CN113681915A - Preparation method for producing double-sided film reinforced mica tape in electron beam curing mode - Google Patents
Preparation method for producing double-sided film reinforced mica tape in electron beam curing mode Download PDFInfo
- Publication number
- CN113681915A CN113681915A CN202110803096.5A CN202110803096A CN113681915A CN 113681915 A CN113681915 A CN 113681915A CN 202110803096 A CN202110803096 A CN 202110803096A CN 113681915 A CN113681915 A CN 113681915A
- Authority
- CN
- China
- Prior art keywords
- solvent
- free glue
- film
- double
- mica tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/522—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spraying, e.g. by flame spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/04—After-treatment of articles without altering their shape; Apparatus therefor by wave energy or particle radiation, e.g. for curing or vulcanising preformed articles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Paper (AREA)
Abstract
The invention relates to a preparation method for producing a double-sided film reinforced mica tape in an electron beam curing mode, which comprises the following steps: step (1), preparing solvent-free glue; the solvent-free glue is prepared from the following components in percentage by mass: 20-60% of acrylate modified silicone oil, 10-40% of acrylate diluent monomer, 10-50% of polyether acrylate, 2-5% of fumed silica and 3-5% of photoinitiator; step (2), rolling and coating the solvent-free glue on the first film and the second film; step (3), spraying the solvent-free glue on the mica paper, and compositing two surfaces of the mica paper coated with the solvent-free glue with one surface of the first film coated with the solvent-free glue and one surface of the second film coated with the solvent-free glue respectively; obtaining a double-sided film reinforced mica tape semi-finished product; and (4) irradiating and curing the double-sided film reinforced mica tape semi-finished product by using an electron accelerator to form the double-sided film reinforced mica tape. By the invention, no VOC is discharged in the manufacturing process.
Description
Technical Field
The invention relates to a preparation method for producing a double-sided film reinforced mica tape in an electron beam curing mode, belonging to the field of mica tape preparation.
Background
The production process of the film reinforced mica tape in the current market is to dilute organic silicon glue into glue solution with certain concentration by toluene according to a certain proportion, roll-coat glue on one surface of mica paper, prepare single-sided film reinforced mica tape by drying, and prepare double-sided film reinforced mica tape by secondary compounding. The process uses a large amount of toluene as a solvent to cause a certain amount of VOC emission, and the toluene is a flammable and explosive substance and has certain potential safety hazard.
Disclosure of Invention
The invention aims to provide a preparation method for producing a double-sided film reinforced mica tape by an electron beam curing mode aiming at the defects of the prior art.
The purpose of the invention is realized as follows: a preparation method for producing a double-sided film reinforced mica tape in an electron beam curing mode is characterized by comprising the following steps:
step (1), preparing solvent-free glue; the solvent-free glue is prepared from the following components in percentage by mass: 20-60% of acrylate modified silicone oil, 10-40% of acrylate diluent monomer, 10-50% of polyether acrylate, 2-5% of fumed silica and 3-5% of photoinitiator;
when in preparation, the acrylate modified silicone oil, the acrylate diluent monomer, the polyether acrylate, the fumed silica and the photoinitiator in percentage by mass are uniformly mixed to obtain the solvent-free glue;
step (2), rolling and coating the solvent-free glue on the first film and the second film;
step (3), spraying the solvent-free glue on the mica paper, and compounding the mica paper with the solvent-free glue after the mica paper is completely permeated by the solvent-free glue, wherein two surfaces of the mica paper coated with the solvent-free glue are compounded with one surface of the first film coated with the solvent-free glue and one surface of the second film coated with the solvent-free glue respectively; obtaining a double-sided film reinforced mica tape semi-finished product;
and (4) irradiating and curing the double-sided film reinforced mica tape semi-finished product by using an electron accelerator to form the double-sided film reinforced mica tape.
In the step (2), the first film and the second film are both OPE films.
In the step (4), the irradiation parameters of the electron accelerator are as follows: 20mm, the advancing speed of the double-sided film reinforced mica tape semi-finished product in the electron accelerator is as follows: 25m/min, electron beam energy 500kev, electron beam current intensity: 40 kGy.
The method is advanced and scientific, and the preparation method for producing the double-sided thin film reinforced mica tape by the electron beam curing mode provided by the invention is characterized in that solvent-free glue is rolled and coated on the thin films (the first thin film and the second thin film), a certain amount of glue is sprayed on the mica paper, the mica paper is compounded after being completely penetrated by the glue, and finally the glue is irradiated and cured by the electron accelerator to form the double-sided thin film reinforced mica tape. The solvent-free glue is prepared from the following components in percentage by mass: 20-60% of acrylate modified silicone oil, 10-40% of acrylate diluent monomer, 10-50% of polyether acrylate, 2-5% of fumed silica and 3-5% of photoinitiator.
The invention has no VOC emission in the manufacturing process and has great market application and popularization value.
Detailed Description
The present invention is further explained below.
A preparation method for producing a double-sided film reinforced mica tape in an electron beam curing mode is characterized by comprising the following steps:
step (1), preparing solvent-free glue; the solvent-free glue is prepared from the following components in percentage by mass: 20-60% of acrylate modified silicone oil, 10-40% of acrylate diluent monomer, 10-50% of polyether acrylate, 2-5% of fumed silica and 3-5% of photoinitiator;
when in preparation, the acrylate modified silicone oil, the acrylate diluent monomer, the polyether acrylate, the fumed silica and the photoinitiator in percentage by mass are uniformly mixed to obtain the solvent-free glue;
step (2), rolling and coating the solvent-free glue on the first film and the second film;
step (3), spraying the solvent-free glue on the mica paper, and compounding the mica paper with the solvent-free glue after the mica paper is completely permeated by the solvent-free glue, wherein two surfaces of the mica paper coated with the solvent-free glue are compounded with one surface of the first film coated with the solvent-free glue and one surface of the second film coated with the solvent-free glue respectively; obtaining a double-sided film reinforced mica tape semi-finished product;
and (4) irradiating and curing the double-sided film reinforced mica tape semi-finished product into a double-sided film reinforced mica tape by using an electron accelerator, wherein the irradiation parameters of the electron accelerator are as follows: 20mm, the advancing speed of the double-sided film reinforced mica tape semi-finished product in the electron accelerator is as follows: 25m/min, electron beam energy 500kev, electron beam current intensity: 40 kGy. In the step (2), the first film and the second film are both OPE films.
Claims (3)
1. A preparation method for producing a double-sided film reinforced mica tape in an electron beam curing mode is characterized by comprising the following steps:
step (1), preparing solvent-free glue; the solvent-free glue is prepared from the following components in percentage by mass: 20-60% of acrylate modified silicone oil, 10-40% of acrylate diluent monomer, 10-50% of polyether acrylate, 2-5% of fumed silica and 3-5% of photoinitiator;
when in preparation, the acrylate modified silicone oil, the acrylate diluent monomer, the polyether acrylate, the fumed silica and the photoinitiator in percentage by mass are uniformly mixed to obtain the solvent-free glue;
step (2), rolling and coating the solvent-free glue on the first film and the second film;
step (3), spraying the solvent-free glue on the mica paper, and compounding the mica paper with the solvent-free glue after the mica paper is completely permeated by the solvent-free glue, wherein two surfaces of the mica paper coated with the solvent-free glue are compounded with one surface of the first film coated with the solvent-free glue and one surface of the second film coated with the solvent-free glue respectively; obtaining a double-sided film reinforced mica tape semi-finished product;
and (4) irradiating and curing the double-sided film reinforced mica tape semi-finished product by using an electron accelerator to form the double-sided film reinforced mica tape.
2. The method according to claim 1, wherein in step (2), the first film and the second film are OPE films.
3. The method for preparing double-sided thin film reinforced mica tape by electron beam curing as claimed in claim 1, wherein in the step (4), the irradiation parameters of the electron accelerator are as follows: 20mm, the advancing speed of the double-sided film reinforced mica tape semi-finished product in the electron accelerator is as follows: 25m/min, electron beam energy 500kev, electron beam current intensity: 40 kGy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110803096.5A CN113681915A (en) | 2021-07-15 | 2021-07-15 | Preparation method for producing double-sided film reinforced mica tape in electron beam curing mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110803096.5A CN113681915A (en) | 2021-07-15 | 2021-07-15 | Preparation method for producing double-sided film reinforced mica tape in electron beam curing mode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113681915A true CN113681915A (en) | 2021-11-23 |
Family
ID=78577257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110803096.5A Pending CN113681915A (en) | 2021-07-15 | 2021-07-15 | Preparation method for producing double-sided film reinforced mica tape in electron beam curing mode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113681915A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115029085A (en) * | 2022-06-27 | 2022-09-09 | 赤壁凯利隆科技有限公司 | Electron beam curing acrylate pressure-sensitive adhesive and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009084372A (en) * | 2007-09-28 | 2009-04-23 | Nippon Shokubai Co Ltd | Electron beam curable resin composition, layered product, and adhesive sheet or film |
| CN103419443A (en) * | 2013-08-16 | 2013-12-04 | 卢儒 | Double-sided reinforced mica tape with films and method for manufacturing double-sided reinforced mica tape |
| CN105719781A (en) * | 2016-04-05 | 2016-06-29 | 杭州世纪云母绝缘材料有限公司 | High temperature resistant powder mica tape containing high strength fibers |
| CN108115959A (en) * | 2017-12-22 | 2018-06-05 | 扬州新奇特电气有限公司 | A kind of environment-friendly type mica high molecular material composite band production method |
| CN110281604A (en) * | 2019-06-26 | 2019-09-27 | 中广核新奇特(扬州)电气有限公司 | A kind of production method of electronic beam curing production mica tape |
| CN110387210A (en) * | 2019-07-31 | 2019-10-29 | 中广核达胜加速器技术有限公司 | A kind of preparation method based on the cured adhesive of EB and the mica tape with it |
-
2021
- 2021-07-15 CN CN202110803096.5A patent/CN113681915A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009084372A (en) * | 2007-09-28 | 2009-04-23 | Nippon Shokubai Co Ltd | Electron beam curable resin composition, layered product, and adhesive sheet or film |
| CN103419443A (en) * | 2013-08-16 | 2013-12-04 | 卢儒 | Double-sided reinforced mica tape with films and method for manufacturing double-sided reinforced mica tape |
| CN105719781A (en) * | 2016-04-05 | 2016-06-29 | 杭州世纪云母绝缘材料有限公司 | High temperature resistant powder mica tape containing high strength fibers |
| CN108115959A (en) * | 2017-12-22 | 2018-06-05 | 扬州新奇特电气有限公司 | A kind of environment-friendly type mica high molecular material composite band production method |
| CN110281604A (en) * | 2019-06-26 | 2019-09-27 | 中广核新奇特(扬州)电气有限公司 | A kind of production method of electronic beam curing production mica tape |
| CN110387210A (en) * | 2019-07-31 | 2019-10-29 | 中广核达胜加速器技术有限公司 | A kind of preparation method based on the cured adhesive of EB and the mica tape with it |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115029085A (en) * | 2022-06-27 | 2022-09-09 | 赤壁凯利隆科技有限公司 | Electron beam curing acrylate pressure-sensitive adhesive and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3256542B1 (en) | Sealing mass based on mercapto-terminated base polymer/epoxy compound and method for hardening by means of a photolatent catalyst | |
| CN102432905B (en) | Modification method for using low-temperature plasma to initiate gas-phase grafting on surface of polyethylene film | |
| DE112005000992B4 (en) | Hydrous self-adhesive coating for electrical steel | |
| DE60218773T2 (en) | Method for producing a laminate | |
| CN108395558B (en) | Preparation method of transparent conductive film of high-transmittance nano silver wire | |
| CN109577077B (en) | Electron beam curing adhesive sticker release paper and manufacturing method thereof | |
| CN110387208B (en) | Electron beam curing composite adhesive, flexible packaging composite film and preparation method thereof | |
| CN113681915A (en) | Preparation method for producing double-sided film reinforced mica tape in electron beam curing mode | |
| CN110387210B (en) | EB (Epstein-Barr) curing-based adhesive and preparation method of mica tape with same | |
| DE10210661A1 (en) | Inductively hardenable and releasable connections | |
| CN112480808B (en) | UV-EB dual-curing coating and preparation method and application thereof | |
| CN106883653A (en) | A kind of ultraviolet moisture dual cure three-proofing coatings of LED and preparation method thereof | |
| JPS6014406B2 (en) | Method for manufacturing magnetic recording tape | |
| EP2847363B1 (en) | A process for application of metal | |
| CN108192042A (en) | A kind of controllable and reversible crosslink cashew resin and preparation method thereof | |
| US11845840B2 (en) | Polyphenol-modified hydrocarbon composition-based prepreg and copper clad laminate prepared therefrom | |
| JPS58162640A (en) | Coating composition for polyolefin plastic | |
| JPH0376776A (en) | Method of adjusting the peeling power of peel-off coating | |
| WO2020119898A1 (en) | Adhesive film that can be wound and stamped | |
| CN113480953B (en) | Solvent-free environment-friendly chemical power supply sealant and preparation method thereof | |
| TW201945478A (en) | Method for forming a solder mask layer on a circuit board using double liquid type solder mask ink | |
| CN113470906A (en) | Production process of electron beam curing mica tape | |
| CN110564318A (en) | process film production method capable of viewing UV viscosity reduction degree and product thereof | |
| CN109263388B (en) | Surface transfer printing processing method for packaging material | |
| CN115895548B (en) | Positive electrode plate UV delay type glue, preparation method and protection method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |