CN113656903B - Evaluation and control method for cutting residual stress of diamond abrasive particles - Google Patents
Evaluation and control method for cutting residual stress of diamond abrasive particles Download PDFInfo
- Publication number
- CN113656903B CN113656903B CN202110815855.XA CN202110815855A CN113656903B CN 113656903 B CN113656903 B CN 113656903B CN 202110815855 A CN202110815855 A CN 202110815855A CN 113656903 B CN113656903 B CN 113656903B
- Authority
- CN
- China
- Prior art keywords
- cutting
- abrasive grain
- diamond abrasive
- residual stress
- abrasive particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
- G06F30/17—Mechanical parametric or variational design
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/25—Design optimisation, verification or simulation using particle-based methods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/14—Force analysis or force optimisation, e.g. static or dynamic forces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Evolutionary Computation (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Pure & Applied Mathematics (AREA)
- Mathematical Optimization (AREA)
- Mathematical Analysis (AREA)
- Computational Mathematics (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a method for evaluating and controlling cutting residual stress of diamond abrasive particles in a micro-element mode. The method comprises the following steps: three-dimensional data acquisition is carried out on the diamond abrasive particles for processing to obtain three-dimensional point cloud data of the diamond abrasive particles; converting the three-dimensional point cloud data of the diamond abrasive particles into a three-dimensional space entity; performing infinitesimal treatment on the three-dimensional entity of the diamond abrasive particle, and dividing the abrasive particle into a plurality of abrasive particle cutting infinitesimal elements; measuring structural parameters of each abrasive grain cutting action primordia; calculating the cutting residual stress generated in the cutting process of each abrasive grain cutting action primordia under a given cutting depth, further calculating the cutting residual stress generated by the whole diamond abrasive grain, and carrying out comprehensive evaluation; and screening out the optimal combination mode of the negative rake angle, the relief angle and the top end area according to the comprehensive evaluation result, and guiding the diamond abrasive particle to be trimmed. Compared with the traditional calculation method of equivalent abrasive particles into spheres or cones, the accuracy of the method is greatly improved.
Description
Technical Field
The invention relates to the field of grinding wheel manufacturing production, in particular to a diamond abrasive particle micro-element cutting residual stress evaluation and control method.
Background
In the mechanical manufacturing process, grinding is a very important machining mode, and can be used for machining and manufacturing workpieces with high precision and low surface roughness, and the machinable materials include, but are not limited to, hard and brittle materials, metals and the like, so that the machining method has various application scenes.
In the process of processing a workpiece by using abrasive particles, mainly used tools are mainly various grinding wheels, and different from turning, milling and the like, the abrasive particles are produced in batches in industrialization, various differences exist among each abrasive particle, and a fixed rake face, a fixed flank face and the like are not available, so that negative rake angles, relief angles, top end areas and the like of the abrasive particles are inconsistent, and are not equal everywhere on the same abrasive particle, and therefore, how to evaluate the cutting performance of one abrasive particle is an engineering problem to be solved urgently. During the abrasive grain processing, residual stress on the surface of the workpiece is generated. Also, the magnitude of the residual stress affects the performance of the machined surface, and therefore, how to control the residual stress within the range required by the workpiece is an engineering problem to be solved. In view of the above, it is very critical to define how the abrasive particles affect the cutting process.
Aiming at the problem of controlling the residual stress of a workpiece, the prior patent discloses a method for obtaining high-efficiency low-stress grinding process parameters of a high-temperature alloy (patent number: ZL201710013444.2, application date: 2017.01.09). Establishing a high-temperature alloy surface integrity grinding process parameter domain, and establishing a high-temperature alloy surface integrity grinding process parameter and surface integrity characteristic relation; then establishing an objective function, carrying out linearization treatment, and establishing a constraint condition of the high-temperature alloy grinding process parameters; finally, a high-temperature alloy efficient low-stress grinding process parameter optimization model is established, and the high-temperature alloy efficient low-stress grinding process parameter is obtained. The method is only adapted to the process parameters and is not considered by the abrasive particles themselves.
In addition, in the actual process, many technicians often simplify the abrasive particles into spherical shapes and conical shapes, which inevitably generate large errors and are not in line with the actual situation.
Disclosure of Invention
The invention aims to provide a new thought for evaluating and controlling abrasive grain cutting stress, and provides a diamond abrasive grain micro-change cutting residual stress evaluating and controlling method. Furthermore, a set of minutiae residual stress calculation method is established. The residual stress of the abrasive grain processing surface can be predicted by analyzing and measuring the characteristic parameters such as the negative front angle, the rear angle, the top end area and the like of each diamond abrasive grain cutting primordia, and the finishing of the abrasive grain can be controlled according to the workpiece processing requirement by the calculation method, thereby saving trial cutting time, improving the completion of the workpiece processing requirement and having certain industrial application value.
The object of the invention is achieved by at least one of the following technical solutions.
A diamond abrasive grain micro-element cutting residual stress evaluation and control method comprises the following steps:
s1, carrying out three-dimensional data acquisition on diamond abrasive particles for processing to obtain three-dimensional point cloud data of the diamond abrasive particles;
s2, converting three-dimensional point cloud data of the diamond abrasive particles into a three-dimensional space entity;
s3, performing infinitesimal treatment on the three-dimensional entity of the diamond abrasive particle, and dividing the abrasive particle into a plurality of infinitesimal abrasive particle cutting actions;
s4, measuring structural parameters of each abrasive grain cutting action primordia;
s5, calculating the given cutting depth a p The cutting residual stress generated in the cutting process of each abrasive grain cutting action primordial is further calculated, and comprehensive evaluation is carried out;
and S6, screening out the optimal combination mode of the negative rake angle, the relief angle and the top end area according to the comprehensive evaluation result, and guiding the diamond abrasive particle to be trimmed.
Further, in step S1, the diamond abrasive particles have a particle size of #16 to #400, and the reason why #16 to #400 are used is that the machinability of the diamond abrasive particles is related to the size of the abrasive particles, and the diamond with a size of #16 or less and a size of #400 or more does not have a good grinding performance, so that the spatial distribution simulation evaluation of the abrasive particles is not considered; the varieties of the diamond abrasive particles are RVD or MBD, and the reason for adopting the RVD and the MBD is that the two varieties have better processing performance; the adopted three-dimensional data acquisition method is laser confocal non-contact detection, and the reason for adopting the laser confocal non-contact detection is that the surface of the diamond abrasive particle can be prevented from being damaged in the detection process; the format of the collected three-dimensional point cloud data is a data table format, including txt/xlsx and other data table formats.
Further, in step S2, the process of converting the three-dimensional point cloud data into the three-dimensional space entity is implemented by pcl, vs2017 and a solidworks tool programming by converting the data table format into the pcd data format and then converting the pcd data format into the igs three-dimensional space entity model.
Further, in step S3, the microminiaturization process is specifically as follows:
the dividing surface of the micro element for the abrasive grain cutting is parallel to the cutting direction of the abrasive grain and is perpendicular to the cutting plane; the width deltax of the element for cutting the abrasive grain is defined by the grain size s of the abrasive grain and the nominal cutting depth a of the abrasive grain p The decision is calculated according to the following formula:
further, in step S4, the structural parameters include negative rake angle-gamma of the abrasive grain cutting action microelements i Angle of clearance alpha i Tip area Sc i Abrasive grain micro-element cutting depth a pi And the overall maximum principal and subordinate bias angles Kr and Kr' of the abrasive grains.
Further, in step S4, the measurement plane for measuring the structural parameters of the abrasive grain cutting action microelements coincides with the center line of the abrasive grain cutting action microelements, the measurement reference is parallel to the cutting direction, the measurement view angles of the overall maximum main and auxiliary deflection angles Kr and Kr' of the abrasive grain cutting action microelements are the right front of the abrasive grain cutting action microelements, and the measurement target is the maximum contour of the abrasive grain cutting action microelements.
Further, in step S5, the cutting residual stress of the ith abrasive grain cutting element is determined by the shearing residual stress τ of the ith abrasive grain cutting element i The cutting residual stress of the ith abrasive grain cutting action element comprises the shearing residual stress tau of the ith abrasive grain cutting action element i Extrusion residual stress sigma of ith abrasive grain cutting action primordial ci And the thermal stress sigma of the ith abrasive grain cutting element ti The formula of the micro-element calculation is as follows:
wherein v is f The grinding wheel feeding speed is D, the diameter of the grinding wheel, N, the rotating speed of the grinding wheel, E, the elastic modulus of the workpiece material and v, the Poisson ratio of the workpiece material.
Further, the overall calculation formula of the cutting residual stress is as follows:
wherein n is the total number of microelements for abrasive grain cutting, τ is the shear residual stress generated by the whole diamond abrasive grain, and σ is the extrusion residual stress and σ generated by the whole diamond abrasive grain t Thermal stress is generated for the entire diamond abrasive particle.
Further, in step S5, the comprehensive evaluation is specifically as follows:
if the absolute value of the deviation of the sum of the calculated shearing residual stress, extrusion residual stress and thermal stress generated by the whole diamond abrasive grain from the target value set during the workpiece processing is larger than the set threshold value, the evaluation is determined to be unqualified, and the diamond abrasive grain is required to be trimmed.
Further, in step S6, the diamond abrasive grain dressing guiding principle is specifically as follows:
preferential adjustment of tip area Sc of the dressed diamond abrasive particles i Negative rake angle-gamma i As an auxiliary adjustment parameter.
Compared with the prior art, the invention has the following beneficial effects:
1. the quality of the abrasive grain cutting workpiece can be predicted and calculated before machining begins, whether the abrasive grain can be used for machining a qualified product can be known without trial cutting, and the production cost is saved;
2. the abrasive particles can be purposefully trimmed according to actual processing requirements, so that the product processing requirements are directly met, post heat treatment is not needed, production procedures are reduced, and the efficiency is improved;
3. after the same abrasive particle is machined, the method can be used for finishing the next batch of workpieces again according to the next batch of machining requirements, so that the machining tool can be used for multiple times, and energy conservation, emission reduction and green manufacturing are realized.
Drawings
FIG. 1 is a flow chart of a method for evaluating and controlling cutting residual stress of diamond abrasive particles in a micro-element manner according to an embodiment of the invention;
FIG. 2 is a schematic diagram of the process and structural parameters of the micro-differentiation of abrasive particles according to an embodiment of the present invention; FIG. 2a is a schematic diagram of the overall abrasive grain and the processing parameters according to the embodiment of the present invention; FIG. 2b is a schematic view of primary and secondary bias angle measurement of abrasive particles according to an embodiment of the present invention; FIG. 2c is a schematic view of a micro-segmentation of abrasive particles according to an embodiment of the present invention; FIG. 2d is a schematic view of measuring parameters of a micro-element structure for abrasive cutting according to an embodiment of the present invention;
FIG. 3 is a diagram showing the comparison between the surface of a workpiece actually processed and the detection result in the embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but embodiments of the present invention are not limited thereto.
Examples:
during the production of diamond abrasive particles, the structure and the like are randomly generated, and are all important factors influencing the processing performance. Therefore, according to different processing performance requirements, diamond abrasive particles with different structures need to be selected. In a specific embodiment, the method for evaluating and controlling the cutting residual stress of the microminiaturization of the diamond abrasive particles considers different objective factors of the diamond abrasive particle structure in three-dimensional space, as shown in fig. 2, so that the residual stress of the abrasive particle processing surface is accurately predicted and evaluated, and the guiding control of the abrasive particle trimming is realized by the method. The basic flow chart is shown in figure 1.
The diamond abrasive grain micro-element cutting residual stress evaluation and control method, as shown in figure 1, comprises the following steps:
s1, carrying out three-dimensional data acquisition on diamond abrasive particles for processing to obtain three-dimensional point cloud data of the diamond abrasive particles;
generally, the diamond abrasive particles are firmly secured against random rotation and displacement after being mounted on the tool, and therefore, in one particular embodiment, the diamond abrasive particles are already mounted on the tool. In a specific embodiment, the depth of cut a p 1 μm, grinding wheel feed speed v f The grinding wheel diameter D is 150mm at 50mm/min, the grinding wheel rotating speed N is 2400r/min, the elastic modulus E of the workpiece material is 241500Mpa, the Poisson ratio v of the workpiece material is 0.3, and the abrasive grain size s is #16.
In a specific embodiment, three-dimensional point cloud data of the diamond abrasive particles are obtained through offline experimental detection, the obtained diamond abrasive particles are placed under a laser confocal three-dimensional contour detector, and three-dimensional point cloud data with the format of txt is obtained through scanning.
S2, converting three-dimensional point cloud data of the diamond abrasive particles into a three-dimensional space entity;
in a specific embodiment, the obtained three-dimensional point cloud data is further processed, and the three-dimensional point cloud data of the diamond abrasive particles are converted into a three-dimensional solid model through the joint programming of pcl, vs2017 and solidworks, wherein the conversion route is that the three-dimensional point cloud data are converted into the data format of txt to pcd and then into the three-dimensional file format of igs.
S3, performing infinitesimal treatment on the three-dimensional entity of the diamond abrasive particle, and dividing the abrasive particle into a plurality of infinitesimal abrasive particle cutting actions;
the microminiaturization treatment is specifically as follows:
the dividing surface of the micro element for the abrasive grain cutting is parallel to the cutting direction of the abrasive grain and is perpendicular to the cutting plane; abrasive grain cuttingThe width deltax of the action microelements is defined by the grain size s of the abrasive grain and the nominal cutting depth a of the abrasive grain p The decision is calculated according to the following formula:
in a specific embodiment, the width δx of the abrasive grain cutting element is set to 0.001843 μm, and the diamond abrasive grains are divided along the dividing plane parallel to the cutting direction.
S4, measuring structural parameters of each abrasive grain cutting action primordia;
the structural parameter comprises negative rake angle-gamma of the minor element of the abrasive grain cutting action i Angle of clearance alpha i Tip area Sc i Abrasive grain micro-element cutting depth a pi And the overall maximum principal and subordinate bias angles Kr and Kr' of the abrasive grains.
The measuring surface for measuring the structural parameters of the abrasive grain cutting action microelements is coincident with the center line of the abrasive grain cutting action microelements, the measuring reference is parallel to the cutting direction, the measuring visual angles of the overall maximum principal and subordinate deflection angles Kr and Kr' of the abrasive grain cutting action microelements are the positions right in front of the abrasive grain cutting action microelements, and the measuring target is the maximum outline of the abrasive grain cutting action microelements.
S5, calculating the given cutting depth a p The cutting residual stress generated in the cutting process of each abrasive grain cutting action primordial is further calculated, and comprehensive evaluation is carried out;
cutting residual stress of the ith abrasive grain cutting action element is calculated from the shearing residual stress tau of the ith abrasive grain cutting action element i The cutting residual stress of the ith abrasive grain cutting action element comprises the shearing residual stress tau of the ith abrasive grain cutting action element i Extrusion residual stress sigma of ith abrasive grain cutting action primordial ci And the thermal stress sigma of the ith abrasive grain cutting element ti The formula of the micro-element calculation is as follows:
wherein v is f The grinding wheel feeding speed is D is the diameter of the grinding wheel, N is the rotating speed of the grinding wheel, E is the elastic modulus of the workpiece material, and v is the Poisson's ratio of the workpiece material;
the overall calculation formula of the cutting residual stress is as follows:
wherein n is the total number of microelements for abrasive grain cutting, τ is the shear residual stress generated by the whole diamond abrasive grain, and σ is the extrusion residual stress and σ generated by the whole diamond abrasive grain t Thermal stress is generated for the entire diamond abrasive particle.
The comprehensive evaluation is specifically as follows:
in a specific embodiment, if the absolute value of the deviation of the calculated sum of the shear residual stress, the extrusion residual stress, and the thermal stress generated by the whole diamond abrasive grain from the target value set at the time of processing the workpiece is greater than 20MPa, the diamond abrasive grain is determined to be unqualified and the diamond abrasive grain is finished.
In a specific embodiment, a stress value deviation of 250MPa occurs, requiring diamond abrasive grain dressing.
S6, screening out the optimal combination mode of the negative rake angle, the relief angle and the top end area according to the comprehensive evaluation result, and guiding diamond abrasive particle dressing;
the diamond abrasive particle dressing guiding principle is specifically as follows:
comparing the target processing requirement and the calculation result of the workpiece, and preferentially adjusting the top end area Sc of the finishing diamond abrasive particles i Negative rake angle-gamma i As an auxiliary adjustment parameter.
In a specific embodiment, the instruction given for the deviation of the stress value of 250MPa is to increase the area of the tip of the abrasive particle and decrease the negative rake angle of the abrasive particle.
In a specific embodiment, a comparison of the detection of the machined surface before and after the application of the method of the invention is shown in fig. 3, the residual stress before control is 1007MPa, the residual stress after control is 725MPa, and the residual stress on the surface of the workpiece is consistent with the predicted control.
According to the diamond abrasive grain microminiaturization cutting residual stress evaluation and control method, trial cutting is not needed in the whole residual stress evaluation and control process, most of work is automatically completed in a computer, the method has the characteristics of high efficiency, accuracy and simplicity in operation, the method accords with the concepts of saving cost and green manufacturing, and experimental verification shows that the method has practical reference value in industrial application.
Many widely differing embodiments may be constructed without departing from the spirit and scope of the present invention. It is to be understood that the invention is not limited to the specific embodiments described in the specification, except as defined by the appended claims.
Claims (10)
1. The diamond abrasive grain micro-element cutting residual stress evaluation and control method is characterized by comprising the following steps of:
s1, carrying out three-dimensional data acquisition on diamond abrasive particles for processing to obtain three-dimensional point cloud data of the diamond abrasive particles;
s2, converting three-dimensional point cloud data of the diamond abrasive particles into a three-dimensional space entity;
s3, performing infinitesimal treatment on the three-dimensional entity of the diamond abrasive particle, and dividing the abrasive particle into a plurality of infinitesimal abrasive particle cutting actions;
s4, measuring structural parameters of each abrasive grain cutting action primordia;
s5, calculating the given cutting depth a p The cutting residual stress generated in the cutting process of each abrasive grain cutting action primordia is further calculated, and the cutting residual stress generated by the whole diamond abrasive grain is comprehensively calculatedEvaluating;
and S6, screening out the optimal combination mode of the negative rake angle, the relief angle and the top end area according to the comprehensive evaluation result, and guiding the diamond abrasive particle to be trimmed.
2. The method for evaluating and controlling the cutting residual stress of the diamond abrasive particles according to claim 1, wherein the method comprises the following steps: in step S1, the granularity of the diamond abrasive particles is #16 to #400, the variety of the diamond abrasive particles is RVD or MBD, the adopted three-dimensional data acquisition method is laser confocal non-contact detection, and the acquired three-dimensional point cloud data is in a data table format.
3. The method for evaluating and controlling the cutting residual stress of the diamond abrasive particles according to claim 2, wherein the method comprises the following steps: in step S2, the process of converting the three-dimensional point cloud data into the three-dimensional space entity is implemented by pcl, vs2017 and solidworks tool programming by adopting a way of converting the data table format into the pcd data format and then converting the pcd data format into the igs three-dimensional space entity model.
4. The method for evaluating and controlling the cutting residual stress of the diamond abrasive particles according to claim 1, wherein the method comprises the following steps: in step S3, the binarization processing specifically includes:
the dividing surface of the micro element for the abrasive grain cutting is parallel to the cutting direction of the abrasive grain and is perpendicular to the cutting plane; the width deltax of the element for cutting the abrasive grain is defined by the grain size s of the abrasive grain and the nominal cutting depth a of the abrasive grain p The decision is calculated according to the following formula:
5. the method for evaluating and controlling the cutting residual stress of the diamond abrasive particles in a microminiaturization mode according to claim 4, wherein the method comprises the following steps: in step S4, the structural parameters comprise the negative front of the abrasive grain cutting action microelementsAngle-gamma i Angle of clearance alpha i Tip area Sc i Abrasive grain micro-element cutting depth a pi And the overall maximum principal and subordinate bias angles Kr and Kr' of the abrasive grains.
6. The method for evaluating and controlling the cutting residual stress of the diamond abrasive particles according to claim 5, wherein the method comprises the following steps: in step S4, the measurement plane for measuring the structural parameters of the abrasive grain cutting action microelements coincides with the center line of the abrasive grain cutting action microelements, the measurement reference is parallel to the cutting direction, the measurement view angles of the overall maximum main and auxiliary deflection angles Kr and Kr' of the abrasive grain cutting action microelements are the right front of the abrasive grain cutting action microelements, and the measurement target is the maximum contour of the abrasive grain cutting action microelements.
7. The method for evaluating and controlling the cutting residual stress of the diamond abrasive particles according to claim 5, wherein the method comprises the following steps: in step S5, the cutting residual stress of the ith abrasive grain cutting element includes the shearing residual stress τ of the ith abrasive grain cutting element i Extrusion residual stress sigma of ith abrasive grain cutting action primordial ci And the thermal stress sigma of the ith abrasive grain cutting element ti The formula of the micro-element calculation is as follows:
wherein v is f The grinding wheel feeding speed is D, the diameter of the grinding wheel, N, the rotating speed of the grinding wheel, E, the elastic modulus of the workpiece material and v, the Poisson ratio of the workpiece material.
8. The method for evaluating and controlling the cutting residual stress of the diamond abrasive particles according to claim 7, wherein the method comprises the following steps: the calculation formula of the cutting residual stress is as follows:
wherein n is the total number of microelements for abrasive grain cutting, τ is the shear residual stress generated by the whole diamond abrasive grain, and σ is the extrusion residual stress and σ generated by the whole diamond abrasive grain t Thermal stress is generated for the entire diamond abrasive particle.
9. The method for evaluating and controlling the cutting residual stress of the diamond abrasive particles in a microminiaturization mode according to claim 8, wherein the method comprises the following steps: in step S5, the comprehensive evaluation is specifically as follows:
if the absolute value of the deviation of the sum of the calculated shearing residual stress, extrusion residual stress and thermal stress generated by the whole diamond abrasive grain from the target value set during the workpiece processing is larger than the set threshold value, the evaluation is determined to be unqualified, and the diamond abrasive grain is required to be trimmed.
10. The method for evaluating and controlling cutting residual stress of diamond abrasive grain according to any one of claims 1 to 9, wherein: in step S6, the diamond abrasive grain dressing guiding principle is specifically as follows:
preferential adjustment of tip area Sc of the dressed diamond abrasive particles i Negative rake angle-gamma i As an auxiliary adjustment parameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110815855.XA CN113656903B (en) | 2021-07-19 | 2021-07-19 | Evaluation and control method for cutting residual stress of diamond abrasive particles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110815855.XA CN113656903B (en) | 2021-07-19 | 2021-07-19 | Evaluation and control method for cutting residual stress of diamond abrasive particles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113656903A CN113656903A (en) | 2021-11-16 |
| CN113656903B true CN113656903B (en) | 2023-04-21 |
Family
ID=78477659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110815855.XA Active CN113656903B (en) | 2021-07-19 | 2021-07-19 | Evaluation and control method for cutting residual stress of diamond abrasive particles |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113656903B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109186836A (en) * | 2018-09-28 | 2019-01-11 | 西安交通大学 | Method based on three dimensional optical measuring technology and consistency profiles test welding point residual stress |
| CN111222258A (en) * | 2020-02-29 | 2020-06-02 | 华南理工大学 | Grinding wheel grinding performance classification method based on crystal face directionality of diamond abrasive particles |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120267235A1 (en) * | 2009-11-30 | 2012-10-25 | Gow-Lin Lam | Method and device for performing quantum control on infinitesimal quanta |
-
2021
- 2021-07-19 CN CN202110815855.XA patent/CN113656903B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109186836A (en) * | 2018-09-28 | 2019-01-11 | 西安交通大学 | Method based on three dimensional optical measuring technology and consistency profiles test welding point residual stress |
| CN111222258A (en) * | 2020-02-29 | 2020-06-02 | 华南理工大学 | Grinding wheel grinding performance classification method based on crystal face directionality of diamond abrasive particles |
Non-Patent Citations (1)
| Title |
|---|
| 蔡毅 ; 唐辉明 ; 葛云峰 ; 张申 ; 谭钦文 ; .岩体结构面三维粗糙度评价的新方法.岩石力学与工程学报.2017,第36卷(第05期),1101-1110. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113656903A (en) | 2021-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108405941B (en) | Efficient precise milling method for blade body profile of aero-engine blade | |
| CN107451382B (en) | Control method for surface appearance of high-speed cutting workpiece | |
| Arif et al. | A study on the effect of tool-edge radius on critical machining characteristics in ultra-precision milling of tungsten carbide | |
| Fomin | Microgeometry of surfaces after profile milling with the use of automatic cutting control system | |
| Daniyan et al. | Numerical and experimental analysis of surface roughness during the milling operation of titanium alloy Ti6Al4V | |
| Denkena et al. | Automatic regeneration of cemented carbide tools for a resource efficient tool production | |
| CN113656903B (en) | Evaluation and control method for cutting residual stress of diamond abrasive particles | |
| CN104439468A (en) | Milling cutter suitable for layered milling forming process of integral leaf disk structural profile | |
| Uhlmann et al. | Increasing the productivity and quality of flute grinding processes through the use of layered grinding wheels | |
| CN106312152A (en) | Method for machining thin-walled components | |
| Liang et al. | Design and fabrication of a new micro ball-end mill with conical flank face | |
| CN106424966A (en) | Grinding technology and device for wheel groove finishing broach with equal cutting angles | |
| Wang et al. | Parameter analysis and modelling of grinding special-shaped granite by diamond tools based on a robot stone machining system | |
| Yang et al. | Research on multi-axis CNC programming in machining large hydraulic turbine's blades based on UG | |
| Gong et al. | Machining behavior and material properties in additive manufacturing Ti-6Al-4V parts | |
| Nguyen et al. | Optimization parameters of milling process of mould material for decreasing machining power and surface roughness criteria | |
| CN108334673B (en) | Grinding consumption design method based on abrasive particle cutting thickness distribution constraint | |
| Shah | Application of Full Factorial Analysis Design For Determining Surface Roughness Model In End Milling of Hardened Steel Material Using Solid Carbide Niti Co 30 Standard End Mill | |
| CN108188480B (en) | Abrasive particle parameter optimization design method for saw blade with abrasive particle parametric arrangement | |
| Kundrak et al. | Experimental study on surface roughness of face milled parts with round insert at various feed rates | |
| Zhu et al. | Research on cutting force of turn-milling based on thin-walled blade | |
| US20240134338A1 (en) | Machining system, and method of manufacturing a machined product | |
| Wojciechowski et al. | The application of response surface method to optimization of precision ball end milling | |
| CN111240271B (en) | Curved surface rough machining method based on flexible abrasive particle mechanical cutting | |
| Sui et al. | Precision prediction of surface roughness in high speed peripheral milling Ti6Al4V alloy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |