CN113643286B - Electronic component assembly detection method and system - Google Patents
Electronic component assembly detection method and system Download PDFInfo
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Abstract
The invention discloses a method and a system for detecting the assembly of electronic components, wherein the method comprises the following steps: acquiring first image information through the image acquisition and recognition equipment, performing feature recognition on the first image information to acquire a feature set, and acquiring connection attribute information according to the feature set; obtaining assembly detection standard information according to the connection attribute information; obtaining characteristic connection relation information according to the element identification characteristic, the connecting piece identification characteristic and the connection relation identification characteristic; performing feature traversal comparison on the feature connection relation information according to the assembly detection standard information to obtain a first comparison result; and obtaining a first detection report according to the first comparison result, and feeding back the first detection report. The technical problems that in the prior art, the component assembly detection method is not intelligent and the detection efficiency is low are solved.
Description
Technical Field
The invention relates to the technical field of intelligent detection, in particular to an electronic component assembly detection method and system.
Background
In the present society, the status of electronic components is very important, and the application range is also becoming larger and larger. Taking components as an example, the use quantity of the components is increased along with the rapid development of science and technology. For any electronic component, packaging and testing are required after the electronic component is produced, and finally, the detection results are bound with information such as models, batches and the like printed on the surface of the component. Therefore, the work such as investigation and tracing can be timely performed under the condition that the components and parts are in failure, and the electronic components and parts can be effectively ensured in all links of industrial production. However, the number of components is large, the inspection process is complex, and the manual operation of the information still occupies a large proportion at present. Due to the large number, the labor costs in this regard can also be very high, and intelligent detection is an important way to reduce costs.
In the process of realizing the technical scheme of the invention in the embodiment of the application, the inventor of the application finds that the above technology at least has the following technical problems:
the component assembly detection method in the prior art is not intelligent and has low detection efficiency.
Disclosure of Invention
The embodiment of the application solves the technical problems of the prior art that the component assembly detection method is not intelligent and the detection efficiency is low by providing the electronic component assembly detection method and the system. The intelligent detection of component assembly is achieved, and the technical effects of detection efficiency and accuracy of detection results are improved.
In view of the above, embodiments of the present application provide a method and a system for detecting assembly of electronic components.
In a first aspect, the present application provides an electronic component assembly detection method, where the method includes: acquiring first image information through the image acquisition and recognition equipment, wherein the first image information comprises electronic component assembly information; performing feature recognition on the first image information to obtain a feature set, wherein the feature set comprises element recognition features, connecting piece recognition features and connection relation recognition features; obtaining connection attribute information according to the feature set; obtaining assembly detection standard information according to the connection attribute information; obtaining characteristic connection relation information according to the element identification characteristic, the connecting piece identification characteristic and the connection relation identification characteristic; performing feature traversal comparison on the feature connection relation information according to the assembly detection standard information to obtain a first comparison result; and obtaining a first detection report according to the first comparison result, and feeding back the first detection report.
In another aspect, the present application further provides an electronic component assembly detection system, where the system includes: the first obtaining unit is used for obtaining first image information through the image acquisition and identification equipment, and the first image information comprises electronic component assembly information; the second obtaining unit is used for carrying out feature recognition on the first image information to obtain a feature set, wherein the feature set comprises element recognition features, connecting piece recognition features and connection relation recognition features; a third obtaining unit, configured to obtain connection attribute information according to the feature set; a fourth obtaining unit for obtaining assembly detection standard information according to the connection attribute information; a fifth obtaining unit for obtaining feature connection relationship information according to the element identification feature, the connector identification feature, and the connection relationship identification feature; the sixth obtaining unit is used for carrying out feature traversal comparison on the feature connection relation information according to the assembly detection standard information to obtain a first comparison result; and the first execution unit is used for obtaining a first detection report according to the first comparison result and feeding back the first detection report.
On the other hand, the embodiment of the application also provides a method and a system for detecting the assembly of electronic components, which comprise a memory, a processor and a computer program stored on the memory and capable of running on the processor, wherein the steps of the method in the first aspect are realized when the processor executes the program.
One or more technical solutions provided in the embodiments of the present application at least have the following technical effects or advantages:
the embodiment of the application provides an electronic component assembly detection method and system, wherein first image information is obtained through image acquisition and identification equipment, and the first image information comprises electronic component assembly information; performing feature recognition on the first image information to obtain a feature set, wherein the feature set comprises element recognition features, connecting piece recognition features and connection relation recognition features; obtaining connection attribute information according to the feature set; obtaining assembly detection standard information according to the connection attribute information; obtaining characteristic connection relation information according to the element identification characteristic, the connecting piece identification characteristic and the connection relation identification characteristic; performing feature traversal comparison on the feature connection relation information according to the assembly detection standard information to obtain a first comparison result; and obtaining a first detection report according to the first comparison result, and feeding back the first detection report. The technical problems that in the prior art, the component assembly detection method is not intelligent and the detection efficiency is low are solved. The intelligent detection of component assembly is achieved, and the technical effects of detection efficiency and accuracy of detection results are improved.
The foregoing description is a summary of the technical solutions of the present application, and may be implemented according to the content of the specification in order to make the technical means of the present application more clearly understood, and in order to make the above and other objects, features and advantages of the present application more clearly understood, the following detailed description of the present application is given.
Drawings
Fig. 1 is a flow chart of an electronic component assembly detection method according to an embodiment of the present application;
fig. 2 is a schematic flow chart of obtaining a feature set in an electronic component assembly detection method according to an embodiment of the present application;
fig. 3 is a schematic flow chart of a second comparison result obtained in the electronic component assembly detection method according to the embodiment of the present application;
fig. 4 is a schematic flow chart of obtaining first reminding information in the electronic component assembly detection method according to the embodiment of the application;
fig. 5 is a schematic flow chart of obtaining third reminding information in the electronic component assembly detection method according to the embodiment of the application;
fig. 6 is a schematic flow chart of obtaining a first detection report in the electronic component assembly detection method according to the embodiment of the present application;
fig. 7 is a schematic flow chart before obtaining a feature set in the electronic component assembly detection method according to an embodiment of the present application;
Fig. 8 is a schematic flow chart before obtaining a first image definition in the electronic component assembly detection method according to the embodiment of the present application;
fig. 9 is a schematic structural diagram of an electronic component assembly detection system according to an embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of an exemplary electronic device according to an embodiment of the present application.
Reference numerals illustrate: the device comprises a first obtaining unit 11, a second obtaining unit 12, a third obtaining unit 13, a fourth obtaining unit 14, a fifth obtaining unit 15, a sixth obtaining unit 16, a first executing unit 17, an electronic device 300, a memory 301, a processor 302, a communication interface 303, and a bus architecture 304.
Detailed Description
The embodiment of the application solves the technical problems of the prior art that the component assembly detection method is not intelligent and the detection efficiency is low by providing the electronic component assembly detection method and the system. The intelligent detection of component assembly is achieved, and the technical effects of detection efficiency and accuracy of detection results are improved.
In the following, example embodiments of the present application will be described in detail with reference to the accompanying drawings, it being apparent that the described embodiments are only some of the embodiments of the present application and not all of the embodiments of the present application, and it is to be understood that the present application is not limited by the example embodiments described herein.
In the present society, the status of electronic components is very important, and the application range is also becoming larger and larger. Taking components as an example, the use quantity of the components is increased along with the rapid development of science and technology. For any electronic component, packaging and testing are required after the electronic component is produced, and finally, the detection results are bound with information such as models, batches and the like printed on the surface of the component. Therefore, the work such as investigation and tracing can be timely performed under the condition that the components and parts are in failure, and the electronic components and parts can be effectively ensured in all links of industrial production. However, the number of components is large, the inspection process is complex, and the manual operation of the information still occupies a large proportion at present. Due to the large number, the labor costs in this regard can also be very high, and intelligent detection is an important way to reduce costs.
Aiming at the technical problems, the technical scheme provided by the application has the following overall thought:
the application provides an electronic component assembly detection method, which uses an assembly detection device, wherein the assembly detection device comprises an image acquisition and identification device, and the method comprises the following steps: acquiring first image information through the image acquisition and recognition equipment, wherein the first image information comprises electronic component assembly information; performing feature recognition on the first image information to obtain a feature set, wherein the feature set comprises element recognition features, connecting piece recognition features and connection relation recognition features; obtaining connection attribute information according to the feature set; obtaining assembly detection standard information according to the connection attribute information; obtaining characteristic connection relation information according to the element identification characteristic, the connecting piece identification characteristic and the connection relation identification characteristic; performing feature traversal comparison on the feature connection relation information according to the assembly detection standard information to obtain a first comparison result; and obtaining a first detection report according to the first comparison result, and feeding back the first detection report.
Having described the basic principles of the present application, various non-limiting embodiments of the present application will now be described in detail with reference to the accompanying drawings.
Example 1
As shown in fig. 1, an embodiment of the present application provides an electronic component assembly detection method, where the method uses an assembly detection device, where the assembly detection device includes an image acquisition and identification device, and the method includes:
step S100: acquiring first image information through the image acquisition and recognition equipment, wherein the first image information comprises electronic component assembly information;
step S200: performing feature recognition on the first image information to obtain a feature set, wherein the feature set comprises element recognition features, connecting piece recognition features and connection relation recognition features;
specifically, the image acquisition and recognition equipment is arranged on the assembly detection device and is mainly used for carrying out image acquisition on the assembly information of the electronic components to be detected, analyzing and recognizing the assembly information, and enabling the assembly information to be faster and more accurately detect whether the connection of the components is correct or not, and whether assembly errors such as missing welding, error welding or polarity inversion exist or not. The first image information includes assembly information of electronic components, namely specific element information, connector information for connection between elements, connection relationship between elements, and the like. The identification feature refers to a feature from which specific things can be analyzed. After the assembled components are subjected to image recognition, the assembly information is analyzed, the components are positioned, further, the connector information among the components, the connection relation among the components and the like are obtained, the characteristics of the components are recognized, and the components are arranged to form a characteristic set so as to improve the detection efficiency.
Step S300: obtaining connection attribute information according to the feature set;
step S400: obtaining assembly detection standard information according to the connection attribute information;
specifically, the connection attribute information refers to the interrelationship of the connection between the elements, such as specific connector information, how to connect, connection polarity relationship, and the like, and is obtained by matching the identification features of the image information with the database information based on the element feature database information, so as to derive standard connection information. The assembly detection standard information is a correct connection mode of the connection relation between the elements, is derived from the connection attribute information and is used for judging the electronic components to be detected, and the correctness of the connection relation between the elements is identified, so that the accuracy of detection of the assembled components is improved.
Step S500: obtaining characteristic connection relation information according to the element identification characteristic, the connecting piece identification characteristic and the connection relation identification characteristic;
step S600: performing feature traversal comparison on the feature connection relation information according to the assembly detection standard information to obtain a first comparison result;
step S700: and obtaining a first detection report according to the first comparison result, and feeding back the first detection report.
Specifically, the feature connection relationship information refers to the connection interrelationship between the elements, and is obtained based on the element identification feature, the connector identification feature and the connection relationship identification feature, and the connection relationship between the elements is known, so that the component assembly can be detected, and the judgment can be performed to see whether the connection relationship is correct. The first detection report is a table for recording the assembly result of the components to be detected, and the report is automatically generated according to the information fed back by the system. And carrying out feature traversal comparison on the assembly detection standard information pair and the feature connection relation information, and detecting whether the connection relation is consistent. If the first comparison result shows that the characteristic connection relation is consistent with the assembly detection standard, the component assembly is correct, namely, a correct detection report is fed back to the system; if the first comparison result shows that the characteristic connection relation is inconsistent with the assembly detection standard, the fact that the components are assembled with errors is indicated, a feedback report is generated according to the related errors detected by the system, and the explanation of the correct connection relation at the error position is provided for a detection user side based on a large database, so that assembly detection is fully automatic, and detection efficiency and accuracy are guaranteed.
Further, as shown in fig. 2, the feature recognition is performed on the first image information to obtain a feature set, and step S200 in the embodiment of the present application includes:
step S210: obtaining an element characteristic database;
step S220: identifying the first image information according to the element characteristic database, obtaining the element identification characteristics, and marking the element identification characteristics;
step S230: obtaining element connection characteristic information according to the element identification characteristic and the element characteristic database;
step S240: identifying the element identification features marked in the first image information according to the element connection feature information to obtain the connection piece identification features and connection relation identification features;
step S250: and obtaining the feature set according to the element identification feature, the connecting piece identification feature and the connection relation identification feature.
Specifically, the element characteristic database records characteristic data of all elements, integrates the characteristic data according to big data sharing and document records, and updates the characteristic data in real time to ensure the integrity of the database content. The component connection characteristic information is acquired based on a component characteristic database according to component identification characteristics, and corresponding connector identification characteristics in the database can be obtained through the component identification characteristics and the component connection characteristics. And arranging the element identification features, the connecting piece identification features and the connection relation identification features to obtain the feature set, so that the efficiency of component assembly detection is improved.
By recognizing the image, element recognition features are obtained,
further, as shown in fig. 3, step S800 in the embodiment of the present application includes:
step S810: obtaining the first element information according to the characteristic connection relation information;
step S820: obtaining a first connection port according to the first element information;
step S830: obtaining second element information according to the first element information and the first connection port, wherein the second element is connected with the first element through a first connection piece;
step S840: and so on, according to the second element information and the second connection port, obtaining third element information, wherein the third element is connected with the second element through a second connection element, and according to the first element information, the second element information and the N-th element information, a first connection line is obtained based on the characteristic connection relation information, the first connection line is a complete connection loop in the characteristic connection relation information with the first element as a starting point, the N-th connection element is a natural number, and the N-th connection element is the end element information of the first connection line;
step S850: according to the assembly detection standard information, performing feature comparison on the first connecting circuit to obtain a second comparison result;
Step S860: and obtaining a first connection line detection result according to the second comparison result.
Specifically, to ensure that the connection relation detection of each element is not missed, the system design performs overlay detection on each element according to the circuit connection mode. The first element is a detection starting point element of the whole connection closed-loop circuit, and generally, detection is started from a switch, so that the whole circuit is enabled, port information connected with other elements is obtained according to the first element, and information of the other elements connected with the first port is judged. The number of the elements connected with the ports can be multiple, and parallel route detection is carried out on the elements according to the current trend of the circuits so as to ensure the smoothness of the connection circuits. Starting to detect the first element, comparing connection relation and connection mode of one element by one element, determining to complete a complete connection loop, avoiding missing the elements, marking the element if the connection relation of the element at the middle part has detected error information, recording error problems until the connection relation of the last element in the closed loop is detected, and judging whether the problem exists or not, thereby improving the accuracy of system detection.
Further, as shown in fig. 4, step S900 in the embodiment of the present application further includes:
step S910: acquiring first element performance information according to the first element information;
step S920: acquiring second element performance information according to the second element information;
step S930: obtaining performance matching degree according to the first element performance information and the second element performance information;
step S940: judging whether the performance matching degree meets a first preset condition or not;
step S950: and when the performance matching degree is not met, obtaining first reminding information according to the performance matching degree.
Specifically, after the component assembly connection relationship is detected, and the result shows that there is no problem, performance detection is also performed on the component in order to further improve the service performance of the product. The detection method is the same as that of step 800, and according to the closed loop characteristics of the connection circuit, the detection of the related performance is performed from the first element, and after the performance detection of the first element is completed, the performance detection is performed on the second element connected with the first connection port through the connection port information of the first element until the detection of the last element is completed. The performance matching degree refers to the matching degree of performance among elements with connection relation, namely, after two elements are connected, the overall performance is improved or reduced, and if the performance is reduced, how to optimize the assembly result. The first predetermined condition is that the performance matching degree between the elements is high, and the connection can optimize the overall performance. When the performance matching degree does not meet the first preset condition, the overall performance of the components is reduced after the components are connected, at the moment, the system reminds workers, recommends other substitute components with higher matching performance to a detection user, optimizes the assembly result, and improves the overall performance after assembly.
Further, as shown in fig. 5, step S1000 in the embodiment of the present application includes:
step S1010: obtaining a first output threshold according to the first element performance information;
step S1020: obtaining first connector parameter information according to the first connector;
step S1030: obtaining parameter matching degree according to the first output threshold and the first connector parameter information;
step S1040: when the parameter matching degree does not meet a second preset condition, second reminding information is obtained;
step S1050: and when the parameter matching degree exceeds a third preset condition, obtaining third reminding information.
Specifically, in order to further improve the service performance of the product, the matching degree of the element and the connecting piece is also detected. The output first threshold value refers to information such as output power, specification and the like of the first element, and the service performance of the first element can be exerted only if the matching degree between the connecting piece and the element is high. For example, the output power of the element is high, but the power which can be born by the connecting piece connected with the element is small, and if the element is applied to a product, potential safety hazards can be caused; the specification of the element is small, but the connecting piece uses a larger specification, so that the waste of resources is caused, and the manufacturing cost of enterprises is increased. The first connector parameter information is a performance parameter of the first connector for calculating a degree of matching with the first element. The second preset condition is that the power of the connecting piece is not matched with the element, the connecting piece cannot meet the output requirement of the element, and in order to avoid potential safety hazards, workers are reminded during detection. The third preset condition is that the output threshold value of the connecting piece relative to the element exceeds a certain range, so that resource waste can be caused, and reminding is performed at the moment. The matching degree of the element and the connecting piece is detected, so that production data are saved, and the production cost is reduced.
Further, as shown in fig. 6, the step S700 of the embodiment of the present application includes:
step S710: judging whether the first comparison result has a first result or not, wherein the first result is mismatching information;
step S720: when the first comparison result exists in the first result, first matching standard information is obtained according to the first result and the assembly detection standard information;
step S730: and obtaining the first detection report according to the first matching standard information and the first result, wherein the first detection report is used for feeding back the first result and providing an adjustment suggestion according to the first matching standard information.
Specifically, the first detection report includes two kinds of detection reports, namely a correct detection report, an incorrect detection report and a corresponding incorrect modification suggestion. If the first comparison result shows that the assembly detection standard information is matched with the characteristic connection relation information, the fact that the components are assembled correctly is indicated, namely, a correct detection report is fed back to a system; if the first comparison result shows that the assembly detection standard information is not matched with the characteristic connection relation information, the fact that the components are assembled with errors is indicated, the error matching is detected according to the related error information detected by the system and the assembly detection standard information, and then the principle, the correct assembly mode and the explanation of the correct connection relation at the error position are obtained, so that a correct modification thought and a correct suggestion are provided for a detection user.
Further, as shown in fig. 7, before the feature recognition is performed on the first image information to obtain the feature set, step S200a in the embodiment of the present application includes:
step S210a: obtaining a first image definition according to the first image information;
step S220a: judging whether the first image definition meets a fourth preset condition or not;
step S230a: and when the image identification and collection are not met, obtaining fourth reminding information, wherein the fourth reminding information is used for reminding the user to carry out image identification and collection again.
Specifically, before the image acquisition and recognition equipment acquires the images of the components to be detected, the definition of the image acquisition and recognition equipment is detected, the higher the definition of the first image is, the more accurate the recognition result is obtained when the equipment analyzes the first image, so that the assembly and detection efficiency can be improved; if the first image has low definition, a certain element, a connecting piece and a connecting relation may not be identified, or the identification is wrong, which is important for the final detection result. The fourth predetermined condition is a condition that the pixel and frame rate of the image definition is low, and if the definition is lower than the condition, the error rate of the device identification result is increased. If the first image definition does not meet the fourth preset condition, the device definition is qualified, and reminding information is generated and used for reminding the user to carry out image recognition and collection again, so that accuracy of component recognition results is improved.
Further, as shown in fig. 8, before the obtaining the first image sharpness according to the first image information, step S210a in the embodiment of the present application includes:
step S211a: according to the first image information, main body identification is carried out on the electronic component assembly information, wherein the main body is an element and a connecting piece;
step S212a: carrying out convolution kernel feature extraction on the main body according to the identification to obtain main body convolution features;
step S213a: and carrying out saturation processing on the first image based on the main convolution characteristic, and improving the information saturation of the first image.
Specifically, if the first image definition is to be obtained according to the first image information, the saturation of the image information should be obtained to determine the first image definition. The convolution kernel feature extraction is a means for processing an image, and given an input image, pixels in a small area in the input image are weighted and averaged to form each corresponding pixel in the output image, wherein a weight is defined by a function, namely a convolution kernel. The main body convolution characteristic is that elements and connecting pieces are marked after the image is acquired, and the images of the main body are processed, such as strengthening the edges of the main body, so as to improve the corresponding saturation. The method comprises the steps of automatically correcting an image, prompting to shoot again if the operation of automatically correcting and improving the definition still does not meet the definition requirement, further ensuring the definition of the image, and further improving the accuracy of the identification result of the components.
In summary, the method for detecting the assembly of electronic components provided by the embodiment of the application has the following technical effects:
the application provides an electronic component assembly detection method, wherein the method comprises the following steps: acquiring first image information through the image acquisition and recognition equipment, wherein the first image information comprises electronic component assembly information; performing feature recognition on the first image information to obtain a feature set, wherein the feature set comprises element recognition features, connecting piece recognition features and connection relation recognition features; obtaining connection attribute information according to the feature set; obtaining assembly detection standard information according to the connection attribute information; obtaining characteristic connection relation information according to the element identification characteristic, the connecting piece identification characteristic and the connection relation identification characteristic; performing feature traversal comparison on the feature connection relation information according to the assembly detection standard information to obtain a first comparison result; and obtaining a first detection report according to the first comparison result, and feeding back the first detection report. The technical problems that in the prior art, the component assembly detection method is not intelligent and the detection efficiency is low are solved. The intelligent detection of component assembly is achieved, and the technical effects of detection efficiency and accuracy of detection results are improved.
Example two
Based on the same inventive concept as the method for detecting the assembly of electronic components in the foregoing embodiment, the present invention also provides an electronic component assembly detection system, as shown in fig. 9, where the system includes:
a first obtaining unit 11, where the first obtaining unit 11 is configured to obtain first image information through an image acquisition and recognition device, and the first image information includes electronic component assembly information;
a second obtaining unit 12, where the second obtaining unit 12 is configured to perform feature recognition on the first image information to obtain a feature set, and the feature set includes an element recognition feature, a connector recognition feature, and a connection relationship recognition feature;
a third obtaining unit 13, where the third obtaining unit 13 is configured to obtain connection attribute information according to the feature set;
a fourth obtaining unit 14, where the fourth obtaining unit 14 is configured to obtain assembly detection standard information according to the connection attribute information;
a fifth obtaining unit 15, where the fifth obtaining unit 15 is configured to obtain feature connection relationship information according to the element identification feature, the connector identification feature, and the connection relationship identification feature;
a sixth obtaining unit 16, where the sixth obtaining unit 16 is configured to perform feature traversal comparison on the feature connection relationship information according to the assembly detection standard information, to obtain a first comparison result;
The first execution unit 17 is configured to obtain a first detection report according to the first comparison result, and feed back the first detection report.
Further, the system further comprises:
a seventh obtaining unit configured to obtain an element characteristic database;
an eighth obtaining unit configured to identify the first image information according to the element feature database, obtain the element identification feature, and mark the element identification feature;
a ninth obtaining unit, configured to obtain element connection feature information according to the element identification feature and the element feature database;
a tenth obtaining unit configured to identify the element identification feature marked in the first image information according to the element connection feature information, and obtain the connector identification feature and a connection relationship identification feature;
an eleventh obtaining unit configured to obtain the feature set based on the element identification feature, the connector identification feature, and the connection relation identification feature.
Further, the system further comprises:
a twelfth obtaining unit configured to obtain the first element information according to the feature connection relationship information;
a thirteenth obtaining unit configured to obtain a first connection port according to the first element information;
a fourteenth obtaining unit, configured to obtain second element information according to the first element information and the first connection port, where the second element is connected to the first element through a first connection element;
a fifteenth obtaining unit, configured to obtain third element information according to second element information and a second connection port by analogy, where the third element and the second element are connected by a second connection element, and a first connection line is obtained according to the first element information, the second element information, and up to nth element information, and based on the characteristic connection relationship information, where the first connection line is a complete connection loop in the characteristic connection relationship information starting from the first element, up to nth connection element, N is a natural number, and nth connection element is terminal element information of the first connection line;
A sixteenth obtaining unit, configured to perform feature comparison on the first connection line according to the assembly detection standard information, to obtain a second comparison result;
a seventeenth obtaining unit for obtaining a first connection line detection result according to the second comparison result.
Further, the system further comprises:
an eighteenth obtaining unit configured to obtain first element performance information according to the first element information;
a nineteenth obtaining unit configured to obtain second element performance information from the second element information;
a twentieth obtaining unit, configured to obtain a performance matching degree according to the first element performance information and the second element performance information;
the first judging unit is used for judging whether the performance matching degree meets a first preset condition or not;
and the twenty-first obtaining unit is used for obtaining the first reminding information according to the performance matching degree when the performance matching degree is not met.
Further, the system further comprises:
A twenty-second obtaining unit, configured to obtain a first output threshold according to the first element performance information;
a twenty-third obtaining unit, configured to obtain first connector parameter information according to the first connector;
a twenty-fourth obtaining unit, configured to obtain a parameter matching degree according to the first output threshold and the first connector parameter information;
a twenty-fifth obtaining unit, configured to obtain second alert information when the parameter matching degree does not meet a second predetermined condition;
and the twenty-sixth obtaining unit is used for obtaining third reminding information when the parameter matching degree exceeds a third preset condition.
Further, the system further comprises:
the second judging unit is used for judging whether the first comparison result has a first result or not, and the first result is mismatching information;
a twenty-seventh obtaining unit, configured to obtain first matching standard information according to the first result and the assembly detection standard information when the first result exists in the first comparison result;
The twenty-eighth obtaining unit is configured to obtain the first detection report according to the first matching standard information and the first result, where the first detection report is a feedback of the first result, and provide an adjustment suggestion according to the first matching standard information.
Further, the system further comprises:
a twenty-ninth obtaining unit, configured to obtain a first image sharpness according to the first image information;
a third judging unit configured to judge whether the first image sharpness satisfies a fourth predetermined condition;
the thirty-second acquisition unit is used for acquiring a fourth reminding message when the image identification and acquisition are not met, wherein the fourth reminding message is used for reminding the user to carry out image identification and acquisition again.
Further, the system further comprises:
the second execution unit is used for carrying out main body identification on the electronic component assembly information according to the first image information, and the main body is an element and a connecting piece;
a thirty-first obtaining unit, configured to perform convolution kernel feature extraction on the main body according to the identifier, to obtain a main body convolution feature;
And the third execution unit is used for carrying out saturation processing on the first image based on the main convolution characteristic and improving the information saturation of the first image.
An electronic device of an embodiment of the present application is described below with reference to fig. 10.
Based on the same inventive concept as the method for detecting the assembly of electronic components in the foregoing embodiments, the embodiments of the present application further provide an electronic component assembly detection system, which includes: a processor coupled to a memory for storing a program that, when executed by the processor, causes the system to perform the method of any of the first aspects.
The electronic device 300 includes: a processor 302, a communication interface 303, a memory 301. Optionally, the electronic device 300 may also include a bus architecture 304. Wherein the communication interface 303, the processor 302 and the memory 301 may be interconnected by a bus architecture 304; the bus architecture 304 may be a peripheral component interconnect bus or an extended industry standard architecture bus, among others. The bus architecture 304 may be divided into address buses, data buses, control buses, and the like. For ease of illustration, the figures are shown with only one bold line, but not with only one bus or one type of bus.
The memory 301 is used for storing computer-executable instructions for executing the embodiments of the present application, and is controlled by the processor 302 to execute the instructions. The processor 302 is configured to execute computer-executable instructions stored in the memory 301, thereby implementing an electronic component assembly detection method provided in the foregoing embodiments of the present application.
Alternatively, the computer-executable instructions in the embodiments of the present application may be referred to as application program codes, which are not specifically limited in the embodiments of the present application.
The embodiment of the application solves the technical problems that a component assembly detection method in the prior art is not intelligent and has low detection efficiency. The intelligent detection of component assembly is achieved, and the technical effects of detection efficiency and accuracy of detection results are improved.
Those of ordinary skill in the art will appreciate that: the various numbers of first, second, etc. referred to in this application are merely for convenience of description and are not intended to limit the scope of embodiments of the present application, nor to indicate a sequence. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. "at least one" means one or more. At least two means two or more. "at least one," "any one," or the like, refers to any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one of a, b, or c (species ) may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or plural.
In the above embodiments, it may be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, produces a flow or function in accordance with embodiments of the present application, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a computer network, or other programmable apparatus. The computer finger
Such as may be stored in or transmitted from one computer readable storage medium to another, such as from one website site, computer, server, or data center, by wired or wireless means. The computer readable storage medium may be any available medium that can be accessed by a computer or a data storage device including one or more servers, data centers, etc. that can be integrated with the available medium. The usable medium may be a magnetic medium, an optical medium, or a semiconductor medium, etc.
The various illustrative logical blocks and circuits described in the embodiments of the present application may be implemented or performed with a general purpose processor, a digital signal processor, an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the general purpose processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a digital signal processor and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a digital signal processor core, or any other similar configuration.
The steps of a method or algorithm described in the embodiments of the present application may be embodied directly in hardware, in a software element executed by a processor, or in a combination of the two. The software elements may be stored in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. In an example, a storage medium may be coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC, which may reside in a terminal. In the alternative, the processor and the storage medium may reside in different components in a terminal. These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
Although the present application has been described in connection with specific features and embodiments thereof, it will be apparent that various modifications and combinations can be made without departing from the spirit and scope of the application.
Accordingly, the specification and drawings are merely exemplary illustrations of the present application as defined in the appended claims and are considered to cover any and all modifications, variations, combinations, or equivalents that fall within the scope of the present application. It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to include such modifications and variations.
Claims (9)
1. An electronic component assembly detection method, wherein the method is applied to an assembly detection device, the assembly detection device comprises an image acquisition and identification device, and the method comprises the following steps:
acquiring first image information through the image acquisition and recognition equipment, wherein the first image information comprises electronic component assembly information;
performing feature recognition on the first image information to obtain a feature set, wherein the feature set comprises element recognition features, connecting piece recognition features and connection relation recognition features;
Obtaining connection attribute information according to the feature set;
obtaining assembly detection standard information according to the connection attribute information;
obtaining characteristic connection relation information according to the element identification characteristic, the connecting piece identification characteristic and the connection relation identification characteristic;
performing feature traversal comparison on the feature connection relation information according to the assembly detection standard information to obtain a first comparison result;
according to the first comparison result, a first detection report is obtained, and the first detection report is fed back;
wherein the method comprises the following steps:
obtaining first element information according to the characteristic connection relation information;
obtaining a first connection port according to the first element information;
obtaining second element information according to the first element information and the first connection port, wherein the second element is connected with the first element through a first connection piece;
and so on, according to the second element information and the second connection port, obtaining third element information, wherein the third element is connected with the second element through a second connection element, and according to the first element information, the second element information and the N-th element information, a first connection line is obtained based on the characteristic connection relation information, the first connection line is a complete connection loop in the characteristic connection relation information with the first element as a starting point, the N-th connection element is a natural number, and the N-th connection element is the end element information of the first connection line;
According to the assembly detection standard information, performing feature comparison on the first connecting circuit to obtain a second comparison result;
and obtaining a first connection line detection result according to the second comparison result.
2. The method of claim 1, wherein the feature identifying the first image information to obtain a feature set comprises:
obtaining an element characteristic database;
identifying the first image information according to the element characteristic database, obtaining the element identification characteristics, and marking the element identification characteristics;
obtaining element connection characteristic information according to the element identification characteristic and the element characteristic database;
identifying the element identification features marked in the first image information according to the element connection feature information to obtain the connection piece identification features and connection relation identification features;
and obtaining the feature set according to the element identification feature, the connecting piece identification feature and the connection relation identification feature.
3. The method of claim 1, wherein the method comprises:
acquiring first element performance information according to the first element information;
acquiring second element performance information according to the second element information;
Obtaining performance matching degree according to the first element performance information and the second element performance information;
judging whether the performance matching degree meets a first preset condition or not;
and when the performance matching degree is not met, obtaining first reminding information according to the performance matching degree.
4. The method of claim 1, wherein the method comprises:
obtaining a first output threshold according to the first element performance information;
obtaining first connector parameter information according to the first connector;
obtaining parameter matching degree according to the first output threshold and the first connector parameter information;
when the parameter matching degree does not meet a second preset condition, second reminding information is obtained;
and when the parameter matching degree exceeds a third preset condition, obtaining third reminding information.
5. The method of claim 1, wherein the obtaining a first detection report according to the first comparison result comprises:
judging whether the first comparison result has a first result or not, wherein the first result is mismatching information;
when the first comparison result exists in the first result, first matching standard information is obtained according to the first result and the assembly detection standard information;
And obtaining the first detection report according to the first matching standard information and the first result, wherein the first detection report is used for feeding back the first result and providing an adjustment suggestion according to the first matching standard information.
6. The method of claim 1, wherein the feature recognition of the first image information, prior to obtaining a feature set, comprises:
obtaining a first image definition according to the first image information;
judging whether the first image definition meets a fourth preset condition or not;
and when the image identification and collection are not met, obtaining fourth reminding information, wherein the fourth reminding information is used for reminding the user to carry out image identification and collection again.
7. The method of claim 6, wherein the obtaining a first image sharpness from the first image information comprises, before:
according to the first image information, main body identification is carried out on the electronic component assembly information, wherein the main body is an element and a connecting piece;
carrying out convolution kernel feature extraction on the main body according to the identification to obtain main body convolution features;
and carrying out saturation processing on the first image based on the main convolution characteristic, and improving the information saturation of the first image.
8. An electronic component assembly inspection system, wherein the system comprises:
the first obtaining unit is used for obtaining first image information through the image acquisition and identification equipment, and the first image information comprises electronic component assembly information;
the second obtaining unit is used for carrying out feature recognition on the first image information to obtain a feature set, wherein the feature set comprises element recognition features, connecting piece recognition features and connection relation recognition features;
a third obtaining unit, configured to obtain connection attribute information according to the feature set;
a fourth obtaining unit for obtaining assembly detection standard information according to the connection attribute information;
a fifth obtaining unit for obtaining feature connection relationship information according to the element identification feature, the connector identification feature, and the connection relationship identification feature;
the sixth obtaining unit is used for carrying out feature traversal comparison on the feature connection relation information according to the assembly detection standard information to obtain a first comparison result;
The first execution unit is used for obtaining a first detection report according to the first comparison result and feeding back the first detection report;
the system further comprises:
a twelfth obtaining unit for obtaining first element information according to the characteristic connection relation information;
a thirteenth obtaining unit configured to obtain a first connection port according to the first element information;
a fourteenth obtaining unit, configured to obtain second element information according to the first element information and the first connection port, where the second element is connected to the first element through a first connection element;
a fifteenth obtaining unit, configured to obtain third element information according to second element information and a second connection port by analogy, where the third element and the second element are connected by a second connection element, and a first connection line is obtained according to the first element information, the second element information, and up to nth element information, and based on the characteristic connection relationship information, where the first connection line is a complete connection loop in the characteristic connection relationship information starting from the first element, up to nth connection element, N is a natural number, and nth connection element is terminal element information of the first connection line;
A sixteenth obtaining unit, configured to perform feature comparison on the first connection line according to the assembly detection standard information, to obtain a second comparison result;
a seventeenth obtaining unit for obtaining a first connection line detection result according to the second comparison result.
9. An electronic component assembly inspection system, comprising: a processor coupled to a memory for storing a program that, when executed by the processor, causes the system to perform the method of any of claims 1-7.
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