually transmitted through the transmission belt 66 through the rotating wheel 67 connected with the outer side wall and the rotating wheel 67 connected on the outer side wall of the first rotating shaft 611, so that the driving motor 65 drives the second rotating shaft 68 to rotate, and stirring equipment connected to the upper end of the second rotating shaft 68 and close to the inner part of the auxiliary soldering tin box 610 is used for stirring and mixing the soldering tin liquid in the molten state in the auxiliary soldering tin box 610;
the traditional electric heating mode is mainly a mode of heating a resistance wire and quartz, the resistance wire and the quartz self-generate heat after being electrified and then transfer the heat to the tin melting box, so that the effect of heating articles in the tin melting box is achieved, the heat utilization rate of the heating effect is low, part of heat is dissipated to the air in the transfer process, compared with the traditional electric heating mode, the electromagnetic induction heating mode generates a magnetic field through current, the tin melting box self-generates heat, the heat insulation cotton 63 connected to the outer side of the tin melting box prevents the tin melting box from dissipating the generated heat, and the heat lost in the heat transfer process is less;
when the consumed soldering tin liquid is replenished to the interior of the main soldering tin melting box 62, the soldering tin liquid in a melting state stored in the auxiliary soldering tin melting box 610 can flow into the interior of the main soldering tin melting box 62 along the transmission pipeline 69 by opening the first gate 61, the first gate 61 is closed after the soldering tin liquid is replenished, the soldering tin bars are not required to be directly added and melted to the interior of the main soldering tin melting box 62, the temperature distribution of the soldering tin liquid in the main soldering tin melting box 62 is uneven, and the melting of the solder strips needs to wait for a period of time, which affects the normal operation of wave soldering operation, the solder strips to be added are put into the auxiliary solder melting box 610, the auxiliary tin melting box 610 is heated by the electromagnetic induction coil 64 at the outer side of the auxiliary tin melting box 610, so that the soldering tin bars are melted into a molten state, and is uniformly mixed under the stirring of the stirring equipment connected to the second rotating shaft 68, so that the temperature difference of each part of the soldering tin liquid in the auxiliary tin melting tank 610 is small.
Example 2:
in the wave soldering process, the copper coating on the surface of the printed circuit board and the copper on the pins of the electronic components and the metal tin in the high-temperature soldering liquid form Cu6Sn5The intermetallic compound is less than the density of the soldering tin liquid, mostly floats on the surface of the soldering tin liquid, and part of the intermetallic compound is driven to enter the soldering tin liquid due to the action of wave peaks, so that the quantity of the intermetallic compound mixed in the soldering tin liquid is increased in the long-time soldering process, and the intermetallic compound is attached to the inner wall of the tin melting box to influence the conduction of heat, so that the temperature of the soldering tin liquid in a molten state in the tin melting box is difficult to stably keep at a set temperature;
referring to fig. 4-7, an impurity removing mechanism 7 is disposed inside the main solder melting tank 62, the impurity removing mechanism 7 includes a bottom plate 74, two sides of the upper surface of the bottom plate 74 are connected with lifting telescopic rods 75, the lifting telescopic rods 75 can adjust the distance between the bottom plate 74 and the bottom of the main solder melting tank 62 by adjusting the length thereof, so that the frame structure formed by the bottom plate 74, the support rods 73 and the lifting plate 72 can move integrally, the support rods 73 are connected to four corners of the upper surface of the bottom plate 74, the lifting plate 72 is connected to the upper end of the support rods 73 near the inside of the main solder melting tank 62, the size and shape of the lifting plate 72 are the same as the shape and size of the cross section of the space inside the main solder melting tank 62, and the outer side of the lifting plate 72 is connected with high temperature and corrosion resistant sealing rings, so that when the lifting plate 72 moves upwardly under the action of the lifting telescopic rods 75, the upper surface of the lifting plate 72 is provided with a slide hole corresponding to the position of the first rotating shaft 611, the inner side wall of the main tin melting box 62 is connected with a baffle plate 71 above the stirring blade 612, electric pump nozzles uniformly distributed on the upper surface of the baffle plate 71 can form a wave crest structure for the soldering tin liquid passing through the position, the rear surface of the main tin melting box 62 is connected with a return pipe 77 corresponding to the position of the baffle plate 71, the upper end of the return pipe 77 is connected with the outer side of the main tin melting box 62 above the baffle plate 71, so that the soldering tin liquid flowing down from one side of the baffle plate 71 can flow into the temporary storage box 76 from the position of the return pipe 77, the lower end of the return pipe 77 is connected with the outer side of the main tin melting box 62 below the baffle plate 71, the temporary storage box 76 is connected with the middle position of the outer side wall of the return pipe 77, the temporary storage box 76 can store the reflowing soldering tin liquid, the outer side wall of the return pipe 77 is connected with a rotating door 78 through a rotating shaft near the position of the temporary storage box 76, the rotating door 78 can enable the filtered impurities on the filter screen at the position corresponding to the return pipe 77 to slide down along the inclined surface after being opened, the outer side wall of the return pipe 77 close to the lower part of the temporary storage box 76 is connected with a second gate 79, and the opening and closing of the second gate 79 can control the transmission of the soldering tin liquid in the temporary storage box 76 to the main soldering tin box 62;
the telescopic rod 75 connected to the lower surface of the main solder melting box 62 can adjust the telescopic length under the control of the welding equipment controller, so as to drive the bottom plate 74 to move in position under the restriction of the support rods 73 at the four corner positions, so that the lifting plate 72 connected with the bottom plate 74 through the support rods 73 can push the solder liquid in the main solder melting box 62 upwards slowly, the solder liquid flows to one side of the shielding plate 71 when spreading to the upper end of the shielding plate 71, the solder liquid passing through the position forms a wave crest when the electric pump nozzles uniformly distributed on the shielding plate 71 act on the solder liquid, the solder liquid flowing from the shielding plate 71 is accumulated on one side of the shielding plate 71 and flows into the temporary storage box 76 from the position of the return pipe 77 at the rear of the main solder melting box 62, and the solder liquid is filtered by the filter screen at the inner side of the return pipe 77 in the process of flowing to the position of the temporary storage box 76 along the return pipe 77, making Cu in the soldering tin liquid6Sn5The intermetallic compounds are filtered out, after the lifting plate 72 reaches the highest position under the pushing of the lifting telescopic rod 75, the lifting telescopic rod 75 which is reduced to the minimum length is quickly extended to the maximum length, so that the lifting plate 72 is reset to the bottom end inside the main molten tin box 62, after the lifting telescopic rod 75 is extended to the maximum length, a signal is transmitted to a controller of the welding equipment, the controller transmits the signal to a second gate 79 on a return pipe 77, and the second gate 79 is opened so that the solder liquid temporarily stored in the temporary storage box 76 flows back to the inside of the main molten tin box 62 along the lower end of the return pipe 77;
in the process of circulating the solder liquid through the return pipe 77 after wave soldering, the filter screen in the return pipe 77 can filter Cu in the solder liquid6Sn5The intermetallic compounds are filtered out, so that the solder liquid flowing back to the main solder melting tank 62 does not contain Cu6Sn5Intermetallic compound impurities, when the lifting plate 72 pushes the soldering tin liquid to move upwards again for soldering tin operation, Cu in the soldering tin liquid cannot exist6Sn5The intermetallic compound influences the flow of the solder liquid, which leads to an impaired soldering operation of the circuit board 2.
Example 3:
cu filtered out by a filter screen6Sn5The intermetallic compounds are deposited on the screen and can slide along the inclined screen toward the side of the door 78 after the door 78 is opened, and slide out through the door 78, sliding out Cu6Sn5The intermetallic compound is reduced in temperature to adhere to Cu6Sn5The solder liquid outside the intermetallic compound solidifies, reducing the solder liquid that flows back into the main solder melting tank 62;
referring to fig. 7-8, a recovery mechanism 8 is disposed on one side of the outer side wall of the return pipe 77, the recovery mechanism 8 includes a recovery pipeline 86, the recovery pipeline 86 is connected to the position of the rotary door 78 corresponding to the outer side wall of the return pipe 77 through a sundry material pipe 83, the rotary door 78 is connected to the inside of the corresponding hole on the outer side of the return pipe 77 through a rotating shaft, the outer side wall of the rotary door 78 is connected to a high temperature and corrosion resistant sealing ring, an adjusting telescopic rod 82 is disposed inside the sundry material pipe 83, the adjusting telescopic rod 82 adjusts the telescopic length of the telescopic rod 82 through a signal transmitted by a welding equipment controller, so that the rotary door 78 adjusts the telescopic rod82 to rotate around the rotation axis to open and close, two ends of the adjusting telescopic rod 82 are respectively connected with the upper surface inside the sundry pipe 83 and the outer side wall of the revolving door 78 through a rotating seat 81, a filter screen plate 87 is connected below the inner side wall of the recovery pipeline 86, a connecting hopper 85 is connected to the upper surface of the recovery pipeline 86, a vent pipe 84 is connected to the upper end of the connecting hopper 85, the upper end of the vent pipe 84 is connected with a pipeline for transmitting inert gas heating equipment of wave soldering equipment through a pipeline, the heated inert gas can reach the position of the filter screen plate 87 along the pipeline, and the inert gas is attached to Cu6Sn5The solidified soldering tin liquid outside the intermetallic compound is melted and dropped, and flows back to the lower part of the recovery pipeline 86 along the recovery pipeline 86 for centralized recovery and utilization;
the telescopic length of the telescopic rod 82 is adjusted under the control of the welding equipment controller, the telescopic rod 82 with one end fixed on the upper surface of the impurity tube 83 can pull the revolving door 78 connected to the lower end of the telescopic rod 82, the revolving door 78 can be rotated and opened under the action of the rotating shaft, and Cu is enabled6Sn5The intermetallic compound slides down and falls into the interior of the recovery pipe 86, and is adhered to Cu by the heated inert gas supplied through the vent pipe 846Sn5The solder liquid outside the intermetallic compound is melted and dropped for recovery.
When the tin melting tank is used, the electromagnetic induction coils 64 on the outer sides of the main tin melting tank 62 and the auxiliary tin melting tank 610 are connected with a power supply to work so as to heat the main tin melting tank 62 and the auxiliary tin melting tank 610, so that tin bars placed in the main tin melting tank 62 and the auxiliary tin melting tank 610 are heated and melted, and are kept in a molten state under the heat preservation effect of the electromagnetic induction coils 64 and the heat preservation cotton 63, the temperature detection equipment of the welding equipment constantly detects the temperature of the tin liquid in the main tin melting tank 62 and the auxiliary tin melting tank 610, the temperature is prevented from exceeding a set range, the tin liquid in the molten state is driven by the stirring blades 612 through the driving motor 65 to fully stir and mix the tin liquid in the main tin melting tank 62, and the detected temperature is more accurate;
a bottom plate 74 connected to the bottom of the main solder melting tank 62 via a telescopic rod 75, and a support rod passing through the telescopic rod 75 after the telescopic rod 75 has contracted its length73 lift plate 72 that is connected with bottom plate 74 rises at the position of main tin melting box 62 inside, lift plate 72 keeps the condition that the slope can not take place for the level under four bracing pieces 73 support, the inside molten state's of main tin melting box 62 soldering tin liquid is upwards flowed by the promotion of lift plate 72 that rises, and form the soldering tin liquid crest under the effect of a plurality of evenly distributed's electric pump shower nozzle on shielding plate 71 upper surface when flowing to shielding plate 71 upper end department, make circuit board 2 carry out the wave soldering operation when passing soldering tin liquid crest position department under the support of transport mechanism 1, in the wave soldering process, the copper structure of circuit board 2 lower surface and the metallic tin of molten state produce Cu and produce the wave soldering operation, the copper structure of circuit board 2 lower surface and molten state's metallic tin6Sn5Intermetallic compound, Cu6Sn5The intermetallic compound flows along with the flow of the molten solder liquid, flows out of the main solder melting tank 62 from the hole on the rear surface of the main solder melting tank 62 corresponding to the position of the return pipe 77, flows inside the return pipe 77, is filtered by the filter screen inside the return pipe 77 and then stored inside the temporary storage tank 76, the heating structure having the same structure as the structure outside the main solder melting tank 62 is arranged outside the temporary storage tank 76, so that the solder liquid temporarily stored inside the temporary storage tank 76 is not cooled and solidified, and returns to the main solder melting tank 62 through the opening of the second gate 79 after the ascending lifting plate 72 is restored to the original position, and during the position movement of the lifting plate 72, the infrared distance sensor on the bottom plate 74 can detect the distance between the bottom plate 74 and the bottom surface of the main solder melting tank 62, and transmit the detected data to the welding equipment control equipment, and the control equipment controls the length of the lifting telescopic rod 75, under the control of the wave soldering equipment on the adjusting telescopic rod 82, the adjusting telescopic rod 82 contracts to drive the rotating door 78 to rotate and open under the action of the rotating shaft, so that filtered Cu is obtained6Sn5The intermetallic compound slides along the impurity pipe 83 to the position of the filter screen plate 87 in the recovery pipe 86, and the heated inert gas introduced from the position of the vent pipe 84 is blown to Cu6Sn5Intermetallic compound surface of Cu6Sn5The solder liquid on the surface of the intermetallic compound is melted into liquid to drip, which is convenient for centralized recycling and removing the Cu attached with the solder liquid on the surface6Sn5Intermetallic compound ofCu can be carried out by opening a rotary door on the recovery duct 86 side6Sn5Removal of intermetallic compounds to prevent Cu in the inner side of the recovery pipe 866Sn5The intermetallic compound deposits affect the recovery of the solder liquid.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (7)
1. A welding process of an intelligent module antenna is characterized by comprising the following steps:
the method comprises the following steps: the circuit board (2) is placed on the inner side of the transmission mechanism (1) and supported by the transmission mechanism (1), and moves along with the transmission of the transmission mechanism (1), when the circuit board moves to the position of the spraying mechanism (3), the spraying equipment in the spraying mechanism (3) sprays soldering flux on the lower surface of the circuit board (2), when the circuit board moves to the position of the preheating mechanism (4), the circuit board (2) is preheated by heat generated by the heating equipment in the preheating mechanism (4), and then the circuit board (2) is transmitted to the position of the welding mechanism (5) through the movement of the transmission mechanism (1);
step two: after wave soldering equipment is started, an electromagnetic induction coil (64) on the outer side of a main tin melting box (62) and an auxiliary tin melting box (610) is connected with a power supply to work so as to heat the main tin melting box (62) and the auxiliary tin melting box (610), so that tin bars placed in the main tin melting box (62) and the auxiliary tin melting box (610) are heated and melted, and the molten state is kept under the action of the electromagnetic induction coil (64) and heat insulation cotton (63), and the molten state tin liquid drives a stirring blade (612) through a driving motor (65) so that the tin liquid in the main tin melting box (62) is stirred and fully mixed;
step three: the bottom plate (74) is connected with the bottom of the main tin melting box (62) through a lifting telescopic rod (75), after the lifting telescopic rod (75) contracts in length, a lifting plate (72) which is connected with the bottom plate (74) through a support rod (73) is lifted at the position inside the main tin melting box (62), the molten soldering tin liquid in the main tin melting box (62) flows upwards under the pushing of the lifting plate (72) and flows to the position of the upper end of the shielding plate (71) without being blocked at one side, the molten soldering tin liquid forms soldering tin liquid wave crests under the action of a plurality of uniformly distributed electric pump nozzles on the upper surface of the shielding plate (71), and the circuit board (2) is subjected to wave crest welding operation when passing through the soldering tin liquid wave crest position under the supporting of the transmission mechanism (1);
step four: in the wave soldering process, the copper structure on the lower surface of the circuit board (2) and the molten metal tin generate Cu6Sn5Intermetallic compound, Cu6Sn5The intermetallic compound flows along with the flowing of the molten state soldering tin liquid, the main soldering tin melting box (62) flows out from the position of a return pipe (77) on the rear surface of the main soldering tin box (62), impurities are filtered by a filter screen in the return pipe (77) and then are stored in a temporary storage box (76), the lifting plate (72) which ascends returns to the original position and then returns to the inside of the main soldering tin box (62) through the opening of a second gate (79), and Cu filtered by the filter screen in the return pipe (77)6Sn5The intermetallic compound can slide from the position of the rotating door (78) to the position of the impurity pipe (83) along the inclined surface of the filter screen;
step five: the revolving door (78) is controlled by the wave soldering equipment to adjust the telescopic rod (82), so that the adjusting telescopic rod (82) contracts to drive the revolving door (78) to rotate and open under the action of the rotating shaft, and filtered Cu is enabled to be obtained6Sn5The intermetallic compound slides along the impurity pipe (83) to the position of the filter screen plate (87) in the recovery pipeline (86), and the heated inert gas introduced from the position of the vent pipe (84) blows the Cu6Sn5Intermetallic compound surface of Cu6Sn5The soldering tin liquid on the surface of the intermetallic compound is melted into liquid and drops, so that the concentrated recycling is convenient.
2. The welding process of the intelligent module antenna according to claim 1, wherein a transmission mechanism (1) is arranged on two sides of the outer side wall of the circuit board (2), a spraying mechanism (3) is arranged on one side of the lower surface of the transmission mechanism (1), a preheating mechanism (4) is arranged on one side of the lower surface of the transmission mechanism (1) close to the spraying mechanism (3), a welding mechanism (5) is arranged on one side of the lower surface of the transmission mechanism (1) close to the preheating mechanism (4), and a tin melting mechanism (6) is arranged inside the welding mechanism (5);
the tin melting mechanism (6) comprises a main tin melting box (62), the outer side wall of the main tin melting box (62) is connected with heat insulation cotton (63), and the outer side wall of the heat insulation cotton (63) is connected with an electromagnetic induction coil (64);
one side of the outer side wall of the main tin melting box (62) is connected with an auxiliary tin melting box (610) through a transmission pipeline (69), and the middle position of the outer side wall of the auxiliary tin melting box (610) is connected with a first gate (61);
the inside lower surface of main tin melting box (62) is connected with driving motor (65) through first pivot (611), first pivot (611) are close to the inside upper end of main tin melting box (62) is connected with stirring leaf (612), first pivot (611) lateral wall is connected with runner (67), runner (67) lateral wall is connected with drive belt (66), vice tin melting box (610) inside lower surface intermediate position department is connected with second pivot (68), second pivot (68) lateral wall corresponds drive belt (66) position department also is connected with runner (67).
3. The welding process of the intelligent module antenna according to the claim 2, characterized in that the inside of the main tin melting box (62) is provided with an impurity removing mechanism (7);
the impurity removing mechanism (7) comprises a bottom plate (74), two sides of the upper surface of the bottom plate (74) are connected with lifting telescopic rods (75), supporting rods (73) are connected at four corners of the upper surface of the bottom plate (74), the upper ends, close to the interior of the main tin melting box (62), of the supporting rods (73) are connected with lifting plates (72), and sliding holes are formed in the positions, corresponding to the first rotating shafts (611), of the upper surfaces of the lifting plates (72);
the main tin melting box (62) inside wall is close to stirring leaf (612) top is connected with shielding plate (71), main tin melting box (62) rear surface corresponds shielding plate (71) position department is connected with back flow (77), back flow (77) lateral wall intermediate position department is connected with temporary storage box (76), back flow (77) lateral wall is close to temporary storage box (76) position department is connected with revolving door (78) through the axis of rotation, back flow (77) lateral wall is close to temporary storage box (76) below is connected with second gate (79).
4. A welding process of an intelligent module antenna according to claim 1, wherein a recovery mechanism (8) is arranged on one side of the outer side wall of the return pipe (77);
the recycling mechanism (8) comprises a recycling pipeline (86), the recycling pipeline (86) is connected to the position, corresponding to the rotary door (78), of the outer side wall of the return pipe (77) through a sundry pipe (83), an adjusting telescopic rod (82) is arranged inside the sundry pipe (83), two ends of the adjusting telescopic rod (82) are respectively connected with the upper surface inside the sundry pipe (83) and the outer side wall of the rotary door (78) through a rotary seat (81), and a filter screen plate (87) is connected below the inner side wall of the recycling pipeline (86);
the upper surface of the recovery pipeline (86) is connected with a connecting hopper (85), and the upper end of the connecting hopper (85) is connected with a vent pipe (84).
5. The welding process of the intelligent module antenna according to claim 1, wherein the structure of the outer side wall of the auxiliary solder melting tank (610) is the same as the structure of the outer side wall of the main solder melting tank (62), the outer sides of the outer side walls of the auxiliary solder melting tank (610) and the main solder melting tank (62) corresponding to the position of the electromagnetic induction coil (64) are both connected with a protective cover, and the protective cover is connected to the outer side wall of the main solder melting tank (62) through mutual embedding between a buckle and a buckle groove formed in the outer side wall of the main solder melting tank (62).
6. The welding process of an intelligent module antenna according to claim 1, wherein a filter screen is connected to the inner side wall of the return pipe (77) at a position corresponding to the revolving door (78), heat insulation cotton (63) and an electromagnetic induction coil (64) are also connected to the outer side wall of the temporary storage box (76), and a plurality of uniformly distributed electric pump spray heads are connected to the upper surface of the shielding plate (71).
7. The welding process of a smart module antenna according to claim 1, wherein the screen plate (87) is disposed in an inclined state inside the recycling pipe (86), and the upper end of the vent pipe (84) is connected to a pipe for transporting inert gas heating equipment of a wave soldering apparatus through a pipe.
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