CN113686676A - Compression-resistant detection equipment for SIP packaging test of 5G communication processing chip and use method thereof - Google Patents
Compression-resistant detection equipment for SIP packaging test of 5G communication processing chip and use method thereof Download PDFInfo
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- CN113686676A CN113686676A CN202110960820.5A CN202110960820A CN113686676A CN 113686676 A CN113686676 A CN 113686676A CN 202110960820 A CN202110960820 A CN 202110960820A CN 113686676 A CN113686676 A CN 113686676A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 47
- 238000012360 testing method Methods 0.000 title claims abstract description 35
- 230000006835 compression Effects 0.000 title claims abstract description 30
- 238000007906 compression Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000001125 extrusion Methods 0.000 claims abstract description 35
- 238000012423 maintenance Methods 0.000 claims abstract description 19
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 3
- 230000003313 weakening effect Effects 0.000 claims description 2
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
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Abstract
The invention discloses a compression-resistant detection device for SIP packaging test of a 5G communication processing chip and a use method thereof, wherein the compression-resistant detection device comprises a compression-resistant detection device body for SIP packaging test of the 5G communication processing chip, a base is arranged at the bottom end of the compression-resistant detection device body, supporting legs are arranged on the periphery of the bottom end of the base, a pressure detection device is arranged on one side of the compression-resistant detection device body, a compression seat is connected to the bottom end of the pressure detection device and used for compressing and testing the SIP packaged 5G communication processing chip, and a placing seat is arranged right below the compression seat and used for placing the SIP packaged 5G communication processing chip. According to the invention, the quick-release maintenance structure is arranged, so that the base plate for pressure test can be quickly disassembled and separated from the extrusion seat, and the pressure sensor between the base plate and the extrusion seat is exposed, so that the maintenance test of the pressure sensor is facilitated, the maintenance efficiency is improved, the assembly of the device is facilitated, and the integral installation effect of the device is improved.
Description
Technical Field
The invention relates to the technical field of 5G communication, in particular to a compression-resistant detection device for SIP packaging test of a 5G communication processing chip and a use method thereof.
Background
SIP (System In a Package) is a packaging scheme that integrates multiple functional wafers, including functional wafers such as processors and memories, into one Package according to factors such as application scenarios and the number of layers of a Package substrate, thereby achieving a basic complete function.
SIP encapsulation resistance to compression detection device on the market can't be quick overhauls to pressure sensor when using, overhauls the efficiency lower and can not be quick take out SIP encapsulation 5G communication processing chip from the inside of device, influences the efficiency that detects.
Disclosure of Invention
The invention aims to provide a pressure-resistant detection device for SIP packaging test of a 5G communication processing chip and a use method thereof, so as to solve the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme: a pressure-resistant detection device for SIP packaging test of a 5G communication processing chip comprises a pressure-resistant detection device body for SIP packaging test of the 5G communication processing chip, the bottom end of the compression-resistant detection equipment body is provided with a base, supporting legs are arranged around the bottom end of the base, one side of the compression-resistant detection equipment body is provided with pressure detection equipment, the bottom end of the pressure detection equipment is connected with a compression seat, the 5G communication processing chip is used for extrusion testing of SIP packaging, a placing seat is arranged right below the extrusion seat, the 5G communication processing chip is used for placing the SIP package, the inside of the placing seat is provided with an adjusting and taking-out structure, the device comprises a placing seat, a pressure sensor, a quick-release maintenance structure, a SIP packaging 5G communication processing chip, a quick-release maintenance structure and a quick-release maintenance structure, wherein the SIP packaging 5G communication processing chip is placed in the placing seat and is used for quickly taking out the pressure sensor and carrying out maintenance and debugging on the pressure sensor;
the quick-release maintenance structure comprises moving grooves formed in two sides of the extrusion seat, supporting rods are arranged inside the moving grooves, springs are sleeved on the outer sides of the supporting rods, one side of each spring is connected with a sliding sleeve in a sliding mode, and a top block is arranged at the top end of each sliding sleeve.
Preferably, the bottom end of the sliding sleeve is provided with a guide rod, one side of the guide rod is connected with an inserted bar, and one side of the inserted bar is provided with a guide hole.
Preferably, the base plate is arranged below the extrusion seat, the bottom end of the base plate is provided with a bottom base plate, a top contact is arranged above the bottom base plate, a pressure sensor is connected above the top contact, and the pressure sensor is arranged at the bottom end of the extrusion seat.
Preferably, two sides of the extrusion seat are provided with limit grooves for linear movement of the top block.
Preferably, the top end of the seat plate is provided with a mounting groove, slots are formed in two sides of the mounting groove, and the top ends of the slots are provided with nail pins for inserting the guide holes of the inserted bars.
Preferably, adjust out the structure including setting up in the knob of placing seat one side, one side of knob is connected with the pivot, the first gear of one side fixedly connected with of pivot, the one end meshing of first gear is connected with the second gear, the internal connection of second gear has the threaded rod, the outside cooperation of threaded rod is connected with the screw sleeve board, the top of screw sleeve board is connected with limit sleeve, limit sleeve's top is provided with the bearing frame, the top of bearing frame is provided with the bottom plate.
Preferably, the top end of the threaded rod is provided with a top ring plate, and the top ring plate is in a cylindrical side plate shape.
Preferably, notches are formed in two sides of the limiting sleeve and used for linear movement of the top ring plate.
Preferably, a groove plate is arranged on the outer side of the bottom plate and used for placing a 5G communication processing chip packaged by SIP.
The use method of the pressure-resistant detection equipment for the SIP packaging test of the 5G communication processing chip comprises the following steps:
placing an SIP packaging 5G communication processing chip to be tested in a groove plate above a placing seat, then switching on an external power supply, controlling a pressure detection device on one side of a compression-resistant detection device body, moving and attaching the pressure detection device to the surface of the SIP packaging 5G communication processing chip in the groove plate, extruding and attaching a bottom cushion plate to the surface of the SIP packaging 5G communication processing chip, and extruding a pressure sensor through a top contact to perform compression-resistant detection on the pressure sensor;
after the anti-pressure detection is finished, rotating a knob on one side of a placing seat, driving a first gear at one end to rotate by a rotating shaft, meshing the first gear with a second gear to rotate, controlling a threaded rod in the second gear to rotate, matching the threaded rod with a threaded sleeve plate, moving a connecting limiting sleeve upwards and rotating the outer side of the threaded rod, driving a bottom plate to move upwards in a groove plate by a bearing seat until an SIP packaging 5G communication processing chip is transferred out of the groove plate, and taking out the SIP packaging 5G communication processing chip which is detected;
step (C), when the pressure sensor is overhauled, the pin is taken out of the guide hole in the inserting rod, the ejector blocks on two sides are moved towards the inner side of the extrusion seat to extrude, the ejector blocks drive the sliding sleeve to extrude the spring on the outer side of the supporting rod in the limiting groove, the spring is stressed to shrink until the guide rod drives the inserting rod to move and slide out of the slot in the seat plate, at the moment, the seat plate is taken down, the seat plate is separated from the extrusion seat, the pressure sensor is exposed, and the pressure sensor is overhauled;
step (D), after the pressure sensor is overhauled, aligning the mounting groove at the top end of the seat plate to the position of the pressure sensor at the bottom end of the extrusion seat until the top contact is connected with the pressure sensor;
step (E), pressing the ejector blocks on the two sides of the extrusion seat inwards to drive the sliding sleeve to move to extrude the spring on the outer side of the supporting rod, enabling the spring to be stressed and contracted, and enabling the sliding sleeve to drive the guide rod at the bottom end to move towards the inner part of the moving groove to be accommodated until the inserted rod is completely accommodated in the extrusion seat;
and (F) moving the seat plate upwards until the slot position is located at one end of the inserting rod, loosening the acting force of the hand on the ejecting block, weakening the stress of the spring, generating elastic extension, driving the inserting rod on one side of the guide rod at the bottom end of the sliding sleeve to move and eject out of the moving groove, inserting the inserting rod into the slot, then inserting the pin into the guide hole, positioning the inserting rod in the slot, fixing the inserting rod and completing the connection of the extrusion seat and the seat plate.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the quick-release maintenance structure is arranged, so that the base plate for pressure test can be quickly disassembled and separated from the extrusion seat, and the pressure sensor between the base plate and the extrusion seat is exposed, so that the maintenance test of the pressure sensor is facilitated, the maintenance efficiency is improved, the assembly of the device is facilitated, and the integral installation effect of the device is improved.
2. According to the invention, through the adjusting and taking-out structure, the knob positioned on one side of the placing seat can be screwed, the bottom plate used for placing the SIP packaging 5G communication processing chip in the control groove plate is jacked up from the bottom plate, so that workers can conveniently and rapidly take out the SIP packaging 5G communication processing chip from the inside of the device, the detection efficiency can be improved from the side surface, and the use effect is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic cross-sectional view of the placement seat of the present invention;
FIG. 3 is a schematic cross-sectional view of the extrusion seat of the present invention;
fig. 4 is an enlarged view of the structure at the position a of the present invention.
In the figure: 1. a compression resistance detection device body; 2. a base; 3. supporting legs; 4. a placing seat; 401. a groove plate; 402. a knob; 403. a rotating shaft; 404. a first gear; 405. a second gear; 406. a threaded rod; 407. a top ring plate; 408. a threaded bushing plate; 409. a limiting sleeve; 410. a notch; 411. a bearing seat; 412. a base plate; 5. a pressure detection device; 6. a pressing base; 601. a seat plate; 602. a bottom bolster plate; 603. a top contact; 604. a pressure sensor; 605. a moving groove; 606. a strut; 607. a spring; 608. a limiting groove; 609. a sliding sleeve; 610. a top block; 611. a guide bar; 612. inserting a rod; 613. a guide hole; 614. a slot; 615. a pin; 616. and (4) mounting the groove.
Detailed Description
In order to solve the problems that the existing pressure sensor cannot be overhauled quickly, the overhauling efficiency is low, and the SIP packaged 5G communication processing chip cannot be taken out of the device quickly, so that the detection efficiency is influenced, the invention provides the pressure-resistant detection equipment for the SIP packaging test of the 5G communication processing chip and the use method thereof. The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described invention is only a part of the invention, not a whole invention. All other inventions obtained by a person of ordinary skill in the art based on the inventions of the present invention without any creative efforts shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the invention provides a compression-resistant detection device for SIP packaging test of a 5G communication processing chip, comprising a compression-resistant detection device body 1 for SIP packaging test of the 5G communication processing chip, a base 2 is arranged at the bottom end of the compression-resistant detection device body 1, supporting legs 3 are arranged around the bottom end of the base 2, a pressure detection device 5 is arranged at one side of the compression-resistant detection device body 1, a compression seat 6 is connected to the bottom end of the pressure detection device 5 for compression testing of the SIP packaged 5G communication processing chip, a placing seat 4 is arranged right below the compression seat 6 for placing the SIP packaged 5G communication processing chip, an adjusting and taking-out structure is arranged inside the placing seat 4 for quickly taking out the SIP packaged 5G communication processing chip placed inside the placing seat 4, a quick-release maintenance structure is arranged at one side of the compression seat 6, the pressure sensor 604 is taken out quickly for maintenance and debugging;
the quick-release maintenance structure comprises moving grooves 605 arranged on two sides of the extrusion seat 6, supporting rods 606 are arranged inside the moving grooves 605, springs 607 are sleeved on the outer sides of the supporting rods 606, one sides of the springs 607 are connected with sliding sleeves 609 in a sliding mode, and top blocks 610 are arranged at the top ends of the sliding sleeves 609.
A guide rod 611 is disposed at the bottom end of the sliding sleeve 609, an insertion rod 612 is connected to one side of the guide rod 611, and a guide hole 613 is formed at one side of the insertion rod 612.
The seat plate 601 is arranged below the further extrusion seat 6, the bottom end of the seat plate 601 is provided with a bottom cushion plate 602, a top contact 603 is arranged above the bottom cushion plate 602, a pressure sensor 604 is connected above the top contact 603, and the pressure sensor 604 is arranged at the bottom end of the extrusion seat 6.
Limiting grooves 608 are formed in two sides of the further extrusion seat 6 and used for linear movement of the top block 610.
Further, the top end of the seat plate 601 is provided with a mounting groove 616, two sides of the mounting groove 616 are provided with slots 614, and the top end of the slots 614 is provided with pins 615 for inserting the guide holes 613 of the insertion rods 612.
Further regulation structure of taking out is including setting up in the knob 402 of placing seat 4 one side, one side of knob 402 is connected with pivot 403, the first gear 404 of one side fixedly connected with of pivot 403, the one end meshing of first gear 404 is connected with second gear 405, the internal connection of second gear 405 has threaded rod 406, the outside cooperation of threaded rod 406 is connected with threaded sleeve plate 408, the top of threaded sleeve plate 408 is connected with limit sleeve 409, the top of limit sleeve 409 is provided with bearing frame 411, the top of bearing frame 411 is provided with bottom plate 412.
The top end of the further threaded rod 406 is provided with a top ring plate 407, the top ring plate 407 being cylindrical side plate type in shape.
Further, a slot board 401 is disposed outside the bottom board 412 for placing a 5G communication processing chip packaged by SIP.
The use method of the pressure-resistant detection equipment for the SIP packaging test of the 5G communication processing chip comprises the following steps:
step (A), placing an SIP packaging 5G communication processing chip to be tested in a groove plate 401 above a placing seat 4, then switching on an external power supply, controlling a pressure detection device 5 on one side of a compression-resistant detection device body 1, moving and attaching the pressure detection device to the surface of the SIP packaging 5G communication processing chip in the groove plate 401, extruding and attaching a bottom base plate 602 to the surface of the SIP packaging 5G communication processing chip, extruding a pressure sensor 604 through a top contact 603, and carrying out compression-resistant detection on the chip;
step (B), after the anti-pressure detection is finished, rotating a knob 402 on one side of a placing seat 4, driving a first gear 404 at one end to rotate by a rotating shaft 403, enabling the first gear 404 to be meshed with a second gear 405 to rotate, controlling a threaded rod 406 in the second gear 405 to rotate, enabling the threaded rod 406 to be matched with a threaded sleeve plate 408, enabling a connecting limiting sleeve 409 to move upwards and rotate on the outer side of the threaded rod 406, driving a bottom plate 412 to move upwards in a groove plate 401 by a bearing seat 411 until an SIP packaging 5G communication processing chip is transferred out of the groove plate 401, and taking out the SIP packaging 5G communication processing chip which is detected;
step (C), when the pressure sensor 604 is overhauled, the pin 615 is taken out of the guide hole 613 in the inserting rod 612, the ejecting block 610 on the two sides is moved towards the inner side of the extrusion seat 6 to extrude, the ejecting block 610 drives the sliding sleeve 609 in the limiting groove 608 to extrude the spring 607 on the outer side of the supporting rod 606, the spring 607 is stressed and contracted until the guide rod 611 drives the inserting rod 612 to move and slide out of the slot 614 in the seat plate 601, at the moment, the seat plate 601 is taken down, the seat plate 601 is separated from the extrusion seat 6, the pressure sensor 604 is exposed, and the pressure sensor 604 is overhauled;
step (D), after the pressure sensor 604 is overhauled, aligning the mounting groove 616 at the top end of the seat plate 601 to the position of the pressure sensor 604 at the bottom end of the extrusion seat 6 until the top contact 603 is connected with the pressure sensor 604;
step (E), then, the jacking blocks 610 on the two sides of the pressing seat 6 are pressed inwards to drive the sliding sleeve 609 to move the pressing spring 607 outside the supporting rod 606, the spring 607 is stressed to contract, and the sliding sleeve 609 drives the guide rod 611 at the bottom end to move and store towards the inside of the moving groove 605 until the inserted rod 612 is completely stored into the pressing seat 6;
step (F), the seat plate 601 is moved upwards until the position of the slot 614 is positioned at one end of the inserting rod 612, the acting force of the hand on the top block 610 is released, the spring 607 is weakened by stress to generate elastic extension, the inserting rod 612 on one side of the guide rod 611 at the bottom end of the sliding sleeve 609 is driven to move and eject out from the inner part of the moving groove 605 and be inserted into the inner part of the slot 614, then the pin 615 is inserted into the guide hole 613, the inserting rod 612 is positioned in the slot 614, the inserting rod 612 is fixed, and the connection of the extrusion seat 6 and the seat plate 601 is completed
The use method of the pressure-resistant detection equipment for the SIP packaging test of the 5G communication processing chip has the following advantages:
1. according to the invention, the quick-release maintenance structure is arranged, so that the base plate 602 for pressure test can be quickly detached and separated from the extrusion seat 6, and the pressure sensor 604 between the base plate and the extrusion seat is exposed, so that the maintenance test of the pressure sensor 604 is facilitated, the maintenance efficiency is improved, the assembly of the device is facilitated, and the integral installation effect of the device is improved.
2. According to the invention, through the arrangement of the adjusting and taking-out structure, the knob 402 positioned on one side of the placing seat 4 can be screwed, the bottom plate 412 used for placing the SIP packaging 5G communication processing chip in the control groove plate 401 is jacked up from the bottom plate, so that a worker can conveniently and rapidly take out the SIP packaging 5G communication processing chip from the inside of the device, the detection efficiency can be improved from the side surface, and the use effect is improved.
Although the present invention has been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made herein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1.5G communication processing chip SIP encapsulation test is with resistance to compression check out test set, its characterized in that: the pressure-resistant detection device comprises a pressure-resistant detection device body (1) used for SIP packaging test of a 5G communication processing chip, wherein a base (2) is arranged at the bottom end of the pressure-resistant detection device body (1), supporting legs (3) are arranged on the periphery of the bottom end of the base (2), a pressure detection device (5) is arranged on one side of the pressure-resistant detection device body (1), the bottom end of the pressure detection device (5) is connected with a squeezing seat (6) used for squeezing and testing the SIP packaged 5G communication processing chip, a placing seat (4) is arranged under the squeezing seat (6) and used for placing the SIP packaged 5G communication processing chip, an adjusting and taking-out structure is arranged in the placing seat (4) and used for quickly taking out the SIP packaged 5G communication processing chip placed in the placing seat (4), and a quick-disassembly and maintenance structure is arranged on one side of the squeezing seat (6), the pressure sensor (604) is taken out quickly and is overhauled and debugged;
the quick-release maintenance structure comprises moving grooves (605) arranged on two sides of the extrusion seat (6), supporting rods (606) are arranged inside the moving grooves (605), springs (607) are sleeved on the outer sides of the supporting rods (606), one side of each spring (607) is slidably connected with a sliding sleeve (609), and the top end of each sliding sleeve (609) is provided with an ejector block (610).
2. The pressure-resistant detection device for the SIP packaging test of the 5G communication processing chip according to claim 1, wherein: the bottom end of the sliding sleeve (609) is provided with a guide rod (611), one side of the guide rod (611) is connected with an insert rod (612), and one side of the insert rod (612) is provided with a guide hole (613).
3. The pressure-resistant detection device for the SIP packaging test of the 5G communication processing chip according to claim 1, wherein: the extrusion seat is characterized in that a seat plate (601) is arranged below the extrusion seat (6), a bottom base plate (602) is arranged at the bottom end of the seat plate (601), a top contact (603) is arranged above the bottom base plate (602), a pressure sensor (604) is connected above the top contact (603), and the pressure sensor (604) is arranged at the bottom end of the extrusion seat (6).
4. The pressure-resistant detection device for the SIP packaging test of the 5G communication processing chip according to claim 3, wherein: and limiting grooves (608) are formed in two sides of the extrusion seat (6) and used for linear movement of the top block (610).
5. The pressure-resistant detection device for the SIP packaging test of the 5G communication processing chip according to claim 3, wherein: the top end of the seat plate (601) is provided with a mounting groove (616), two sides of the mounting groove (616) are provided with slots (614), and the top end of each slot (614) is provided with a pin (615) for being inserted into a guide hole (613) of the insertion rod (612).
6. The pressure-resistant detection device for the SIP packaging test of the 5G communication processing chip according to claim 1, wherein: adjust out structure including setting up in knob (402) of placing seat (4) one side, one side of knob (402) is connected with pivot (403), the first gear of one side fixedly connected with (404) of pivot (403), the one end meshing of first gear (404) is connected with second gear (405), the internal connection of second gear (405) has threaded rod (406), the outside cooperation of threaded rod (406) is connected with threaded sleeve board (408), the top of threaded sleeve board (408) is connected with stop sleeve (409), the top of stop sleeve (409) is provided with bearing frame (411), the top of bearing frame (411) is provided with bottom plate (412).
7. The pressure-resistant detection device for the SIP packaging test of the 5G communication processing chip according to claim 6, wherein: the top end of the threaded rod (406) is provided with a top ring plate (407), and the top ring plate (407) is in a cylindrical side plate shape.
8. The pressure-resistant detection device for the SIP packaging test of the 5G communication processing chip according to claim 6, wherein: notches (410) are formed in the two sides of the limiting sleeve (409) and used for linear movement of the top ring plate (407).
9. The pressure-resistant detection device for the SIP packaging test of the 5G communication processing chip according to claim 6, wherein: and a groove plate (401) is arranged on the outer side of the bottom plate (412) and used for placing a 5G communication processing chip packaged by the SIP.
10. The use method of the pressure-resistant detection equipment for the 5G communication processing chip SIP packaging test, based on any one of claims 1-9, is characterized in that: the method comprises the following steps:
step (A), a SIP packaging 5G communication processing chip to be tested is placed in a groove plate (401) above a placing seat (4), then an external power supply is switched on, pressure detection equipment (5) on one side of a compression-resistant detection equipment body (1) is controlled to move and attach to the surface of the SIP packaging 5G communication processing chip in the groove plate (401), a bottom base plate (602) is extruded and attached to the surface of the SIP packaging 5G communication processing chip, and a pressure sensor (604) is extruded through a top contact (603) to perform compression-resistant detection on the chip;
step (B), after the anti-pressure detection is completed, a knob (402) on one side of a placing seat (4) is rotated, a rotating shaft (403) drives a first gear (404) on one end to rotate, the first gear (404) is meshed with a second gear (405) to rotate, a threaded rod (406) inside the second gear (405) is controlled to rotate, the threaded rod (406) is matched with a threaded sleeve plate (408), a connecting limiting sleeve (409) moves upwards and rotates on the outer side of the threaded rod (406), a bearing seat (411) drives a bottom plate (412) to move upwards inside a groove plate (401) until an SIP packaging 5G communication processing chip is transferred out of the groove plate (401), and the SIP packaging 5G communication processing chip which is detected is taken out;
step (C), when the pressure sensor (604) is overhauled, the pin (615) is taken out of the guide hole (613) in the inserting rod (612), the ejecting block (610) on the two sides is moved towards the inner side of the extrusion seat (6) to extrude, the ejecting block (610) drives the sliding sleeve (609) in the limiting groove (608) to extrude the spring (607) on the outer side of the supporting rod (606), the spring (607) is stressed to shrink until the guide rod (611) drives the inserting rod (612) to move out of the slot (614) in the seat plate (601), the seat plate (601) is taken down at the moment, the seat plate (601) is separated from the extrusion seat (6), the pressure sensor (604) is exposed and taken out, and the pressure sensor (604) is overhauled;
step (D), after the pressure sensor (604) is overhauled, aligning a mounting groove (616) at the top end of the seat plate (601) to the position of the pressure sensor (604) at the bottom end of the extrusion seat (6) until the top contact (603) is connected with the pressure sensor (604);
step (E), then, pressing the top blocks (610) on the two sides of the pressing seat (6) inwards to drive the sliding sleeve (609) to move the pressing spring (607) on the outer side of the supporting rod (606), wherein the spring (607) is stressed to shrink, and the sliding sleeve (609) drives the guide rod (611) at the bottom end to move towards the inside of the moving groove (605) for containing until the inserted rod (612) is completely contained in the pressing seat (6);
and (F) moving the seat plate (601) upwards until the position of the slot (614) is positioned at one end of the inserted link (612), loosening the acting force of the hand on the top block (610), weakening the stress of the spring (607), generating elastic extension, driving the inserted link (612) at one side of the guide rod (611) at the bottom end of the sliding sleeve (609) to move and eject out of the moving slot (605), inserting into the slot (614), then inserting the pin (615) into the guide hole (613), positioning the inserted link (612) in the slot (614), fixing the inserted link (612), and completing the connection of the extrusion seat (6) and the seat plate (601).
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| CN202110960820.5A CN113686676A (en) | 2021-08-20 | 2021-08-20 | Compression-resistant detection equipment for SIP packaging test of 5G communication processing chip and use method thereof |
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| CN202110960820.5A CN113686676A (en) | 2021-08-20 | 2021-08-20 | Compression-resistant detection equipment for SIP packaging test of 5G communication processing chip and use method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115683862A (en) * | 2022-11-09 | 2023-02-03 | 徐州市沂芯微电子有限公司 | Chip packaging detection machine capable of detecting press-fitting quality and implementation method thereof |
| CN115963016A (en) * | 2023-03-17 | 2023-04-14 | 无锡祺芯半导体科技有限公司 | Chip packaging test system and test method thereof |
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| CN115683862B (en) * | 2022-11-09 | 2023-12-26 | 徐州市沂芯微电子有限公司 | Chip packaging detector capable of detecting packaging quality and implementation method thereof |
| CN115963016A (en) * | 2023-03-17 | 2023-04-14 | 无锡祺芯半导体科技有限公司 | Chip packaging test system and test method thereof |
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