CN113671729B

CN113671729B - Dimming film, edge sealing method thereof, dimming assembly and vehicle

Info

Publication number: CN113671729B
Application number: CN202110749492.4A
Authority: CN
Inventors: 王加赋; 水方; 冯涛; 林寿; 郑国新; 毛祚水
Original assignee: Fuyao Glass Industry Group Co Ltd
Current assignee: Fuyao Glass Industry Group Co Ltd
Priority date: 2021-07-01
Filing date: 2021-07-01
Publication date: 2023-11-17
Anticipated expiration: 2041-07-01
Also published as: CN113671729A

Abstract

The application provides a dimming film, a sealing method thereof, a dimming assembly and a vehicle, wherein the dimming film comprises a first substrate, a functional layer and a second substrate which are sequentially stacked; and a sealing structure is arranged on the periphery of the functional layer, and the sealing structure is formed by coating the functional layer through a first substrate and a second substrate. The first substrate is subjected to local high-frequency friction near the processing die, and the materials of the local conducting layer and the functional layer are crushed and flow to two sides; after high-temperature melting, the first substrate is abutted against the second substrate, and the high-density dimming film edge sealing structure is formed after cooling and solidification, so that the peeling strength of the dimming film is effectively enhanced, and the overall strength is high. Meanwhile, short circuits can not occur on the first conductive layer and the second conductive layer, and the yield and the reliability of products are improved.

Description

Dimming film, edge sealing method thereof, dimming assembly and vehicle

Technical Field

The application relates to the technical field of vehicle spare and accessory parts, in particular to a dimming film, a sealing method thereof, a dimming assembly and a vehicle.

Background

Vehicles are one of the important transportation vehicles for humans. Part of the window glass of the vehicle has a dimming effect due to the addition of the dimming film, so that the driving environment is more comfortable and lighter and luxury. However, the local failure, particularly edge failure, of the dimming film is caused by the factors of plasticizer, water vapor in the environment and the like, and the edge sealing of the dimming film becomes a technical difficulty which must be overcome. In the dimming film manufactured by the prior art, when the dimming film is subjected to edge sealing, the sealing structure of the dimming film is easy to be unsealed, and only edge failure is slowed down and cannot be completely eliminated; the peeling strength is smaller, so that the dimming film after edge sealing is still easy to damage and the like.

Disclosure of Invention

The application discloses a dimming film edge sealing method, which can solve the technical problems that a sealing structure of a dimming film is not sealed and the peeling strength is smaller.

In a first aspect, the present application provides a light modulation film, where the light modulation film includes a first substrate, a functional layer, and a second substrate that are sequentially stacked; and a sealing structure is arranged on the periphery of the functional layer, and the sealing structure is formed by coating the functional layer through a first substrate and a second substrate.

The first substrate is subjected to local high-frequency friction near the processing die, and the materials of the local conducting layer and the functional layer are crushed and flow to two sides; after high-temperature melting, the first substrate is abutted against the second substrate, and a high-density dimming film sealing structure is formed after cooling and solidification, so that the peeling strength of the dimming film is effectively enhanced, and the overall strength is high. Meanwhile, short circuits can not occur on the first conductive layer and the second conductive layer, and the yield and the reliability of products are improved.

In a second aspect, the present application further provides a light modulation film, where the light modulation film includes a first substrate, a functional layer, and a second substrate that are sequentially stacked, the first substrate and the second substrate respectively include a substrate main body portion and a substrate edge portion, the functional layer is located between the substrate main body portions of the first substrate and the second substrate, and the substrate edge portion forms a sealing structure for covering the functional layer.

Optionally, the sealing structure is formed by mutually abutting and fusing the first substrate and the second substrate.

Optionally, at least one groove structure is provided at the outer edge of the dimming film, and the sealing structure is located at the groove structure.

Optionally, a filling part is arranged at one side of the groove structure, which is away from the sealing structure.

Optionally, the groove structure is formed by melting and shrinking the first substrate and/or the second substrate towards the direction of the functional layer.

Optionally, the groove structure extends through the outer peripheral edge of the functional layer, communicating with a surface of the functional layer adjacent the first substrate and/or a surface of the functional layer adjacent the second substrate.

Optionally, the groove structure comprises a step structure or a trench structure.

Optionally, a dam structure is reserved at the periphery of the groove structure, and the distance between the dam structure and the groove structure is 0.5mm-10mm.

Optionally, the longitudinal section of the sealing structure at the groove structure is V-shaped, U-shaped, W-shaped, M-shaped, X-shaped, I-shaped, II-shaped, III-shaped, or a combination of the foregoing.

Optionally, the functional layer includes a first conductive layer, a dimming layer and a second conductive layer that are sequentially stacked.

Optionally, the dimming film further comprises at least one opening.

In a third aspect, the present application further provides a method for edge sealing of a dimming film, where the method for edge sealing of a dimming film includes:

(1) Providing a dimming film, wherein the dimming film comprises a first substrate, a functional layer and a second substrate which are sequentially stacked;

(2) A processing die is arranged on one side, away from the functional layer, of the first substrate, and a bearing table is arranged on one side, away from the functional layer, of the second substrate;

(3) The die compresses the first substrate, and makes reciprocating vibration parallel to the direction of the die with the second substrate, and opposite to the bearing table along the horizontal direction parallel to the ground plane, so that local friction is generated on the functional layer, the local functional layer adjacent to the die is more easily crushed and pushed to two sides, and meanwhile, the first substrate and the second substrate are locally changed into a molten state near the die;

(4) The functional layer forms a groove structure under the action of local friction, and after the first substrate is mutually abutted with the second substrate in a high-temperature melting state, the first substrate is cooled and solidified to form a compact sealing structure;

(5) And forming at least one complete sealing structure in the periphery of the edge of the dimming film to finish edge sealing.

Optionally, the vibration frequency of the bearing table ranges from 20KHz to 40KHz.

Optionally, the mold comprises at least one concave-convex pattern parallel to the outer side of the mold, and the width of the concave-convex pattern on the mold ranges from 0.2mm to 10mm.

Optionally, the dimming film further includes a dam structure located at the periphery of the groove structure, and after the sealing is completed by forming at least one sealing structure on the inner periphery and the outer periphery of the dimming film, the dimming film sealing method further includes:

and cutting off the dam structure.

Optionally, before forming the groove structure, a filling portion is disposed on a surface of a side of the first substrate and/or the second substrate facing away from the functional layer.

Optionally, the thickness of the filling portion in the stacking direction ranges from 1/3 to 1/2 times the thickness of the first substrate or the second substrate in the stacking direction.

Optionally, after the groove structure is formed, a filling portion is disposed on a side of the groove structure facing away from the sealing structure.

In a fourth aspect, the present application further provides a dimming component, where the dimming component includes a first transparent plate, a second transparent plate, and the dimming film according to the first aspect, and the dimming film is sandwiched between the first transparent plate and the second transparent plate.

In a fifth aspect, the present application also provides a vehicle employing a dimmer pack as defined in the third aspect.

Drawings

For a clearer description of the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic top view of a light modulation film according to an embodiment (a) of the present application.

Fig. 2 is a schematic cross-sectional view taken along line I-I in fig. 1.

Fig. 3 is a side view of a seal edge of a first base tape filler according to embodiment (ii) of the present application.

Fig. 4 is a side view of a sealing structure for providing a first substrate melt-filled portion according to an embodiment (III) of the present application.

Fig. 5 is a schematic cross-sectional view of a multi-seal structure of a light modulation film according to the fourth embodiment of the present application.

Fig. 6 is a schematic view of a step structure according to the fifth embodiment of the present application.

Fig. 7 is a schematic top view of a light modulation film according to the sixth embodiment of the present application.

Fig. 8 is a schematic flow chart of a method for edge sealing of a dimming film according to the seventh embodiment of the present application.

Fig. 9 is a schematic diagram of a mold and a carrier according to an eighth embodiment of the application.

Fig. 10 is a schematic cross-sectional view of a dimming component according to an embodiment (nine) of the present application.

Fig. 11 is a schematic plan view of a vehicle according to an embodiment (ten) of the present application.

Description of the reference numerals: the light adjusting film comprises a light adjusting film-1, a first substrate-11, a filling part-111, a functional layer-12, a first conducting layer-121, a light adjusting layer-122, a second conducting layer-123, a second substrate-13, a substrate main body part-1 a, a substrate edge part-1 b, a groove structure-14, a sealing structure-15, a dam structure-16, a conducting piece-17, an opening-18, a mold-2, a mold-21, a bearing table-3, a light adjusting component-4, a first transparent plate-41, a second transparent plate-42, a connecting part-43, a vehicle-5 and a frame-51.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, based on the embodiments of the application, which a person of ordinary skill in the art would achieve without inventive faculty, are within the scope of the application.

The application provides a dimming film 1, please refer to fig. 1 and fig. 2 together, fig. 1 is a schematic top view of the dimming film according to the embodiment (a); fig. 2 is a schematic cross-sectional view taken along line I-I in fig. 1. The dimming film 1 comprises a first substrate 11, a functional layer 12 and a second substrate 13 which are sequentially stacked; a sealing structure 15 is arranged on the periphery of the functional layer 12; the sealing structure 15 is formed by wrapping the functional layer 12 with the first substrate 11 and the second substrate 13.

Note that, in order to better observe the overall structure and components of the light modulation film 1, the overall structure and components are shown in fig. 1 in a perspective form, and are not represented to be disposed on the first substrate 11. In the present embodiment, the functional layer 12 includes a first conductive layer 121, a light adjusting layer 122, and a second conductive layer 123, which are stacked in this order. When a voltage or a current is applied to the first conductive layer 121 and the second conductive layer 123, the dimming layer 122 is energized, and the dimming film 1 enters an energized state; when no voltage or current is applied to the first conductive layer 121 and the second conductive layer 123, the dimming layer 122 is powered off, and the dimming film 1 is in a powered off state. It will be appreciated that in other possible embodiments, the dimming film 1 may be controlled to adjust the power on/off state in other ways, which is not limited by the present application. It can be understood that the functional layer may have other functions besides light control, such as communication or display, and the function of not being suitable for dimming is limited.

The light modulation film 1 is a multi-layered composite structure capable of adjusting reflection or transmission properties of transmitted light, for example, polymer Dispersed Liquid Crystal (PDLC), suspended Particle Device (SPD), dichroic dye liquid crystal film (LC), electrochromic (EC) film, and the like. In this embodiment, taking the dimming film 1 as a PDLC as an example, when the functional layer 12 of the dimming film 1 is powered off, the haze of the dimming film 1 is large, and when light passes through the dimming film 1, most of the light is blocked by the functional layer 12, so that the dimming film 1 is in an opaque state when the power is off; when the functional layer 12 of the light modulation film 1 is energized, the functional layer 12 becomes transparent, no light is blocked, and most of the light penetrates through the light modulation film 1, so that the light modulation film 1 is in a transparent state when energized.

The functional layer 12 is sensitive to the environment and the gas around the membrane, such as moisture or plasticizer, so that the membrane at the peripheral portion of the functional layer loses its light-adjusting ability and may be continuously deteriorated with time and temperature, so that the functional layer 12 needs to be subjected to edge sealing treatment to form the sealing structure 15, thereby effectively protecting the functional layer 12. Preferably, the sealing structure 15 is formed entirely enclosed at the outer periphery of the outer edge of the dimming film 1.

It can be understood that in the first embodiment (a), the first substrate 11 and the second substrate 13 are rubbed locally at high frequency near the processing mold, and the material of the local conductive layer and the functional layer 12 between the two substrates is crushed and flows to both sides; after high-temperature melting, for example, 250-300 ℃, the first substrate 11 is abutted against the second substrate 13, and the high-density dimming film sealing structure 15 is formed after cooling and solidifying, so that the water absorption rate of the functional layer is less than 1%, the peeling strength of the dimming film 1 is effectively enhanced, and the overall mechanical strength is high. Meanwhile, the first and second conductive layers 121 and 123 do not have a short circuit, and the yield and reliability of the product are improved.

Alternatively, referring to fig. 2 again, the light modulation film 1 includes a first substrate 11, a functional layer 12, and a second substrate 13 stacked in sequence, where the first substrate 11 and the second substrate 13 include a substrate main body portion 1a and a substrate edge portion 1b, respectively, the substrate main body portion 1a and the substrate edge portion 1b are used for holding or clamping the functional layer 12, and the substrate edge portion 1b forms a sealing structure for covering the functional layer 12.

In the present embodiment (one), the total thickness of the first substrate 11 and the first conductive layer 121 in the lamination direction is about 187 μm, and the thickness of the light adjusting layer 122 in the lamination direction is about 11 μm, that is, the total thickness of the light adjusting film 1 in the lamination direction is about 385 μm, as the total thickness of the second substrate 13 and the second conductive layer 123 in the lamination direction is the same. In the present embodiment, the length of the groove structure 14 in the stacking direction is about 270 μm, and in other possible embodiments, the length of the groove structure 14 in the stacking direction may be changed due to a change in actual operation.

The thickness of the first conductive layer 121 and the second conductive layer 123 in the stacking direction is small, the thickness is typically in the order of several hundred nm, and the thickness is much lower than 5 μm, and the bonding with the first substrate 11 and the second substrate 13 is very tight, so that the first conductive layer 121 and the second conductive layer 123 can be regarded as a part of the first substrate 11 or the second substrate 13 in the stacking direction in the present application. The material in the dimming layer 122 at the groove structure 14 is extruded, thereby exhibiting a transparent or translucent state of the groove structure. In one possible embodiment, the sealing structure 15 is integrally formed with the first substrate 11 and/or the second substrate 13.

In particular, in one possible embodiment, the sealing structure 15 is formed by melt-shrinking the first substrate 11 and/or the second substrate 13 in the direction of the functional layer 12.

Specifically, in this embodiment, the longitudinal section of the portion of the groove structure 14 located on the first substrate 11 is a trapezoid, and in other possible embodiments, the longitudinal section of the groove structure 14 may also be rectangular, oval, etc., which is not limited in the present application.

The groove structures 14 extend through the functional layer 12, communicating with a surface of the functional layer 12 adjacent to the first substrate 11 and/or a surface of the functional layer 12 adjacent to the second substrate 13. The first substrate 11 in a high temperature molten state flows toward the second substrate 13 through the groove structure 14 due to the gravity and fills the groove structure 14 to form the sealing structure 15. It will be appreciated that in other possible embodiments, it is also possible that the second substrate 13 in a molten state at a high temperature flows through the groove structure 14 towards the first substrate 11 due to the action of gravity; it is also possible that the first substrate 11 and the second substrate 13 are simultaneously filled with the groove structures 14, which is not limited in the present application.

In the present embodiment, the sealing structure 15 is formed by melt-shrinking the first substrate 11 toward the functional layer 12, and then at least a portion of the side of the first substrate 11 facing away from the functional layer 12 is recessed.

In order to avoid this problem, please refer to fig. 3, fig. 3 is a schematic diagram illustrating a raised first substrate according to the second embodiment of the present application. Specifically, before the groove structure 14 is formed, a raised portion is pre-filled in a portion corresponding to the first substrate 11 to form a filling portion 111, after the first substrate 11 melts and flows into the groove structure 14, and is cooled and solidified, the filling portion 111 may supplement the portion of the first substrate 11 that is recessed, and after the melting, the side of the first substrate 11 facing away from the functional layer 12 is relatively flat. In the present embodiment, the thickness of the filling portion 111 in the stacking direction is in the range of 1/3 to 1/2 times the thickness of the first substrate 11 or the second substrate 13 in the stacking direction.

In other possible embodiments, please refer to fig. 4, fig. 4 is a schematic diagram of a filling first substrate according to an embodiment (iii) of the present application. The difference between the third embodiment and the second embodiment is that the filling portion 111 is filled in the portion of the first substrate 11 that is recessed while the groove structure 14 is formed, so that a surface of a side of the first substrate 11 facing away from the functional layer 12 is relatively flat. The groove structure 14 is substantially vanishing in appearance, and is more aesthetically pleasing, although at an increased cost. In particular, when the light adjusting film 1 is applied to, for example, a borderless window (but not limited thereto), it is preferable to consider that such a groove structure 14 is formed while the sealing structure 15 is "filled up" with the filling portion 111. The material of the filling portion 111 and the material of the first substrate 11 may be the same or different; the "filling" may be substantially filling, that is, the base body portion is substantially flush with the upper surface of the filling portion, or may be completely filling, that is, the base body portion is flush with the upper surface of the filling portion. It will be appreciated that the groove structures 14 may be formed first and then the sealing structures 15 may be "filled" with the filling portions 111.

In one possible embodiment, please refer to fig. 2 and fig. 5 together, fig. 5 is a schematic cross-sectional view of a dimming film according to an embodiment (four) of the present application. The longitudinal section of the sealing structure 15 at the groove structure 14 is of the U-shape or the I-shape or the II-shape or the III-shape or a combination of the foregoing.

Specifically, as shown in fig. 2, the longitudinal section of the sealing structure 15 at the groove structure 14 is in a U shape; as shown in fig. 5, the sealing structure 15 is of type III in longitudinal section at the groove structure 14. It is understood that the sealing structure 15 of type III and the first substrate 11 and the second substrate 13 can be regarded as having 6 force contact surfaces, and the sealing structure 15 of type U and the first substrate 11 and the second substrate 13 can be regarded as having 2 force contact surfaces. Thus, the seal 15 of type III provides greater peel strength than the seal 15 of type U, all other things being equal. On the other hand, the U-shaped sealing structure 15 is simpler and more convenient to manufacture than the III-shaped sealing structure 15.

It will be appreciated that the peel strength of the light control film 1 is adjusted differently depending on the shape of the sealing structure 15. Figures 2 and 5 of the present application are only some of the possible embodiments and are not intended to limit the shape of the seal 15. In other possible embodiments, the sealing structure 15 may be of other shapes, as well, without limitation of the application.

In one possible embodiment, referring again to fig. 1, the recess structure 14 includes a stepped or grooved structure. When the groove structure 14 is a groove structure, a dam structure 16 is disposed at the periphery of the groove structure 14, the dam structure 16 completely electrically isolates the groove peripheral dimming film 1 from the groove inner ring dimming film 1, and the distance between the dam structure 16 and the groove structure 14 is 0.5mm-10mm.

Note that, the dam structure 16 includes a part of the first substrate 11, the functional layer 12, and the second substrate 13 that are sequentially stacked, but after the edge sealing of the dimming film 1 is completed, the dam structure 16 loses the dimming effect and serves as a further protection for the sealing structure 15.

In this embodiment, the distance between the dam structure 16 and the groove structure 14 is in the range of 0.5mm to 10mm, preferably, the distance between the dam structure 16 and the groove structure 14 is in the range of 3mm to 7mm, specifically, the distance between the dam structure 16 and the groove structure 14 may be 5.1mm, 5.7mm, 6.4mm, etc., which is not limited in the present application.

Referring to fig. 6, fig. 6 is a schematic diagram of a step structure provided in the fifth embodiment of the present application when the recess structure 14 is a step structure. The dam structure 16 in the groove structure 14 is cut away to form the dimming film 1 with little to no area for dimming to meet the emerging borderless dimming laminated glass or other component, structural manufacturing needs.

In one possible embodiment, referring to fig. 1 again, the dimming film 1 further includes a conductive member 17, and the conductive member 17 is electrically connected to the first conductive layer 121 and the second conductive layer 123, respectively. The conductive member 17 is configured to transmit a current to the first conductive layer 121 and the second conductive layer 123, so that the dimming film 1 enters an energized state. It can be appreciated that when the conductive member 17 stops transmitting current to the first conductive layer 121 and the second conductive layer 123, the light modulation film 1 enters a power-off state.

In one possible embodiment, please refer to fig. 7, fig. 7 is a schematic top view of a dimming film according to an embodiment (sixth) of the present application. The light modulation film 1 further comprises at least one opening 18, and the opening 18 may be opened in a direction approximately perpendicular to the stacking direction of the light modulation film 1.

Specifically, the opening 18 is opened in a direction indicated by an arrow in fig. 7. In the sixth embodiment, the opening 18 is formed in a U shape, and in other possible embodiments, the opening 18 may be formed in a V shape or other shapes, and the dimensions may be different, which is not shown in the drawings, and the shape of the opening 18 is not limited in the present application. It should be noted that the opening is preferably formed before the edge sealing of the light modulation film.

In the prior art, many glasses, such as front glass, door glass, sunroof glass, etc., of a vehicle have a hyperbolic spherical shape. Therefore, a flat membrane cannot be spread after being molded on the hyperbolic spherical glass, and more folds are generated.

It can be appreciated that in the sixth embodiment, at least one opening 18 is formed in the periphery of the light modulation film 1, so that the formed opening 18 area of the light modulation film 1 is hidden under the black edge of the light modulation film 1, and at the same time, wrinkles can be effectively avoided. And then the opening 18 area and the periphery of the dimming film 1 are subjected to edge sealing, so that the functional layer 12 of the dimming film 1 can be isolated from the outside, and the influence of outside water vapor and plasticizer is avoided.

Next, a method for edge sealing of the light modulation film 1 according to the present application will be described. The application also provides a dimming film edge sealing method, please refer to fig. 8, fig. 8 is a schematic flow chart of the dimming film edge sealing method according to the embodiment (seventh) of the application. The edge sealing method of the dimming film comprises steps S801, S802, S803, S804 and S805, and the steps S801, S802, S803, S804 and S805 are described in detail below.

S801, a dimming film is provided, wherein the dimming film comprises a first substrate, a functional layer and a second substrate which are sequentially stacked;

specifically, the light adjusting film 1 is described above, and will not be described herein.

S802, a processing die is arranged on one side, away from the functional layer, of the first substrate, and a bearing table is arranged on one side, away from the functional layer, of the second substrate;

specifically, referring to fig. 9 together, fig. 9 is a schematic diagram of a mold and a carrier according to an eighth embodiment of the application. In this embodiment, the mold 2 has a circular wheel shape and abuts against the first substrate 11. When the die 2 starts to press the first substrate 11, the bearing table vibrates at high frequency, and a part of the functional layer, which is in contact with the die 2, of the first substrate 11 is crushed and pushed to two sides of the die 2; then the first substrate and the second substrate are directly rubbed and melted at high temperature; completing edge sealing of the submillimeter membrane in a submillimeter time; the round wheel continues to rotate at uniform speed, and the process is repeated at a new position. Thus, the edge sealing work is continuously carried out until the peripheral full-closed complete edge sealing is completed.

The carrying table 3 may be a round anvil with a flat surface, and is abutted against the second substrate 13 and used for carrying the light modulation film 1. When the die 2 rolls, the die 2 is further used for driving the light modulation film 1 to do translational motion on the bearing table 3 along the rolling direction of the die 2 so as to polish different parts of the light modulation film 1.

S803, the die compresses the first substrate, and makes reciprocating vibration opposite to the bearing table along the horizontal direction parallel to the ground plane in parallel with the direction of the die with the second substrate, so as to generate local friction on the functional layer;

specifically, when the die 2 polishes the first substrate 11, the first substrate 11 and the functional layer 12 generate local friction due to continuous vibration and displacement, meanwhile, the bearing table 3 vibrates at high frequency along the direction parallel to the die 2 and drives the second substrate 13 to vibrate and displace, so that the second substrate 13 and the functional layer 12 generate local friction, the local friction heating temperature is increased, the local functional layer adjacent to the die is more easily crushed and pushed to two sides, and meanwhile, the first substrate and the second substrate locally become molten states near the die;

in this embodiment, since the structural strength of the light adjusting layer 122 is weaker than that of the first conductive layer 121 and the second conductive layer 123, the light adjusting layer 122 in the functional layer 12 is firstly rubbed and removed by the local rubbing action of the first substrate 11 and the second substrate 13, and is pushed and collected by the mold 2 on both sides of the polishing direction of the mold 2. Further, the first conductive layer 121 and the second conductive layer 123 are rubbed and torn against each other, and are pushed and collected by the die 2 on two sides of the die 2 in the polishing direction, so as to form the groove structure 14.

S804, forming a groove structure by the functional layer under the action of local friction, and cooling and solidifying the first substrate and the second substrate to form a compact sealing structure after the first substrate and the second substrate are mutually abutted in a high-temperature melting state;

the first substrate 11 and the second substrate 13 are rapidly heated by continuous local friction, and after the softening temperature is passed, they reach a melting temperature and are then melted locally. The melted portion of the first substrate 11 flows toward the second substrate 13 due to gravity and is integrated with the melted portion of the second substrate 13 to form a groove structure. After the melted portions of the first substrate 11 and the second substrate 13 cool and solidify, the sealing structure 15 is formed, and the sealing structure 15 is firmly connected to the first substrate 11 and the second substrate 13, so as to enhance the peel strength of the overall structure of the dimming film 1.

The peel strength is the maximum force required for peeling the bonded materials from the contact surface per unit width. For example, in the present embodiment, before the sealing structure 15 is formed, the peeling strength of the light modulation film 1 at the peeling angle of 180 ° is 0.059N (newton)/mm; after the sealing structure 15 is formed, the peeling strength at the sealing structure 15 is 2.5N/mm under the same peeling angle, and the peeling strength is improved by 50 times.

In the present embodiment, the polishing speed of the die 2, the vibration frequency of the carrier 3, and other parameters are adjusted so that the process of step S804 is completed within 0.01 to 100 milliseconds. It can be appreciated that, for example, the polishing speed of the die 2 is increased, and the vibration frequency of the carrying table 3 is increased, so that the time consumption of the process of step S804 can be shortened; vice versa, slowing down the polishing speed of the die 2 and reducing the vibration frequency of the carrying table 3 can prolong the time consumption of the process of step S804, and the application is not limited thereto and can be adjusted according to practical situations.

S805, forming at least one complete sealing structure in the peripheral edge of the dimming film, and completing edge sealing.

Specifically, in this embodiment, the die 2 may be rolled to drive the light-adjusting film 1 to move, so that the above steps are repeated at different positions of the light-adjusting film 1, so that a plurality of continuous sealing structures 15 may be formed, and the continuous sealing structures 15 form a whole, and communicate with two opposite side boundaries of the light-adjusting film 1 perpendicular to the stacking direction, so as to complete edge sealing. In other possible embodiments, the above steps may be repeated on the other side of the light modulation film 1, to form another sealing structure 15 communicating with the opposite side boundaries of the light modulation film 1 perpendicular to the lamination direction. It will be appreciated that the functional layer 12 between adjacent sealing structures 15 is protected by the sealing structures 15 from damage to the functional layer 12 by external environmental gases or solvents.

In this embodiment, the sealing structure 15 is substantially transparent or translucent. When the dimming film 1 is in a power-off state, the PDLC is an opaque film with high haze, and the SPDs and the EC are films with colors. Therefore, the edge sealing method of the dimming film provided by the application has high visualization degree, and the integrity and reliability of edge sealing can be judged according to the characteristics of the dimming film 1, such as the transparency degree of the sealing structure 15.

It can be appreciated that, in the present embodiment, the first substrate 11 flows into and fills the groove structure 14 after being melted at a high temperature, so that the first substrate 11 forms the sealing structure 15 after being cooled and solidified, and the sealing structure 15 is firmly connected to the second substrate 13, so as to enhance the peel strength of the light modulation film 1. Meanwhile, the surface structure of the dimming film 1 is uniform, the overall strength is high, and the dimming film is not easy to damage.

In one possible embodiment, the distance between the die 2 and the carrier 3 is smaller than the thickness of the light modulation film 1 in the lamination direction.

Specifically, the distance between the die 2 and the carrying table 3 is smaller than the thickness of the light modulation film 1 in the stacking direction, so that the carrying table 3 causes the extrusion force to the second substrate 13 while the die 2 causes the extrusion force to the first substrate 11, that is, the light modulation film 1 is sandwiched between the die 2 and the carrying table 3.

It will be appreciated that the smaller the distance between the mould 2 and the carrier 3, the greater the pressing force of the mould 2 against the first substrate 11 and the greater the pressing force of the carrier 3 against the second substrate 13. Although the smaller the distance between the die 2 and the carrier 3 is, the better the local friction effect of the first substrate 11 and the second substrate 13 on the functional layer 12 is, the smaller the distance between the die 2 and the carrier 3 is not required to be in order to avoid damage to the light modulation film 1 caused by the extrusion force of the die 2 and the carrier 3. In the present embodiment, the difference between the thickness of the light modulation film 1 in the lamination direction and the distance between the mold 2 and the stage 3 should be a strength threshold value, and the strength threshold value may be changed according to the hierarchical structure and the material of the light modulation film 1, which is not limited in the present application.

In one possible embodiment, the carrier 3 generates high frequency vibrations with a frequency in the range of 20KHz-40KHz.

Specifically, the bearing table 3 generates high-frequency vibration to drive the second substrate 13 to vibrate, so as to generate local friction with the functional layer 12. It will be appreciated that the frequency of vibration of the carrier 3 affects the degree of local friction of the second substrate 13 with the functional layer 12.

In this embodiment, the vibration frequency of the carrying platform 3 is in the range of 20KHz-40KHz, preferably, the vibration frequency of the carrying platform 3 is in the range of 27KHz-36KHz. Specifically, the vibration frequency of the bearing table 3 may be 29KHz, 31KHz, or 35KHz, which is not limited in the present application.

In one possible embodiment, the mold 2 includes at least one mold 21 surrounding the outside of the mold 2, and the width of the mold 21 surrounding the mold 2 ranges from 0.2mm to 10mm.

Specifically, the die 2 polishes the first substrate 11, mainly because the die 21 generates local friction with the first substrate 11, that is, the formation and shape of the groove structure 14 are related to the die 21. The width of the mold 21 enclosed on the mold 2 directly influences the aperture size of the groove structure 14. In this embodiment, the width of the mold 21 enclosed on the mold 2 is in the range of 0.2mm to 10mm, preferably, the width of the mold 21 enclosed on the mold 2 is in the range of 0.5mm to 3mm, more preferably, the width of the mold 21 enclosed on the mold 2 is in the range of 0.8mm to 2.6mm, specifically, the width of the mold 21 enclosed on the mold 2 may be 1mm, 1.5mm, 2.0mm, etc., as long as the melted portion of the groove structure 14 passing through the first substrate 11 or the second substrate 13 is not affected, which is not limited by the present application.

As shown in fig. 9, when the number of the molds 21 is equal to or greater than two, the plurality of molds 21 are arranged at intervals, so that the groove structures 14 with different shapes can be formed, and the sealing structures 15 with different shapes can be formed. It should be noted that, the plurality of molds 21 may be at least one mold 21 generating a local friction with the first substrate 11, and another mold 21 generating a local friction with the second substrate 13. It will be appreciated that the shape of the mould 21 will affect the shape of the groove structure 14. The mold 21 may also be single and include at least one simple pattern parallel to the outside of the mold, such as rectangular, circular, etc., or may be various complex patterns, such as laces, serrations, tire textures, etc., to make the shape of the sealing structure 15 ultimately formed in the groove structure 14 more attractive. The groove structure may be single-pass, double-pass, or multi-pass. More than two passes, it is preferred that at least one pass be continuous and complete. In addition, the mold 21 may have a special shape, and may have one or more teeth (such as similar to a tire texture), and the teeth may be continuous, discontinuous, or staggered, so as to facilitate forming the sealing structure 15 with a relatively strong peel strength and edge sealing strength, which is not limited in the present application.

In a possible embodiment, the groove structures 14 extend through the functional layer 12, communicating with a surface of the functional layer 12 adjacent to the first substrate 11 and/or a surface of the functional layer adjacent to the second substrate 13.

In a possible embodiment, referring again to fig. 7, the groove structure 14 includes a step structure or a groove structure, and after the step of forming at least one sealing structure in the dimming film and completing the edge sealing, the method for edge sealing the dimming film further includes step S806, and the detailed description of step S806 is as follows.

S806, cutting off the dam structure of the groove structure to form the step structure. Specifically, the dam structure 16 may be cut away, especially when manufacturing a borderless dimming laminated glass without printed black edges (but not limited to this), so as to reduce the occupied volume of the dimming film 1, so that the dimming film 1 may be integrated into a laminated glass or other components or structures with fewer non-dimming edges.

In one possible embodiment, the material of the mold 2 is a metal material. Specifically, the mold 2 is made of metal, and the metal generally has better heat dissipation and strength. It can be appreciated that, on the one hand, when the first substrate 11 is processed by the mold 2, a larger amount of heat is generated due to friction, and when the mold 2 is made of metal, the mold 2 can better dissipate heat, so as to be beneficial to continuous operation; on the other hand, the mold 2 needs a certain strength to process the first substrate 11, and in general, the metal material has a relatively high strength to facilitate the mold 2 to process the first substrate 11.

In a possible embodiment, referring again to fig. 2, the recess structure 14 penetrates the functional layer 12, and communicates with a surface of the functional layer 12 adjacent to the first substrate 11 and/or a surface of the functional layer 12 adjacent to the second substrate 13.

Specifically, the groove structure 14 communicates the surface of the functional layer 12 adjacent to the first substrate 11 with the surface of the functional layer 12 adjacent to the second substrate 13, so that a fault structure is formed on one side of the first conductive layer 121, the dimming layer 122, and the second conductive layer 123 adjacent to the groove structure 14. It should be noted that in the prior art, a laser or a mechanical device may be used to cut the dimming film 1, so that the first conductive layer 121 and the second conductive layer 123 often have a short circuit phenomenon, and a step of breakdown a short circuit portion with a high voltage is also required.

It can be appreciated that in this embodiment, the first conductive layer 121, the dimming layer 122, and the second conductive layer 123 form a fault structure adjacent to one side of the groove structure 14, so that the problem that the first conductive layer 121 and the second conductive layer 123 may have a short circuit is avoided, and the manufacturing steps of the dimming film 1 are saved.

In one possible embodiment, the thickness of the first substrate 11 and the second substrate 13 in the stacking direction ranges from 30 μm to 200 μm, the functional layer 12 includes a first conductive layer 121, a dimming layer 122, and a second conductive layer 123 that are sequentially stacked, the thickness of the first conductive layer 121 and the second conductive layer 123 in the stacking direction ranges from 0.1 μm to 5 μm, the sheet resistance ranges from 5Ω to 200Ω/≡, and the thickness of the dimming layer 122 in the stacking direction ranges from 1 μm to 20 μm.

In order to avoid excessive thickness of the entire glass, the thickness of the first substrate 11 and the second substrate 13 in the lamination direction is preferably in the range of 30 μm to 200 μm, and the thickness of the first substrate 11 and the second substrate 13 in the lamination direction is preferably in the range of 45 μm to 185 μm, and specifically, the thickness of the first substrate 11 and the second substrate 13 in the lamination direction may be 50 μm, 100 μm, 180 μm, or the like, which is not limited in the present application.

Specifically, the thickness of the first conductive layer 121 and the second conductive layer 123 in the stacking direction may be in a range of 0.1 μm to 5 μm, and preferably, the thickness of the first conductive layer 121 and the second conductive layer 123 in the stacking direction may be in a range of 0.5 μm to 3 μm, and specifically, the thickness of the first conductive layer 121 and the second conductive layer 123 in the stacking direction may be in a range of 1 μm, 1.7 μm, 2.4 μm, and the like. It will be appreciated that in other possible embodiments, the thicknesses of the first conductive layer 121 and the second conductive layer 123 in the stacking direction may also be different, which is not limited by the present application.

In the present embodiment, when the light control film 1 is a PDLC, the thickness of the light control layer 122 in the lamination direction is in the range of 10 μm to 20 μm; when the dimming film 1 is SPD or EC, the thickness of the dimming layer 122 in the lamination direction is in the range of 1 μm to 20 μm. Preferably, the thickness of the light modulation layer 122 in the stacking direction ranges from 4 μm to 18 μm, and specifically, the thickness of the light modulation layer 122 in the stacking direction may be 7 μm, 9 μm, 13 μm, etc., which is not limited in the present application.

In one possible embodiment, the material of the first substrate 11 and the second substrate 13 is any one of PET, PMMA, PC.

Specifically, polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and Polycarbonate (PC) are all polymer materials having excellent thermoplasticity. Preferably, the first substrate 11 and the second substrate 13 are made of PET. It can be appreciated that the first substrate 11 and the second substrate 13 are made of polymer materials with excellent thermoplasticity, so that the first substrate 11 and the second substrate 13 are better melted under the action of local friction, and are integrated with each other through the groove structure 14, and the sealing structure 15 is formed after cooling and solidifying.

It will be appreciated that in other possible embodiments, the materials of the first substrate 11 and the second substrate 13 may be other materials, so long as the formation of the sealing structure 15 is not affected, which is not limited by the present application.

The application also provides a dimming component 4, please refer to fig. 10, fig. 10 is a schematic cross-sectional view of the dimming component according to the embodiment (nine) of the application. The light modulation component 4 comprises a first transparent plate 41, a second transparent plate 42 and the light modulation film 1 as described above, wherein the light modulation film 1 is clamped between the first transparent plate 41 and the second transparent plate 42.

Specifically, the light adjusting film 1 is described above, and will not be described herein. The dimming component 4 generally further comprises a connection part 43, the first transparent plate 41 is connected with the first substrate 11 of the dimming film 1 through the connection part 43, and the second transparent plate 42 is connected with the second substrate 13 of the dimming film 1 through the connection part 43. The first transparent plate or the second transparent plate may be made of inorganic glass, organic glass, or a mixture of both.

In the present embodiment, the connection portion 43 is made of polyvinyl alcohol Ding Quanzhi (PVB). It can be appreciated that the dimming film 1 is applied to the dimming component 4, has a strong peel strength, and the dimming film 1 can be firmly fixed in the dimming component 4. The hierarchy of the dimming film 1 is uniform, the overall strength is high, the dimming film is not easy to damage, and the dimming assembly 4 is attractive.

It should be noted that, in the prior art, the adhesive layer, such as PVB, in the dimming component often needs to be added with a plasticizer or the like to improve the performance of the polymer material, and when the dimming film is a PDLC material, the plasticizer or the like can cause the portion about 3-15mm of the outer periphery of the dimming film to lose the dimming function, i.e. to become transparent and not have the dimming effect, and further diffuse with the increase of time. Even if no plasticizer is used, such as EVA lamination, the high temperature condition may deteriorate by 2-12 mm. After edge sealing, the prior art dimming film also needs to pass a 1000-hour heat aging test at a high temperature of 110 ℃. Experiments show that the dimming film manufactured by the dimming film edge sealing method provided by the application has the advantages that the dimming function is lost only at the part with the outer periphery of about 1mm and even not more than 0.9mm, the problem of further diffusion is avoided, and compared with the prior art, the dimming film has the technical effects of great improvement and better.

The application also provides a vehicle 5, referring to fig. 11, fig. 11 is a schematic top view of the vehicle according to the embodiment (ten) of the application. The vehicle 5 employs a dimmer pack 4 comprising as described above.

In general, the vehicle 5 further includes a frame 51, and the dimming component 4 is mounted on the frame 51 in a bearing manner. Specifically, the dimming component 4 is described above, and will not be described herein.

The principles and embodiments of the present application have been described herein with reference to specific examples, the description of the above embodiments being only for the purpose of aiding in the understanding of the core concept of the present application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.

Claims

1. The dimming film is characterized by comprising a first substrate, a functional layer and a second substrate which are sequentially stacked; a sealing structure is arranged on the periphery of the functional layer, and the sealing structure is formed by wrapping the functional layer through a first substrate and a second substrate; at the outer edge of the dimming film, the functional layer forms a groove structure under the action of local friction, and the sealing structure is positioned at the groove structure; the sealing structure is formed by mutually abutting and fusing the first substrate and the second substrate towards the direction of the functional layer.

2. The dimming film is characterized by comprising a first substrate, a functional layer and a second substrate which are sequentially stacked, wherein the first substrate and the second substrate respectively comprise a substrate main body part and a substrate edge part, the functional layer is positioned between the substrate main body part of the first substrate and the substrate main body part of the second substrate, and the substrate edge part forms a sealing structure for coating the functional layer; at the outer edge of the dimming film, the functional layer forms a groove structure under the action of local friction, and the sealing structure is positioned at the groove structure; the sealing structure is formed by mutually abutting and fusing the first substrate and the second substrate towards the direction of the functional layer.

3. A dimming film as claimed in claim 1 or 2, wherein a side of the groove structure facing away from the sealing structure is provided with a filling portion.

4. The dimming film according to claim 1 or 2, wherein the groove structure is formed by melt-shrinking the first substrate and/or the second substrate toward the functional layer.

5. A dimming film according to claim 1 or 2, wherein the groove structure extends through the peripheral edge of the functional layer communicating with a surface of the functional layer adjacent the first substrate and/or a surface of the functional layer adjacent the second substrate.

6. A dimming film as claimed in claim 1 or 2, wherein the groove structure comprises a step structure or a groove structure.

7. The dimming film as claimed in claim 6, wherein a dam structure is provided at a periphery of the groove structure, the dam structure being spaced from the groove structure by a distance ranging from 0.5mm to 10mm.

8. The dimming film according to claim 1 or 2, wherein a longitudinal section of the sealing structure at the groove structure is at least one of V-shape or U-shape or W-shape or M-shape or X-shape or I-shape or II-shape or III-shape.

9. The light control film according to claim 1 or 2, wherein the functional layer includes a first conductive layer, a light control layer, and a second conductive layer which are stacked in this order.

10. The dimming film according to claim 1 or 2, wherein the dimming film further comprises at least one opening.

11. The dimming film edge sealing method is characterized by comprising the following steps of:

(3) The die compresses the first substrate, is parallel to the direction of the die with the second substrate, and is in reciprocating vibration opposite to the bearing table along the horizontal direction parallel to the ground plane, so that local friction is generated on the functional layer, the local functional layer adjacent to the die is more easily crushed and pushed to two sides, and meanwhile, the first substrate and the second substrate are locally changed into a molten state near the die;

(4) The functional layer forms a groove structure under the action of local friction, and the first substrate is mutually abutted with the second substrate in a high-temperature melting state and then cooled and solidified to form a sealing structure;

(5) And forming at least one complete sealing structure in the peripheral edge of the dimming film to finish edge sealing.

12. The method of edge sealing a dimmer film of claim 11, wherein the frequency of vibration ranges from 20KHz to 40KHz.

13. The method of edge banding a light directing film as defined in claim 11, wherein said mold includes at least one relief pattern parallel to the outside of said mold, said relief pattern having a width on said mold in the range of 0.2mm to 10mm.

14. The dimming film edge banding method of claim 11, wherein the groove structure extends through the peripheral edge of the functional layer communicating with a surface of the functional layer adjacent the first substrate and/or a surface of the functional layer adjacent the second substrate.

15. The method of sealing a edge of a light-adjusting film according to claim 11, wherein the light-adjusting film further comprises a dam structure located at the periphery of the groove structure, and after the sealing is completed by forming at least one complete sealing structure in the peripheral edge of the light-adjusting film, the method further comprises:

and cutting off the dam structure.

16. The method of edge sealing of a light directing film of claim 11, wherein a side surface of the first substrate and/or the second substrate facing away from the functional layer is provided with a filler prior to forming the groove structure.

17. The method of edge sealing of a light adjusting film according to claim 16, wherein a thickness of the filling portion in a lamination direction is in a range of 1/3 to 1/2 times a thickness of the first substrate or the second substrate in the lamination direction.

18. The method of sealing a light directing film as defined in claim 11, wherein a filler is provided on a side of the groove structure facing away from the sealing structure after or simultaneously with forming the groove structure.

19. A light modulating assembly comprising a first transparent plate, a second transparent plate and a light modulating film according to any one of claims 1-10, wherein the light modulating film is located between the first transparent plate and the second transparent plate.

20. A vehicle employing a dimmer pack as claimed in claim 19.