CN113642260B - Performance evaluation method and system for heat-seal cover tape - Google Patents

Performance evaluation method and system for heat-seal cover tape Download PDF

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CN113642260B
CN113642260B CN202111200236.6A CN202111200236A CN113642260B CN 113642260 B CN113642260 B CN 113642260B CN 202111200236 A CN202111200236 A CN 202111200236A CN 113642260 B CN113642260 B CN 113642260B
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CN113642260A (en
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陈雪强
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JIANGSU YONGJIA ELECTRONIC MATERIALS CO Ltd
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Abstract

The invention discloses a performance evaluation method and a system of a heat-seal cover tape, wherein the method comprises the following steps: training the first heat-seal cover tape parameter analysis model according to the model parameters and the heating capacity parameters of the first product set to obtain a first updated heat-seal cover tape parameter analysis model; training the second heat-seal cover tape parameter analysis model according to the pressure-bearing capacity parameters of the first carrier tape set to obtain a second updated heat-seal cover tape parameter analysis model; extracting first parameter information and second parameter information; constructing a third heat-seal cover tape parameter analysis model according to the first parameter information and the second parameter information; and evaluating the performance of the first heat-seal cover tape according to the third heat-seal cover tape parameter analysis model to obtain a first evaluation result. The technical problems that in the prior art, the performance of the heat-seal cover tape is evaluated singly, and professional applicability is lacked, so that sealing work of the heat-seal cover tape is influenced are solved.

Description

Performance evaluation method and system for heat-seal cover tape
Technical Field
The invention relates to the field of electronic packaging, in particular to a performance evaluation method and system for a heat-seal cover tape.
Background
The cover tape is a tape product applied to the field of electronic packaging and is used together with a carrier tape, and the cover tape usually takes a polyester or polypropylene film as a base layer and is compounded or coated with different functional layers (an antistatic layer, an adhesive layer and the like) and can be sealed on the surface of the carrier tape under the condition of external force or heating to form a closed space so as to protect electronic components in a pocket of the carrier tape.
However, in the process of implementing the technical solution of the invention in the embodiments of the present application, the inventors of the present application find that the above-mentioned technology has at least the following technical problems:
the prior art heat-seal cover tape has single performance evaluation and lacks professional applicability, thereby influencing the sealing work of the heat-seal cover tape.
Disclosure of Invention
The embodiment of the application provides a performance evaluation method and system of heat-seal cover tape, and the problem that the performance evaluation of the heat-seal cover tape is single and lacks professional applicability in the prior art is solved, so that the technical problem of sealing work of the heat-seal cover tape is influenced, a cover tape performance evaluation model is established by combining product parameters and carrier tape pressure-bearing parameters, the performance evaluation of the heat-seal cover tape is more accurate, and the technical effect of sealing work can be effectively realized when the heat-seal cover tape is actually applied.
In view of the above, the present invention has been developed to provide a method that overcomes, or at least partially solves, the above-mentioned problems.
In a first aspect, embodiments of the present application provide a method for evaluating performance of a heat-sealable cover tape, the method comprising: obtaining a model parameter and a heating capacity parameter of a first product set; acquiring a pressure-bearing capacity parameter of the first carrier tape set; obtaining a first heat-seal cover tape parameter analysis model; training the first heat-seal cover tape parameter analysis model according to the model parameters and the heating capacity parameters of the first product set to obtain a first updated heat-seal cover tape parameter analysis model; obtaining a second heat-seal cover tape parameter analysis model; training the second heat-seal cover tape parameter analysis model according to the pressure-bearing capacity parameters of the first carrier tape set to obtain a second updated heat-seal cover tape parameter analysis model; extracting first parameter information of the first updated heat-seal cover tape parameter analysis model and second parameter information of the second updated heat-seal cover tape parameter analysis model; constructing a third heat-seal cover tape parameter analysis model according to the first parameter information and the second parameter information; and evaluating the performance of the first heat-seal cover tape according to the third heat-seal cover tape parameter analysis model to obtain a first evaluation result.
In another aspect, the present application also provides a performance evaluation system for heat-sealing a cover tape, the system comprising: the first obtaining unit is used for obtaining the model parameter and the heating capacity parameter of a first product set; the second obtaining unit is used for obtaining the pressure-bearing capacity parameter of the first carrier band set; a third obtaining unit for obtaining a parameter analysis model of the first heat-seal cover tape; a fourth obtaining unit, configured to train the first heat-seal cover tape parameter analysis model according to the model parameter and the heat capacity parameter of the first product set, and obtain a first updated heat-seal cover tape parameter analysis model; a fifth obtaining unit for obtaining a second heat-seal cover tape parameter analysis model; a sixth obtaining unit, configured to train the second heat-seal cover tape parameter analysis model according to the pressure-bearing capacity parameter of the first carrier tape set, and obtain a second updated heat-seal cover tape parameter analysis model; a first extracting unit configured to extract first parameter information of the first updated heat-seal cover tape parameter analysis model and second parameter information of the second updated heat-seal cover tape parameter analysis model; a first construction unit, configured to construct a third heat-seal cover tape parameter analysis model according to the first parameter information and the second parameter information; and the seventh obtaining unit is used for evaluating the performance of the first heat-seal cover tape according to the parameter analysis model of the third heat-seal cover tape to obtain a first evaluation result.
In a third aspect, an embodiment of the present invention provides an electronic device, including a bus, a transceiver, a memory, a processor, and a computer program stored on the memory and executable on the processor, where the transceiver, the memory, and the processor are connected via the bus, and when the computer program is executed by the processor, the method for controlling output data includes any one of the steps described above.
In a fourth aspect, embodiments also provide a computer-readable storage medium, on which a computer program is stored, where the computer program, when executed by a processor, implements the steps in the method for evaluating the performance of a heat-seal cover tape described in any of the above.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
training the first heat-seal cover tape parameter analysis model by using the model parameters and the heating capacity parameters of the first product set to obtain a first updated heat-seal cover tape parameter analysis model; obtaining a second heat-seal cover tape parameter analysis model; training the second heat-seal cover tape parameter analysis model according to the pressure-bearing capacity parameters of the first carrier tape set to obtain a second updated heat-seal cover tape parameter analysis model; extracting first parameter information of the first updated heat-seal cover tape parameter analysis model and second parameter information of the second updated heat-seal cover tape parameter analysis model; constructing a third heat-seal cover tape parameter analysis model according to the first parameter information and the second parameter information; and evaluating the performance of the first heat-seal cover tape according to the third heat-seal cover tape parameter analysis model to obtain a first evaluation result. And then reach and establish the evaluation model of lid area performance through combining product parameter and carrier band pressure-bearing parameter, to the more accurate specialty of performance evaluation in heat-seal lid area to guarantee that heat-seal lid area can effectively realize the technological effect of involution work when the actual application.
The foregoing description is only an overview of the technical solutions of the present application, and the present application can be implemented according to the content of the description in order to make the technical means of the present application more clearly understood, and the following detailed description of the present application is given in order to make the above and other objects, features, and advantages of the present application more clearly understandable.
Drawings
Fig. 1 is a schematic flow chart of a method of evaluating the performance of a heat-sealable cover tape according to an embodiment of the present application;
fig. 2 is a schematic flow chart of performance evaluation results of a first heat-seal cover tape obtained in a method of evaluating performance of heat-seal cover tapes according to an embodiment of the present application;
fig. 3 is a schematic flow chart illustrating data protection for the sealing temperature and sealing pressure in a method for evaluating performance of a heat-sealable cover tape according to an embodiment of the present disclosure;
fig. 4 is a schematic flow chart illustrating a first updated parametric analysis model of a heat-seal cover tape obtained in a method for evaluating performance of a heat-seal cover tape according to an embodiment of the present application;
fig. 5 is a schematic flow chart illustrating data matching in a library of heat-seal cover tape models in a method for evaluating performance of a heat-seal cover tape according to an embodiment of the present application;
fig. 6 is a schematic flow chart illustrating a second analysis model of heat-seal cover tape parameters obtained in a method for evaluating the performance of a heat-seal cover tape according to an embodiment of the present application;
fig. 7 is a schematic view of a process for obtaining a second heat-sealed cover tape according to a method for evaluating the performance of a heat-sealed cover tape of an embodiment of the present application;
fig. 8 is a schematic view of a performance evaluation system for heat-sealing a cover tape according to an embodiment of the present application;
fig. 9 is a schematic structural diagram of an electronic device for performing a performance evaluation method for heat-sealing a cover tape according to an embodiment of the present application.
Description of reference numerals: a first obtaining unit 11, a second obtaining unit 12, a third obtaining unit 13, a fourth obtaining unit 14, a fifth obtaining unit 15, a sixth obtaining unit 16, a first extracting unit 17, a first constructing unit 18, a seventh obtaining unit 19, a bus 1110, a processor 1120, a transceiver 1130, a bus interface 1140, a memory 1150, an operating system 1151, an application 1152 and a user interface 1160.
Detailed Description
In the description of the embodiments of the present invention, it should be apparent to those skilled in the art that the embodiments of the present invention can be embodied as methods, apparatuses, electronic devices, and computer-readable storage media. Thus, embodiments of the invention may be embodied in the form of: entirely hardware, entirely software (including firmware, resident software, micro-code, etc.), a combination of hardware and software. Furthermore, in some embodiments, embodiments of the invention may also be embodied in the form of a computer program product in one or more computer-readable storage media having computer program code embodied in the medium.
The computer-readable storage media described above may take any combination of one or more computer-readable storage media. The computer-readable storage medium includes: an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of the computer-readable storage medium include: a portable computer diskette, a hard disk, a random access memory, a read-only memory, an erasable programmable read-only memory, a flash memory, an optical fiber, a compact disc read-only memory, an optical storage device, a magnetic storage device, or any combination thereof. In embodiments of the invention, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, device, or apparatus.
The method, the device and the electronic equipment are described through the flow chart and/or the block diagram.
It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer-readable program instructions. These computer-readable program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.
These computer-readable program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing apparatus to function in a particular manner. Thus, the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means which implement the function/act specified in the flowchart and/or block diagram block or blocks.
The computer readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatus or other devices to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.
The embodiments of the present invention will be described below with reference to the drawings.
Example one
As shown in fig. 1, embodiments of the present application provide a method for evaluating performance of a heat-sealed cover tape, wherein the method includes:
step S100: obtaining a model parameter and a heating capacity parameter of a first product set;
specifically, the first product set is an electronic component set with a cover tape, and includes an IC, a capacitor, a resistor, a connector, a micro-transformer, an inductor, a relay, an electronic switch, a diode, a triode, a wafer surface patch, and the like. The model parameter and the heating capacity parameter of the first product set are the product model, the heating characteristic parameter, the product material characteristic and the like of the electronic component.
Step S200: acquiring a pressure-bearing capacity parameter of the first carrier tape set;
specifically, the first carrier tape assembly is a tape-shaped product applied to the field of electronic packaging, and has a specific thickness, holes (also called pockets) for holding electronic components and positioning holes for index positioning are equidistantly distributed in the length direction of the tape-shaped product, and the tape-shaped product is matched with a cover tape to form a closed type package for protecting the electronic components from being polluted and damaged in the transportation process. The bearing capacity parameter of the first carrier band set is the bearing pressure strength of the carrier band, and carrier bands made of different materials have different bearing capacities.
Step S300: obtaining a first heat-seal cover tape parameter analysis model;
particularly, certain temperature and pressure are applyed through the involution presser foot to heat-seal cover tape by the involution machine, make the hot melt adhesive melting pressfitting of cover tape realize the involution on the involution face of carrier band, and heat-seal cover tape does not have the stickness at normal atmospheric temperature, just has the stickness after the heating. The first heat-seal cover tape parameter analysis model is a neural network model and is obtained by training data such as width parameters, performance parameters, material parameters, resistance parameters and the like of the heat-seal cover tape.
Step S400: training the first heat-seal cover tape parameter analysis model according to the model parameters and the heating capacity parameters of the first product set to obtain a first updated heat-seal cover tape parameter analysis model;
as shown in fig. 4, further, in which the first heat-seal cover tape parametric analysis model is trained according to the model parameter and the heat capacity parameter of the first product set to obtain a first updated heat-seal cover tape parametric analysis model, step S400 of this embodiment of the present application further includes:
step S410: adding a first mask to the model parameter and the heat capacity parameter of the first product set;
step S420: and training the first heat-seal cover tape parameter analysis model according to the model parameter and the heat capacity parameter of the first product set added with the first mask to obtain a first updated heat-seal cover tape parameter analysis model.
Specifically, when the first heat-seal cover tape parameter analysis model is subjected to data training, a first mask is added to the model parameter and the heat capacity parameter of the first product set, the mask is a string of binary codes to perform bit and operation on a target field, the current input bit is shielded, and the source code and the mask are subjected to bit-wise operation or logic operation to obtain a new operand. Training the first heat-seal cover tape parameter analysis model through the model parameters and the heat capacity parameters of the first product set after the first mask is added, namely performing incremental learning on the first heat-seal cover tape parameter analysis model, wherein the first heat-seal cover tape parameter analysis model is obtained by connecting a plurality of neurons to form a neural network. Therefore, the first updated heat-seal cover tape parameter analysis model obtained through the training of the loss data reserves the basic functions of the first heat-seal cover tape parameter analysis model, the performance of continuous updating of the model is maintained, and the safety of network model training is effectively solved by adding the mask, so that the updating performance of parameter analysis is improved, and the technical effect of ensuring the accuracy of the parameter analysis result of the heat-seal cover tape is ensured.
Step S500: obtaining a second heat-seal cover tape parameter analysis model;
as shown in fig. 5, further, in the obtaining a second parametric analysis model of the heat-seal cover tape, step S500 of the embodiment of the present application further includes:
step S510: obtaining a heat-seal cover tape model library;
step S520: and performing data matching in the heat-seal cover tape model library according to the pressure-bearing capacity parameters of the first carrier tape set to obtain a second heat-seal cover tape parameter analysis model.
Specifically, the heat-seal cover tape model library is a model database of heat-seal cover tape characteristics, and comprises size characteristics, material characteristics, resistance characteristics, tensile characteristics and the like, data matching is performed in the heat-seal cover tape model library according to the pressure-bearing capacity parameters of the first carrier tape set, and a second heat-seal cover tape parameter analysis model of parameter matching is called from the heat-conduction adhesive tape model training library and is used for performing parameter analysis of the heat-seal cover tape. The analysis model of the heat-seal cover tape suitable for the bearing capacity of the carrier tape set is matched, and the technical effect that data in subsequent model training is more accurate is ensured.
Step S600: training the second heat-seal cover tape parameter analysis model according to the pressure-bearing capacity parameters of the first carrier tape set to obtain a second updated heat-seal cover tape parameter analysis model;
specifically, the second heat-seal cover tape parameter analysis model is trained through the pressure-bearing capacity parameters of the first carrier tape set, that is, the second heat-seal cover tape parameter analysis model is subjected to incremental learning, and the second heat-seal cover tape parameter analysis model is obtained by connecting a plurality of neurons with one another to form a neural network. Therefore, obtaining the second updated heat-seal cover tape parameter analysis model through the training of the loss data maintains the basic functions of the second heat-seal cover tape parameter analysis model and maintains the continuous updating performance of the model, thereby improving the updating performance of parameter analysis.
Step S700: extracting first parameter information of the first updated heat-seal cover tape parameter analysis model and second parameter information of the second updated heat-seal cover tape parameter analysis model;
step S800: constructing a third heat-seal cover tape parameter analysis model according to the first parameter information and the second parameter information;
specifically, first parameter information of the first updated heat-seal cover tape parameter analysis model, such as a product model parameter, a heating capacity parameter, a cover tape dimensional characteristic parameter, and the like, is extracted, and second parameter information of the second updated heat-seal cover tape parameter analysis model, such as a carrier tape pressure-bearing capacity parameter, a cover tape tensile property parameter, and the like, is extracted. And constructing a third heat-seal cover tape parameter analysis model after model updating according to the first parameter information and the second parameter information, so that the updated heat-seal cover tape parameter analysis model is combined with characteristic parameters of the working substance.
Step S900: and evaluating the performance of the first heat-seal cover tape according to the third heat-seal cover tape parameter analysis model to obtain a first evaluation result.
As shown in fig. 2, further, in which the evaluating the performance of the first heat-seal cover tape according to the third heat-seal cover tape parameter analysis model to obtain a first evaluation result, step S900 in this embodiment of the present application further includes:
step S910: obtaining the sealing temperature and the sealing pressure of the first heat-seal cover tape;
step S920: and inputting the sealing temperature and the sealing pressure into the third heat-seal cover tape parameter analysis model to obtain an output result of the third heat-seal cover tape parameter analysis model, wherein the output result comprises the first evaluation result of the first heat-seal cover tape.
Specifically, the third heat-seal cover tape parameter analysis model is a neural network model, and the sealing temperature and the sealing pressure are input into the neural network model through training of a large amount of training data, and the sealing temperature and the sealing pressure are sealing parameters of the heat-seal cover tape during sealing, so that the first evaluation result of the first heat-seal cover tape is output. The neural network model carries out continuous self-correction and adjustment until the obtained first output result is consistent with the identification information, the group of data supervised learning is finished, and the next group of data supervised learning is carried out; and when the output information of the neural network model reaches the preset accuracy rate/reaches the convergence state, finishing the supervised learning process. Through the supervision and learning of the neural network model, the neural network model can process the input information more accurately, the output first evaluation result information is more reasonable and accurate, and model training is performed through the attribute of workers, so that the technical effect that the performance evaluation result of the heat-seal cover tape is more accurate is achieved.
As shown in fig. 3, further, before evaluating the performance of the first heat-seal cover tape according to the third heat-seal cover tape parametric analysis model and obtaining a first evaluation result, step S900 in this embodiment of the present application further includes:
step S930: constructing a firewall for the parameter analysis model of the third heat-seal cover tape;
step S940: and when the sealing temperature and the sealing pressure are input into the third heat-seal cover tape parameter analysis model, performing data protection on the sealing temperature and the sealing pressure.
Specifically, before the performance of the first heat-seal cover tape is evaluated and a first evaluation result is obtained, a firewall is constructed for the third heat-seal cover tape parameter analysis model, and the firewall technology has the functions of timely finding and processing the problems of security risk, data transmission and the like which may exist during the operation of a computer network, wherein the processing measures comprise isolation and protection, and meanwhile, recording and detection can be carried out on each operation in the security of the computer network, so that the security of the operation of the computer network is ensured, the integrity of user data and information is ensured, and better and safer computer network use experience is provided for users. And when the sealing temperature and the sealing pressure are input into the third heat-seal cover tape parameter analysis model, performing data protection on the sealing temperature and the sealing pressure so as to ensure the technical effect of data security in the use of the model.
As shown in fig. 6, further, in which the data matching is performed in the heat-seal cover tape model library according to the pressure-bearing capacity parameter of the first carrier tape set to obtain the second heat-seal cover tape parameter analysis model, step S520 in this embodiment of the present application further includes:
step S521: performing input data matching in the heat-seal cover tape model library according to the pressure-bearing capacity parameter of the first carrier tape set to obtain a first matching result;
step S522: obtaining a predetermined matching threshold corresponding to the second heat seal cover tape parametric analysis model;
step S523: judging whether the first matching result is within the preset matching threshold value;
step S524: if the first match is within the predetermined match threshold, a parametric analysis model of the second heat-seal cover tape is obtained.
Specifically, input data matching is performed in the heat-seal cover tape model library according to the pressure-bearing capacity parameters of the first carrier tape set, so that a model matching result matched with the carrier tape parameters is obtained, and the preset matching threshold is the adaptive matching degree range of the carrier tape parameters and the second heat-seal cover tape parameter analysis model. And judging whether the first matching result is within the preset matching threshold value or not, if so, indicating that the parameters can be matched with the model, and determining the second heat-seal cover tape parameter analysis model. The parameter analysis model of the heat-seal cover tape is determined through the matching of the bearing capacity of the carrier tape, and the attribute of a working substance is combined, so that the data training output result of the model is more accurate.
As shown in fig. 7, further, after the evaluating the performance of the first heat-seal cover tape according to the third heat-seal cover tape parametric analysis model and obtaining a first evaluation result, step S900 in this embodiment of the present application further includes:
step S950: judging whether the parameters of the first heat-seal cover tape can be adjusted according to the first evaluation result;
step S960: if the parameters of first heat-seal cover tape can not be adjusted, it is right first heat-seal cover tape replaces, obtains second heat-seal cover tape.
Specifically, it is determined whether parameters of the first heat-seal cover tape can be adjusted according to the first evaluation result, for example, the evaluation result of the performance of the heat-seal cover tape does not meet a predetermined sealing standard, and the parameters of the heat-seal cover tape need to be adjusted accordingly, such as adjusting the dimensional parameters and the stretch parameters of the heat-seal cover tape. If the parameter in first heat-seal lid area can not be adjusted, it is right first heat-seal lid area is replaced, obtains the second heat-seal lid area that satisfies the parameter condition for the assessment result is more accurate, thereby guarantees the involution effect in heat-seal lid area.
Further, after determining whether the parameters of the first heat-seal cover tape can be adjusted according to the first evaluation result, step S950 in this embodiment of the present application further includes:
step S951: and if the parameters of the first heat-seal cover tape can be adjusted, updating the parameters of the first heat-seal cover tape according to the model parameters, the heating capacity parameters and the pressure-bearing capacity parameters to obtain the updated parameters of the first heat-seal cover tape.
Specifically, if the parameters of the first heat-seal cover tape can be adjusted, the parameters of the first heat-seal cover tape are updated according to the model parameters, the heat capacity parameters and the pressure-bearing capacity parameters, for example, the tension parameters and the sealing temperature of the heat-seal cover tape are adjusted and updated. And obtaining updated parameters of the updated first heat-seal cover tape, thereby ensuring the technical effect of carrying out normal sealing action on the electronic product.
In summary, the method and system for evaluating the performance of the heat-seal cover tape provided by the embodiment of the present application have the following technical effects:
training the first heat-seal cover tape parameter analysis model by using the model parameters and the heating capacity parameters of the first product set to obtain a first updated heat-seal cover tape parameter analysis model; obtaining a second heat-seal cover tape parameter analysis model; training the second heat-seal cover tape parameter analysis model according to the pressure-bearing capacity parameters of the first carrier tape set to obtain a second updated heat-seal cover tape parameter analysis model; extracting first parameter information of the first updated heat-seal cover tape parameter analysis model and second parameter information of the second updated heat-seal cover tape parameter analysis model; constructing a third heat-seal cover tape parameter analysis model according to the first parameter information and the second parameter information; and evaluating the performance of the first heat-seal cover tape according to the third heat-seal cover tape parameter analysis model to obtain a first evaluation result. And then reach and establish the evaluation model of lid area performance through combining product parameter and carrier band pressure-bearing parameter, to the more accurate specialty of performance evaluation in heat-seal lid area to guarantee that heat-seal lid area can effectively realize the technological effect of involution work when the actual application.
Example two
Based on the same inventive concept as the method for evaluating the performance of the heat-seal cover tape in the previous embodiment, the present invention further provides a system for evaluating the performance of the heat-seal cover tape, as shown in fig. 8, the system comprising:
a first obtaining unit 11, where the first obtaining unit 11 is configured to obtain a model parameter and a heating capacity parameter of a first product set;
a second obtaining unit 12, where the second obtaining unit 12 is configured to obtain a pressure-bearing capacity parameter of the first carrier tape set;
a third obtaining unit 13, where the third obtaining unit 13 is configured to obtain a parametric analysis model of the first heat-seal cover tape;
a fourth obtaining unit 14, where the fourth obtaining unit 14 is configured to train the first heat-seal cover tape parameter analysis model according to the model parameter and the heat capacity parameter of the first product set, so as to obtain a first updated heat-seal cover tape parameter analysis model;
a fifth obtaining unit 15, where the fifth obtaining unit 15 is configured to obtain a second parametric analysis model of the heat-seal cover tape;
a sixth obtaining unit 16, where the sixth obtaining unit 16 is configured to train the second heat-seal cover tape parameter analysis model according to the pressure-bearing capacity parameter of the first carrier tape set, so as to obtain a second updated heat-seal cover tape parameter analysis model;
a first extracting unit 17, where the first extracting unit 17 is configured to extract first parameter information of the first updated heat-seal cover tape parameter analysis model and second parameter information of the second updated heat-seal cover tape parameter analysis model;
a first constructing unit 18, where the first constructing unit 18 is configured to construct a third heat-seal cover tape parameter analysis model according to the first parameter information and the second parameter information;
a seventh obtaining unit 19, where the seventh obtaining unit 19 is configured to evaluate, according to the parameter analysis model of the third heat-seal cover tape, the performance of the first heat-seal cover tape to obtain a first evaluation result.
Further, the system further comprises:
an eighth obtaining unit configured to obtain a sealing temperature and a sealing pressure of the first heat-seal cover tape;
a ninth obtaining unit, configured to input the sealing temperature and the sealing pressure into the third heat-seal cover tape parameter analysis model, and obtain an output result of the third heat-seal cover tape parameter analysis model, where the output result includes the first evaluation result of the first heat-seal cover tape.
Further, the system further comprises:
a second construction unit, configured to construct a firewall for the parametric analysis model of the third heat-seal cover tape;
and the first protection unit is used for performing data protection on the sealing temperature and the sealing pressure when the sealing temperature and the sealing pressure are input into the third heat-seal cover tape parameter analysis model.
Further, the system further comprises:
a first adding unit, configured to add a first mask to the model parameter and the heat capacity parameter of the first product set;
a tenth obtaining unit, configured to train the model parameter and the heat capacity parameter of the first product set to which the first mask is added to the first heat-seal cover tape parameter analysis model, so as to obtain a first updated heat-seal cover tape parameter analysis model.
Further, the system further comprises:
an eleventh obtaining unit for obtaining a library of heat-seal cover tape patterns;
and the twelfth obtaining unit is used for performing data matching in the heat-seal cover tape model library according to the pressure-bearing capacity parameters of the first carrier tape set to obtain the second heat-seal cover tape parameter analysis model.
Further, the system further comprises:
a thirteenth obtaining unit, configured to perform input data matching in the heat-seal cover tape model library according to the pressure-bearing capacity parameter of the first carrier tape set, so as to obtain a first matching result;
a fourteenth obtaining unit for obtaining a predetermined matching threshold corresponding to the second heat-seal cover tape parametric analysis model;
a first judging unit configured to judge whether the first matching result is within the predetermined matching threshold;
a fifteenth obtaining unit for obtaining the second heat-seal cover tape parametric analysis model if the first matching result is within the predetermined matching threshold.
Further, the system further comprises:
a second judging unit configured to judge whether the parameter of the first heat-seal cover tape can be adjusted according to the first evaluation result;
a sixteenth obtaining unit, the sixteenth obtaining unit is configured to, if the parameter of the first heat-seal cover tape cannot be adjusted, replace the first heat-seal cover tape to obtain a second heat-seal cover tape.
Further, the system further comprises:
and the seventeenth obtaining unit is used for updating the parameters of the first heat-seal cover tape according to the model parameters, the heating capacity parameters and the pressure-bearing capacity parameters if the parameters of the first heat-seal cover tape can be adjusted, so as to obtain the updated parameters of the first heat-seal cover tape.
While various modifications and embodiments of the method for evaluating the performance of a heat-seal cover tape in the first embodiment of fig. 1 are also applicable to the system for evaluating the performance of a heat-seal cover tape in the present embodiment, the method for implementing the method for evaluating the performance of a heat-seal cover tape in the present embodiment will be apparent to those skilled in the art from the foregoing detailed description of the method for evaluating the performance of a heat-seal cover tape, and therefore, for the sake of brevity of the description, detailed description thereof will not be provided herein.
In addition, an embodiment of the present invention further provides an electronic device, which includes a bus, a transceiver, a memory, a processor, and a computer program stored in the memory and capable of running on the processor, where the transceiver, the memory, and the processor are connected via the bus, and when the computer program is executed by the processor, the processes of the method for controlling output data are implemented, and the same technical effects can be achieved, and are not described herein again to avoid repetition.
Specifically, referring to fig. 9, an embodiment of the present invention further provides an electronic device, which includes a bus 1110, a processor 1120, a transceiver 1130, a bus interface 1140, a memory 1150, and a user interface 1160.
In an embodiment of the present invention, the electronic device further includes: a computer program stored on the memory 1150 and executable on the processor 1120, the computer program, when executed by the processor 1120, implementing the various processes of the method embodiments of controlling output data described above.
A transceiver 1130 for receiving and transmitting data under the control of the processor 1120.
In embodiments of the invention in which a bus architecture (represented by bus 1110) is used, bus 1110 may include any number of interconnected buses and bridges, with bus 1110 connecting various circuits including one or more processors, represented by processor 1120, and memory, represented by memory 1150.
Bus 1110 represents one or more of any of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, a processor, or a local bus using any of a variety of bus architectures. By way of example, and not limitation, such architectures include: industry standard architecture bus, micro-channel architecture bus, expansion bus, video electronics standards association, peripheral component interconnect bus.
Processor 1120 may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method embodiments may be performed by integrated logic circuits in hardware or instructions in software in a processor. The processor described above includes: general purpose processors, central processing units, network processors, digital signal processors, application specific integrated circuits, field programmable gate arrays, complex programmable logic devices, programmable logic arrays, micro-control units or other programmable logic devices, discrete gates, transistor logic devices, discrete hardware components. The various methods, steps and logic blocks disclosed in embodiments of the present invention may be implemented or performed. For example, the processor may be a single core processor or a multi-core processor, which may be integrated on a single chip or located on multiple different chips.
Processor 1120 may be a microprocessor or any conventional processor. The steps of the method disclosed in connection with the embodiments of the present invention may be performed directly by a hardware decoding processor, or may be performed by a combination of hardware and software modules in the decoding processor. The software modules may reside in random access memory, flash memory, read only memory, programmable read only memory, erasable programmable read only memory, registers, and the like, as is known in the art. The readable storage medium is located in a memory, and a processor reads information in the memory and completes the steps of the method in combination with hardware of the processor.
The bus 1110 may also connect various other circuits such as peripherals, voltage regulators, or power management circuits to provide an interface between the bus 1110 and the transceiver 1130, as is well known in the art. Therefore, the embodiments of the present invention will not be further described.
The transceiver 1130 may be one element or may be multiple elements, such as multiple receivers and transmitters, providing a means for communicating with various other apparatus over a transmission medium. For example: the transceiver 1130 receives external data from other devices, and the transceiver 1130 transmits data processed by the processor 1120 to other devices. Depending on the nature of the computer device, a user interface 1160 may also be provided, such as: touch screen, physical keyboard, display, mouse, speaker, microphone, trackball, joystick, stylus.
It is to be appreciated that in embodiments of the invention, the memory 1150 may further include memory located remotely with respect to the processor 1120, which may be coupled to a server via a network. One or more portions of the above-described network may be an ad hoc network, an intranet, an extranet, a virtual private network, a local area network, a wireless local area network, a wide area network, a wireless wide area network, a metropolitan area network, the internet, a public switched telephone network, a plain old telephone service network, a cellular telephone network, a wireless fidelity network, and a combination of two or more of the above. For example, the cellular telephone network and the wireless network may be global mobile communications devices, code division multiple access devices, global microwave interconnect access devices, general packet radio service devices, wideband code division multiple access devices, long term evolution devices, LTE frequency division duplex devices, LTE time division duplex devices, long term evolution advanced devices, universal mobile communications devices, enhanced mobile broadband devices, mass machine type communications devices, ultra-reliable low-latency communications devices, and the like.
It is to be understood that the memory 1150 in embodiments of the present invention can be either volatile memory or nonvolatile memory, or can include both volatile and nonvolatile memory. Wherein the nonvolatile memory includes: read-only memory, programmable read-only memory, erasable programmable read-only memory, electrically erasable programmable read-only memory, or flash memory.
The volatile memory includes: random access memory, which acts as an external cache. By way of example, and not limitation, many forms of RAM are available, such as: static random access memory, dynamic random access memory, synchronous dynamic random access memory, double data rate synchronous dynamic random access memory, enhanced synchronous dynamic random access memory, synchronous link dynamic random access memory, and direct memory bus random access memory. The memory 1150 of the electronic device described in the embodiments of the invention includes, but is not limited to, the above and any other suitable types of memory.
In an embodiment of the present invention, memory 1150 stores the following elements of operating system 1151 and application programs 1152: an executable module, a data structure, or a subset thereof, or an expanded set thereof.
Specifically, the operating system 1151 includes various device programs, such as: a framework layer, a core library layer, a driver layer, etc. for implementing various basic services and processing hardware-based tasks. Applications 1152 include various applications such as: media player, browser, used to realize various application services. A program implementing a method of an embodiment of the invention may be included in application program 1152. The application programs 1152 include: applets, objects, components, logic, data structures, and other computer device-executable instructions that perform particular tasks or implement particular abstract data types.
In addition, an embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored, where the computer program, when executed by a processor, implements the processes of the embodiment of the method for evaluating performance of a heat-seal cover tape, and can achieve the same technical effects, and in order to avoid repetition, the details are not repeated here.
The above description is only a specific implementation of the embodiments of the present invention, but the scope of the embodiments of the present invention is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the embodiments of the present invention, and all such changes or substitutions should be covered by the scope of the embodiments of the present invention. Therefore, the protection scope of the embodiments of the present invention shall be subject to the protection scope of the claims.

Claims (8)

1. A method of evaluating performance of a heat-sealable cover tape, wherein the method comprises:
obtaining a model parameter and a heating capacity parameter of a first product set;
acquiring a pressure-bearing capacity parameter of the first carrier tape set;
obtaining a first heat-seal cover tape parameter analysis model; the first heat-seal cover tape parameter analysis model is a neural network model and is obtained by training width parameters, performance parameters, material parameters and resistance parameters of the heat-seal cover tape;
training the first heat-seal cover tape parameter analysis model according to the model parameters and the heating capacity parameters of the first product set to obtain a first updated heat-seal cover tape parameter analysis model;
wherein, the training of the first heat-seal cover tape parameter analysis model through the model parameter and the heat capacity parameter of the first product set obtains a first updated heat-seal cover tape parameter analysis model, including:
adding a first mask to the model parameter and the heat capacity parameter of the first product set;
training the model parameter and the heat capacity parameter of the first product set added with the first mask to the first heat-seal cover tape parameter analysis model to obtain a first updated heat-seal cover tape parameter analysis model;
obtaining a second heat-seal cover tape parameter analysis model;
wherein obtaining a second heat seal cover tape parametric analysis model comprises:
obtaining a heat-seal cover tape model library;
performing data matching in the heat-seal cover tape model library according to the pressure-bearing capacity parameters of the first carrier tape set to obtain a second heat-seal cover tape parameter analysis model;
training the second heat-seal cover tape parameter analysis model according to the pressure-bearing capacity parameters of the first carrier tape set to obtain a second updated heat-seal cover tape parameter analysis model;
extracting first parameter information of the first updated heat-seal cover tape parameter analysis model and second parameter information of the second updated heat-seal cover tape parameter analysis model;
constructing a third heat-seal cover tape parameter analysis model according to the first parameter information and the second parameter information;
and evaluating the performance of the first heat-seal cover tape according to the third heat-seal cover tape parameter analysis model to obtain a first evaluation result.
2. The method of claim 1, wherein evaluating the performance of the first heat-seal cover tape based on the third heat-seal cover tape parametric analysis model to obtain a first evaluation comprises:
obtaining the sealing temperature and the sealing pressure of the first heat-seal cover tape;
and inputting the sealing temperature and the sealing pressure into the third heat-seal cover tape parameter analysis model to obtain an output result of the third heat-seal cover tape parameter analysis model, wherein the output result comprises the first evaluation result of the first heat-seal cover tape.
3. The method of claim 1, wherein evaluating the performance of the first heat-seal cover tape based on the third heat-seal cover tape parametric analysis model before obtaining the first evaluation comprises:
constructing a firewall for the parameter analysis model of the third heat-seal cover tape;
and when the sealing temperature and the sealing pressure are input into the third heat-sealing cover tape parameter analysis model, performing data protection on the sealing temperature and the sealing pressure.
4. The method of claim 1, wherein the obtaining the second heat-seal cover tape parametric analysis model by data matching in the library of heat-seal cover tape models based on the pressure-bearing capacity parameters of the first set of carrier tapes comprises:
performing input data matching in the heat-seal cover tape model library according to the pressure-bearing capacity parameter of the first carrier tape set to obtain a first matching result;
obtaining a predetermined matching threshold corresponding to the second heat seal cover tape parametric analysis model;
judging whether the first matching result is within the preset matching threshold value;
if the first match is within the predetermined match threshold, a parametric analysis model of the second heat-seal cover tape is obtained.
5. The method of claim 1, wherein evaluating the performance of the first heat-seal cover tape based on the third heat-seal cover tape parametric analysis model comprises, after obtaining a first evaluation result:
judging whether the parameters of the first heat-seal cover tape can be adjusted according to the first evaluation result;
if the parameters of first heat-seal cover tape can not be adjusted, it is right first heat-seal cover tape replaces, obtains second heat-seal cover tape.
6. The method of claim 5, wherein determining whether parameters of the first heat-seal cover tape can be adjusted based on the first evaluation comprises:
and if the parameters of the first heat-seal cover tape can be adjusted, updating the parameters of the first heat-seal cover tape according to the model parameters, the heating capacity parameters and the pressure-bearing capacity parameters to obtain the updated parameters of the first heat-seal cover tape.
7. A performance evaluation system for heat-sealable cover tapes, wherein the system comprises:
the first obtaining unit is used for obtaining the model parameter and the heating capacity parameter of a first product set;
the second obtaining unit is used for obtaining the pressure-bearing capacity parameter of the first carrier band set;
a third obtaining unit for obtaining a parameter analysis model of the first heat-seal cover tape; the first heat-seal cover tape parameter analysis model is a neural network model and is obtained by training width parameters, performance parameters, material parameters and resistance parameters of the heat-seal cover tape;
a fourth obtaining unit, configured to train the first heat-seal cover tape parameter analysis model according to the model parameter and the heat capacity parameter of the first product set, and obtain a first updated heat-seal cover tape parameter analysis model;
wherein the fourth obtaining unit includes:
a first adding unit, configured to add a first mask to the model parameter and the heat capacity parameter of the first product set;
a tenth obtaining unit, configured to train the model parameter and the heat capacity parameter of the first product set to which the first mask is added to the first heat-seal cover tape parameter analysis model, so as to obtain a first updated heat-seal cover tape parameter analysis model;
a fifth obtaining unit for obtaining a second heat-seal cover tape parameter analysis model;
wherein the fifth obtaining unit includes:
an eleventh obtaining unit for obtaining a library of heat-seal cover tape patterns;
a twelfth obtaining unit, configured to perform data matching in the heat-seal cover tape model library according to the pressure-bearing capacity parameter of the first carrier tape set, so as to obtain a second heat-seal cover tape parameter analysis model;
a sixth obtaining unit, configured to train the second heat-seal cover tape parameter analysis model according to the pressure-bearing capacity parameter of the first carrier tape set, and obtain a second updated heat-seal cover tape parameter analysis model;
a first extracting unit configured to extract first parameter information of the first updated heat-seal cover tape parameter analysis model and second parameter information of the second updated heat-seal cover tape parameter analysis model;
a first construction unit, configured to construct a third heat-seal cover tape parameter analysis model according to the first parameter information and the second parameter information;
and the seventh obtaining unit is used for evaluating the performance of the first heat-seal cover tape according to the parameter analysis model of the third heat-seal cover tape to obtain a first evaluation result.
8. An electronic device for evaluating the performance of a heat-sealable cover tape, comprising a bus, a transceiver, a memory, a processor, and a computer program stored in and executable on the memory, the transceiver, the memory, and the processor being connected via the bus, wherein the computer program, when executed by the processor, implements the steps of the method of evaluating the performance of a heat-sealable cover tape of any of claims 1-6.
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