CN113624373A - Optical fiber plane stress sensor with Taiji type structure - Google Patents
Optical fiber plane stress sensor with Taiji type structure Download PDFInfo
- Publication number
- CN113624373A CN113624373A CN202111059314.5A CN202111059314A CN113624373A CN 113624373 A CN113624373 A CN 113624373A CN 202111059314 A CN202111059314 A CN 202111059314A CN 113624373 A CN113624373 A CN 113624373A
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- optical fiber
- sensor
- type structure
- plane stress
- tai
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 39
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 7
- 239000000084 colloidal system Substances 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims description 9
- 239000000835 fiber Substances 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 101100082036 Danio rerio pou3f3a gene Proteins 0.000 claims 1
- 238000001228 spectrum Methods 0.000 abstract description 6
- 238000012544 monitoring process Methods 0.000 abstract 1
- 238000005253 cladding Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
- G01L1/242—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet the material being an optical fibre
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention discloses an optical fiber plane stress sensor with a Tai Chi type structure, which comprises a broadband light source, an optical fiber sensor with a Tai Chi type structure and a spectrometer, wherein the broadband light source is connected with the optical fiber plane stress sensor; the Tai Ji type structure optical fiber sensor is formed by connecting two echo walls in parallel, and is packaged in a sheet shape by using silicone colloid; when the measured object deforms, the Taiji-type structure optical fiber sensor attached to the surface of the measured object deforms correspondingly, so that the spectrum output by the sensor drifts, and the plane stress of the measured object can be sensed by monitoring the spectrum change condition. The invention has the advantages of simple and compact structure, high mechanical strength, capability of measuring plane stress and the like.
Description
Technical Field
The invention belongs to the field of optical fiber sensing, and particularly relates to an optical fiber plane stress sensor with a Taiji structure.
Background
In the process of coating the thin device, due to differences in process reasons and sizes and properties of various materials, the device is deformed and bent due to plane stress and the like, and the reliability of the device is adversely affected. For example, in the manufacture of semiconductor devices, due to the difference of the thermal expansion coefficients of the substrate material and the coating material, the respective plane stresses are different, so that the devices are warped, and the warped chips affect the performance of the semiconductor devices and even cause rejection. Therefore, detection of deformation of the thin device due to planar stress is important.
Although there are some temperature cross influence factors, common optical fiber stress sensors, such as fiber bragg grating, fabry-perot cavity, mach-zehnder interferometer, etc., can better realize stress measurement along the axial direction of the optical fiber, i.e., one-dimensional stress measurement. For the deformation detection of the thin device caused by the plane stress, the size and the direction of the plane stress are often required to be measured and judged, so that the optical fiber plane stress sensor which is simple in structure and small in influence of the change of the environmental temperature is developed for the deformation detection of the thin device caused by the plane stress, and the optical fiber plane stress sensor has high application value.
Disclosure of Invention
The invention aims to provide an optical fiber plane stress sensor with a Tai Chi type structure, which senses the change of the plane stress to be measured by using the interference spectrum change generated by a echo wall structure in the optical fiber sensor. Meanwhile, the silicone colloid is used for carrying out sheet packaging on the sensor, so that the mechanical strength of the sensor is increased, the heat insulation characteristic of the silicone colloid reduces the cross influence of temperature, and the planar stress sensing measurement is better realized.
The technical scheme adopted by the invention is as follows:
an optical fiber plane stress sensor with a Taiji type structure is characterized by comprising a broadband light source (1), an optical fiber sensor (2) with a Taiji type structure and a spectrometer (3); the output end of the broadband light source (1) is connected with the input end of the optical fiber sensor (2) with the Tai Chi type structure, and the output end of the optical fiber sensor (2) with the Tai Chi type structure is connected with the input end of the spectrometer (3).
The Tai Chi type structure optical fiber sensor (2) is formed by connecting an echo wall (6) and an echo wall (7) in parallel, the inner diameters of the two echo walls are both 7mm, the two echo walls are fixed through a glass sleeve (4) and a glass sleeve (5), and the glass sleeve is 0.5cm long and 0.5mm in inner diameter.
The Taiji type optical fiber structure sensor (2) carries out sheet-shaped packaging through the silicone colloid (8), the packaging thickness is not more than 4mm, and the area can be determined according to the condition of a measured object.
The working principle of the invention is as follows:
when a broadband light source is led into the echo wall structure from the single-mode optical fiber, a part of light can be separated from the fiber core and transmitted to the cladding, if the external refractive index is smaller than the refractive index of the cladding and the radius of the echo wall structure is proper, total reflection can be generated at the interface of the outside and the cladding, and the echo wall mode is formed. After the transmitted light passes through the echo wall structure, the light transmitted to the cladding is coupled back to the fiber core, and interferes with the light of the fiber core. Peak wavelength lambdamCan be expressed as:
in the formula: l iseffRepresenting the effective bending length, Δ n, of the echo wall structureeffRepresenting the difference in the effective refractive index of the core and cladding, and m represents a positive integer equal to 0, 1, 2 ….
From equation (1), it can be seen that when the effective bending length of the echo wall structure is changed, the peak wavelength of the interference spectrum shifts. When the measured object deforms, the Taiji type structure optical fiber sensor attached to the surface of the measured object deforms, so that the effective bending length of the echo wall structure changes, the peak wavelength correspondingly drifts, different sensitivities can be shown in different stress directions, and the size and the direction of the plane stress of the measured object can be reversely deduced through the drift amount and the sensitivities of the wavelength.
The invention has the beneficial effects that:
1. the invention is formed by connecting two echo walls in parallel, has simple and compact structure and low cost, not only can realize lower stress detection limit, but also can detect the stress action area in a plane.
2. Compared with the existing optical fiber sensors of the same type, the optical fiber sensor has higher mechanical strength.
3. The use of silicone gel encapsulation can effectively avoid temperature cross-effects.
Drawings
Fig. 1 is a schematic diagram of a fiber optic planar stress sensor in a tai chi configuration.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 1, an optical fiber plane stress sensor with a tai chi type structure is characterized by comprising a broadband light source (1), an optical fiber sensor (2) with a tai chi type structure and a spectrometer (3); the output end of the broadband light source (1) is connected with the input end of the optical fiber sensor (2) with the Tai Chi type structure, and the output end of the optical fiber sensor (2) with the Tai Chi type structure is connected with the input end of the spectrometer (3). The Tai-polar structure optical fiber sensor (2) is formed by connecting a echo wall (6) and an echo wall (7) in parallel, the inner diameters of the two echo walls are both 7mm, the two echo walls are fixed by a glass sleeve (4) and a glass sleeve (5), and the glass sleeve is 0.5cm long and 0.5mm in inner diameter. The Tai-polar optical fiber structure sensor (2) is packaged in a sheet shape through silicone colloid (8), the packaging thickness is not more than 4mm, and the area can be determined according to the condition of a measured object.
According to the method, the Taiji type structure optical fiber sensor (2) is attached to the surface of a measured object to sense the plane stress change of the surface of the measured object, when the measured object deforms, the peak wavelength of an interference spectrum output by the sensor can correspondingly drift, the drift sensitivity is different due to different stress directions, and the size and the direction of the plane stress of the measured object can be obtained by demodulating the change condition of the interference spectrum. The optical fiber plane stress sensor has the advantages of compact structure and simple operation, and can be used for quickly and accurately measuring the plane stress of a thin device.
Claims (3)
1. An optical fiber plane stress sensor with a Taiji type structure is characterized by comprising a broadband light source (1), an optical fiber sensor (2) with a Taiji type structure and a spectrometer (3); the output end of the broadband light source (1) is connected with the input end of the optical fiber sensor (2) with the Tai Chi type structure, and the output end of the optical fiber sensor (2) with the Tai Chi type structure is connected with the input end of the spectrometer (3).
2. A fiber optic planar stress sensor of the type described in claim 1, further comprising: the Tai-polar structure optical fiber sensor (2) is formed by connecting a echo wall (6) and an echo wall (7) in parallel, the inner diameters of the two echo walls are both 7mm and are fixed through a glass sleeve (4) and a glass sleeve (5), and the two glass sleeves are both 0.5cm long and 0.5mm in inner diameter.
3. A fiber optic planar stress sensor of the type described in claim 1, further comprising: the Tai-Ji structure optical fiber sensor (2) is packaged in a sheet shape through silicone colloid (8), the packaging thickness is not more than 4mm, and the area can be determined according to the condition of a measured object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111059314.5A CN113624373A (en) | 2021-09-10 | 2021-09-10 | Optical fiber plane stress sensor with Taiji type structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111059314.5A CN113624373A (en) | 2021-09-10 | 2021-09-10 | Optical fiber plane stress sensor with Taiji type structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113624373A true CN113624373A (en) | 2021-11-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111059314.5A Pending CN113624373A (en) | 2021-09-10 | 2021-09-10 | Optical fiber plane stress sensor with Taiji type structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113624373A (en) |
-
2021
- 2021-09-10 CN CN202111059314.5A patent/CN113624373A/en active Pending
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Application publication date: 20211109 |
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| WD01 | Invention patent application deemed withdrawn after publication |