CN113650308A - Vacuumizing glue filling mechanism and glue filling equipment - Google Patents

Vacuumizing glue filling mechanism and glue filling equipment Download PDF

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Publication number
CN113650308A
CN113650308A CN202110852255.0A CN202110852255A CN113650308A CN 113650308 A CN113650308 A CN 113650308A CN 202110852255 A CN202110852255 A CN 202110852255A CN 113650308 A CN113650308 A CN 113650308A
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CN
China
Prior art keywords
glue
plate
hole
vacuum
pumping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110852255.0A
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Chinese (zh)
Inventor
徐亚林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Shizong Automation Equipment Co Ltd
Original Assignee
Shenzhen Shizong Automation Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Shizong Automation Equipment Co Ltd filed Critical Shenzhen Shizong Automation Equipment Co Ltd
Priority to CN202110852255.0A priority Critical patent/CN113650308A/en
Publication of CN113650308A publication Critical patent/CN113650308A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
    • B29C65/544—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles

Abstract

The invention discloses a vacuumizing glue filling mechanism and glue filling equipment, which are used for filling glue into a glue filling product, wherein the glue filling product is provided with a glue inlet hole and a glue outlet hole, the glue inlet hole and the glue outlet hole are mutually communicated through a cavity in the glue filling product, the vacuumizing glue filling mechanism comprises a floating plate, a glue filling assembly and a glue pumping assembly, and the floating plate can move in the vertical direction when being driven; the glue filling assembly is arranged on the floating plate and used for extending into the glue inlet hole to fill the glue into the cavity; the glue pumping assembly is arranged on the floating plate and adjacent to the glue pouring assembly and used for extending into the glue outlet hole to vacuumize the cavity so that the glue flows out of the glue outlet hole. The invention can make the flow rate of the colloid faster and the glue filling rate faster, and effectively improves the productivity.

Description

Vacuumizing glue filling mechanism and glue filling equipment
Technical Field
The invention relates to the technical field of mobile phone glue filling, in particular to a vacuumizing glue filling mechanism and glue filling equipment.
Background
Along with the rapid development of intelligent electronic equipment, various intelligent equipment functions are more and more, for example, a smart phone, a tablet personal computer and the like, in the related art, electronic equipment such as a mobile phone, a tablet personal computer and the like needs to be assembled and fixed on various parts inside in the assembling process, in the past, a foam adhesive tape and the like are generally adopted for bonding and fixing, so that the stability of the parts is insufficient, the thickness of the parts is difficult to control, the problem is solved by adopting an adhesive filling mode, but the existing adhesive filling mode has the disadvantages that the adhesive filling rate is slow in the adhesive filling process due to the slow flow rate of colloid, and the productivity is difficult to promote.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of the present invention is to provide a vacuum pumping glue filling mechanism, for filling glue into a glue filling product, where the glue filling product has a glue inlet and a glue outlet, and the glue inlet and the glue outlet are communicated with each other via a cavity in the glue filling product, and the vacuum pumping glue filling mechanism includes:
a floating plate movable in a vertical direction when driven;
the glue filling assembly is arranged on the floating plate and used for extending into the glue inlet hole to fill the glue into the cavity;
and the glue pumping assembly is arranged on the floating plate and is adjacent to the glue pouring assembly, and is used for extending into the glue outlet hole to vacuumize the cavity so that the glue flows out of the glue outlet hole.
Preferably, according to an embodiment of the present invention, the glue extracting assembly includes:
the first adjusting plate is provided with a vertical end and a horizontal end, and the vertical end is movably connected with the floating plate along the vertical direction;
one end of the second adjusting plate is movably connected with the horizontal end;
a third adjustment plate movably connected to the other end of the second adjustment plate.
Preferably, according to an embodiment of the present invention, the glue extracting assembly includes:
the upper end of the connecting seat is connected with the third adjusting plate;
the glue extracting head is sleeved at the lower end of the connecting seat;
the elastic piece is sleeved on the connecting seat and abuts against the glue extracting head;
and the vacuum joint is arranged on the glue pumping head and used for being connected to vacuum equipment to vacuumize the glue pumping head.
Preferably, according to an embodiment of the present invention, a detection sensor is disposed at a top of the connection seat, and the detection sensor is configured to detect the glue in the glue outlet to control the glue filling assembly to start or stop.
Preferably, according to an embodiment of the present invention, the glue dispensing device further comprises a vacuum valve, wherein the vacuum valve is communicated with the vacuum joint to adjust the vacuum pressure of the glue dispensing head.
Preferably, according to an embodiment of the present invention, the vertical end has a first strip-shaped hole extending along a vertical direction, and the first strip-shaped hole is connected to the floating plate;
the second bar hole that extends along the horizontal direction has on the horizontal end, be equipped with the third bar hole that extends along the horizontal direction on the third regulating plate, second bar hole with third bar hole mutually perpendicular, the connecting hole that second regulating plate both ends were equipped with respectively with second bar hole with third bar hole links to each other.
Preferably, according to an embodiment of the present invention, the glue pouring assembly includes:
the connecting plate is arranged on the floating plate;
the two rubber cylinders are arranged on the connecting plate;
and the glue filling head is arranged on the connecting plate and is communicated with the two glue cylinders.
Preferably, according to an embodiment of the present invention, a base plate is disposed on a side of the floating plate away from the potting assembly, the floating plate is slidably connected to the base plate, and an air cylinder is disposed on the base plate and is configured to drive the floating plate to slide on the base plate in a vertical direction.
Preferably, according to an embodiment of the present invention, the apparatus further includes a tension spring, one end of the tension spring is connected to the base plate, and the other end of the tension spring is connected to the floating plate.
The invention also provides glue filling equipment which comprises the vacuumizing glue filling mechanism.
According to the vacuumizing glue filling mechanism provided by the invention, when the floating plate is driven, the glue filling assembly can be driven to extend into the glue inlet hole and fill glue into the cavity, and meanwhile, the glue pumping assembly extends into the glue outlet hole to vacuumize the cavity, so that the glue can be completely filled in the cavity and flows out from the glue outlet hole, the glue flow rate is higher, the glue filling speed is higher, and the productivity is effectively improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a vacuum pumping and glue pouring mechanism provided in an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a glue filling head, a glue pumping head and a glue filling product provided in the embodiment of the present invention;
FIG. 3 is a cross-sectional view of a glue filling head, a glue pumping head and a glue filling product provided in an embodiment of the invention;
FIG. 4 is an exploded view of the glue dispensing assembly provided in an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a glue-pouring assembly provided in an embodiment of the invention;
fig. 6 is a schematic structural diagram of a glue filling apparatus provided in the embodiment of the present invention.
The reference numbers illustrate:
10. a floating plate; 20. a glue pouring assembly; 21. a connecting plate; 22. a rubber cylinder; 23. pouring a glue head; 30. a glue pumping assembly; 31. a first adjusting plate; 311. a first bar-shaped hole; 312. a second bar-shaped hole; 32. a second adjusting plate; 321. connecting holes; 33. a third adjusting plate; 331. a third strip-shaped hole; 34. a connecting seat; 35. a glue drawing head; 36. an elastic member; 37. a vacuum joint; 38. a detection sensor; 40. glue pouring products; 401. a glue inlet hole; 402. a glue outlet hole; 403. a cavity; 50. a vacuum valve; 60. a substrate; 70. a cylinder; 80. a tension spring.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention, and all other embodiments that can be obtained by one skilled in the art based on the embodiments of the present invention without inventive efforts shall fall within the scope of protection of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "circumferential," "radial," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following describes the vacuum pumping glue filling mechanism and the glue filling equipment of the embodiment of the invention in detail with reference to the attached drawings.
Referring to fig. 1 to 3, the vacuum pumping and glue pouring mechanism provided in the embodiment of the present invention is configured to pour glue into a glue pouring product 40, the glue pouring product 40 has a glue inlet 401 and a glue outlet 402, the glue inlet 401 and the glue outlet 402 are communicated with each other through a cavity 403 in the glue pouring product 40, the vacuum pumping and glue pouring mechanism includes a floating plate 10, a glue pouring assembly 20, and a glue pumping assembly 30, and the floating plate 10 can move in a vertical direction when being driven; the glue pouring assembly 20 is arranged on the floating plate 10 and is used for extending into the glue inlet hole 401 so as to pour glue into the cavity 403; the glue pumping assembly 30 is disposed on the floating plate 10 and adjacent to the glue pouring assembly 20, and is used for extending into the glue outlet 402 to evacuate the cavity 403, so that the glue flows out of the glue outlet 402.
Wherein, the encapsulating product 40 can be CG glass apron, aluminum alloy cover plate, ceramic cover plate etc., the glue inlet hole 401 and the glue outlet hole 402 of encapsulating product 40 can be used for bonding the part respectively, be equipped with a plurality of overflow holes respectively at the position of glue inlet hole 401 and glue outlet hole 402, when the colloid pours into from glue inlet hole 401, because the evacuation in the cavity 403, the colloid can get into in the cavity 403, and after filling up in the cavity 403, spill over from the overflow hole, then will bond the part at glue inlet hole 401 and glue outlet hole 402 position in the follow-up assembly process, it can be understood that the colloid can spill over from the overflow hole when filling up in cavity 403, make the encapsulating speed faster, the encapsulating effect is better.
When the floating plate 10 is driven, the vacuum pumping glue filling mechanism provided by the invention can drive the glue filling assembly 20 to extend into the glue inlet hole 401 and fill glue into the cavity 403, and meanwhile, the glue pumping assembly 30 extends into the glue outlet hole 402 to vacuum the cavity 403, so that the glue can be completely filled in the cavity 403 and flows out from the glue outlet hole 402, the glue flow rate is higher, the glue filling rate is higher, and the productivity is effectively improved.
Referring to fig. 4, the glue dispensing assembly 30 includes a first adjusting plate 31, a second adjusting plate 32 and a third adjusting plate 33, the first adjusting plate 31 having a vertical end and a horizontal end, the vertical end being movably connected to the floating plate 10 in a vertical direction; one end of the second adjusting plate 32 is movably connected with the horizontal end; the third adjusting plate 33 is movably connected to the other end of the second adjusting plate 32.
Furthermore, the vertical end is provided with a first strip-shaped hole 311 extending along the vertical direction, and the first strip-shaped hole 311 is connected with the floating plate 10; the horizontal end is provided with a second strip-shaped hole 312 extending along the horizontal direction, the third adjusting plate 33 is provided with a third strip-shaped hole 331 extending along the horizontal direction, the second strip-shaped hole 312 and the third strip-shaped hole 331 are perpendicular to each other, and the connecting holes 321 arranged at the two ends of the second adjusting plate 32 are respectively connected with the second strip-shaped hole 312 and the third strip-shaped hole 331.
In this embodiment, the connecting seat 34 is connected to the third adjusting plate 33, the glue-extracting head 35 is disposed at the lower end of the connecting seat 34, the first strip-shaped hole 311 and the floating plate 10 can be fixed by bolts, and when the vertical height of the glue-extracting head 35 is adjusted, the height of the connecting seat 34 and the glue-extracting head 35 is adjusted in the vertical direction along with the first adjusting plate 31 by moving and adjusting the first adjusting plate 31 in the vertical direction; the connecting holes 321 at the two ends of the second adjusting plate 32 can be fixed with the second strip-shaped holes 312 and the third strip-shaped holes 331 through bolts, and when the horizontal position of the glue extracting head 35 is adjusted to be aligned with the glue outlet hole 402, the horizontal position of the glue extracting head 35 can be adjusted to be aligned with the glue outlet hole 402 by adjusting the relative positions of the second adjusting plate 32 and the first adjusting plate 31 and the relative positions of the third adjusting plate 33 and the second adjusting plate 32; it can be understood that, through the first adjusting plate 31, the second adjusting plate 32 and the third adjusting plate 33, the three-axis direction of the glue-extracting head 35 can be moved and adjusted, the adjustment operation is simpler, and the distance between the glue-extracting head 35 and the glue-pouring product 40 and the precision of the glue-discharging hole 402 can be ensured to be more accurate.
Referring to fig. 3 and 4, the glue extracting assembly 30 includes a connecting seat 34, a glue extracting head 35, an elastic member 36 and a vacuum joint 37, wherein the upper end of the connecting seat 34 is connected to a third adjusting plate 33; the rubber head 35 is sleeved at the lower end of the connecting seat 34; the elastic piece 36 is sleeved on the connecting seat 34 and abuts against the rubber head 35; a vacuum connection 37 is provided on the applicator head 35 for connection to a vacuum device for evacuating the applicator head 35.
In this embodiment, the vacuum device may be connected to the vacuum connector 37 through an air pipe, during the process of filling and vacuuming the glue, the glue filling assembly 20 aligns with the floating plate 10 and presses down the glue inlet 401, and the glue pumping head 35 aligns with the glue outlet 402 and presses down with the floating plate 10, so that the filling and vacuuming can be performed simultaneously, and the speed of filling the glue is increased; moreover, when the glue-extracting head 35 is pressed down on the glue outlet 402, the elastic part 36 can elastically buffer the glue-extracting head 35, so that the glue-extracting head 35 is prevented from crushing the glue-pouring product 40, and the yield of the glue-pouring product 40 is improved.
Specifically, the top of the connecting seat 34 is provided with a detecting sensor 38, and the detecting sensor 38 is used for detecting the glue in the glue hole 402 to control the glue filling assembly 20 to start or stop.
In this embodiment, the detection sensor 38 may be electrically connected to the main controller to achieve signal transmission control, the connection seat 34 is communicated with the glue-extracting head 35, the detection sensor 38 may monitor whether the glue outlet 402 discharges glue through the connection seat 34 and the glue-extracting head 35, and when the glue outlet 402 discharges glue, the main controller may control the glue-pouring assembly 20 to stop pouring glue by sending a signal; when the glue outlet hole 402 does not discharge glue, a signal is sent to enable the main controller to control the glue pouring assembly 20 to start glue pouring, so that the monitoring is more accurate, and the glue pouring effect is better.
Referring to fig. 6, a vacuum valve 50 is further included, and the vacuum valve 50 is in communication with the vacuum connector 37 for adjusting the vacuum pressure of the glue dispensing head 35. Wherein, vacuum apparatus can be connected to vacuum valve 50 through the trachea, and vacuum valve 50 rethread trachea is linked together with vacuum joint 37, when adjusting the vacuum pressure who takes out gluey head 35, can adjust the vacuum pressure who takes out gluey head 35 through vacuum valve 50 for take out gluey pressure controllable of taking out gluey head 35, and control more accurately, avoid the colloid not take out the scheduling situation.
Referring to fig. 5, the glue filling assembly 20 includes a connection plate 21, two glue cartridges 22 and a glue filling head 23, wherein the connection plate 21 is disposed on the floating plate 10; two rubber cylinders 22 are arranged on the connecting plate 21; the glue filling head 23 is arranged on the connecting plate 21 and communicated with the two glue cylinders 22.
In this embodiment, the glue may be AB glue, and the two glue cartridges 22 may contain the AB glue, and mix the AB glue, and inject the mixed AB glue into the glue filling head 23, so that the glue filling head 23 may press down on the glue filling product 40 to fill the glue; the glue filling head 23 is provided with a spring for providing elastic buffering, so that the buffering effect is better in the process of pressing the glue filling head 23 down for glue filling, the damage to the glue filling head 23 or a glue filling product 40 is avoided, and the safety is higher; as can be understood by those skilled in the art, since the AB glue is a glue close to solid state and has a slow flow rate, the glue is pumped through the glue pumping head 35, and the glue filling rate is faster during glue filling.
Referring to fig. 5, a base plate 60 is provided at a side of the floating plate 10 away from the potting unit 20, the floating plate 10 is slidably connected to the base plate 60, and an air cylinder 70 is provided on the base plate 60, and the air cylinder 70 is used for driving the floating plate 10 to slide on the base plate 60 in a vertical direction. Wherein, the piston rod of the cylinder 70 is connected with the floating plate 10, when the piston rod of the cylinder 70 extends, the floating plate 10 is driven by the cylinder 70 to move downwards; when the piston rod of the air cylinder 70 retracts, the floating plate 10 is driven by the air cylinder 70 to move upwards, so that the glue filling head 23 and the glue pumping head 35 can synchronously press down on the glue filling product 40 and synchronously leave the glue filling product 40, and the use is more convenient and simpler.
Further, a tension spring 80 is further included, and one end of the tension spring 80 is connected to the base plate 60, and the other end is connected to the floating plate 10.
In this embodiment, the tension spring 80 can overcome the gravity of the floating plate 10 and the glue filling assembly 20, so that the floating plate 10 has a better buffering effect in the ascending or descending process, the damage to the glue filling product 40 caused by the gravity of the floating plate 10 and the glue filling assembly 20 can be avoided, and the stability is better.
The glue filling equipment provided by the embodiment of the invention comprises the vacuumizing glue filling mechanism. Wherein, this encapsulating equipment installs foretell evacuation encapsulating mechanism for this encapsulating equipment can irritate the gluey product 40 through foretell evacuation encapsulating mechanism and carry out the encapsulating, and its technical effect and technical scheme all are unanimous with the above-mentioned, no longer give unnecessary detail here.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. The utility model provides a vacuum pumping encapsulating mechanism for to encapsulating product encapsulating, encapsulating product has into gluey hole and goes out gluey hole, advance gluey hole with go out gluey hole via cavity in the encapsulating product communicates each other, vacuum pumping encapsulating mechanism includes:
a floating plate movable in a vertical direction when driven;
the glue filling assembly is arranged on the floating plate and used for extending into the glue inlet hole to fill the glue into the cavity;
and the glue pumping assembly is arranged on the floating plate and is adjacent to the glue pouring assembly, and is used for extending into the glue outlet hole to vacuumize the cavity so that the glue flows out of the glue outlet hole.
2. The vacuum pumping and glue filling mechanism according to claim 1, wherein the glue pumping assembly comprises:
the first adjusting plate is provided with a vertical end and a horizontal end, and the vertical end is movably connected with the floating plate along the vertical direction;
one end of the second adjusting plate is movably connected with the horizontal end;
a third adjustment plate movably connected to the other end of the second adjustment plate.
3. The vacuum pumping and glue filling mechanism according to claim 2, wherein the glue pumping assembly comprises:
the upper end of the connecting seat is connected with the third adjusting plate;
the glue extracting head is sleeved at the lower end of the connecting seat;
the elastic piece is sleeved on the connecting seat and abuts against the glue extracting head;
and the vacuum joint is arranged on the glue pumping head and used for being connected to vacuum equipment to vacuumize the glue pumping head.
4. The vacuum pumping glue pouring mechanism according to claim 3, wherein a detection sensor is arranged at the top of the connecting seat and used for detecting the glue in the glue outlet hole so as to control the glue pouring assembly to start or stop.
5. The vacuum pumping and glue pouring mechanism according to claim 3, further comprising a vacuum valve, wherein the vacuum valve is communicated with the vacuum joint for adjusting the vacuum pressure of the glue pumping head.
6. The vacuum pumping glue filling mechanism as claimed in claim 2, wherein the vertical end has a first strip-shaped hole extending along the vertical direction, and the first strip-shaped hole is connected with the floating plate;
the second bar hole that extends along the horizontal direction has on the horizontal end, be equipped with the third bar hole that extends along the horizontal direction on the third regulating plate, second bar hole with third bar hole mutually perpendicular, the connecting hole that second regulating plate both ends were equipped with respectively with second bar hole with third bar hole links to each other.
7. The vacuum pumping glue filling mechanism according to claim 1, wherein the glue filling assembly comprises:
the connecting plate is arranged on the floating plate;
the two rubber cylinders are arranged on the connecting plate;
and the glue filling head is arranged on the connecting plate and is communicated with the two glue cylinders.
8. The vacuum pumping glue pouring mechanism according to claim 1, wherein a base plate is arranged on a side of the floating plate facing away from the glue pouring assembly, the floating plate is slidably connected with the base plate, and an air cylinder is arranged on the base plate and used for driving the floating plate to slide on the base plate in a vertical direction.
9. The vacuum pumping glue filling mechanism according to claim 8, further comprising a tension spring, wherein one end of the tension spring is connected with the base plate, and the other end of the tension spring is connected with the floating plate.
10. A glue filling apparatus comprising the vacuum glue filling mechanism as claimed in any one of claims 1 to 9.
CN202110852255.0A 2021-07-27 2021-07-27 Vacuumizing glue filling mechanism and glue filling equipment Pending CN113650308A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110852255.0A CN113650308A (en) 2021-07-27 2021-07-27 Vacuumizing glue filling mechanism and glue filling equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110852255.0A CN113650308A (en) 2021-07-27 2021-07-27 Vacuumizing glue filling mechanism and glue filling equipment

Publications (1)

Publication Number Publication Date
CN113650308A true CN113650308A (en) 2021-11-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110852255.0A Pending CN113650308A (en) 2021-07-27 2021-07-27 Vacuumizing glue filling mechanism and glue filling equipment

Country Status (1)

Country Link
CN (1) CN113650308A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115445854A (en) * 2022-09-09 2022-12-09 王二虎 RFID antenna side cut detects integral type equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115445854A (en) * 2022-09-09 2022-12-09 王二虎 RFID antenna side cut detects integral type equipment

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