CN113652198A - Special hot-melt pressure-sensitive adhesive for high-temperature residue-free glass fiber adhesive tape and preparation method thereof - Google Patents
Special hot-melt pressure-sensitive adhesive for high-temperature residue-free glass fiber adhesive tape and preparation method thereof Download PDFInfo
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- CN113652198A CN113652198A CN202111130607.8A CN202111130607A CN113652198A CN 113652198 A CN113652198 A CN 113652198A CN 202111130607 A CN202111130607 A CN 202111130607A CN 113652198 A CN113652198 A CN 113652198A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/387—Block-copolymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a special hot-melt pressure-sensitive adhesive for a high-temperature residue-free glass fiber adhesive tape and a preparation method thereof. The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape comprises the following raw materials: 2-12 parts of naphthenic oil, 6-18 parts of SEBS (styrene-ethylene-butadiene-styrene), 2-10 parts of thermoplastic elastomer, 10-22 parts of rosin ester, 10100.02-0.1 part of antioxidant, 0.01-0.06 part of didodecyl thiodipropionate and 0.5-5 parts of viscosity regulator. The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape is compounded by using SEBS and SIS, rosin glyceride, a viscosity regulator and the like are added, and particularly, the adhesive property, the lasting viscosity and the like of a hot-melt pressure-sensitive adhesive system are adjusted by compounding ethoxylated glycerol triacrylate and ethylene glycol dimethacrylate. The hot-melt pressure-sensitive adhesive has good high-temperature resistance, is easy to remove, and does not remain or pollute the surface of the body. Has wide application prospect in the field of adhesive tapes.
Description
Technical Field
The invention relates to the technical field of adhesives, in particular to a special hot-melt pressure-sensitive adhesive for a high-temperature residue-free glass fiber adhesive tape and a preparation method thereof.
Background
The glass fiber adhesive tape is commonly used for repairing cracks of dry board walls, gypsum board joints, various wall bodies and other wall surface damages, and has excellent alkali resistance and durability. The hot melt adhesive is a solid adhesive prepared by taking thermoplastic resin or elastomer as a base material, adding a tackifier, a plasticizer, an antioxidant, a flame retardant and a filler, and melting and mixing. Compared with other adhesives, the adhesive has the following characteristics: the solid content is high; the hot melt adhesive has thermal plasticity, namely can be repeatedly heated to melt and cooled to solidify, the process is reversible, and the chemical and physical properties of the hot melt adhesive cannot be changed. The hot melt adhesive is applied in a molten state by heating, and is cooled and solidified to produce an adhesive force. Due to the above advantages, hot melt adhesives have been rapidly developed in many fields from the 20 th 50 s to the present, and particularly, hot melt adhesives have been used in printing, packaging and other industries to replace nail and wire bonding, and are beginning to be used in the fields of building, airplane, ship and automobile interior decoration and the like. Over the past 60 years, the hot melt adhesive industry has developed very rapidly, new technologies, new products and new applications have emerged, and the performance has been continuously improved.
At present, researches on special hot-melt pressure-sensitive adhesive for glass fiber adhesive tapes are few, and particularly, a hot-melt pressure-sensitive adhesive aiming at the glass fiber adhesive tapes, which has no residue at high temperature and excellent performances, is lacked.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a special hot-melt pressure-sensitive adhesive for a high-temperature residue-free glass fiber adhesive tape.
The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape is prepared from the following raw materials in parts by weight:
2-12 parts of naphthenic oil, 6-18 parts of SEBS (styrene-ethylene-butadiene-styrene), 2-10 parts of thermoplastic elastomer, 10-22 parts of rosin ester, 10100.02-0.1 part of antioxidant, 0.01-0.06 part of dilauryl thiodipropionate and 0.5-5 parts of viscosity regulator, wherein the viscosity regulator is selected from ethoxylated glycerol triacrylate, ethylene glycol dimethacrylate and a combination thereof.
As a preferred embodiment of the invention, the special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape is prepared from the following raw materials in parts by weight:
4-10 parts of naphthenic oil, 7-15 parts of SEBS (styrene-ethylene-butadiene-styrene), 3-8 parts of thermoplastic elastomer, 12-20 parts of rosin ester, 10100.02-0.08 part of antioxidant, 0.01-0.05 part of dilauryl thiodipropionate and 0.5-3 parts of viscosity regulator, wherein the viscosity regulator is selected from ethoxylated glycerol triacrylate, ethylene glycol dimethacrylate and a combination thereof.
In the invention, the comprehensive performance of the hot-melt pressure-sensitive adhesive system is improved by the viscosity regulator compounded by the ethoxylated glycerol triacrylate and the ethylene glycol dimethacrylate.
As a preferable preference of the invention, the viscosity regulator is a combination of ethoxylated glycerol triacrylate and ethylene glycol dimethacrylate.
The mass ratio of the ethoxylated glycerol triacrylate to the ethylene glycol dimethacrylate is 1: (1-7) such as 1:1, 1:2, 1:3, 1: 5.
Further preferably, the mass ratio of the ethoxylated glycerol triacrylate to ethylene glycol dimethacrylate is 1: (1-3).
According to some embodiments of the invention, the styrene content of the SEBS is 10% to 14%.
According to some embodiments of the invention, the thermoplastic elastomer is selected from SIS, SBS and combinations thereof, preferably SIS.
According to some embodiments of the invention, the rosin ester is selected from rosin glycerol esters, rosin pentaerythritol esters and combinations thereof, preferably rosin glycerol esters.
The invention also aims to provide a method for preparing the special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape, which comprises the following steps:
weighing the raw materials, heating an internal mixer to 52-57 ℃, adding SEBS, a thermoplastic elastomer, rosin ester, an antioxidant 1010, didodecyl thiodipropionate, a viscosity regulator and naphthenic oil, mixing for 3-40 min at 52-153 ℃, and discharging to obtain the epoxy resin composition.
As a preferred embodiment of the present invention, the method comprises the steps of:
weighing the raw materials, heating an internal mixer to 52-57 ℃, adding SEBS, a thermoplastic elastomer, rosin ester, an antioxidant 1010, didodecyl thiodipropionate and a viscosity regulator, stirring for 2-7 h at 52-57 ℃, heating to 141-147 ℃, stirring for 3-10 min at 141-147 ℃, adding naphthenic oil, heating to 148-153 ℃, mixing for 5-15 min at 148-153 ℃, and discharging to obtain the epoxy resin.
The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape is compounded by using SEBS and SIS, rosin glyceride, a viscosity regulator and the like are added, and particularly, the adhesive property, the lasting viscosity and the like of a hot-melt pressure-sensitive adhesive system are adjusted by compounding ethoxylated glycerol triacrylate and ethylene glycol dimethacrylate. The hot-melt pressure-sensitive adhesive has good high-temperature resistance, is easy to remove, and does not remain or pollute the surface of the body. Has wide application prospect in the field of adhesive tapes.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Some of the raw materials involved in the examples are as follows:
SEBS having a styrene content of 12% and a melting rate (190 ℃, 2.16 kg) of 0.5 g/10min, HYBRAR7311F, available from Coly, Japan.
Naphthenic oil, grade KN4010, kramayi petrochemical company.
SIS, model 1105, petrochemical limited of yue yang hills, hannan.
The examples relate to the following test methods:
1) initial tack test
Reference GB/T4852-.
2) Tack holding test
Reference is made to GB/T4851-.
3) 180 degree peel strength test
See GB/T2792-.
Example 1
The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape is prepared from the following raw materials:
7.2g of naphthenic oil, 12g of SEBS, 5g of SIS, 15g of rosin glyceride, 10100.05 g of antioxidant, 0.03g of didodecyl thiodipropionate and 2g of viscosity regulator.
The viscosity regulator is a composition of ethoxylated glycerol triacrylate and ethylene glycol dimethacrylate, and the mass ratio of the ethoxylated glycerol triacrylate to the ethylene glycol dimethacrylate is 1: 1.
the preparation method of the special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape comprises the following steps: weighing the raw materials, heating an internal mixer to 55 ℃, adding SEBS, SIS, rosin glyceride, an antioxidant 1010, didodecyl thiodipropionate and a viscosity regulator, stirring for 5 hours at 55 ℃, heating to 145 ℃, stirring for 5 minutes at 145 ℃, adding naphthenic oil, heating to 150 ℃, mixing for 10 minutes at 150 ℃, and discharging to obtain the finished product.
Example 2
The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape is prepared from the following raw materials:
7g of naphthenic oil, 12g of SEBS, 5.3g of SIS, 15g of rosin glyceride, 10100.06 g of antioxidant, 0.03g of dilauryl thiodipropionate and 2g of viscosity regulator.
The viscosity regulator is a composition of ethoxylated glycerol triacrylate and ethylene glycol dimethacrylate, and the mass ratio of the ethoxylated glycerol triacrylate to the ethylene glycol dimethacrylate is 1: 3.
the preparation method of the special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape comprises the following steps: weighing the raw materials, heating an internal mixer to 55 ℃, adding SEBS, SIS, rosin glyceride, an antioxidant 1010, didodecyl thiodipropionate and a viscosity regulator, stirring for 5 hours at 55 ℃, heating to 145 ℃, stirring for 5 minutes at 145 ℃, adding naphthenic oil, heating to 150 ℃, mixing for 10 minutes at 150 ℃, and discharging to obtain the finished product.
Example 3
The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape is prepared from the following raw materials:
7g of naphthenic oil, 13g of SEBS, 5g of SIS, 14g of rosin glyceride, 10100.05 g of antioxidant, 0.03g of didodecyl thiodipropionate and 2g of viscosity regulator.
The viscosity regulator is a composition of ethoxylated glycerol triacrylate and ethylene glycol dimethacrylate, and the mass ratio of the ethoxylated glycerol triacrylate to the ethylene glycol dimethacrylate is 1: 5.
the preparation method of the special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape comprises the following steps: weighing the raw materials, heating an internal mixer to 55 ℃, adding SEBS, SIS, rosin glyceride, an antioxidant 1010, didodecyl thiodipropionate and a viscosity regulator, stirring for 5 hours at 55 ℃, heating to 145 ℃, stirring for 5 minutes at 145 ℃, adding naphthenic oil, heating to 150 ℃, mixing for 10 minutes at 150 ℃, and discharging to obtain the finished product.
Example 4
The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape is prepared from the following raw materials:
7.2g of naphthenic oil, 12g of SEBS, 5g of SIS, 15g of rosin glyceride, 10100.05 g of antioxidant, 0.03g of didodecyl thiodipropionate and 2g of viscosity regulator.
The viscosity regulator is ethoxylated glycerol triacrylate.
The preparation method of the special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape comprises the following steps: weighing the raw materials, heating an internal mixer to 55 ℃, adding SEBS, SIS, rosin glyceride, an antioxidant 1010, didodecyl thiodipropionate and a viscosity regulator, stirring for 5 hours at 55 ℃, heating to 145 ℃, stirring for 5 minutes at 145 ℃, adding naphthenic oil, heating to 150 ℃, mixing for 10 minutes at 150 ℃, and discharging to obtain the finished product.
Example 5
The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape is prepared from the following raw materials:
7.2g of naphthenic oil, 12g of SEBS, 5g of SIS, 15g of rosin glyceride, 10100.05 g of antioxidant, 0.03g of didodecyl thiodipropionate and 2g of viscosity regulator.
The viscosity regulator is ethylene glycol dimethacrylate.
The preparation method of the special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape comprises the following steps: weighing the raw materials, heating an internal mixer to 55 ℃, adding SEBS, SIS, rosin glyceride, an antioxidant 1010, didodecyl thiodipropionate and a viscosity regulator, stirring for 5 hours at 55 ℃, heating to 145 ℃, stirring for 5 minutes at 145 ℃, adding naphthenic oil, heating to 150 ℃, mixing for 10 minutes at 150 ℃, and discharging to obtain the finished product.
Table 1: performance test result table of special hot-melt pressure-sensitive adhesive for high-temperature residue-free glass fiber adhesive tape
| Peel strength (kN/m) | Viscosity retention property | Initial viscosity (ball) | |
| Example 1 | 32.3 | ＞60h | 30 |
| Example 2 | 29.2 | ＞60h | 30 |
| Example 3 | 27.4 | ＞48h | 25 |
| Example 4 | 23.6 | ＞48h | 25 |
| Example 4 | 26.7 | ＞48h | 25 |
The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape is compounded by using SEBS and SIS, rosin glyceride, a viscosity regulator and the like are added, and particularly, the adhesive property, the lasting viscosity and the like of a hot-melt pressure-sensitive adhesive system are adjusted by compounding ethoxylated glycerol triacrylate and ethylene glycol dimethacrylate. The hot-melt pressure-sensitive adhesive has good high-temperature resistance, is easy to remove, and does not remain or pollute the surface of the body. Has wide application prospect in the field of adhesive tapes.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the concept of the present invention, and these modifications and decorations should also be regarded as being within the protection scope of the present invention.
Claims (9)
1. The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape is characterized by being prepared from the following raw materials in parts by weight:
2-12 parts of naphthenic oil, 6-18 parts of SEBS (styrene-ethylene-butadiene-styrene), 2-10 parts of thermoplastic elastomer, 10-22 parts of rosin ester, 10100.02-0.1 part of antioxidant, 0.01-0.06 part of dilauryl thiodipropionate and 0.5-5 parts of viscosity regulator, wherein the viscosity regulator is selected from ethoxylated glycerol triacrylate, ethylene glycol dimethacrylate and a combination thereof.
2. The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape according to claim 1, which is prepared from the following raw materials in parts by weight:
4-10 parts of naphthenic oil, 7-15 parts of SEBS (styrene-ethylene-butadiene-styrene), 3-8 parts of thermoplastic elastomer, 12-20 parts of rosin ester, 10100.02-0.08 part of antioxidant, 0.01-0.05 part of dilauryl thiodipropionate and 0.5-3 parts of viscosity regulator, wherein the viscosity regulator is selected from ethoxylated glycerol triacrylate, ethylene glycol dimethacrylate and a combination thereof.
3. The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape according to claim 1 or 2, wherein the mass ratio of the ethoxylated glycerol triacrylate to the ethylene glycol dimethacrylate is 1: (1-7).
4. The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape as claimed in claim 3, wherein the mass ratio of the ethoxylated glycerol triacrylate to the ethylene glycol dimethacrylate is 1: (1-3).
5. The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape as claimed in claim 1 or 2, wherein the styrene content of the SEBS is 10% -14%.
6. The special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber tape according to claim 1 or 2, wherein the thermoplastic elastomer is selected from SIS, SBS and combination thereof.
7. The hot-melt pressure-sensitive adhesive special for the high-temperature residue-free glass fiber tape according to claim 1 or 2, wherein the rosin ester is selected from rosin glycerol ester, rosin pentaerythritol ester and a combination thereof.
8. The method for preparing the special hot-melt pressure-sensitive adhesive for the high-temperature residue-free glass fiber adhesive tape as defined in any one of claims 1 to 7, is characterized by comprising the following steps:
weighing the raw materials, heating an internal mixer to 52-57 ℃, adding SEBS, a thermoplastic elastomer, rosin ester, an antioxidant 1010, didodecyl thiodipropionate, a viscosity regulator and naphthenic oil, mixing for 3-40 min at 52-153 ℃, and discharging to obtain the epoxy resin composition.
9. The method of claim 8, comprising the steps of:
weighing the raw materials, heating an internal mixer to 52-57 ℃, adding SEBS, a thermoplastic elastomer, rosin ester, an antioxidant 1010, didodecyl thiodipropionate and a viscosity regulator, stirring for 2-7 h at 52-57 ℃, heating to 141-147 ℃, stirring for 3-10 min at 141-147 ℃, adding naphthenic oil, heating to 148-153 ℃, mixing for 5-15 min at 148-153 ℃, and discharging to obtain the epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111130607.8A CN113652198A (en) | 2021-09-26 | 2021-09-26 | Special hot-melt pressure-sensitive adhesive for high-temperature residue-free glass fiber adhesive tape and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111130607.8A CN113652198A (en) | 2021-09-26 | 2021-09-26 | Special hot-melt pressure-sensitive adhesive for high-temperature residue-free glass fiber adhesive tape and preparation method thereof |
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| Publication Number | Publication Date |
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| CN113652198A true CN113652198A (en) | 2021-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111130607.8A Pending CN113652198A (en) | 2021-09-26 | 2021-09-26 | Special hot-melt pressure-sensitive adhesive for high-temperature residue-free glass fiber adhesive tape and preparation method thereof |
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| Country | Link |
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| CN (1) | CN113652198A (en) |
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2021
- 2021-09-26 CN CN202111130607.8A patent/CN113652198A/en active Pending
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