CN113643850A - Cable with intelligent temperature sensing core and temperature sensing chip - Google Patents
Cable with intelligent temperature sensing core and temperature sensing chip Download PDFInfo
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- CN113643850A CN113643850A CN202110856417.8A CN202110856417A CN113643850A CN 113643850 A CN113643850 A CN 113643850A CN 202110856417 A CN202110856417 A CN 202110856417A CN 113643850 A CN113643850 A CN 113643850A
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- 238000010792 warming Methods 0.000 claims description 2
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- 229920003020 cross-linked polyethylene Polymers 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/32—Insulated conductors or cables characterised by their form with arrangements for indicating defects, e.g. breaks or leaks
- H01B7/324—Insulated conductors or cables characterised by their form with arrangements for indicating defects, e.g. breaks or leaks comprising temperature sensing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/323—Thermally-sensitive members making use of shape memory materials
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- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
The application discloses take cable and temperature sensing chip of intelligence temperature sensing core, this cable includes: cable core, intelligent chip layer and outer jacket set up the temperature sensing chip in the intelligent chip layer, and the temperature sensing chip includes: the coil is used for inducing an electric field and/or a magnetic field generated when current passes through the cable core and supplying power to the temperature sensing chip after induction: the temperature measuring module is used for measuring the temperature of the cable core; the wireless communication module is used for at least transmitting the temperature to the outside of the cable in a wireless way; and the memory alloy switch enables the coil to supply power to the temperature measuring module and the wireless communication module in the on state, stops supplying power to the temperature measuring module and the wireless communication module in the off state, and switches between the on state and the off state by using the extension and the shortening of the memory alloy. Through this application solve among the prior art passive temperature measurement chip be in operating condition always and lead to reducing the problem of operational life to passive temperature measurement chip's operational life has been improved.
Description
Technical Field
The application relates to the field of cables, in particular to a cable with an intelligent temperature sensing core and a temperature sensing chip.
Background
At present, the national grid company puts forward the demand of building energy internet, needs to carry out the temperature measurement to the cable, and the temperature measurement device is generally planted to the cable temperature measurement, for example, but the optic fibre temperature measurement signal of can planting optic fibre temperature measurement is cable transmission and optic fibre accepts easy emergence fracture in laying process, influences the temperature measurement effect. In addition, the optical fiber added into the cable cannot position the cable, and particularly, a plurality of cables are arranged in a laying facility, so that the position of a fault cable is difficult to determine quickly when the cable runs and fails, and inconvenience is brought to emergency maintenance.
In another mode, a passive wireless temperature measurement chip can be implanted in the cable, and the chip can be used in the case that the current passing through the cable exceeds a threshold value, generally, the current passing through the cable exceeds the threshold value to generate an electric field and/or a magnetic field, and a coil configured in the passive wireless temperature measurement chip is used for sensing the magnetic field and/or the electric field to generate electric energy, and the electric energy is used for driving the wireless communication module and the temperature measurement module to work.
The passive wireless temperature measuring chip embedded in the cable has own technical requirements, wherein the working life is an important requirement. The current requirement of the working life of the passive wireless temperature measuring chip implanted in the cable is 30 years.
The passive wireless temperature measurement chip (or called temperature sensing chip, intelligent chip and the like) is implanted into the cable, and the current inside the cable is generally continuously transmitted, so the passive wireless temperature measurement chip can be always in a working state, the working life of the passive wireless temperature measurement chip is greatly reduced, and a related solution is not provided in the prior art aiming at the problem.
Disclosure of Invention
The embodiment of the application provides a cable with an intelligent temperature sensing core and a temperature sensing chip, and aims to solve the problem that in the prior art, a passive temperature sensing chip is always in a working state to reduce the working life.
According to an aspect of the present application, there is provided a cable with an intelligent temperature sensing core, comprising: cable core, intelligent chip layer and outer jacket, the chip of warming in setting up in the intelligent chip layer, wherein, the temperature sensing chip includes: the coil is used for inducing an electric field and/or a magnetic field generated when current flows in the cable core and supplying power to the temperature sensing chip after induction: the temperature measuring module is used for measuring the temperature of the cable core; a wireless communication module for wirelessly transmitting at least the temperature out of the cable; and a memory alloy switch which, in an on state, causes the coil to supply power to the temperature measurement module and the wireless communication module, and, in an off state, stops supplying power to the temperature measurement module and the wireless communication module, wherein the memory alloy switch switches between the on state and the off state using elongation and contraction of a memory alloy.
Further, still include: the isolation layer is arranged between the cable core and the intelligent chip layer and used for spacing the cable core and the intelligent chip layer.
Furthermore, the intelligent chip layer is provided with a plurality of temperature sensing chips at the same angle interval on the circumferential plane at the same position of the cable core.
Further, the number of the plurality of temperature sensing chips is three.
Furthermore, the temperature sensing chip is arranged at a position of a preset distance in the direction of the length of the cable on the intelligent chip layer.
Furthermore, one end of the memory alloy switch is connected with the coil in series, the other end of the memory alloy switch is connected with the temperature measurement module and the wireless communication module in series, the memory alloy switch is communicated with the coil and the temperature measurement module and the wireless communication module in a conducting state, and the memory alloy switch is disconnected with the coil and the temperature measurement module and the wireless communication module in a disconnecting state.
Further, memory alloy silk in the memory alloy switch is encapsulated in having certain space and box body, the box body be the cuboid, the cuboid is provided with the conducting strip with length direction vertically both sides side, conducting strip in the side in the both sides side with the coil is connected, conducting strip in another side in the both sides side with temperature measurement module with wireless communication module connects, memory alloy silk is in shrink or extension on length direction breaks down the coil with temperature measurement module with be connected between the wireless communication module, intercommunication under the extended state the coil with temperature measurement module with wireless communication module.
According to another aspect of the present application, there is also provided a temperature sensing chip for a cable interior, including: the coil is used for inducing an electric field and/or a magnetic field generated when current flows in the cable core and supplying power to the temperature sensing chip after induction: the temperature measuring module is used for measuring the temperature of the cable core; a wireless communication module for wirelessly transmitting at least the temperature out of the cable; and a memory alloy switch which, in an on state, causes the coil to supply power to the temperature measurement module and the wireless communication module, and, in an off state, stops supplying power to the temperature measurement module and the wireless communication module, wherein the memory alloy switch switches between the on state and the off state using elongation and contraction of a memory alloy.
Furthermore, one end of the memory alloy switch is connected with the coil in series, the other end of the memory alloy switch is connected with the temperature measurement module and the wireless communication module in series, the memory alloy switch is communicated with the coil and the temperature measurement module and the wireless communication module in a conducting state, and the memory alloy switch is disconnected with the coil and the temperature measurement module and the wireless communication module in a disconnecting state.
Further, memory alloy silk in the memory alloy switch is encapsulated in having certain space and box body, the box body be the cuboid, the cuboid is provided with the conducting strip with length direction vertically both sides side, conducting strip in the side in the both sides side with the coil is connected, conducting strip in another side in the both sides side with temperature measurement module with wireless communication module connects, memory alloy silk is in shrink or extension on length direction breaks down the coil with temperature measurement module with be connected between the wireless communication module, intercommunication under the extended state the coil with temperature measurement module with wireless communication module.
In this application embodiment, cable core, intelligent chip layer and outer jacket have been adopted, the chip that warms up is felt in setting up in the intelligent chip layer, wherein, the temperature sensing chip includes: the coil is used for inducing an electric field and/or a magnetic field generated when current flows in the cable core and supplying power to the temperature sensing chip after induction: the temperature measuring module is used for measuring the temperature of the cable core; a wireless communication module for wirelessly transmitting at least the temperature out of the cable; and a memory alloy switch which, in an on state, causes the coil to supply power to the temperature measurement module and the wireless communication module, and, in an off state, stops supplying power to the temperature measurement module and the wireless communication module, wherein the memory alloy switch switches between the on state and the off state using elongation and contraction of a memory alloy. Through the application, the problem that the working life of the passive temperature measurement chip is reduced because the passive temperature measurement chip is always in a working state in the prior art is solved, and therefore the working life of the passive temperature measurement chip is prolonged.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application. In the drawings:
fig. 1 is a schematic view of a cable according to an embodiment of the present application.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
It should be noted that the steps illustrated in the flowcharts of the figures may be performed in a computer system such as a set of computer-executable instructions and that, although a logical order is illustrated in the flowcharts, in some cases, the steps illustrated or described may be performed in an order different than presented herein.
In the embodiment, the intelligent temperature sensing chip is improved. The intelligent temperature sensing chip is a passive wireless temperature sensing chip (or a chip for intelligent energy, an intelligent chip and the like), and can be arranged inside a cable in a pasting mode. For example, in an alternative embodiment, a method of how to manufacture such a cable is presented.
The manufacturing method of the chip embedded type plastic armored intelligent power cable for the intelligent energy comprises the following steps:
step one, determining a cable structure;
in the first step, a disc frame twisting machine can be adopted to carry out circular pressing and twisting on the metal monofilament to manufacture a conductor; and co-extruding the semi-conductive conductor shielding layer, the crosslinked polyethylene insulating layer and the semi-conductive insulating shielding layer by a CCV catenary production line.
Step two, manufacturing an insulated wire core; after the manufactured insulated wire core is heated and degassed in a drying room, a metal shielding layer is wrapped; if a single insulated wire core structure is adopted, the insulated wire core is coated with the metal shielding layer to form a cable core; if a structure with a plurality of insulated wire cores is adopted, a metal shielding layer is coated outside each insulated wire core, and then a disc stranding machine is adopted for stranding the plurality of wire cores;
step three: manufacturing a cable core and an isolation layer, adding an intelligent chip layer and fastening the protection layer; stranding the insulated wire cores coated with the metal shielding layers into a cable core by using a cabling machine; when a plurality of insulated wire cores are adopted, a filling layer is added in the intertwisted middle gap; two layers of ultrathin light plain non-woven fabrics are alternately and lapped outside the cable core to manufacture an isolating layer; manually attaching a self-adhesive intelligent chip at a pre-designed monitoring position to manufacture an intelligent chip layer, marking the chip position and recording the rice mark of the insulated wire core; wrapping ultrathin light plain non-woven fabric outside the self-adhesive intelligent chip, wherein the non-woven fabric exceeds the self-adhesive intelligent chip by 2 times of the length, and fastening the two ends of the non-woven fabric by using adhesive tapes to manufacture a fastening protective layer; if a single insulated wire core is adopted, 2-4 self-adhesive intelligent chips are placed, the length direction of the chips is consistent with the axial direction of the cable, and the chips are uniformly distributed along the circumferential direction of the cable core; if a plurality of insulating wire cores are adopted, at least 1 self-adhesive intelligent chip is arranged outside the metal shield of each insulating wire core; gaps are reserved among the self-adhesive intelligent chips and are not overlapped;
step four: manufacturing an inner liner; extruding and wrapping a polyethylene or polyvinyl chloride protective layer as an inner liner;
step five: manufacturing a plastic armor layer; double-layer gap lapping of a polyester plastic belt with the thickness of 1mm by using a steel belt armoring machine, wherein the gap rate is controlled to be 30-40% of the belt width, and a lapping head is provided with a stopper; the polyester type plastic belt is connected by adopting a high-pressure device in a compression joint mode, and a hot drying gun is adopted to heat the compression joint position;
step six: manufacturing an outer protective layer; and a layer of polyethylene or polyvinyl chloride is extruded outside the plastic armor layer to be used as an outer protective layer.
The cable produced in this way has the following construction:
the cable comprises a cable core, an isolation layer, an intelligent chip layer, a fastening protection layer, an inner liner, a plastic armor layer and an outer protective layer from inside to outside in sequence; the cable core comprises at least one insulated wire core; the intelligent chip layer comprises self-adhesive intelligent chips of which the number is multiple of the number of the insulated wire cores; the self-adhesive intelligent chips comprise test chips, antennas and packaging materials for packaging the test chips and the antennas together, and the length directions of the chips of the respective adhesive intelligent chips are along the axial direction of the cable and are uniformly distributed along the circumferential direction of the cable core; the fastening protective layer corresponds to the respective adhesive intelligent chips of the intelligent chip layer one by one; the plastic armor layer is a double-layer plastic steel belt gap lapping, and the gap rate is controlled to be 30% -40% of the width of the plastic steel belt.
When the cable core comprises a plurality of insulating wire cores, at least one self-adhesive intelligent chip is placed at each insulating wire core.
The fastening protective layer comprises an ultrathin light plain non-woven fabric wrapping tape and an adhesive tape compatible with a cable material; the ultrathin light plain non-woven fabric wrapping belt completely covers the self-adhesive intelligent chip and exceeds 2 times of the length of the chip, and the two exceeding ends are sealed by adhesive tapes; the thickness of the ultrathin light plain non-woven fabric is 0.1mm, and the longitudinal tearing strength is more than 50N/15 mm.
The plastic steel belt of the plastic armor layer is a polyester plastic belt, the thickness of the polyester plastic belt is 1mm, the tensile strength is not less than 300N/mm, and staggered grains are uniformly pressed on the front surface and the back surface of the polyester plastic belt; the polyester type plastic belt joint is pressed under the high pressure action by adopting a compression joint device and is heated by a heat drying gun, and the inner surface of the polyester type plastic belt at the compression joint is contacted with the lining layer.
The isolation layer is two layers of ultrathin light plain non-woven fabric wrapping, double-layer inner right and outer left crossed overlapping wrapping is adopted when the cable core comprises a multi-core insulated wire core, and single-layer left overlapping wrapping is adopted when the cable core is a single insulated wire core; the thickness of the ultrathin light plain non-woven fabric is 0.1mm, and the longitudinal tearing strength is more than 50N/15 mm.
The thickness of self-adhesion type intelligent chip is 1.5mm, and length is 40 ~ 50mm, and the width is 10 ~ 20 mm.
The inner liner is formed by extruding medium-density polyethylene or 90 ℃ polyvinyl chloride material; the outer protective layer is formed by extruding and wrapping polyethylene or polyvinyl chloride.
Each insulated wire core sequentially comprises a conductor, a semi-conductive conductor shielding layer, a crosslinked polyethylene insulating layer and a semi-conductive insulating shielding layer from inside to outside; a metal shielding layer is arranged outside the insulated wire core; when the cable core comprises a plurality of insulating wire cores, a filling layer is arranged between the metal shielding layer and the isolation layer. The chips mentioned in the above embodiments are, for example: the self-adhesive smart chip is the chip described in this embodiment.
The cable structure is a relatively preferable complex structure, and in this embodiment, a relatively simple cable with an intelligent temperature sensing core may further be provided, including: cable core 1, intelligent chip layer 2 and outer jacket 3, temperature sensing chip 4 in setting up in the intelligent chip layer, wherein, temperature sensing chip 4 (not shown in the structure chart of temperature sensing chip) includes: the coil is used for inducing an electric field and/or a magnetic field generated when current flows in the cable core and supplying power to the temperature sensing chip after induction: the temperature measuring module is used for measuring the temperature of the cable core; a wireless communication module for wirelessly transmitting at least the temperature out of the cable; and a memory alloy switch which, in an on state, causes the coil to supply power to the temperature measurement module and the wireless communication module, and, in an off state, stops supplying power to the temperature measurement module and the wireless communication module, wherein the memory alloy switch switches between the on state and the off state using elongation and contraction of a memory alloy. The memory alloy wire in the memory alloy switch is stretched when the temperature is higher than the preset temperature, the memory alloy switch is switched on after the stretching, the memory alloy switch is switched off when the temperature is lower than the preset temperature, and the memory alloy switch is switched off after the shortening. For example, the predetermined temperature is 60 degrees. Since it is not necessary to monitor the cable if the temperature in the cable is not high, and temperature monitoring is required if the cable temperature continues to rise above a predetermined temperature. In the embodiment, the temperature sensing chip can be ensured not to be always in a working state, but also to be capable of reporting the temperature when the temperature rises, and the working life is prolonged.
Optionally, the method further comprises: and the isolation layer (not shown in the figure) is arranged between the cable core and the intelligent chip layer and used for spacing the cable core and the intelligent chip layer.
In an optional embodiment, the intelligent chip layer is configured with a plurality of temperature sensing chips at the same position of the cable core on the circumferential plane at the same angle interval. For example, the plurality of temperature sensing chips is three in number. The temperature sensing of the memory alloy wires in each temperature sensing chip is different, the memory alloy wires in the first temperature sensing chip stretch and conduct the memory alloy switch when the temperature exceeds a first temperature, the memory alloy wires in the second temperature sensing chip stretch and conduct the memory alloy switch when the temperature exceeds a second temperature, the memory alloy wires in the third temperature sensing chip stretch and conduct the memory alloy switch when the temperature exceeds a third temperature, the third temperature is higher than the second temperature, and the second temperature is higher than the first temperature.
In a preferred embodiment, the temperature sensing chip is disposed at a position spaced apart from the smart chip layer by a predetermined distance in a direction of the length of the cable. The separation distance may be determined according to the transmission distance of the wireless communication module, and the separation distance is 0.8 times the wireless transmission distance, for example, the separation distance is 160 meters if the wireless transmission distance is 200 meters.
The wireless communication modules each have their own unique number, which is editable, for uniquely identifying the wireless communication module in the cable. When the wireless communication module transmits the temperature, the unique number of the wireless communication module is transmitted, so that the wireless communication module is favorable for positioning.
Optionally, one end of the memory alloy switch is connected in series with the coil, the other end of the memory alloy switch is connected in series with the temperature measurement module and the wireless communication module, the memory alloy switch is communicated with the coil and the temperature measurement module and the wireless communication module in a conducting state, and the memory alloy switch is disconnected from the coil and the temperature measurement module and the wireless communication module in a disconnecting state.
The memory alloy switch has a plurality of realization modes, for example, a memory alloy wire in the memory alloy switch is packaged in a box body with a certain space, the box body is a cuboid, two side surfaces of the cuboid, which are vertical to the length direction, are provided with conducting strips, one side surface of the two side surfaces is connected with the coil, the conducting strip of the other side surface of the two side surfaces is connected with the temperature measurement module and the wireless communication module, the memory alloy wire contracts or extends in the length direction, is disconnected in the contraction state, the coil is connected with the temperature measurement module and the wireless communication module, and is communicated with the temperature measurement module and the wireless communication module in the extension state.
The temperature sensing chip 4 can be sold, manufactured or used separately, that is, in this embodiment, there is also provided a temperature sensing chip 4 for use inside a cable, including: the coil is used for inducing an electric field and/or a magnetic field generated when current flows in the cable core and supplying power to the temperature sensing chip after induction: the temperature measuring module is used for measuring the temperature of the cable core; a wireless communication module for wirelessly transmitting at least the temperature out of the cable; and a memory alloy switch which, in an on state, causes the coil to supply power to the temperature measurement module and the wireless communication module, and, in an off state, stops supplying power to the temperature measurement module and the wireless communication module, wherein the memory alloy switch switches between the on state and the off state using elongation and contraction of a memory alloy.
Optionally, one end of the memory alloy switch is connected in series with the coil, the other end of the memory alloy switch is connected in series with the temperature measurement module and the wireless communication module, the memory alloy switch is communicated with the coil and the temperature measurement module and the wireless communication module in a conducting state, and the memory alloy switch is disconnected from the coil and the temperature measurement module and the wireless communication module in a disconnecting state.
Optionally, memory alloy silk in the memory alloy switch is encapsulated in having certain space and box body, the box body be the cuboid, the cuboid is provided with the conducting strip with length direction vertically both sides side, conducting strip in the side in the both sides side with the coil is connected, conducting strip in another side in the both sides side with temperature measurement module with wireless communication module connects, memory alloy silk is in shrink or extension on the length direction breaks down the coil with temperature measurement module with be connected between the wireless communication module, intercommunication under the extended state the coil with temperature measurement module with wireless communication module.
In this application embodiment, cable core, intelligent chip layer and outer jacket have been adopted, the chip that warms up is felt in setting up in the intelligent chip layer, wherein, the temperature sensing chip includes: the coil is used for inducing an electric field and/or a magnetic field generated when current flows in the cable core and supplying power to the temperature sensing chip after induction: the temperature measuring module is used for measuring the temperature of the cable core; a wireless communication module for wirelessly transmitting at least the temperature out of the cable; and a memory alloy switch which, in an on state, causes the coil to supply power to the temperature measurement module and the wireless communication module, and, in an off state, stops supplying power to the temperature measurement module and the wireless communication module, wherein the memory alloy switch switches between the on state and the off state using elongation and contraction of a memory alloy. Through the application, the problem that the working life of the passive temperature measurement chip is reduced because the passive temperature measurement chip is always in a working state in the prior art is solved, and therefore the working life of the passive temperature measurement chip is prolonged.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. The utility model provides a take cable of intelligence temperature sensing core which characterized in that includes: cable core, intelligent chip layer and outer jacket, the chip of warming in setting up in the intelligent chip layer, wherein, the temperature sensing chip includes:
the coil is used for inducing an electric field and/or a magnetic field generated when current flows in the cable core and supplying power to the temperature sensing chip after induction:
the temperature measuring module is used for measuring the temperature of the cable core;
a wireless communication module for wirelessly transmitting at least the temperature out of the cable;
and a memory alloy switch which, in an on state, causes the coil to supply power to the temperature measurement module and the wireless communication module, and, in an off state, stops supplying power to the temperature measurement module and the wireless communication module, wherein the memory alloy switch switches between the on state and the off state using elongation and contraction of a memory alloy.
2. The cable of claim 1, further comprising:
the isolation layer is arranged between the cable core and the intelligent chip layer and used for spacing the cable core and the intelligent chip layer.
3. The cable of claim 1, wherein the intelligent chip layer is configured with a plurality of temperature sensing chips at the same angular intervals on the circumferential plane of the cable core at the same position.
4. The cable according to claim 3, wherein the plurality of temperature sensing chips is three in number.
5. The cable according to claim 3, wherein the smart chip layer is provided with the temperature sensing chip at a position spaced apart from each other by a predetermined distance in a direction of the length of the cable.
6. The cable according to any one of claims 1 to 5, wherein one end of the memory alloy switch is connected in series with the coil, the other end of the memory alloy switch is connected in series with the temperature measurement module and the wireless communication module, the memory alloy switch connects the coil with the temperature measurement module and the wireless communication module in a conducting state, and the memory alloy switch disconnects the coil from the temperature measurement module and the wireless communication module in a disconnecting state.
7. The cable according to claim 6, wherein the memory alloy wire in the memory alloy switch is enclosed in a box having a space and the box body is a rectangular parallelepiped, two side surfaces of the rectangular parallelepiped perpendicular to the length direction are provided with conductive sheets, the conductive sheet in one of the two side surfaces is connected to the coil, the conductive sheet in the other of the two side surfaces is connected to the temperature measurement module and the wireless communication module, the memory alloy wire contracts or extends in the length direction, the connection between the coil and the temperature measurement module and the wireless communication module is disconnected in a contracted state, and the coil is connected to the temperature measurement module and the wireless communication module in an extended state.
8. A temperature sensing chip for inside of a cable, comprising:
the coil is used for inducing an electric field and/or a magnetic field generated when current flows in the cable core and supplying power to the temperature sensing chip after induction:
the temperature measuring module is used for measuring the temperature of the cable core;
a wireless communication module for wirelessly transmitting at least the temperature out of the cable;
and a memory alloy switch which, in an on state, causes the coil to supply power to the temperature measurement module and the wireless communication module, and, in an off state, stops supplying power to the temperature measurement module and the wireless communication module, wherein the memory alloy switch switches between the on state and the off state using elongation and contraction of a memory alloy.
9. The temperature sensing chip according to claim 8, wherein one end of the memory alloy switch is connected in series with the coil, the other end of the memory alloy switch is connected in series with the temperature measuring module and the wireless communication module, the memory alloy switch connects the coil with the temperature measuring module and the wireless communication module in a conducting state, and the memory alloy switch disconnects the coil from the temperature measuring module and the wireless communication module in a disconnecting state.
10. The temperature sensing chip according to claim 9, wherein the memory alloy wire in the memory alloy switch is enclosed in a box having a space and the box body, the box body is a rectangular parallelepiped, two side surfaces of the rectangular parallelepiped perpendicular to the length direction are provided with conductive strips, the conductive strip in one of the two side surfaces is connected to the coil, the conductive strip in the other of the two side surfaces is connected to the temperature measuring module and the wireless communication module, the memory alloy wire contracts or extends in the length direction, the connection between the coil and the temperature measuring module and the wireless communication module is disconnected in a contracted state, and the coil is connected to the temperature measuring module and the wireless communication module in an extended state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110856417.8A CN113643850A (en) | 2021-07-28 | 2021-07-28 | Cable with intelligent temperature sensing core and temperature sensing chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110856417.8A CN113643850A (en) | 2021-07-28 | 2021-07-28 | Cable with intelligent temperature sensing core and temperature sensing chip |
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| CN113643850A true CN113643850A (en) | 2021-11-12 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203384439U (en) * | 2013-05-22 | 2014-01-08 | 吴桂芳 | Intelligent passive self-closing gas stop valve |
| KR20150000109A (en) * | 2013-06-24 | 2015-01-02 | (주)센큐브 | Cable with Shape Memory Alloy |
| CN107393645A (en) * | 2017-08-09 | 2017-11-24 | 远东电缆有限公司 | The wisdom energy moulds armouring intelligent power cable and manufacture method with chip built-in type |
| CN207834066U (en) * | 2017-12-29 | 2018-09-07 | 福州万山电力咨询有限公司 | A kind of reactor wind-cooling heat dissipating control device |
| CN109269651A (en) * | 2018-10-31 | 2019-01-25 | 江苏骏龙光电科技股份有限公司 | A kind of passive type radio temperature sensor for measuring transformer temperature |
-
2021
- 2021-07-28 CN CN202110856417.8A patent/CN113643850A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203384439U (en) * | 2013-05-22 | 2014-01-08 | 吴桂芳 | Intelligent passive self-closing gas stop valve |
| KR20150000109A (en) * | 2013-06-24 | 2015-01-02 | (주)센큐브 | Cable with Shape Memory Alloy |
| CN107393645A (en) * | 2017-08-09 | 2017-11-24 | 远东电缆有限公司 | The wisdom energy moulds armouring intelligent power cable and manufacture method with chip built-in type |
| CN207834066U (en) * | 2017-12-29 | 2018-09-07 | 福州万山电力咨询有限公司 | A kind of reactor wind-cooling heat dissipating control device |
| CN109269651A (en) * | 2018-10-31 | 2019-01-25 | 江苏骏龙光电科技股份有限公司 | A kind of passive type radio temperature sensor for measuring transformer temperature |
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