CN113637936A - Surface intelligent copper plating equipment for electronic hardware shell - Google Patents

Surface intelligent copper plating equipment for electronic hardware shell Download PDF

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Publication number
CN113637936A
CN113637936A CN202110916411.5A CN202110916411A CN113637936A CN 113637936 A CN113637936 A CN 113637936A CN 202110916411 A CN202110916411 A CN 202110916411A CN 113637936 A CN113637936 A CN 113637936A
Authority
CN
China
Prior art keywords
support frame
support
copper plating
electronic hardware
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110916411.5A
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Chinese (zh)
Inventor
戴结财
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou Juxinlong Metal Products Co ltd
Original Assignee
Huizhou Juxinlong Metal Products Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Juxinlong Metal Products Co ltd filed Critical Huizhou Juxinlong Metal Products Co ltd
Priority to CN202110916411.5A priority Critical patent/CN113637936A/en
Publication of CN113637936A publication Critical patent/CN113637936A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06Metallic material
    • C23C4/08Metallic material containing only metal elements
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/123Spraying molten metal

Abstract

The invention provides surface intelligent copper plating equipment for an electronic hardware shell, and belongs to the technical field of copper plating. Including the support main part, a fixed subassembly is installed to inside one side of support main part, a copper facing subassembly is installed to the inside opposite side of support main part, the support main part includes a support frame, the top of support frame is fixed with a liquid reserve tank, the fixed intercommunication in one side of liquid reserve tank has a fixed pipe, the one end that the liquid reserve tank was kept away from to fixed pipe runs through the upper surface of support frame and extends to the inside of support frame, install a drawing liquid pump on the fixed pipe, the copper facing subassembly includes two supports, the equal fixed mounting of two supports is on the support frame, fixed mounting has a direction montant on the support, the top fixed mounting of direction montant is on the interior top surface of support frame, it is connected with a bolt lead screw to rotate through the bearing on another support. The invention can uniformly spray the surface of the electronic hardware shell, has better spraying effect and higher spraying efficiency, and is easy to be put into the market.

Description

Surface intelligent copper plating equipment for electronic hardware shell
Technical Field
The application relates to the technical field of copper plating, in particular to surface intelligent copper plating equipment for an electronic hardware shell.
Background
At present, most of the existing copper plating equipment in the market is troublesome when plating copper on the surface of an electronic hardware shell, and the copper plating efficiency is low.
Disclosure of Invention
The invention aims to provide surface intelligent copper plating equipment for an electronic hardware shell, which aims to solve the problems in the background technology.
The embodiment of the application adopts the following technical scheme:
the surface intelligent copper plating equipment for the electronic hardware shell comprises a bracket main body, wherein a fixing component is installed on one side inside the bracket main body, and a copper plating component is installed on the other side inside the bracket main body;
the support main body comprises a support frame, a liquid storage tank is fixed at the top end of the support frame, a fixing pipe is fixedly communicated with one side of the liquid storage tank, one end, far away from the liquid storage tank, of the fixing pipe penetrates through the upper surface of the support frame and extends into the support frame, and a liquid pump is mounted on the fixing pipe;
the copper-plating subassembly includes two supports, two the equal fixed mounting of support is on the support frame, one fixed mounting has a direction montant on the support, the top fixed mounting of direction montant is on the interior top surface of support frame, another rotate through the bearing on the support and be connected with a bolt lead screw, the top of bolt lead screw is passed through the bearing and is rotated and connect on the interior top surface of support frame, a lifter plate has been cup jointed in the slip on direction montant and the bolt lead screw, the inside fixed mounting of lifter plate has a drain pipe, install a plurality of atomizer that are a style of calligraphy range on the drain pipe, it has a bellows still to fix the intercommunication on the drain pipe, the one end that the drain pipe was kept away from to the bellows communicates with the bottom mounting of fixed pipe.
Preferably, the lower fixed surface of support frame installs four support callus on the sole that are the rectangle and distribute, the lower surface of supporting the callus on the sole is coarse.
Preferably, a driving motor is fixedly mounted at the top end of the supporting frame, and the output end of the driving motor is fixedly connected with the top end of the bolt lead screw.
Preferably, fixed subassembly includes a fixed hanger plate, the top fixed mounting of fixed hanger plate is on the interior top surface of support frame, the inside of fixed hanger plate runs through the direction horizontal pole that has the bisymmetry to set up, the one end fixed mounting of direction horizontal pole has a connecting plate, the other end fixed mounting of direction horizontal pole has an end plate, a telescopic spring has been cup jointed to the week side of direction horizontal pole and between being located fixed hanger plate and the connecting plate, a fixed mounting has four sucking discs that are the rectangle and distribute on the surface that the direction horizontal pole was kept away from to the connecting plate, it has an electron five metals shell to adsorb on the sucking disc.
Preferably, a pull ring is installed on one side face, far away from the guide cross rod, of the end plate, and the pull ring is a component made of steel alloy.
Preferably, the fixed hanger plate is internally provided with a transverse hole matched with the guide cross rod, and the guide cross rod penetrates through the transverse hole.
Preferably, a through hole matched with the guide vertical rod is formed in the lifting plate, and a threaded hole matched with the bolt and screw rod is further formed in the lifting plate.
Preferably, a fan is fixedly installed on the lifting plate.
The embodiment of the application adopts at least one technical scheme which can achieve the following beneficial effects:
firstly, by starting the liquid pump, the liquid pump conveys the copper liquid in the liquid storage tank to the liquid outlet pipe through the fixed pipe and the telescopic hose, and finally the copper liquid is sprayed out through the atomizing nozzle, and the control switch of the driving motor is started while the copper liquid is sprayed out through the atomizing nozzle, so that the driving motor can drive the bolt lead screw to rotate, and the lifting plate drives the liquid outlet pipe and the atomizing nozzle to move up and down, and the surface of the electronic hardware shell is uniformly sprayed.
Its two, through the pulling pull ring, make the connecting plate remove to the right side, expanding spring will contract this moment and shorten, later adsorb electron five metals shell on the sucking disc again, adsorb after on the sucking disc as electron five metals shell, loosen the pull ring, because expanding spring's elastic force effect this moment, electron five metals shell will be close to with atomizer, is prepared for the copper-plating.
It is three, adsorb after the sucking disc when electron five metals shell, loosen the pull ring, this moment because expanding spring's elastic action, electron five metals shell will be close to with atomizer, later start the drawing liquid pump, the drawing liquid pump carries the drain pipe with the inside copper liquid of liquid reserve tank through fixed pipe and expansion hose, spout copper liquid through atomizer at last, start driving motor's control switch when atomizer with copper liquid spun, driving motor will drive the bolt lead screw and rotate, thereby make the lifter plate drive drain pipe and atomizer be the up-and-down motion, thereby carry out even spraying on the surface to electron five metals shell.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a schematic view of an overall structure according to an embodiment of the present invention;
FIG. 2 is a schematic view of another perspective of the overall structure provided by the embodiment of the present invention;
FIG. 3 is a front view provided by an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a stent body according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a fixing assembly according to an embodiment of the present invention;
FIG. 6 is an elevation view of a securing assembly provided by an embodiment of the present invention;
FIG. 7 is a schematic structural view of a copper-plated component according to an embodiment of the present invention.
In the figure: 1-a stent body; 101-a support frame; 102-supporting a foot pad; 103-a liquid storage tank; 104-a stationary tube; 105-a liquid pump; 106-a drive motor; 2-a stationary component; 201-fixing the hanging plate; 202-a guide rail; 203-connecting plate; 204-end plate; 205-a telescoping spring; 206-a pull ring; 207-suction cup; 208-electronic hardware housing; 3-plating a copper component; 301-a support; 302-guiding vertical rods; 303-bolt lead screw; 304-a lifter plate; 305-a liquid outlet pipe; 306-an atomizer; 307-telescoping hoses; 308-a fan.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The technical solutions provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Example one
Referring to fig. 1-7, the present invention provides a technical solution: the surface intelligent copper plating equipment for the electronic hardware shell comprises a support main body 1, wherein a fixing component 2 is installed on one side inside the support main body 1, and a copper plating component 3 is installed on the other side inside the support main body 1;
the support main body 1 comprises a support frame 101, a liquid storage tank 103 is fixed at the top end of the support frame 101, a fixing pipe 104 is fixedly communicated with one side of the liquid storage tank 103, one end, far away from the liquid storage tank 103, of the fixing pipe 104 penetrates through the upper surface of the support frame 101 and extends into the support frame 101, and a liquid pump 105 is installed on the fixing pipe 104;
copper-plated subassembly 3 includes two supports 301, the equal fixed mounting of two supports 301 is on support frame 101, fixed mounting has a direction montant 302 on one support 301, the top fixed mounting of direction montant 302 is on the interior top surface of support frame 101, be connected with a bolt lead screw 303 through the bearing rotation on another support 301, the top of bolt lead screw 303 is passed through the bearing and is rotated and connect on the interior top surface of support frame 101, sliding sleeve has a lifter plate 304 on direction montant 302 and the bolt lead screw 303, the inside fixed mounting of lifter plate 304 has a drain pipe 305, install a plurality of atomizer 306 that are a style of calligraphy and arrange on the drain pipe 305, still fixed intercommunication has a flexible hose 307 on the drain pipe 305, the one end that drain pipe 305 was kept away from to flexible hose 307 communicates with the bottom mounting of fixed pipe 104.
Referring to fig. 4, four supporting foot pads 102 are fixedly mounted on the lower surface of the supporting frame 101, and the lower surface of the supporting foot pads 102 is rough.
Referring to fig. 4, a driving motor 106 is fixedly installed at the top end of the supporting frame 101, and an output end of the driving motor 106 is fixedly connected with the top end of the bolt screw 303.
Referring to fig. 6, the fixing assembly 2 includes a fixing hanger plate 201, the top end of the fixing hanger plate 201 is fixedly installed on the inner top surface of the supporting frame 101, two symmetrically arranged guiding cross rods 202 penetrate through the fixing hanger plate 201, a connecting plate 203 is fixedly installed at one end of the guiding cross rod 202, an end plate 204 is fixedly installed at the other end of the guiding cross rod 202, a telescopic spring 205 is sleeved between the fixing hanger plate 201 and the connecting plate 203 and located on the peripheral side surface of the guiding cross rod 202, four suckers 207 which are distributed in a rectangular shape are fixedly installed on one surface of the connecting plate 203 far away from the guiding cross rod 202, and an electronic hardware shell 208 is adsorbed on the suckers 207.
Example two
The second embodiment provides another surface intelligent copper plating device for an electronic hardware shell, which comprises a bracket main body 1, wherein a fixing component 2 is installed on one side inside the bracket main body 1, and a copper plating component 3 is installed on the other side inside the bracket main body 1;
the support main body 1 comprises a support frame 101, a liquid storage tank 103 is fixed at the top end of the support frame 101, a fixing pipe 104 is fixedly communicated with one side of the liquid storage tank 103, one end, far away from the liquid storage tank 103, of the fixing pipe 104 penetrates through the upper surface of the support frame 101 and extends into the support frame 101, and a liquid pump 105 is installed on the fixing pipe 104;
copper-plated subassembly 3 includes two supports 301, the equal fixed mounting of two supports 301 is on support frame 101, fixed mounting has a direction montant 302 on one support 301, the top fixed mounting of direction montant 302 is on the interior top surface of support frame 101, be connected with a bolt lead screw 303 through the bearing rotation on another support 301, the top of bolt lead screw 303 is passed through the bearing and is rotated and connect on the interior top surface of support frame 101, sliding sleeve has a lifter plate 304 on direction montant 302 and the bolt lead screw 303, the inside fixed mounting of lifter plate 304 has a drain pipe 305, install a plurality of atomizer 306 that are a style of calligraphy and arrange on the drain pipe 305, still fixed intercommunication has a flexible hose 307 on the drain pipe 305, the one end that drain pipe 305 was kept away from to flexible hose 307 communicates with the bottom mounting of fixed pipe 104.
Referring to fig. 4, four supporting foot pads 102 are fixedly mounted on the lower surface of the supporting frame 101, and the lower surface of the supporting foot pads 102 is rough.
Referring to fig. 4, a driving motor 106 is fixedly installed at the top end of the supporting frame 101, and an output end of the driving motor 106 is fixedly connected with the top end of the bolt screw 303.
Referring to fig. 6, the fixing assembly 2 includes a fixing hanger plate 201, the top end of the fixing hanger plate 201 is fixedly installed on the inner top surface of the supporting frame 101, two symmetrically arranged guiding cross rods 202 penetrate through the fixing hanger plate 201, a connecting plate 203 is fixedly installed at one end of the guiding cross rod 202, an end plate 204 is fixedly installed at the other end of the guiding cross rod 202, a telescopic spring 205 is sleeved between the fixing hanger plate 201 and the connecting plate 203 and located on the peripheral side surface of the guiding cross rod 202, four suckers 207 which are distributed in a rectangular shape are fixedly installed on one surface of the connecting plate 203 far away from the guiding cross rod 202, and an electronic hardware shell 208 is adsorbed on the suckers 207.
Referring to fig. 6, a pull ring 206 is mounted on a side of the end plate 204 away from the guiding rail 202, and the pull ring 206 is made of steel alloy.
The inside of fixed hanger plate 201 is seted up and is led the cross bore that crossbar 202 phase-match, and the cross bore is passed to direction crossbar 202.
A through hole matched with the guide vertical rod 302 is formed in the lifting plate 304, and a threaded hole matched with the bolt screw rod 303 is formed in the lifting plate 304.
Referring to fig. 7, a fan 308 is fixedly mounted on the lifting plate 304.
The working principle is as follows: when the surface of the electronic hardware shell 208 needs to be plated with copper, firstly, a worker pulls the pull ring 206 to move the connecting plate 203 to the right side, at the moment, the expansion spring 205 contracts and shortens, then the electronic hardware shell 208 is adsorbed on the suction cup 207, after the electronic hardware shell 208 is adsorbed on the suction cup 207, the pull ring 206 is loosened, at the moment, due to the elastic force of the expansion spring 205, the electronic hardware shell 208 is close to the atomizing spray head 306, then the liquid pump 105 is started, the liquid pump 105 conveys the copper liquid in the liquid storage tank 103 to the liquid outlet pipe 305 through the fixed pipe 104 and the expansion hose 307, finally, the copper liquid is sprayed out through the atomizing spray head 306, the control switch of the driving motor 106 is started while the atomizing spray head 306 sprays the copper liquid, the driving motor 106 drives the bolt screw rod 303 to rotate, so that the lifting plate 304 drives the liquid outlet pipe 305 and the atomizing spray head 306 to move up and down, thereby uniformly coating the surface of the electronics hardware housing 208.
It should be noted that: the specific model specification of the electrical components such as the driving motor 106 and the like needs to be determined according to the actual specification and the like of the device, and the specific model selection calculation method adopts the prior art, so detailed description is omitted.
The power supply of the drive motor 106 and its principle will be clear to the skilled person and will not be described in detail here.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims (8)

1. The surface intelligent copper plating equipment for the electronic hardware shell comprises a support main body (1) and is characterized in that a fixing component (2) is installed on one side inside the support main body (1), and a copper plating component (3) is installed on the other side inside the support main body (1);
the support main body (1) comprises a support frame (101), a liquid storage tank (103) is fixed at the top end of the support frame (101), a fixing pipe (104) is fixedly communicated with one side of the liquid storage tank (103), one end, far away from the liquid storage tank (103), of the fixing pipe (104) penetrates through the upper surface of the support frame (101) and extends into the support frame (101), and a liquid pump (105) is installed on the fixing pipe (104);
the copper-plated component (3) comprises two supports (301), wherein the two supports (301) are fixedly mounted on a support frame (101), one support (301) is fixedly provided with a guide vertical rod (302), the top end of the guide vertical rod (302) is fixedly mounted on the inner top surface of the support frame (101), the other support (301) is rotatably connected with a bolt lead screw (303) through a bearing, the top end of the bolt lead screw (303) is rotatably connected on the inner top surface of the support frame (101) through a bearing, the guide vertical rod (302) and the bolt lead screw (303) are slidably sleeved with a lifting plate (304), a liquid outlet pipe (305) is fixedly mounted inside the lifting plate (304), a plurality of atomizing nozzles (306) which are arranged in a straight shape are mounted on the liquid outlet pipe (305), and a flexible hose (307) is fixedly communicated with the liquid outlet pipe (305), one end of the telescopic hose (307) far away from the liquid outlet pipe (305) is fixedly communicated with the bottom end of the fixed pipe (104).
2. The equipment for copper plating on surface intelligence for electronic hardware shell of claim 1, characterized in that, the lower surface fixed mounting of support frame (101) has four support callus pads (102) that are the rectangle and distribute, the lower surface of support callus pad (102) is crude.
3. The surface intelligent copper plating equipment for the electronic hardware shell as claimed in claim 1, wherein a driving motor (106) is fixedly mounted at the top end of the supporting frame (101), and the output end of the driving motor (106) is fixedly connected with the top end of the bolt screw rod (303).
4. The surface intelligent copper plating equipment for the electronic hardware shell as claimed in claim 1, the fixed component (2) comprises a fixed hanging plate (201), the top end of the fixed hanging plate (201) is fixedly arranged on the inner top surface of the support frame (101), two symmetrically arranged guide cross bars (202) penetrate through the inside of the fixed hanging plate (201), one end of the guide cross bar (202) is fixedly provided with a connecting plate (203), the other end of the guide cross bar (202) is fixedly provided with an end plate (204), a telescopic spring (205) is sleeved on the peripheral side surface of the guide cross bar (202) and positioned between the fixed hanging plate (201) and the connecting plate (203), connecting plate (203) keep away from on the surface of direction horizontal pole (202) fixed mounting have four sucking discs (207) that are the rectangle and distribute, an electron hardware housing (208) has been adsorbed on sucking disc (207).
5. The equipment for copper plating on surface intelligence of electronic hardware shell according to claim 4, characterized in that, a pull ring (206) is installed on the side of end plate (204) far away from guide rail (202), and pull ring (206) is a member made of steel alloy.
6. The electronic hardware shell surface intelligent copper plating equipment as claimed in claim 4, wherein a transverse hole matched with the guide cross rod (202) is formed in the fixed hanging plate (201), and the guide cross rod (202) penetrates through the transverse hole.
7. The electronic hardware shell surface intelligent copper plating equipment as claimed in claim 1, wherein a through hole matched with the guide vertical rod (302) is formed in the lifting plate (304), and a threaded hole matched with the bolt lead screw (303) is formed in the lifting plate (304).
8. The surface intelligent copper plating equipment for the electronic hardware shell as claimed in claim 1, wherein a fan (308) is fixedly installed on the lifting plate (304).
CN202110916411.5A 2021-08-11 2021-08-11 Surface intelligent copper plating equipment for electronic hardware shell Pending CN113637936A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110916411.5A CN113637936A (en) 2021-08-11 2021-08-11 Surface intelligent copper plating equipment for electronic hardware shell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110916411.5A CN113637936A (en) 2021-08-11 2021-08-11 Surface intelligent copper plating equipment for electronic hardware shell

Publications (1)

Publication Number Publication Date
CN113637936A true CN113637936A (en) 2021-11-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0370758U (en) * 1989-11-07 1991-07-16
US20090110839A1 (en) * 2007-10-31 2009-04-30 Nordson Corporation Apparatus and methods for controlling material application device
CA2724012A1 (en) * 2008-05-29 2009-12-03 Northwest Mettech Corp. Method and system for producing coatings from liquid feedstock using axial feed
KR101873788B1 (en) * 2017-09-25 2018-07-03 주식회사 우진에프에이 multiple spindle coating apparatus
CN207738878U (en) * 2017-12-22 2018-08-17 索密克汽车配件有限公司 A kind of Electroplating Rack for being convenient for putting weight
CN209323225U (en) * 2018-12-27 2019-08-30 宁波帕罗玛防坠落装备有限公司 It is a kind of list hanging point fire-proof safety band production use cutting device
CN212451643U (en) * 2020-06-22 2021-02-02 天津永宝电镀有限公司 Metal surface copper tin plating device
CN212534939U (en) * 2020-04-13 2021-02-12 中孚城建集团有限公司 Indoor wall body spraying device
CN112453846A (en) * 2020-11-05 2021-03-09 陈华 Assembly mechanism of LED display screen
CN112495611A (en) * 2020-12-14 2021-03-16 宁波灵凡智远电子设备有限公司 Metal plate spraying device and spraying process for machine manufacturing
CN213102819U (en) * 2020-07-27 2021-05-04 杭州仁力科技有限公司 Spraying device for hardware plate machining

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0370758U (en) * 1989-11-07 1991-07-16
US20090110839A1 (en) * 2007-10-31 2009-04-30 Nordson Corporation Apparatus and methods for controlling material application device
CA2724012A1 (en) * 2008-05-29 2009-12-03 Northwest Mettech Corp. Method and system for producing coatings from liquid feedstock using axial feed
KR101873788B1 (en) * 2017-09-25 2018-07-03 주식회사 우진에프에이 multiple spindle coating apparatus
CN207738878U (en) * 2017-12-22 2018-08-17 索密克汽车配件有限公司 A kind of Electroplating Rack for being convenient for putting weight
CN209323225U (en) * 2018-12-27 2019-08-30 宁波帕罗玛防坠落装备有限公司 It is a kind of list hanging point fire-proof safety band production use cutting device
CN212534939U (en) * 2020-04-13 2021-02-12 中孚城建集团有限公司 Indoor wall body spraying device
CN212451643U (en) * 2020-06-22 2021-02-02 天津永宝电镀有限公司 Metal surface copper tin plating device
CN213102819U (en) * 2020-07-27 2021-05-04 杭州仁力科技有限公司 Spraying device for hardware plate machining
CN112453846A (en) * 2020-11-05 2021-03-09 陈华 Assembly mechanism of LED display screen
CN112495611A (en) * 2020-12-14 2021-03-16 宁波灵凡智远电子设备有限公司 Metal plate spraying device and spraying process for machine manufacturing

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Application publication date: 20211112